Classifications

• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
  • H03K17/22—Modifications for ensuring a predetermined initial state when the supply voltage has been applied
  • H03K17/223—Modifications for ensuring a predetermined initial state when the supply voltage has been applied in field-effect transistor switches
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
  • G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
  • G11C17/18—Auxiliary circuits, e.g. for writing into memory
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
  • G11C7/12—Bit line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, equalising circuits, for bit lines
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C8/00—Arrangements for selecting an address in a digital store
  • G11C8/08—Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
  • H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
  • H03K17/081—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
  • H03K17/08104—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit in field-effect transistor switches
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
  • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
  • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
  • H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
  • H03K17/6871—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors the output circuit comprising more than one controlled field-effect transistor
  • H03K17/6872—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors the output circuit comprising more than one controlled field-effect transistor using complementary field-effect transistors
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
  • H03K19/003—Modifications for increasing the reliability for protection
  • H03K19/00315—Modifications for increasing the reliability for protection in field-effect transistor circuits
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
  • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
  • G11C13/0021—Auxiliary circuits
  • G11C13/0069—Writing or programming circuits or methods
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
  • H03K2217/0018—Special modifications or use of the back gate voltage of a FET
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
  • H03K2217/0063—High side switches, i.e. the higher potential [DC] or life wire [AC] being directly connected to the switch and not via the load
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
  • H03K2217/0072—Low side switches, i.e. the lower potential [DC] or neutral wire [AC] being directly connected to the switch and not via the load

Definitions

• This application relates to integrated circuits, and more particularly to an n-well biasing scheme to prevent latchup for high-density applications.
• a PMOS transistor includes a p-type drain and source formed in an n- type body. Holes are thus the majority carrier in a PMOS channel.
• CMOS complementary MOS
• the bulk substrate is p-type such that the n-type body for a PMOS transistor exists as an n-type well (n-well) in the p-type substrate.
• the PMOS source will be at a positive voltage with regard to the drain when the channel is conducting.
• This positive voltage on the source can be problematic in that a p-n junction is formed between the source and the n-well for the PMOS transistor. If the source is sufficiently biased with regard to the n-well, that p-n junction is then forward biased.
• a conducting parasitic structure results from this forward biased p-n junction and the ground connection to NMOS transistors in the p-type substrate. The resulting short circuit condition in the conducting parasitic structure is referred to as latchup. Latchup is dangerous in that the circuit can be destroyed from the latchup currents.
• latchup inhibits normal operation.
• An n-well voltage switching circuit controls the voltage for a switched n- well of a dual-mode PMOS transistor to prevent latchup.
• the dual-mode PMOS transistor is controlled to operate in both a high- voltage mode and a low-voltage mode.
• the n-well voltage switching circuit biases the switched n- well to a high voltage.
• This high voltage is at least as high as any expected source (or drain) voltage for the dual-mode PMOS transistor during operation in the high- voltage mode. In this fashion, the p-n junction for the dual-mode PMOS transistor between its source and the switched n-well does not get forward biased and latchup is prevented accordingly.
• the n-well voltage switching circuit biases the switched n-well to a low voltage that is lower than the high voltage. This low voltage is sufficiently low such that the dual-mode PMOS transistor is not strained during the low- voltage mode. In this fashion, the dual-mode PMOS transistor may be relatively small and have a thin-gate oxide to enhance density.
• a plurality of dual-mode PMOS transistors may have the voltage of their switched n-wells biased by the n-well voltage switching circuit to further enhance density.
• the n-well switching voltage switching circuit includes a first PMOS transistor of a first size having a first gate-oxide thickness.
• the first size and the first gate-oxide thickness have a magnitude such that a permanent coupling of an un- switched n-well and a source for the first PMOS transistor to a high- voltage supply providing the high voltage does not cause damage to the first PMOS transistor.
• the dual-mode PMOS transistor has a second size that is less than the first size and a second gate-oxide thickness that is less than the first gate-oxide thickness.
• the second size and the second gate-oxide thickness have a magnitude such that the switched n-well for the dual-mode PMOS transistor cannot be permanently coupled to the high-voltage supply without incurring damage to the dual-mode PMOS transistor.
• the n-well voltage switching circuit is controlled so that the switched n-well is biased to the high voltage for no longer than a safe duration that protects the dual-mode PMOS transistor from damage despite its relatively small size and thin gate-oxide thickness.
• Figure 1 is a schematic diagram for an n-well voltage switching circuit.
• Figure 2 is a schematic diagram for an electronically programmable memory incorporating the n-well voltage switching circuit of Figure 1.
• Figure 3 is a schematic diagram of a high voltage switch for the bit line in the memory of Figure 2.
• Figure 4 illustrates a plurality of electronic systems incorporating an electronically programmable memory in accordance with embodiments disclosed herein.
• an n-well voltage switching circuit that controls the voltage bias for a dual-mode PMOS transistor's switched n-well. In a low-power mode of operation, the n-well voltage switching circuit biases the switched n-well to a relatively low voltage. Conversely, in a high-power mode of operation, the n-well voltage switching circuit biases the switched n-well to a relatively high voltage. What constitutes low and high voltage for the embodiments discussed herein depends upon the process node. For example, in a 20 nm process node, the high voltage may be 1.9 V whereas the low voltage may be 1 V.
• Figure 1 shows an embodiment of an n- well voltage switching circuit 100 that is responsive to a mode control signal 105.
• n- well voltage switching circuit 100 charges a switched n-well 110 for a dual- mode PMOS transistor 112 to a high voltage during a high-voltage (or power) mode of operation for dual-mode PMOS transistor 112.
• mode control signal 105 is pulled low to select for a low-voltage mode of operation for dual-mode PMOS transistor 112
• n-well voltage switching circuit 100 biases switched n-well 110 to a low voltage. In this fashion, switched n-well 110 need not be permanently tied to a high- voltage supply.
• dual-mode PMOS transistor 112 can then take advantage of the smaller dimensions (and thinner oxide) available in modern process nodes.
• An inverter 125 inverts mode control signal 105 into an inverted control signal 106.
• Inverted control signal 106 drives the gate of a native thick-oxide NMOS transistor 130.
• a drain of native thick-oxide NMOS transistor 130 is tied to a low voltage supply 120 whereas its source is tied to switched n-well 110.
• Low voltage supply 120 supplies the low voltage for switched n-well 110 when NMOS transistor 130 is turned on.
• mode control signal 105 goes low to select for a low-voltage mode of operation for dual-mode PMOS transistor 112
• inverted control signal 106 goes high such that NMOS transistor 130 turns fully on to bias switched n-well 110 to the low voltage.
• the source for NMOS transistor 130 forms part of an output node for n- well switching circuit 100 that couples to switched n-well 110.
• Inverted control signal 106 also drives the gate of a thick-oxide PMOS transistor 135, which is thus off in the low- voltage mode.
• the source of PMOS transistor 135 is tied to a high-voltage supply 115 and its drain is tied to switched n-well 110.
• mode control signal 105 is asserted high such that inverter 125 pulls inverted control signal 106 low so that PMOS transistor 135 is fully on.
• the drain of PMOS transistor 135 forms a remaining part of an output node for n-well voltage switching circuit 100 that couples to switched n-well 110.
• High-voltage supply 115 supplies the high voltage that biases switched n- well 110 when PMOS transistor 135 is turned on. NMOS transistor 130 is turned off in response to inverted control signal 106 going low at this time. Thus, switched n-well 110 for dual-mode PMOS transistor 112 is biased to the high voltage when mode control signal 105 goes high. PMOS transistor 135 is not stressed from the high voltage since its n-well 140 is also tied to high voltage supply 115 and because its gate oxide is relatively thick. In addition, PMOS transistor 135 has a size (channel length) sufficiently large to be robust to such a permanent coupling to the high voltage.
• control signal 106 should also be charged to the high voltage during the low-power mode of operation for dual-mode PMOS transistor 112. If control signal 106 were instead just charged to the low voltage during this time, the gate voltage of PMOS transistor 135 could be sufficiently lower than its source voltage so that PMOS transistor 135 would conduct rather than be shut off. Thus, high- voltage supply 115 supplies the power to inverter 125 so that control signal 106 is charged to the high voltage during the low- voltage mode of operation for dual-mode PMOS transistor 112. In this fashion, PMOS transistor 135 is fully off during the low-power mode of operation.
• NMOS transistor 130 is a thick-oxide transistor even though its drain is tied only to low- voltage supply 120 because its gate will thus be charged to the high voltage during the low- voltage mode of operation for dual-mode PMOS transistor 112.
• Both PMOS transistor 135 and NMOS transistor 130 must be relatively large and robust to withstand the strain from high-voltage supply 115. These transistors thus demand die space accordingly. But there need only be one n-well voltage switching circuit 100 to control the switched n-well potential for assorted other dual- mode PMOS transistors having the low and high voltage modes of operation. In this fashion, substantial die area savings may be realized.
• Dual-mode transistor PMOS 112 has a size that is smaller than the size used for PMOS transistor 135 and NMOS transistor 130. For example, dual-mode PMOS transistor 112 may have the minimum size and gate oxide thickness allowed by the process node. In this fashion, density is greatly enhanced.
• inverter 125 may be omitted in alternative embodiments in which control signal 105 is replaced with an active low control signal that would directly drive the gates of NMOS transistor 130 and PMOS transistor 135.
• the active low control signal would be pulled low to select for the high-voltage mode of operation.
• the active low control signal would be charged to the high voltage to select for the low-voltage mode of operation.
• an electrically-programmable fuse (e-fuse) memory includes assorted word line drivers as well as programming transistors.
• e-fuse memory the electrically-programmable fuse
• an e-fuse memory 200 shown in Figure 2 enables the use of small thin-oxide word line drivers and programming transistors, which advantageously increases density.
• e-fuse memory 200 is shown with just a single word line 210 and a single bit line 225. It will be appreciated, however, that e-fuse memory 200 includes a plurality of other word lines and bit lines arranged analogously as shown for word line 210 and bit line 225. The other word lines would form additional rows in parallel with word line 210.
• bit lines 225 would form columns in parallel with bit line 225.
• the corresponding e-fuses for that word line may be either read or programmed depending upon the bias for the bit lines.
• Each intersection of a word line and the bit lines corresponds to an e-fuse.
• an e-fuse 215 corresponds to the intersection of word line 210 and bit line 225.
• Each e-fuse comprises a fusible link that is conductive in the un-programmed state.
• a programmed e-fuse is either an open circuit or much more resistive as compared to an un-programmed e-fuse.
• the word line driver transistors may thus be advantageously implemented using a switched n-well so that these transistors may remain relatively small yet be robust to the high- voltage mode of operation.
• a small thin-oxide word line (WL) driver PMOS transistor 205 has its drain tied to word line 210.
• WL driver PMOS transistor 205 has its switched n-well 110 controlled by n-well voltage switching circuit 100 as discussed with regard to Figure 1.
• the source of WL driver PMOS transistor 205 is also tied to switched n-well 110 so that the voltage bias for both the source and switched n-well 110 are controlled by mode control signal 105.
• n-well voltage switching circuit 100 biases the source and switched n-well 110 for WL driver PMOS transistor 205 to the high voltage.
• a word line decoder (not illustrated) selects for word line 210 by pulling the gate of WL driver PMOS transistor 205 low.
• WL driver PMOS transistor 205 turns on and biases word line 210 to the high voltage.
• Word line 210 controls a gate of a small thin-oxide programming NMOS transistor 220 having its source tied to ground and a drain tied to a terminal of e-fuse 215. In the programming mode, programming NMOS transistor 220 thus has its gate biased to the high voltage.
• Bit line 225 couples to a remaining terminal of e-fuse 215. If bit line 225 is also charged to the high voltage when NMOS programming transistor 220 turns on, a relatively large amount of current will flow through e-fuse 215 so that it can be programmed.
• mode control signal 105 commands n- well voltage switching circuit 100 to bias the source and switched n-well 110 of WL driver PMOS transistor 205 to the low voltage. If the gate of WL driver PMOS transistor 205 is then pulled low, this transistor will then turn on to charge word line 210 to the low voltage so as to turn on NMOS programming transistor 220. During this read operation, bit line 225 is biased to the low- voltage. If e-fuse 215 is un-programmed, the assertion of word line 210 will pull the charged bit line 225 towards ground because of the conduction through NMOS programming transistor 220. In contrast, if e-fuse 215 had been programmed, bit line 225 will not be pulled to ground despite NMOS programming transistor 220 being turned on.
• WL driver PMOS transistor 205 is thus protected from latchup during the high- voltage mode of operation for programming e-fuses, it is not robust to a sufficiently long period of high- voltage operation since WL driver PMOS transistor 205 is a small thin-oxide transistor. But the programming of an e-fuse takes a relatively short amount of time as compared to the high-voltage longevity of such a small thin- oxide transistor.
• a controller 150 that controls the state of mode control signal 105 is configured to assert mode control signal 105 only for the relatively short amount of time necessary to program e-fuse 215.
• both WL driver PMOS transistor 205 and programming NMOS transistor 220 are biased by the high voltage only for the duration necessary to program e-fuse 215.
• both of these transistors can take advantage of the small dimensions and thin gate-oxide thickness available in modern process nodes, which greatly enhances die saving. For example, if memory 200 includes a plurality N of word lines and the same plurality N of bit lines, it would include N 2 e- fuses and would thus require N 2 programming transistors. The die area savings are thus quadratically related to the size of the memory.
• n-well voltage switching discussed herein may also be applied to the power switch used to pull bit line 225 to the high voltage during the programming mode.
• a global power switch in series with a local power switch for the high- voltage charging of bit line 225.
• both these switches would comprise relatively large thick-oxide PMOS transistors having their n- wells permanently tied to high voltage supply 115 to prevent latchup.
• a local power switch comprises a relatively small thin-oxide PMOS transistor 300 having its switched n-well 110 controlled by n-well voltage switching circuit 100.
• a global power switch comprises a relatively large thick- oxide PMOS transistor 305 having its source and an un-switched n-well 306 tied to high- voltage supply 115.
• PMOS transistor 300 couples in series between bit line 225 and a drain for PMOS transistor 305.
• An enable programming control signal 315 is inverted through an inverter 310 to drive the gates of both PMOS transistors 305 and 300.
• enable programming control signal 315 is also the mode control signal for n-well voltage switching circuit 100.
• enable programming control signal 315 is asserted, switched n-well 110 is also charged to the high voltage.
• enable programming control signal 315 is de-asserted such that PMOS transistors 300 and 305 are turned off.
• n-well voltage switching circuit 100 biases switched n-well 110 to the low voltage. But note that a node 320 coupling to the source for PMOS transistor 300 was charged to the high voltage during the programming mode. To prevent any possibility of latchup occurring from this charged node potential as compared to the low voltage for switched n-well 110, an NMOS transistor 325 pulls node 320 to ground when memory 200 is not being programmed.
• inverter 310 drives the gate of NMOS transistor 325 such that NMOS transistor 325 turns on in response to the de-assertion of enable programming mode control signal 315.
• a source of NMOS transistor 325 is tied to ground whereas its drain is tied to node 320. In this fashion, NMOS transistor 325 will pull the potential for node 320 to ground when e-fuse memory 200 is not in the programming mode.
• a separate low voltage switch (not illustrated) would be active during a read mode of operation for memory 200 to charge bit line 225 to the low voltage.
• Electrically programmable memory 200 has numerous applications. For example, it conventional to use such a memory to configure a system-on-a-chip (SOC) with configuration data, trim data, RAM redundancy information, an encryption code, or other suitable information.
• SOC system-on-a-chip
• Figure 4 illustrates some exemplary devices that include an SOC enhanced with electrically programmable memory 200.
• a cell phone 400, a laptop 405, and a tablet PC 410 may all include an electrically
• programmable memory 200 constructed in accordance with the disclosure.
• Other exemplary electronic systems such as a music player, a video player, a communication device, and a personal computer may also be configured with electrically programmable memories in accordance with the disclosure.

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• 2013
  • 2013-01-16 US US13/742,964 patent/US8787096B1/en active Active
• 2014
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