WO2014044114A1 - 散热器固定装置 - Google Patents

散热器固定装置 Download PDF

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Publication number
WO2014044114A1
WO2014044114A1 PCT/CN2013/082543 CN2013082543W WO2014044114A1 WO 2014044114 A1 WO2014044114 A1 WO 2014044114A1 CN 2013082543 W CN2013082543 W CN 2013082543W WO 2014044114 A1 WO2014044114 A1 WO 2014044114A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
hook
printed circuit
circuit board
fixing device
Prior art date
Application number
PCT/CN2013/082543
Other languages
English (en)
French (fr)
Inventor
张伟锋
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to JP2015532285A priority Critical patent/JP6019238B2/ja
Priority to EP13839889.6A priority patent/EP2887784B1/en
Publication of WO2014044114A1 publication Critical patent/WO2014044114A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a fixing device applied to an electronic device, and more particularly to a fixing device for integrating a circuit chip heat sink. Background technique
  • Integrated C i rcui t integrated circuits (Integrated C i rcui t ) chips are running faster and faster, and more heat is generated, some IC chips are equipped with IC heat sinks to help dissipate accumulated heat and make ICs The chip maintains a safer operating temperature.
  • the IC chip is soldered on the printed circuit board, and the IC heat sink is attached and fixed on the surface of the IC chip, and the heat accumulated by the IC chip is dissipated to the IC heat sink by conduction.
  • the common fixing methods of the existing IC heat sinks include the fixing of the structural parts and the adhesion of the thermal conductive glue.
  • the fixing method of the structural parts is usually to open holes in the printed circuit board, and the IC heat sink is connected by a structural member such as a bolt.
  • Printed circuit board is usually to open holes in the printed circuit board, and the IC heat sink is connected by a structural member such as a bolt.
  • the inventors have found that the relevant structural member fixing manner is opened on the printed circuit board, which results in a large occupied area of the fixed structure on the printed circuit board, and reduces the inside and outside of the printed circuit board.
  • the usable area of the layer wiring increases the difficulty of the printed circuit board layout design, especially for multilayer printed circuit boards.
  • the thermal adhesive adhesion method has the risk of aging and falling off, which reduces heat dissipation performance and work reliability. Summary of the invention
  • the technical problem to be solved by the present invention is to provide a heat sink fixing device, which effectively reduces the area occupied by the heat sink fixing structure occupying the printed circuit board.
  • the present invention provides a heat sink fixing device, which comprises a hook body of a heat sink end and a latch body of a printed circuit board end, and the latch body is fixed to the printed circuit board by surface mounting.
  • the hook body is sleeved with an elastic body, and is engaged with the latch body through a mounting hole formed in the heat sink to fix and fix the heat sink on the printed circuit board.
  • the hook body comprises a cylinder, a column cap and a hook
  • the column cap is disposed on one of the cylinders
  • the hook is disposed at the other end of the cylinder, and the hook is perpendicular to the cylinder to form an L-shaped hook.
  • the buckle body is a rectangular frame with one end open, and the open end is provided with a buckle to form a C-type buckle; the hook body is sleeved with the elastic body, passes through the mounting hole on the heat sink, and compresses the elastic body.
  • the hook of the hook body extends to the open end of the buckle body and rotates to hook the C-shaped hook to the L-shaped hook.
  • the hook body comprises a cylinder, a column cap and a cassette
  • the column cap is disposed at one end of the cylinder
  • the cassette is disposed at the other end of the cylinder
  • the cassette is perpendicular to the cylinder to form an L-shaped cassette.
  • the buckle body is a sleeve structure
  • the side wall of the sleeve is provided with an arc-shaped slideway
  • the end of the slideway is provided with a card slot
  • the hook body is sleeved with the elastic body and then passes through the heat sink. Install the hole and compress the elastic body. The hook of the hook body enters the card slot along the slide rail, and the card slot is hooked to the L-shaped cassette.
  • the heat sink is an integrated circuit chip heat sink, and the integrated circuit chip is soldered on the printed circuit board, and the heat dissipating surface of the integrated circuit chip heat sink is bonded to the surface of the integrated circuit chip.
  • the latch body is two or more, and is disposed around the integrated circuit chip.
  • the snap body is soldered to the printed circuit board.
  • the hook body and the buckle body are made of metal or non-metal, and the crucible is manufactured by casting or machining.
  • the elastomer is a spring or a metal dome.
  • the embodiment of the invention provides a heat sink fixing device, which avoids opening a hole in the printed circuit board, effectively reduces the area occupied by the fixed structure occupying the printed circuit board, increases the available area of the printed circuit board wiring, and reduces the available area.
  • the design of the printed circuit board wiring is difficult, the structure is simple, the installation is convenient, and the connection is reliable. Further, with the multilayer printed circuit board structure, since the buckle body of the embodiment of the present invention is disposed only on the surface of the first layer of the printed circuit board, the usable area of the printed circuit board wiring is increased to a greater extent.
  • FIG. 1 is a schematic structural view of a first embodiment of a heat sink fixing device according to the present invention
  • FIGS. 2a and 2b are schematic structural views of a first hook body according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a first buckle body according to an embodiment of the present invention
  • 4 is a schematic structural view of a first hook body and a first snap body according to an embodiment of the present invention
  • FIG. 5 is a schematic structural view of a heat sink fixing device according to a second embodiment of the present invention
  • FIG. 6 is a schematic structural view of a second hook body according to an embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a second buckle body according to an embodiment of the present invention.
  • the heat sink fixing device of the embodiment of the invention comprises a hook body of the heat sink end and a buckle body of the printed circuit board end, and the buckle body is fixed on the printed circuit board by surface mounting, and is disposed on the periphery of the ic chip and on the heat sink. A mounting hole is formed, and the hook body of the elastic body is engaged with the buckle body through the mounting hole, and the heat sink is mounted and fixed on the printed circuit board.
  • one heat sink can be fixed by two or more heat sink fixing devices of the present invention. Because the heat sink fixing device of the embodiment of the invention avoids opening holes on the printed circuit board, the fixed structure occupies the area of the printed circuit board, the available area of the printed circuit board wiring is increased, and the printed circuit is reduced.
  • the layout of the board is difficult, the structure is simple, the installation is convenient, and the connection is reliable. Further, for the multilayer printed circuit board structure, since the snap body of the embodiment of the present invention is disposed only on the surface of the first layer of the printed circuit board, the usable area of the printed circuit board is increased to a greater extent.
  • the heat sink fixing device of the embodiment of the invention can be realized by at least two structural modes, an L-shaped hooking manner and a pressing hooking manner.
  • the heat sink fixing device of the embodiment is an L-shaped hooking method, and includes a first hook body 11 , a first elastic body 12 and a first buckle body 13 , and a first hook of the first elastic body 12 is sleeved.
  • the body 11 is engaged with the first latching body 13, and the heat sink 3 attached to the surface of the IC chip 2 is mounted and fixed on the printed circuit board 1.
  • the IC chip 2 is soldered on the printed circuit board 1, and the first "" button body 13 is disposed at the periphery (such as the two ends or four corners) of the IC chip 2, and is fixed to the printed circuit by surface mounting.
  • the heat sink 3 is provided with a mounting hole, and the heat dissipating surface of the heat sink 3 is adhered to the surface of the IC chip 2.
  • the first hook body 11 of the first elastic body 12 is inserted through the mounting hole and the first latch body.
  • the 13 card is connected to realize the connection between the heat sink 3 and the printed circuit board 1.
  • 2a and 2b are schematic structural views of a first hook body according to an embodiment of the present invention. As shown in FIG.
  • the first hook body 11 of the embodiment of the present invention includes a cylinder 111, a column cap 112 and a hook 113.
  • the column cap 112 is disposed at one end of the cylinder 111
  • the hook 113 is disposed at the other end of the cylinder 111.
  • 113 is perpendicular to the cylinder 111 to form an L-shaped hook.
  • the first hook body of the embodiment of the present invention can be expanded or deformed into a plurality of structural forms.
  • the end of the hook can be provided with a convex edge 114 to increase the reliability of the hook, as shown in FIG. 2b. Show.
  • a groove of a word, a cross or other shape may be formed on the surface of the cap 112 to facilitate the use of the tool to unlock the first hook body when the heat sink is removed.
  • FIG. 3 is a schematic structural diagram of a first "" button body according to an embodiment of the present invention.
  • the first "" button body of the embodiment of the present invention is a rectangular frame 131 having an opening at one end, and a buckle 132 is disposed at the open end to form a C-type buckle.
  • the snap body can be soldered on the printed circuit board, the elastic body can use a spring or a metal spring, and the first hook body and the first snap body can be made of metal or non-metal wire or bar. Materials such as plates are made by casting, machining, etc.
  • FIG. 4 is a schematic structural view of a first hook body and a first snap body according to an embodiment of the present invention.
  • the first fastening body 13 is welded on the printed circuit board 1.
  • the heat sink 3 is provided with a mounting hole.
  • the first hook body 11 is sleeved on the first elastic body 12 and then passes through the heat sink 3.
  • Mounting holes and compressing the first elastic body 12 such as a spring or a spring until the L-shaped hook of the first hook body 11 extends to the open end of the first snap body 13 and rotates the first hook body toward the inside of the C-shaped buckle 11 , until the C-type buckle hooks the L-shaped hook.
  • the first elastic body 12 by providing the first elastic body 12, the first elastic body 12 provides an upward thrust to the first hook body 11, so that the L-shaped hook is stably hung on the C-type buckle.
  • the heat sink 3 is fixed to the printed circuit board 1 by the two or more first hook bodies and the first snap body of the embodiment of the present invention, and the heat radiating surface of the heat sink is bonded to the surface of the IC chip.
  • the heat sink fixing device fixes the heat sink on the printed circuit board through the L-shaped hook and the C-type buckle, thereby avoiding opening holes in the printed circuit board, and effectively reducing the fixing structure on the printed circuit board.
  • the occupied area is simple, the installation is convenient, and the connection is reliable.
  • FIG. 5 is a schematic structural view of a second embodiment of a heat sink fixing device according to an embodiment of the present invention.
  • the heat sink fixing device of the embodiment is a press hooking method, and includes a second hook body 21, a second elastic body 22 and a second snap body 23, and a second hook of the second elastic body 22 is sleeved.
  • the body 21 is engaged with the second latching body 23, and the heat sink 3 attached to the surface of the IC chip 2 is mounted and fixed on the printed circuit board 1.
  • the IC chip 2 is soldered on the printed circuit board 1, and the second latch body 23 is disposed on the IC.
  • the periphery of the chip 2 (such as two ends or four corners) is fixed on the printed circuit board 1 by surface mounting, and the heat sink 3 is provided with a mounting hole, and the heat radiating surface of the heat sink 3 is bonded to the surface of the IC chip 2.
  • the second hook body 21 of the second elastic body 22 is engaged with the second latching body 23 through the mounting hole to realize the connection and fixing of the heat sink 3 to the printed circuit board 1.
  • FIG. 6 is a schematic structural view of a second hook body according to an embodiment of the present invention.
  • the second hook body 21 of the embodiment of the present invention includes a cylinder 211, a column cap 212 and a cassette 213.
  • the column cap 212 is disposed at one end of the cylinder 211
  • the cassette 213 is disposed at the other end of the cylinder 211.
  • the cassette 213 is perpendicular to the cylinder 211 to form an L-shaped cassette.
  • a slot, cross or other shaped recess can be formed in the surface of the cap 212 to facilitate the use of the tool to unlock the second hook when the heat sink is removed.
  • FIG. 7 is a schematic structural diagram of a second buckle body according to an embodiment of the present invention.
  • the second buckle body of the embodiment of the present invention has a sleeve structure.
  • the side wall 231 of the sleeve is provided with a curved slide 232, and the end of the slide 232 is provided with a slot 233.
  • the number of the latches 213 of the second hook body 21 may be one or two or more, and the hook reliability is increased.
  • the cassette is two or more, a corresponding number of curved slides and slots are formed on the side wall of the sleeve of the second snap body.
  • the snap-in body can be soldered on the printed circuit board
  • the elastic body can use a spring or a metal spring
  • the second hook body and the second snap body can be made of metal or non-metal wire, bar, Materials such as plates are made by casting, machining, etc.
  • the fixing method of the embodiment is as follows: The second fastening body 23 is welded on the printed circuit board 1.
  • the heat sink 3 is provided with a mounting hole, and the second hook body 21 is sleeved with the second elastic body 22.
  • the structure of the embodiment of the present invention provides a second thrust body 21 by providing a second elastic body 22, so that the second hook body 21 is provided with an upward thrust so that the latch is firmly hung in the card slot.
  • the heat sink 3 is fixed to the printed circuit board 1 by two or more second hook bodies and second latch bodies of the present invention, and the heat radiating surface of the heat sink is bonded to the surface of the IC chip.
  • the heat sink fixing device fixes the heat sink on the printed circuit board through the cassette and the card slot, thereby avoiding opening holes in the printed circuit board, thereby effectively reducing the occupied area of the fixed structure on the printed circuit board.
  • the structure is simple, the installation is convenient, and the connection is reliable.
  • the embodiment of the invention provides a heat sink fixing device, which avoids opening a hole in the printed circuit board, effectively reduces the area occupied by the fixed structure occupying the printed circuit board, increases the available area of the printed circuit board wiring, and reduces the available area.
  • the design of the printed circuit board wiring is difficult, the structure is simple, the installation is convenient, and the connection is reliable. Further, with the multilayer printed circuit board structure, since the buckle body of the embodiment of the present invention is disposed only on the surface of the first layer of the printed circuit board, the usable area of the printed circuit board wiring is increased to a greater extent.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Snaps, Bayonet Connections, Set Pins, And Snap Rings (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)

Abstract

一种散热器固定装置，包括散热器端的挂钩体和印制电路板端的卡扣体，所述卡扣体采用表面贴装方式固定在印制电路板上，所述挂钩体上套设有弹性体，并穿过散热器上开设的安装孔与所述卡扣体卡接，将散热器安装固定在印制电路板上。

Description

散热器固定装置
技术领域
本发明涉及一种电子设备中应用到的固定装置， 尤其涉及一种用于集成 电路芯片散热器的固定装置。 背景技术
由于集成电路 ( Integra ted C i rcui t ) 芯片的运行速度越来越快， 所产 生的热量越来越多，因此一些 IC芯片上加装有 IC散热器，以辅助散除积热， 使 IC芯片保持较安全的工作温度。
通常， IC芯片焊接在印制电路板上， IC散热器贴设固定在 IC芯片表面 上， 通过传导将 IC芯片的积热散逸至 IC散热器。 目前， 现有 IC散热器常见 的固定方式有结构件固定和导热胶粘附等方式， 其中结构件固定方式通常是 在印制电路板上开孔， 通过诸如螺栓等结构件连接 IC散热器和印制电路板。
在实现本发明技术方案的过程中， 发明人发现， 相关结构件固定方式在 印制电路板上开孔， 导致固定结构在印制电路板上占用面积较大， 减小了印 制电路板内外层布线的可用面积， 增加了印制电路板布线设计的难度， 多层 印制电路板尤甚。 而导热胶粘附方式存在胶老化脱落的风险， 降低了散热性 能和工作可靠性。 发明内容
本发明要解决的技术问题是提供一种散热器固定装置， 有效减小散热器 固定结构占用印制电路板的面积。
为解决上述技术问题， 本发明提供了一种散热器固定装置， 包括散热器 端的挂钩体和印制电路板端的卡扣体， 所述卡扣体釆用表面贴装方式固定在 印制电路板上， 所述挂钩体上套设有弹性体， 并穿过散热器上开设的安装孔 与所述卡扣体卡接， 将散热器安装固定在印制电路板上。
优选地， 所述挂钩体包括柱体、 柱帽和挂钩， 所述柱帽设置在柱体的一 端， 所述挂钩设置在柱体的另一端， 所述挂钩与柱体垂直， 形成 L型挂钩。 优选地， 所述卡扣体为一端开口的矩形框， 开口端设置卡扣， 形成 C型 卡扣； 所述挂钩体套接弹性体后穿过散热器上的安装孔， 并压缩弹性体， 挂 钩体的挂钩伸到卡扣体的开口端后旋转， 使 C型卡扣钩住 L型挂钩。
优选地， 所述挂钩体包括柱体、 柱帽和卡榫， 柱帽设置在柱体的一端， 卡榫设置在柱体的另一端， 卡榫与柱体垂直， 形成 L型卡榫。
优选地， 所述卡扣体为套筒结构， 套筒的侧壁上开设有弧形滑道， 滑道 的端部设置卡槽； 所述挂钩体套接弹性体后穿过散热器上的安装孔， 并压缩 弹性体， 挂钩体的卡榫沿着滑道进入卡槽， 使卡槽钩住 L型卡榫。
在上述技术方案基础上， 所述散热器为集成电路芯片散热器， 集成电路 芯片焊接在印制电路板上 , 集成电路芯片散热器的散热面与集成电路芯片的 表面贴合。
优选地， 所述卡扣体为 2个以上， 设置在集成电路芯片周边。
优选地， 所述卡扣体焊接在印制电路板上。
优选地， 所述挂钩体和卡扣体为金属或非金属， 釆用铸造或机加工方式 制造。
优选地， 所述弹性体为弹簧或金属弹片。
本发明实施例提供了一种散热器固定装置，避免了在印制电路板上开孔， 有效减小了固定结构占用印制电路板的面积， 增加了印制电路板布线的可用 面积， 降低了印制电路板布线设计的难度， 且结构简单， 安装便捷， 连接可 靠。 进一步地， 对多层印制电路板结构， 由于本发明实施例卡扣体只设置在 印制电路板第一层的表面， 因此印制电路板布线可用面积的增加程度更大。
附图概述
图 1为本发明散热器固定装置第一实施例的结构示意图；
图 2a和图 2b为本发明实施例第一挂钩体的结构示意图；
图 3为本发明实施例第一卡扣体的结构示意图； 图 4为本发明实施例第一挂钩体和第一卡扣体连接的结构示意图； 图 5为本发明散热器固定装置第二实施例的结构示意图；
图 6为本发明实施例第二挂钩体的结构示意图；
图 7为本发明实施例第二卡扣体的结构示意图。
本发明的较佳实施方式
下面结合附图， 对本发明技术方案做进一步详细说明。
本发明实施例散热器固定装置包括散热器端的挂钩体和印制电路板端的 卡扣体，卡扣体釆用表面贴装方式固定在印制电路板上，设置在 ic芯片周边， 散热器上开设安装孔， 套设弹性体的挂钩体穿过该安装孔与卡扣体卡接， 将 散热器安装固定在印制电路板上。 实际应用中， 一个散热器可以用 2个或多 个本发明实施例散热器固定装置来固定。 由于本发明实施例散热器固定装置 避免了在印制电路板上开孔， 有效减小了固定结构占用印制电路板的面积， 增加了印制电路板布线的可用面积， 降低了印制电路板布线设计的难度， 且 结构简单， 安装便捷， 连接可靠。 进一步地， 对多层印制电路板结构， 由于 本发明实施例卡扣体只设置在印制电路板第一层的表面， 因此印制电路板布 线可用面积的增加程度更大。
本发明实施例散热器固定装置可以至少由两种结构方式实现， L型挂钩 方式和按压卡钩方式。
图 1为本发明实施例散热器固定装置第一实施例的结构示意图。 如图 1 所示， 本实施例散热器固定装置为 L型挂钩方式， 包括第一挂钩体 11、 第一 弹性体 12和第一卡扣体 13 , 套设第一弹性体 12的第一挂钩体 11与第一卡 扣体 13卡接， 将贴设在 IC芯片 2表面上的散热器 3安装固定在印制电路板 1上。 具体地， IC芯片 2焊接在印制电路板 1上， 第一"" ^扣体 13设置在 IC 芯片 2的周边（如两端或四角） ， 且釆用表面贴装方式固定在印制电路板 1 上，散热器 3上开设有安装孔，散热器 3的散热面与 IC芯片 2表面贴合， 套 设第一弹性体 12的第一挂钩体 11穿过安装孔与第一卡扣体 13卡接，实现散 热器 3与印制电路板 1的连接固定。 图 2a和图 2b为本发明实施例第一挂钩体的结构示意图。 如图 2a所示， 本发明实施例第一挂钩体 11 包括柱体 111、 柱帽 112和挂钩 113 , 柱帽 112 设置在柱体 111的一端， 挂钩 113设置在柱体 111的另一端， 挂钩 113与柱 体 111垂直， 形成 L型挂钩。 实际应用中， 本发明实施例第一挂钩体可以扩 展或变形为多种结构形式， 例如在 L型挂钩基础上， 挂钩的端部可以设置凸 沿 114, 增加挂接可靠性， 如图 2b所示。 柱帽 112的表面上可以开设一字、 十字或其他形状的凹槽， 在拆卸散热器时便于使用工具使第一挂钩体解锁。
图 3为本发明实施例第一"" ^扣体的结构示意图。 如图 3所示， 本发明实 施例第一"" ^扣体为一端开口的矩形框 131 , 开口端设置卡扣 132, 形成 C型 卡扣。 实际应用中， 卡扣体可以焊接在印制电路板上， 弹性体可以釆用弹簧 或金属弹片，第一挂钩体和第一卡扣体可以釆用金属或非金属的丝材、棒材、 板材等材料， 釆用铸造、 机加工等方式制造。
图 4为本发明实施例第一挂钩体和第一卡扣体连接的结构示意图。 如图 4所示， 第一卡扣体 13焊接在印制电路板 1上， 散热器 3上开设有安装孔， 第一挂钩体 11套接第一弹性体 12后穿过散热器 3上的安装孔， 并压缩诸如 弹簧或弹片的第一弹性体 12, 直至第一挂钩体 11的 L型挂钩伸到第一卡扣 体 13的开口端， 朝 C型卡扣内侧方向旋转第一挂钩体 11 , 直至 C型卡扣钩 住 L型挂钩。 本发明实施例结构通过设置第一弹性体 12, 第一弹性体 12给 第一挂钩体 11提供一个向上的推力， 使得 L型挂钩稳稳挂在 C型卡扣上。 由此， 散热器 3被 2个或多个本发明实施例第一挂钩体和第一卡扣体固定在 印制电路板 1上， 散热器的散热面与 IC芯片的表面贴合。
本实施例散热器固定装置通过 L型挂钩和 C型卡扣将散热器固定在印制 电路板上， 避免了在印制电路板上开孔， 有效减小了固定结构在印制电路板 上的占用面积， 且结构简单， 安装便捷， 连接可靠。
图 5为本发明实施例散热器固定装置第二实施例的结构示意图。 如图 5 所示， 本实施例散热器固定装置为按压卡钩方式， 包括第二挂钩体 21、 第二 弹性体 22和第二卡扣体 23 , 套设第二弹性体 22的第二挂钩体 21与第二卡 扣体 23卡接， 将贴设在 IC芯片 2表面上的散热器 3安装固定在印制电路板 1上。 具体地， IC芯片 2焊接在印制电路板 1上， 第二卡扣体 23设置在 IC 芯片 2的周边（如两端或四角） ， 且釆用表面贴装方式固定在印制电路板 1 上，散热器 3上开设有安装孔，散热器 3的散热面与 IC芯片 2表面贴合， 套 设第二弹性体 22的第二挂钩体 21穿过安装孔与第二卡扣体 23卡接，实现散 热器 3与印制电路板 1的连接固定。
图 6为本发明实施例第二挂钩体的结构示意图。 如图 6所示， 本发明实 施例第二挂钩体 21包括柱体 211、 柱帽 212和卡榫 213 , 柱帽 212设置在柱 体 211的一端， 卡榫 213设置在柱体 211的另一端， 卡榫 213与柱体 211垂 直， 形成 L型卡榫。 柱帽 212的表面上可以开设一字、 十字或其他形状的凹 槽， 在拆卸散热器时便于使用工具使第二挂钩体解锁。
图 7为本发明实施例第二卡扣体的结构示意图。 如图 7所示， 本发明实 施例第二卡扣体为套筒结构， 套筒的侧壁 231上开设有弧形滑道 232, 滑道 232的端部设置卡槽 233。 本发明实施例第二挂钩体 21的卡榫 213可以是 1 个， 也可以是 2个或多个， 增加挂接可靠性。 当卡榫是 2个或多个时， 第二 卡扣体的套筒侧壁上则开设相应数量的弧形滑道和卡槽。 实际应用中， 卡扣 体可以焊接在印制电路板上， 弹性体可以釆用弹簧或金属弹片， 第二挂钩体 和第二卡扣体可以釆用金属或非金属的丝材、棒材、板材等材料，釆用铸造、 机加工等方式制造。 如图 5所示，本实施例的固定方法为： 第二卡扣体 23焊接在印制电路板 1上， 散热器 3上开设有安装孔， 第二挂钩体 21套接第二弹性体 22后穿过 散热器 3上的安装孔， 并压缩诸如弹簧或弹片的第二弹性体 22, 使第二挂钩 体 21的卡榫沿着第二卡扣体的滑道进入卡槽，直至卡槽钩住卡榫。本发明实 施例结构通过设置第二弹性体 22,第二弹性体 22给第二挂钩体 21提供一个 向上的推力， 使得卡榫牢靠地挂在卡槽内。 由此， 散热器 3被 2个或多个本 发明实施例第二挂钩体和第二卡扣体固定在印制电路板 1上， 散热器的散热 面与 IC芯片的表面贴合。
本实施例散热器固定装置通过卡榫和卡槽将散热器固定在印制电路板上, 避免了在印制电路板上开孔， 有效减小了固定结构在印制电路板上的占用面 积， 且结构简单， 安装便捷， 连接可靠。
以上所述仅为本发明的优选实施例而已， 并不用于限制本发明， 对于本 领域的技术人员来说， 本发明可以有各种更改和变化。 凡在本发明的精神和 原则之内， 所作的任何修改、 等同替换、 改进等， 均应包含在本发明的保护 范围之内。
工业实用性
本发明实施例提供了一种散热器固定装置，避免了在印制电路板上开孔， 有效减小了固定结构占用印制电路板的面积， 增加了印制电路板布线的可用 面积， 降低了印制电路板布线设计的难度， 且结构简单， 安装便捷， 连接可 靠。 进一步地， 对多层印制电路板结构， 由于本发明实施例卡扣体只设置在 印制电路板第一层的表面， 因此印制电路板布线可用面积的增加程度更大。

Claims

权 利 要 求 书
1、 一种散热器固定装置， 包括散热器端的挂钩体和印制电路板端的 卡扣体， 所述卡扣体釆用表面贴装方式固定在印制电路板上， 所述挂钩体上 套设有弹性体， 并穿过散热器上开设的安装孔与所述卡扣体卡接， 将散热器 安装固定在印制电路板上。
2、 如权利要求 1 所述的散热器固定装置， 其中， 所述挂钩体包括柱 体、 柱帽和挂钩， 所述柱帽设置在柱体的一端， 所述挂钩设置在柱体的另一 端， 所述挂钩与柱体垂直， 形成 L型挂钩。
3、 如权利要求 2 所述的散热器固定装置， 其中， 所述卡扣体为一端 开口的矩形框， 开口端设置卡扣， 形成 C型卡扣； 所述挂钩体套接弹性体后 穿过散热器上的安装孔， 并压缩弹性体， 挂钩体的挂钩伸到卡扣体的开口端 后旋转， 使 C型卡扣钩住 L型挂钩。
4、 如权利要求 1 所述的散热器固定装置， 其中， 所述挂钩体包括柱 体、 柱帽和卡榫， 柱帽设置在柱体的一端， 卡榫设置在柱体的另一端， 卡榫 与柱体垂直， 形成 L型卡榫。
5、 如权利要求 4 所述的散热器固定装置， 其中， 所述卡扣体为套筒 结构， 套筒的侧壁上开设有弧形滑道， 滑道的端部设置卡槽； 所述挂钩体套 接弹性体后穿过散热器上的安装孔， 并压缩弹性体， 挂钩体的卡榫沿着滑道 进入卡槽， 使卡槽钩住 L型卡榫。
6、 如权利要求 1 ~ 5任一所述的散热器固定装置， 其中， 所述散热器 为集成电路芯片散热器， 集成电路芯片焊接在印制电路板上， 集成电路芯片 散热器的散热面与集成电路芯片的表面贴合。
7、 如权利要求 6所述的散热器固定装置， 其中， 所述卡扣体为 2个 以上， 设置在集成电路芯片周边。
8、 如权利要求 1 ~ 5任一所述的散热器固定装置， 其中， 所述卡扣体 焊接在印制电路板上。
9、 如权利要求 1 ~ 5任一所述的散热器固定装置， 其中 , 所述挂钩体 和卡扣体为金属或非金属， 釆用铸造或机加工方式制造。
10、 如权利要求 1 ~ 5任一所述的散热器固定装置， 其中 , 所述弹性体 为弹簧或金属弹片。
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