WO2014097862A1 - Générateur acoustique, dispositif de génération acoustique et dispositif électronique - Google Patents

Générateur acoustique, dispositif de génération acoustique et dispositif électronique Download PDF

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Publication number
WO2014097862A1
WO2014097862A1 PCT/JP2013/082222 JP2013082222W WO2014097862A1 WO 2014097862 A1 WO2014097862 A1 WO 2014097862A1 JP 2013082222 W JP2013082222 W JP 2013082222W WO 2014097862 A1 WO2014097862 A1 WO 2014097862A1
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WIPO (PCT)
Prior art keywords
exciter
generator according
sound generator
sound
circuit board
Prior art date
Application number
PCT/JP2013/082222
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English (en)
Japanese (ja)
Inventor
健 岡村
神谷　哲
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京セラ株式会社
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Publication of WO2014097862A1 publication Critical patent/WO2014097862A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/045—Plane diaphragms using the distributed mode principle, i.e. whereby the acoustic radiation is emanated from uniformly distributed free bending wave vibration induced in a stiff panel and not from pistonic motion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/10—Resonant transducers, i.e. adapted to produce maximum output at a predetermined frequency
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure

Definitions

  • the disclosed embodiment relates to a sound generator, a sound generation device, and an electronic apparatus.
  • an acoustic generator using a piezoelectric element is known (see, for example, Patent Document 1).
  • Such an acoustic generator is configured to vibrate a diaphragm by applying a voltage to a piezoelectric element attached to the diaphragm to vibrate, and to output sound by actively utilizing resonance of the vibration.
  • such a sound generator can use a thin film such as a resin film for the diaphragm, it can be configured to be thinner and lighter than a general electromagnetic speaker.
  • the thin film when using a thin film for a diaphragm, the thin film is supported in a state in which a uniform tension is applied, for example, by being sandwiched from a thickness direction by a pair of frame members so as to obtain excellent acoustic conversion efficiency. Is required.
  • the conventional acoustic generator described above actively uses the resonance of the diaphragm that is uniformly tensioned, and therefore, in the frequency characteristics of the sound pressure, the peak (the portion where the sound pressure is higher than the surroundings) and the dip There is a problem that high quality sound quality is difficult to obtain due to the fact that the sound pressure is lower than the surrounding area.
  • the sound generator and the electronic device provided with the sound generator have a problem that it is difficult to obtain good sound quality.
  • One aspect of the embodiments has been made in view of the above, and an object thereof is to provide an acoustic generator, an acoustic generator, and an electronic apparatus that can obtain a favorable frequency characteristic of sound pressure.
  • An acoustic generator includes an exciter that receives an electric signal to vibrate, the vibration exciter attached to the exciter, and the vibration plate that vibrates with the exciter due to vibration of the exciter, And a printed circuit board that is connected to the exciter and inputs an electrical signal to the exciter.
  • a sound generation device includes the sound generator described above and a housing that houses the sound generator.
  • An electronic apparatus includes the above-described acoustic generator, an electronic circuit connected to the acoustic generator, and a housing that houses the electronic circuit and the acoustic generator. It has a function of generating sound from the sound generator.
  • an acoustic generator it is possible to realize an acoustic generator, an acoustic generator, and an electronic device that can obtain good sound pressure frequency characteristics.
  • FIG. 1A is a schematic plan view showing a schematic configuration of a basic sound generator.
  • FIG. 1B is an example of a cross-sectional view taken along line A-A ′ of FIG. 1A.
  • FIG. 1C is another example of a cross-sectional view taken along line A-A ′ of FIG. 1A.
  • FIG. 2 is a diagram illustrating an example of frequency characteristics of sound pressure.
  • FIG. 3A is a schematic plan view illustrating an example of the configuration of the sound generator according to the embodiment. 3B is an enlarged cross-sectional view taken along line B-B ′ of FIG. 3A.
  • FIG. 4A is a schematic plan view showing one of the modified examples of the flexible substrate.
  • FIG. 4B is a schematic plan view showing one of the modified examples of the flexible substrate.
  • FIG. 5A is a schematic plan view showing one of the modified examples of the flexible substrate.
  • FIG. 5B is a schematic plan view showing one of the modifications of the flexible substrate.
  • FIG. 5C is an enlarged cross-sectional view taken along line C-C ′ of FIG. 5B.
  • FIG. 6A is a diagram illustrating a configuration of the sound generation device according to the embodiment.
  • FIG. 6B is a diagram illustrating a configuration of the electronic device according to the embodiment.
  • FIGS. 1A to 1C a schematic configuration of a basic sound generator 1 'will be described with reference to FIGS. 1A to 1C.
  • 1A is a schematic plan view showing a schematic configuration of the acoustic generator 1 ′
  • FIG. 1B is an example of a cross-sectional view taken along the line AA ′ of FIG. 1A
  • FIG. 1C is an A— line of FIG. 1A. It is another example of A 'line sectional drawing.
  • FIGS. 1A to 1C show a three-dimensional orthogonal coordinate system including a Z-axis having a vertically upward direction as a positive direction and a vertically downward direction as a negative direction.
  • Such an orthogonal coordinate system may also be shown in other drawings used in the following description.
  • FIG. 1A the resin layer 7 (described later) is not shown.
  • FIG. 1B and FIG. 1C show the sound generator 1 ′ greatly exaggerated in the thickness direction (Z-axis direction).
  • the sound generator 1 ' includes a frame 2, a diaphragm 3, a piezoelectric element 5, and lead wires 6a' and 6b '.
  • the case where there is one piezoelectric element 5 is illustrated, but the number of piezoelectric elements 5 is not limited.
  • the frame 2 functions as a support that supports the diaphragm 3 at the peripheral edge of the diaphragm 3.
  • the diaphragm 3 has a plate-like shape or a film-like shape, and its peripheral portion is fixed to the frame body 2 and is supported substantially flat in a state where tension is uniformly applied within the frame of the frame body 2.
  • the frame body 2 is configured by two frame members having a rectangular frame shape and the same shape, and supports the diaphragm 3 by sandwiching the peripheral edge portion of the diaphragm 3. Functions as a body.
  • the diaphragm 3 has a plate-like or film-like shape, and its peripheral portion is sandwiched and fixed by the frame 2 and is substantially flat in a state where tension is uniformly applied within the frame of the frame 2. Supported by
  • the vibrating body 3 a is a portion that has a substantially rectangular shape within the frame of the frame body 2.
  • the diaphragm 3 can be formed using various materials such as resin and metal.
  • the diaphragm 3 can be made of a resin film such as polyethylene or polyimide having a thickness of 10 to 200 ⁇ m.
  • the thickness and material of the frame member constituting the frame body 2 are not particularly limited, and can be formed using various materials such as metal and resin.
  • a stainless steel member having a thickness of 100 to 5000 ⁇ m can be suitably used as the frame member constituting the frame body 2 because of its excellent mechanical strength and corrosion resistance.
  • FIG. 1A shows the frame 2 in which the shape of the inner region is substantially rectangular, but it may be a polygon such as a parallelogram, trapezoid, or regular n-gon. In the present embodiment, as shown in FIG.
  • the piezoelectric element 5 is an exciter that is provided on the surface of the diaphragm 3 (vibrating body 3a) or the like, and that excites the vibrating body 3a by oscillating upon application of a voltage.
  • the piezoelectric element 5 includes, for example, a laminate in which piezoelectric layers 5a, 5b, 5c, and 5d made of ceramics and three internal electrode layers 5e are alternately laminated. Body, surface electrodes 5f and 5g formed on the top and bottom surfaces of the laminate, and external electrodes 5h and 5j formed on the side surface where the internal electrode layer 5e is exposed. Also, lead wires 6a 'and 6b' are connected to the external electrodes 5h and 5j. The lead wires 6a 'and 6b' are conducting wires for inputting an electric signal from the outside.
  • the piezoelectric element 5 has a plate shape, and the main surface on the upper surface side and the lower surface side has a polygonal shape such as a rectangular shape or a square shape.
  • the piezoelectric layers 5a, 5b, 5c, and 5d are polarized as shown by arrows in FIG. 1B or 1C. In other words, polarization is performed such that the direction of polarization with respect to the direction of the electric field applied at a certain moment is reversed between one side and the other side in the thickness direction (Z-axis direction in the figure).
  • the piezoelectric elements 5 When a voltage is applied to the piezoelectric element 5 via the lead wires 6a ′ and 6b ′, for example, at a certain moment, the piezoelectric layers 5c and 5d on the side bonded to the vibrating body 3a contract, and the piezoelectric element 5 The piezoelectric layers 5a and 5b on the upper surface side of the substrate are deformed so as to extend. Therefore, by applying an AC signal to the piezoelectric element 5, the piezoelectric element 5 can bend and vibrate, and the vibrating plate 3 (the vibrating body 3a) can be bent.
  • the main surface of the piezoelectric element 5 is bonded to the main surface of the diaphragm 3 (vibrating body 3a) with an adhesive such as an epoxy resin.
  • the materials constituting the piezoelectric layers 5a, 5b, 5c and 5d have conventionally been lead-free piezoelectric materials such as lead zirconate titanate, Bi layered compounds and tungsten bronze structure compounds.
  • the used piezoelectric ceramics can be used.
  • various metal materials can be used as the material of the internal electrode layer 5e.
  • the piezoelectric layers 5a, 5b, 5c, and 5d are contained, the piezoelectric layers 5a, 5b, 5c, and 5d and the internal electrode layer 5e Since the stress due to the difference in thermal expansion can be reduced, the piezoelectric element 5 free from stacking faults can be obtained.
  • the sound generator 1 ′ is arranged so as to cover the surfaces of the piezoelectric element 5 and the vibrating body 3a in the frame of the frame 2, and the vibrating body 3a and the piezoelectric element 5 are disposed. And a resin layer 7 integrated with each other.
  • the resin layer 7 is preferably formed using, for example, an acrylic resin so that the Young's modulus is about 1 MPa to 1 GPa.
  • the moderate damper effect can be induced by embedding the piezoelectric element 5 in the resin layer 7, the resonance phenomenon can be suppressed, and the peak or dip in the frequency characteristic of the sound pressure can be suppressed to be small.
  • 1B or 1C shows a state in which the resin layer 7 is formed so as to have the same height as the frame 2, but it is sufficient that the piezoelectric element 5 is embedded, for example, the resin layer 7 may be formed to be higher than the height of the frame 2.
  • the vibrating body 3a, the piezoelectric element 5 and the resin layer 7 are integrated to form a so-called composite vibrating body that vibrates integrally.
  • the bimorph multilayer piezoelectric element is taken as an example of the piezoelectric element 5.
  • the piezoelectric element 5 is not limited to this.
  • the expanding and contracting piezoelectric element 5 is attached to the vibrating body 3a. It may be a unimorph type.
  • the diaphragm 3 (vibrating body 3a) is supported in a state where tension is uniformly applied in the frame of the frame body 2.
  • the sound pressure changes rapidly at a specific frequency, and it is difficult to flatten the frequency characteristic of the sound pressure.
  • FIG. 2 is a diagram illustrating an example of frequency characteristics of sound pressure.
  • the vibrating body 3 a is supported substantially flat in a state where tension is uniformly applied within the frame of the frame body 2.
  • the height of the peak P is lowered (see the arrow 201 in the figure), the peak width is widened (see the arrow 202 in the figure), and the peak P or dip (not shown) is reduced. It is effective to take measures to make it smaller.
  • the lead wires 6a 'and 6b' are conducting wires for inputting an electric signal from the outside.
  • the lead wires 6a are also induced by resonance of the vibrating body 3a. “6b” itself is also vibrating.
  • the lead wires 6a 'and 6b' are made of general linear metal wires or vinyl wires, the lead wires 6a 'and 6b' are vibrated because they are thin and have low rigidity. It does not affect the vibration of the vibrating body 3a so much.
  • a printed board such as a flexible board is used as the lead wires 6a 'and 6b'. Since the printed circuit board is more rigid than the lead wires 6a ′ and 6b ′ described above and has a structure in which a plurality of wirings are provided on one resin sheet, vibration transmitted to each wiring is generated in one resin sheet. The vibration can be disturbed in the printed circuit board by being mixed, and the damper effect can be generated by the resin forming the printed circuit board to suppress the resonance. While reducing the height of the peak P, the peak width can be increased.
  • FIG. 3A is a schematic plan view illustrating an example of the configuration of the sound generator 1 according to the embodiment.
  • FIG. 3B is an enlarged cross-sectional view taken along line B-B ′ of FIG. 3A.
  • the printed board is a flexible printed board generally called FPC (Flexible Printed Circuits), and is abbreviated as “flexible board”.
  • FPC Flexible Printed Circuits
  • the resin layer 7 may be omitted as in FIG. 1A for convenience of explanation.
  • the sound generator 1 includes a flexible substrate 6 instead of the lead wires 6a 'and 6b' shown in FIGS. 1A to 1C.
  • the flexible substrate 6 includes an insulator 6a, a wiring conductor 6b, and a via conductor 6c.
  • the insulator 6a is a base of the flexible substrate 6 and is formed using a resin such as polyimide.
  • a resin such as polyimide.
  • the diaphragm 3 (vibrating body 3a) and the insulating body 6a are made of the same material, such as the insulator 6a also using polyimide. It is more suitable when formed using.
  • the flexible substrate 6 is preferably provided in a state where tension is not applied.
  • the wiring conductor 6b is a conductor made of a metal foil such as copper or aluminum formed in an adhesive layer formed on the insulator 6a.
  • the flexible substrate 6 has a multilayer structure
  • the insulator 6a includes a first insulator layer 6aa, a second insulator layer 6ab, and a third insulator layer. 6ac.
  • the wiring conductor 6b includes a first wiring conductor layer 6ba and a second wiring conductor layer 6bb.
  • the first wiring conductor layer 6ba is formed between the first insulator layer 6aa and the second insulator layer 6ab.
  • the second wiring conductor layer 6bb is formed between the second insulator layer 6ab and the third insulator layer 6ac.
  • the via conductor 6c is provided as a through-hole penetrating the flexible substrate 6, and connects the first wiring conductor layer 6ba and the second wiring conductor layer 6bb by electrical connection.
  • the via conductor 6c may be provided as a non-through hole.
  • the third insulator layer 6ac exposes the second wiring conductor layer 6bb at one end portion of the flexible substrate 6.
  • the exposed second wiring conductor layer 6bb is joined to the external electrodes 5h and 5j (see FIG. 1B or 1C) of the piezoelectric element 5.
  • terminal portion 6d a portion where the wiring conductor 6b included in the flexible substrate 6 is exposed and a portion joined to the piezoelectric element 5 is referred to as a “terminal portion 6d”.
  • the terminal portion 6d is joined to the piezoelectric element 5 using, for example, an anisotropic conductive resin obtained by mixing fine metal particles having conductivity with a thermosetting resin. Moreover, you may join using solder. Moreover, you may join using the conductive adhesive which consists of silver paste etc.
  • the terminal portion 6d is joined to the piezoelectric element 5 in a state of being covered with the insulator 6a in a plan view.
  • the terminal portion 6d is not only the external electrodes 5h and 5j of the piezoelectric element 5 but also the external electrode 5h such as the piezoelectric layer 5a (see FIG. 1B or FIG. 1C) through the bonding material such as the anisotropic conductive resin described above. 5j is joined in contact with the portions other than 5j.
  • the degeneration of the resonance mode can be solved and dispersed, the height of the peak P can be lowered, and the peak width can be widened. Therefore, it is possible to flatten the frequency characteristic of sound pressure and obtain a good frequency characteristic of sound pressure.
  • the vibration of the piezoelectric element 5 is also partially affected by the damper effect in the vicinity of the bonding region of the flexible substrate 6, so that there is a difference in sound pressure around the piezoelectric element 5 near and far from the flexible substrate 6. .
  • the resonance condition of the vibrating body 3a can be disturbed, and the resonance frequency can be partially unbalanced.
  • the frequency characteristic of sound pressure can be flattened, and a good frequency characteristic of sound pressure can be obtained.
  • the height of the piezoelectric element 5 can be reduced.
  • the acoustic generator 1 can be reduced in size.
  • the terminal portion 6d is joined to the piezoelectric element 5 in a state of being covered with the insulator 6a in a plan view.
  • the resonance condition of the vibrating body 3a can be disturbed, and the resonance frequency can be partially unbalanced.
  • the frequency characteristic of sound pressure can be flattened, and a good frequency characteristic of sound pressure can be obtained.
  • a part of the flexible substrate 6 such as the insulator 6a is formed using the same material as that of the diaphragm 3, and the Young's modulus is the same by being provided in a state where no tension is applied.
  • the resonance frequency can be different.
  • the damper effect can be generated by not resonating the flexible substrate 6 with respect to the resonance frequency of the vibrating body 3a, the resonance peak P can be suppressed and the frequency characteristics of the sound pressure can be flattened. That is, it is possible to obtain a favorable frequency characteristic of sound pressure.
  • the vibration wave propagating from the vibrating body 3a can be reflected by the metal particles contained in the anisotropic conductive resin. Moreover, a damper effect can be given to the resin portion of the anisotropic conductive resin.
  • the vibration wave can be disturbed, the reflected wave reflected from the piezoelectric element 5 toward the vibrating body 3a can also be disturbed, and the resonance frequency can be partially unbalanced. Therefore, it is possible to vary the sound pressure peak P at the resonance point and flatten the frequency characteristic of the sound pressure. That is, it is possible to obtain a favorable frequency characteristic of sound pressure.
  • the vibration wave propagating from the vibrating body 3a can be irregularly reflected by the solder.
  • the reflected wave reflected toward the vibrating body 3a from the piezoelectric element 5 can be disturbed, it is possible to make the resonance frequencies not partially uniform.
  • the sound pressure peak P at the resonance point can be varied to flatten the frequency characteristic of the sound pressure. That is, it is possible to obtain a favorable frequency characteristic of sound pressure.
  • the region where the metal particles are connected and the region where the resin is dispersed can be mixed between the piezoelectric element 5 and the flexible substrate 6.
  • the vibration wave propagating from the vibrating body 3a can be reflected or propagated in the region where the metal particles are connected, and the damper wave can be obtained in the region where the resin is dispersed, thereby vigorously disturbing the vibration wave.
  • the reflected wave reflected from the piezoelectric element 5 toward the vibrating body 3a can also be disturbed, and the resonance frequency can be partially unbalanced. Therefore, it is possible to vary the sound pressure peak P at the resonance point and flatten the frequency characteristic of the sound pressure. That is, it is possible to obtain a favorable frequency characteristic of sound pressure.
  • the wiring conductor 6b has a multilayer structure and is included in the flexible substrate 6, whereby the resonance condition of the vibrating body 3a can be disturbed. Specifically, when vibration propagates from the vibrating body 3a to the flexible substrate 6, the first wiring conductor layer 6ba and the second wiring conductor layer 6bb are individually vibrated to disturb the resonance condition of the vibrating body 3a. It will be.
  • the resonance frequencies can be partially unbalanced, so that the sound pressure peak P at the resonance point can be varied and the frequency characteristics of the sound pressure can be flattened. That is, it is possible to obtain a favorable frequency characteristic of sound pressure.
  • the wiring conductor 6b is interlayer-connected by the via conductor 6c, so that the via conductor 6c can be referred to as a “node”, and resonance induced in the dimension of the wiring conductor 6b can be generated. .
  • the resonance condition of the vibrating body 3a can be disturbed by this, the resonance frequency can be partially unbalanced. Therefore, it is possible to flatten the frequency characteristic of sound pressure and obtain a good frequency characteristic of sound pressure.
  • the terminal portion 6d includes the surface electrode 5f electrically connected to the external electrode 5h, the surface electrode 5f electrically connected to the external electrode 5j, and a portion excluding the surface electrode 5f (that is, the surface electrode 5f).
  • the piezoelectric substrate 5 is bonded to the piezoelectric element 5 while being in contact with both of the piezoelectric body 5 and the piezoelectric body 5 so that the vibration of the flexible substrate 6 caused by the deformation of the piezoelectric body is propagated as noise to the vibrating body 3a. Can do.
  • “contacting” is not limited to direct contact, and may be in contact via a bonding material.
  • the resonance frequencies can be partially unbalanced, so that the sound pressure peak P at the resonance point can be varied and the frequency characteristics of the sound pressure can be flattened. That is, it is possible to obtain a favorable frequency characteristic of sound pressure.
  • the flexible substrate 6 is bonded not to the longitudinal center of the piezoelectric element 5 but to the end thereof, when the piezoelectric element 5 vibrates, an effect of constraining the position with the largest displacement occurs.
  • the amount of displacement at both ends in the longitudinal direction can be made different, the resonance of the surrounding diaphragm 3 can be suppressed, and the peak dip can be suppressed.
  • FIGS. 4A to 5C are schematic plan views showing one of modifications of the flexible substrate 6 in order.
  • FIG. 5C is an enlarged sectional view taken along line C-C ′ of FIG. 5B.
  • the terminal portion 6d of the flexible substrate 6 is formed into a tip-break shape in which the tip portion is divided along the extending direction of the wiring conductor 6b, and then the tip-break shape is divided. It is good also as joining to the piezoelectric element 5 for every part s1 and s2.
  • the vibration wave propagating around the flexible substrate 6 can be reduced.
  • the resonance frequencies can be partially unbalanced, so that the sound pressure peak P at the resonance point can be varied and the frequency characteristics of the sound pressure can be flattened. That is, it is possible to obtain a favorable frequency characteristic of sound pressure.
  • the insulator 6a of the flexible substrate 6 is formed to have a wide width so as to cover not only the region along the wiring conductor 6b but also the entire piezoelectric element 5 in plan view. Also good.
  • the damper effect can be given to the entire piezoelectric element 5, but also the sound pressure can be more effectively differentiated near and far from the wiring conductor 6b, so that the resonance condition of the vibrating body 3a is disturbed. Can be made.
  • the resonance frequencies can be partially unbalanced, the frequency characteristics of sound pressure can be flattened, and good frequency characteristics of sound pressure can be obtained.
  • the flexible substrate 6 may be provided with a terminal plate 6e provided with an external terminal 6f at the other end serving as a connection point with the outside.
  • the terminal board 6e can disturb the vibration wave around the terminal board 6e by picking up the vibration around the sound generator 1.
  • the resonance frequency can be partially unbalanced, the frequency characteristic of the sound pressure can be flattened and a good frequency characteristic of the sound pressure can be obtained.
  • the strength of the flexible substrate 6 can be increased by being connected to the terminal board 6e, it is possible to prevent disconnection due to bending and improve durability. Further, by providing the terminal board 6e, it is possible to obtain convenience at the time of wiring that it is easy to connect from the outside.
  • the terminal plate 6 e may be fixed to the frame body 2.
  • the vibration wave can be disturbed around the terminal plate 6e when the frame 2 is vibrated by being induced by the vibration of the vibration plate 3 (vibrating body 3a).
  • the resonance frequencies can be partially unbalanced, so that the sound pressure peak P at the resonance point can be varied and the frequency characteristics of the sound pressure can be flattened. That is, it is possible to obtain a favorable frequency characteristic of sound pressure.
  • the thickness h1 of the terminal board 6e is preferably larger than the thickness h2 of the flexible substrate 6.
  • the volume of the terminal board 6e it is possible to more easily pick up the surrounding vibration waves.
  • the vibration wave can be more effectively disturbed around the terminal board 6e.
  • the resonance frequency can be more effectively made partially non-uniform and the frequency characteristic of the sound pressure can be flattened, so that a good frequency characteristic of the sound pressure can be obtained.
  • the strength of the terminal board 6e can of course be increased by taking a large thickness, it is possible to more effectively prevent disconnection due to bending and improve durability.
  • FIG. 6A is a diagram illustrating a configuration of the sound generation device 20 according to the embodiment
  • FIG. 6B is a diagram illustrating a configuration of the electronic device 50 according to the embodiment.
  • FIG. 6A is a diagram illustrating a configuration of the sound generation device 20 according to the embodiment
  • FIG. 6B is a diagram illustrating a configuration of the electronic device 50 according to the embodiment.
  • only the component required for description is shown and description about a general component is abbreviate
  • the sound generator 20 is a sounding device such as a so-called speaker, and includes, for example, a sound generator 1 and a housing 30 that houses the sound generator 1 as shown in FIG. 6A.
  • the housing 30 resonates the sound generated by the sound generator 1 and radiates the sound to the outside through an opening (not shown) formed in the housing 30.
  • the sound pressure in a low frequency band can be increased.
  • the sound generator 1 can be mounted on various electronic devices 50.
  • the electronic device 50 is a mobile terminal device such as a mobile phone or a tablet terminal.
  • the electronic device 50 includes an electronic circuit 60.
  • the electronic circuit 60 includes, for example, a controller 50a, a transmission / reception unit 50b, a key input unit 50c, and a microphone input unit 50d.
  • the electronic circuit 60 is connected to the sound generator 1 and has a function of outputting an audio signal to the sound generator 1.
  • the sound generator 1 generates sound based on the sound signal input from the electronic circuit 60.
  • the electronic device 50 includes a display unit 50e, an antenna 50f, and the sound generator 1. Further, the electronic device 50 includes a housing 40 that accommodates these devices.
  • each device including the controller 50a is accommodated in one housing 40, but the accommodation form of each device is not limited. In the present embodiment, it is sufficient that at least the electronic circuit 60 and the sound generator 1 are accommodated in one housing 40.
  • the controller 50 a is a control unit of the electronic device 50.
  • the transmission / reception unit 50b transmits / receives data via the antenna 50f based on the control of the controller 50a.
  • the key input unit 50c is an input device of the electronic device 50 and accepts a key input operation by an operator.
  • the microphone input unit 50d is also an input device of the electronic device 50, and accepts a voice input operation by an operator.
  • the display unit 50e is a display output device of the electronic device 50, and outputs display information based on the control of the controller 50a.
  • the sound generator 1 operates as a sound output device in the electronic device 50.
  • the sound generator 1 is connected to the controller 50a of the electronic circuit 60, and emits sound upon application of a voltage controlled by the controller 50a.
  • the electronic device 50 is described as a portable terminal device.
  • the electronic device 50 is not limited to the type of the electronic device 50, and may be applied to various consumer devices having a function of emitting sound.
  • flat-screen TVs and car audio devices can of course be used for products having a function of emitting sound such as "speak", for example, various products such as vacuum cleaners, washing machines, refrigerators, microwave ovens, etc. .
  • the sound generator includes an exciter (piezoelectric element), a flat vibrating body, and a printed board (flexible board).
  • the exciter vibrates when an electric signal is input thereto.
  • the vibrator is provided with the exciter, and vibrates with the exciter by the vibration of the exciter.
  • the printed circuit board is connected to the exciter and inputs an electrical signal to the exciter.
  • the sound generator according to the embodiment it is possible to obtain a favorable frequency characteristic of sound pressure.
  • the printed board is a flexible board
  • the embodiment is not limited to the flexible board.
  • a rigid substrate formed by using FR4 (Flame Retardant Type 4) as a base material and attaching a metal foil or the like may be used.
  • a rigid flexible substrate in which a flexible substrate and a rigid substrate are integrated may be used. Even in the case where these are used, as in the case of the flexible substrate in the embodiment, a terminal portion with the wiring conductor exposed is formed at the tip portion, and bonding to the piezoelectric element is performed via the terminal portion. Good.
  • the piezoelectric element is provided on one main surface of the vibrating body.
  • the present invention is not limited thereto, and the piezoelectric element is provided on both surfaces of the vibrating body. It may be provided.
  • the case where the resin layer is formed so as to cover the piezoelectric element and the vibrating body in the frame of the frame is taken as an example.
  • Such a resin layer is not necessarily formed, but it is preferable to form a resin layer.
  • the diaphragm is configured by a thin film such as a resin film
  • the present invention is not limited to this.
  • the diaphragm may be configured by a plate-like member.
  • the support body that supports the diaphragm is a frame and the periphery of the diaphragm is supported has been described as an example.
  • the present invention is not limited to this.
  • it is good also as supporting only the both ends of the longitudinal direction or a transversal direction of a diaphragm.
  • the exciter is a piezoelectric element
  • the exciter is not limited to the piezoelectric element, and has a function of vibrating when an electric signal is input. What is necessary is just to have.
  • an electrodynamic exciter for vibrating a speaker
  • an electrostatic exciter for vibrating a speaker
  • an electromagnetic exciter well known as an exciter for vibrating a speaker
  • the electrodynamic exciter is such that an electric current is passed through a coil disposed between the magnetic poles of a permanent magnet to vibrate the coil.
  • the electrostatic exciter is composed of two metals facing each other. A bias and an electric signal are passed through the plate to vibrate the metal plate, and an electromagnetic exciter is an electric signal that is passed through the coil to vibrate a thin iron plate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

[Problème] Obtenir des caractéristiques de fréquence de pression acoustique satisfaisantes. [Solution] Le générateur acoustique de l'invention comporte un excitateur, un corps vibrant plat et un substrat imprimé. L'excitateur vibre lorsqu'un signal électrique lui est appliqué. Le corps vibrant est fixé à l'excitateur, et la vibration de l'excitateur fait vibrer le corps vibrant en même temps que l'excitateur. Le substrat imprimé est relié à l'excitateur et permet d'appliquer un signal électrique à l'excitateur.
PCT/JP2013/082222 2012-12-19 2013-11-29 Générateur acoustique, dispositif de génération acoustique et dispositif électronique WO2014097862A1 (fr)

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JP2012-277369 2012-12-19
JP2012277369 2012-12-19

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WO2014097862A1 true WO2014097862A1 (fr) 2014-06-26

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017017426A (ja) * 2015-06-29 2017-01-19 京セラ株式会社 音響発生器およびこれを備えた音響発生装置、電子機器
JP2017135340A (ja) * 2016-01-29 2017-08-03 Tdk株式会社 圧電アクチュエータ
WO2019087922A1 (fr) * 2017-11-02 2019-05-09 Tdk株式会社 Dispositif de vibration
WO2019087923A1 (fr) * 2017-11-02 2019-05-09 Tdk株式会社 Dispositif de vibration
JP2021040286A (ja) * 2019-09-05 2021-03-11 Tdk株式会社 振動デバイス

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JPH07107593A (ja) * 1993-10-04 1995-04-21 Murata Mfg Co Ltd 電気音響変換器
JP2003125492A (ja) * 2001-10-16 2003-04-25 Taiyo Yuden Co Ltd 圧電音響装置
JP2007336504A (ja) * 2006-06-12 2007-12-27 Taiyo Yuden Co Ltd 振動板

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH07107593A (ja) * 1993-10-04 1995-04-21 Murata Mfg Co Ltd 電気音響変換器
JP2003125492A (ja) * 2001-10-16 2003-04-25 Taiyo Yuden Co Ltd 圧電音響装置
JP2007336504A (ja) * 2006-06-12 2007-12-27 Taiyo Yuden Co Ltd 振動板

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017017426A (ja) * 2015-06-29 2017-01-19 京セラ株式会社 音響発生器およびこれを備えた音響発生装置、電子機器
JP2017135340A (ja) * 2016-01-29 2017-08-03 Tdk株式会社 圧電アクチュエータ
CN107026230A (zh) * 2016-01-29 2017-08-08 Tdk株式会社 压电致动器
US10439126B2 (en) 2016-01-29 2019-10-08 Tdk Corporation Piezoelectric actuator
CN107026230B (zh) * 2016-01-29 2019-09-10 Tdk株式会社 压电致动器
JP2019087574A (ja) * 2017-11-02 2019-06-06 Tdk株式会社 振動デバイス
JP2019087573A (ja) * 2017-11-02 2019-06-06 Tdk株式会社 振動デバイス
WO2019087923A1 (fr) * 2017-11-02 2019-05-09 Tdk株式会社 Dispositif de vibration
WO2019087922A1 (fr) * 2017-11-02 2019-05-09 Tdk株式会社 Dispositif de vibration
CN111279498A (zh) * 2017-11-02 2020-06-12 Tdk株式会社 振动器件
US11548030B2 (en) 2017-11-02 2023-01-10 Tdk Corporation Vibration device
JP2021040286A (ja) * 2019-09-05 2021-03-11 Tdk株式会社 振動デバイス
JP7294006B2 (ja) 2019-09-05 2023-06-20 Tdk株式会社 振動デバイス

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