WO2017118011A1 - 一种扣式散热器 - Google Patents

一种扣式散热器 Download PDF

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Publication number
WO2017118011A1
WO2017118011A1 PCT/CN2016/093970 CN2016093970W WO2017118011A1 WO 2017118011 A1 WO2017118011 A1 WO 2017118011A1 CN 2016093970 W CN2016093970 W CN 2016093970W WO 2017118011 A1 WO2017118011 A1 WO 2017118011A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
elastic arm
button
bayonet
sink according
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PCT/CN2016/093970
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English (en)
French (fr)
Inventor
单建兵
余方祥
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中兴通讯股份有限公司
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Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2017118011A1 publication Critical patent/WO2017118011A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention relates to the field of machinery, and in particular to a button radiator.
  • the motherboard lines are getting denser and denser, and the number of chips on the motherboard is increasing, whether it is single chip power consumption or overall power consumption is getting higher and higher. Since the wiring is intensive, it is not possible to use the motherboard to punch holes or make other connecting devices for fixing the heat sink on the chip, so that the heat sink is used to bond the heat sink to the chip.
  • the bonding method is not only complicated to manufacture, but also inconvenient to load and unload the heat sink.
  • the thermal conductivity of the thermal conductive adhesive is low, resulting in a large interface thermal resistance between the chip and the heat sink, and the temperature of the chip is increased by 2.5 degrees. about.
  • the thermal conductive adhesive only has a good affinity with the aluminum material, which seriously limits the structure of the heat sink, and only the aluminum material can be used as the bottom structure, which affects the improvement of the heat dissipation capability of the product.
  • the heat sink connected by gluing has become a bottleneck for further improving the heat dissipation capability of the product.
  • an embodiment of the present invention provides a button heat sink.
  • the button heat sink of the embodiment of the invention includes a resilient arm having a bayonet, a heat sink with an opening reserved, and a connecting piece connecting a central processing unit (CPU) and a resilient arm, wherein the connecting member After the fins passing through the reserved opening are caught and fixed by the elastic arms, the heat sink is fixed by the downward pressure generated by the deformation of the elastic arms.
  • a resilient arm having a bayonet, a heat sink with an opening reserved, and a connecting piece connecting a central processing unit (CPU) and a resilient arm, wherein the connecting member After the fins passing through the reserved opening are caught and fixed by the elastic arms, the heat sink is fixed by the downward pressure generated by the deformation of the elastic arms.
  • CPU central processing unit
  • the elastic arm having the bayonet includes a double-layer elastic structure, a bayonet at each end of each layer of the elastic structure, and a connecting piece connecting the double-layer elastic structure.
  • the entrance of the bayonet of the elastic arm is obliquely folded at a certain angle.
  • the size of the bottom opening of the fin of the reserved opening matches the cross-sectional size of the connecting and fastening structure of the connecting member.
  • the connecting member connecting the CPU and the elastic arm comprises a thin plate, a cantilever and a snap fixing structural member.
  • the thin plate is used to insert between a printed circuit board (PCB) and a chip CPU.
  • PCB printed circuit board
  • the cantilever is used to catch the chip CPU.
  • the snap-fit structural member is fixed by the bottom opening of the heat sink to catch the elastic arm bayonet.
  • the elastic arm is at least one of a linear fastener, a sheet metal member, and a silicone member.
  • the connecting member connecting the CPU and the elastic arm is at least one of a linear fastener, a sheet metal member and a rubber member.
  • the button heat sink includes a resilient arm of the bayonet, a heat sink for leaving the opening, and a connecting member connecting the chip CPU and the elastic arm; wherein the connecting member passes through the reserved opening After the heat sink is clamped and fixed, the heat sink is fixed by the downward pressure generated by the deformation of the elastic arm.
  • the adhesive heat sink needs to be removed at a high temperature, and the installation process is complicated again, and the button heat sink is convenient for installation and disassembly, and the range of optimization of the heat sink is broadened.
  • the thermal grease can be used, and the thickness of the thermal paste is small. The thermal conductivity is large, which can greatly reduce the temperature of the chip.
  • the bottom plate can adopt materials with high thermal conductivity such as copper plate, heat pipe and VC, and the temperature uniformity of the heat sink bottom plate is mentioned to improve the thermal conductivity;
  • the heat sink fin material Stamped metal plates can be used to increase the number of fins and improve heat dissipation.
  • FIG. 1 is an assembled view of a heat sink according to an embodiment of the present invention
  • Figure 2 is an exploded view of a heat sink according to an embodiment of the present invention.
  • Figure 3 is a perspective view of an elastic arm of an embodiment of the present invention.
  • Figure 4 is a front elevational view of a heat sink according to an embodiment of the present invention.
  • Figure 5 is a rear view of a heat sink according to an embodiment of the present invention.
  • Figure 6 is a view of a fixing bracket of an embodiment of the present invention.
  • Figure 7 is a perspective view of an elastic arm of a second embodiment of the present invention.
  • Figure 8 is a perspective view of a resilient arm of a third embodiment of the present invention.
  • Figure 9 is a perspective view of an elastic arm of a fourth embodiment of the present invention.
  • the embodiment of the present invention provides a heat sink.
  • the embodiments of the present invention are further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
  • Embodiment 1 When installing, the first step is to brush the thermal paste; in the second part, the arms of the two U-shaped fixing brackets 4 are stuck to the chip to limit the position, and the bracket thin plate 18 is inserted into the gap between the PCB and the chip. The cantilever 19 of the fixing bracket 4 and the cantilever 20 are stuck to the CPU, and the wall 21 of the fixing bracket 4 is close to the CPU.
  • the heat sink is installed, and the heat sink mounting hole 15 is inserted into the step 22 of the fixing bracket 4 to make the bottom surface of the heat sink Close to the top surface of the CPU; in the fourth step, insert the elastic arm 2 into the gap between the heat dissipating teeth, press the connecting piece 6 of the elastic arm 2 to force the bayonet inlet 7 to open, and insert the fixing bracket 4 into the gap 17
  • the elastic arm bayonet 8 is installed.
  • the present invention provides a second embodiment: for a short heat sink, the buckle type elastic arm of FIG. 7 can be used for mounting and fixing.
  • the first step is to brush the thermal grease; the second part, the two U-shaped fixing brackets 4
  • the arm is stuck to the chip to limit the position, and the bracket thin plate 18 is inserted into the PCB board and the chip.
  • the gap between the cantilever 19 and the cantilever 20 of the fixing bracket 4 is stuck to the CPU, and the wall 21 of the fixing bracket 4 is close to the CPU.
  • the heat sink is installed, and the heat sink mounting hole 15 is inserted into the step 22 of the bracket 4 to dissipate heat.
  • the bottom surface of the device is close to the top surface of the CPU; in the fourth step, the elastic arm 2 is inserted into the gap between the heat dissipating teeth, and the connecting piece 6 of the elastic arm 2 is pressed to make the bayonet inlet 7 open, and the fixing bracket 4 is buckled. 17 is inserted into the elastic arm mount 8, that is, the installation is completed.
  • the present invention further provides a third embodiment: for the heat sink with short heat dissipating fins, the buckle type elastic arm of FIG. 8 can be used for mounting and fixing.
  • the first step is to brush the thermal paste; the second part, two U shapes
  • the arm of the fixing bracket 4 is stuck to the chip to limit the position, the bracket thin plate 18 is inserted into the gap between the PCB board and the chip, the cantilever 19 of the fixing bracket 4 and the cantilever 20 are stuck to the CPU, and the wall 21 of the fixing bracket 4 is close to the CPU;
  • the heat sink is installed, and the heat sink mounting hole 15 is inserted into the step 22 of the bracket 4 so that the bottom surface of the heat sink is close to the top surface of the CPU.
  • the elastic arm 2 is inserted into the gap between the heat dissipating teeth, and is pressed hard.
  • the two ends of the elastic arm 2 are connected to the sheet 6, so that the bayonet inlet 7 is opened, and the clip 17 of the fixing bracket 4 is inserted into the elastic arm mount 8, that is, the installation is completed.
  • the present invention provides a fourth embodiment: for a large size heat sink or a heat sink with a long heat dissipation fin, the buckle type elastic arm of FIG. 9 can be used for mounting and fixing, and in the specific installation, the first step is to brush the thermal grease;
  • the arms of the two U-shaped fixing brackets 4 are stuck to the limit function, and the bracket thin plate 18 is inserted into the gap between the PCB board and the chip.
  • the cantilever 19 of the fixing bracket 4 and the cantilever 20 are stuck to the CPU, and the fixing bracket 4 is fixed.
  • the wall 21 is close to the CPU; in the third step, the heat sink is installed, and the heat sink mounting hole 15 is placed in the step 22 of the fixing bracket 4 so that the bottom surface of the heat sink is close to the top surface of the CPU; in the fourth step, the elastic arm 2 is inserted into the heat dissipating tooth. In the gap between the two, the two ends of the elastic arm 2 are connected to the connecting piece 6, so that the bayonet inlet 7 is opened, and the fixing bracket 4 buckle 17 is inserted into the elastic arm bayonet 8, that is, the installation is completed.
  • the button heat sink includes a resilient arm of the bayonet, a heat sink for reserving the opening, and a connecting member connecting the chip CPU and the elastic arm; wherein the connecting member passes through the reserved opening After the heat sink is clamped and fixed to the elastic arm, the heat sink is fixed by the downward pressure generated by the deformation of the elastic arm.
  • the button-type heat sink is easy to install and disassemble, and widens the range of optimization of the heat sink.
  • the thermal grease can be used. The thickness of the thermal paste is small, the thermal conductivity is large, and the temperature of the chip can be greatly reduced.
  • the bottom plate can be made of copper plate and heat pipe. VC and other materials with high thermal conductivity mentioned the temperature uniformity of the heat sink base plate to improve the heat conductivity; thirdly, the heat sink fin material can be stamped metal plate to increase the number of fins and improve the heat dissipation capability.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Orthopedics, Nursing, And Contraception (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种扣式散热器（1），该扣式散热器（1）包括弹性臂（2），散热片（3）以及固定支架（4），弹性臂（2）穿过散热片（3）和固定支架（4）卡扣卡住连接，从而固定散热片（3），该扣式散热器（1）能提高散热效率，并且安装方便。

Description

一种扣式散热器 技术领域
本发明涉及机械领域，特别是涉及一种扣式散热器。
背景技术
目前，随着通讯产品的迅速发展，主板线路越来越密集，主板上芯片数量不断增加，不论是单芯片功耗还是整体功耗越来越高。由于线路密集不能采用在主板打孔或者制作其它连接器件，用来将散热片固定在芯片上面，只好用导热胶将散热片粘接在芯片上。而采用粘接的方法，不但制造复杂，不便于散热片装卸，更由于粘接厚度厚，导热胶的导热系数低，导致芯片和散热片之间的界面热阻大，芯片温度升高2.5度左右。同时导热胶仅和铝材亲合力较好，严重限制了散热器的结构，仅能使用铝材作为底部结构，影响了产品散热能力的提升。通过胶粘连接的散热器已经成为进一步提高产品散热能力的瓶颈。
发明内容
为解决上述技术问题，本发明实施例提供了一种扣式散热器。
本发明实施例的扣式散热器，包括有卡口的弹性臂、预留开口的散热片及连接芯片中央处理器(CPU，Central Processing Unit)和弹性臂的连接件，其中，所述连接件穿过所述预留开口的散热片，与所述弹性臂卡住固定后，通过所述弹性臂形变产生的下压力，固定所述散热片。
本发明实施例中，有卡口的弹性臂包括呈双层弹性结构，每层弹性结构两端的卡口以及连接双层弹性结构的连接片。
本发明实施例中，弹性臂的卡口入口处斜向折一定角度。
本发明实施例中，预留开口的散热片的底层开口的大小与连接件卡扣固定结构件的横截面大小相匹配。
本发明实施例中，连接CPU和弹性臂的连接件包括薄板，悬臂和卡扣固定结构件。
本发明实施例中，薄板用于插入印制电路板(PCB，Printed Circuit Board)板和芯片CPU之间。
本发明实施例中，悬臂用于卡住芯片CPU。
本发明实施例中，卡扣固定结构件穿过所述散热片底部开口卡住弹性臂卡口固定。
本发明实施例中，弹性臂为线性扣具、钣金件、朔胶件中的至少一种。
本发明实施例中，连接CPU和弹性臂的连接件为线性扣具、钣金件、朔胶件中的至少一种。
本发明实施例的技术方案中，扣式散热器包括卡口的弹性臂、预留开口的散热片及连接芯片CPU和弹性臂的连接件；其中，所述连接件穿过所述预留开口的散热片，与所述弹性臂卡住固定后，通过所述弹性臂形变产生的下压力，固定所述散热片。可见，胶粘散热器需要在高温下才能拆下来，而且再次安装工艺复杂，而扣式散热器便于安装拆卸，拓宽了散热器优化的范围，其一，可以采用导热膏，导热膏厚度小，导热系数大，可大大降低芯片的温度；其二，底板可以采用铜板、热管、VC等高导热能力的材料，提到散热器底板温度均匀度，提高导热能力；其三，散热器鳍片材料可以采用冲压金属板，增加鳍片数量，提高散热能力。
附图说明
图1是本发明实施例的散热器组装图；
图2是本发明实施例的散热器爆炸图；
图3是本发明实施例的方案一弹性臂图；
图4是本发明实施例的散热片正面图；
图5是本发明实施例的散热片背面图；
图6是本发明实施例的固定支架图；
图7是本发明实施例二的弹性臂图；
图8是本发明实施例三的弹性臂图；
图9是本发明实施例四的弹性臂图。
图中标号对应的部件如下：1.跨梁式扣具散热器；2.弹性臂；3.散热片；4.固定支架；5.CPU芯片；6.连接片；7.卡口入口；8.弹性臂卡口；9.支点；10.扣具臂；11.散热齿；12.安装槽；13.散热片底座；14.限位槽；15.安装孔；16.支架柱；17.卡扣；18.支架薄板；19.悬臂A；20.悬臂B；21.壁；22.台阶。
具体实施方式
为了解决现有技术散热片的散热效果较差的问题，本发明实施例提供了一种散热片，以下结合附图以及实施例，对本发明实施例进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明，并不限定本发明，以下具体结合图1至图9所示结构描述。
实施例一：安装时，第一步，刷导热膏；第二部，两个U形固定支架4的臂卡住芯片起到限位作用，将支架薄板18插入PCB板和芯片之间的缝隙，固定支架4的悬臂19和悬臂20卡住CPU，固定支架4的壁21贴近CPU；第三步，安装散热片，将散热片安装孔15套入固定支架4的台阶22，使散热器底面贴近CPU顶面；第四步，将弹性臂2插入散热齿之间的间隙里，用力压弹性臂2的两端连接片6，使卡口入口7张开，将固定支架4卡扣17插入弹性臂卡口8中，即安装完毕。
本发明提供第二个实施例：针对短小的散热片，可以采用图7的扣式弹性臂安装固定，具体安装时，第一步，刷导热膏；第二部，两个U形固定支架4的臂卡住芯片起到限位作用，将支架薄板18插入PCB板和芯片之 间的缝隙，固定支架4的悬臂19和悬臂20卡住CPU，固定支架4的壁21贴近CPU；第三步，安装散热片，将散热片安装孔15套入支架4的台阶22，使散热器底面贴近CPU顶面；第四步，将弹性臂2插入散热齿之间的间隙里，用力压弹性臂2的两端连接片6，使卡口入口7张开，将固定支架4卡扣17插入弹性臂卡口8中，即安装完毕。
本发明还提供第三个实施例：针对散热齿短的散热片，可以采用图8的扣式弹性臂安装固定，具体安装时，第一步，刷导热膏；第二部，两个U形固定支架4的臂卡住芯片起到限位作用，将支架薄板18插入PCB板和芯片之间的缝隙，固定支架4的悬臂19和悬臂20卡住CPU，固定支架4的壁21贴近CPU；第三步，安装散热片，将散热片安装孔15套入支架4的台阶22，使散热器底面贴近CPU顶面；第四步，将弹性臂2插入散热齿之间的间隙里，用力压弹性臂2的两端连接片6，使卡口入口7张开，将固定支架4卡扣17插入弹性臂卡口8中，即安装完毕。
本发明提供第四个实施例：针对尺寸大的散热片或者散热齿过长的散热片，可以采用图9的扣式弹性臂安装固定，具体安装时，第一步，刷导热膏；第二部，两个U形固定支架4的臂卡住芯片起到限位作用，将支架薄板18插入PCB板和芯片之间的缝隙，固定支架4的悬臂19和悬臂20卡住CPU，固定支架4的壁21贴近CPU；第三步，安装散热片，将散热片安装孔15套入固定支架4的台阶22，使散热器底面贴近CPU顶面；第四步，将弹性臂2插入散热齿之间的间隙里，用力压弹性臂2的两端连接片6，使卡口入口7张开，将固定支架4卡扣17插入弹性臂卡口8中，即安装完毕。
以上仅为本发明的优选实施例，并非因此限制其专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。
工业实用性
本发明实施例的技术方案，扣式散热器包括卡口的弹性臂、预留开口的散热片及连接芯片CPU和弹性臂的连接件；其中，所述连接件穿过所述预留开口的散热片，与所述弹性臂卡住固定后，通过所述弹性臂形变产生的下压力，固定所述散热片。扣式散热器便于安装拆卸，拓宽了散热器优化的范围，其一，可以采用导热膏，导热膏厚度小，导热系数大，可大大降低芯片的温度；其二，底板可以采用铜板、热管、VC等高导热能力的材料，提到散热器底板温度均匀度，提高导热能力；其三，散热器鳍片材料可以采用冲压金属板，增加鳍片数量，提高散热能力。

Claims (10)

  1. 一种扣式散热器，包括有卡口的弹性臂、预留开口的散热片及连接芯片中央处理器CPU和弹性臂的固定支架，其中：
    所述固定支架穿过所述预留开口的散热片，与所述弹性臂卡住固定后，通过所述弹性臂形变产生的下压力，固定所述散热片。
  2. 根据权利要求1所述的扣式散热器，其中，所述有卡口的弹性臂呈双层弹性结构，每层弹性结构卡口分别在两端，双层弹性结构中间有连接单个弹性臂的连接片。
  3. 根据权利要求2所述的扣式散热器，其中，所述弹性臂的卡口入口处斜向折一定角度。
  4. 根据权利要求1所述的扣式散热器，其中，所述预留开口的散热片的底层开口的大小与固定支架的支架柱横截面大小相匹配。
  5. 根据权利要求1所述的扣式散热器，其中，所述连接芯片CPU和弹性臂的固定支架包括支架薄板，悬臂，支架柱和卡扣固定结构件。
  6. 根据权利要求5所述的扣式散热器，其中，所述薄板用于插入印制电路板PCB板和芯片CPU之间。
  7. 根据权利要求5所述的扣式散热器，其中，所述悬臂用于卡住芯片CPU。
  8. 根据权利要求5所述的扣式散热器，其中，所述固定支架支架柱穿过所述散热片底部开口卡住弹性臂卡口固定。
  9. 根据权利要求2或3所述的扣式散热器，其中，所述弹性臂为线性扣具、钣金件、朔胶件中的至少一种。
  10. 根据权利要求5至8任一项所述的扣式散热器，其中，所述连接CPU芯片和弹性臂的固定支架为线性扣具、钣金件、朔胶件中的至少一种。
PCT/CN2016/093970 2016-01-08 2016-08-08 一种扣式散热器 WO2017118011A1 (zh)

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