WO2014092386A1 - 인쇄회로기판 및 그 제조방법 - Google Patents
인쇄회로기판 및 그 제조방법 Download PDFInfo
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- WO2014092386A1 WO2014092386A1 PCT/KR2013/011248 KR2013011248W WO2014092386A1 WO 2014092386 A1 WO2014092386 A1 WO 2014092386A1 KR 2013011248 W KR2013011248 W KR 2013011248W WO 2014092386 A1 WO2014092386 A1 WO 2014092386A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Definitions
- the present invention relates to a printed circuit board using aluminum and a method for manufacturing the same, and a printed circuit board and a method for manufacturing the same that can increase the heat dissipation and bending strength using aluminum.
- a printed circuit board generally called a printed circuit board (PCB) is a component that is configured to allow various devices to be mounted or to make an electrical connection between devices due to integrated wiring.
- a printed circuit board having various forms and various functions according to the development of technology. Substrates are being manufactured.
- the demand for printed circuit boards is increasing along with the growth of consumer electronics, telecommunications, semiconductor equipment, industrial equipment, and automotive electric control.In particular, as printed circuit board products become smaller and lighter as electronic components become smaller and more advanced. And high value-added products.
- An object of the present invention is to solve the problems described above, to provide a printed circuit board and a method of manufacturing the same that can increase the heat radiation function and bending strength.
- Another object of the present invention is to provide a printed circuit board and a method of manufacturing the same, which can improve the reliability of a product by preventing breakage (cracking) of the substrate in harsh environmental conditions applied to automobiles.
- Another object of the present invention is to provide a printed circuit board and a method for manufacturing the same, which reduce weight of automotive electronic parts by using aluminum which is relatively lighter than copper.
- Another object of the present invention is to provide a printed circuit board and a method of manufacturing the same, which can shorten the manufacturing time of the printed circuit board and reduce the manufacturing cost thereof.
- Another object of the present invention is that the aluminum is bonded to the insulating layer by the method of laminating the aluminum around the insulator, so that various types of circuits can be implemented as necessary, thereby integrating the circuits to simplify the product.
- a printed circuit board and a method of manufacturing the same are provided.
- the printed circuit board according to the above-described embodiments of the present invention may include a core part formed of an aluminum material, a joint formed on both sides of the core part, and a base layer made of an aluminum material and the core layer to bond the base layer to the core part.
- a metal layer for metallizing a portion of the via member exposed in the via hole is formed, the substitution layer is formed in a portion other than the metal layer, the plating layer may be formed to cover the metal layer.
- the plating layer may be formed of a substitution plating layer formed by electrolytic plating or electroless plating on the surface of the substitution layer, and an electroplating layer of copper material formed by electrolytic plating on the substitution plating layer.
- the substitution plating layer may be formed on the surface of the substitution layer except for the metal layer or may be formed to cover a part of the metal layer, and the electrolytic plating layer may be formed to cover a metal layer portion in which the substitution plating layer is not formed.
- the core portion may be formed of an aluminum material having a predetermined thickness, and may be a metal core layer having a core pattern formed thereon.
- the core part may include a metal core layer formed of an aluminum material having a predetermined thickness, and having a core pattern formed thereon, and being bonded to both sides of the metal core layer, and including an aluminum core base layer and the core base layer on the metal core layer. It may include a core bonding member interposed between the metal core layer and the core base layer for bonding.
- the circuit pattern may further include a circuit pattern formed on the core base layer, and an insulating layer may be formed on the core base layer.
- the metal layer may be formed to metallize a portion where the bonding member, the core bonding member, and the insulating layer are exposed in the via hole, and the plating layer may be formed to cover the metal layer.
- An insulating layer is further formed between the core portion and the bonding member, and a metal layer is formed in the via hole to metallize a portion where the core bonding member, the bonding member, and the insulating layer are exposed.
- Silver may be formed in portions other than the metal layer, and the plating layer may be formed to cover the metal layer.
- the core pattern is formed of one or more holes formed through the metal core layer, the holes may be formed in a pattern or holes are arranged regularly or irregularly.
- the metal core layer may perform a surface treatment to form a surface roughness.
- Via holes may be formed.
- a second metal layer is formed in the second via hole to metallize a portion where the bonding member, the insulating layer, and the second bonding member are exposed, and the second substitution layer is a portion except the second metal layer.
- the second plating layer may be formed to cover the second metal layer.
- the core portion a metal core layer formed of an aluminum material of a predetermined thickness, the core pattern is formed, a core bonding member provided on both sides of the metal core layer, the metal core using the core bonding member
- a core base layer bonded to the layer and made of aluminum; It may include a second core base layer of aluminum material respectively bonded to the core base layer by using a second core bonding member and the second core bonding member provided on the core base layer.
- the method of manufacturing a printed circuit board according to the embodiments of the present invention described above, providing a core portion of aluminum, bonding the base layer of a predetermined thickness using a bonding member on the core portion, Forming a via hole through the core portion, the bonding member, and the base layer, zinc forming a surface of the base layer and a portion exposed to the inside of the via hole to form a substitution layer, and forming a plating layer on the substitution layer And forming a predetermined circuit pattern on the plating layer.
- the forming of the plating layer may include forming the plating layer to cover the metal layer.
- the forming of the plating layer may include forming a substitution plating layer formed on the surface of the substitution layer by electrolytic plating or electroless plating, and forming an electroplating layer of copper on the substitution plating layer. It may include.
- the substitution plating layer may be formed on the surface of the substitution layer except for the metal layer or may be formed to cover a portion of the metal layer, and the electrolytic plating layer may be formed to cover a metal layer portion in which the substitution plating layer is not formed.
- the core portion may be formed of an aluminum material having a predetermined thickness, formed of a metal core layer having a core pattern, and further comprising performing a surface treatment for forming the surface roughness of the metal core layer have.
- the providing of the core part may include providing a metal core layer formed of an aluminum material having a predetermined thickness, forming a core pattern on the metal core layer, and cores on both sides of the metal core layer on which the core pattern is formed. Bonding the core base layer of the aluminum material using the bonding member may be formed.
- the method may further include forming a second circuit pattern on the core base layer and providing an insulating layer on the core base layer.
- the method may further include bonding a second core base layer made of aluminum to each of the core base layers using a second core bonding member.
- the method may further include forming an insulating layer to fill the circuit pattern, bonding a second base layer made of aluminum to the insulating layer using a second bonding member, the metal core layer, the bonding member, and the base. Forming a second via hole penetrating through the layer, the insulating layer, the second bonding member, and the second base layer, and metallizing the surfaces of the bonding member and the second bonding member exposed into the second via hole.
- the core pattern may be formed of one or more holes formed through the metal core layer, the holes may be formed in a pattern or holes are arranged regularly or irregularly.
- the method may further include performing a surface treatment for forming the surface roughness of the metal core layer.
- forming the circuit pattern to form a preliminary substrate stacking the two preliminary substrates on which the circuit pattern is formed, insulated between the stacked preliminary substrates and the top and bottom of the preliminary substrate Forming a layer, bonding a second base layer made of aluminum to a second bonding member on the insulating layer, the laminated preliminary substrates, the insulating layer, the second bonding member, and the second bonding member; Forming a via hole penetrating through the base layer, forming a metal layer to metallize a portion of the bonding member of the preliminary substrate and a portion exposed from the second bonding member to the inside of the via hole, except for the metal layer, the second base Substituting the surface of the layer and the surface of the second base layer, the base layer, and the insulating layer exposed to the inside of the via hole by zinc
- The may further comprise the step of forming comprising the steps of electrolysis on the substitution layer using plating or electroless plating to form a plated layer and forming a circuit pattern on the plat
- the polyimide adhesive sheet capable of absorbing the change rate according to the thermal expansion coefficient of aluminum is used to prevent breakage of the substrate even under severe conditions where vibration and temperature change are sudden, Product reliability can be improved.
- the roughness is formed on the surface of the base layer, it is possible to shorten the manufacturing time of the printed circuit board, and to use a relatively inexpensive aluminum, thereby reducing the manufacturing cost have.
- the printed circuit board and the manufacturing method according to the present invention by applying the conventional lamination, plating, circuit forming method while reducing the manufacturing cost of the printed circuit board, it is possible to improve the strength of the power supply, heat dissipation, bending Is also obtained.
- 1 to 12 are schematic views for explaining a method of manufacturing a printed circuit board having a metal core layer when a via hole is formed according to an embodiment of the present invention.
- FIGS. 13 to 15 are schematic diagrams for describing a method of manufacturing a multilayer board using the printed circuit board manufactured in FIGS. 1 to 12.
- 17 and 17 are schematic diagrams for explaining a method of conducting a conductive layer of an inner layer in the multilayer substrate manufactured in FIGS. 13 to 15.
- 18 to 24 are schematic diagrams for describing a method of manufacturing a printed circuit board having a metal core layer when a via hole is not formed according to an embodiment of the present invention.
- 25 to 27 are schematic diagrams for describing a method of manufacturing a multilayer board using the printed circuit board manufactured in FIGS. 18 to 24.
- the metal core layer 101 ' is prepared.
- the metal core layer 101 ′ is formed of aluminum and may have a predetermined thickness.
- a core pattern 100 formed of one or more holes is formed in the metal core layer 101 ′.
- the core pattern 100 may be formed in a predetermined pattern or may be formed by arranging a plurality of holes regularly or irregularly.
- the core pattern 100 may serve to form a predetermined circuit pattern on the metal core layer 101 ′ by forming a predetermined pattern.
- the core pattern 100 allows the heat dissipation of the metal core layer 101 'to be smoothly performed.
- the core pattern 100 may be formed on the metal core layer 101 ′ by a chemical or mechanical method.
- the core pattern 100 may form a pattern on the metal core layer 101 'using chemical etching or the like.
- the core pattern 100 may form holes in the metal core layer 101 ′ by punching or the like.
- the base layer 103 ' is prepared.
- aluminum foil having a predetermined thickness may be used as the base layer 103 '.
- the base layers 103 are bonded to both sides of the metal core layer 101, respectively.
- the metal core layer 101 and the base layer 103 can be bonded using the bonding member 102.
- the bonding member 102 may use an epoxy-based adhesive sheet such as a polyimide insulating adhesive sheet or a glass epoxy resin, which is a bonding material having excellent adhesive performance and insulating function.
- the bonding member 102 may use a similar thermal expansion coefficient to the base layer 103.
- the polyimide can withstand a high temperature of 400 ° C or higher and a low temperature of -269 ° C, and thus can absorb the change rate according to the thermal expansion coefficient of aluminum (23.03 ⁇ 10 -6 / ° C).
- the base layer 103 can be heated to a predetermined temperature and bonded by applying a predetermined pressure.
- Surface treatment may be performed to form surface roughness on the base layer 103 ', respectively.
- a soft etching process is performed on the surface of the metal core layer 101 'on which no surface roughness is formed by using sulfuric acid, or an oxidation process is performed to form a predetermined surface roughness.
- a soft etching treatment or an oxidation treatment is performed on the surface of the base layer 103 'on which no surface roughness is formed to form a predetermined surface roughness.
- the via hole 104 may be formed by using a drill or laser processing.
- the metal layer 105 for metallizing the part of the bonding member 102 exposed in the inner surface of the via hole 104 is formed.
- the metal layer 105 may form a carbon plating layer using carbon direct plating.
- the base layers 103 formed on the upper and lower portions of the metal core layer 101 are electrically connected to each other.
- the metal layer 105 may electrically connect the metal core layer 101 and the base layer 103 to each other, as shown in FIG. 5. It is formed to be connected.
- a zinc coating is performed on the surface of the base layer 103 to form a substitution layer 106 having a predetermined thickness.
- the substitution layer 106 is formed by replacing a portion of the surface of the base layer 103 with a zinc film.
- the substitution layer 106 is formed in an area excluding the metal layer 105, that is, in the cross-sectional portions of the base layer 103 and the metal core layer 101 exposed in the surface of the base layer 103 and the inside of the via hole 104. do.
- the thickness of the substitution layer 106 is formed such that the thickness of the substitution layer 106 formed on the basis of the thickness of the metal layer 105 is equal to the thickness of the metal layer 105.
- the substitution layer 106 may be formed by replacing a part of the surface thickness of the base layer 103 as indicated by 106 ′ in FIG. 6.
- the present invention is not limited by the drawings, and the thickness of the substitution layer 106 and the thickness 106 ′ of the base layer 103 to be substituted may be substantially changed.
- the substitution layer 106 may be formed to prevent the aluminum from being oxidized in the air, thereby protecting the surface of the base layer 103.
- the substitution layer 106 may be formed to prevent the aluminum from being oxidized in the air, thereby protecting the surface of the base layer 103.
- by replacing the surface of the base layer 103 with a zinc film it is possible to prevent the surface of the base layer 103 from corroding during the electroless plating and electrolytic plating process to be performed later.
- a substitution plating layer 107 is formed on the substitution layer 106.
- the substitution plating layer 107 is formed on the surface of the metal layer 105 inside the via hole 104 as well as the substitution layer 106.
- the substitution plating layer 107 may use electrolytic plating or electroless plating.
- the substitution plating layer 107 may be formed on the substitution layer 106 by performing substitution plating with a metal film having strong chemical resistance.
- the substitution plating layer 107 may be formed by replacing the substitution layer 106 with a nickel film by performing substitution plating using nickel (Ni).
- Ni nickel
- the present invention is not limited only to nickel, and it is also possible to perform substitution plating with another metal having strong chemical resistance, for example, gold (Au) or silver (Ag).
- the present invention is not limited thereto, and the metal layer 105 and the substitution layer 106 are not limited thereto. ) May also be considered to be substituted by the substitution plating layer 107.
- the substitution plating layer 107 may be formed only on the substitution layer 106 except for the metal layer 105, or may be formed to cover some or all of the metal layer 105.
- an electroplating layer is formed on the substitution plating layer 107.
- the electroplating layer 108 is also formed on the substitution plating layer 107 in the via hole 104.
- the electroplating layer 108 may be a copper film by copper plating.
- the electrolytic plating layer 108 is formed using electrolytic plating.
- the thickness of the electroplating layer 108 may be formed to 20 ⁇ m or more.
- the metal layer 105 is formed to be covered by at least one of the substitution plating layer 107 and the electroplating layer 108.
- the substitution plating layer 107 is formed only on the substitution layer 106 except for the metal layer 105
- the electroplating layer 108 is formed to cover both the substitution plating layer 107 and the metal layer 105
- Only the electroplating layer 108 is formed on the metal layer 105.
- the substitution plating layer 107 is formed to cover a part of the metal layer 105
- the electroplating layer 108 is formed to cover both the substitution plating layer 107 and the metal layer 105.
- the electroplating layer 108 covers the substitution plating layer 107, and the substitution plating layer 107 and the electroplating layer 108 are disposed on the metal layer 105. Two layers of are formed.
- the substitution layer 106 may improve the bonding force between the base layer 103 and the plating layers 107 and 108. Therefore, the base layer 103, the substitution layer 106, and the plating layers 107 and 108 are effectively prevented from being separated from each other by vibration, and thus, the base layer 103, the substitution layer 106, and the plating layers 107 and 108 may be suitably used in an environment in which vibration is generated a lot.
- a dry film 109 is coated on the surface of the electroplating layer 108 to form a predetermined pattern 110.
- the pattern 110 of the dry film 109 is formed by printing a predetermined pattern on the dry film 109, exposing and developing for a predetermined time.
- the electroplating layer 108, the substitution plating layer 107, the substitution layer 106 and the base layer 104 are formed according to the pattern 110 of the dry film 109.
- a printed circuit board on which the circuit pattern 111 is formed.
- the circuit pattern 111 may be formed using hydrochloric acid-based acid etching based on the pattern 110 on the dry film 109.
- hydrochloric acid series ferric chloride, cupric chloride, sodium chlorate and the like can be used.
- the circuit pattern 110 may be formed not only by a chemical method using the dry film 109 and hydrochloric acid-based acid etching, but also by a mechanical method such as punching.
- the printed circuit board manufactured according to the present invention can be applied to automotive electronic parts and the like.
- an insulating layer 112 made of an insulator material is formed on the printed circuit board formed in FIGS. 1 to 12.
- the insulating layer 112 is formed to fill both the via hole 104 and the circuit pattern 111 in the printed circuit board.
- the base layer 114 is formed on the insulating layer 112, and the base layer 114 is formed on the upper and lower portions of the insulating layer 112, respectively.
- the base layer 114 may be an aluminum foil having a predetermined thickness.
- the base layer 114 forms a predetermined surface roughness by using a soft etching or oxidation treatment of sulfuric acid-based in order to improve the bonding performance of the surface.
- a bonding member 113 such as a polyimide insulating adhesive sheet or an epoxy series may be used.
- the base layer 114 is also subjected to a surface treatment to improve the surface roughness in order to improve the bonding force with the bonding member 113.
- the second via hole 115 is formed in the state where the insulating layer 112, the bonding member 113, and the base layer 114 are formed in the printed circuit board, and the metal layer 116 is formed.
- a predetermined circuit pattern 120 is formed using a dry film to form a multilayer board.
- the process of forming the second via hole 115 and forming the circuit pattern 120 is the same as described above with reference to FIGS. 4 to 12, and thus a detailed description thereof will be omitted.
- the circuit pattern 120 is formed by a chemical method using a dry film and using hydrochloric acid-based acid etching.
- the base layer 114, as well as the electroplating layer 119, the substitution plating layer 118, and the substitution layer 117, must be selectively removed, so that only some layers can be selectively removed. Use chemical methods.
- the substrate is formed by laminating two layers, but the present invention is not limited thereto, and the steps of FIG. 13 to FIG. 15 are repeated to form three or more layers of high multi-layer substrates. It is possible.
- a third via hole 121 for conduction is formed in the manufactured multilayer board.
- the third via hole 121 serves to electrically connect the circuit pattern of the printed circuit board formed therein and the circuit pattern of the printed circuit board stacked thereon.
- the third via hole 121 may have an electroplating layer 119, a substitution plating layer 118, a substitution layer 117, a base layer 114, a bonding member 113, and an insulating layer 112 on the laminated substrate.
- the electrolytic plating layer 108 on the printed circuit board formed therein is removed to expose all of them.
- the third via hole 121 may be formed using a drill or laser processing.
- a metal layer 122 is formed to metallize the surfaces of the insulating layer 112 and the bonding member 113 exposed into the formed third via hole 121 and sequentially.
- the substitution layer 123, the substitution plating layer 124, and the electroplating layer 125 are formed.
- the method of forming the metal layer 122, the substitution layer 123, the substitution plating layer 124, and the electroplating layer 125 is the same as described above with reference to FIGS. 5 to 8, and thus redundant descriptions thereof will be omitted.
- the metal layer 122 electrically connects the internal electroplating layer 108 and the external electroplating layer 119 to each other in the third via hole 121 to electrically connect the internal printed circuit board and the stacked printed circuit board. It acts as a connecting wire.
- the thicknesses of the substitution layer 123, the substitution plating layer 124, and the electroplating layer 125 formed in the third via hole 121 may include the substitution layer 117 and the substitution plating layer 118 formed on the stacked printed circuit board. And the same thickness as the electroplating layer 119.
- the substitution plating layer 123 and the electroplating layer 124 are formed to cover the metal layer 122.
- the substitution plating layer 123 is formed so as not to cover the metal layer 122
- the electroplating layer 124 is formed to cover the entire metal layer 122
- the substitution plating layer 123 is a part of the metal layer 122.
- the electroplating layer 124 is formed on the substitution plating layer 123. That is, the metal layer 122 is covered by at least one of the substitution plating layer 123 and the electroplating layer 124.
- a metal core layer 201 ′ formed of aluminum and having a predetermined thickness is prepared.
- a core pattern 200 formed of one or more holes is formed in the metal core layer 201 ′.
- the core pattern 200 may be formed in a predetermined pattern or may be formed by arranging a plurality of holes regularly or irregularly.
- the role of the core pattern 200 may serve to form a predetermined circuit pattern on the metal core layer 201 ′ by forming a predetermined pattern.
- the core pattern 200 allows the heat dissipation of the metal core layer 201 'to be smoothly performed.
- the core pattern 200 may be formed on the metal core layer 201 ′ by a chemical or mechanical method.
- the core pattern 200 may form a pattern on the metal core layer 201 'using chemical etching or the like.
- the core pattern 200 may form holes in the metal core layer 201 ′ by punching or the like.
- a base layer 203 ′ formed of aluminum foil having a predetermined thickness is formed.
- the base layers 203 are bonded to both sides of the metal core layer 201, respectively.
- the metal core layer 201 and the base layer 203 may be bonded using the bonding member 202.
- the joining member 202 may use a polyimide insulating adhesive sheet or an epoxy series.
- the metal core layer 201 'and the base layer 203' are provided.
- Surface treatment may be performed to form surface roughness, respectively.
- a soft etching process is performed on the surface of the metal core layer 201 ′ where no surface roughness is formed by using sulfuric acid, or an oxidation process is performed to form a predetermined surface roughness.
- a soft etching treatment or an oxidation treatment is performed on the surface of the base layer 203 'on which no surface roughness is formed to form a predetermined surface roughness.
- the dry film 204 is apply
- the circuit pattern 206 is formed by removing the base layer 203 based on the pattern 205 of the dry film 204, and as shown in FIG. 24.
- the printed circuit board is formed by removing the film 204.
- a direct circuit pattern is formed on the base layer 203 as an example, but the present invention is not limited thereto, and electrolytic plating or electroless plating is performed on the base layer 203. It is also possible to form a plating layer.
- circuit pattern 205 may be formed by a chemical method using hydrochloric acid-based acid etching using the dry film 204, or may be formed by a mechanical method using punching or the like.
- circuit pattern 204 may be formed only through-holes to connect the electrode or the metal layer in a predetermined form.
- 25 to 27 are schematic diagrams for describing a method of manufacturing a multilayer board using the printed circuit board manufactured in FIGS. 17 to 24.
- an insulating layer 207 having a predetermined thickness is formed to fill a circuit pattern 206 in the printed circuit board manufactured according to FIGS. 17 to 24.
- the base layer 209 is bonded to the insulating layer 207 using the bonding member 208.
- the base layer 209 is an aluminum foil having a predetermined thickness, and the bonding member 208 may use a polyimide insulating adhesive sheet or an epoxy series.
- the via hole 210 is formed to penetrate the printed circuit board on which the insulating layer 207, the bonding member 208, and the base layer 209 are formed.
- the via hole 210 may be formed using a drill or laser processing.
- the metal layer 211 is formed to metallize the insulating layer 207 and the cross-sectional portion of the bonding member 208 exposed into the via hole 210, and the substitution layer 212, the substitution plating layer 213, and the electroplating layer are formed. 214 is formed sequentially.
- the metal layer 211 is not formed only on the insulating layer 207 and the bonding member 208 so that the metal layer 211 can electrically connect the metal core layer 201 and the base layer 203 to each other.
- the insulating layer 207 and the bonding member 208 are formed to be connected to the metal core layer 201 and the base layer 303 disposed on both sides. At least one of the substitution plating layer 213 and the electroplating layer 214 is formed to cover the metal layer 211.
- the method of forming the metal layer 211, the substitution layer 212, the substitution plating layer 213, and the electroplating layer 214 is the same as described with reference to FIGS. 5 to 8, and thus, redundant descriptions thereof will be omitted.
- the predetermined circuit pattern 217 is formed using the dry film 215 on which the pattern is formed. ).
- the circuit pattern 217 may be formed by using the dry film 215 to remove the electrolytic plating layer 214, the substitution plating layer 213, the substitution layer 212, and the base layer 209 by using hydrochloric acid-based acid etching. Can be.
- the circuit pattern 217 is formed by a chemical method using a dry film and hydrochloric acid-based acid etching.
- the base layer 209, as well as the electrolytic plating layer 214, the substitution plating layer 213, and the substitution layer 212 should be selectively removed, so that only some layers may be selectively removed. Use the method.
- the substrate is formed by laminating in two layers, but the present invention is not limited thereto, and by repeating the steps described with reference to FIGS. 25 and 26, a multi-layer substrate having three or more layers is formed. It is possible to do Alternatively, as shown in FIG. 27, it is possible to form a high multilayer board by stacking two printed circuit boards manufactured according to FIGS. 17 to 24 up and down. Of course, it is possible to form three or more printed circuit boards by laminating three or more printed circuit boards in the manner described in FIG. Also in the case of the high-layer substrate illustrated in FIG. 27, as described with reference to FIGS.
- an insulating layer 207 is formed between the printed circuit boards and bonded to each other, and the bonding member 208 is formed on the insulating layer 207.
- the predetermined thickness is applied using the dry film 215.
- the circuit pattern 217 may be formed to form a high multilayer substrate.
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Abstract
Description
Claims (26)
- 알루미늄 재질로 형성된 코어부;상기 코어부의 양측면 상에 접합 형성되고 알루미늄 재질의 베이스층;상기 베이스층을 상기 코어부에 접합시키기 위해서 상기 코어부와 상기 베이스층 사이에 개재되는 접합 부재;상기 코어부와 상기 접합 부재 및 상기 베이스층을 관통하여 형성된 비아홀;상기 베이스층의 표면 및 상기 비아홀 내부로 노출된 부분을 아연화시키도록 형성된 치환층; 및상기 치환층 상에 형성되며 회로 패턴이 형성된 도금층;을 포함하는 인쇄회로기판.
- 제1항에 있어서,상기 비아홀 내부에서 상기 접합 부재가 노출되는 부분을 금속화시키기 위한 금속층이 형성되고,상기 치환층은 상기 금속층을 제외한 부분에 형성되며,상기 도금층은 상기 금속층도 덮도록 형성되는 인쇄회로기판.
- 제2항에 있어서,상기 도금층은 상기 치환층 표면에 전해 도금 또는 무전해 도금으로 형성되는 치환 도금층과, 상기 치환 도금층 상에 전해 도금으로 형성된 구리 재질의 전해 도금층으로 형성되는 인쇄회로기판.
- 제3항에 있어서,상기 치환 도금층은 상기 금속층을 제외한 상기 치환층 표면에 형성되거나 상기 금속층의 일부를 덮도록 형성되고,상기 전해 도금층은 상기 치환 도금층이 형성되지 않은 금속층 부분도 덮도록 형성되는 인쇄회로기판.
- 제1항에 있어서,상기 코어부는 일정 두께의 알루미늄 재질로 형성되고, 코어 패턴이 형성된 금속 코어층인 인쇄회로기판.
- 제1항에 있어서,상기 코어부는,일정 두께의 알루미늄 재질로 형성되고 코어 패턴이 형성된 금속 코어층;상기 금속 코어층의 양측면 상에 접합 형성되고 알루미늄 재질의 코어 베이스층; 및상기 코어 베이스층을 상기 금속 코어층에 접합시키기 위해서 상기 금속 코어층과 상기 코어 베이스층 사이에 개재되는 코어 접합 부재;를 포함하는 인쇄회로기판.
- 제6항에 있어서,상기 코어 베이스층 상에 형성된 회로 패턴을 더 포함하고,상기 코어 베이스층 상에 절연층이 형성되는 인쇄회로기판.
- 제7항에 있어서,상기 금속층은 상기 비아홀 내부에서 상기 접합 부재, 상기 코어 접합 부재 및 상기 절연층이 노출되는 부분을 금속화시키도록 형성되고,상기 도금층은 상기 금속층을 덮도록 형성된 인쇄회로기판.
- 제6항에 있어서,상기 코어부와 상기 접합 부재 사이에는 절연층이 더 형성되고,상기 비아홀 내부에서 상기 코어 접합 부재와 상기 접합 부재 및 상기 절연층이 노출되는 부분을 금속화시키기 위한 금속층이 형성되고,상기 치환층은 상기 금속층을 제외한 부분에 형성되고,상기 도금층은 상기 금속층도 덮도록 형성되는 인쇄회로기판.
- 제5항 또는 제6항에 있어서,상기 코어 패턴은 상기 금속 코어층을 관통하여 형성되는 하나 이상의 홀로 형성되고, 상기 홀이 패턴으로 형성되거나 규칙적 또는 불규칙적으로 홀이 배열되어 형성된 인쇄회로기판.
- 제10항에 있어서,상기 금속 코어층은 표면 조도를 형성하기 위한 표면처리를 수행하는 인쇄회로기판.
- 제1항에 있어서,상기 회로 패턴 상에 형성된 절연층;상기 절연층 상에 제2 접합 부재를 이용하여 접합되는 알루미늄 재질의 제2 베이스층;상기 제2 베이스층 표면을 아연화시키도록 형성된 제2 치환층; 및상기 제2 치환층 상에 형성되는 제2 도금층;을 포함하고,상기 절연층 내지 상기 제2 도금층이 1회 이상 반복 적층되어 형성되고,상기 절연층 내지 상기 제2 도금층을 모두 관통하는 제2 비아홀이 형성되는 인쇄회로기판.
- 제12항에 있어서,상기 제2 비아홀 내부에서 상기 접합 부재, 상기 절연층 및 상기 제2 접합 부재가 노출되는 부분을 금속화시키기 위한 제2 금속층이 형성되고,상기 제2 치환층은 상기 제2 금속층을 제외한 부분에 형성되며,상기 제2 도금층은 상기 제2 금속층도 덮도록 형성되는 인쇄회로기판.
- 제1항에 있어서,상기 코어부는,일정 두께의 알루미늄 재질로 형성되고 코어 패턴이 형성된 금속 코어층;상기 금속 코어층의 양측면 상에 각각 구비되는 코어 접합 부재;상기 코어 접합 부재를 이용하여 상기 금속 코어층 상에 접합 형성되고 알루미늄 재질의 코어 베이스층;상기 코어 베이스층 상에 각각 구비되는 제2 코어 접합 부재; 및상기 제2 코어 접합 부재를 이용하여 상기 코어 베이스층 상에 각각 접합되는 알루미늄 재질의 제2 코어 베이스층;을 포함하는 인쇄회로기판.
- 알루미늄 재질의 코어부를 제공하는 단계;상기 코어부 상에 접합 부재를 이용하여 소정 두께의 베이스층을 접합하는 단계;상기 코어부와 상기 접합 부재 및 상기 베이스층을 관통하여 비아홀을 형성하는 단계;상기 베이스층의 표면 및 상기 비아홀 내부에 노출된 부분을 아연화시켜서 치환층을 형성하는 단계;상기 치환층 상에 도금층을 형성하는 단계; 및상기 도금층 상에 소정의 회로 패턴을 형성하는 단계;를 포함하는 인쇄회로기판의 제조방법.
- 제15항에 있어서,상기 비아홀 내부에서 상기 접합 부재가 노출되는 부분을 금속화시키기 위한 금속층을 형성하는 단계를 더 포함하고,상기 치환층을 형성하는 단계는, 상기 금속층을 제외한 부분에 상기 치환층을 형성하며,상기 도금층을 형성하는 단계는, 상기 금속층도 덮도록 상기 도금층을 형성하는 인쇄회로기판의 제조방법.
- 제16항에 있어서,상기 도금층을 형성하는 단계는,상기 치환층 표면에 전해 도금 또는 무전해 도금으로 형성되는 치환 도금층을 형성하는 단계와, 상기 치환 도금층 상에 전해 도금으로 형성된 구리 재질의 전해 도금층을 형성하는 단계를 포함하는 인쇄회로기판의 제조방법.
- 제17항에 있어서,상기 치환 도금층은 상기 금속층을 제외한 상기 치환층 표면에 형성되거나 상기 금속층의 일부를 덮도록 형성되고,상기 전해 도금층은 상기 치환 도금층이 형성되지 않은 금속층 부분을 덮도록 형성되는 인쇄회로기판의 제조방법.
- 제15항에 있어서,상기 코어부는 일정 두께의 알루미늄 재질로 형성되고, 코어 패턴이 형성된 금속 코어층으로 형성되고,상기 금속 코어층의 표면 조도를 형성하기 위한 표면처리를 수행하는 단계를 더 포함하는 인쇄회로기판의 제조방법.
- 제15항에 있어서,상기 코어부를 제공하는 단계는,일정 두께의 알루미늄 재질로 형성된 금속 코어층을 제공하는 단계;상기 금속 코어층에 코어 패턴을 형성하는 단계; 및상기 코어 패턴이 형성된 금속 코어층의 양측면 상에 코어 접합 부재를 이용하여 알루미늄 재질의 코어 베이스층을 접합하는 단계;를 포함하여 형성되는 인쇄회로기판의 제조방법.
- 제20항에 있어서,상기 코어 베이스층 상에 제2 회로 패턴을 형성하는 단계; 및상기 코어 베이스층 상에 절연층을 제공하는 단계;를 더 포함하는 인쇄회로기판의 제조방법.
- 제20항에 있어서,상기 코어 베이스층 상에 각각 제2 코어 접합 부재를 이용하여 알루미늄 재질의 제2 코어 베이스층을 접합하는 단계;를 더 포함하는 인쇄회로기판의 제조방법.
- 제20항에 있어서,상기 회로 패턴을 채우도록 절연층을 형성하는 단계;상기 절연층 상에 제2 접합 부재를 이용하여 알루미늄 재질의 제2 베이스층을 접합하는 단계;상기 금속 코어층과 상기 접합 부재, 상기 베이스층, 상기 절연층, 상기 제2 접합 부재 및 상기 제2 베이스층을 관통하는 제2 비아홀을 형성하는 단계;상기 제2 비아홀 내부로 노출된 상기 접합 부재 및 상기 제2 접합 부재의 면을 금속화시키는 금속층을 형성하는 단계;상기 금속층을 제외하고, 상기 제2 베이스층의 표면 및 상기 제2 비아홀 내부로 노출된 상기 제2 베이스층, 상기 베이스층, 상기 절연층의 부분을 아연화시키는 표면 처리하여 치환층을 형성하는 단계;상기 치환층 상에 전해 도금 또는 무전해 도금을 이용하여 도금층을 형성하는 단계; 및상기 도금층 상에 회로 패턴을 형성하는 단계;를 더 포함하는 인쇄회로기판의 제조방법.
- 제19항 또는 제20항에 있어서,상기 코어 패턴은 상기 금속 코어층을 관통하여 형성되는 하나 이상의 홀로 형성되고, 상기 홀이 패턴으로 형성되거나 규칙적 또는 불규칙적으로 홀이 배열되어 형성된 인쇄회로기판의 제조방법.
- 제24항에 있어서,상기 금속 코어층의 표면 조도를 형성하기 위한 표면처리를 수행하는 단계를 더 포함하는 인쇄회로기판의 제조방법.
- 제15항에 있어서,상기 회로 패턴을 형성하여 예비 기판을 형성하는 단계;상기 회로 패턴이 형성된 상기 예비 기판을 2개 적층하는 단계;상기 적층된 예비 기판들 사이 및 상기 예비 기판의 최상단과 최하단에 절연층을 형성하는 단계;상기 절연층 상에 제2 접합 부재를 이용하여 알루미늄 재질의 제2 베이스층을 접합하는 단계;상기 적층된 예비 기판들과 상기 절연층 및 상기 제2 접합 부재 및 상기 제2 베이스층을 관통하는 비아홀을 형성하는 단계;상기 예비 기판의 접합 부재와 상기 제2 접합 부재에서 상기 비아홀 내부로 노출된 부분을 금속화시키는 금속층을 형성하는 단계;상기 금속층을 제외하고, 상기 제2 베이스층의 표면 및 상기 비아홀 내부로 노출된 상기 제2 베이스층, 상기 베이스층, 상기 절연층 부분을 아연화시키는 표면 처리하여 치환층을 형성하는 단계;상기 치환층 상에 전해 도금 또는 무전해 도금을 이용하여 도금층을 형성하는 단계; 및상기 도금층 상에 회로 패턴을 형성하는 단계;를 더 포함하는 인쇄회로기판의 제조방법.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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KR1020137032740A KR20150095959A (ko) | 2012-12-14 | 2013-12-06 | 인쇄회로기판 및 그 제조방법 |
CN201380065445.1A CN105191512B (zh) | 2012-12-14 | 2013-12-06 | 印刷电路板及其制造方法 |
EP13862689.0A EP2934073A4 (en) | 2012-12-14 | 2013-12-06 | CONDUCTOR PLATE AND METHOD FOR THE PRODUCTION THEREOF |
US14/736,407 US9788421B2 (en) | 2012-12-14 | 2015-06-11 | Printed circuit board and method of manufacturing same |
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KR1020120146263A KR20140077441A (ko) | 2012-12-14 | 2012-12-14 | 인쇄회로기판 및 그 제조방법 |
KR10-2012-0146263 | 2012-12-14 |
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US14/736,407 Continuation US9788421B2 (en) | 2012-12-14 | 2015-06-11 | Printed circuit board and method of manufacturing same |
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WO2014092386A1 true WO2014092386A1 (ko) | 2014-06-19 |
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PCT/KR2013/011248 WO2014092386A1 (ko) | 2012-12-14 | 2013-12-06 | 인쇄회로기판 및 그 제조방법 |
Country Status (5)
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US (1) | US9788421B2 (ko) |
EP (1) | EP2934073A4 (ko) |
KR (2) | KR20140077441A (ko) |
CN (1) | CN105191512B (ko) |
WO (1) | WO2014092386A1 (ko) |
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WO2017179748A1 (ko) * | 2016-04-15 | 2017-10-19 | 손경애 | 인쇄회로기판의 제조방법 및 그 방법에 의해 제조된 인쇄회로기판 |
JP6621781B2 (ja) * | 2017-08-10 | 2019-12-18 | 太陽誘電株式会社 | 集合プリント基板、プリント配線板の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050178669A1 (en) * | 2004-02-17 | 2005-08-18 | Strubbe John L. | Method of electroplating aluminum |
JP2007027618A (ja) * | 2005-07-21 | 2007-02-01 | Fuji Name Plate Kk | プリント配線板及びその製造方法 |
JP2007235015A (ja) * | 2006-03-03 | 2007-09-13 | Matsushita Electric Ind Co Ltd | 多層配線基板及びその製造方法 |
KR20090053628A (ko) * | 2007-11-23 | 2009-05-27 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP2012151176A (ja) * | 2011-01-17 | 2012-08-09 | Meito Densan Kk | アルミニウムを導電パターンとしたプリント配線基板、及びその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006347990A (ja) | 2005-06-20 | 2006-12-28 | Pola Chem Ind Inc | 爪用の抗真菌医薬組成物 |
EP2059380A1 (en) | 2006-09-08 | 2009-05-20 | CRC for Advanced Composite Structures Limited | Joining of concentric section polymer composite components |
KR100950916B1 (ko) * | 2008-05-06 | 2010-04-01 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 및 이에 의해 제조된인쇄회로기판 |
-
2012
- 2012-12-14 KR KR1020120146263A patent/KR20140077441A/ko unknown
-
2013
- 2013-12-06 CN CN201380065445.1A patent/CN105191512B/zh not_active Expired - Fee Related
- 2013-12-06 EP EP13862689.0A patent/EP2934073A4/en not_active Withdrawn
- 2013-12-06 KR KR1020137032740A patent/KR20150095959A/ko active IP Right Grant
- 2013-12-06 WO PCT/KR2013/011248 patent/WO2014092386A1/ko active Application Filing
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2015
- 2015-06-11 US US14/736,407 patent/US9788421B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050178669A1 (en) * | 2004-02-17 | 2005-08-18 | Strubbe John L. | Method of electroplating aluminum |
JP2007027618A (ja) * | 2005-07-21 | 2007-02-01 | Fuji Name Plate Kk | プリント配線板及びその製造方法 |
JP2007235015A (ja) * | 2006-03-03 | 2007-09-13 | Matsushita Electric Ind Co Ltd | 多層配線基板及びその製造方法 |
KR20090053628A (ko) * | 2007-11-23 | 2009-05-27 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP2012151176A (ja) * | 2011-01-17 | 2012-08-09 | Meito Densan Kk | アルミニウムを導電パターンとしたプリント配線基板、及びその製造方法 |
Also Published As
Publication number | Publication date |
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KR20150095959A (ko) | 2015-08-24 |
US20150282292A1 (en) | 2015-10-01 |
CN105191512A (zh) | 2015-12-23 |
CN105191512B (zh) | 2018-03-30 |
EP2934073A1 (en) | 2015-10-21 |
US9788421B2 (en) | 2017-10-10 |
EP2934073A4 (en) | 2016-08-17 |
KR20140077441A (ko) | 2014-06-24 |
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