JP6019238B2 - 放熱器固定装置 - Google Patents
放熱器固定装置 Download PDFInfo
- Publication number
- JP6019238B2 JP6019238B2 JP2015532285A JP2015532285A JP6019238B2 JP 6019238 B2 JP6019238 B2 JP 6019238B2 JP 2015532285 A JP2015532285 A JP 2015532285A JP 2015532285 A JP2015532285 A JP 2015532285A JP 6019238 B2 JP6019238 B2 JP 6019238B2
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- JP
- Japan
- Prior art keywords
- hook
- radiator
- snap
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
Claims (6)
- 放熱器固定装置であって、放熱器端のフック体及びプリント回路基板端のスナップ体を含み、前記スナップ体は表面実装方式でプリント回路基板に固定され、前記フック体は弾性体がスリーブ設置され、放熱器に開設された取付穴を貫通して前記スナップ体に係止され、放熱器をプリント回路基板に取り付けて固定し、
前記フック体は、柱体、柱キャップ及びフックを含み、前記柱キャップは、柱体の一端に設置され、前記フックは、柱体の他端に設置され、前記フックは、柱体に垂直で、L型フックを形成し、
前記スナップ体は、一端が開口された矩形フレームであり、開口端にスナップが設置されてC型スナップを形成し、前記フック体は、弾性体にスリーブ接続された後放熱器における取付穴を貫通して、弾性体を圧縮し、フック体のフックは、スナップ体の開口端に達してから回転し、C型スナップをL型フックにフックさせ、
又は、
前記フック体は、柱体、柱キャップ及び係合ホゾを含み、柱キャップは、柱体の一端に設置され、係合ホゾは、柱体の他端に設置され、係合ホゾは、柱体に垂直で、L型係合ホゾを形成し、
前記スナップ体は、スリーブ構造であり、スリーブの側壁に弧形スライドが開設され、スライドの端部に係合スロットが設置され、前記係合スロットの頂端は前記係合スロットの頂端と前記スライドとの過渡突出部よりも高く、前記フック体は、弾性体にスリーブ接続された後放熱器における取付穴を貫通して、弾性体を圧縮し、フック体の係合ホゾは、スライドに沿って係合スロットに入り、係合スロットをL型係合ホゾにフックさせる放熱器固定装置。 - 前記放熱器は、集積回路チップ放熱器であり、集積回路チップは、プリント回路基板にボンディングされ、集積回路チップ放熱器の放熱面は集積回路チップの表面に密着される請求項1に記載の放熱器固定装置。
- 前記スナップ体は、2つ以上であり、集積回路チップの周辺に設置される請求項2に記載の放熱器固定装置。
- 前記スナップ体は、プリント回路基板にボンディングされる請求項1に記載の放熱器固定装置。
- 前記フック体及びスナップ体は、金属又は非金属であり、鋳造又は機械加工方式で製造される請求項1に記載の放熱器固定装置。
- 前記弾性体は、バネ又は金属クリップである請求項1に記載の放熱器固定装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012204811168U CN202841813U (zh) | 2012-09-20 | 2012-09-20 | 散热器固定装置 |
CN201220481116.8 | 2012-09-20 | ||
PCT/CN2013/082543 WO2014044114A1 (zh) | 2012-09-20 | 2013-08-29 | 散热器固定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015536040A JP2015536040A (ja) | 2015-12-17 |
JP6019238B2 true JP6019238B2 (ja) | 2016-11-02 |
Family
ID=47953395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015532285A Active JP6019238B2 (ja) | 2012-09-20 | 2013-08-29 | 放熱器固定装置 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2887784B1 (ja) |
JP (1) | JP6019238B2 (ja) |
CN (1) | CN202841813U (ja) |
WO (1) | WO2014044114A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI669480B (zh) * | 2019-01-22 | 2019-08-21 | 奇鋐科技股份有限公司 | 固定結構之承載單元及散熱總成之固定結構 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202841813U (zh) * | 2012-09-20 | 2013-03-27 | 中兴通讯股份有限公司 | 散热器固定装置 |
CN105682338A (zh) * | 2016-02-04 | 2016-06-15 | 青岛海信电器股份有限公司 | 散热装置及散热装置装配方法 |
US10224660B2 (en) | 2016-10-18 | 2019-03-05 | Microsoft Technology Licensing, Llc | Threaded circuit board |
WO2019034246A1 (en) * | 2017-08-16 | 2019-02-21 | Arcelik Anonim Sirketi | SURFACE MOUNTING THERMAL DISSIPATORS FOR PRINTED CIRCUIT BOARDS AND METHOD OF ASSEMBLING THE SAME |
CN108834385B (zh) * | 2018-08-23 | 2024-02-27 | 深圳市金卓立五金制品有限公司 | 一种散热片及其安装方法 |
CN114294990B (zh) * | 2021-12-30 | 2023-05-05 | 江苏徐工工程机械研究院有限公司 | 散热器安装结构和工程机械 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6152406A (ja) * | 1984-08-23 | 1986-03-15 | 吉田 隆治 | 結合固定具 |
SE9401203L (sv) * | 1994-04-11 | 1995-10-12 | Ellemtel Utvecklings Ab | Skärm och kylare |
JP2000236185A (ja) * | 1999-02-16 | 2000-08-29 | Kenwood Corp | プリント基板に取付けられる電子デバイスへの放熱器取付け構造 |
CN2416612Y (zh) * | 2000-04-05 | 2001-01-24 | 富准精密工业(深圳)有限公司 | 散热装置 |
TWM244712U (en) * | 2003-12-26 | 2004-09-21 | Hon Hai Prec Ind Co Ltd | Heat sink fastener |
CN2733590Y (zh) * | 2004-08-13 | 2005-10-12 | 东莞莫仕连接器有限公司 | 带有引流罩的散热装置 |
JP4412498B2 (ja) * | 2006-03-23 | 2010-02-10 | 日本電気株式会社 | ヒートシンクの取り付け構造 |
CN200966203Y (zh) * | 2006-11-07 | 2007-10-24 | 东莞莫仕连接器有限公司 | 散热装置 |
CN101336062B (zh) * | 2007-06-29 | 2011-05-11 | 富准精密工业(深圳)有限公司 | 散热装置组合 |
CN101616563B (zh) * | 2008-06-27 | 2012-06-13 | 富准精密工业(深圳)有限公司 | 散热装置组合 |
CN101848623B (zh) * | 2009-03-25 | 2013-06-05 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN202841813U (zh) * | 2012-09-20 | 2013-03-27 | 中兴通讯股份有限公司 | 散热器固定装置 |
-
2012
- 2012-09-20 CN CN2012204811168U patent/CN202841813U/zh not_active Expired - Lifetime
-
2013
- 2013-08-29 EP EP13839889.6A patent/EP2887784B1/en active Active
- 2013-08-29 JP JP2015532285A patent/JP6019238B2/ja active Active
- 2013-08-29 WO PCT/CN2013/082543 patent/WO2014044114A1/zh active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI669480B (zh) * | 2019-01-22 | 2019-08-21 | 奇鋐科技股份有限公司 | 固定結構之承載單元及散熱總成之固定結構 |
US10867886B2 (en) | 2019-01-22 | 2020-12-15 | Asia Vital Components Co., Ltd. | Female fastener holder for fixing structure and fixing structure for heat dissipation assembly |
Also Published As
Publication number | Publication date |
---|---|
EP2887784A1 (en) | 2015-06-24 |
JP2015536040A (ja) | 2015-12-17 |
CN202841813U (zh) | 2013-03-27 |
EP2887784A4 (en) | 2015-10-07 |
EP2887784B1 (en) | 2019-04-10 |
WO2014044114A1 (zh) | 2014-03-27 |
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