WO2014112600A1 - 熱交換器とその製造方法 - Google Patents
熱交換器とその製造方法 Download PDFInfo
- Publication number
- WO2014112600A1 WO2014112600A1 PCT/JP2014/050845 JP2014050845W WO2014112600A1 WO 2014112600 A1 WO2014112600 A1 WO 2014112600A1 JP 2014050845 W JP2014050845 W JP 2014050845W WO 2014112600 A1 WO2014112600 A1 WO 2014112600A1
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- Prior art keywords
- molded body
- heat exchanger
- heat
- edge
- resin
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims description 31
- 229920005989 resin Polymers 0.000 claims abstract description 77
- 239000011347 resin Substances 0.000 claims abstract description 77
- 238000005304 joining Methods 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
- 239000011342 resin composition Substances 0.000 claims abstract description 30
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 22
- 238000012545 processing Methods 0.000 claims abstract description 15
- 239000012530 fluid Substances 0.000 claims abstract description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 40
- 230000001737 promoting effect Effects 0.000 claims description 32
- 238000000465 moulding Methods 0.000 claims description 19
- 238000001746 injection moulding Methods 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 13
- -1 polybutylene terephthalate Polymers 0.000 claims description 12
- 239000000498 cooling water Substances 0.000 claims description 8
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 6
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 5
- 229920006122 polyamide resin Polymers 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 description 41
- 239000000463 material Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 17
- 230000001965 increasing effect Effects 0.000 description 14
- 238000005219 brazing Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 235000013405 beer Nutrition 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000013585 weight reducing agent Substances 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 230000002528 anti-freeze Effects 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 229910001092 metal group alloy Inorganic materials 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010027339 Menstruation irregular Diseases 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010409 ironing Methods 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 229910001463 metal phosphate Inorganic materials 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
- F28F19/04—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of rubber; of plastics material; of varnish
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20872—Liquid coolant without phase change
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/02—Flexible elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/08—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes pressed; stamped; deep-drawn
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/14—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes molded
- F28F2255/146—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes molded overmolded
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/10—Arrangements for sealing the margins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49352—Repairing, converting, servicing or salvaging
Definitions
- the present invention relates to a heat exchanger that performs heat exchange through a heat medium and a method for manufacturing the same. More specifically, the present invention relates to a heat exchanger for exchanging heat with an electronic component of an electronic control circuit or the like and cooling the heat exchanger, and a manufacturing method thereof.
- heat exchangers that efficiently transfer heat from one object to another have been proposed for various structures such as heating and cooling, and are used in a wide variety of applications.
- a semiconductor element such as a CPU mounted on a substrate of a control circuit generates high heat generation, so that it is necessary to cool it, and a cooler for that purpose is provided.
- a cooler for that purpose is provided.
- electronic components in the automotive field where air-cooled or water-cooled coolers are used are exposed to harsh environments such as operation in high-temperature desert areas, operation in cold areas, etc. There are many.
- an aluminum alloy used for cooling an automobile engine system has been used as a material.
- the joining between the aluminum alloy parts is performed by brazing using an Al—Si based brazing alloy.
- an aluminum alloy cooler joined by brazing has been used as a main member for cooling electronic components on a control circuit board.
- a device applied to a switching power supply device is disclosed in which a base plate integrated with the cooler is formed of a molded member (for example, Patent Document 1, Patent Document 1). 2).
- This base plate which forms the frame of the cooler, is brought into contact with electronic components mounted on an electronic circuit board and cooled by heat conduction. For this reason, the shape of this base plate is flat and rectangular in accordance with the shape of the electronic circuit board.
- the cooler is not of an independent structure, but is characterized in that the base plate is brought into direct contact with the electronic component to increase the heat exchange efficiency and the base plate is made small.
- This cooler is integrated as a structure provided in the recess of the base plate. In order to make the contact area with the electronic component effective, the height of the pedestal is changed according to the level difference.
- Patent Document 3 an example in which a thin metal body is applied to the cooler is known (for example, see Patent Document 3).
- This example is disclosed as a cooler in which two press-molded plates are joined to form a tube and fins are arranged in the tube.
- This tube is disclosed as a plurality of tube structures that are stacked at a predetermined interval in a direction orthogonal to the direction of the flow of the cooling fluid. The thickness of this tube is shown as 0.4 mm, allowing some deformation.
- the aluminum alloy is used as the material to reduce the weight, but brazing, which is a conventional fixing method, is mainly used for joining the aluminum alloy parts.
- a thin aluminum alloy coil body having a thickness of 0.1 mm or less is used for a can body used in a typical can beer as a thin metal body (see, for example, Patent Documents 4 and 5). ).
- This thin aluminum alloy coil body used as a can body material has a laminated structure with a resin coating on the surface, and can be pressed and drawn even in this resin-coated state. .
- This aluminum alloy coil body is disclosed as applied to the formation of DI cans and bottle cans. Since this aluminum alloy coil body is extremely thin, it is a material having a property of being easily bent and easily deformed. Further, the resin coating prevents gas from coming into contact with metal and has a gas barrier property so that beer is not oxidized. Furthermore, with regard to the joining of an aluminum alloy and a resin, joining techniques that have achieved weight reduction and enhanced adhesive strength have been established (see, for example, Patent Documents 6 and 7). That is, this is a technique in which the surface of an aluminum alloy is subjected to a chemical etching process to form an ultrafine uneven surface, and a thermoplastic resin composition is adhered to the ultrafine uneven surface by injection molding.
- the base substrate is a member formed by molding an aluminum alloy, and is therefore an aluminum alloy having a certain thickness.
- the base since the base is a molded member made of an aluminum alloy, it has a certain thickness.
- a cooler in a tube form with a structure for reducing the weight has been proposed. This is formed by press-molding a thin plate aluminum alloy and has a structure in which fins are arranged inside.
- the thin metal plate used as the material of the tube has a thickness of 0.4 mm. However, although it is somewhat deformed, it is partially deformed by receiving an internal pressure from a liquid heat medium such as water inside. It's not a material.
- a further problem is that joining the aluminum alloy is by brazing.
- the above-described tube is structured by overlapping two plates, and this overlapping portion is formed by brazing.
- This brazing joining method may cause the joining state to be incomplete due to corrosion or poor bonding due to vibration or the like in a severe use environment.
- vibration always accompanies and there is a risk of leakage of water as a heat medium due to breakage, and it cannot always be said that there is certainty.
- salt damage from antifreezing agents sprayed on roads salt damage from coastal areas, coastal areas, and the like.
- the generated heat also increases, so the cooling efficiency has to be further increased.
- a cooling method for such a purpose of use a water-cooled type that has a higher cooling effect than an air-cooled type is adopted.
- An object of the present invention is to provide a safe and reliable heat exchanger and a method for manufacturing the same, simplifying the structure, reducing weight and cost.
- the heat exchanger of the present invention A heat exchanger for exchanging heat with a heat exchanger (3) via a heat medium (8), It is composed of a thin metal plate that can be bent by the internal pressure of the heat medium (8), and has an outer surface (4a) that can contact the heat exchanger and an inner surface (4b) coated with a resin, A first molded body (4) comprising an edge provided at a peripheral edge, and a recess formed in a concave shape in cross section between the edge and the edge; A member that is combined with the first molded body (4) so as to face the first molded body (4), is configured by a thin metal plate that can be bent by an internal pressure of the heat medium (8), and can be in contact with the heat exchange body.
- a second molded body (5) Provided across the edge (4c) of the first molded body (4) and the edge (5c) of the second molded body (5), A thermoplastic resin composition is injection-molded onto the outer surface (4a) of the edge and the outer surface (5a) of the edge of the second molded body, and the edge and the second molded body of the first molded body.
- a joining member (6) for integrally joining the edges of Surrounded and formed by the first molded body and the second molded body integrally joined by the joining member, the fluid passage of the heat medium (8) has a supply port (10) and a discharge port (11). Consisting of the space part (7)
- the inner surface (4b) of the edge portion (4c) of the first molded body and the inner surface (5b) of the edge portion (5c) of the second molded body are heat-bonded to each other. By making it adhere, it is characterized by making the said space part into a sealed state.
- the heat exchanger of the present invention 2 is characterized in that, in the present invention 1, the thin metal plate is an aluminum alloy plate having a predetermined thickness coated with the resin.
- a heat exchanger according to a third aspect of the present invention is the heat exchanger according to the first or second aspect, wherein the heat exchanger is an electronic component mounted on an electronic control circuit board of an automobile, and a main component of the heat medium is cooling water. It is characterized by.
- the heat exchanger of the present invention 4 is the heat exchanger according to the first or second aspect of the present invention, wherein the outer surface (4a) of the first molded body to which the thermoplastic resin composition is fixed by the injection molding, and the second molded body.
- the outer surface (5a) is subjected to an ultrafine processing treatment in order to strengthen the adhesion of the thermoplastic resin composition.
- the thermoplastic resin composition comprises a polybutylene terephthalate resin, a polyphenylene It is a thermoplastic resin composition containing as a main component one selected from a sulfide resin and a polyamide resin.
- a heat exchanger according to a fifth aspect of the present invention is the heat exchanger according to the first or second aspect of the present invention, wherein the first molded body (4) and / or the second molded body (5) are provided with the recesses in order to meander the heat medium.
- a protruding portion (14, 15) having a protruding shape that protrudes toward the space portion (7) is provided in a part of the shape.
- a heat exchanger according to a sixth aspect of the present invention is the first or the second molded body according to the first or second aspect of the present invention, wherein the first molded body and / or the second molded body has a convex shape projecting toward the electronic component side in a part of the shape of the concave portion.
- projection part of is provided.
- a heat exchanger according to a seventh aspect of the present invention is the heat exchanger according to the first or second aspect of the present invention, wherein in the first molded body and / or the second molded body, a part of the shape of the concave portion is made uneven to match the height of the electronic component. It is characterized in that a step is provided.
- the heat exchanger of the present invention 8 is characterized in that, in the present invention 1 or 2, the bendable thin metal plate is an aluminum alloy metal plate having a thickness of 0.1 to 0.8 mm. To do.
- the heat exchanger according to the ninth aspect of the present invention has a structure in which, in the first or second aspect of the present invention, the space portion has a built-in heat exchange promoting body that is in surface contact with the first molded body and the second molded body to promote heat exchange. It is characterized by becoming.
- the manufacturing method of the heat exchanger of the present invention 10 A heat exchanger manufacturing method for performing heat exchange with a heat exchanger (3) via a heat medium (8), Two thin metal plates that can be bent and are coated with resin on one surface, the outer surface (4a, 5a) as the surface in contact with the heat exchanger (3), and the inner surface (4b, 5b) as the resin
- a first molded body (4) and a second molded body comprising a coated resin-coated surface, an edge provided on the periphery, and a recess formed in a concave shape in cross section between the edge and the edge.
- the first molded body (4) and the second molded body (5) that have been heat-sealed are inserted into a mold (12), and a cavity (12d) formed at the edge (4c, 5c) site.
- the method for producing a heat exchanger according to the present invention 11 is the method according to the present invention 10, wherein the thin metal plate is an aluminum alloy plate having a predetermined thickness coated with the resin, and the thermoplastic resin composition is polybutylene.
- a thermoplastic resin composition comprising as a main component one selected from a terephthalate resin, a polyphenylene sulfide resin, and a polyamide resin, and before the injection molding, the outer surface of the first molded body (4) ( 4a) and a step of performing ultrafine processing on the outer surface (5a) of the second molded body (5) in order to strengthen the adhesion of the thermoplastic resin composition.
- the press molding step is the shape of the concave portion of the first molded body (4) and / or the second molded body (5).
- a step of forming a protruding portion that protrudes into a convex shape is included.
- the method for producing a heat exchanger according to a thirteenth aspect of the present invention is the method according to the tenth or eleventh aspect of the present invention, wherein the step of press-molding comprises the shape of the recess of the first molded body (4) and / or the second molded body (5) A part thereof includes a step of forming a step shape.
- the heat exchanger of the present invention since the base body of the heat exchanger is a thin metal plate molded body, the heat exchanger combining the two molded bodies has a structure that is easy to bend and can be partially deformed.
- the outer surface of the edge of the two molded bodies is subjected to ultra-fine processing having a fine irregular surface, the thermoplastic resin composition is injected into this portion, and the two molded bodies are joined with the periphery of the edge between them. A joining member was formed. This is a strong joint, and even if there is vibration of the automobile, there is no risk of the heat medium leaking outside from the space that is the flow path of the heat medium, so a high quality and highly reliable heat exchanger is achieved. Obtainable.
- the resin coated on the inner surface of the edge of the two molded products is heat-sealed by hot pressing to seal between the inner surfaces of the edge, and the sealing by the joining member and the heat of the resin on the inner surface
- a heat exchanger with high quality and high reliability can be obtained by preventing the heat medium from leaking from the space to the outside.
- this heat exchanger does not employ brazing using a brazing material, the reliability of the product can be improved.
- the manufacturing method of the heat exchanger according to the present invention is a highly productive manufacturing method mainly including a press molding process, a hot press working process, an injection molding process, etc., and a high quality and highly reliable heat exchanger is provided. It can be manufactured at low cost with good productivity.
- FIG. 1 is a cross-sectional view showing a state where heat exchange is performed by bringing an electronic component into contact with one molded body of a heat exchanger having a single structure.
- 2 (a) to 2 (e) are process explanatory views showing the manufacturing process of the heat exchanger.
- FIG. 3 is a cross-sectional view showing a state where heat exchange is performed by bringing the electronic components mounted on the two substrates into contact with both molded bodies of the heat exchanger having a single structure.
- FIG. 4 is a cross-sectional view showing a state where heat exchange is performed by arranging a plurality of heat exchangers in contact with a plurality of electronic components mounted on a plurality of substrates, respectively.
- FIG. 5 is a cross-sectional view showing a state in which an uneven step is provided on one molded body of the heat exchanger and brought into contact with an electronic component to perform heat exchange.
- FIG. 6 is a cross-sectional view showing a state in which a convex projecting portion is provided on the space portion side of one molded body of the heat exchanger to perform heat exchange.
- FIG. 7 is a cross-sectional view showing a state where heat is exchanged by providing overhang portions on both molded bodies of the heat exchanger in the modification of FIG.
- FIG. 8 is a cross-sectional view showing a state in which a convex protrusion is provided on the electronic component side of one molded body of the heat exchanger to perform heat exchange.
- FIG. 9 is a cross-sectional view showing a state in which heat is exchanged by providing a projecting protruding portion on two molded bodies so that the heat medium meanders and flows in the modification of FIG.
- FIG. 10 is a partial cross-sectional view showing another structural example related to the joining member of the heat exchanger 1.
- FIG. 11 is a cross-sectional view in which the heat exchange promoting body is built in the heat exchanger, and the heat exchange promoting body has a honeycomb structure.
- FIG. 12 is a cross-sectional view showing another embodiment in which the heat exchange promoting body is incorporated in the heat exchanger, and the heat exchange promoting body is a metal block body and has a structure having one row of through holes.
- FIG. 13 is a cross-sectional view showing another embodiment in which the heat exchange promoting body is incorporated in the heat exchanger, and the heat exchange promoting body is a metal block body and has a structure having two rows of through holes.
- FIG. 11 is a cross-sectional view in which the heat exchange promoting body is built in the heat exchanger, and the heat exchange promoting body has a honeycomb structure.
- FIG. 12 is a cross-sectional view showing another embodiment in which the heat exchange promoting body is
- FIG. 14 is a cross-sectional view showing a structure in which the heat exchange promoting body is built in the heat exchanger, and the heat exchange promoting body has a bent bellows structure.
- FIG. 15 is a partial view showing a structure in which the bent portion of the heat exchange promoting body is flattened in the modification of FIG.
- FIG. 16 is a modification of FIG. 14 and is a partial view showing a structure in which a step portion is provided in the bent shape of the heat exchange promoting body.
- FIG. 17 is a plan view showing an inflow / outflow state of the heat medium of the heat exchanger 1 incorporating the heat exchange promoting body, and FIG. 17 (a) is an inlet / outlet in a direction crossing the flow direction of the heat medium 8.
- FIG. 15 is a partial view showing a structure in which the bent portion of the heat exchange promoting body is flattened in the modification of FIG.
- FIG. 16 is a modification of FIG. 14 and is a partial view showing a structure in which a
- FIG. 17B is a diagram showing an example in which an inlet and an outlet are provided in the same direction as the flow direction of the heat medium 8 of the heat exchanger 5.
- FIG. 18 is a partial view showing a structure in which the shape of the heat exchange promoting body is changed in order to change the flow of the heat medium in the modification of FIG.
- FIG. 1 is a cross-sectional view of the basic form of the heat exchanger of the present invention and shows a state in which it is in contact with an electronic component.
- the heat exchange device is applied for heating and cooling, but in the present embodiment, it will be described as a heat exchanger applied for cooling.
- a cooling heat exchanger 1 (hereinafter referred to as “heat exchanger 1”) is disposed and mounted on an electronic control circuit board 2 (hereinafter referred to as “substrate 2”) that is a target of heat exchange. It is provided in contact with an electronic component (heat exchange body) 3 such as a semiconductor.
- This electronic component 3 to be cooled is mainly used in a control circuit device of an automobile.
- This electronic component 3 is a heat source, and if it exceeds the limit temperature, the function as the electronic component is impaired, so it must be cooled.
- the heat exchanger 1 of the present embodiment combines the first molded body 4 formed by press-molding a thin aluminum alloy coil plate and the second molded body 5 having the same structure as this, and the combined portion thereof A joining member 6 that is a thermoplastic synthetic resin is formed by injection molding.
- the heat medium 8 is circulated in the internal space portion 7 formed by the combination to exchange heat.
- the heat medium in the present embodiment is cooling water.
- the electronic component 3 is mainly cooled by being in contact with the outer surface 4a of the first molded body 4, the outer surface 5a of the second molded body 5, or both the outer surfaces 4a and 5a.
- the thin aluminum alloy coil plate used in the present embodiment is the same type as the thin aluminum alloy plate used in beer cans and the like. This aluminum alloy coil plate has a predetermined thickness (for example, 0.1 to 0.4 mm) and a very thin thickness. At least one surface of the aluminum alloy coil plate is coated with a very thin resin. ing.
- the inner and outer surfaces of the beer can are coated with, for example, about 4 ⁇ m on the inner surface and 4 to 10 ⁇ m (including the coating thickness) on the outer surface.
- This resin film is generally one or more layers coated with a laminate film.
- polypropylene (PP) is used as the type of resin.
- This PP is a resin that has a high melting point, a high heat distortion temperature, withstands the boiling temperature of water, is glossy, is suitable for forming a transparent film, and is harder than polyethylene terephthalate (PET).
- PET polyethylene terephthalate
- the type of the coating resin is not limited to polypropylene (PP), and other types of resin such as polyethylene terephthalate (PET) may be used.
- the first molded body 4 and the second molded body 5 are formed by press-molding a flat molded material (thin metal plate) obtained by cutting an aluminum alloy coil plate into a predetermined shape and size.
- the thickness of the aluminum alloy coil plate should be determined in consideration of the internal pressure, durability, and flexibility, but is 0.1 to 0.8 mm, preferably 0.3 to 0.8, more preferably 0.8. A thickness of 3 to 0.5 mm is preferable. For example, when the internal pressure is 0.6 to 1 MPa, the pressure is preferably 0.3 to 0.5 mm.
- the 1st molded object 4 was shape
- the 2nd molded object 5 consists of a recessed part (a convex part if it sees from the reverse) in the cross sectional view between the edge part 5c formed in a periphery, and the edge part 5c and the edge part 5c.
- This recess is formed by press molding.
- the 1st molded object 4 and the 2nd molded object 5 are the edge 4c and the edge 5c in the state which faced the recessed part shape
- the base body of the heat exchanger 1 composed of the molded body 4 and the second molded body 5 are structured.
- the 1st molded object 4 and the 2nd molded object 5 are combined so that the inner surface 4b and the inner surface 5b may oppose, and are used as the base
- the inner surfaces 4b and 5b are resin-coated surfaces, and the resin-coated surfaces are surfaces in which the surface of an aluminum alloy is coated with a resin.
- This resin-coated surface prevents the material (aluminum alloy) of the first molded body 4 and the second molded body 5 from corroding due to the heat medium 8 flowing into the interior, and the heat medium 8 is altered during use. It also prevents that.
- the resin-coated surface is a heat medium such as an antifreeze liquid, the material is not affected, and there is a gas barrier property.
- the material of the first molded body 4 and the second molded body 5 coated with the resin can be pressed by plastic working. After the resin-coated surface of the edge 4c of the first molded body 4 and the resin-coated surface of the edge 5c of the second molded body 5 are brought into contact with the inner surface 4b of the edge 4c and the inner surface 5b of the edge 5c, By performing press working, the resins forming the resin-coated surface are heat-sealed.
- the resin-coated surface of the inner surface 4b of the edge portion 4c and the resin-coated surface of the inner surface 5b of the edge portion 5c are brought into close contact with each other, and the heat medium 8 in the space portion 7 is brought into contact with the contact portion. There is no leakage outside the heat exchanger 1. This heat fusion can be said to be temporary joining in terms of the manufacturing process.
- the coil plate is processed into a can by DI molding (drawing and ironing) to produce a beer can.
- DI molding drawing and ironing
- this material is extremely thin and has a property capable of DI molding, and is a material that enables press molding while maintaining its thinness.
- Patent Document 4 shows an example of an aluminum alloy that can be applied to DI cans and bottle cans by minimizing strength reduction after resin coating to ensure formability.
- a metal with such a record As an example, for example, a thickness of 3004-H19 alloy (see “JISJH 4000” defined in Japanese Industrial Standards) with H19 tempering used as a beer can body material is set to a predetermined thickness (for example, , 0.3 mm) is preferable.
- a heat medium circulation pump, a circulation circuit pipe, a control device, and the like are additionally provided.
- the heat exchanger 1 basically includes the first molded body 4 and the second molded body 5 which are two molded bodies. The two molded bodies 4 and 5 formed with the recesses are combined so that the inner surfaces 4b and 5b face each other, and the space portion 7 is constructed inside.
- the internal space 7 serves as a flow path for the heat medium 8, and the inner surfaces 4b and 5b are resin-coated surfaces coated with resin. Therefore, when the two molded bodies 4 and 5 are combined, the edge 4c of the first molded body 4 and the edge 5c of the second molded body 5 are brought into contact with each other. Since the abutted edges 4c and 5c are resin-coated on the inner surfaces 4b and 5b, the resin coated by hot pressing is heat-sealed, and the inner surface 4b and the edge of the edge 4c. It is possible to make a close contact with the inner surface 5b of 5c.
- the heat-sealed portion serves as a first seal that prevents the heat medium 8 from leaking from the space portion 7 to the outside of the heat exchanger 1 through the space between the edge portion 4c and the edge portion 5c.
- the space 7 can be sealed.
- the outer surfaces 4a and 5a of the recesses come into contact with the electronic component 3, and the thickness of the two molded bodies 4 and 5 is very thin enough to bend by the internal pressure of the heat medium 8, so The structure is easy to break.
- the peripheral shape of the edge portions 4c and 5c of the two molded bodies 4 and 5 combined is a rectangular shape in accordance with the shape of the substrate 2 on which the electronic component 3 is arranged.
- the outer surface 4a of the edge portion 4c and the outer surface 5a of the edge portion 5c are surfaces not coated with resin.
- an ultra fine surface treatment is performed to form a fine uneven surface on the outer surface 4a of the edge 4c and the outer surface 5a of the edge 5c. This process is for improving the adhesive force between the outer surface 4a of the edge 4c and the outer surface 5a of the edge 5c and the joining member 6.
- the ultrafine processing is a known technique, but an outline thereof will be described in order to facilitate understanding of the present invention.
- the first condition is unevenness with a peak-valley average interval (RSm) of 1 to 10 ⁇ m by chemical etching technique, and the unevenness height difference is about half of the period, that is, the maximum roughness height (Rz) is 0.2 to
- the rough surface is up to 5 ⁇ m. In other words, the surface should have a roughness on the order of microns.
- the second condition is that the inner wall surface of the concave portion forming the above-mentioned rough surface has an ultra fine uneven surface with a period of 10 nm or more, preferably about 50 nm.
- the third condition is that the complicated surface is made of a ceramic, specifically, a metal oxide layer having a problem with corrosion resistance is a metal oxide layer thicker than a natural oxide layer.
- a metal alloy species having a problem with corrosion resistance is a thin layer of metal oxide or metal phosphorous oxide produced by chemical conversion treatment.
- some chemical processing is performed on the metal alloy to (1) a surface with large irregularities on the order of microns, and more specifically, (2) at least the inner wall surface of the recess has a period of 10 nm or more. Due to the presence of the ultra-fine irregularities, (3) the surface of the metal alloy itself forming the ultra-fine irregularities and larger irregularities on the order of microns is covered with a thin ceramic material.
- the surface is a surface having a roughness of 0.5 to 10 ⁇ m by chemical etching, and this surface is covered with an ultrafine irregular surface with an irregular period of 5 to 500 nm. And the surface is covered with a thin layer of metal oxide or metal phosphate.
- this treatment By applying this treatment, the metal and the resin are firmly integrated. Since this surface treatment is described in detail in Patent Documents 6 and 7, the detailed description is omitted.
- a resin-body joining member 6 is formed by injection molding on 4c and 5c, and a basic heat exchanger 1 as a single unit is constructed. As shown in the figure, this joining member 6 is located outside the portion 12e (see FIG. 2 (d)) of the holding range of the mold (a portion 1a away from the concave end surface of the molded bodies 4 and 5), that is, It is comprised so that the edge parts 4c and 5c surrounding the two molded objects 4 and 5 may be surrounded endlessly. The joining member 6 covers and surrounds the edges 4c and 5c of the two molded bodies 4 and 5.
- the bonding member 6 is a combination of the two molded bodies 4 and 5, and the resin body is preferably a polybutylene terephthalate resin (PBT), a polyphenylene sulfide resin (PPS), Alternatively, a crystalline thermoplastic resin composition (hereinafter referred to as “resin composition”) mainly composed of a polyamide resin (nylon 6, nylon 66, etc.) is injection-molded.
- PBT polybutylene terephthalate resin
- PPS polyphenylene sulfide resin
- resin composition a crystalline thermoplastic resin composition mainly composed of a polyamide resin (nylon 6, nylon 66, etc.) is injection-molded.
- the outer surface 4a of the edge part 4c of the two molded objects 4 and 5 made from an aluminum alloy, the outer surface 5a of the edge part 5c, and the joining member 6 of a resin body are firmly integrated and joined.
- the joining member 6 can be molded while the above is generated. The absence of the deburring process greatly contributes to the reduction of man-hours especially in the case of mass production.
- FIG. 1 is a view showing a heat exchange state in which the heat exchanger 1 as a single unit is brought into contact with the electronic component 3.
- the heights of the plurality of electronic components 3 are all the same, depending on the arrangement on the substrate 2, there may be some height fluctuations such as an error in the height of the electronic components 3 and an attachment error. .
- the pressure per unit area is constant according to Pascal's principle, and the outer surfaces 4a and 5a are easily partially deformed.
- the electronic component 3 is uniformly and pressed against the electronic component 3 by the pressure of the heat medium in the space 7. As a result, the heat conduction efficiency can be increased.
- a rod-like support 9 that supports the edges 4 c and 5 c of the heat exchanger 1 is provided between the substrate 2 and the heat exchanger 1.
- This rod-shaped support body 9 is a fixing means that is positioned and fixed so that it does not come off even if there is vibration.
- the heat exchanger 1 can be integrally attached to the substrate 2 on which the electronic component 3 is arranged via the rod-like support 9.
- the heat medium 8 is supplied from the supply ports 10 of the two molded bodies 4 and 5, flows as indicated by arrows (see FIG. 1), and is discharged from the discharge ports 11 of the two molded bodies 4 and 5.
- the supply port 10 and the discharge port 11 are constituted by pipe-shaped members.
- the temperature of the heat medium 8 discharged from the heat exchanger 1 is increased by exchanging heat with the electronic component 3.
- the heat medium 8 is cooled to a predetermined temperature by an external cooling device (not shown) and is again heated. It returns to 1 and circulates.
- the cooling temperature of the electronic component 3 is set to a predetermined set temperature, and the temperature management of the heat medium 8 is performed in accordance with this.
- the set temperature is set to 70 ° C. or lower.
- the heat medium 8 is cooling water, but when used in a cold region, the cooling water is an antifreeze.
- the cooling water in this case is preferably water containing, for example, ethylene glycol-based water. This ethylene glycol is one of the main raw materials of polyethylene terephthalate (PET resin), but it is well dissolved in water and has a low melting point, so it is suitable as an antifreeze for automobiles.
- FIG. 1 is a cross-sectional view of a structure in which the heat exchanger 1 is brought into contact with the electronic component 3 to allow heat exchange as described above.
- the electronic component 3 is brought into contact with the flat outer surface 4a of the first molded body 4 (one molded body).
- the heat medium 8 is supplied from the supply port 10, passes through the space portion 7, and is discharged from the discharge port 11.
- the space portion 7 serves as a flow path.
- the height of the plurality of electronic components 3 is not necessarily constant. Conventionally, for example, even a tube-shaped thickness is not deformed according to the height of each electronic component 3 although it is deformed.
- the thickness of the two molded bodies 4 and 5 is set to a predetermined thickness (for example, 0.1 mm) or less, even if there is a height error, an attachment error, etc., within a certain range. If so, the outer surface 4a is easily bent and deformed by the pressure of the heat medium 8 depending on the individual electronic component 3 as described above.
- the internal pressure of the heat medium 8 is constant at any position according to Pascal's principle, the contact pressure to any electronic component can be kept constant, so that the cooling capacity can also be kept constant. In this way, any electronic component 3 can always be in close contact with each other.
- FIG. 2 is a process explanatory view showing the manufacturing process.
- two molded bodies 4 and 5 in which a thin metal plate (a plate-shaped molding material) that can be bent and has a resin coating on one surface is press-molded into a predetermined shape. Make them face each other.
- the inner surfaces 4b and 5b of the concave portions of the two molded bodies 4 and 5 pressed are opposed to each other, and the inner surfaces 4b and 5b are resin-coated surfaces coated with resin.
- the two molded bodies 4 and 5 are combined, and the resin-coated surfaces of the inner surfaces 4b and 5b of the edges 4c and 5c are abutted.
- the edges 4c and 5c are heat-sealed by hot pressing.
- the resin-coated surface of the edge 4c and the resin-coated surface of the edge 5c are brought into close contact with each other, and at the same time, the space 7 is formed in which the insides of the two molded bodies 4, 5 are surrounded by the inner surfaces 4b, 5b. To do.
- the coated resin between the inner surface 4b of the edge portion 4c and the inner surface 5b of the edge portion 5c is heat-sealed, the space between the edge portion 4c and the edge portion 5c is in a sealed state, and the space portion 7 is a heat medium 8. It becomes this flow path.
- the edge portions 4c and 5c are uneven due to burrs and the like, but are not subjected to processing such as deburring.
- an ultrafine processing process for forming a fine uneven surface is performed on a predetermined range of the outer surfaces 4a and 5a of the combined edges 4c and 5c.
- the range indicated by “A” in FIG. 2C and the part indicated by the symbol “B” in FIG. 2C are processing parts.
- this is a process of forming a concavo-convex surface by a chemical etching technique and further forming a ceramic surface having an ultrafine concavo-convex surface with a period of 10 nm or more.
- the two molded bodies 4 and 5 that have been subjected to the ultrafine processing and heat-sealed are inserted into the mold 12.
- the mold 12 includes an upper mold 12a and a lower mold 12b, and the two molded bodies 4 and 5 are inserted across the two molds 12a and 12b.
- a cavity 12d for forming the joining member 6 is formed around the edges 4c and 5c.
- a portion 12e in the pressing range of the mold 12a and the mold 12b has a structure that sandwiches a part of the edge portions 4c and 5c on the concave side.
- the cavity 12d has a structure in which the edges 4c and 5c in an uneven state of the two molded bodies 4 and 5 protrude.
- the two molded bodies 4 and 5 heat-sealed are positioned and the mold 12 is closed, and then the resin composition is injected into the cavity 12d through the gate 12c.
- this resin composition is a resin mainly containing PBT or PPS in this example.
- the resin composition injected into the cavity 12d seals the space portion 7 with the periphery of the edge portions 4c and 5c sandwiched therebetween.
- the mold 12 is opened, and the two integrated molded bodies 4 and 5 including the solidified joining member 6 are taken out.
- the two molded bodies 4 and 5 are provided with the joining member 6 solidified with the resin composition straddling the edge portions 4c and 5c, and are joined and fixed together.
- a base body of the heat exchanger 1 is made.
- the supply port 10 and the discharge port 11 that are indispensable for the function as the heat exchanger 1 are attached to the base body so as to penetrate the space portion 7, and the heat exchanger 1 is completed as a basic form.
- the form of the supply port 10 and the discharge port 11 is not limited. As a simple example, it can be dealt with by a method of drilling a corresponding part, but this embodiment is explained by providing a pipe.
- the supply port 10 and the discharge port 11 may be provided at a stage before and after the two molded bodies 4 and 5 are combined.
- the mold structure in the post-injection molding stage is a structure that avoids interference between the supply port 10 and the discharge port 11.
- the supply port 10 and the discharge port 11 can be provided in the flat portion on the outer surface 5a side of the two molded bodies 4 and 5, the corresponding portion is partially formed into a pipe shape at the press molding stage. It is also possible to form the supply port 10 and the discharge port 11 only by forming by a protruding method and making a hole at the end.
- the present invention is basically manufactured according to the method of the present embodiment.
- another embodiment of the heat exchanger will be described as a cooling example in which the heat exchanger is applied to an electronic component. To do.
- the same reference numerals are given to the same portions as those of the above-described embodiments, and the detailed description thereof is omitted.
- FIG. 3 shows an example of a structure in which the electronic component 3 is brought into contact with the outer surface 5a of the second molded body 5 as compared with FIG. 1 and the electronic components 3 located on both sides of the heat exchanger 1 are simultaneously cooled.
- the first molded body 4 and the second molded body 5 have exactly the same conditions.
- This is an example of a structure in which a plurality of electronic components 3 arranged on two substrates 2 can be efficiently cooled by one heat exchanger 1.
- the first molded body 4 and the second molded body 5 on both sides of the heat exchanger 1 can be brought into contact with the electronic component 3 and cooled.
- FIG. 4 is an example of a structure in which a plurality of heat exchangers 1 are arranged to cool a plurality of electronic components 3.
- the heat exchanger 1 is installed between the plurality of substrates 2, and the electronic components 3 mounted on both surfaces of the plurality of substrates 2 are cooled.
- the figure shows two heat exchangers 1, the number of heat exchangers 1 is not limited, and a plurality of heat exchangers 1 may be stacked and arranged corresponding to a plurality of substrates 2 as necessary.
- supply and discharge of the heat medium 8 are performed by providing a pipe body 13 for collecting the heat medium from the supply port 10 and the discharge port 11, as shown in FIG.
- the discharge may be branched into the supply port 10 and the discharge port 11 by the pipe body 13.
- FIG. 5 shows an example of a structure corresponding to a design in which the heights of the plurality of electronic components 3 mounted on the substrate are different.
- the above-described one having the single concave surface cannot be followed only by the bending deformation of the single concave surface.
- the single flat outer shape cannot be adhered to the entire surface or almost the entire surface of all the electronic components 3 having different heights.
- the step surface 14 in which the shape 4a of the electronic component contact portion, which is the portion that contacts the electronic component 3 in the concave portion of the first molded body 4, is made uneven according to the height of the electronic component 3.
- This structural example is effective when the electronic component 3 is randomly attached to the substrate 2.
- the shape of the outer surface of the first molded body 4 is determined by a mold at the press processing stage, and an uneven surface is formed by pressing according to the height and arrangement of the electronic component 3.
- an uneven surface is formed by pressing according to the height and arrangement of the electronic component 3.
- FIG. 6 shows that a part of the shape of the electronic component contact portion of the concave portion of the first molded body 4 projects in the form of a rib toward the space portion 7 with respect to the structure of the other embodiment 3 (see FIG. 5). This is an example of the structure. Providing this projecting protruding portion 15 increases the heat transfer area, cools the environment in the vicinity of the electronic component, improves the heat exchange efficiency per unit area or volume, and consequently increases the cooling effect. Can do.
- the cooling area of the outer surface 4a of the first molded body 4 provided with the overhanging portion 15 is widened, and at the same time, the flow of the heat medium 8 is a flow over the overhanging portion 15, so that it is effective for the electronic component 3. It is possible to maintain a proper cooling state.
- the overhang portion 15 is formed only by pressing. Therefore, there is no part for forming a convex shape due to the generation of turbulent flow or the like, and there is no need to insert related parts in the space portion 7.
- FIG. 7 shows an example of a configuration in which the second molded body 5 is provided with the same structure as that of the first molded body 4 shown in FIG. Similarly to the first molded body 4, the second molded body 5 is also configured such that a part of the shape of the electronic component contact portion of the concave portion of the second molded body 5 projects toward the space portion 7 side. 16 is formed by press working. The press working of these overhang portions 15 and 16 is within a range not exceeding the combination surface of both.
- FIG. 7 shows a case where the arrangement of the electronic components 3 on the first molded body 4 side and the second molded body 5 side is alternately shifted in a zigzag pattern. The flow of the heat medium 8 in this case is the first molded body. The cooling effect can be further enhanced because the path is a little longer, meandering to the body 4 side and the second molded body side 5.
- FIG. 8 shows an overhanging portion so that a part of the electronic component contact portion in the recess extends beyond the contact surface of the electronic component 3 toward the electronic component 3 side, as compared with the other embodiment 4 (see FIGS. 6 and 7).
- 17 is an example structure.
- the side surface of the electronic component 3 can be cooled, and the cooling effect can be further enhanced.
- a similar structure can be applied to the second molded body 5.
- FIG. 9 is a plan view of the heat exchanger 1, which is a structural example in which the flow of the heat medium 8 is meandered. 6 and 7, this is a modified example in which the overhang portions 15 and 16 are provided on the space portion 7 side, but linear portions are alternately added to the overhang portions 15 and 16 to force the flow of the heat medium 8. In particular, it is configured to flow from the supply port 10 to the discharge port 11 while meandering in the left-right direction.
- the cooling function of the heat medium 8 can be effectively used, and the heat exchange between the electronic component 3 and its surroundings can be further improved.
- the position and installation range of the outer surfaces 4a and 5a are limited and the other embodiment 6 depends on the arrangement of the electronic component 3, the application is limited.
- FIG. 10 is a partial cross-sectional view showing another structural example related to the joining member of the heat exchanger 1. It is an example which structurally reinforces a joining member. That is, as shown in the figure, through holes 4e and 5e are provided in a plurality of locations on the edges 4c and 5c of the two molded bodies 4 and 5 before injecting the resin composition. By doing in this way, since the resin composition injected by injection molding passes through and fills the through holes 4e and 5e, the joining member 18 is integrally bonded with the edges 4c and 5c interposed therebetween. It will be formed in the state.
- the bonding member 18 is separated from the edges 4c and 5c of the two molded bodies 4 and 5 without breakage such as peeling even if there is vibration or the like unless a physical force such as destruction acts on the bonding member 18. It becomes a structure that does not leave.
- the form is a structural example in which a heat exchange promoting body made of a material such as metal that promotes heat exchange is inserted into the space 7 of the heat exchanger 1.
- the structure example described below is a technique that can be applied to the other embodiments described above.
- FIG. 11 is a view showing a structure in which a heat exchange promoting body 20 having an insertable shape is inserted into the space 7 of the heat exchanger 1.
- the heat exchange promoting body 20 is a honeycomb structure.
- the heat medium 8 flows through the space of the honeycomb structure, and in the course of this flow, heat from the electronic component 3 is absorbed and cooled through the heat exchange promoting body 20 to promote heat exchange.
- the heat exchange promoting body 20 controls the flow direction, flow rate, and the like of the heat medium 8 in order to increase the heat exchange efficiency.
- the honeycomb structure is a superposition of two folded thin plates of aluminum alloy or the like, and has a honeycomb shape with a so-called hexagonal cross section.
- the section modulus of the heat exchanger 1 is improved and the heat exchanger 1 is strengthened to withstand stress such as bending.
- the heat medium 8 is passed through the hexagonal space 20a to increase the heat exchange efficiency. Since this honeycomb structure has a large contact area with the heat medium 8, heat conduction from the heat medium 8 is increased, and heat exchange is further promoted as compared with the above-described example in which only the space is formed.
- FIG. 12 is an example in which a heat exchange promoting body 21 of a metal block body having a plurality of through holes 21 a is inserted into the space portion 7.
- the heat medium 8 absorbs heat and promotes heat exchange during the passage process, and heat exchange efficiency is improved.
- the cross-sectional shape of the through hole 21a is a quadrangular shape, and a plurality of the through holes 21a are arranged on a straight line.
- the concave portion 22b which is a relief portion is provided in the wall portion between the heat exchanger 1 main body, the thickness is kept constant when the heat exchange promoting body 21 is formed. Less deformation during extrusion molding.
- the heat exchanging body 21 of this metal block is formed by extruding an aluminum alloy, and the wall thickness between the through holes 21a can be formed to a desired thickness.
- This metal block is provided with a wall surface 21b which is a wall surface at a wall portion between the heat exchanger 1 body. As a result, manufacturing deformation can be prevented, and a contact area with the heat medium 8 is ensured to enable smooth heat exchange.
- the cross-sectional shape of the through-hole 21a shown in the drawing is a square shape, it is needless to say that the cross-sectional shape may be other cross-sectional shapes such as a circular shape and an elliptical shape.
- FIG. 13 is another embodiment showing a modification of FIG.
- This is an example in which the arrangement of the through holes 22a of the heat exchange promoting body 22 composed of a metal block is arranged in two stages. Compared to the above-described case of one stage, the number of through holes 22a is increased, and the contact area with the heat medium 8 is increased accordingly. Therefore, heat exchange is further promoted and heat exchange efficiency is increased.
- Making the through hole 22a of the heat exchange promoting body 22 into a multilayer having two or more stages has manufacturing restrictions due to the structural restrictions of the mold when molding by the extrusion molding method. In particular, in the case of a heat exchanger having a small shape, there is a limit, and design considerations such as changing the shape of the through hole 22a are necessary.
- part between the heat exchanger 1 main bodies is the same as that of the example mentioned above.
- FIG. 14 shows an example of a heat exchange promoting body 23 in which a thin aluminum alloy plate is bent and deformed into a wave shape to form a bellows shape.
- This structure is a simplified structure with a shape in which a single thin plate is bent into a bellows.
- the bent portion is brought into contact with the inner surfaces 4b and 5b of the molded bodies 4 and 5 in order to improve heat conduction, and the heat exchanger 1 is brought into contact with the points or surfaces.
- the heat medium 8 passes through the space between the corrugated plates and promotes heat exchange.
- This structure can be manufactured at a low cost, and further, if the space between the bellows is narrowed, the contact area of the heat medium 8 is increased to promote heat exchange and enhance the heat exchange effect.
- the premise of this structure is that the heat exchanger 1 is a thin metal plate and the joint is a resin joint 6.
- the shape of the heat exchange promoting body 23 may be another structure, for example, a portion that contacts the inner surfaces 4b and 5b as shown in FIG. 15 may be a flat portion 23a. Further, as shown in part in FIG. 16, it may be a wave-shaped heat exchange promoter having a step 23b.
- FIG. 17A and 17 (b) are diagrams showing the flow of the heat medium 8 in the heat exchanger 1 in the other embodiments shown in FIGS. 11 to 16 described above.
- FIG. 17A shows a case where the heat medium 8 is introduced from the side surface of the heat exchanger 1 in which the inflow port 10 and the outflow port 11 are arranged in a direction crossing the flow direction of the heat medium 8.
- reservoir spaces 7 a and 7 b are arranged on the side of each inlet 10 and outlet 11 of the space 7.
- the heat medium 8 flows in from the inflow port 10, stays in the accumulation space 7 a, flows in a direction indicated by an arrow while being dispersed, and flows into the heat exchange promoting bodies 20, 21, 22, and 23.
- the heat medium 8 that has absorbed heat and has been heated through the heat exchange promoting bodies 20, 21, 22, and 23 merges in the pool space 7 b on the outflow side as indicated by the arrows in the figure, and flows into the outlet 11. It is discharged to the outside through.
- FIG. 17B shows an example in which the direction of the inlet 10 and the outlet 11 of the heat medium 8 is changed.
- the heat medium 1 of the heat exchanger 1 is introduced from the same direction as the flow direction.
- the heat medium 8 that has flowed in from the inlet 10 flows into the heat exchange promoters 20, 21, 22, and 23 in the direction indicated by the arrows through the pool space 7a and generates heat.
- the heat medium 8 that has been absorbed and heated is merged in the pool space 7b on the outflow side as shown by the arrows in the figure, and is discharged to the outside from the outlet 11 in the same direction as the flow direction.
- FIG. 18 is a partial view showing another embodiment corresponding to FIG.
- the heat medium is uniformly introduced into the heat exchange promoting bodies 20, 21, 22, and 23. That is, in the pool space portion 7a, the space of the pool space portion 7a on the back side is narrower than the front side on the inflow side, and the inflow on the back side is uniformly introduced into the heat exchange promoting body in the same manner as the front side.
- the length of the back side of the heat exchange promoting bodies 20, 21, 22, 23 is made longer than the near side by S dimension. In this way, the heat medium 8 flowing into the pool space 7a can be made to flow evenly evenly, thereby promoting cooling and enhancing the cooling effect.
- the main material of the heat exchanger can be a metal other than an aluminum alloy, for example, copper, as long as it is a thin plate that is highly corrosive and can be pressed and has good adhesion to the resin.
- this heat exchanger is not described in detail other than cooling, it can also be applied to the case where heating medium is used as the heating medium, for example, heating of a heating device or the like is required.
- the heat exchanger has been described as a structure for directly exchanging heat with an electronic component, a member having good thermal conductivity (for example, an insulating material such as ceramic having good thermal conductivity) is interposed between the contact portions. It may be of a structure that makes contact with each other.
- the material of the heat exchange promoters 20, 21, 22, and 23 is not limited to metal, and may be made of a synthetic resin with high productivity and high thermal conductivity that is low in cost as a material.
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Abstract
Description
本発明の目的は、構造を簡素化し軽量化と低コスト化を図り、安全で確実性のある熱交換器とその製造方法を提供することにある。
本発明1の熱交換器は、
被熱交換体(3)との間で熱媒体(8)を介して熱交換するための熱交換器であって、
前記熱媒体(8)の内部圧力により撓み可能な薄肉金属板で構造され、前記被熱交換体と接することが可能な外面(4a)と樹脂が被覆された内面(4b)とを有し、周縁に設けられる縁部と、前記縁部と前記縁部との間に断面視凹字状に成形される凹部とからなる第1成形体(4)と、
前記第1成形体(4)に対向して組み合わせられる部材であって、前記熱媒体(8)の内部圧力により撓み可能な薄肉金属板で構造され、前記被熱交換体と接することが可能な外面(5a)と樹脂が被覆された内面(5b)とを有し、周縁に設けられる縁部と、前記縁部と前記縁部との間に断面視凹字状に成形される凹部とからなる第2成形体(5)と、
突き合わされた前記第1成形体(4)の前記縁部(4c)と前記第2成形体(5)の前記縁部(5c)とに跨がって設けられ、前記第1成形体の前記縁部の外面(4a)と前記第2成形体の前記縁部の外面(5a)とに熱可塑性樹脂組成物を射出成形して、前記第1成形体の前記縁部と前記第2成形体の前記縁部とを一体に接合するための接合部材(6)と、
前記接合部材により一体に接合された前記第1成形体と前記第2成形体とにより囲繞形成され、供給口(10)と排出口(11)を有し前記熱媒体(8)の流体通路となる空間部(7)とからなり、
前記第1成形体の前記縁部(4c)の前記内面(4b)と前記第2成形体の前記縁部(5c)の前記内面(5b)とは、被覆された前記樹脂同士を熱融着させることで密着させて前記空間部を密封状態にすることを特徴とする。
本発明3の熱交換器は、本発明1又は2において、前記被熱交換体は、自動車の電子制御回路基板に搭載された電子部品であり、前記熱媒体の主成分は冷却水であることを特徴とする。
本発明5の熱交換器は、本発明1又は2において、前記第1成形体(4)及び/又は前記第2成形体(5)には、前記熱媒体を蛇行させるために、前記凹部の形状の一部に、前記空間部(7)側に張り出す凸形状の張り出し部(14,15)が設けられていることを特徴とする。
本発明7の熱交換器は、本発明1又は2において、前記第1成形体及び/又は前記第2成形体には、前記凹部の形状の一部を凹凸にし前記電子部品の高さに合わせた段差が設けられていることを特徴とする。
本発明9の熱交換器は、本発明1又は2において、前記空間部に、前記第1成形体及び前記第2成形体に面接触し熱交換を促進させる熱交換促進体を内臓した構造になっていることを特徴とする。
被熱交換体(3)との間で熱媒体(8)を介して熱交換を行うための熱交換器の製造方法であって、
撓み可能で一方の面に樹脂の被覆が施された2つの薄肉金属板を、外面(4a,5a)を前記被熱交換体(3)に接する面とし、内面(4b,5b)を樹脂が被覆された樹脂被覆面とし、周縁に設けられる縁部と、前記縁部と前記縁部との間に断面視凹字状に成形される凹部とからなる第1成形体(4)及び第2成形体(5)にプレス成形する工程と、
前記第1成形体(4)の前記内面(4b)と前記第2成形体(5)の前記内面(5b)とが対向するように組み合わせて熱媒体(8)の流路となる空間部(7)を形成し、前記第1成形体の縁部(4c)の前記樹脂被覆面と前記第2成形体の縁部(5c)の前記樹脂被覆面とを熱プレス加工により熱融着させる工程と、
前記熱融着させた前記第1成形体(4)と前記第2成形体(5)を金型(12)にインサートし、前記縁部(4c,5c)部位に形成されたキャビティ(12d)に熱可塑性樹脂組成物を射出し、前記第1成形体と前記第2成形体とを一体に接合する接合部材(6)を成形する射出成形工程と、
前記接合部材で接合された前記第1成形体と前記第2成形体とに、前記空間部(7)に連通する供給口(10)と排出口(11)とを設ける工程とからなる。
本発明12の熱交換器の製造方法は、本発明10又は11において、前記プレス成形する工程は、前記第1成形体(4)及び/又は前記第2成形体(5)の前記凹部の形状の一部に、前記熱媒体を蛇行させるために、凸形状に張り出す張り出し部を成形する工程を含むものであることを特徴とする。
図3に基づいて他の実施の形態1の説明を行う。図3は、図1に対し第2成形体5の外面5aにも電子部品3を接触させ、熱交換器1の両側に位置する電子部品3を同時に冷却する構造の例である。このときの第1成形体4と第2成形体5とは全く同一の条件となる。1つの熱交換器1で効率よく2つの基板2に配置された複数の電子部品3を冷却できる構造の例である。熱交換器1の両側の第1成形体4、第2成形体5を、電子部品3に接触させ冷却することができる。
図4に基づいて他の実施の形態2の説明を行う。図4は、複数の熱交換器1を並べて複数の電子部品3を冷却する構造の例である。この場合は複数の基板2の間に熱交換器1を設置し、複数の基板2の両面に実装された電子部品3を冷却する構造の例である。図は2つの熱交換器1としているが、熱交換器1の個数に限定はなく、必要に応じ複数の基板2に対応し複数の熱交換器1を積層配置すればよい。この場合の熱媒体8の供給と排出は、図に示すように、供給口10、排出口11からの熱媒体を集合させる管路体13を設け、複数の熱交換器1に跨って供給と排出をこの管路体13で各々の供給口10、排出口11に分岐する形態にするとよい。
図5に基づいて他の実施の形態3の説明を行う。図5は、基板上に実装されている、複数の電子部品3の高さが設計上異なるものに対応する構造の例である。この場合は、前述した単一の凹部面を持ったものでは、この単一の凹部面の撓み変形のみでは追従できない。即ち、単一の平坦な形状の外面形状では、高さの異なる全ての電子部品3の全面、又はほぼ全面に密着させることはできない。この密着を可能にするため、第1成形体4の凹部の電子部品3と接触する部位である電子部品接触部の形状4aを、電子部品3の高さに合わせて凹凸状態にした段差面14とする。この構造例は、電子部品3が基板2にランダムに取り付けられている場合に有効である。
図6に基づいて他の実施の形態4の説明を行う。図6は、他の実施の形態3(図5参照)の構造に対し、第1成形体4の凹部の電子部品接触部の形状の一部を空間部7側にリブの形で張り出すようにした構造の例である。この凸形状の張り出し部15を設けることで、伝熱面積を増やし、電子部品の近傍の環境を冷却して、単位面積又は体積当たりの熱交換効率を向上させ、結果的に冷却効果を高めることができる。即ち、張り出し部15を設けた第1成形体4の外面4aの冷却面積が広くなると同時に、熱媒体8の流れがこの張り出し部15を乗り越える流れになるので、電子部品3に対しては効果的な冷却状態を維持できることになる。この張り出し部15の形成はプレス加工のみで行なう。従って、乱流発生等のために凸形状を形成するための部品は発生せず、空間部7にその関連の部品挿入の必要もない。
図8に基づいて他の実施の形態5の説明を行う。
図8は、他の実施の形態4(図6,7参照)に対し、凹部の電子部品接触部の一部を電子部品3の接触面を越えて電子部品3側に張り出すように張り出し部17を設けた構造例である。この例の場合は、電子部品3の側面も冷却することが可能な構造となり、冷却効果を一層高めることができる。図示はしていないが、第2成形体5にも同様な構造を施すことが可能なことはいうまでもない。
図9に基づいて他の実施の形態6の説明を行う。図9は、熱交換器1の平面図であるが、熱媒体8の流れを蛇行させるようにした構造例である。図6,7のように空間部7側に張り出し部15,16を設けた場合の変形例になるが、張り出し部15,16に交互に直線形状の部分を加え、熱媒体8の流れを強制的に左右方向に蛇行させながら、供給口10から排出口11に流す構造のものである。このように熱媒体8の流れの長さを長くすることにより、熱媒体8の冷却機能を有効に利用し、電子部品3とその周辺の熱交換を一層向上させることができる。ただし、この他の実施の形態6は、外面4a,5aの位置、設置範囲が限定され、電子部品3の配置に左右されるので、適用は限られる。
図10に基づいて他の実施の形態7の説明を行う。図10は、熱交換器1の接合部材に関わる他の構造例を示す部分断面図である。接合部材を構造的に補強する例である。即ち、図に示すように、樹脂組成物を射出する前に2つの成形体4,5の縁部4c,5cの複数ヶ所に貫通穴4e,5eを設けておく。このようにすることで、射出成形により射出された樹脂組成物が、この貫通穴4e,5eを通過し充填されるので、接合部材18は縁部4c,5cを間に挟んで一体的な結合状態で形成されることになる。これにより接合部材18が破壊等の物理的力が作用しない限り、振動等があっても接合部材18は剥がれ等の折損することなく、2つの成形体4,5の縁部4c,5cから離間、離脱することのない構造となる。
図11は、熱交換器1の空間部7に、挿入可能な形状にした熱交換促進体20を挿入した構造を示す図である。この熱交換促進体20は、ハニカム構造の構造体としている。熱媒体8は、このハニカム構造の空間を通して流れることになり、この流れの過程で電子部品3からの熱をこの熱交換促進体20を介して熱吸収し冷却させ、熱交換を促進させる。熱媒体8をハニカム構造の壁面に接触させることにより多くの熱を吸収して排出し、熱交換効率を高めるようにしたものである。同時に、熱交換促進体20は、熱交換効率を高めるために熱媒体8の流れの方向、流量等を制御するものである。
図12は、複数の通し孔21aを有する金属ブロック体の熱交換促進体21を空間部7に挿入した例である。この例であると、熱媒体8を通し孔21aに通過させることにより、この通過の過程で熱媒体8は熱を吸収し熱交換を促進させ、熱交換効率が高められる。通し孔21aの断面形状は、本例では四角形状のものとし、これを直線上に複数個配置したものである。この場合も熱媒体8が通過の際、通し孔21aの壁との接触面積が大きくなるので、熱吸収が大きくなり前述したものと同様に、熱交換は促進され冷却効率を高めることになる。又、熱交換器1本体との間において、壁部位に逃げ部である凹形状部22bを設けているので、熱交換促進体21を成形するとき、肉厚が一定に保たれているので、押出成形のときの変形が少ない。
図13は、図12の変形例を示す他の実施の形態である。金属ブロックで構造される熱交換促進体22の通し孔22aの配置を2段にした例である。前述の1段の場合に比し、通し孔22aの数が多くなりそれに伴い熱媒体8との接触面積が大きくなるので、一層熱交換が促進され、熱交換効率を高めることになる。熱交換促進体22の通し孔22aを2段以上の多層にすることは、押し出し成形法で成形するとき、金型の構造上の制約から製造上の制約がある。特に、形状の小さい熱交換器の場合は限界があり、通し孔22aの形状を変える等の設計上の配慮が必要となる。又、熱交換器1本体との間において、壁部位に逃げ部である凹形状部22bを設けた点は前述した例と同様である。
図14は、薄いアルミニウム合金板を波状に折り曲げ変形させ蛇腹形態にした熱交換促進体23の例を示す。この構造は、一枚の薄板を蛇腹に折り曲げただけの形状で簡素化された構造のものである。この折り曲げ形態は、熱伝導を良くするため折り曲げ部を成形体4,5の内面4b、5bに接触させ、熱交換器1に点又は面で接触させる構造としている。熱媒体8は、この波状板の間の空間を通過し熱交換を促進させる。
2…電子制御回路基板
3…電子部品(被熱交換体)
4…第1成形体
5…第2成形体
6…接合部材
7…空間部
8…熱媒体(冷却水)
Claims (13)
- 被熱交換体(3)との間で熱媒体(8)を介して熱交換するための熱交換器であって、
前記熱媒体(8)の内部圧力により撓み可能な薄肉金属板で構造され、前記被熱交換体と接することが可能な外面(4a)と樹脂が被覆された内面(4b)とを有し、周縁に設けられる縁部と、前記縁部と前記縁部との間に断面視凹字状に成形される凹部とからなる第1成形体(4)と、
前記第1成形体(4)に対向して組み合わせられる部材であって、前記熱媒体(8)の内部圧力により撓み可能な薄肉金属板で構造され、前記被熱交換体と接することが可能な外面(5a)と樹脂が被覆された内面(5b)とを有し、周縁に設けられる縁部と、前記縁部と前記縁部との間に断面視凹字状に成形される凹部とからなる第2成形体(5)と、
突き合わされた前記第1成形体(4)の前記縁部(4c)と前記第2成形体(5)の前記縁部(5c)とに跨がって設けられ、前記第1成形体の前記縁部の外面(4a)と前記第2成形体の前記縁部の外面(5a)とに熱可塑性樹脂組成物を射出成形して、前記第1成形体の前記縁部と前記第2成形体の前記縁部とを一体に接合するための接合部材(6)と、
前記接合部材により一体に接合された前記第1成形体と前記第2成形体とにより囲繞形成され、供給口(10)と排出口(11)を有し前記熱媒体(8)の流体通路となる空間部(7)とからなり、
前記第1成形体の前記縁部(4c)の前記内面(4b)と前記第2成形体の前記縁部(5c)の前記内面(5b)とは、被覆された前記樹脂同士を熱融着させることで密着させて前記空間部を密封状態にする
ことを特徴とする熱交換器。 - 請求項1に記載の熱交換器において、
前記薄肉金属板は、前記樹脂が被覆された所定の厚さのアルミニウム合金板である
ことを特徴とする熱交換器。 - 請求項1又は2に記載の熱交換器において、
前記被熱交換体(3)は、自動車の電子制御回路基板(2)に搭載された電子部品(3)であり、前記熱媒体(8)の主成分は冷却水である
ことを特徴とする熱交換器。 - 請求項1又は2に記載の熱交換器において、
前記射出成形により、前記熱可塑性樹脂組成物が固着されている前記第1成形体の前記外面(4a)、及び前記第2成形体の前記外面(5a)には、前記熱可塑性樹脂組成物の前記固着を強固にするために超微細加工処理が施こされており、
前記熱可塑性樹脂組成物は、ポリブチレンテレフタート樹脂、ポリフェニレンスルファイド樹脂、及びポリアミド樹脂から選択される1種を主成分とする熱可塑性樹脂組成物である
ことを特徴とする熱交換器。 - 請求項1又は2に記載の熱交換器において、
前記第1成形体(4)及び/又は前記第2成形体(5)には、前記熱媒体を蛇行させるために、前記凹部の形状の一部に、前記空間部(7)側に張り出す凸形状の張り出し部(14,15)が設けられている
ことを特徴とする熱交換器。 - 請求項1又は2に記載の熱交換器において、
前記第1成形体(4)及び/又は前記第2成形体(5)には、前記凹部の形状の一部に、前記電子部品(3)側に張り出す凸形状の張り出し部(16)が設けられている
ことを特徴とする熱交換器。 - 請求項1又は2に記載の熱交換器において、
前記第1成形体(4)及び/又は前記第2成形体(5)には、前記凹部の形状の一部を凹凸にし前記電子部品の高さに合わせた段差(14)が設けられている
ことを特徴とする熱交換器。 - 請求項1又は2に記載の熱交換器において、
前記撓み可能な薄肉金属板は、肉厚が0.1~0.8mmの厚さのアルミニウム合金の金属板であることを特徴とする熱交換器。 - 請求項1又は2に記載の熱交換器において、
前記空間部(7)に、前記第1成形体(4)及び前記第2成形体(5)に面接触し熱交換を促進させる熱交換促進体(20,21,22,23)を内臓した構造になっていることを特徴とする熱交換器。 - 被熱交換体(3)との間で熱媒体(8)を介して熱交換を行うための熱交換器の製造方法であって、
撓み可能で一方の面に樹脂の被覆が施された2つの薄肉金属板を、外面(4a,5a)を前記被熱交換体(3)に接する面とし、内面(4b,5b)を樹脂が被覆された樹脂被覆面とし、周縁に設けられる縁部と、前記縁部と前記縁部との間に断面視凹字状に成形される凹部とからなる第1成形体(4)及び第2成形体(5)にプレス成形する工程と、
前記第1成形体(4)の前記内面(4b)と前記第2成形体(5)の前記内面(5b)とが対向するように組み合わせて熱媒体(8)の流路となる空間部(7)を形成し、前記第1成形体の縁部(4c)の前記樹脂被覆面と前記第2成形体の縁部(5c)の前記樹脂被覆面とを熱プレス加工により熱融着させる工程と、
前記熱融着させた前記第1成形体(4)と前記第2成形体(5)を金型(12)にインサートし、前記縁部(4c,5c)部位に形成されたキャビティ(12d)に熱可塑性樹脂組成物を射出し、前記第1成形体と前記第2成形体とを一体に接合する接合部材(6)を成形する射出成形工程と、
前記接合部材で接合された前記第1成形体と前記第2成形体とに、前記空間部(7)に連通する供給口(10)と排出口(11)とを設ける工程と
からなる熱交換器の製造方法。 - 請求項10に記載の熱交換器の製造方法において、
前記薄肉金属板は、前記樹脂が被覆された所定の厚さのアルミニウム合金板であり、
前記熱可塑性樹脂組成物は、ポリブチレンテレフタート樹脂、ポリフェニレンスルファイド樹脂、及びポリアミド樹脂から選択される1種を主成分とする熱可塑性樹脂組成物であり、
前記射出成形の前に、前記第1成形体(4)の前記外面(4a)、及び前記第2成形体(5)の前記外面(5a)に、前記熱可塑性樹脂組成物の前記固着を強固にするために超微細加工処理を施す工程を有する
ことを特徴とする熱交換器の製造方法。 - 請求項10又は11に記載の熱交換器の製造方法において、
前記プレス成形する工程は、前記第1成形体(4)及び/又は前記第2成形体(5)の前記凹部の形状の一部に、前記熱媒体を蛇行させるために、凸形状に張り出す張り出し部を成形する工程を含むものである
ことを特徴とする熱交換器の製造方法。 - 請求項10又は11に記載の熱交換器の製造方法において、
前記プレス成形する工程は、前記第1成形体(4)及び/又は前記第2成形体(5)の前記凹部の形状の一部に、段差形状に成形する工程を含むものである
ことを特徴とする熱交換器の製造方法。
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Also Published As
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JPWO2014112600A1 (ja) | 2017-01-19 |
KR101772780B1 (ko) | 2017-09-12 |
EP2947412A4 (en) | 2017-05-24 |
US20150369545A1 (en) | 2015-12-24 |
JP6328567B2 (ja) | 2018-05-23 |
KR20150108892A (ko) | 2015-09-30 |
EP2947412A1 (en) | 2015-11-25 |
CN104969021A (zh) | 2015-10-07 |
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