JP5723665B2 - 先供給型液状半導体封止樹脂組成物 - Google Patents
先供給型液状半導体封止樹脂組成物 Download PDFInfo
- Publication number
- JP5723665B2 JP5723665B2 JP2011096907A JP2011096907A JP5723665B2 JP 5723665 B2 JP5723665 B2 JP 5723665B2 JP 2011096907 A JP2011096907 A JP 2011096907A JP 2011096907 A JP2011096907 A JP 2011096907A JP 5723665 B2 JP5723665 B2 JP 5723665B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- component
- liquid
- encapsulating resin
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011342 resin composition Substances 0.000 title claims description 42
- 239000007788 liquid Substances 0.000 title claims description 37
- 239000004065 semiconductor Substances 0.000 title claims description 36
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 239000004593 Epoxy Substances 0.000 claims description 7
- 150000008065 acid anhydrides Chemical class 0.000 claims description 5
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 4
- 239000003094 microcapsule Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 description 24
- 239000003822 epoxy resin Substances 0.000 description 23
- 239000000758 substrate Substances 0.000 description 18
- 238000007789 sealing Methods 0.000 description 17
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 230000008719 thickening Effects 0.000 description 7
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- -1 hydrogenated methylnadic acid anhydride Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920006287 phenoxy resin Polymers 0.000 description 3
- 239000013034 phenoxy resin Substances 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical group ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 2
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910007637 SnAg Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229940014800 succinic anhydride Drugs 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical class C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- RUFZNDNBXKOZQV-UHFFFAOYSA-N 2,3-dihydro-1h-pyrrolo[1,2-a]benzimidazole Chemical compound C1=CC=C2N(CCC3)C3=NC2=C1 RUFZNDNBXKOZQV-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- UVYLEXYRTBDZNM-UHFFFAOYSA-N 4,4-diethyloxane-2,6-dione Chemical compound CCC1(CC)CC(=O)OC(=O)C1 UVYLEXYRTBDZNM-UHFFFAOYSA-N 0.000 description 1
- WGCKYCGUJYPRCV-UHFFFAOYSA-N 4,5-dimethyl-7-(2-methylprop-1-enyl)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound CC(C)=CC1C=C(C)C(C)C2C(=O)OC(=O)C12 WGCKYCGUJYPRCV-UHFFFAOYSA-N 0.000 description 1
- DRPJWBIHQOHLND-UHFFFAOYSA-N 4-[dimethoxy(methyl)silyl]oxybutyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)OCCCCOC(=O)C(C)=C DRPJWBIHQOHLND-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- LQOPXMZSGSTGMF-UHFFFAOYSA-N 6004-79-1 Chemical compound C1CC2C3C(=O)OC(=O)C3C1C2 LQOPXMZSGSTGMF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- ZGACYOKNEKDSNK-UHFFFAOYSA-N ac1mjht3 Chemical compound C1CC2(C)C3C(=O)OC(=O)C3C1(C(C)C)C=C2 ZGACYOKNEKDSNK-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- OZEHOHQZIRILDX-UHFFFAOYSA-N ctk1b7797 Chemical compound O=C1OC(=O)C2C1C1(C)CC2CC1 OZEHOHQZIRILDX-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Led Device Packages (AREA)
Description
〔1〕(A)液状エポキシ樹脂、
(B)式(1):
(C)液状酸無水物硬化剤、および
(D)マイクロカプセル型硬化促進剤
を含むことを特徴とする、先供給型液状半導体封止樹脂組成物。
〔2〕(B)成分のエポキシ当量が800g/当量以上である、上記〔1〕記載の先供給型液状半導体封止樹脂組成物。
〔3〕(B)成分を、先供給型液状半導体封止樹脂組成物:100質量部に対して、4質量部以上含む、上記〔1〕または〔2〕記載の先供給型液状半導体封止樹脂組成物。
〔4〕温度:25℃での粘度が、0.5〜200Pa・sである、上記〔1〕〜〔3〕のいずれか記載の先供給型液状半導体封止樹脂組成物。
〔5〕上記〔1〕〜〔4〕のいずれか記載の先供給型液状半導体封止樹脂組成物を用いて封止されたフリップチップ型半導体素子を有する、半導体装置。
(B)式(1):
(C)液状酸無水物硬化剤、および
(D)マイクロカプセル型硬化促進剤
を含むことを特徴とする。
表1〜3に示す配合で、封止樹脂組成物を調整した。実施例2〜11のいずれも液状樹脂組成物であり、作業性、ハンドリングの容易性、狭ピッチ化対応に優れていた。
30μmのバンプが、50μmピッチで544個形成された幅:7.3mm、長さ:7.3mm、高さ:125μmのSiチップを準備した。バンプは、SnAgはんだめっきされた銅ピラーである。また、シリコンチップのバンプパターンに対応した電極を有する厚さ:360μmのFR−4基板を準備した。この基板を60℃のステージに載置し、この基板の電極上に、23Gのニードルのディスペンサーを用いて、封止樹脂組成物を塗布し、その上から、フリップチップボンダーを用いて、240℃×2秒の条件でSiチップを圧接し、評価サンプルを作製した。
実施例2〜11、比較例1〜4、参考例1の封止樹脂組成物の作製後、30分以内の粘度を、回転粘度計(E型)を用い、25℃、10rpmで測定した。この粘度を、増粘倍率評価での初期粘度とした。
実施例2〜11、比較例1〜4、参考例1の封止樹脂組成物を、室温で24時間放置した後の粘度を、回転粘度計(E型)を用い、25℃、10rpmで測定した。増粘倍率(単位:倍)は、上記初期粘度と、室温で24時間放置後の粘度から、下記式:
[増粘倍率]=[室温で24時間放置後の粘度]/[初期粘度]
により算出した。
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011096907A JP5723665B2 (ja) | 2011-04-25 | 2011-04-25 | 先供給型液状半導体封止樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011096907A JP5723665B2 (ja) | 2011-04-25 | 2011-04-25 | 先供給型液状半導体封止樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012229299A JP2012229299A (ja) | 2012-11-22 |
JP5723665B2 true JP5723665B2 (ja) | 2015-05-27 |
Family
ID=47431132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011096907A Active JP5723665B2 (ja) | 2011-04-25 | 2011-04-25 | 先供給型液状半導体封止樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5723665B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6126834B2 (ja) * | 2012-12-20 | 2017-05-10 | ナミックス株式会社 | 先供給型半導体封止用液状樹脂組成物および半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3606253B2 (ja) * | 2001-11-27 | 2005-01-05 | 松下電工株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP4067916B2 (ja) * | 2002-08-26 | 2008-03-26 | 新日鐵化学株式会社 | 液状エポキシ樹脂組成物 |
JP2008007578A (ja) * | 2006-06-27 | 2008-01-17 | Matsushita Electric Works Ltd | チップオンフィルム用液状エポキシ樹脂組成物及び半導体装置 |
JP2010171118A (ja) * | 2009-01-21 | 2010-08-05 | Panasonic Electric Works Co Ltd | 実装部品の表面実装方法、その方法を用いて得られる実装部品構造体、及びその方法に用いられるアンダーフィル用液状エポキシ樹脂組成物 |
-
2011
- 2011-04-25 JP JP2011096907A patent/JP5723665B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012229299A (ja) | 2012-11-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6789495B2 (ja) | アンダーフィル用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | |
JP2016219600A (ja) | 半導体用ダイアタッチペースト及び半導体装置 | |
JP2011168650A (ja) | エポキシ樹脂組成物 | |
TW201127864A (en) | Semiconductor-sealing epoxy resin composition and semiconductor device | |
JP4176619B2 (ja) | フリップチップ実装用サイドフィル材及び半導体装置 | |
JP6286959B2 (ja) | エポキシ樹脂組成物、電子部品装置及び電子部品装置の製造方法 | |
JP5593259B2 (ja) | 液状エポキシ樹脂組成物 | |
JP3925803B2 (ja) | フリップチップ実装用サイドフィル材及び半導体装置 | |
JP5411774B2 (ja) | 先供給型液状半導体封止樹脂組成物 | |
JP5647769B2 (ja) | Cof封止用樹脂組成物 | |
JP5723665B2 (ja) | 先供給型液状半導体封止樹脂組成物 | |
TWI612096B (zh) | 液狀樹脂組成物、覆晶安裝體及其製造方法 | |
JP5723557B2 (ja) | エポキシ樹脂組成物 | |
JP6388228B2 (ja) | 半導体封止用液状エポキシ樹脂組成物とそれを用いた半導体装置 | |
JP2012056979A (ja) | エポキシ樹脂組成物 | |
JP2010209266A (ja) | 半導体封止用液状エポキシ樹脂組成物、及びそれをアンダーフィル材として用いて封止したフリップチップ型半導体装置 | |
JP5886051B2 (ja) | 樹脂組成物 | |
JP2013253183A (ja) | 先供給型液状半導体封止樹脂組成物 | |
JP5415334B2 (ja) | 先供給型液状半導体封止樹脂組成物 | |
JP5788765B2 (ja) | 樹脂組成物 | |
JPWO2005080502A1 (ja) | アンダーフィル用液状エポキシ樹脂組成物および同組成物を用いて封止した半導体装置 | |
WO2016059980A1 (ja) | 液状エポキシ樹脂組成物 | |
JP2013118276A (ja) | 半導体装置 | |
JP6126834B2 (ja) | 先供給型半導体封止用液状樹脂組成物および半導体装置 | |
JP7093998B2 (ja) | ディップ用先供給型半導体封止材、それを用いた半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140305 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140710 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140715 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140901 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150310 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150330 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5723665 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |