WO2014059684A1 - 掩膜板、制造有机发光显示面板的蒸镀装置及其方法 - Google Patents

掩膜板、制造有机发光显示面板的蒸镀装置及其方法 Download PDF

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WO2014059684A1
WO2014059684A1 PCT/CN2012/083294 CN2012083294W WO2014059684A1 WO 2014059684 A1 WO2014059684 A1 WO 2014059684A1 CN 2012083294 W CN2012083294 W CN 2012083294W WO 2014059684 A1 WO2014059684 A1 WO 2014059684A1
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open area
mask
open
organic light
vapor deposition
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English (en)
French (fr)
Inventor
吴泰必
吴元均
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/697,003 priority Critical patent/US20140147964A1/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a mask, an evaporation device for manufacturing the organic light-emitting display panel, and a method thereof.
  • Organic Light Emitting Display Panel (Organic Light-Emitting) Diode, OLED) is an autonomous display panel with simple structure and power saving.
  • FIG. 1 is a schematic structural view of a mask in the prior art
  • FIG. 2 is a schematic view of an open area of the mask shown in FIG. 1.
  • the mask 100 includes a plurality of open regions 110 distributed in an array, each of the open regions 110 having a rounded rectangular shape, and the region between the adjacent two rounded corners R is film-forming. Guarantee area 120.
  • the organic light-emitting material provided by the evaporation source is easily formed in the corresponding film formation due to the difference in the angle between the evaporation source and the opening region 110 at different positions.
  • the film formation filling rate at the region 120 is not ensured to be insufficient, so that each of the light-emitting regions of the organic light-emitting layer of the organic light-emitting display panel forms a film-forming ineffective region having a height H1 of 15 ⁇ m or more at the corresponding film-forming non-guaranteed region 120.
  • the aperture ratio of the organic light emitting display panel is lowered.
  • the technical problem to be solved by the present invention is to provide a mask, an evaporation device for manufacturing an organic light-emitting display panel, and a method thereof, to reduce the area of the film-forming ineffective region, and to improve the aperture ratio of the organic light-emitting display panel.
  • a technical solution adopted by the present invention is to provide a mask comprising a plurality of open areas distributed in an array, each open area including a first open area arranged in a rectangular shape and disposed on the first a second open area of the four corners of the open area, the second open area being in communication with the first open area.
  • the second open area is a side wing that communicates with the first open area, and the width of the side wings is gradually decreased along a direction away from the first open area.
  • the second open area is formed by etching or electroforming.
  • the second opening area is integrally formed with the first opening area.
  • the material of the mask is metal or iron-nickel alloy.
  • an evaporation device for manufacturing an organic light emitting display panel comprising: a mask plate comprising a plurality of open regions distributed in an array, and each opening The area includes a first open area disposed in a rectangular shape and a second open area disposed at four corners of the first open area, the second open area is in communication with the first open area; and the evaporation source is spaced apart from the substrate One side for providing an organic light-emitting material to the substrate to form an organic light-emitting layer; and a heating device for heating the evaporation source.
  • the vapor deposition device is installed in a vacuum and a sealed space.
  • the second open area is a side wing that communicates with the first open area, and the width of the side wings is gradually decreased along a direction away from the first open area.
  • the second open area is formed by etching or electroforming.
  • the second opening area is integrally formed with the first opening area.
  • the material of the mask is metal or iron-nickel alloy.
  • an evaporation method for manufacturing an organic light emitting display panel comprising: providing a mask, the mask comprising a plurality of open regions distributed in an array, And each of the open areas includes a first open area disposed in a rectangular shape and a second open area disposed at four corners of the first open area, the second open area is in communication with the first open area; providing a substrate and a mask Adjacent bonding arrangement; in a vacuum and a sealed space, an organic light emitting material is formed by providing an organic light emitting material to the substrate through an open area of the mask, and the organic light emitting material is provided by an evaporation source disposed on a side of the mask away from the substrate .
  • the second open area is a side wing that communicates with the first open area, and the width of the side wings is gradually decreased along a direction away from the first open area.
  • the material of the mask is metal or iron-nickel alloy.
  • the second open area is formed by etching or electroforming.
  • the second opening area is integrally formed with the first opening area.
  • the present invention has the effect of the rounding of the film-unguaranteed area on the film filling rate by providing the second opening area on the side of the rectangular first opening area of the mask.
  • the transfer to the second opening region improves the film filling filling rate of the first opening region at the time of vapor deposition film formation, thereby reducing the area of the film forming ineffective region, thereby improving the aperture ratio of the organic light emitting display panel.
  • FIG. 1 is a schematic structural view of a mask in the prior art
  • Figure 2 is a schematic view of the open area of the mask shown in Figure 1;
  • Figure 3 is a schematic structural view of a mask of the present invention.
  • Figure 4 is a schematic view of the open area of the mask shown in Figure 3;
  • FIG. 5 is a schematic structural view of an evaporation device for manufacturing an organic light emitting display panel according to the present invention.
  • FIG. 6 is a flow chart of a vapor deposition method for fabricating an organic light emitting display panel of the present invention
  • Fig. 7 is a view showing the effect of the evaporation method of the organic light-emitting display panel of the present invention.
  • FIG. 3 is a schematic structural view of a mask of the present invention
  • FIG. 4 is a schematic view of an open area of the mask shown in FIG.
  • the mask 300 includes a plurality of open regions 310 distributed in an array.
  • Each of the open areas 310 includes a first open area 311 and a second open area 312.
  • the first opening area 311 is disposed in a rectangular shape
  • the second opening area 312 is disposed at four corners of the first opening area 311, that is, the second opening area 312 constitutes a side wing communicating with the first opening area 311, and each second opening area
  • the width of the 312 setting gradually decreases in a direction away from the first opening area 311.
  • the second opening region 312 is integrally formed with the first opening region 311 and is formed by an etching or electroforming process.
  • the material of the mask 300 may be any suitable material, and the magnetic material having high structural strength or low expansion coefficient is preferred.
  • the mask 300 may be made of various metals or alloys. For example, it is an iron-nickel alloy (Invar).
  • Fig. 5 is a schematic view showing the structure of an evaporation apparatus using the mask 300 shown in Fig. 3.
  • the vapor deposition apparatus 600 includes a mask 300, a vapor deposition source 620, and a heating device 630.
  • the vapor deposition device 600 is configured to perform a vapor deposition process on the substrate 640 placed on the mask 300.
  • the heating device 630 is used to heat the evaporation source 620.
  • the vapor deposition source 620 is disposed in parallel with the mask plate 300 for
  • the substrate 640 is provided with an organic light-emitting material after reaching a certain temperature to form an organic light-emitting layer of the organic light-emitting display panel on the substrate 640.
  • the vapor deposition apparatus 600 must be installed in the vacuum-tight space at the time of vapor deposition film formation.
  • Fig. 6 is a flow chart showing a vapor deposition method for manufacturing an organic light-emitting display panel using the vapor deposition device 600 shown in Fig. 5.
  • the evaporation method for manufacturing an organic light emitting display panel of the present invention comprises the following steps:
  • Step S101 providing a mask, the mask panel includes a plurality of open regions distributed in an array, and each of the open regions includes a first open region disposed in a rectangular shape and a second opening disposed at four corners of the first open region An open area, the second open area is in communication with the first open area.
  • Step S102 providing a substrate disposed adjacent to the mask.
  • Step S103 providing an organic light-emitting material to the substrate through the open area of the mask to form an organic light-emitting layer in a vacuum and a sealed space, wherein the organic light-emitting material is provided by an evaporation source disposed on a side of the mask away from the substrate .
  • the evaporation source 620 is placed in a vacuum and sealed space adjacent to the heating device 630. Then, the heating device 630 is turned on to heat the vapor deposition source 620, and impurities on the surface of the vapor deposition source 620 are removed by evaporation. It is worth noting that during the heating process, the temperature for controlling the heat removal is lower than the temperature required for the evaporation to avoid waste due to excessive evaporation of the evaporation source 620 due to excessive temperature.
  • the vapor deposition source 620 after the impurity removal is moved to another vacuum-tight space, such as a vapor deposition chamber.
  • the evaporation source 620 is continuously heated in a high temperature state by using the heating device 630. After the evaporation source 620 reaches a certain temperature, the organic luminescent material particles are evaporated, and a part of the organic luminescent material particles pass through the open region 310 of the mask 300. And after being exposed to the lower temperature substrate 640, it is deposited in a crystalline state, and another portion of the organic luminescent material particles are deposited in a crystalline state after being exposed to the lower temperature mask 300.
  • the present invention provides a second open area 312 on both sides of the rectangular first open area 311 for each open area 310 by changing the opening design of the mask 300, and two of the film formation non-guaranteed areas 320 are formed.
  • the rounded corners R1 are disposed in the second opening region 312 such that when the organic light-emitting material particles are deposited on the substrate 640 through the first opening region 311, the rounded corner R shown in FIG. 2 is not formed, thereby increasing the opening region 310.
  • the film formation filling ratio at the time of vapor deposition film formation reduces the area of the film formation ineffective region.
  • Fig. 7 is a view showing the effect of the evaporation method of the organic light-emitting display panel of the present invention.
  • the present invention can reduce the film formation dead zone from more than 15 micrometers in the prior art to 5-10 micrometers (as indicated by H2), thereby increasing the aperture ratio of the organic light emitting display panel.
  • the shape of the second opening region 312 is not limited to the embodiment shown in FIG. 4, and the opening ratio of the organic light-emitting display panel may be increased as long as the area of the film-forming ineffective region can be reduced.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种掩膜板（300）、制造有机发光显示面板的蒸镀装置及其方法。掩膜板（300）包括呈阵列状分布的多个开口区（310），其中每一开口区（310）包括呈矩阵设置的第一开口区（311）以及设置于第一开口区（311）的四个角的第二开口区（312），第二开口区（312）与第一开口区（311）连通。通过改变掩膜板（300）的开口区（310）设计，降低开口区（310）的成膜无效区的面积，从而提高有机发光显示面板的开口率。

Description

掩膜板、制造有机发光显示面板的蒸镀装置及其方法
【技术领域】
本发明涉及显示技术领域，具体而言涉及一种掩膜板、制造有机发光显示面板的蒸镀装置及其方法。
【背景技术】
有机发光显示面板（Organic Light-Emitting Diode，OLED）是一种自主发光的显示面板，其具备结构简单、省电等特性。
目前，制备有机发光显示面板的过程中，掩膜板（Shadow Mask）是其中不可缺少的一个辅助元件，图1是现有技术中掩膜板的结构示意图，图2是图1所示掩膜板的开口区的示意图。参阅图1和图2，掩膜板100包括呈阵列状分布的多个开口区110，每一开口区110呈圆角矩形，且相邻的两个圆角R之间的区域为成膜不保证区120。
在使用掩膜板100蒸镀形成有机发光显示面板的有机发光层时，由于蒸镀源与不同位置的开口区110具有的角度差异，极易使得蒸镀源提供的有机发光材料在对应成膜不保证区120处的成膜填充率不足，从而导致有机发光显示面板的有机发光层的每一发光区在对应成膜不保证区120处形成高度H1为15微米以上的成膜无效区，进而降低有机发光显示面板的开口率。
综上所述，有必要提供一种掩膜板、制造有机发光显示面板的蒸镀装置及其方法，以解决上述问题。
【发明内容】
本发明主要解决的技术问题是提供一种掩膜板、制造有机发光显示面板的蒸镀装置及其方法，以降低成膜无效区的面积，提高有机发光显示面板的开口率。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种掩膜板，包括呈阵列状分布的多个开口区，每一开口区包括呈矩形设置的第一开口区以及设置于第一开口区的四个角的第二开口区，第二开口区与第一开口区连通。
其中，第二开口区是与第一开口区连通的侧翼，侧翼设置的宽度沿着远离第一开口区的方向逐渐减小。
其中，第二开口区采用蚀刻或电铸工艺成型。
其中，第二开口区与第一开口区一体成型。
其中，掩膜板的材质为金属或铁镍合金。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种制造有机发光显示面板的蒸镀装置，包括：掩膜板，包括呈阵列状分布的多个开口区，且每一开口区包括呈矩形设置的第一开口区以及设置于第一开口区的四个角的第二开口区，第二开口区与第一开口区连通；蒸镀源，间隔设置于掩膜板远离基板的一侧，用于为基板提供有机发光材料，以形成有机发光层；以及加热装置，用于加热蒸镀源。
其中，蒸镀装置设置于真空且密闭的空间内。
其中，第二开口区是与第一开口区连通的侧翼，侧翼设置的宽度沿着远离第一开口区的方向逐渐减小。
其中，第二开口区采用蚀刻或电铸工艺成型。
其中，第二开口区与第一开口区一体成型。
其中，掩膜板的材质为金属或铁镍合金。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种制造有机发光显示面板的蒸镀方法，包括：提供一掩膜板，掩膜板包括呈阵列分布的多个开口区，且每一开口区包括呈矩形设置的第一开口区以及设置于第一开口区的四个角的第二开口区，第二开口区与第一开口区连通；提供一基板，与掩膜板相邻贴合设置；在真空且密闭的空间内，通过掩膜板的开口区向基板提供有机发光材料形成有机发光层，有机发光材料由设置于掩膜板远离基板一侧的蒸镀源提供。
其中，第二开口区是与第一开口区连通的侧翼，侧翼设置的宽度沿着远离第一开口区的方向逐渐减小。
其中，掩膜板的材质为金属或铁镍合金。
其中，第二开口区采用蚀刻或电铸工艺成型。
其中，第二开口区与第一开口区一体成型。
本发明的有益效果是：区别于现有技术，本发明通过在掩膜板的矩形第一开口区的侧翼设置第二开口区，将成膜不保证区的圆角对成膜填充率的影响转移到第二开口区，提高了第一开口区在蒸镀成膜时的成膜填充率，从而降低了成膜无效区的面积，进而提高了有机发光显示面板的开口率。
【附图说明】
图1是现有技术中掩膜板的结构示意图；
图2是图1所示掩膜板的开口区的示意图；
图3是本发明掩膜板的结构示意图；
图4是图3所示掩膜板的开口区的示意图；
图5是本发明制造有机发光显示面板的蒸镀装置的结构示意图；
图6是本发明制造有机发光显示面板的蒸镀方法的流程图；
图7是本发明制造有机发光显示面板的蒸镀方法的实施效果示意图。
【具体实施方式】
下面结合附图和实施例对本发明进行详细说明。
图3是本发明掩膜板的结构示意图，图4是图3所示掩膜板的开口区的示意图。参阅图3和图4，掩膜板300包括呈阵列状分布的多个开口区310。
其中，每一开口区310包括：第一开口区311和第二开口区312。第一开口区311呈矩形设置，第二开口区312设置于第一开口区311的四个角，即第二开口区312构成与第一开口区311连通的侧翼，并且每一第二开口区312设置的宽度沿着远离第一开口区311的方向逐渐减小。
在本实施例中，第二开口区312与第一开口区311一体成型，且采用蚀刻或电铸工艺成型。基于此，掩膜板300的材质可以为任何合适的材料，并以具有高结构强度或低膨胀系数的磁性材料为佳，举例而言，掩膜板300的材质可以为各式金属或合金，例如为铁镍合金（Invar）。
图5是采用图3所示掩膜板300的蒸镀装置的结构示意图。如图5所示，蒸镀装置600包括：掩膜板300、蒸镀源620以及加热装置630。
蒸镀装置600用于对放置于掩膜板300上的基板640进行蒸镀处理，其中，加热装置630用于加热蒸镀源620，蒸镀源620与掩膜板300平行间隔设置，用于在达到一定温度后为基板640提供有机发光材料，以在基板640上形成有机发光显示面板的有机发光层。需要说明的是，蒸镀装置600在蒸镀成膜时，必须设置于真空密闭的空间内。
图6是采用图5所示蒸镀装置600制造有机发光显示面板的蒸镀方法的流程图。如图6所示，本发明制造有机发光显示面板的蒸镀方法包括以下步骤：
步骤S101：提供一掩膜板，掩膜板包括呈阵列分布的多个开口区，且每一开口区包括呈矩形设置的第一开口区以及设置于第一开口区的四个角的第二开口区，第二开口区与第一开口区连通。
步骤S102：提供一基板，与掩膜板相邻设置。
步骤S103：在真空且密闭的空间内，通过掩膜板的开口区向基板提供有机发光材料以形成有机发光层，其中，有机发光材料由设置于掩膜板远离基板一侧的蒸镀源提供。
下面结合图5和图6，详细说明采用图3所示的掩膜板300制造有机发光显示面板的蒸镀过程：
首先，将蒸镀源620设置于一真空且密闭的空间内，且相邻于加热装置630。然后，开启加热装置630对蒸镀源620进行加热，通过蒸发除去蒸镀源620表面的杂质。值得注意的是，在加热过程中，控制加热除杂的温度低于蒸镀所需的温度，以避免因温度过高使蒸镀源620过度蒸发造成浪费。
将除杂之后的蒸镀源620移至另一真空密闭的空间内，例如蒸镀室。使用加热装置630在高温状态下对蒸镀源620进行持续性加热，蒸镀源620在达到一定温度后蒸发出有机发光材料粒子，一部分的有机发光材料粒子穿过掩膜板300的开口区310，并在接触到温度较低的基板640后以结晶状态沉积，另一部分的有机发光材料粒子在接触到温度较低的掩膜板300后以结晶状态沉积。
综上所述，本发明通过改变掩膜板300的开口设计，对于每一开口区310，在矩形第一开口区311的两侧设置第二开口区312，将成膜不保证区320的两个圆角R1设置在第二开口区312，使得有机发光材料粒子穿过第一开口区311在基板640上沉积时，不会形成图2所示的圆角R，由此提高了开口区310在蒸镀成膜时的成膜填充率，降低成膜无效区的面积。
图7是本发明制造有机发光显示面板的蒸镀方法的实施效果示意图。如图7所示，本发明能够使成膜无效区从现有技术的大于15微米降低至5~10微米（如H2所示），进而提高了有机发光显示面板的开口率。需要说明的是，第二开口区312的形状并不限定于图4所示的实施例，只要能够降低成膜无效区的面积，提高有机发光显示面板的开口率即可。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (16)

  1. 一种掩膜板，其中，所述掩膜板包括呈阵列状分布的多个开口区，其中，每一所述开口区包括：
    呈矩形设置的第一开口区以及设置于所述第一开口区的四个角的第二开口区，所述第二开口区与所述第一开口区连通。
  2. 根据权利要求1所述的掩膜板，其中，所述第二开口区是与所述第一开口区连通的侧翼，所述侧翼设置的宽度沿着远离所述第一开口区的方向逐渐减小。
  3. 根据权利要求2所述的掩膜板，其中，所述第二开口区采用蚀刻或电铸工艺成型。
  4. 根据权利要求3所述的掩膜板，其中，所述第二开口区与所述第一开口区一体成型。
  5. 根据权利要求4所述的掩膜板，其中，所述掩膜板的材质为金属或铁镍合金。
  6. 一种制造有机发光显示面板的蒸镀装置，其中，所述蒸镀装置包括：
    掩膜板，包括呈阵列状分布的多个开口区，且每一所述开口区包括呈矩形设置的第一开口区以及设置于所述第一开口区的四个角的第二开口区，所述第二开口区与所述第一开口区连通；
    蒸镀源，间隔设置于所述掩膜板的一侧，用于提供有机发光材料，以形成有机发光层；以及
    加热装置，用于加热所述蒸镀源。
  7. 根据权利要求6所述的蒸镀装置，其中，所述蒸镀装置设置于真空且密闭的空间内。
  8. 根据权利要求6所述的蒸镀装置，其中，所述第二开口区是与所述第一开口区连通的侧翼，所述侧翼设置的宽度沿着远离所述第一开口区的方向逐渐减小。
  9. 根据权利要求8所述的蒸镀装置，其中，所述第二开口区采用蚀刻或电铸工艺成型。
  10. 根据权利要求9所述的蒸镀装置，其中，所述第二开口区与所述第一开口区一体成型。
  11. 根据权利要求10所述的蒸镀装置，其中，所述掩膜板的材质为金属或铁镍合金。
  12. 一种制造有机发光显示面板的蒸镀方法，其中，所述蒸镀方法包括：
    提供一掩膜板，所述掩膜板包括呈阵列分布的多个开口区，且每一所述开口区包括呈矩形设置的第一开口区以及设置于所述第一开口区的四个角的第二开口区，所述第二开口区与所述第一开口区连通；
    提供一基板，与所述掩膜板相邻设置；
    在真空且密闭的空间内，通过所述掩膜板的所述开口区向所述基板提供有机发光材料形成有机发光层，所述有机发光材料由设置于所述掩膜板远离所述基板一侧的蒸镀源提供。
  13. 根据权利要求12所述的蒸镀方法，其中，所述第二开口区是与所述第一开口区连通的侧翼，所述侧翼设置的宽度沿着远离所述第一开口区的方向逐渐减小。
  14. 根据权利要求13所述的蒸镀方法，其中，所述掩膜板的材质为金属或铁镍合金。
  15. 根据权利要求12所述的蒸镀方法，其中，所述第二开口区采用蚀刻或电铸工艺成型。
  16. 根据权利要求15所述的蒸镀方法，其中，所述第二开口区与所述第一开口区一体成型。
PCT/CN2012/083294 2012-10-17 2012-10-22 掩膜板、制造有机发光显示面板的蒸镀装置及其方法 Ceased WO2014059684A1 (zh)

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