WO2014103814A1 - Composition de résine et corps moulé par insertion sous forme tabulaire - Google Patents

Composition de résine et corps moulé par insertion sous forme tabulaire Download PDF

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Publication number
WO2014103814A1
WO2014103814A1 PCT/JP2013/083828 JP2013083828W WO2014103814A1 WO 2014103814 A1 WO2014103814 A1 WO 2014103814A1 JP 2013083828 W JP2013083828 W JP 2013083828W WO 2014103814 A1 WO2014103814 A1 WO 2014103814A1
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mass
parts
resin
epoxy group
resin composition
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PCT/JP2013/083828
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English (en)
Japanese (ja)
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史幸 大竹
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ポリプラスチックス株式会社
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Publication of WO2014103814A1 publication Critical patent/WO2014103814A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

Definitions

  • the present invention relates to a resin composition containing a polyarylene sulfide resin, and a plate-like insert molded body obtained by insert-molding the resin composition and a metal into a plate shape.
  • Polyarylene sulfide resin (hereinafter sometimes referred to as “PAS resin”) represented by polyphenylene sulfide resin (hereinafter sometimes referred to as “PPS resin”) has high heat resistance, mechanical properties, chemical resistance, Since it has dimensional stability and flame retardancy, it is widely used in electrical and electronic equipment component materials, automotive equipment component materials, chemical equipment component materials, and the like.
  • Such a PAS resin has excellent performance as described above, but since it has poor adhesion to an epoxy resin or a resin modified with an epoxy, various studies have been made to improve its adhesion.
  • the adhesiveness is improved by blending a bisphenol A type epoxy resin with a resin composition containing a PAS resin.
  • the object of the present invention is to provide a resin composition excellent in all of adhesiveness, high and low temperature impact resistance, low warpage when molded into a flat plate shape, and tensile strength, and a resin modified with an epoxy resin or an epoxy, etc.
  • An object of the present invention is to provide a flat plate-like molded article that is excellent in all of adhesion, high-temperature impact resistance, low warpage, and tensile strength.
  • the present invention for solving the above problems is as follows. (1) (A) 100 parts by mass of a polyarylene sulfide resin, (B) 1.5 to 6.5 parts by mass of a bisphenol A type epoxy resin, and (C) 3.6 to 18 parts by mass of an epoxy group-containing ethylene copolymer. Part (D) 20 to 100 parts by mass of the irregular cross-section glass fiber, and (E) 49 to 55 parts by mass of the glass flakes, and the epoxy group content in the (B) bisphenol A type epoxy resin is 0.
  • the epoxy group content in the (C) epoxy group-containing ethylene copolymer is 0.05 to 0.32 parts by mass
  • in the (B) bisphenol A type epoxy resin A total of the epoxy group content of (C) and the epoxy group content in the (C) epoxy group-containing ethylene copolymer is 0.20 to 0.55 parts by mass.
  • a plate-like insert-molded product obtained by insert-molding the resin composition according to any one of (1) to (3) above and a metal or inorganic solid into a plate-like shape.
  • a resin composition excellent in all of adhesiveness, high and low temperature impact resistance, low warpage when formed into a flat plate shape, and tensile strength and a resin modified with an epoxy resin or an epoxy, etc. It is possible to provide a plate-like insert-molded body that is excellent in all of adhesion, high-low temperature impact resistance, low warpage, and tensile strength.
  • the resin composition of the present invention comprises (A) 100 parts by weight of a polyarylene sulfide resin, (B) 1.5 to 6.5 parts by weight of a bisphenol A type epoxy resin, and (C) an epoxy group-containing ethylene copolymer 3 Epoxy group in the (B) bisphenol A type epoxy resin, comprising 6 to 18 parts by mass, (D) 20 to 100 parts by mass of irregular-shaped glass fiber, and (E) 49 to 55 parts by mass of glass flakes
  • the content is 0.01 to 0.29 parts by mass
  • the epoxy group content in the (C) epoxy group-containing ethylene copolymer is 0.05 to 0.32 parts by mass
  • the (B) bisphenol The total of the epoxy group content in the A-type epoxy resin and the epoxy group content in the (C) epoxy group-containing ethylene copolymer is 0.20 to 0.55 parts by mass.
  • each component will be sequentially described.
  • the PAS resin is a polymer compound mainly composed of — (Ar—S) — (wherein Ar is an arylene group) as a repeating unit, and a PAS resin having a molecular structure generally known in the present invention is used. can do.
  • arylene group examples include p-phenylene group, m-phenylene group, o-phenylene group, substituted phenylene group, p, p′-diphenylene sulfone group, p, p′-biphenylene group, p, p′-.
  • examples thereof include a diphenylene ether group, p, p′-diphenylenecarbonyl group, naphthalene group and the like.
  • the PAS resin may be a homopolymer consisting only of the above repeating units, or a copolymer containing the following different types of repeating units may be preferable from the viewpoint of processability and the like.
  • a polyphenylene sulfide resin (hereinafter also referred to as “PPS resin”) in which a p-phenylene group is used as an arylene group and a p-phenylene sulfide group is a repeating unit is preferably used.
  • PPS resin polyphenylene sulfide resin
  • the copolymer among the arylene sulfide groups comprising the above-mentioned arylene groups, two or more different combinations can be used, and among them, a combination containing a p-phenylene sulfide group and an m-phenylene sulfide group is particularly preferably used. It is done.
  • PAS resins those containing p-phenylene sulfide groups of 70 mol% or more, preferably 80 mol% or more are suitable from the viewpoint of physical properties such as heat resistance, moldability and mechanical properties.
  • PAS resins a high molecular weight polymer having a substantially linear structure obtained by condensation polymerization from a monomer mainly composed of a bifunctional halogen aromatic compound can be particularly preferably used.
  • the PAS resin used in the present invention may be a mixture of two or more different types of molecular weight PAS resins.
  • a partially branched or crosslinked structure is formed by using a small amount of a monomer such as a polyhaloaromatic compound having 3 or more halogen substituents when performing condensation polymerization.
  • a monomer such as a polyhaloaromatic compound having 3 or more halogen substituents
  • examples thereof include polymers obtained by heating a polymer having a low molecular weight and a linear structure polymer having a low molecular weight at a high temperature in the presence of oxygen or the like to increase the melt viscosity by oxidative crosslinking or thermal crosslinking, thereby improving molding processability.
  • the melt viscosity (310 ° C., shear rate 1216 sec ⁇ 1 ) of the PAS resin as the base resin used in the present invention is preferably 600 Pa ⁇ s or less, including the above mixed system, and is in the range of 8 to 300 Pa ⁇ s. Those having a good balance between mechanical properties and fluidity are preferred. Furthermore, those in the range of 20 to 300 Pa ⁇ s are particularly preferred because of their excellent resistance to high and low temperature impacts.
  • the bisphenol A type epoxy resin is blended in order to impart adhesiveness.
  • the bisphenol A type epoxy resin is not particularly limited as long as it is a bisphenol A type epoxy resin. Among them, a bisphenol A type epoxy resin obtained by reacting bisphenol A and epichlorohydrin is representative.
  • the blending amount of the bisphenol A type epoxy resin is 1.5 to 6.5 parts by mass with respect to 100 parts by mass of the PAS resin.
  • the blending amount is less than 1.5 parts by mass, the adhesiveness is inferior.
  • it exceeds 6.5 parts by mass the releasability at the time of molding tends to be deteriorated, so that it is not preferred from the viewpoint that it is difficult to obtain the desired molded product or the productivity is easily lowered.
  • the epoxy group content in the bisphenol A type epoxy resin is 0.01 to 0.29 parts by mass with respect to 100 parts by mass of the PAS resin. If the epoxy group content is less than 0.01 parts by mass, the adhesiveness tends to be lowered, and if it exceeds 0.29 parts by mass, the warpage and / or high / low temperature impact resistance tends to deteriorate. Moreover, since the mold release property at the time of molding tends to deteriorate, it is not preferable in that it is difficult to obtain a desired molded product or the productivity is likely to be lowered.
  • the epoxy group-containing ethylene copolymer is blended in order to impart high and low temperature impact resistance.
  • the epoxy group-containing ethylene copolymer include a copolymer composed of an ethylene unit and a glycidyl (meth) acrylate unit, and a copolymer composed of an ethylene unit, a glycidyl (meth) acrylate unit and a methyl (meth) acrylate unit.
  • a copolymer comprising an ethylene unit, a glycidyl (meth) acrylate unit and an ethyl (meth) acrylate unit
  • a copolymer comprising an ethylene unit, a glycidyl (meth) acrylate unit and a vinyl acetate unit.
  • an ethylene / glycidyl (meth) acrylate copolymer is preferable.
  • the expression “(meth) acrylate” means acrylate or methacrylate.
  • the expression “(meth) acrylic acid” means acrylic acid or methacrylic acid.
  • the blending amount of the epoxy group-containing ethylene copolymer is 3.6 to 18 parts by mass with respect to 100 parts by mass of the PAS resin.
  • the blending amount is less than 3.6 parts by mass, the high-low temperature impact resistance is inferior, and when it exceeds 18 parts by mass, the low warpage is inferior.
  • the epoxy group content in the epoxy group-containing ethylene copolymer is 0.05 to 0.32 parts by mass with respect to 100 parts by mass of the PAS resin.
  • the epoxy group content is less than 0.05 parts by mass, the high and low temperature impact resistance tends to deteriorate, and when it exceeds 0.32 parts by mass, the low warpage tends to deteriorate and the generated gas tends to increase. This is not preferable because the frequency of mold maintenance tends to increase.
  • the total of (B) epoxy group content in bisphenol A type epoxy resin and (C) epoxy group content in epoxy group-containing ethylene copolymer is 0.20 to 100 parts by mass of PAS resin. 0.55 parts by mass. If the total is less than 0.20 parts by mass, the adhesiveness and / or high / low temperature impact resistance tends to deteriorate. When the total exceeds 0.55 parts by mass, low warpage and / or mold release properties at the time of molding tend to deteriorate.
  • the modified cross-section glass fiber is blended to impart high and low temperature impact resistance and / or tensile strength.
  • the irregular cross-section glass fiber is a glass fiber whose cross-sectional shape is not a substantially perfect circle shape like a general glass fiber but an elliptical shape or an oval shape.
  • the ratio of the maximum diameter (d1) and the minimum diameter (d2) of the cross section of the modified cross-section glass fiber used in the present invention is preferably large (particularly ratio: d1 / d2), particularly preferably 3 or more and 5 or less. Deformation ratio: When d1 / d2 is larger, orientation is easier in the flow direction of the resin, and tensile strength is improved.
  • the resin flow direction and the fiber length direction are easily oriented so that the resin flow direction and the maximum diameter d1 direction are parallel to each other. It becomes easy to orientate, and resistance to high and low temperature impact is improved.
  • the blending amount of the irregular cross-section glass fiber is 20 to 100 parts by mass with respect to 100 parts by mass of the PAS resin.
  • the blending amount is less than 20 parts by mass, the high and low temperature impact resistance and / or tensile strength is inferior, and when it exceeds 100 parts by mass, the fluidity at the time of melting deteriorates.
  • glass flakes are blended for imparting low warpage.
  • the glass flakes may be generally blended into the resin composition, and those having an average particle size of 10 to 1000 ⁇ m are preferable.
  • the average particle diameter means a particle diameter having an integrated value of 50% in a particle size distribution measured by a laser diffraction / scattering method.
  • the compounding amount of the glass flakes is 49 to 55 parts by mass with respect to 100 parts by mass of the PAS resin. When the blending amount is less than 49 parts by mass, the low warpage property is inferior, and when it exceeds 55 parts by mass, the fluidity at the time of melting deteriorates.
  • the cut fiber refers to a glass fiber having a fiber length of 1 mm or less in an initial shape (a shape before melt kneading). Glass fibers having a fiber length of more than 1 mm are distinguished from cut fibers as glass fibers.
  • the fiber length of the cut fiber is preferably 300 ⁇ m or less, and more preferably 10 to 200 ⁇ m. When the fiber length is 300 ⁇ m or less, low warpage and strength are improved in a well-balanced manner.
  • the blend amount of the cut fiber is preferably 30 to 60 parts by mass with respect to 100 parts by mass of the PAS resin. When the blending amount is 30 to 60 parts by mass, it contributes to improvement of low warpage and strength.
  • talc In the resin composition of the present invention, it is preferable to further blend talc in order to further improve the adhesion with an epoxy resin or a resin modified with an epoxy.
  • the talc may be generally blended into the resin composition, and preferably has an average particle size of 1.0 to 20.0 ⁇ m.
  • the blending amount of talc is preferably 12 to 14 parts by mass with respect to 100 parts by mass of the PAS resin. When the blending amount is 12 to 14 parts by mass, it contributes to improvement of adhesion with an epoxy resin or a resin modified with epoxy.
  • other components than the above (A) to (G) may be blended within a range not impeding the effects of the present invention.
  • Other components include lubricants, carbon black, nucleating agents, flame retardants, flame retardant aids, antioxidants, metal deactivators, other anti-aging agents, and UV absorbers, stabilizers, plasticizers, pigments, dyes , Colorants, antistatic agents, foaming agents, other polymers such as resins, additives, and the like.
  • the lubricant it is preferable to use polyethylene wax, stearic acid wax, or the like.
  • the flat insert molded article of the present invention is formed by insert molding the above resin composition of the present invention and a metal into a flat plate shape. Since the insert molded body of the present invention uses the resin composition of the present invention which is excellent in adhesiveness, high and low temperature impact resistance, low warpage when molded into a flat plate shape, and tensile strength, the performance thereof is maintained as it is. It has.
  • the insert molded body of the present invention is a composite molded body in which a metal or the like is previously mounted on a molding die and the above-described compounded resin composition is filled on the outside thereof.
  • a molding method for filling the resin into the mold there are an injection method, an extrusion compression molding method, and the like, and an injection molding method is general.
  • the material to be inserted into the resin is used for the purpose of taking advantage of its characteristics and compensating for the defects of the resin, a material that does not change its shape or melt when it comes into contact with the resin during molding is used.
  • metals such as aluminum, magnesium, copper, iron, brass and their alloys, and inorganic solids such as glass and ceramics, which are pre-formed into flat shapes, bars, pins, screws, etc. Is done.
  • the shape of the flat insert molded body of the present invention is not particularly limited as long as it is flat, and may be a circle, a polygon, a planar donut shape, a flat rectangular parallelepiped, a flat cube, or the like. Moreover, one part may protrude in the normal line direction of the said flat insert molded object.
  • the flat insert molded body of the present invention is preferably applied to electrical and electronic parts and chassis.
  • PPS resin 1 manufactured by Kureha Co., Ltd., Fortron KPS W202A (melt viscosity: 20 Pa ⁇ s (shear rate: 1216 sec ⁇ 1 , 310 ° C.))
  • PPS resin 2 manufactured by Kureha Co., Ltd., Fortron KPS W214A (melt viscosity: 130 Pa ⁇ s (shear rate: 1216 sec ⁇ 1 , 310 ° C.))
  • the mass part number of (A) component is corresponded to the total amount of only the PPS resin component of said (a) and (b).
  • melt viscosity of PPS resin Using a Capillograph manufactured by Toyo Seiki Co., Ltd., a melt viscosity at a barrel temperature of 310 ° C. and a shear rate of 1216 sec ⁇ 1 was measured using a 1 mm ⁇ ⁇ 20 mmL / flat die as a capillary.
  • the height from the horizontal plane was the same as the average height, and a plane parallel to the horizontal plane was used as a reference plane.
  • the maximum height and the minimum height from the reference plane were selected from the heights measured at the nine locations, and the difference between them was calculated.
  • the above difference was calculated, and the obtained five values were averaged to obtain a flatness value.
  • the flatness was measured even after annealing the flat resin molded product at 240 ° C. for 80 minutes. The results are shown in Tables 1 to 3. If it is less than 0.3 mm, it can be said that the low warpage is good. (Molding condition) Cylinder temperature: 320 ° C Mold temperature: 150 ° C Holding pressure: 50 MPa
  • the obtained mixture is applied to the above flat resin molded product so that the coating thickness is about 15 ⁇ m, and the flat resin molded product after application is put into an oven at 45 ° C. for 45 minutes and then at 230 ° C. For 30 minutes. After taking out from the oven, humidity control was performed for 24 hours in an air-conditioned room adjusted to 23 ° C. and 50% RH. Next, the adhesion was evaluated by a so-called cross cut test.
  • the cross cut test is performed by measuring 100 squares of 1.0 mm square with a cutter, attaching permacel tape (P-221) and attaching it, then peeling off the permacel tape and evaluating by the number of squares that were not peeled off. did. The evaluation results are shown in Tables 1 to 3. Adhesiveness can be said to be good when the squares that have not been peeled off exceed 95.

Abstract

L'invention concerne une composition de résine supérieure en termes d'adhésivité, de résistance aux chocs à haute et basse température, de faible gauchissement lorsqu'elle est moulée, par exemple, sous forme tabulaire, et de résistance à la traction. La composition de résine comprend (A) 100 parties en masse de résine de poly(sulfure d'arylène), (b) 1,5 à 6,5 parties en masse de résine époxy de type bisphénol A, (C) 3,6 à 18 parties en masse de copolymère d'éthylène contenant des groupes époxy, (D) 20 à 100 parties en masse de fibres de verre présentant une section transversale amorphe et (E) 49 à 55 parties en masse de paillettes de verre. La teneur en groupes époxy du constituant (B) est de 0,01 à 0,29 partie en masse, la teneur en groupes époxy du constituant (C) est de 0,05 à 0,32 partie en masse et le total de la teneur en groupes époxy dans le constituant (B) et de la teneur en groupes époxy dans le constituant (C) est de 0,20 à 0,55 partie en masse.
PCT/JP2013/083828 2012-12-27 2013-12-18 Composition de résine et corps moulé par insertion sous forme tabulaire WO2014103814A1 (fr)

Applications Claiming Priority (2)

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JP2012284235 2012-12-27
JP2012-284235 2012-12-27

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018079704A1 (fr) * 2016-10-31 2018-05-03 ポリプラスチックス株式会社 Composition de résine à base de poly(arylène sulfure) et article moulé sur prisonnier
WO2018198850A1 (fr) * 2017-04-27 2018-11-01 ポリプラスチックス株式会社 Composition de résine de poly(sulfure d'arylène) et article moulé par insertion
CN110050034A (zh) * 2016-12-09 2019-07-23 宝理塑料株式会社 聚芳硫醚系树脂组合物和嵌件成型品
JP2019183156A (ja) * 2018-04-12 2019-10-24 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物及びインサート成形品
WO2019208377A1 (fr) * 2018-04-25 2019-10-31 Dic株式会社 Composition de résine de poly(sulfure d'arylène), article moulé, article moulé composite et procédé de production associé
WO2020196273A1 (fr) * 2019-03-27 2020-10-01 東レ株式会社 Composition de résine de poly(sulfure de phénylène) et article moulé
CN112041395A (zh) * 2018-04-27 2020-12-04 宝理塑料株式会社 聚芳硫醚系树脂组合物和嵌入成型品
TWI726894B (zh) * 2015-07-16 2021-05-11 日商寶理塑料股份有限公司 提高比較追蹤指數的方法以及環氧化合物及乙烯丙烯酸乙酯共聚物的用途
US11118053B2 (en) 2018-03-09 2021-09-14 Ticona Llc Polyaryletherketone/polyarylene sulfide composition
JP2022521549A (ja) * 2019-02-27 2022-04-08 ソルベイ スペシャルティ ポリマーズ ユーエスエー， エルエルシー 高い誘電性能を有するポリ（アリーレンスルフィド）組成物

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Cited By (18)

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Publication number Priority date Publication date Assignee Title
TWI726894B (zh) * 2015-07-16 2021-05-11 日商寶理塑料股份有限公司 提高比較追蹤指數的方法以及環氧化合物及乙烯丙烯酸乙酯共聚物的用途
CN109890898B (zh) * 2016-10-31 2022-01-25 宝理塑料株式会社 聚芳硫醚系树脂组合物和嵌入成型品
CN109890898A (zh) * 2016-10-31 2019-06-14 宝理塑料株式会社 聚芳硫醚系树脂组合物和嵌入成型品
WO2018079704A1 (fr) * 2016-10-31 2018-05-03 ポリプラスチックス株式会社 Composition de résine à base de poly(arylène sulfure) et article moulé sur prisonnier
CN110050034A (zh) * 2016-12-09 2019-07-23 宝理塑料株式会社 聚芳硫醚系树脂组合物和嵌件成型品
CN110050034B (zh) * 2016-12-09 2022-04-15 宝理塑料株式会社 聚芳硫醚系树脂组合物和嵌件成型品
WO2018198850A1 (fr) * 2017-04-27 2018-11-01 ポリプラスチックス株式会社 Composition de résine de poly(sulfure d'arylène) et article moulé par insertion
US11118053B2 (en) 2018-03-09 2021-09-14 Ticona Llc Polyaryletherketone/polyarylene sulfide composition
JP2019183156A (ja) * 2018-04-12 2019-10-24 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物及びインサート成形品
JP7356252B2 (ja) 2018-04-12 2023-10-04 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物及びインサート成形品
WO2019208377A1 (fr) * 2018-04-25 2019-10-31 Dic株式会社 Composition de résine de poly(sulfure d'arylène), article moulé, article moulé composite et procédé de production associé
JPWO2019208377A1 (ja) * 2018-04-25 2020-09-03 Dic株式会社 ポリアリーレンスルフィド樹脂組成物、成形品、複合成形品及びそれらの製造方法
CN112041395A (zh) * 2018-04-27 2020-12-04 宝理塑料株式会社 聚芳硫醚系树脂组合物和嵌入成型品
CN112041395B (zh) * 2018-04-27 2021-11-26 宝理塑料株式会社 聚芳硫醚系树脂组合物和嵌入成型品
US11091635B1 (en) 2018-04-27 2021-08-17 Polyplastics Co., Ltd. Polyarylene sulfide-based resin composition and insert-molded product
JP2022521549A (ja) * 2019-02-27 2022-04-08 ソルベイ スペシャルティ ポリマーズ ユーエスエー， エルエルシー 高い誘電性能を有するポリ（アリーレンスルフィド）組成物
CN113557266A (zh) * 2019-03-27 2021-10-26 东丽株式会社 聚苯硫醚树脂组合物及成型品
WO2020196273A1 (fr) * 2019-03-27 2020-10-01 東レ株式会社 Composition de résine de poly(sulfure de phénylène) et article moulé

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