WO2020113751A1 - 一种掩膜板 - Google Patents

一种掩膜板 Download PDF

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Publication number
WO2020113751A1
WO2020113751A1 PCT/CN2019/070150 CN2019070150W WO2020113751A1 WO 2020113751 A1 WO2020113751 A1 WO 2020113751A1 CN 2019070150 W CN2019070150 W CN 2019070150W WO 2020113751 A1 WO2020113751 A1 WO 2020113751A1
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WO
WIPO (PCT)
Prior art keywords
area
evaporation
mask
areas
shielding
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PCT/CN2019/070150
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English (en)
French (fr)
Inventor
叶剑
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/488,589 priority Critical patent/US20210336147A1/en
Publication of WO2020113751A1 publication Critical patent/WO2020113751A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Definitions

  • the invention relates to the technical field of display, in particular to a mask.
  • the screen ratio of the entire electronic device is required to be higher and higher.
  • the aspect ratio of the mobile phone screen has increased from the existing 16:9 to the current mainstream 18:9, 18.5:9, 19.5:9, and 20:9.
  • OLED manufacturing methods are generally manufactured by vacuum evaporation method.
  • the organic light-emitting material is heated in the crucible and changes from solid state to gas state, and then through the opening of the fine metal mask FMM
  • the hole is deposited in the corresponding sub-pixel area in the array substrate, that is, the area defined by the pixel definition layer (Pixel Definition Layer, PDL).
  • the FMM is provided with openings corresponding one-to-one to the R/G/B sub-pixels.
  • the current FMM manufacturing method is mainly a wet etching process.
  • a pattern with a specific opening size that is, a photo mask (PhotoMask)
  • PhotoMask a photo mask
  • the corresponding FMM is made by the opening, that is, the corresponding opening needs to be made in the sub-pixel area, and the production cost of the pattern is usually relatively high and the cost is high. That is, the manufacturing cost of the fine metal mask FMM is relatively high, thereby increasing the production cost.
  • the FMM needs to be remade to make the opening correspond to the new display area, which reduces flexibility.
  • the purpose of the present invention is to provide a mask plate, which can reduce production costs and increase flexibility.
  • the present invention provides a mask, which includes:
  • a shielding body includes a plurality of first shielding strips arranged in a first direction and a plurality of second shielding strips arranged in a second direction, the ends of the first shielding strips and The ends of the second shielding strips are all fixed on the frame; a plurality of the first shielding strips and a plurality of the second shielding strips intersect to form an opening area arranged in an array;
  • the mask substrate includes a plurality of mask units, both ends of the mask unit are fixed on the frame, the mask unit is disposed on the shield body, and the mask unit includes an evaporation area, so
  • the evaporation area corresponds to a row or a row of opening areas, the position of the opening area corresponds to the position of the display area of the display panel;
  • the evaporation area includes a plurality of sub-evaporation areas, and the sub-evaporation area and the opening area
  • the mask unit further includes two buffer zones, and the two buffer zones are respectively located on one of the two sides of the evaporation zone.
  • two adjacent sub-evaporation areas are arranged at intervals.
  • the spacing between two adjacent sub-evaporation areas is equal.
  • the area of the sub-evaporation area is larger than the area of the corresponding opening area.
  • the sub-evaporation zone includes an effective evaporation zone and a virtual evaporation zone
  • the virtual evaporation zone is located outside the effective evaporation zone
  • the effective evaporation zone and the opening zone Corresponding to the position of, at least a plurality of first holes are provided in both the effective evaporation area and the virtual evaporation area.
  • the same mask unit corresponds to a plurality of display areas with different areas.
  • the buffer zone and the evaporation zone are spaced apart.
  • the buffer zone is provided with a plurality of second holes.
  • the first shielding strip and the second shielding strip are integrally formed.
  • the size of each vapor deposition area on each mask unit is equal.
  • the invention provides a mask plate, which includes:
  • a shielding body includes a plurality of first shielding strips arranged in a first direction and a plurality of second shielding strips arranged in a second direction, the ends of the first shielding strips and The ends of the second shielding strips are all fixed on the frame; a plurality of the first shielding strips and a plurality of the second shielding strips intersect to form an opening area arranged in an array;
  • the mask substrate includes a plurality of mask units, both ends of the mask unit are fixed on the frame, the mask unit is disposed on the shield body, and the mask unit includes an evaporation area, so
  • the vapor deposition area corresponds to a row or a row of opening areas, and the position of the opening area corresponds to the position of the display area of the display panel.
  • the evaporation area includes a plurality of sub-evaporation areas, and the sub-evaporation areas correspond to the positions of the opening areas.
  • two adjacent sub-evaporation areas are arranged at intervals.
  • the spacing between two adjacent sub-evaporation areas is equal.
  • the area of the sub-evaporation area is larger than the area of the corresponding opening area.
  • the sub-evaporation zone includes an effective evaporation zone and a virtual evaporation zone
  • the virtual evaporation zone is located outside the effective evaporation zone
  • the effective evaporation zone and the opening zone Corresponding to the position of, at least a plurality of first holes are provided in both the effective evaporation area and the virtual evaporation area.
  • the same mask unit corresponds to a plurality of display areas with different areas.
  • the mask unit further includes two buffer zones, and the two buffer zones are respectively located on one of the two sides of the evaporation zone.
  • the buffer zone and the evaporation zone are spaced apart.
  • the buffer zone is provided with a plurality of second holes.
  • an evaporation area is provided on the mask unit, the evaporation area corresponds to a row or a row of opening areas, and the position of the opening area corresponds to the position of the display area of the display panel, thereby passing a sheet
  • the mask substrate is used to manufacture a variety of panels of different sizes, which reduces production costs and improves flexibility.
  • FIG. 1 is a schematic structural view of a mask plate of the invention
  • FIG. 2 is a schematic structural view of a mask unit of the present invention
  • FIG. 3 is a schematic diagram of the first structure of the mask unit of the present invention.
  • FIG. 4 is a schematic diagram of a second structure of the mask unit of the present invention.
  • FIG. 5 is a schematic diagram of a third structure of the mask unit of the present invention.
  • FIG. 6 is a schematic diagram of a fourth structure of the mask unit of the present invention.
  • FIG. 7 is a schematic diagram of a fifth structure of the mask unit of the present invention.
  • FIG. 8 is a schematic diagram of a sixth structure of the mask unit of the present invention.
  • FIG. 9 is a top view of the mask unit and the opening area of the present invention.
  • FIG. 10 is a schematic diagram of the structure of the display panel of the present invention during the vapor deposition process.
  • FIG. 1 is a schematic diagram of the mask of the present invention.
  • the mask plate 100 of the present invention includes the shielding body 10 and the mask substrate 20, the frame 40, and may further include an alignment plate 30.
  • the shielding body 10 includes a plurality of first shielding strips 12 and a plurality of second shielding strips 13. The plurality of first shielding strips 12 and the plurality of second shielding strips 13 intersect.
  • the first shielding bars 12 are arranged along the first direction, and the second shielding bars 13 are arranged along the second direction, where the first direction is, for example, a horizontal direction, the second direction is a vertical direction, and the first direction is perpendicular to the second direction .
  • Both the end of the first shielding strip 12 and the end of the second shielding strip 13 are fixed on the frame 40; for example, the end of the first shielding strip 12 and the second shielding strip 13 Both ends are welded to the frame 40.
  • the plurality of first shielding strips 12 and the plurality of second shielding strips 13 intersect to form an opening area 14 arranged in an array.
  • the first shielding bar 12 and the second shielding bar 13 are integrally formed.
  • FIG. 1 is a schematic diagram of the area where the vapor deposition area is not blocked by the blocking body 10.
  • the mask substrate 20 includes four mask units 21, and both ends of the mask unit 21 are fixed on the frame 40, wherein the mask unit 21 is welded on the frame 40.
  • the mask unit 21 is provided on the shielding body 10.
  • the number of mask units 21 corresponds to the number of columns of display panels to be vaporized. For example, there are four columns of display panels that need to be vaporized (each column of display panels includes multiple display panels), then four mask units 21 need to be provided. It should be noted here that different mask substrates are used for the evaporation of different colors of organic light-emitting materials in each display panel, for example, a mask substrate is used for the evaporation of green organic light-emitting materials, and the evaporation of red organic light-emitting materials is used A mask substrate.
  • a mask substrate is used for the vapor deposition of blue organic luminescent material.
  • a mask substrate is used to vapor-deposit the same color sub-pixel regions of multiple display panels to obtain organic light-emitting units of corresponding colors.
  • FIG. 2 only takes the mask substrate 20 including four mask units 21 as an example, it does not limit the present invention.
  • the mask substrate 20 may include two or more mask units 21.
  • the material of the mask substrate 20 may be Invar alloy, which is fully etched (Full Etching) design.
  • the mask unit 21 includes an evaporation area 211 corresponding to a row or a row of opening areas 14.
  • the position of the opening area 14 corresponds to the position of the display area of the display panel. 1, that is, one opening area 14 corresponds to the display area of one display panel, and the vapor deposition area 211 of the same mask unit 21 corresponds to one row or one column of display panels, so that the same mask substrate 20 corresponds to multiple display panels, wherein the display
  • the region includes a plurality of sub-pixel regions, and the sub-pixel regions are used for forming organic light-emitting units by vapor-depositing organic light-emitting materials of corresponding colors.
  • the vapor deposition area 211 includes a plurality of sub-evaporation areas 201, and the sub-evaporation areas 201 correspond to the positions of an opening area 14 in a row or a row of opening areas. That is, the sub-evaporation area 201 corresponds to the position of one opening area 14 in the corresponding column or row.
  • the evaporation area 211 corresponds to the position of the opening area in the third column
  • one of the sub-evaporation areas 201 in the evaporation area 211 corresponds to the position of one opening area 14 in the opening area in the third column.
  • the area of each sub-evaporation area 201 is larger than the area of the opening area 14. Therefore, the shielding body 10 shields the position of the vapor deposition area other than the display area, that is, the position that does not require vapor deposition.
  • the sub-evaporation area 201 includes an effective evaporation area 202 and a virtual evaporation area 203.
  • the virtual evaporation area 203 is located outside the effective evaporation area 202, and the sub-evaporation area 201 is located outside the virtual evaporation area 203.
  • the effective evaporation area 202 corresponds to the position of the opening area 14.
  • only a plurality of first holes 31 are provided in both the effective vapor deposition area 202 and the virtual vapor deposition area 203.
  • the entire evaporation area 211 is provided with a plurality of first holes 31.
  • the first hole 31 is a through hole.
  • the area of the effective vapor deposition area 202 is slightly greater than or equal to the area of the corresponding opening area 14, so that the size (length and width) of the opening area 14 can be adjusted within the area not greater than the vapor deposition area 211, thereby It is easy to make display panels of different sizes, which improves flexibility.
  • two adjacent sub-evaporation areas 201 are spaced apart. Moreover, the distance between two adjacent sub-evaporation areas 201 is small, thereby improving the strength of the mask unit 21 and avoiding wrinkles when the mask substrate is stretched. The distance between two adjacent sub-evaporation areas 201 is equal to improve the uniformity of the vapor deposition film (that is, the organic light-emitting material).
  • two adjacent sub-evaporation regions 201 are arranged adjacent to each other. That is, there is no gap between two adjacent sub-evaporation regions 201.
  • the mask unit 21 further includes two buffer zones 212, and the two buffer zones 212 are respectively located on one of the two sides of the evaporation zone 211. That is, one of the buffer zones 212 is located on one side of the evaporation zone 211. Since the buffer zone is provided on both sides of the evaporation zone, it can facilitate the mask substrate 20 to play a role of anti-deformation, and prevent the position and size of the intermediate effective evaporation zone 202 from being excessively shifted, thereby obtaining The film thickness of the vapor deposition material is uniform, and the positions of the vapor deposition area 211 and the display area on the array substrate are in one-to-one correspondence to avoid deviation.
  • the buffer zone 212 is provided with a plurality of second holes 32.
  • the second hole 32 is a through hole. It can be understood that the numbers and positions of the first holes and the second holes in the figure are only for illustration, and do not limit the present invention.
  • the buffer zone 212 and the evaporation zone 211 may be provided with more holes. The number and location of holes can also be set according to actual needs. It can be understood that the holes are not shown in the remaining figures.
  • the buffer zone 212 and the evaporation zone 211 are spaced apart.
  • the buffer zone 212 and the evaporation zone 211 are arranged adjacent to each other. That is, the buffer zone 212 and the evaporation zone 211 are not spaced apart.
  • the area of each effective evaporation area 202 in the evaporation area 211 is not equal, that is, the same mask unit 21 corresponds to the opening area 14 of different sizes, or The same mask unit 21 corresponds to display areas of different sizes.
  • the areas of the plurality of opening areas 14 or display areas in the same row or column are not equal. In one embodiment, the areas of at least two display areas are not equal. In another embodiment, the areas of the display areas are not equal.
  • the mask substrate 20 of the present invention can make OLED panels of different sizes.
  • the mask substrate 20 can be matched with opening areas of different sizes, of which 141 to 143 represent opening areas of different sizes, and the sizes of the vapor deposition areas 211 on each mask unit 21 are equal. Therefore, when the size of the OLED panel is not much different, for example, only the aspect ratio changes, such as from the original 16:9 to 18:9 or 20:9, and the same size of the sub-pixel area, it can be shared The same set of mask substrate 20 only needs to be matched with a shield body of corresponding size.
  • the design of the mask substrate 20 of the present invention can correspond to the manufacture of a variety of different size panels, especially when the pixel size of the OLED panel remains unchanged, but the panel size is fine-tuned, the same mask unit can correspond
  • the production of OLED panels of various sizes and specifications can avoid the design of multiple different film substrates for each size of the panel, thereby saving the production cost.
  • the same mask substrate 20 is used to manufacture display panels of different sizes, compared with the use of multiple sets of different mask substrates 20 designed separately, the cost in the process of manufacturing the mask substrate can be saved, and the utilization rate and flexibility of the mask substrate can be improved .
  • the method for manufacturing an OLED panel using the above mask plate in the present invention mainly includes the following steps:
  • the array substrate 50 includes a switch array layer and a pixel definition layer, and the array substrate has a sub-pixel area (to-be-evaporated area) corresponding to the organic light-emitting unit.
  • the sub-pixel area includes a red sub-pixel area 51, a green sub-pixel area 52, and a blue sub-pixel area 53.
  • the mask substrate 20 includes three types of R/G/B mask substrates, each of which includes a plurality of mask units.
  • the mask substrate of each color can be used to manufacture display panels of different sizes.
  • Fig. 10 only exemplifies a mask substrate.
  • the red R organic light emitting material in the evaporation source 60 is deposited on the red sub-pixel region 51 on the array substrate 50 through the hole in the mask unit 20 and the opening region in the shield 10 .
  • the mask unit of the present invention is combined with shields of different opening sizes to form a complete set of mask plates, and OLED panels of different sizes are manufactured through an evaporation process.
  • an evaporation area is provided on the mask unit, the evaporation area corresponds to a row or a row of opening areas, and the position of the opening area corresponds to the position of the display area of the display panel, thereby passing a sheet
  • the mask substrate is used to manufacture a variety of panels of different sizes, which reduces production costs and improves flexibility.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
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  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种掩膜板（100），该掩膜板（100）包括：框架（40）；遮挡体（10），所述遮挡体（10）包括第一遮挡条（12）以及第二遮挡条（13）；多个所述第一遮挡条（12）和多个所述第二遮挡条（13）相交形成阵列排布的开口区（14）；掩膜基板（20）包括多个掩膜单元（21），所述掩膜单元（21）包括蒸镀区（211），所述蒸镀区（211）对应一行或一列开口区（14），所述开口区（14）的位置与显示面板的显示区域的位置对应。

Description

一种掩膜板 技术领域
本发明涉及显示技术领域，特别是涉及一种掩膜板。
 背景技术
人们对全面屏的需求越来越迫切，即要求整个电子装置的屏占比要求越来越高。以智能手机为例，手机屏幕的长宽比从现有的16:9，增加到目前主流的18:9、18.5:9、19.5:9以及20:9等。
目前手机屏幕多采用OLED显示屏，OLED的制作方法普遍的都是采用真空蒸镀的方法制造，将有机发光材料在坩埚中受热，由固态变成气态，然后通过精细金属掩膜版FMM的开孔，沉积在阵列基板中对应的子像素区中，也即像素定义层(Pixel Definition Layer，PDL)所限定的区域。FMM上设置有与R/G/B子像素一一对应的开孔。在蒸镀某种颜色的有机发光材料时，采用对应颜色的精细金属掩膜板（Fine Metal Mask，FMM）。
 技术问题
然而，目前FMM的制作方法主要是湿法刻蚀的工艺制作，首先制作特定开口尺寸的图案，也即光罩（PhotoMask），然后通过黄光刻蚀工艺在金属薄膜材料上面刻蚀出相应的开口制作出相应的FMM，也即在子像素区内需要制作相应的开口，其中图案的制作费用通常比较昂贵，成本较高。也即精细金属掩膜板FMM的制作成本较高，从而增大了生产成本。当面板尺寸改变时，需要重新制作FMM，以使开口与新的显示区域对应，降低了灵活性。
 技术解决方案
本发明的目的在于提供一种掩膜板，能够降低生产成本和提高灵活性。
为解决上述技术问题，本发明提供一种掩膜板，其包括：
框架；
遮挡体，所述遮挡体包括彼此相交设置的多个沿第一方向排布的第一遮挡条以及多个沿第二方向排布的第二遮挡条，所述第一遮挡条的端部和所述第二遮挡条的端部均固定在所述框架上；多个所述第一遮挡条和多个所述第二遮挡条相交形成阵列排布的开口区；
掩膜基板，包括多个掩膜单元，所述掩膜单元的两端固定在所述框架上，所述掩膜单元设置在所述遮挡体上，所述掩膜单元包括蒸镀区，所述蒸镀区对应一行或一列开口区，所述开口区的位置与显示面板的显示区域的位置对应；所述蒸镀区包括多个子蒸镀区，所述子蒸镀区与所述开口区的位置对应，所述掩膜单元还包括两个缓冲区，所述两个缓冲区分别位于所述蒸镀区的两侧中的其中一侧。
在本发明的掩膜板中，相邻两个所述子蒸镀区之间间隔设置。
在本发明的掩膜板中，相邻两个所述子蒸镀区之间的间距相等。
在本发明的掩膜板中，所述子蒸镀区的面积大于对应的开口区的面积。
在本发明的掩膜板中，所述子蒸镀区包括有效蒸镀区和虚拟蒸镀区，所述虚拟蒸镀区位于有效蒸镀区外，所述有效蒸镀区与所述开口区的位置对应，至少所述有效蒸镀区和所述虚拟蒸镀区中均设置有多个第一孔。
在本发明的掩膜板中，同一所述掩膜单元对应多个面积不等的显示区域。
在本发明的掩膜板中，所述缓冲区与所述蒸镀区之间间隔设置。
在本发明的掩膜板中，所述缓冲区设置有多个第二孔。
在本发明的掩膜板中，所述第一遮挡条和所述第二遮挡条一体形成。
在本发明的掩膜板中，每个所述掩膜单元上的各蒸镀区的尺寸相等。
本发明提供一种掩膜板，其包括：
框架；
遮挡体，所述遮挡体包括彼此相交设置的多个沿第一方向排布的第一遮挡条以及多个沿第二方向排布的第二遮挡条，所述第一遮挡条的端部和所述第二遮挡条的端部均固定在所述框架上；多个所述第一遮挡条和多个所述第二遮挡条相交形成阵列排布的开口区；
掩膜基板，包括多个掩膜单元，所述掩膜单元的两端固定在所述框架上，所述掩膜单元设置在所述遮挡体上，所述掩膜单元包括蒸镀区，所述蒸镀区对应一行或一列开口区，所述开口区的位置与显示面板的显示区域的位置对应。
在本发明的掩膜板中，所述蒸镀区包括多个子蒸镀区，所述子蒸镀区与所述开口区的位置对应。
在本发明的掩膜板中，相邻两个所述子蒸镀区之间间隔设置。
在本发明的掩膜板中，相邻两个所述子蒸镀区之间的间距相等。
在本发明的掩膜板中，所述子蒸镀区的面积大于对应的开口区的面积。
在本发明的掩膜板中，所述子蒸镀区包括有效蒸镀区和虚拟蒸镀区，所述虚拟蒸镀区位于有效蒸镀区外，所述有效蒸镀区与所述开口区的位置对应，至少所述有效蒸镀区和所述虚拟蒸镀区中均设置有多个第一孔。
在本发明的掩膜板中，同一所述掩膜单元对应多个面积不等的显示区域。
在本发明的掩膜板中，所述掩膜单元还包括两个缓冲区，所述两个缓冲区分别位于所述蒸镀区的两侧中的其中一侧。
在本发明的掩膜板中，所述缓冲区与所述蒸镀区之间间隔设置。
在本发明的掩膜板中，所述缓冲区设置有多个第二孔。
 有益效果
本发明的掩膜板，通过在掩膜单元上设置蒸镀区，所述蒸镀区对应一行或一列开口区，所述开口区的位置与显示面板的显示区域的位置对应，从而通过一张掩膜基板进行多种不同尺寸面板的制作，降低了生产成本，提高了灵活性。
 附图说明
图1为本发明掩膜板的结构示意图；
图2为本发明掩膜单元的结构示意图；
图3为本发明掩膜单元的第一种结构示意图；
图4为本发明掩膜单元的第二种结构示意图；
图5为本发明掩膜单元的第三种结构示意图；
图6为本发明掩膜单元的第四种结构示意图；
图7为本发明掩膜单元的第五种结构示意图；
图8为本发明掩膜单元的第六种结构示意图；
图9为本发明掩膜单元与开口区的俯视图；
图10为本发明显示面板的蒸镀过程中的结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是以相同标号表示。
请参照图1至10，图1为本发明掩膜板的结构示意图。
如图1所示，本发明的掩膜板100包括遮挡体10和掩膜基板20、框架40、此外还可包括对齐板30。
所述遮挡体10包括多个第一遮挡条12以及多个第二遮挡条13，多个所述第一遮挡条12和多个所述第二遮挡条13相交设置。
第一遮挡条12沿第一方向排布，第二遮挡条13沿第二方向排布的，其中第一方向比如为水平方向，第二方向为竖直方向，第一方向与第二方向垂直。所述第一遮挡条12的端部和所述第二遮挡条13的端部均固定在所述框架40上；比如所述第一遮挡条12的端部和所述第二遮挡条13的端部均焊接在所述框架40上。多个所述第一遮挡条12和多个所述第二遮挡条13相交形成阵列排布的开口区14。在一实施方式中，所述第一遮挡条12和所述第二遮挡条13一体形成。当两者分体形成时，所述第一遮挡条12与所述第二遮挡条13焊接在一起。其中，第一遮挡条12和所述第二遮挡条13的材料可以是不锈钢。所述遮挡体10用于遮挡不需要蒸镀的区域以及支撑掩膜基板20的作用。可以理解的，图1中给出的是，经过遮挡体10遮挡不需要蒸镀区域的示意图。
掩膜基板20包括四个掩膜单元21，所述掩膜单元21的两端固定在所述框架40上，其中所述掩膜单元21焊接在框架40上。所述掩膜单元21设置在遮挡体10上。其中掩膜单元21的数量与待蒸镀的显示面板的列数对应，比如有4列显示面板需要蒸镀（每一列显示面板包括多个显示面板），那么需要设置4个掩膜单元21。在此需要说明的是，各显示面板中不同颜色的有机发光材料的蒸镀采用不同的掩膜基板，比如绿色有机发光材料的蒸镀采用一种掩膜基板，红色有机发光材料的蒸镀采用一种掩膜基板，蓝色有机发光材料的蒸镀采用一种掩膜基板。在一次蒸镀过程中，使用一个掩膜基板对多个显示面板的同种颜色的子像素区进行蒸镀，得到对应颜色的有机发光单元。虽然图2仅以掩膜基板20包括四个掩膜单元21为例，但是并不能对本发明构成限定。掩膜基板20可以包括两个或者两个以上的掩膜单元21。掩膜基板20的材料可以是因瓦合金，采用全面全刻蚀（Full Etching）设计。
如图2所示，所述掩膜单元21包括蒸镀区211，所述蒸镀区211对应一行或一列开口区14，所述开口区14的位置与显示面板的显示区域的位置对应，结合图1，也即一个开口区14对应一个显示面板的显示区域，同一掩膜单元21的蒸镀区211对应一行或者一列显示面板，使得同一掩膜基板20对应多个显示面板，其中所述显示区域包括多个子像素区，所述子像素区用于通过蒸镀对应颜色的有机发光材料，以形成有机发光单元。
如图3或4所示，所述蒸镀区211包括多个子蒸镀区201，所述子蒸镀区201与一行或一列开口区中的一开口区14的位置对应。也即所述子蒸镀区201与对应列或者对应行中的一个开口区14的位置对应。例如，蒸镀区211与第3列的开口区的位置对应，蒸镀区211的其中一个子蒸镀区201与第3列开口区中的一个开口区14的位置对应。其中，每个子蒸镀区201的面积大于所述开口区14的面积。因此通过所述遮挡体10遮挡显示区域以外的蒸镀区的位置，也即遮挡不需要蒸镀的位置。
其中所述子蒸镀区201包括有效蒸镀区202和虚拟蒸镀区203。虚拟蒸镀区203位于有效蒸镀区202外，子蒸镀区201位于虚拟蒸镀区203外。所述有效蒸镀区202与所述开口区14的位置对应。在一实施方式中，仅在有效蒸镀区202和虚拟蒸镀区203中均设置有多个第一孔31。在另一实施方式中，整个蒸镀区211均设置有多个第一孔31。所述第一孔31为通孔。其中，所述有效蒸镀区202的面积略大于或者等于对应的开口区14的面积，从而使得开口区14的尺寸（长和宽）可以在不大于蒸镀区211的面积内进行调整，从而便于制作不同尺寸的显示面板，提高了灵活性。
在一实施方式中，如图3所示，相邻两个所述子蒸镀区201之间间隔设置。且相邻两个所述子蒸镀区201之间的间距较小，从而提高掩膜单元21的强度，避免掩膜基板张网时产生褶皱。其中相邻两个所述子蒸镀区201之间的间距相等，以提高蒸镀膜（也即有机发光材料）的均匀性。
在另一实施方式中，如图4所示，相邻两个所述子蒸镀区201之间彼此相邻设置。也即相邻两个所述子蒸镀区201之间不存在间隙。
如图3至6所示，所述掩膜单元21还包括两个缓冲区212，所述两个缓冲区212分别位于所述蒸镀区211的两侧中的其中一侧。也即其中一个缓冲区212位于所述蒸镀区211的一侧。由于在蒸镀区的两侧设置缓冲区，可以便于掩膜基板20张网时起到反变形的作用，以及避免中间有效蒸镀区202的内的位置及大小产生过大偏移，从而得蒸镀材料的膜厚均匀，以及保证蒸镀区211与阵列基板上的显示区域的位置一一对应，避免发生偏移。
所述缓冲区212设置有多个第二孔32。该第二孔32为通孔。可以理解的，图中的第一孔和第二孔的数量和位置只是示意，并不能对本发明构成限定，缓冲区212和蒸镀区211上可设置有更多的孔。也可根据实际需要设置孔的数量和位置。可以理解的，其余图中未示意出孔。
在一实施方式中，如图3或4所示，所述缓冲区212与所述蒸镀区211之间间隔设置。
在一实施方式中，如图5或6所示，所述缓冲区212与所述蒸镀区211彼此相邻设置。也即所述缓冲区212与所述蒸镀区211之间不间隔设置。
在一实施例中，如图7或8所示，其中所述蒸镀区211中各有效蒸镀区202的面积不相等，也即同一掩膜单元21对应不同尺寸的开口区14，或者说同一掩膜单元21对应不同尺寸的显示区域。同一行或者同一列中的所述多个开口区14或者显示区域的面积不相等。在一实施方式中，至少两个显示区域的面积不相等。在另一实施方式中，各显示区域的面积均不相等。
结合图9，本发明的掩膜基板20可以制作不同尺寸OLED面板。掩膜基板20可以搭配不同尺寸的开口区，其中141至143代表不同尺寸的开口区，每个掩膜单元21上的各蒸镀区211的尺寸相等。因此当OLED面板的尺寸相差不大，比如仅仅是长宽比发生变化时，如从原来的16:9变成18:9或者20:9，同时子像素区的尺寸相同的情况下，可以共用同一套掩膜基板20，只需搭配相应尺寸的遮挡体即可。也即本发明的掩膜基板20的设计可以对应多种不同尺寸面板的制作，尤其是当OLED面板的像素大小保持不变的情况下，只是面板尺寸发生微调时，相同的掩膜单元可以对应多种尺寸规格的OLED面板制作，可以避免针对每种尺寸的面板单独设计多个不同的膜基板，从而节约制作的成本。
由于利用同一个掩膜基板20制作不同尺寸的显示面板，相对于采用单独设计多套不同的掩膜基板20，可以节约制作掩膜基板过程中的费用，提高掩膜基板的利用率以及灵活性。
本发明采用上述掩膜板制作OLED面板的方法，主要包括以下步骤：
S101、提供制作完成的阵列基板50和掩膜板；
以单个显示面板为例，如图10所示，例如，该阵列基板50包括开关阵列层和像素定义层，该阵列基板具有与有机发光单元一一对应的子像素区（待蒸镀区）。其中子像素区包括红色子像素区51、绿色子像素区52、蓝色子像素区53。
掩膜基板20分别包括R/G/B三种掩膜基板，每一种颜色的掩膜基板包括多个掩膜单元。每一种颜色的掩膜基板可以用来不同尺寸的显示面板的制作。图10仅以一种掩膜基板示例。
S102、将掩膜板、阵列基板安装于蒸镀机台上；
以红色有机发光单元制作为例，蒸镀源60中的红色R有机发光材料透过掩膜单元20上的孔以及遮挡体10上的开口区沉积到阵列基板50上的红色子像素区51上。
也即本发明的掩膜单元搭配不同开口大小的遮挡体形成完整的一套掩膜板，通过蒸镀工艺从而制作出不同尺寸的OLED面板。
本发明的掩膜板，通过在掩膜单元上设置蒸镀区，所述蒸镀区对应一行或一列开口区，所述开口区的位置与显示面板的显示区域的位置对应，从而通过一张掩膜基板进行多种不同尺寸面板的制作，降低了生产成本，提高了灵活性。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种掩膜板，其包括：
    框架；
    遮挡体，包括彼此相交设置的多个沿第一方向排布的第一遮挡条以及多个沿第二方向排布的第二遮挡条，所述第一遮挡条的端部和所述第二遮挡条的端部均固定在所述框架上；多个所述第一遮挡条和多个所述第二遮挡条相交形成阵列排布的开口区；以及
    掩膜基板，包括多个掩膜单元，所述掩膜单元的两端固定在所述框架上，所述掩膜单元设置在所述遮挡体上，所述掩膜单元包括蒸镀区，所述蒸镀区对应一行或一列开口区，所述开口区的位置与显示面板的显示区域的位置对应；所述蒸镀区包括多个子蒸镀区，所述子蒸镀区与所述开口区的位置对应，所述掩膜单元还包括两个缓冲区，所述两个缓冲区分别位于所述蒸镀区的两侧中的其中一侧。
  2. 根据权利要求1所述的掩膜板，其中
    相邻两个所述子蒸镀区之间间隔设置。
  3. 根据权利要求1所述的掩膜板，其中
    相邻两个所述子蒸镀区之间的间距相等。
  4. 根据权利要求1所述的掩膜板，其中
    所述子蒸镀区的面积大于对应的开口区的面积。
  5. 根据权利要求1所述的掩膜板，其中
    所述子蒸镀区包括有效蒸镀区和虚拟蒸镀区，所述虚拟蒸镀区位于有效蒸镀区外，所述有效蒸镀区与所述开口区的位置对应，至少所述有效蒸镀区和所述虚拟蒸镀区中均设置有多个第一孔。
  6. 根据权利要求1所述的掩膜板，其中
    同一所述掩膜单元对应多个面积不等的显示区域。
  7. 根据权利要求1所述的掩膜板，其中
    所述缓冲区与所述蒸镀区之间间隔设置。
  8. 根据权利要求1所述的掩膜板，其中
    所述缓冲区设置有多个第二孔。
  9. 根据权利要求1所述的掩膜板，其中
    所述第一遮挡条和所述第二遮挡条一体形成。
  10. 根据权利要求1所述的掩膜板，其中
    每个所述掩膜单元上的各蒸镀区的尺寸相等。
  11. 一种掩膜板，其包括：
    框架；
    遮挡体，所述遮挡体包括彼此相交设置的多个沿第一方向排布的第一遮挡条以及多个沿第二方向排布的第二遮挡条，所述第一遮挡条的端部和所述第二遮挡条的端部均固定在所述框架上；多个所述第一遮挡条和多个所述第二遮挡条相交形成阵列排布的开口区；
    掩膜基板，包括多个掩膜单元，所述掩膜单元的两端固定在所述框架上，所述掩膜单元设置在所述遮挡体上，所述掩膜单元包括蒸镀区，所述蒸镀区对应一行或一列开口区，所述开口区的位置与显示面板的显示区域的位置对应。
  12. 根据权利要求11所述的掩膜板，其中
    所述蒸镀区包括多个子蒸镀区，所述子蒸镀区与所述开口区的位置对应。
  13. 根据权利要求12所述的掩膜板，其中
    相邻两个所述子蒸镀区之间间隔设置。
  14. 根据权利要求13所述的掩膜板，其中
    相邻两个所述子蒸镀区之间的间距相等。
  15. 根据权利要求12所述的掩膜板，其中
    所述子蒸镀区的面积大于对应的开口区的面积。
  16. 根据权利要求12所述的掩膜板，其中
    所述子蒸镀区包括有效蒸镀区和虚拟蒸镀区，所述虚拟蒸镀区位于有效蒸镀区外，所述有效蒸镀区与所述开口区的位置对应，至少所述有效蒸镀区和所述虚拟蒸镀区中均设置有多个第一孔。
  17. 根据权利要求11所述的掩膜板，其中
    同一所述掩膜单元对应多个面积不等的显示区域。
  18. 根据权利要求11所述的掩膜板，其中
    所述掩膜单元还包括两个缓冲区，所述两个缓冲区分别位于所述蒸镀区的两侧中的其中一侧。
  19. 根据权利要求18所述的掩膜板，其中
    所述缓冲区与所述蒸镀区之间间隔设置。
  20. 根据权利要求18所述的掩膜板，其中
    所述缓冲区设置有多个第二孔。
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