JP2015223044A - 回路構成体および電気接続箱 - Google Patents
回路構成体および電気接続箱 Download PDFInfo
- Publication number
- JP2015223044A JP2015223044A JP2014106803A JP2014106803A JP2015223044A JP 2015223044 A JP2015223044 A JP 2015223044A JP 2014106803 A JP2014106803 A JP 2014106803A JP 2014106803 A JP2014106803 A JP 2014106803A JP 2015223044 A JP2015223044 A JP 2015223044A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- heat sink
- heat
- conductive member
- circuit structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/02—Details
- H02G3/08—Distribution boxes; Connection or junction boxes
- H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
Abstract
Description
本明細書によって開示される技術は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような種々の態様も含まれる。
11…回路構成体
12…回路基板
13…接続用開口部
16…バスバー
20…電子部品
25…放熱板
30…絶縁シート
35…熱伝導性部材
38…ボルト
39…ナット
40…ケース
Claims (3)
- 放熱板と、
前記放熱板に重ねられた絶縁シートと、
前記放熱板に前記絶縁シートを介して重ねられた回路基板と、を有する回路構成体であって、
前記回路基板はねじ止めにより前記放熱板に固定されており、
前記絶縁シートと前記回路基板との間に、熱伝導性部材が配されている回路構成体。 - 前記回路基板のうち前記放熱板が配される面と反対側の面に電子部品が実装されており、
前記熱伝導性部材は、前記回路基板のうち前記電子部品が実装される領域に対応する領域に設けられている請求項1に記載の回路構成体。 - 請求項1または2に記載の回路構成体をケースに収容してなる電気接続箱。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014106803A JP2015223044A (ja) | 2014-05-23 | 2014-05-23 | 回路構成体および電気接続箱 |
PCT/JP2015/063433 WO2015178232A1 (ja) | 2014-05-23 | 2015-05-11 | 回路構成体および電気接続箱 |
CN201580024044.0A CN106463930A (zh) | 2014-05-23 | 2015-05-11 | 电路结构体及电连接箱 |
US15/308,859 US10117322B2 (en) | 2014-05-23 | 2015-05-11 | Circuit assembly and electric junction box |
DE112015002430.1T DE112015002430T5 (de) | 2014-05-23 | 2015-05-11 | Schaltungsbaugruppe und elektrischer Verteiler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014106803A JP2015223044A (ja) | 2014-05-23 | 2014-05-23 | 回路構成体および電気接続箱 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015223044A true JP2015223044A (ja) | 2015-12-10 |
Family
ID=54553905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014106803A Pending JP2015223044A (ja) | 2014-05-23 | 2014-05-23 | 回路構成体および電気接続箱 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10117322B2 (ja) |
JP (1) | JP2015223044A (ja) |
CN (1) | CN106463930A (ja) |
DE (1) | DE112015002430T5 (ja) |
WO (1) | WO2015178232A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017110539A1 (ja) * | 2015-12-24 | 2017-06-29 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
WO2017145784A1 (ja) * | 2016-02-22 | 2017-08-31 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
WO2020105391A1 (ja) * | 2018-11-21 | 2020-05-28 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
WO2020105393A1 (ja) * | 2018-11-21 | 2020-05-28 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
US10912232B2 (en) | 2016-12-09 | 2021-02-02 | Mitsubishi Electric Corporation | Electronic circuit board and power conversion device |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016119798A (ja) * | 2014-12-22 | 2016-06-30 | 株式会社オートネットワーク技術研究所 | 回路構成体及び電気接続箱 |
JP6477373B2 (ja) * | 2015-09-11 | 2019-03-06 | 株式会社オートネットワーク技術研究所 | 回路構成体および電気接続箱 |
KR102495931B1 (ko) * | 2015-12-15 | 2023-02-02 | 엘지디스플레이 주식회사 | 인쇄 회로 기판 및 이를 포함하는 표시 장치 |
JP6443632B2 (ja) * | 2015-12-16 | 2018-12-26 | 株式会社オートネットワーク技術研究所 | 回路構成体、及び電気接続箱 |
JP2018164324A (ja) * | 2017-03-24 | 2018-10-18 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
JP6760497B2 (ja) * | 2017-05-24 | 2020-09-23 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
DE102018207943A1 (de) | 2018-05-22 | 2019-11-28 | Zf Friedrichshafen Ag | Elektronikmodul zur Anordnung an einem Getriebebauteil und Verfahren zur Anordnung eines Elektronikmoduls an einem Getriebebauteil |
US11670929B2 (en) * | 2021-06-02 | 2023-06-06 | Schaeffler Technologies AG & Co. KG | Heat dissipation and sealing configuration for junction assembly |
US11955871B2 (en) * | 2021-09-28 | 2024-04-09 | Schaeffler Technologies AG & Co. KG | Emotor connection arrangement with phase bar cooling and compliant internal support in the junction box |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11330709A (ja) * | 1998-05-14 | 1999-11-30 | Ishikawajima Harima Heavy Ind Co Ltd | ヒートシンク付メタルクラッド基板 |
JP2003179316A (ja) * | 2001-12-13 | 2003-06-27 | Fuji Kiko Denshi Kk | 放熱性に優れたプリント配線板の構造 |
JP2005151624A (ja) * | 2003-11-11 | 2005-06-09 | Sumitomo Wiring Syst Ltd | 回路構成体の製造方法 |
JP2010232318A (ja) * | 2009-03-26 | 2010-10-14 | Toyota Industries Corp | 半導体装置および熱伝シート |
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US5708566A (en) * | 1996-10-31 | 1998-01-13 | Motorola, Inc. | Solder bonded electronic module |
TW408453B (en) * | 1997-12-08 | 2000-10-11 | Toshiba Kk | Package for semiconductor power device and method for assembling the same |
US6156980A (en) * | 1998-06-04 | 2000-12-05 | Delco Electronics Corp. | Flip chip on circuit board with enhanced heat dissipation and method therefor |
JP2001135758A (ja) * | 1999-11-04 | 2001-05-18 | Toyota Autom Loom Works Ltd | パワーモジュールの放熱構造 |
US6549409B1 (en) * | 2000-08-21 | 2003-04-15 | Vlt Corporation | Power converter assembly |
US7167377B2 (en) | 2001-11-26 | 2007-01-23 | Sumitoo Wiring Systems, Ltd. | Circuit-constituting unit and method of producing the same |
JP3927017B2 (ja) | 2001-11-26 | 2007-06-06 | 株式会社オートネットワーク技術研究所 | 回路構成体及びその製造方法 |
US6724631B2 (en) * | 2002-04-22 | 2004-04-20 | Delta Electronics Inc. | Power converter package with enhanced thermal management |
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JP4278680B2 (ja) * | 2006-12-27 | 2009-06-17 | 三菱電機株式会社 | 電子制御装置 |
JP4385058B2 (ja) * | 2007-05-07 | 2009-12-16 | 三菱電機株式会社 | 電子制御装置 |
JP2010245174A (ja) * | 2009-04-02 | 2010-10-28 | Denso Corp | 電子制御ユニット及びその製造方法 |
US8520389B2 (en) * | 2009-12-02 | 2013-08-27 | Hamilton Sundstrand Corporation | Power semiconductor module for wide temperature applications |
JP5546889B2 (ja) * | 2010-02-09 | 2014-07-09 | 日本電産エレシス株式会社 | 電子部品ユニット及びその製造方法 |
US8737073B2 (en) * | 2011-02-09 | 2014-05-27 | Tsmc Solid State Lighting Ltd. | Systems and methods providing thermal spreading for an LED module |
CN103688373B (zh) * | 2012-04-11 | 2016-03-02 | 株式会社理技独设计系统 | 照明装置以及液晶显示装置 |
US9257310B2 (en) * | 2012-10-19 | 2016-02-09 | Haesung Ds Co., Ltd. | Method of manufacturing circuit board and chip package and circuit board manufactured by using the method |
-
2014
- 2014-05-23 JP JP2014106803A patent/JP2015223044A/ja active Pending
-
2015
- 2015-05-11 US US15/308,859 patent/US10117322B2/en active Active
- 2015-05-11 DE DE112015002430.1T patent/DE112015002430T5/de not_active Ceased
- 2015-05-11 WO PCT/JP2015/063433 patent/WO2015178232A1/ja active Application Filing
- 2015-05-11 CN CN201580024044.0A patent/CN106463930A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11330709A (ja) * | 1998-05-14 | 1999-11-30 | Ishikawajima Harima Heavy Ind Co Ltd | ヒートシンク付メタルクラッド基板 |
JP2003179316A (ja) * | 2001-12-13 | 2003-06-27 | Fuji Kiko Denshi Kk | 放熱性に優れたプリント配線板の構造 |
JP2005151624A (ja) * | 2003-11-11 | 2005-06-09 | Sumitomo Wiring Syst Ltd | 回路構成体の製造方法 |
JP2010232318A (ja) * | 2009-03-26 | 2010-10-14 | Toyota Industries Corp | 半導体装置および熱伝シート |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017110539A1 (ja) * | 2015-12-24 | 2017-06-29 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
WO2017145784A1 (ja) * | 2016-02-22 | 2017-08-31 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
US10912232B2 (en) | 2016-12-09 | 2021-02-02 | Mitsubishi Electric Corporation | Electronic circuit board and power conversion device |
WO2020105391A1 (ja) * | 2018-11-21 | 2020-05-28 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
WO2020105393A1 (ja) * | 2018-11-21 | 2020-05-28 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
US11778724B2 (en) | 2018-11-21 | 2023-10-03 | Autonetworks Technologies, Ltd. | Circuit structure |
Also Published As
Publication number | Publication date |
---|---|
US10117322B2 (en) | 2018-10-30 |
WO2015178232A1 (ja) | 2015-11-26 |
US20170079129A1 (en) | 2017-03-16 |
CN106463930A (zh) | 2017-02-22 |
DE112015002430T5 (de) | 2017-03-09 |
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