WO2014075524A1 - 一种带晶片位置检测器的液体喷洒回收装置 - Google Patents

一种带晶片位置检测器的液体喷洒回收装置 Download PDF

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Publication number
WO2014075524A1
WO2014075524A1 PCT/CN2013/084950 CN2013084950W WO2014075524A1 WO 2014075524 A1 WO2014075524 A1 WO 2014075524A1 CN 2013084950 W CN2013084950 W CN 2013084950W WO 2014075524 A1 WO2014075524 A1 WO 2014075524A1
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WIPO (PCT)
Prior art keywords
wafer
support table
protective cover
spindle motor
liquid spray
Prior art date
Application number
PCT/CN2013/084950
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English (en)
French (fr)
Inventor
卢继奎
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沈阳芯源微电子设备有限公司
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Publication of WO2014075524A1 publication Critical patent/WO2014075524A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Definitions

  • Liquid spray recovery device with wafer position detector Liquid spray recovery device with wafer position detector
  • the present invention is in the field of wafer wet processing in the semiconductor industry, and more particularly to a liquid spray recovery apparatus for recovering a wafer position detector from a wafer. Background technique
  • the wet-processed wafer is held in a non-vacuum manner, and the wafer may be deflected by errors during the placement of the wafer in the support table, and the wafer is easily ejected when the support table is rotated, thereby posing a danger.
  • wet processing of wafers mostly uses corrosive liquids, which have an impact on equipment safety. Summary of the invention
  • the body spray recovery device can detect whether the position of the wafer on the support table is offset, and at the same time, an inner and outer shield is provided, and the liquid of the wafer is recovered by changing the lift state of the inner shield.
  • Another object of the present invention is to provide a liquid spray recovery apparatus.
  • the body spray recovery device can blow a shielding gas into the cavity to prevent corrosion of the spindle motor connected to the support table.
  • the invention includes an inner protective cover, an outer protective cover, a wafer detector, a support table, and a support
  • a support plate, a lifting cylinder, a telescopic cylinder, a bottom plate and a spindle motor wherein the support plate and the telescopic cylinder are respectively located below the bottom plate and respectively connected to the bottom plate, wherein the spindle motor is connected to the output end of the telescopic cylinder, and the output end of the spindle motor
  • a support table on which the wafer is placed is connected through the bottom plate, the support table on which the wafer is placed is driven to rotate by the spindle motor, and is driven to move up and down by the spindle motor through the telescopic cylinder;
  • the inner protective cover and the outer protective cover are inwardly directed
  • the outer layer is arranged on the outer periphery of the support table, the outer protective cover is mounted on the bottom plate, and the inner protective cover is connected with the output end of the lifting cylinder mounted on the support plate, and is driven to be lifted and lowered by the lifting cylinder; the inner protective cover And the top of the outer shield is provided with a
  • an exhaust ring is mounted on an output end of the spindle motor, and an air hole is formed on the exhaust ring in the axial direction to blow a gas into the inner cavity of the inner shield, and the air hole is connected to the air source;
  • the connection between the hole and the center of the wafer; the top of the inner shield and the outer shield are in the shape of a truncated cone, the inner hollow, the inner shield, the outer shield, the support platform and the spindle motor are
  • the invention has a pair of wafer detectors on the top of the outer protective cover. After the wafer is placed on the support table, the support table is lowered, and the light emitted by the wafer detector is blocked by the wafer. According to the intensity of the light blocked by the wafer, whether the wafer is placed or not can be determined.
  • the outer surface of the spindle motor connected to the support table has an exhaust ring, and the exhaust ring has not less than two air holes, and the clean and dry gas can be blown from the air holes, and the gas can be used for the cavity device. Play a protective role.
  • the present invention has a gas tube adjacent each wafer detector that can align the dry clean gas with the top of the wafer detector to protect the wafer detector.
  • the support table of the present invention can be lifted and lowered by a telescopic cylinder, and the wafer can be transferred to the support table by a robot.
  • Figure 1 is a schematic view showing the overall three-dimensional structure of the present invention.
  • Figure 2 is a cross-sectional view showing the structure of the present invention when the robot feeds the wafer;
  • Figure 3 is a cross-sectional view showing the structure of the support table in the working position of the present invention.
  • Figure 4 is a cross-sectional view showing the structure of the inner shield of the present invention in a raised position
  • 1A is the inner protective cover
  • 1B is the outer protective cover
  • 2 is the wafer
  • 3 is the wafer position detector
  • 4 is the support table
  • 5 is the exhaust ring
  • 6 is the guide column
  • 7 is the support plate
  • 8 is Lifting cylinder
  • 9 is a telescopic cylinder
  • 10 is a gas pipe
  • 11 is a bottom plate
  • 12 is a spindle motor
  • 13 is a connecting piece.
  • the present invention includes an inner protective cover 1A, an outer protective cover 1B, a wafer detector 3, a support table 4, an exhaust ring 5, a guide post 6, a support plate 7, and a lifting cylinder 8,
  • the output end of the spindle motor 12 is passed through the bottom plate 11 and connected to the support table 4 on which the wafer 2 is placed.
  • a plurality of stoppers for positioning the wafer 2 are uniformly distributed in the circumferential direction, and the wafer 2 is placed.
  • the support table 4 is driven to rotate by the spindle motor 12, and is driven to move up and down by the spindle motor 12 through the telescopic cylinder 9.
  • Inner protective cover 1A and outer protective cover IB are arranged on the outer periphery of the support table 4 from the inside to the outside, and the inner protective cover
  • the 1A and outer protective cover 1B has a frustum shape at the top and is hollow inside.
  • the inner protective cover 1A, the outer protective cover 1B, the support table 4 and the spindle motor 12 are concentrically arranged.
  • the top of the inner protective cover 1A and the outer protective cover 1B are provided with holes for lifting and lowering the support table 4, and the edge of the hole of the outer protective cover 1B is provided with a wafer detector 3 for detecting the position of the wafer 2; this embodiment is external
  • the edge of the hole in the layer shield 1B is provided with a pair of symmetrically disposed wafer detectors 3, and the connection between the two wafer detectors 3 passes through the holes and the center of the wafer 2; each wafer detector 3 is provided with a direction
  • the gas detector 10 of the dry cleaning gas is blown out from the top of the wafer detector 3, one end of the gas pipe 10 is in communication with the gas source, and the other end is bent toward the top of the wafer detector 3.
  • the outer shield 1B is mounted on the bottom plate 11, and the inner shield 1A is connected to the output end of the lift cylinder 8 mounted on the support plate 7 via the guide post 6, and is driven up and down by the lift cylinder 8.
  • An exhaust ring 5 is mounted on the output end of the spindle motor 12, and the exhaust ring 5 is provided with air holes for blowing gas into the inner cavity of the inner shield 1A in the axial direction, the air holes being at least two, each of which The air holes are all connected with the air source, and the clean and dry gas blown by the air holes enters the inner cavity of the inner protective cover 1A through the gap between the spindle motor 12 and the bottom plate 11, and these gases can protect the device of the cavity. .
  • the working principle of the invention is:
  • the robot places the wafer on the support table 4, the telescopic cylinder 9 contracts to lower the support table 4; and the wafer position detection while descending The light-emitting line of the device 3, one of the position detectors 3 emits light, and the other wafer position detector 3 receives light.
  • the wafer position detector 3 blocks the wafer 2. The size of the light is compared with the amount of light that is blocked when the wafer 2 is placed normally.
  • the crystal is The position of the sheet 2 on the support table 4 is deviated, and a signal is given to the control system (the control system of the present invention is prior art). If the two light contrasts are not biased, the position of the wafer 2 on the support table 4 is accurate. , you can proceed to the next process step.
  • the telescopic cylinder 9 is contracted to drive the support table 4 down to the lowest end.
  • the spindle motor 12 drives the support table 4 and the wafer 2 to rotate, and the external structure sprays the liquid on the surface of the wafer 2;
  • the support plate 7 is connected to the guide post 6, and the other end of the guide post 6 is connected to the inner shield la, and the lift cylinder 8 can smoothly control the ascending and descending state of the inner shield la.
  • the exhaust ring 5 sprays a clean and dry gas into the cavity to prevent the mist generated by the sprayed liquid from approaching the spindle motor 12, thereby protecting the spindle motor 12.
  • a gas pipe 10 beside the wafer position detector 3, when the liquid is sprayed onto the wafer 2, the liquid will splash on the wafer position detector 3, which will affect the intensity and emission direction of the light generated by the wafer position detector 3.
  • the wafer position detector 3 is caused to false alarm, and the gas blown by the air tube 10 can protect the wafer detector 3, preventing the liquid from affecting the intensity and emission direction of the light generated by the wafer position detector 3, thereby minimizing false alarms.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

一种带晶片位置检测器的液体喷洒回收装置，设有与升降气缸（8）连接的内层防护罩（1A），可以根据使用液体的不同选择上升或下降；外层防护罩（1B）上装有晶片位置检测器（3），可通过装有伸缩气缸（9）的支撑台（4）的升降来检测晶片的位置。当连接支撑台（4）的伸缩气缸（9）处于伸出状态时，支撑台（4）处于上位，可通过外部机械手将晶片放在支撑台（4）上，然后伸缩气缸（9）收缩，支撑台（4）下降，在下降过程中外层防护罩（1B）上装有晶片位置检测器（3）检测晶片的位置是否正确，当晶片位置出现偏差时，晶片位置检测器（3）发出信号。可以防止支撑台（4）旋转时将晶片甩出。在支撑台下方有一排气环（5），可以向腔体内排出保护气体，防止连接支撑台（4）的电机受腐蚀。

Description

一种带晶片位置检测器的液体喷洒回收装置
技术领域
本发明属于半导体行业晶片湿法处理领域， 具体地说是一种回收从晶片上甩落液 体的带晶片位置检测器的液体喷洒回收装置。 背景技术
目前， 湿法处理晶片采用非真空的方式夹持， 在晶片放置在支撑台的过程中可能 会因为误差将晶片放偏， 当支撑台旋转时晶片很容易被甩出， 从而产生危险。 另外， 湿法处理晶片大多采用腐蚀性液体， 会对设备安全产生影响。 发明内容
为了解决非真空方式夹持晶片存在因晶片放偏而被甩出的问题， 本发明的目的在 于提供一种液体喷洒回收装置。 该体喷洒回收装置可以检测晶片在支撑台上的位置是 否偏移， 同时设置内外防护罩， 通过改变内层防护罩的升降状态回收处理晶片的液体。
本发明的另一目的在于提供一种液体喷洒回收装置。 该体喷洒回收装置可以向腔 体内吹保护气体， 防止连接支撑台的主轴电机受腐蚀。
本发明的目的是通过以下技术方案来实现的：
本发明包括内层防护罩、 外层防护罩、 晶片检测器、 支撑台、 支
撑板、 升降气缸、 伸缩气缸、 底板及主轴电机， 其中支撑板及伸缩气缸分别位于 底板的下方、 并分别连接于底板上， 所述主轴电机连接于伸缩气缸的输出端， 主轴电 机的输出端由所述底板穿过、 连接有放置晶片的支撑台， 该放置晶片的支撑台由主轴 电机驱动旋转、 并随主轴电机通过伸缩气缸驱动升降； 所述内层防护罩及外层防护罩 由内向外依次设在支撑台的外围， 外层防护罩安装在所述底板上， 内层防护罩与安装 在支撑板上的升降气缸的输出端相连， 通过升降气缸驱动升降； 所述内层防护罩及外 层防护罩的顶部均开有供支撑台升降的孔， 在外层防护罩上孔的边缘设有检测晶片位 置的晶片检测器。
其中： 所述主轴电机的输出端上安装有排气环， 该排气环上沿轴向设有向内层防 护罩内部腔体吹出气体的气孔， 所述气孔与气源相连通； 所述气孔为至少两个， 每个 气孔均与气源相连通； 由所述气孔吹出的清洁干燥气体通过主轴电机与底板之间的间 隙进入内层防护罩内部腔体； 所述晶片检测器上设有向晶片检测器顶部吹出气体的气 管， 该气管的一端与气源相连通， 另一端向晶片检测器的顶部弯折； 所述外层防护罩 上孔的边缘设有一对对称设置的晶片检測器， 两个晶片检测器之间的连接经过所述孔 及晶片的圆心； 所述内层防护罩及外层防护罩的顶部均为锥台形， 内部中空， 内层防 护罩、 外层防护罩、 支撑台及主轴电机同心设置； 所述支撑台的边缘沿周向均布有多 个定位晶片的挡柱； 所述内层防护罩通过导柱与升降气缸的输出端相连。
本发明的优点与积极效果为：
1 .本发明在外层防护罩顶部有一对晶片检测器，晶片放在支撑台后，支撑台下降， 晶片检测器发出的光线会被晶片阻挡， 根据晶片阻挡的光线的强弱可以判定晶片是否 放平， 位置是否准确， 防止碎片； 内层防护罩通过导柱和支撑板与升降气缸相连， 外 层防护罩安置在内层防护罩外侧， 通过改变内层防护罩的升降状态可以控制从晶片甩 落液体的流向。
2. 本发明中与支撑台连接的主轴电机外圏有一排气环， 该排气环上有不少于两个 的气孔， 从气孔可以吹出清洁干燥的气体， 这些气体可以对腔体的器件起到保护作用。
3. 本发明在每个晶片检测器旁都有一个气管，该气管可以对准晶片检測器顶部吹 出干燥清洁的气体， 可以对晶片检测器起到保护的作用。
4. 本发明的支撑台可以通过伸缩气缸进行升降，可以釆用机械手将晶片传递到支 撑台。 附图说明
图 1为本发明的整体立体结构示意图；
图 2为本发明在机械手送晶片时的结构剖视图；
图 3为本发明支撑台处在工作位置的结构剖视图；
图 4为本发明内层防护罩处在上升位置的结构剖视图；
其中： 1A为内层防护罩， 1B为外层防护罩， 2为晶片， 3为晶片位置检测器， 4 为支撑台， 5为排气环， 6为导柱， 7为支撑板， 8为升降气缸， 9为伸缩气缸， 10为 气管， 11为底板， 12为主轴电机， 13为连接件。 具体实》式
下面结合附图对本发明作进一步详述。
如图 1、 图 2所示， 本发明包括内层防护罩 1A、 外层防护罩 1B、 晶片检測器 3、 支撑台 4、 排气环 5、 导柱 6、 支撑板 7、 升降气缸 8、 伸缩气缸 9、 气管 10、 底板 U 及主轴电机 12， 其中支撑板 7及伸缩气缸 9分别位于底板 11的下方、并分别连接于底 板 11上； 主轴电机 12通过连接件 13连接于伸缩气缸 9的输出端， 主轴电机 12的输 出端由所述底板 11穿过、 连接有放置晶片 2的支撑台 4, 在支撑台 4的边缘沿周向均 布有多个定位晶片 2的挡柱， 放置晶片 2的支撑台 4由主轴电机 12驱动旋转、 并随主 轴电机 12通过伸缩气缸 9驱动升降。
内层防护罩 1A及外层防护罩 IB由内向外依次设在支撑台 4的外围， 内层防护罩
1A及外层防护罩 1B的顶部均为锥台形， 内部中空， 内层防护罩 1A、 外层防护罩 1B、 支撑台 4及主轴电机 12同心设置。 内层防护罩 1A及外层防护罩 1B的顶部均开有供支 撑台 4升降的孔， 在外层防护罩 1B上孔的边缘设有检测晶片 2位置的晶片检測器 3 ; 本实施例是在外层防护罩 1B上孔的边缘设有一对对称设置的晶片检测器 3， 两个晶片 检测器 3之间的连接经过所述孔及晶片 2的圆心； 每个晶片检测器 3上均设有向晶片 检测器 3顶部吹出干燥清洁气体的气管 10， 该气管 10的一端与气源相连通，另一端向 晶片检测器 3的顶部弯折， 气管 10吹出的气体可以对晶片检测器 3起到保护的作用。
外层防护罩 1B安装在底板 11上， 内层防护罩 1A通过导柱 6与安装在支撑板 7 上的升降气缸 8的输出端相连， 通过升降气缸 8驱动升降。 在主轴电机 12的输出端上 安装有排气环 5，该排气环 5上沿轴向设有向内层防护罩 1A内部腔体吹出气体的气孔, 所述气孔为至少两个， 每个气孔均与气源相连通， 由所述气孔吹出的清洁干燥气体通 过主轴电机 12与底板 11之间的间隙进入内层防护罩 1A内部腔体， 这些气体可以对腔 体的器件起到保护作用。
本发明的工作原理为：
如图 1所示， 当伸缩气缸 9处于伸出状态时支撑台 4处于最高位置， 机械手将晶 片放置在支撑台 4上， 伸縮气缸 9收缩带动支撑台 4下降； 下降的同时一对晶片位置 检测器 3发 光线， 其中一个位置检测器 3发 光线， 另一晶片位置检测器 3接收光 线， 晶片 2下降时会挡住一对位置检测器 3中间的光线， 晶片位置检测器 3会将晶片 2 挡住的光线大小与晶片 2正常放置时挡住的光线大小进行对比， 如果有偏差则说明晶 片 2在支撑台 4上的位置有偏差， 会给控制系统 （本发明的控制系统为现有技术） 一 个信号进行报警， 如果两个光线对比无偏差则晶片 2在支撑台 4上的位置准确， 则可 以进行下一工艺步骤。
晶片 2准确放置在支撑台 4上后， 伸縮气缸 9收缩带动支撑台 4下降到最低端， 此时主轴电机 12带动支撑台 4和晶片 2旋转， 外部结构对晶片 2表面喷洒液体； 升降 气缸 8通过支撑板 7与导柱 6相连， 导柱 6的另一端与内层防护罩 la相连， 升降气缸 8可以平滑的来控制内层防护罩 la的上升下降状态。当内层防护罩 la处在下降状态时, 如图 3所示， 喷洒的液体会从内层防护罩 la外侧流出， 当内层防护罩 la处在上升状 态时喷洒的液体会从内层防护罩 la内侧流出， 如图 4所示。
在外部结构对晶片 2喷洒液体时， 排气环 5会给腔体内喷出洁净干燥的气体， 防 止喷洒的液体产生的雾靠近主轴电机 12， 从而对主轴电机 12起到保护的作用。另外在 晶片位置检测器 3的旁边有一气管 10， 在给晶片 2喷洒液体时， 液体会溅落在晶片位 置检測器 3上， 会影响晶片位置检测器 3产生的光线的强度和发射方向， 从而会引起 晶片位置检测器 3误报警， 气管 10吹出的气体可以对晶片检测器 3起到保护的作用， 防止液体影响晶片位置检测器 3产生的光线的强度和发射方向，从而尽量减少误报警。

Claims

权 利 要 求 书
1. 一种带晶片位置检测器的液体喷洒回收装置， 其特征在于： 包括内层防护罩 (1A)、外层防护罩（1B)、 晶片检测器（3)、支撑台（4)、 支撑板（7)、 升降气缸（8)、 伸缩气缸 （9)、 底板 （ID 及主轴电机 （12)， 其中支撑板 （7) 及伸缩气缸 （9) 分别 位于底板 （11) 的下方、 并分别连接于底板 （11) 上， 所述主轴电机 （12) 连接于伸 缩气缸 （9) 的输出端， 主轴电机 （12) 的输出端由所述底板 （11) 穿过、 连接有放置 晶片 （2) 的支撑台 (4), 该放置晶片 （2) 的支撑台 （4) 由主轴电机（12)驱动旋转、 并随主轴电机 （12)通过伸缩气缸 （9) 驱动升降； 所述内层防护罩 （1A) 及外层防护 罩（1B)由内向外依次设在支撑台（4)的外围，外层防护罩（1B)安装在所述底板（11) 上， 内层防护罩 （1A) 与安装在支撑板 （7) 上的升降气缸 （8) 的输出端相连， 通过 升降气缸 （8) 驱动升降； 所述内层防护罩 （1A) 及外层防护罩 （1B) 的顶部均开有供 支撑台 （4) 升降的孔， 在外层防护罩 （1B) 上孔的边缘设有检测晶片 （2) 位置的晶 片检測器 （3)。
2. 按权利要求 1所述液体喷洒回收装置， 其特征在于： 所述主轴电机（12) 的输 出端上安装有排气环 （5)， 该排气环 （5) 上沿轴向设有向内层防护罩 （1A) 内部腔体 吹出气体的气孔， 所述气孔与气源相连通。
3. 按权利要求 2所述液体喷洒回收装置， 其特征在于： 所述气孔为至少两个， 每 个气孔均与气源相连通； 由所述气孔吹出的清洁干燥气体通过主轴电机 （12) 与底板
(11) 之间的间隙进入内层防护罩 （1A) 内部腔体。
4. 按权利要求 1或 2所述液体喷洒回收装置， 其特征在于： 所述晶片检测器（3) 上设有向晶片检测器 （3) 顶部吹出气体的气管 （10)， 该气管 （10) 的一端与气源相 连通， 另一端对准晶片检测器 (3)顶端。
5. 按权利要求 1或 2所述液体喷洒回收装置，其特征在于：所述外层防护罩（1B) 上孔的边缘设有一对对称设置的晶片检测器 （3)， 两个晶片检测器 （3)之间的连接线 经过所述孔及晶片 （2) 的圆心。
6. 按权利要求 1或 2所述液体喷洒回收装置，其特征在于：所述内层防护罩（1A) 及外层防护罩（IB)的顶部均为锥台形， 内部中空， 内层防护罩（1A)、外层防护罩（1B)、 支撑台 （4) 及主轴电机 （12) 同心设置。
7. 按权利要求 1或 2所述液体喷洒回收装置， 其特征在于： 所述支撑台 （4) 的 边缘沿周向均布有多个定位晶片 （2) 的挡柱。
8. 按权利要求 1或 2所述液体喷洒回收装置，其特征在于：所述内层防护罩（1A) 通过导柱 （6) 与升降气缸 （8) 的输出端相连。
PCT/CN2013/084950 2012-11-13 2013-10-10 一种带晶片位置检测器的液体喷洒回收装置 WO2014075524A1 (zh)

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