WO2014094636A1 - 电子装置和栅格阵列模块 - Google Patents
电子装置和栅格阵列模块 Download PDFInfo
- Publication number
- WO2014094636A1 WO2014094636A1 PCT/CN2013/089994 CN2013089994W WO2014094636A1 WO 2014094636 A1 WO2014094636 A1 WO 2014094636A1 CN 2013089994 W CN2013089994 W CN 2013089994W WO 2014094636 A1 WO2014094636 A1 WO 2014094636A1
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- WIPO (PCT)
- Prior art keywords
- pad
- radio frequency
- bonding pad
- printed circuit
- circuit board
- Prior art date
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- 239000000758 substrate Substances 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 description 10
- 238000005476 soldering Methods 0.000 description 8
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 230000003071 parasitic effect Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000011056 performance test Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to the field of electronic technologies, and in particular, to an electronic device and a grid array module. Background technique
- LGA Land Grid Array
- the LGA module has comprehensive functions.
- the LGA module usually has functions such as wireless reception, signal processing, and wireless transmission.
- LGA module includes printed circuit board
- HDI High Density Interconnect
- the antenna connected to the LGA module generally includes a main antenna, a sub antenna, and a global positioning system.
- the SMA (Small A Type) head on the board is connected to the SMA head on the LGA module via a cable to interconnect the antenna on the backplane with the LGA module.
- the bottom surface of the LGA module is opposite the backplane, and the SMA head on the LGA module is placed on the top surface of the LGA module. Since the SMA head on the LGA module occupies a certain surface area, the effective layout space of the LGA module is reduced.
- Embodiments of the present invention provide an electronic device and a grid array module capable of improving an LGA mode The effective layout space of the block.
- an electronic device comprising: a grid array LGA module, including a first printed circuit board, a lower surface of the first printed circuit board having a first RF pad and a first non-RF pad;
- the second printed circuit board has a second RF pad and a second non-RF pad, wherein the first RF pad is connected to the second RF pad, and the first non-RF solder
- the disk is connected to the second non-radio pad;
- the antenna is located on the bottom plate and is connected to the second RF pad, wherein the size of the first RF pad is smaller than the size of the second non-RF pad, and the second RF pad
- the size of the first non-radio frequency pad is smaller than that of the first non-radio frequency pad, and the first radio frequency pad and the second radio frequency pad are used to transmit the radio frequency signal transmitted by the antenna between the LGA module and the backplane.
- the lengths of the first radio frequency pad and the second radio frequency pad range from 0.4 mm to 1.2 mm, and the widths of the first radio frequency pad and the second radio frequency pad range from 0.4 mm. To 0.8mm
- the first RF pad and the second RF pad have a length of 1.0 mm, the first RF pad and the second RF solder The width of the disc is 0.6 mm.
- the first radio frequency pad, the first non-radio frequency pad, and the second radio frequency pad are rectangular,
- the long side of an RF pad is parallel to the long side of the first non-radio pad, and the short side of the first RF pad is parallel to the short side of the first non-radio pad.
- the first radio frequency pad, the first non-radio frequency pad, and the second radio frequency pad are rectangular, wherein The short side of the first RF pad is parallel to the long side of the first non-RF pad, and the long side of the first RF pad is parallel to the short side of the first non-RF pad.
- the lower surface of the first printed circuit board further has a first empty network pad, the first radio frequency pad a predetermined gap between the first empty network pad and the first RF pad and the first empty network
- the size and shape of the area occupied by the land pads are consistent with the size and shape of the area occupied by the first non-RF pad
- the upper surface of the second printed circuit board has a second empty network pad, the second RF pad and the There is a preset gap between the two empty network pads, wherein the first empty network pad is connected to the second empty network pad.
- the first radio frequency pad and the printed circuit of the lower surface of the first printed circuit board (or printing) The distance between the circuits) is greater than 0.2 mm; the distance between the second RF pads and the printed traces on the upper surface of the second printed circuit board is greater than 0.2 mm.
- the distance between the first RF pad and the printed traces inside the first printed circuit board is greater than 0.2 mm.
- an electronic device including: a grid array LGA module including a first printed circuit board, a lower surface of the first printed circuit board having a first RF pad; and a bottom plate including a second printed circuit board
- the upper surface of the second printed circuit board has a second RF pad, the first RF pad is connected to the second RF pad, and the length of the first RF pad and the second RF pad ranges from 0.4 mm to 1.2 mm
- the first RF pad and the second RF pad have a width ranging from 0.4 mm to 0.8 mm; the antenna is located on the substrate and is connected to the second RF pad, the first RF pad and the second RF pad It is used to transmit the RF signal transmitted by the antenna between the LGA module and the backplane.
- the first RF pad and the second RF pad have a length of 1.0 mm, and the first RF pad and the second RF pad have a width of 0.6 mm.
- the distance between the first RF pad and the printed trace of the lower surface of the first printed circuit board is greater than 0.2 mm; the distance between the second RF pad and the printed trace of the lower surface of the second printed circuit board is greater than 0.2 mm.
- the lower surface of the first printed circuit board further has a first empty network pad, first There is a predetermined gap between the RF pad and the first empty network pad.
- a distance between the first radio frequency pad and a printed trace inside the first printed circuit board is greater than
- a grid array LGA module including: a first printed circuit board; a lower surface of the first printed circuit board having a first RF pad, and a length of the first RF pad is 0.4 mm To 1.2 mm, the width of the first RF pad ranges from 0.4 mm to 0.8 mm. .
- the first RF pad has a length of 1.0 mm and the first RF pad has a width of 0.6 mm.
- the distance between the first RF pad and the printed traces inside the first printed circuit board is greater than 0.2 mm.
- the lower surface of the first printed circuit board further has a first empty network pad, the first RF pad and the first There is a preset gap between the empty network pads.
- a grid array LGA module including: a printed circuit board having a first RF pad and a first non-RF pad on a lower surface thereof, the first RF pad being smaller than the first The size of a non-RF pad.
- the length of the first RF pad ranges from 0.4 mm to 1.2 mm, and the width of the first RF pad ranges from 0.4 mm to 0.8 mm.
- the first RF pad has a length of 1.0 mm and the first RF pad has a width of 0.6 mm.
- a large between the first radio frequency pad and the printed circuit of the lower surface of the first printed circuit board The distance is greater than 0.2mm.
- the first radio frequency pad and the printed wiring inside the first printed circuit board The distance between them is greater than 0.2mm.
- Embodiments of the present invention can connect the RF pad on the LGA module to the RF pad on the backplane and connect the RF pad on the backplane to the antenna so that the RF signal on the LGA module can be transmitted to the antenna. Since the RF pad of the LGA module is located on the bottom surface of the LGA module, it does not occupy the space on the top surface of the LGA module, thus improving the effective layout space of the LGA module.
- FIG. 1A is a schematic structural view of an electronic device in accordance with an embodiment of the present invention.
- Figure 1B is a schematic exploded view of an electronic device in accordance with the embodiment of Figure 1A.
- 2A is a schematic illustration of a non-radio frequency pad and a radio frequency pad, in accordance with one embodiment of the present invention.
- 2B is a schematic diagram of a non-radio frequency pad and a radio frequency pad in accordance with another embodiment of the present invention.
- 2C is a schematic illustration of a non-radio frequency pad and a radio frequency pad in accordance with yet another embodiment of the present invention.
- 2D is a schematic illustration of a non-radio frequency pad and a radio frequency pad in accordance with yet another embodiment of the present invention.
- 3A is a schematic illustration of non-RF pads and RF pads and empty network pads, in accordance with one embodiment of the present invention.
- Figure 3B is a schematic illustration of a non-radio frequency pad and radio frequency pad and an empty network pad in accordance with another embodiment of the present invention.
- 3C is a schematic illustration of a non-radio frequency pad and a radio frequency pad and an empty network pad in accordance with yet another embodiment of the present invention.
- FIG. 4 is a cross-sectional view of a printed circuit board of an LGA module in accordance with an embodiment of the present invention.
- FIG. 5 is a schematic structural diagram of an electronic device according to another embodiment of the present invention.
- FIG. 6 is a schematic structural diagram of an LGA module according to another embodiment of the present invention.
- FIG. 7 is a schematic structural diagram of an LGA module in accordance with still another embodiment of the present invention.
- FIG. 8 is a schematic structural view of an electronic device according to still another embodiment of the present invention.
- the antenna can be first connected to the RF pad on the substrate through the wiring on the printed circuit board of the backplane, and the RF pad of the backplane is connected to the RF pad of the LGA module.
- the LGA module and the backplane may also be provided with pads for transmitting non-RF signals (hereinafter referred to as non-RF pads).
- the size of the non-RF pad is generally large, for example, the length can be 1.5 mm and the width can be 1.0 mm.
- the size of the non-RF pads is generally larger, so that the RF pads are adjacent to the printed circuit of the same layer or the same layer (for example, copper).
- the parasitic capacitance generated by the RF pad is large.
- a larger capacitor is connected in parallel with the RF signal path, resulting in impedance discontinuity, resulting in a large insertion loss of the RF signal path.
- FIG. 1A is a schematic structural diagram of an electronic device 100 in accordance with an embodiment of the present invention.
- FIG. 1B is a schematic exploded view of an electronic device 100 in accordance with the embodiment of FIG. 1A.
- the electronic device 100 of the present invention will be described below with reference to FIGS. 1A and 1B.
- the electronic device 100 includes a grid array LGA module 110, a backplane 120, and an antenna 130.
- the grid array LGA module 110 includes a first printed circuit board 113 having a lower surface having a first RF pad 111 and a first non-RF pad 112.
- the first radio frequency pad 111 and the first non-radio frequency pad 112 may be disposed on a lower surface of the first printed circuit board 113.
- the outer surface of the first radio frequency pad 111 may be flush with the lower surface of the first printed circuit board 113.
- the embodiment according to the present invention is not limited thereto, for example, the outer surface of the first radio frequency pad 111 may be printed with the first The lower surface of the circuit board 113 is not flush (e.g., above or below the lower surface of the printed circuit board).
- the bottom plate 120 includes a second printed circuit board 123.
- the upper surface of the second printed circuit board 123 has a second RF pad 121 and a second non-RF pad 122, wherein the first RF pad 111 and the second RF pad 121
- the first non-radio frequency pad 112 is connected to the second non-radio frequency pad 122.
- the first RF pad 111 on the LGA module 110 and the second RF pad 121 on the backplane 120 may be soldered together.
- a non-radio frequency pad 112 is soldered to the second non-radio frequency pad 122 such that the LGA module 110 is attached to the bottom plate 120.
- the second RF pad 122 on the backplane 120 corresponds to the first RF pad 111 on the LGA module 110
- the second non-RF pad 122 corresponds to the first non-RF pad 112.
- the outer surface of the second RF pad 121 may be flush with the upper surface of the second printed circuit board 123.
- the second RF pad 121 may be associated with the second printed circuit board 123.
- the upper surface is not flush (eg, above or below the lower surface of the printed circuit board).
- the antenna 130 is located on the bottom plate 120 and is connected to the second RF pad 121.
- the size of the first RF pad 111 is smaller than the size of the first non-RF pad 112, and the size of the second RF pad is smaller than the second non-RF.
- the size of the pad 122, the first RF pad 111 and the second RF pad 121 are used to transmit the RF signal transmitted by the antenna 130 between the LGA module 110 and the backplane 120.
- First RF welding The size of the disk 111 may be equal to the size of the second RF pad 121.
- the size of the first radio frequency pad 111 and the second radio frequency pad 121 may refer to the surface area of the soldering surface of the first radio frequency pad 111 and the second radio frequency pad 121.
- the size of the first non-RF pad 112 may be equal to the size of the second non-RF pad 122.
- the size of the first non-radio frequency pad 112 and the size of the second non-radio frequency pad 122 may refer to the size of the first non-radio frequency pad 112 and the surface area of the soldering surface of the second non-radio frequency pad 122.
- the antenna 130 is connected to the second RF pad 121 on the backplane 120 through the wiring 124 on the second printed circuit board 123 of the backplane 120.
- Embodiments of the present invention are not limited thereto, and for example, may be utilized independently of the second
- the leads of the printed circuit board 123 connect the antenna 130 to the second RF pad 121 of the backplane 120.
- the first non-RF pad 112 is used to transmit non-RF signals, that is, to transmit signals other than RF signals.
- the LGA module 110 when the LGA module 110 is mounted on the substrate 120, the LGA module 110 may be connected to the substrate 120 through the first RF pad 111 and the second RF pad 121, and the substrate 120 may be routed or leaded.
- the antenna 130 is connected to interconnect the LGA module 110 and the antenna 130 such that the RF signal transmitted by the antenna 130 can be transmitted between the antenna 130 and the LGA module 110.
- the second printed circuit board in this embodiment may be a printed circuit board including at least one layer, for example, a printed circuit board of one layer, a printed circuit board of two layers, or a printed circuit board of three layers.
- the size of the first radio frequency pad may be the same as the size of the second radio frequency pad, and the size of the first radio frequency pad may be different from the size of the second radio frequency pad.
- the size of the first non-RF pad 112 is the same as the size of the second non-RF pad 122, and there may be a tolerance between the size of the first non-RF pad 112 and the size of the second non-RF pad 122.
- Embodiments of the present invention can connect the RF pad on the LGA module to the RF pad on the backplane and connect the RF pad on the backplane to the antenna so that the RF signal on the LGA module can be transmitted to the antenna. Since the RF pad of the LGA module is located on the bottom surface of the LGA module, it does not occupy the space on the top surface of the LGA module, thus improving the effective layout space of the LGA module.
- embodiments of the present invention can set the size of the radio frequency pad to be smaller than the size of the non-radio frequency pad, so that the capacitance generated by the radio frequency pad is reduced, the impedance continuity of the radio frequency loop is improved, thereby reducing insertion loss and improving RF sensitivity. The better the impedance continuity, the better the impedance convergence in the wide frequency range, which makes debugging of multiple frequency bands easier.
- the backplane has one radio frequency pad, as will be understood by those skilled in the art, in the LGA module or the backplane.
- the number of RF pads of the LGA module is one-to-one corresponding to the number of RF pads on the backplane, and corresponds to the number of antennas.
- the number of non-radio pads can be set as needed.
- the first RF pad 111 is smaller than the surface area of the first non-RF pad 112, and the surface area of the second RF pad 121 is smaller than the surface area of the first non-RF pad 112.
- the surface area of the first RF pad 111 may be equal to the surface area of the second RF pad 121.
- the surface area of the first RF pad 111 may be 1/2, 1/ of the surface area of the first non-RF pad 112. 3, 1/4, 1/5 and so on.
- the first non-radio frequency pad 112 has a surface area of 2.5 mm 2
- the first radio frequency pad 111 has a surface area of 0.1 mm 2 to 1.2 mm 2 , for example, 0.1 mm 2 , 0.2 mm 2 , 0.3 mm 2 , 0.4 mm 2 , 0.5 mm 2 , 0.6 . Mm2, 0.7 mm2, 0.8 mm2, 0.9 mm2, 1.0 mm2, 1.1 mm2, 1.2 mm2, etc.
- the lengths of the first radio frequency pad 111 and the second radio frequency pad 121 range from 0.4 mm to 1.2 mm, and the widths of the first radio frequency pad 111 and the second radio frequency pad 121 range from 0.4. Mm to 0.8mm
- the first RF pad 111 and the second RF pad 121 may have a length of 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm 1.2 mm, for example, the first RF
- the width of the pad 111 and the second RF pad 121 may be 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, or 0.8 mm.
- the first radio frequency pad 111 and the second radio frequency pad 121 have a length of 1.0 mm, and the first radio frequency pad 111 and the second radio frequency pad 121 have a width of 0.6 mm. This is okay Ensure that the RF signal has good impedance convergence over a wide frequency range (eg 0.7G-4G).
- the RF pad size is smaller than the minimum size of the above range (for example, the length and width of the RF pad is less than 0.4mm)
- the LGA module will be equipped.
- the cost of the test fixture is increased.
- the size of the RF pad is larger than the maximum size of the above range (for example, the length of the above RF pad is larger than 1.0 mm and the width is larger than 0.8 mm)
- the continuity of the impedance is deteriorated, and the insertion loss becomes large.
- the first radio frequency pad 111, the first non-radio frequency pad 112, and the second radio frequency pad 121 are rectangular, and the long side of the first radio frequency pad 111 is longer than the first non-radio frequency pad 112.
- the sides of the first RF pad 111 are parallel to the short sides of the first non-RF pad 112.
- the first radio frequency pad 111, the first non-radio frequency pad 112, and the second radio frequency pad 121 are rectangular, wherein the short side of the first radio frequency pad 111 and the first non-radio frequency pad 112 The long sides are parallel, and the long sides of the first RF pads 111 are parallel to the short sides of the first non-RF pads 112.
- the lower surface of the first printed circuit board 113 of the LGA module 110 has a first empty network pad, the first RF pad 111 and the first empty network pad (not shown in FIG. 1A)
- the gap is the same as the size of the area occupied by the first non-RF pad, and the shape of the area occupied by the first RF pad 111 and the first empty network pad (including the first RF pad 111 and the first empty network pad)
- the shape of the preset gap is the same as the shape occupied by the first non-radio frequency pad; the upper surface of the second printed circuit board 123 of the bottom plate 120 has the second empty network pad (not shown in FIG.
- a predetermined gap is formed between the second RF pad 121 and the second empty network pad, wherein the first empty network pad is connected to the second empty network pad.
- the size of the predetermined gap between the RF pad and the empty network pad can be set such that the RF pad and the empty network pad meet the manufacturing process requirements.
- the space saved can be used to set the empty network pad.
- the empty network pad can be used to increase the soldering reliability of the LGA module and ensure soldering performance.
- RF pads can be shared with empty network pads. The size and shape of the area used is consistent with the size and shape of the area occupied by the non-RF pads.
- the distance between the first RF pad 111 and the printed trace of the lower surface of the first printed circuit board 113 is greater than 0.2 mm (about 8 mils); the second RF pad 112 and the first The distance between the printed traces of the upper surface of the printed circuit board 123 is greater than 0.2 mm.
- no printed circuit eg, copper
- the parasitic capacitance prevents the RF signal from being discontinuous at the LGA pad and ensures the impedance continuity of the RF path of the antenna.
- the distance between the first RF pad 111 and the printed traces inside the first printed circuit board 113 is greater than 0.2 mm.
- the trace can be a reference location above the RF pad. In this way, it is possible to avoid causing the RF signal to be discontinuous at the LGA pad.
- 2A is a schematic illustration of a non-radio frequency pad and a radio frequency pad, in accordance with one embodiment of the present invention.
- 2A illustrates an example of a non-radio-radio pad and a radio frequency pad of the LGA module of the embodiment of FIG. 1A.
- the non-radio frequency pad 210 and the radio frequency pad 220 may be disposed on the same side of the LGA module (i.e., the lower surface of the LGA module). There may be a predetermined gap between the non-RF pad 210 and the RF pad 220.
- the RF pad 220 and the non-RF pad 210 are rectangular rectangular.
- the long side of the RF pad 220 is parallel to the long side of the non-RF pad 210, and the short side of the RF pad 220 is parallel to the short side of the non-RF pad 210.
- the predetermined gap between the RF pad and the non-RF pad can be sized such that the RF pad and the non-RF pad meet the manufacturing process requirements.
- FIG. 2B is a schematic diagram of a non-radio frequency pad and a radio frequency pad in accordance with another embodiment of the present invention.
- the non-RF pad 230 and RF pad 240 of Figure 2B are similar to the non-RF pad 210 and RF pad 220 of Figure 2A, except that the RF pad 240 is a rounded rectangle.
- 2C is a schematic illustration of a non-radio frequency pad and a radio frequency pad in accordance with yet another embodiment of the present invention.
- 2C illustrates an example of a non-radio frequency pad and a radio frequency pad of the LGA module of the embodiment of FIG. 1A.
- the non-radio frequency pad 230 and the radio frequency pad 240 may be disposed on the same side of the surface of the LGA module (ie, the lower surface of the LGA module).
- Non-RF pad 250 and RF pad 260 are straight The rectangular rectangle, wherein the short side of the RF pad 260 is parallel to the long side of the non-RF pad 250, and the long side of the RF pad 260 is parallel to the short side of the non-RF pad 250.
- FIG. 2D is a schematic illustration of a non-radio frequency pad and a radio frequency pad in accordance with yet another embodiment of the present invention.
- the non-RF pad 270 and RF pad 280 of Figure 2D are similar to the non-RF pad 250 and RF pad 260 of Figure 2C, except that the RF pad 280 is a rounded rectangle.
- the non-RF pads and RF pads on the backplane correspond to the non-RF pads and RF pads on the LGA module
- the non-RF pads and RF pads on the backplane are
- the non-radio frequency pad and the radio frequency pad on the LGA module of FIGS. 2A to 2D have similar shapes and arrangements, and are not described herein again.
- FIG. 3A is a schematic illustration of non-RF pads and RF pads and empty network pads, in accordance with one embodiment of the present invention.
- Figure 3A illustrates an example of non-RF pads and RF pads and empty network pads of the LGA module of the embodiment of Figure 1A.
- the RF pad 330 and the empty network pad 320 there is a predetermined gap between the RF pad 330 and the empty network pad 320, and the size and shape of the area occupied by the RF pad 330 and the empty network pad 320 and the area occupied by the non-RF pad 310
- the size and shape are the same.
- the area occupied by the RF pad 330 and the space network pad 320 (including the gap between the two) is equal to the area of the non-RF pad 310.
- the RF pad 330, the empty network pad 320, and the non-RF pad 310 may each be a rectangular rectangle.
- Figure 3B is a schematic illustration of a non-radio frequency pad and radio frequency pad and an empty network pad in accordance with another embodiment of the present invention.
- the non-RF pad 340, the empty network pad 350, and the RF pad 360 of FIG. 3B are similar to the non-RF pad 310, the empty network pad 320, and the RF pad 330 of FIG. 3A, except that the RF pad 360 is Rounded Rectangle.
- FIG. 3C is a schematic illustration of a non-radio frequency pad and a radio frequency pad and an empty network pad in accordance with yet another embodiment of the present invention.
- Figure 3C illustrates an example of non-RF pads and RF pads and empty network pads of the LGA module of the embodiment of Figure 1A.
- the size and shape of the area occupied by the RF pad 390 and the empty network pad 380 are non-RF.
- the area occupied by the pad 370 is the same size and shape.
- the area occupied by the RF pad 390 and the space network pad 380 (including the gap between the two) is equal to the area of the non-RF pad 370.
- the shape of the radio frequency pad 390 and the non-radio frequency pad 370 may be rectangular.
- the empty network pad 380 may surround or partially surround the RF pad 390.
- the structure of the empty network pad 380 is '", that is, an opening may be disposed on the space network pad 380, and the RF pad 390 may be An opening located in the empty network pad 380.
- the shape of the RF pad 390 of FIG. 3C may also be set to a rounded rectangle.
- non-RF pads and RF pads on the backplane correspond to the non-RF pads and RF pads on the LGA module
- the non-RF pads and RF pads on the backplane are as shown in Figure 3A.
- the non-RF pads and RF pads on the LGA module of FIG. 3D have similar shapes and arrangements, and are not described herein again.
- FIG. 4 is a cross-sectional view of a multilayer printed circuit board 400 of an LGA module in accordance with an embodiment of the present invention.
- the multilayer printed circuit board 400 is an example of the first printed circuit board 113 in Fig. 1.
- Each of the plurality of printed circuit boards 400 may include a substrate 410 and a printed circuit 440, and the printed circuit 440 includes printed traces.
- the lower surface of the underlying printed circuit board in the multilayer printed circuit board 400 further includes: an RF pad 420 and a non-RF pad 430.
- the distance between the RF pad 420 and the printed trace of the same layer is set to be greater than d2
- the distance between the RF pad 420 and the non-RF pad 430 of the same layer is set to be greater than dl
- the RF pad 420 and the multilayer In the printed circuit 400 the printed circuit 400 may not be provided with a printed trace within a range of a distance d3 above the RF pad 420.
- the upper printed circuit board of the lower printed circuit board corresponds to the pad 420.
- the part does not set the printed circuit.
- D2 can be set according to the requirements of the manufacturing process.
- the printed traces above the RF pads 420 are reference ground.
- FIG. 5 is a schematic structural diagram of an electronic device 500 according to another embodiment of the present invention.
- Electronics Apparatus 500 includes: a grid array LGA module 510, a backplane 520, and an antenna 530.
- the grid array LGA module 510 includes a first printed circuit board 513 having a lower surface having a first RF pad 511.
- the bottom plate 520 includes a second printed circuit board 523.
- the upper surface of the second printed circuit board 523 has a second RF pad 521.
- the first RF pad 511 is connected to the second RF pad 521, and the first RF pad 511 and The length d5 of the second RF pad 521 ranges from 0.4 mm to 1.2 mm, and the width d4 of the first RF pad 511 and the second RF pad 521 ranges from 0.4 mm to 0.8 mm.
- the antenna 530 is located on the bottom plate 520 and is connected to the second RF pad 521.
- the first RF pad 511 and the second RF pad 521 are used to transmit the RF signal transmitted by the antenna between the LGA module 510 and the backplane 520.
- Embodiments of the present invention can connect the RF pad on the LGA module to the RF pad on the backplane and connect the RF pad on the backplane to the antenna so that the RF signal on the LGA module can be transmitted to the antenna. Since the RF pad of the LGA module is located on the bottom surface of the LGA module, it does not occupy the space on the top surface of the LGA module, thus improving the effective layout space of the LGA module.
- embodiments of the present invention can set the length of the radio frequency pad to be 0.4 mm to 1.2 mm, and the length of the radio frequency pad can be set to 0.4 mm to 0.8 mm, so that the LGA module is used to transmit radio frequency signals to the backplane.
- the parasitic capacitance generated by the RF pad is reduced, which improves the impedance continuity of the RF loop, thereby reducing insertion loss and improving RF sensitivity.
- the better the impedance continuity the better the impedance convergence in the wide frequency range, which makes debugging of multiple frequency bands easier.
- the first RF pad 511 and the second RF pad 521 have a length of 1.0 mm, and the first RF pad 511 and the second RF pad 521 have a width of 0.6 mm. In this way, RF signals can be guaranteed to have good impedance convergence over a wide frequency range (eg 0.7G-4G).
- the distance between the first RF pad 511 and the printed trace of the lower surface of the first printed circuit board is greater than 0.2 mm; the second RF pad 521 and the upper surface of the second printed circuit board The distance between the printed traces is greater than 0.2 mm.
- the distance between the lines is greater than 0.2mm.
- the printed trace can be a reference ground above the RF pad. In this way, it is possible to avoid causing the RF signal to be discontinuous at the LGA pad.
- the lower surface of the first printed circuit board further has a first empty network pad, and a predetermined gap is formed between the first RF pad and the first empty network pad.
- the empty network pad can be used to increase the soldering reliability of the LGA module to the backplane and ensure soldering performance.
- FIG. 6 is a schematic structural diagram of an LGA module 600 according to another embodiment of the present invention.
- the LGA module 600 of FIG. 6 is an example of the LGA module 110 of FIG. 1A, which includes a printed circuit board 610 and a first RF pad 620.
- the lower surface of the printed circuit board 610 has a first RF pad 620, the length d7 of the first RF pad 620 ranges from 0.4 mm to 1.2 mm, and the width of the first RF pad 620 is d6. The range is from 0.4mm to 0.8mm.
- the first RF pad 620 may be disposed on a lower surface of the first printed circuit board 610.
- the outer surface of the first radio frequency pad 620 may be flush with the lower surface of the first printed circuit board 620.
- the embodiment according to the present invention is not limited thereto.
- the outer surface of the first radio frequency pad 620 may be printed with the first The lower surface of the circuit board 610 is not flush (eg, above or below the lower surface of the printed circuit board).
- Embodiments of the present invention may provide a radio frequency pad on the bottom surface (i.e., the lower surface) of the LGA module for connection to the RF pad on the backplane for connection to the antenna through the RF pad on the backplane. Since the RF pad of the LGA module is located on the bottom surface of the LGA module, it does not occupy the space on the top surface of the LGA module, thus improving the effective layout space of the LGA module.
- embodiments of the present invention can set the length of the radio frequency pad to be 0.4 mm to 1.2 mm, and the length of the radio frequency pad can be set to 0.4 mm to 0.8 mm, so that the LGA module is used to transmit radio frequency signals to the backplane.
- the parasitic capacitance generated by the RF pad is reduced, which improves the impedance continuity of the RF loop, thereby reducing insertion loss and improving RF sensitivity.
- the better the impedance continuity the better the impedance convergence in the wide frequency range, which makes debugging of multiple frequency bands easier.
- the length of the first RF pad 111 may be 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 111111 or 1.2111111.
- the width of the first RF pad 111 may be 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm > 3 ⁇ 4 0.8 mm.
- the first RF pad 620 has a length of 1.0 mm and the first RF pad has a width of 0.6 mm.
- the RF pad size is smaller than the minimum size of the above range (for example, the length and width of the RF pad is less than 0.4mm)
- the LGA module will be equipped.
- the cost of the test fixture is increased.
- the size of the RF pad is larger than the maximum size of the above range (for example, the length of the above RF pad is larger than 1.0 mm and the width is larger than 0.8 mm)
- the continuity of the impedance is deteriorated, and the insertion loss becomes large.
- the distance between the first radio frequency pad and the printed trace of the lower surface of the first printed circuit board is greater than 0.2 mm.
- the distance between the first RF pad and the printed traces inside the first printed circuit board is greater than 0.2 mm. In this way, it is possible to avoid causing the RF signal to be discontinuous at the LGA pad.
- no printed circuit eg, copper
- the parasitic capacitance ensures the impedance continuity of the antenna's RF path.
- the lower surface of the first printed circuit board further has a first empty network pad, and a predetermined gap is formed between the first RF pad and the first empty network pad.
- the empty network pad can be used to increase the soldering reliability of the LGA module.
- FIG. 7 is a schematic structural diagram of an LGA module 700 according to still another embodiment of the present invention.
- the LGA module 700 includes a printed circuit board 710 having a lower surface having a first RF pad 720 and a first non-RF pad 730, the size of the first RF pad 720 being smaller than the first The size of a non-RF pad 730.
- the length d7 of the first radio frequency pad 720 ranges from 0.4 mm to 1.2 mm
- the width d6 of the first RF pad 720 ranges from 0.4 mm to 0.8 mm.
- the first radio frequency pad 720 has a length d7 of 1.0 mm and the first radio frequency pad has a width d6 of 0.6 mm.
- the RF signal can be guaranteed to be in a wide frequency range (eg
- the distance between the first RF pad 720 and the printed circuit of the lower surface of the first printed circuit board 710 is greater than 0.2 mm. In this way, the impedance discontinuity of the RF signal at the LGA pad can be avoided, and the impedance continuity of the RF path of the antenna can be ensured.
- the distance between the first RF pad and the printed traces inside the first printed circuit board 710 is greater than 0.2 mm. In this way, it is possible to avoid causing the RF signal to be unstable at the LGA pad.
- FIG. 8 is a schematic block diagram of an electronic device 800 including an LGA module 810, a backplane 820, a first antenna 830 (eg, a primary antenna), and a second antenna 840 (eg, a secondary antenna), in accordance with yet another embodiment of the present invention.
- the LGA module 810 includes a printed circuit board 815 having a lower surface having a radio frequency pad 811, a radio frequency pad 813, a non-radio frequency pad 812, and a non-radio frequency pad 814, wherein the non-radio frequency pad 812 is located at the LGA module 810
- a plurality of non-RF pads 812 and 814 can be disposed on each side of the lower surface of the LGA module 810.
- the bottom plate 820 includes a printed circuit board 825 having an RF pad 821, a radio frequency pad 823, a non-RF pad 822, and a non-RF pad 824 on the upper surface of the printed circuit board 825, wherein the RF pad 821, RF Pad 823, non-radio frequency pad 822, and non-radio frequency pad 824 correspond to radio frequency pad 811, radio frequency pad 813, non-radio frequency pad 812, and non-radio frequency pad 814, respectively.
- the first antenna 830 is coupled to the RF pad 821 by a wiring 826 on the printed circuit board 825
- the second antenna 840 is coupled to the RF pad 823 by a wiring 827 on the printed circuit board 825.
- the RF pad 811 and the RF pad 813 in the embodiment of FIG. 8 are located on the same side of the lower surface of the printed circuit board of the LGA module, those skilled in the art will appreciate that the RF pad 811 is understood. And the RF pad 813 can also be located on different sides of the lower surface of the printed circuit board of the LGA module as needed (eg, the device of the antenna).
- the embodiment of FIG. 8 only describes that the LGA module includes two radio frequency pads, in the case where the antenna is multiple (eg, more than two), the radio frequency pad on the LGA module may be Multiple (eg, more than two), correspondingly, the number of radio frequency pads on the backplane may also be multiple (eg, more than two).
- the embodiment of FIG. 8 shows five pads on each side of the lower surface of the printed circuit board of the LGA module, embodiments according to the present invention are not limited thereto, and printed circuits disposed in the LGA module The pads on each side of the lower surface of the board may be provided in plurality according to the size of the LGA module and the size of the pads.
- the disclosed apparatus can be implemented in other ways.
- the device embodiments described above are merely illustrative.
- the division of the unit is only a logical function division.
- there may be another division manner for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not executed.
- the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be electrical, mechanical or otherwise.
- the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solution of the embodiment.
- each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transceivers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Mobile Radio Communication Systems (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13864172.5A EP2852262A4 (en) | 2012-12-21 | 2013-12-19 | ELECTRONIC DEVICE AND LGA MODULE |
JP2015538280A JP2016502262A (ja) | 2012-12-21 | 2013-12-19 | 電子装置及びランド・グリッド・アレイモジュール |
US14/580,991 US9905918B2 (en) | 2012-12-21 | 2014-12-23 | Electronic apparatus and land grid array module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201210562834.2 | 2012-12-21 | ||
CN201210562834.2A CN103889149B (zh) | 2012-12-21 | 2012-12-21 | 电子装置和栅格阵列模块 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US14/580,991 Continuation US9905918B2 (en) | 2012-12-21 | 2014-12-23 | Electronic apparatus and land grid array module |
Publications (1)
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WO2014094636A1 true WO2014094636A1 (zh) | 2014-06-26 |
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PCT/CN2013/089994 WO2014094636A1 (zh) | 2012-12-21 | 2013-12-19 | 电子装置和栅格阵列模块 |
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US (1) | US9905918B2 (zh) |
EP (1) | EP2852262A4 (zh) |
JP (1) | JP2016502262A (zh) |
CN (2) | CN103889149B (zh) |
WO (1) | WO2014094636A1 (zh) |
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CN106304630B (zh) * | 2015-06-09 | 2019-12-27 | 南京瀚宇彩欣科技有限责任公司 | 软性电路板及显示装置 |
US9684754B2 (en) * | 2015-10-02 | 2017-06-20 | Arm Limited | Standard cell architecture layout |
CN106211570B (zh) * | 2016-09-22 | 2019-06-11 | 京信通信系统(中国)有限公司 | 射频pcb连接结构及连接方法 |
EP3438676B1 (en) * | 2017-08-04 | 2020-07-15 | Rohde & Schwarz GmbH & Co. KG | Modular device architecture |
US10468218B2 (en) * | 2018-01-19 | 2019-11-05 | ISSA Technology Co., Ltd. | Relay with SMA wire driven mechanism |
CN108538823B (zh) * | 2018-04-25 | 2020-06-19 | 成都聚利中宇科技有限公司 | 集成单极子天线的封装芯片及其加工方法 |
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Also Published As
Publication number | Publication date |
---|---|
EP2852262A1 (en) | 2015-03-25 |
CN103889149A (zh) | 2014-06-25 |
EP2852262A4 (en) | 2015-09-02 |
CN107278029A (zh) | 2017-10-20 |
CN103889149B (zh) | 2017-07-14 |
US9905918B2 (en) | 2018-02-27 |
US20150116186A1 (en) | 2015-04-30 |
JP2016502262A (ja) | 2016-01-21 |
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