WO2014119708A1 - ガラス基板の製造方法 - Google Patents

ガラス基板の製造方法 Download PDF

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Publication number
WO2014119708A1
WO2014119708A1 PCT/JP2014/052211 JP2014052211W WO2014119708A1 WO 2014119708 A1 WO2014119708 A1 WO 2014119708A1 JP 2014052211 W JP2014052211 W JP 2014052211W WO 2014119708 A1 WO2014119708 A1 WO 2014119708A1
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WO
WIPO (PCT)
Prior art keywords
glass
glass substrate
partition wall
internal partition
heating element
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PCT/JP2014/052211
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English (en)
French (fr)
Japanese (ja)
Inventor
伸広 前田
裕介 塩地
Original Assignee
ＡｖａｎＳｔｒａｔｅ株式会社
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Application filed by ＡｖａｎＳｔｒａｔｅ株式会社 filed Critical ＡｖａｎＳｔｒａｔｅ株式会社
Priority to JP2014559763A priority Critical patent/JP5981570B2/ja
Priority to CN201480006297.0A priority patent/CN104955775B/zh
Publication of WO2014119708A1 publication Critical patent/WO2014119708A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B17/00—Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
    • C03B17/06—Forming glass sheets
    • C03B17/064—Forming glass sheets by the overflow downdraw fusion process; Isopipes therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to a method for producing a glass substrate by a downdraw method.
  • a down draw method is used as a method for forming glass.
  • molten glass is poured into a groove of a molded body, and then the molten glass is overflowed from the groove. The molten glass then flows down along the side of the molded body. Molten glass merges at the lower end of the molded body, and then leaves the molded body to become sheet-like glass (sheet glass).
  • sheet glass is pulled and conveyed by a roller and cooled by the atmosphere in the furnace. Thereafter, the sheet glass is cut into a desired size and further processed into a glass substrate.
  • the glass plate manufacturing apparatus described in Patent Document 1 below includes an internal partition that partitions a heating element and a molded body in the furnace chamber.
  • the heat of the molten glass in the furnace chamber is exchanged with the internal partition wall heated by the heating element mainly through radiant heat transfer. A temperature distribution will occur in the direction. For this reason, as a material of an internal partition, a thing with large heat conductivity and high homogeneity is desirable.
  • Patent Document 1 describes that, for example, a SiC plate can be used for the internal partition.
  • an object of the present invention is to provide a method for producing a glass substrate that can suppress the oxidative expansion of an internal partition wall when producing the glass substrate by a downdraw method.
  • the method for producing a glass substrate of the present invention has the following aspects.
  • a method for producing a glass substrate having a step of forming molten glass into sheet glass by a downdraw method In the molding furnace chamber, provided with a heating element, the molded body, and an internal partition that partitions the heating element and the molded body, An SiC sintered body having an open porosity of 1% or less is used for the internal partition wall, A method for producing a glass substrate, comprising: heating the molten glass flowing through the molded body through the internal partition by the heating element.
  • the said internal partition is a manufacturing method of the glass substrate of the aspect 1 whose heat conductivity is 20 W / (m * K) or more at 1200 degreeC.
  • the said molten glass is a manufacturing method of the glass substrate of the aspect 1 or 2 which is 1000 degreeC or more when the viscosity of 10 ⁇ 5 > poise.
  • the method for producing a glass substrate which is an embodiment of the present invention, when a glass substrate is produced by the downdraw method, it is possible to suppress the occurrence of problems associated with the oxidative expansion of the internal partition walls.
  • FIG. 1 is a flowchart showing a part of the glass substrate manufacturing method according to the present embodiment.
  • the glass substrate is manufactured through various processes including a melting process ST1, a clarification process ST2, a homogenization process ST3, a molding process ST4, a cooling process ST5, and a cutting process ST6.
  • the melting process ST1 a clarification process ST2, a homogenization process ST3, a molding process ST4, a cooling process ST5, and a cutting process ST6.
  • the glass raw material is heated and melted.
  • Glass raw material is a composition such as SiO 2, Al 2 O 3.
  • the completely melted glass raw material becomes molten glass.
  • the molten glass is clarified. Specifically, the gas component contained in the molten glass is released from the molten glass, or the gas component is absorbed into the molten glass.
  • the homogenization step ST3 the molten glass is homogenized.
  • the molten glass is formed into a sheet-like glass, that is, a sheet glass by a downdraw method (specifically, an overflow downdraw method).
  • the sheet glass formed in the forming step ST4 is gradually cooled.
  • the sheet glass is cooled to near room temperature.
  • the cutting step ST6 the sheet glass cooled to near room temperature is cut every predetermined length to obtain a base glass.
  • disconnected for every predetermined length is cut
  • FIG. 2 is a schematic diagram showing the glass substrate manufacturing apparatus 100.
  • the glass substrate manufacturing apparatus 100 mainly includes a melting apparatus 200 and a forming apparatus 300.
  • the dissolution apparatus 200 is an apparatus for performing the dissolution process ST1, the clarification process ST2, and the homogenization process ST3. As shown in FIG. 2, the dissolution apparatus 200 includes a dissolution tank 201, a clarification tank 202, a stirring tank 203, a first pipe 204, and a second pipe 205.
  • the melting tank 201 is a tank for melting the glass raw material.
  • the dissolution step ST1 is performed.
  • the clarification tank 202 is a tank for removing bubbles from the molten glass melted in the melting tank 201. By further heating the molten glass fed from the melting tank 201 in the clarification tank 202, defoaming of the molten glass is promoted.
  • a clarification step ST2 is performed in the clarification tank 202.
  • the stirring tank 203 stirs the molten glass with a stirrer.
  • the homogenization step ST3 is performed.
  • the first pipe 204 and the second pipe 205 are pipes made of platinum group elements or platinum group element alloys.
  • the first pipe 204 is a pipe that connects the clarification tank 202 and the stirring tank 203.
  • the second pipe 205 is a pipe that connects the stirring tank 203 and the molding apparatus 300.
  • the molding apparatus 300 is an apparatus for performing the molding process ST4 and the cooling process ST5.
  • FIG. 3 is a schematic side view showing the forming furnace chamber 30 included in the forming apparatus 300.
  • the molding apparatus 300 includes a molding furnace chamber 30 at the top.
  • the forming furnace chamber 30 includes a furnace wall 24 as an outer wall, and is partitioned from the lower furnace chamber by a partition member 20.
  • a molded body 14 and a plurality of heating elements 28 are arranged inside the molding furnace chamber 30, a molded body 14 and a plurality of heating elements 28 are arranged.
  • an internal partition wall 16 that partitions the molded body 14 and the heating element 28 is provided.
  • the molded body 14 is an apparatus for performing the molding step ST4 and is provided in the molding furnace chamber 30.
  • the formed body 14 has a function of forming the molten glass flowing from the melting apparatus 200 into a sheet-like glass substrate (sheet glass G) by an overflow down draw method.
  • the molded body 14 has a wedge-shaped cross-sectional shape cut in the vertical direction, and is composed of, for example, refractory bricks made of zircon, zirconia, YPO 4 , Al 2 O 3 , SiO 2 , SiC, SiN, and combinations thereof. ing.
  • a groove portion 18 that receives the molten glass MG flowing from the melting device 200 is formed in the upper portion of the molded body 14.
  • the side surface 14b of the molded body 14 is formed along the vertical direction so that the molten glass MG overflowed from the groove 18 flows down.
  • the inclined surface 14c of the molded body 14 has a side surface 14b so that the molten glass MG flowing down the both side surfaces 14b, 14b of the molded body 14 joins at the lowermost end portion 14d, which is the apex of the wedge-shaped cross section of the molded body 14. It is inclined with respect to.
  • the inner partition wall 16 is disposed between the heating element 28 and the molded body 14 and is disposed around the molded body 14 so as to surround the molded body 14.
  • the internal partition 16 is made of a SiC sintered body, and more specifically, is made of a high-density sintered SiC plate.
  • the internal partition 16 is preferably composed of a SiC sintered body having a SiC content of 95 wt% (wt%) or more. Further, from the viewpoint of improving the temperature uniformity of the internal partition wall 16, the thermal conductivity at 1200 ° C. is 20 W / (m ⁇ K) or more, more preferably 25 W / (m ⁇ K) or more, and further preferably 30 W / (m.
  • the SiC sintered compact which is more than K).
  • the upper limit of the thermal conductivity is, for example, 490 W / (m ⁇ K).
  • the open porosity of the SiC sintered body constituting the internal partition wall 16 is set to 1% or less.
  • the open porosity of the SiC sintered body is preferably 0.8% or less, and more preferably 0.6% or less.
  • the open porosity of the SiC sintered body is, for example, more than 0%.
  • the open porosity is a percentage of the volume of the open pore portion in the sample when the outer volume of the sample is 1, and is measured by a measurement method defined in JIS R 1634: 1998, for example. Can do.
  • a horizontal partition wall 26 is provided between the furnace wall 24 and the internal partition wall 16 to partition the space between the furnace wall 24 and the internal partition wall 16 in the lateral direction.
  • the horizontal partition wall 26 is a plate-like member that partitions the space between the furnace wall 24 of the molding furnace chamber 30 and the internal partition wall 16 into a plurality of vertically adjacent spaces.
  • zircon, zirconia, YPO 4 , Al It is a heat insulating member made of 2 O 3 , SiO 2 , SiC, SiN and combinations thereof.
  • a heating element 28 is disposed in each of the small spaces partitioned by the horizontal partition wall 26.
  • the molding furnace chamber 30 may be partitioned into a plurality of spaces, and the temperature of each partitioned space may be controlled by the heating element 28, and the position and number of the horizontal partition walls 26 are arbitrary.
  • the horizontal partition wall 26 is disposed at a position where the distance from the adjacent heating element 28 is constant at regular intervals.
  • the thickness of the horizontal partition 26 can be set arbitrarily, for example, it can be made the same as the thickness of the internal partition 16 and the thickness of the furnace wall 24.
  • the heat transfer amount transmitted by the horizontal partition wall 26 and the internal partition wall 16 is made equal by making the thickness the same, and the molten glass MG is uniformly heated in the width direction. can do.
  • the thermal conductivity of the internal partition 16 provided at a position closer to the molten glass MG is set.
  • the thermal conductivity of the horizontal partition wall 26 can be made higher.
  • the open porosity of the internal partition wall 16 can be made lower than the open porosity of the horizontal partition wall 26.
  • the thermal conductivity of the internal partition wall 16 located at the position facing the lowermost end portion 14d is set to both side surfaces 14b, 14b.
  • the open porosity of the internal partition wall 16 at the position facing the lowermost end portion 14d can be made lower than the open porosity of the internal partition wall 16 at the position facing both side surfaces 14b, 14b.
  • the heating element 28 is composed of, for example, a sheathed heater, a cartridge heater, or a ceramic heater that generates heat by resistance heating, dielectric heating, microwave heating, induction heating, etc., and the amount of generated heat (temperature) can be arbitrarily adjusted.
  • Each heating element 28 disposed in the molding furnace chamber 30 can independently control the amount of heat generated. For example, when the molten glass MG travels downward in the molding furnace chamber 30, the grooves 18 and both side surfaces of the molding body 14. A temperature gradient can be formed so that the temperature sequentially decreases toward 14b, 14b, the inclined surface 14c, and the lowermost end portion 14d. That is, the amount of heat generated by the plurality of heating elements 28 is adjusted so that the temperature of the wall surface facing the molded body 14 of the internal partition wall 16 decreases as the molten glass MG flows. Is preferred.
  • the partition member 20 is a plate-like member disposed in the vicinity of the lowermost end portion 14d of the forming body 14, for example, zircon, zirconia, YPO 4, Al 2 O 3 , SiO 2, SiC, SiN and a combination thereof It is the heat insulation member which consists of.
  • a pair of partition members 20 are provided such that the ends thereof are opposed to each other.
  • the partition member 20 is disposed so as to be horizontal on both sides in the thickness direction of the sheet glass G flowing down from the lowermost end portion 14d of the molded body 14.
  • the partition member 20 suppresses the movement of heat from the upper side to the lower side of the partition member 20 by partitioning and insulating the upper and lower atmospheres leaving a gap through which the sheet glass passes.
  • a cooling roller 22 is disposed below the partition member 20.
  • the cooling roller 22 is disposed in a furnace chamber located below the partition member 20. Moreover, the cooling roller 22 is arrange
  • the cooling roller 22 is air-cooled by, for example, an air-cooling tube passed through the inside.
  • the cooling roller 22 pulls the sheet glass G downward by transmitting the driving force of the driving motor.
  • a slow cooling furnace chamber (not shown) for performing the cooling step ST5 is provided below the forming furnace chamber 30, a slow cooling furnace chamber (not shown) for performing the cooling step ST5 is provided.
  • the slow cooling furnace chamber is partitioned into a plurality of furnace chambers along the flow of the sheet glass G, and a plurality of tension rollers are provided along the flow of the sheet glass G.
  • the pulling roller is driven by a motor and conveys the seed glass G while pulling it downward.
  • Each furnace chamber is provided with a heater for adjusting the temperature of the atmosphere around the sheet glass G. By controlling the temperature of the atmosphere around the sheet glass G using this heater, the temperature of the sheet glass G is controlled, and the sheet glass is subjected to a temperature profile that reduces the thickness deviation, warpage, and distortion of the sheet glass G. G is gradually cooled.
  • the cutting step ST6 is performed by a cutting device (not shown).
  • the cutting device is disposed below the slow cooling furnace chamber.
  • the cutting device is a device that cuts the sheet glass G flowing down in the forming device 300 in a direction perpendicular to the longitudinal surface thereof.
  • the sheet-like sheet glass G becomes a plurality of base plates having a predetermined length by being cut by a cutting device.
  • the base plate is further cut, packaged through end face processing, cleaning, and inspection, and shipped as a glass substrate.
  • the molten glass MG that has flowed through the groove 18 of the molded body 14 overflows at the top of the groove 18 and flows down along both side surfaces 14b and 14b of the molded body 14.
  • the molten glass G which flowed down along the both side surfaces 14b and 14b of the molded object 14 merges in the lowest end part 14d of the molded object 14 via the inclined surfaces 14c and 14c, and becomes the sheet glass G.
  • the sheet glass G is supplied to a slow cooling furnace chamber below the forming furnace chamber 30 through a slit-like gap between the pair of partition members 20 and 20.
  • the internal partition 16 is heated by the heating element 28, heat exchange is performed between the heated internal partition 16 and the molten glass MG flowing through the molded body 14, and the molten glass MG is cooled.
  • the atmosphere containing oxygen in the forming furnace chamber 30 is maintained at a temperature of 1000 ° C. or more, for example, about 1200 ° C., but the internal partition wall 16 is exposed to the atmosphere containing oxygen at such a high temperature,
  • the SiC sintered body constituting the partition 16 is oxidized from the portion in contact with oxygen and changed to SiO 2 .
  • the open porosity of the SiC sintered body is larger than 1%, the oxidation tends to proceed not only from the surface but also from the inside. In a place where internal oxidation has progressed, the volume increases, leading to deformation and even cracking.
  • the SiC sintered body is a material that is resistant to high temperatures and excellent in heat resistance and oxidation resistance.
  • the oxidation start temperature at which the SiC sintered body reacts with oxygen is about 700 ° C., and when this temperature is exceeded, oxidation starts, leading to deformation and further cracking. Since the temperature in the molding furnace chamber 30 is 1000 ° C. or higher as described above, the SiC sintered body is easily oxidized in the molding furnace chamber 30.
  • a SiC sintered body having an open porosity of 1% or less is used for the internal partition wall 16. Therefore, only the surface comes into contact with the high temperature atmosphere containing oxygen, and the progress of SiC oxidation inside the tissue can be suppressed. Thereby, abnormal expansion due to internal oxidation of the internal partition wall 16 is suppressed, and deformation, surface cracks, and generation of cracks can be suppressed. Therefore, it is possible to prevent the soaking effect of the internal partition wall 16 from being lowered, and to improve the quality of the glass substrate. Moreover, the lifetime of the internal partition 16 can be extended and the productivity of the glass substrate can be improved. Further, when the SiC sintered body is oxidized, the oxide SiO 2 completely covers the surface of the SiC sintered body and becomes a protective film against oxidation, so that the internal oxidation of the internal partition wall 16 can be suppressed.
  • FIG. 4 is a view for explaining the temperature distribution around the heating element 28, and is a view of the molten glass MG, the internal partition wall 16, and the heating element 18 as viewed from above in FIG.
  • the heating element 28 When the heating element 28 generates heat, the heat generated from the heating element 28 spreads in a spherical shape around the heating element 28, and in the small space surrounded by the internal partition wall 16, the horizontal partition wall 26, and the furnace wall 24, A spherical temperature distribution with a center is formed.
  • the heat spread in a spherical shape reaches the inner partition wall 16, the heat is absorbed by the inner partition wall 16, and heat is accumulated in the inner partition wall 16. Since the internal partition wall 16 has a soaking effect, the heat accumulated in the internal partition wall 16 is released in a planar shape along the side wall of the internal partition wall 16.
  • a substantially constant temperature distribution is formed along the internal partition 16 along at least the width direction of the molten glass MG. Due to the substantially constant temperature distribution along the internal partition wall 16, the temperature of the molten glass MG becomes uniform in the width direction of the molten glass MG, and the temperature of the sheet glass G is, for example, about 1150 at the lowermost end portion 14 d of the molded body 14. It becomes uniform in the width direction at °C.
  • the internal partition 16 of the present embodiment has a thermal conductivity of 20 W / (m ⁇ K) or more at 1200 ° C., more preferably 25 W / (m ⁇ K) or more, and further preferably 30 W / (m ⁇ K). ) That's it. Therefore, even if the temperature of each heating element 28 varies from place to place, the temperature of the internal partition wall 16 is less varied depending on the place in the width direction of the molten glass MG, and the temperature tends to be uniform in the width direction of the molten glass MG.
  • the soaking effect of the internal partition 16 can be improved, and the temperature of the molten glass MG flowing through the molded body 14 can be cooled more uniformly in the width direction of the molten glass MG, thereby improving the quality of the glass substrate.
  • the atmosphere between the furnace wall 24 and the internal partition wall 16 in the molding furnace chamber 30 is maintained at a required temperature by the heating element 28.
  • a horizontal partition wall 26 that partitions the molding furnace chamber 30 into a plurality of vertically adjacent spaces is provided between the furnace wall 24 of the molding furnace chamber 30 and the internal partition wall 16.
  • a plurality of heating elements 28 are provided in the plurality of spaces partitioned by the horizontal partition walls 26, and each heating element 28 can independently control the amount of heat generation.
  • the horizontal partition wall 26 is made of a material having a high heat insulating property, for example, a material having a high heat insulating property compared to the internal partition wall 16.
  • a temperature difference can be given and the quality of a glass substrate can be improved.
  • a heating element based on a temperature measured by a temperature sensor (not shown) such as a resistance temperature detector or a thermocouple installed in the molding furnace chamber 30.
  • the amount of heat generated by 28 can be adjusted. For example, when the temperature measured by the temperature sensor is the same on both side surfaces 14b and 14b of the molded body 14 and the inclined surface 14c, the amount of heat generated by the heating element 28 at a position facing the both side surfaces 14b and 14b. Or by suppressing the amount of heat generated by the heating element 28 at a position facing the inclined surface 14c, a temperature difference is caused in the flow direction in the molten glass MG flowing through the side surfaces 14b, 14b and the inclined surface 14c. Can do.
  • the manufacturing method of this embodiment is suitable when the inside of the molding furnace needs to be kept at a high temperature. Specifically, it is suitable when the inside of the molding furnace is 1000 ° C. or higher, more suitable when it is 1200 ° C. or higher, and particularly suitable when it is 1300 ° C. or higher.
  • this embodiment uses glass (molten glass) having a high high temperature viscosity. Suitable for manufacturing glass substrates.
  • the viscosity of the glass (molten glass) when the viscosity of the glass (molten glass) is 10 5 poise, it is suitable for manufacturing a glass substrate using glass (molten glass) that is 1000 ° C. or higher. Moreover, the upper limit of the temperature of a molten glass when a viscosity is 10 ⁇ 5 > poise is 1700 degreeC, for example.
  • alkali-free glass or alkali-containing glass containing a trace amount of alkali metal has high viscosity at high temperature
  • this embodiment is suitable for manufacturing a glass substrate composed of alkali-free glass or alkali-containing glass.
  • a glass substrate having the following composition range is shown by mass%. SiO 2 : 50 to 70%, Al 2 O 3 : 0 to 25%, B 2 O 3 : 1 to 15%, MgO: 0 to 10%, CaO: 0-20%, SrO: 0 to 20%, BaO: 0 to 10%, RO: Alkali-free glass containing 5 to 30% (where R is the total amount of Mg, Ca, Sr and Ba).
  • the glass substrate may be a glass containing a trace amount of alkali metal containing a trace amount of alkali metal.
  • the total of R ′ 2 O is 0.10% or more and 0.5% or less, preferably 0.20% or more and 0.5% or less (where R ′ is selected from Li, Na, and K) It is preferable that the glass substrate contains at least one kind. Of course, the total of R ′ 2 O may be less than 0.10%. That is, the present invention is suitable for manufacturing a flat panel display using an alkali-free glass or a glass substrate with a small amount of alkali.
  • the glass substrate was manufactured using the glass substrate manufacturing apparatus demonstrated in the above-mentioned embodiment.
  • As the inner partition wall high-density sintered SiC having a SiC content of 99 wt%, a thermal conductivity of 25 W / (m ⁇ K) at 1200 ° C., and an open porosity of 1% was used.
  • a glass substrate was manufactured using the glass substrate manufacturing apparatus described in the above embodiment.
  • high-density sintered SiC having a SiC content of 98 wt%, a thermal conductivity of 30 W / (m ⁇ K) at 1200 ° C., and an open porosity of 0.6% was used.
  • a glass substrate was manufactured using the glass substrate manufacturing apparatus described in the above embodiment.
  • high-density sintered SiC having a SiC content of 95 wt%, a thermal conductivity of 35 W / mK at 1200 ° C., and an open porosity of 0.5% was used.
  • Molded body 16 Internal partition wall 24 Furnace wall 26 Horizontal partition wall 28 Heating element 30 Molding furnace chamber MG Molten glass G Sheet glass

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Furnace Details (AREA)
  • Glass Compositions (AREA)
  • Ceramic Products (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
PCT/JP2014/052211 2013-01-31 2014-01-31 ガラス基板の製造方法 WO2014119708A1 (ja)

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Application Number Priority Date Filing Date Title
JP2014559763A JP5981570B2 (ja) 2013-01-31 2014-01-31 ガラス基板の製造方法
CN201480006297.0A CN104955775B (zh) 2013-01-31 2014-01-31 玻璃基板的制造方法

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JP2013-016968 2013-01-31
JP2013016968 2013-01-31

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CN (2) CN108409110A (zh)
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CN107602153A (zh) * 2017-08-03 2018-01-19 彩虹（合肥）液晶玻璃有限公司 一种SiC板表面氧化层快速增厚的方法
TW202017873A (zh) * 2017-08-17 2020-05-16 美商康寧公司 玻璃成形設備之外殼

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JP2010527891A (ja) * 2007-05-18 2010-08-19 コーニング インコーポレイテッド ガラス製造プロセスにおける含有物を最小化する方法及び装置
WO2011145387A1 (ja) * 2010-05-21 2011-11-24 日本碍子株式会社 Ｓｉ－ＳｉＣ系複合材料及びその製造方法、ハニカム構造体、熱伝導体ならびに熱交換器
JP2013001608A (ja) * 2011-06-17 2013-01-07 Nippon Electric Glass Co Ltd ガラスの製造装置及びそれを用いたガラス製造方法

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TWI535672B (zh) * 2010-05-28 2016-06-01 康寧公司 複合隔離管
KR101432413B1 (ko) * 2011-03-31 2014-08-20 아반스트레이트 가부시키가이샤 유리판의 제조 방법
CN102674661A (zh) * 2012-03-31 2012-09-19 彩虹显示器件股份有限公司 溢流下拉装置中玻璃板成形区域温度控制方法

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Publication number Priority date Publication date Assignee Title
JP2010527891A (ja) * 2007-05-18 2010-08-19 コーニング インコーポレイテッド ガラス製造プロセスにおける含有物を最小化する方法及び装置
WO2011145387A1 (ja) * 2010-05-21 2011-11-24 日本碍子株式会社 Ｓｉ－ＳｉＣ系複合材料及びその製造方法、ハニカム構造体、熱伝導体ならびに熱交換器
JP2013001608A (ja) * 2011-06-17 2013-01-07 Nippon Electric Glass Co Ltd ガラスの製造装置及びそれを用いたガラス製造方法

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TWI576318B (zh) 2017-04-01
JPWO2014119708A1 (ja) 2017-01-26
JP5981570B2 (ja) 2016-08-31
TW201437155A (zh) 2014-10-01
CN104955775A (zh) 2015-09-30
CN104955775B (zh) 2018-06-26
CN108409110A (zh) 2018-08-17

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