WO2014024872A1 - 光学表示デバイスの生産方法および光学表示デバイスの生産システム - Google Patents

光学表示デバイスの生産方法および光学表示デバイスの生産システム Download PDF

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Publication number
WO2014024872A1
WO2014024872A1 PCT/JP2013/071228 JP2013071228W WO2014024872A1 WO 2014024872 A1 WO2014024872 A1 WO 2014024872A1 JP 2013071228 W JP2013071228 W JP 2013071228W WO 2014024872 A1 WO2014024872 A1 WO 2014024872A1
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WIPO (PCT)
Prior art keywords
optical member
optical display
optical
bonding
member sheet
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Application number
PCT/JP2013/071228
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English (en)
French (fr)
Japanese (ja)
Inventor
大充 田中
幹士 藤井
Original Assignee
住友化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 住友化学株式会社 filed Critical 住友化学株式会社
Priority to CN201380041638.3A priority Critical patent/CN104520917B/zh
Priority to KR1020157003600A priority patent/KR101975632B1/ko
Priority to JP2014529504A priority patent/JP5804399B2/ja
Publication of WO2014024872A1 publication Critical patent/WO2014024872A1/ja

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays

Definitions

  • the present invention relates to an optical display device production method and an optical display device production system.
  • This application claims priority based on Japanese Patent Application No. 2012-175999 filed on Aug. 08, 2012 and Japanese Patent Application No. 2013-104404 filed on May 16, 2013, and the contents thereof. Is hereby incorporated by reference.
  • an optical member such as a polarizing plate to be bonded to a liquid crystal panel (optical display component) is cut out from a long optical member sheet into a substantially rectangular shape according to the liquid crystal panel. Then, it is bonded to a liquid crystal panel (for example, see Patent Document 1).
  • the optical member needs to be bonded so as to cover the optical display component.
  • the optical member is cut out from the optical member sheet in accordance with the shape of the optical display component.
  • the optical member is cut out from the optical member sheet using laser light.
  • the method of cutting out an optical member from an optical member sheet using laser light has the following problems.
  • a method of cutting out an optical member from an optical member sheet using a laser beam first, there is a method of continuously scanning the laser beam along the outer shape of the optical member to be formed.
  • the scanning speed of the laser beam is slowed when the corners of the optical member are formed. Therefore, the irradiation time of the laser beam to the corner part of the optical member becomes long.
  • the laser beam is scanned along the line and the cutting line by the laser beam intersects at the corner.
  • the laser beam is irradiated on the corners of the optical member in an overlapping manner. Therefore, the irradiation time of the laser beam to the corner part of the optical member becomes long.
  • the corner of the optical member since the energy of the laser beam is concentrated on the corner of the optical member, the corner of the optical member may be bent due to heat or the like to have an R shape. Thereby, when an optical member is bonded to the display area of the optical display component to form an optical display device, light may leak from the display area of the optical display component, and the performance of the optical display device may not be ensured. .
  • an object of the present invention is to provide an optical display device production method and an optical display device production system capable of suppressing the corners of the optical member from being R-shaped when the optical member is cut out from the optical member sheet.
  • An optical display device production method of the present invention is an optical display device production method formed by bonding an optical member to an optical display component, and the optical display component A bonding step in which an optical member sheet larger than the display area of the optical display component is bonded to form a bonded body, a facing portion of the optical member sheet in the bonded body with the display region, and an outer side of the facing portion.
  • the cutting step holding the bonded body on a holding surface of a table
  • the laser light scanned biaxially by the scanner in a plane parallel to the holding surface while relatively moving the step and the table and the scanner that scans the laser light.
  • the scanner relatively moves with respect to the table along a relative movement locus having a shape in which a corner portion of the optical display component is bent inward, and the movement locus of the laser light on the optical member sheet is
  • the laser beam is emitted toward the outside of the relative movement locus by the scanner so as to be along the corner of the optical display component.
  • the movement trajectory of the laser beam at the corner of the optical display component is the laser beam along one of the two sides sandwiching the corner of the optical display component. It is characterized in that it bulges outside the virtual bent shape formed at the intersection of the extension line of the movement locus and the extension line of the movement locus of the laser beam along the other side.
  • An optical display device production system includes a bonding apparatus in which an optical member sheet larger than a display area of the optical display component is bonded to the optical display component to form a bonded body.
  • a table having a holding surface for holding the bonded body, a scanner capable of biaxial scanning with laser light in a plane parallel to the holding surface, and a moving device capable of relatively moving the table and the scanner.
  • a laser beam irradiating device, and the laser beam irradiating device separates a portion facing the display area of the optical member sheet in the bonded body and a surplus portion outside the facing portion, and the optical member.
  • the moving device When the optical member having a size corresponding to the display area is formed from a sheet, and the laser beam is applied to the corner of the optical display component, the moving device is The table and the scanner are relatively moved along a relative movement locus having a shape in which a corner portion of the display component is curved inward, and the scanner has a movement locus of the laser light on the optical member sheet.
  • the laser light is emitted toward the outside of the relative movement trajectory so as to follow the corner of the optical display component.
  • the method for producing an optical display device of the present invention is a method for producing an optical display device formed by bonding an optical member to an optical display component, wherein the optical display A bonding step of bonding an optical member sheet larger than the display area of the optical display component to the component to form a bonded body, a facing portion of the optical member sheet in the bonded body with the display region, and the facing portion Cutting the outer surplus portion and forming the optical member having a size corresponding to the display area from the optical member sheet, wherein the cutting step holds the bonded body on the holding surface of the table
  • the laser beam scanned biaxially by the scanning element in a plane parallel to the holding surface while relatively moving the holding step and the scanning element that scans the table and the laser beam.
  • the scanning element relatively moves with respect to the table along a relative movement locus having a shape in which a corner portion of the optical display component is bent inward, and the laser light moves on the optical member sheet. The scanning element irradiates the laser beam toward the outside of the relative movement locus so that the locus is along the corner of the optical display component.
  • a straight line extension along one side and a straight line extension along the other side of the two sides sandwiching the corner of the optical display component intersect each other.
  • the virtually formed shape is set as a virtual bent shape
  • the virtual bent shape is set as a position for separating the facing portion and the surplus portion
  • the relative movement locus at the corner of the optical display component is set as the Set inside the virtual bending shape and irradiate the laser light toward the outside of the relative movement trajectory so that the scanning position of the laser light at the corner of the optical display component matches the virtual bending shape It is also possible to set a deviation amount between the relative movement trajectory and the laser light movement trajectory.
  • the bonded body prior to the cutting step, further includes a detection step of detecting an outer peripheral edge of the bonding surface between the optical member sheet and the optical display component, The position where the facing part and the surplus part are separated may be set along the detected outer peripheral edge.
  • An optical display device production system is an optical display device production system formed by bonding an optical member to an optical display component, and the optical display component includes the optical display device.
  • a laser beam irradiation device comprising: a scanning element capable of scanning the laser beam in two axes in a plane parallel to a holding surface; and a moving device capable of relatively moving the table and the scanning element.
  • the light irradiation device separates a facing portion of the bonded body from the display area of the optical member sheet and a surplus portion outside the facing portion, and removes the surface from the optical member sheet.
  • the moving device has a shape in which the corner of the optical display component is curved inward.
  • the table and the scanning element are relatively moved along a relative movement locus having the scanning element so that the movement locus of the laser light on the optical member sheet is along a corner of the optical display component.
  • the laser beam is emitted toward the outside of the relative movement locus.
  • a straight line extension along one side and a straight line extension along the other side of the two sides sandwiching the corner of the optical display component intersect each other.
  • the virtually formed shape is set as a virtual bent shape
  • the virtual bent shape is set as a position for separating the facing portion and the surplus portion
  • the relative movement locus at the corner of the optical display component is set as the Set inside the virtual bending shape and irradiate the laser light toward the outside of the relative movement trajectory so that the scanning position of the laser light at the corner of the optical display component matches the virtual bending shape It is also possible to set a deviation amount between the relative movement trajectory and the laser light movement trajectory.
  • the bonded body further includes a detection unit that detects an outer peripheral edge of a bonded surface between the optical member sheet and the optical display component, and the facing portion and the surplus The position where the part is separated may be set along the detected outer peripheral edge.
  • the scanner moves relative to the table along the relative movement locus having a curved shape inside the corner of the optical display component, it is possible to suppress a decrease in the relative movement speed between the table and the scanner. . Furthermore, since the laser beam is emitted toward the outside of the relative movement locus by the scanner so that the movement locus of the laser beam is along the corner of the optical display component, the relative movement locus of the table and the scanner and the laser beam emitted by the scanner are The movement trajectory of the laser beam obtained when combined with the irradiation trajectory can be formed along the corner of the optical display component. Moreover, since the laser beam is scanned by the scanner, the movement trajectory of the laser beam can be controlled with high accuracy.
  • the “opposite part of the display area” in the above indicates an area that is not less than the size of the display area and not more than the size of the outer shape of the optical display component and that avoids a functional part such as an electrical component mounting portion. . That is, in the above, the case where the excess part is laser-cut along the outer periphery of an optical display component is included. In the present specification, the cutting process using laser light may be referred to as “laser cut”.
  • the “bonding surface between the optical member sheet and the optical display component” in the above configuration refers to a surface facing the optical member sheet of the optical display component, and “the outer peripheral edge of the bonding surface” is specifically Refers to the outer peripheral edge of the substrate on the side where the optical member sheet is bonded in the optical display component.
  • FIG. 1 shows one Embodiment of the manufacturing apparatus of the optical member bonding body of this invention. It is a perspective view of a laser beam irradiation apparatus. It is a perspective view which shows the internal structure of a 2nd cutting device equally. It is a perspective view of the 2nd bonding apparatus periphery of the manufacturing apparatus of an optical member bonding body equally. It is sectional drawing of the 1st bonding sheet
  • FIG. 8 is a cross-sectional view taken along the line AA of FIG. It is sectional drawing of the double-sided bonding panel which passed through the manufacturing apparatus of the optical member bonding body equally. It is sectional drawing which shows the cutting end by the laser of the optical member sheet
  • the width direction of the optical display component is the X direction
  • the direction (liquid crystal panel transport direction) orthogonal to the X direction in the plane of the liquid crystal panel is the Y direction, the X direction, and the Y direction.
  • the direction orthogonal to the Z direction is taken as the Z direction.
  • an optical display device production system is illustrated as an optical member bonding body manufacturing apparatus, and a film bonding system constituting a part of the optical display device production system will be described.
  • FIG. 1 shows a schematic configuration of the film bonding system 1 of the present embodiment.
  • the film bonding system 1 bonds a film-shaped optical member such as a polarizing film, a retardation film, and a brightness enhancement film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.
  • the film bonding system 1 manufactures the optical member bonding body including the optical display component and the optical member.
  • a liquid crystal panel P is used as the optical display component.
  • Each part of the film bonding system 1 is comprehensively controlled by a control device 20 as an electronic control device.
  • the film bonding system 1 sequentially performs a predetermined process on the liquid crystal panels P while transporting the liquid crystal panels P from the start position to the end position using, for example, the drive roller conveyor 5.
  • the liquid crystal panel P is conveyed on the roller conveyor 5 with its front and back surfaces being horizontal.
  • the left side ( ⁇ Y direction side) is the upstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the upstream side of the panel transport), and the right side in FIG. , Referred to as the panel conveyance downstream side).
  • the liquid crystal panel P has a rectangular shape in a plan view, and a display region P4 having an outer shape along the outer peripheral edge is formed inside the outer peripheral edge by a predetermined width.
  • the liquid crystal panel P is transported in a direction in which the short side of the display area P4 is substantially along the transport direction on the upstream side of the panel transport from the second alignment device 14 described later. Further, the liquid crystal panel P is transported in a direction in which the long side of the display area P4 is substantially along the transport direction on the downstream side of the panel transport from the second alignment device 14.
  • the first optical member F11 and the third optical member F13 as polarizing films are bonded to both the backlight side and the display surface side of the liquid crystal panel P, respectively.
  • a second optical member F12 as a brightness enhancement film is further bonded to the surface on the backlight side of the liquid crystal panel P so as to overlap the first optical member F11.
  • the film bonding system 1 conveys the liquid crystal panel P from the upstream process to the panel conveyance upstream side of the roller conveyor 5.
  • the film bonding system 1 includes a first alignment device 11, a first bonding device 12, a first cutting device 13, a second alignment device 14, a second bonding device 15, and a second cutting device 16. , A third alignment device 17, a third bonding device 18, and a third cutting device 19.
  • the first alignment device 11 holds the liquid crystal panel P and freely transports the liquid crystal panel P in the vertical direction (Z direction) and the horizontal direction (XY direction).
  • the first alignment device 11 has a pair of cameras that image the upstream and downstream ends of the liquid crystal panel P, for example.
  • the imaging data of the camera is sent to the control device 20.
  • the control device 20 operates the first alignment device 11 based on the imaging data and the inspection data in the optical axis direction stored in advance.
  • the second alignment device 14 and the third alignment device 17 have the camera, and use image data of the camera for alignment.
  • the first alignment device 11 performs alignment of the liquid crystal panel P with respect to the first bonding device 12 under the control of the control device 20.
  • the liquid crystal panel P is positioned in a horizontal direction (X direction) (hereinafter referred to as a component width direction) orthogonal to the transport direction (Y direction), and a turning direction (hereinafter referred to as Z axis). Positioning in the swivel direction). In this state, the liquid crystal panel P is introduced into the bonding position of the first bonding apparatus 12.
  • the 1st bonding apparatus 12 is provided in the panel conveyance downstream rather than the 1st alignment apparatus 11.
  • FIG. The 1st bonding apparatus 12 bonds the upper surface (backlight side) of liquid crystal panel P conveyed below the lower surface of the elongate 1st optical member sheet
  • the 1st bonding apparatus 12 is provided with the conveying apparatus 12a and the pinching roll 12b.
  • the conveying device 12a conveys the first optical member sheet F1 along the longitudinal direction while unwinding the first optical member sheet F1 from the first raw roll R1 around which the first optical member sheet F1 is wound.
  • the pinching roll 12b bonds the upper surface of the liquid crystal panel P conveyed by the roller conveyor 5 to the lower surface of the first optical member sheet F1 conveyed by the conveying device 12a.
  • the transport device 12a includes a holding unit 12c and a collection unit 12d.
  • the holding part 12c holds the first original roll R1 around which the first optical member sheet F1 is wound, and feeds the first optical member sheet F1 along the longitudinal direction thereof.
  • the collection unit 12d collects the protection film pf that has been fed out together with the first optical member sheet F1 so as to overlap the upper surface of the first optical member sheet F1 on the downstream side of the panel transfer of the first bonding apparatus 12.
  • the conveyance apparatus 12a sets the conveyance path
  • the pinching roll 12b has a pair of laminating rollers that are arranged with their axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers. The inside of this gap is the bonding position of the first bonding apparatus 12. In the gap, the liquid crystal panel P and the first optical member sheet F1 are overlapped and introduced. The liquid crystal panel P and the first optical member sheet F1 are sent to the downstream side of the panel conveyance while being pressed between the bonding rollers. By performing such an operation on each of the plurality of liquid crystal panels P that are sequentially transported, the first bonding apparatus 12 is a long first optical member that is spaced apart from the plurality of liquid crystal panels P by a predetermined distance. The 1st bonding sheet
  • seat F1 is formed.
  • the 1st cutting device 13 is located in the panel conveyance downstream rather than collection part 12d.
  • the 1st cutting device 13 is a predetermined part of the 1st optical member sheet
  • the 1st cutting device 13 forms the 1st single-sided bonding panel P11 by which the said sheet piece F1S larger than the liquid crystal panel P was bonded to the upper surface of the liquid crystal panel P by the said cutting
  • the size of the portion that protrudes outside the liquid crystal panel P (the size of the surplus portion of the sheet piece F1S) is appropriately set according to the size of the liquid crystal panel P.
  • the distance between one side of the sheet piece F1S and one side of the liquid crystal panel P is 2 mm at each side of the sheet piece F1S. Set to a length in the range of ⁇ 5 mm.
  • the 2nd alignment apparatus 14 is provided in the panel conveyance downstream rather than the 1st bonding apparatus 12 and the 1st cutting device 13.
  • FIG. The second alignment device 14 holds, for example, the first single-sided bonding panel P11 on the roller conveyor 5 and turns 90 ° around the vertical axis.
  • the 1st single-sided bonding panel P11 currently conveyed substantially parallel to the short side of the display area P4 changes direction so that it may be conveyed substantially parallel to the long side of the display area P4.
  • the said turning is made
  • the second alignment device 14 performs the same alignment as the first alignment device 11. That is, the 2nd alignment apparatus 14 is based on the inspection data of the optical axis direction memorize
  • the 2nd bonding apparatus 15 is provided in the panel conveyance downstream rather than the 2nd alignment apparatus 14.
  • FIG. The 2nd bonding apparatus 15 is the upper surface (of liquid crystal panel P of the 1st single-sided bonding panel P11 conveyed below that with respect to the lower surface of the elongate 2nd optical member sheet
  • the 2nd bonding apparatus 15 is provided with the conveying apparatus 15a and the pinching roll 15b.
  • the conveying device 15a conveys the second optical member sheet F2 along the longitudinal direction while unwinding the second optical member sheet F2 from the second original roll R2 around which the second optical member sheet F2 is wound.
  • the pinching roll 15b bonds the upper surface of the 1st single-sided bonding panel P11 which the roller conveyor 5 conveys to the lower surface of the 2nd optical member sheet
  • the transport device 15a includes a holding unit 15c and a collection unit 15d.
  • the holding part 15c holds the second original fabric roll R2 around which the second optical member sheet F2 is wound, and feeds the second optical member sheet F2 along its longitudinal direction.
  • the collection unit 15d collects an excess portion of the second optical member sheet F2 that has passed through the second cutting device 16.
  • the transport device 15a is a bonding position in the second bonding device 15, and the second optical member sheet F2 has a bonding surface with the first single-sided bonding panel P11 of the second optical member sheet F2 facing downward. Set the transport route.
  • the pinching roll 15b has a pair of laminating rollers arranged with their axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers. The inside of this gap is the bonding position of the second bonding apparatus 15.
  • the first single-sided bonding panel P11 and the second optical member sheet F2 are overlapped and introduced into the gap. These 1st single-sided bonding panels P11 and the 2nd optical member sheet
  • seat F2 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers.
  • the second bonding device 15 places the plurality of first single-sided bonding panels P11 at a predetermined interval.
  • seat F2 is formed.
  • the 2nd cutting device 16 is located in the panel conveyance downstream rather than the pinching roll 15b. At that time, the second cutting device 16 has the second optical member sheet F2 and the sheet piece F1S of the first optical member sheet F1 included in the first single-sided bonding panel P11 bonded to the lower surface of the second optical member sheet F2. Cut (see FIG. 4). The second cutting device 16 cuts the second optical member sheet F2 and the sheet piece F1S of the first optical member sheet F1 in an endless manner along the outer peripheral edge of the liquid crystal panel P.
  • the 2nd cutting device 16 cuts each optical member sheet
  • the present invention can be applied even when only the second optical member sheet F2 is cut.
  • only the second optical member sheet F2 can be cut after the second optical member sheet F2 is bonded to the first single-sided bonding panel P11 in a larger size. According to this method, the pasting accuracy at the time of pasting the 2nd optical member sheet F2 on the 1st single side pasting panel P11 becomes unnecessary, and frame cutting correspondence is also possible.
  • the second cutting device 16 cuts the optical member sheets F1 and F2 as described above, so that the first optical member F11 and the second optical member F12 overlap each other on the upper surface of the liquid crystal panel P.
  • the 2nd single-sided bonding panel P12 bonded together is formed.
  • seat F22 is a 2nd single-sided bonding panel P12 and the opposing part (each optical member F11, each) of the display area P4 of liquid crystal panel P (refer FIG. 1).
  • F12) is cut off and separated into excess portions of the optical member sheets F1 and F2 remaining in a frame shape.
  • a plurality of surplus portions of the second optical member sheet F2 are connected in a ladder shape. This surplus portion is wound around the collecting portion 15d together with the surplus portion of the first optical member sheet F1.
  • the “opposite part of the display area P4” is an area that is not less than the size of the display area P4 and not more than the size of the outer shape of the liquid crystal panel P, and avoids functional parts such as the electrical component mounting portion P5. Indicates the area. That is, in the above, the case where the excess part is laser-cut along the outer periphery of the liquid crystal panel P is included.
  • the third alignment device 17 is provided on the downstream side of the panel conveyance with respect to the second bonding device 15 and the second cutting device 16.
  • the third alignment device 17 reverses the front and back of the second single-sided bonding panel P12 with the backlight side of the liquid crystal panel P as the upper surface so that the display surface side of the liquid crystal panel P is the upper surface.
  • the same alignment as that of the second alignment device 14 is performed. That is, the third alignment device 17 is based on the inspection data in the optical axis direction stored in the control device 20 and the imaging data of the camera in the component width direction of the second single-sided bonding panel P12 with respect to the third bonding device 18. And positioning in the turning direction. In this state, the second single-sided bonding panel P ⁇ b> 12 is introduced into the bonding position of the third bonding device 18.
  • the 3rd bonding apparatus 18 is provided in the panel conveyance downstream rather than the 3rd alignment apparatus 17.
  • FIG. The 3rd bonding apparatus 18 is the upper surface of 2nd single-sided bonding panel P12 conveyed below with respect to the lower surface of the elongate 3rd optical member sheet
  • the 3rd bonding apparatus 18 is provided with the conveying apparatus 18a and the pinching roll 18b.
  • the conveyance device 18a conveys the third optical member sheet F3 along the longitudinal direction while unwinding the third optical member sheet F3 from the third original roll R3 around which the third optical member sheet F3 is wound.
  • the pinching roll 18b bonds the upper surface of the 2nd single-sided bonding panel P12 which the roller conveyor 5 conveys to the lower surface of the 3rd optical member sheet
  • the transport device 18a includes a holding unit 18c and a collection unit 18d.
  • the holding portion 18c holds the third original fabric roll R3 around which the third optical member sheet F3 is wound, and feeds the third optical member sheet F3 along its longitudinal direction.
  • the collection unit 18d collects an excess portion of the third optical member sheet F3 that has passed through the third cutting device 19 positioned on the downstream side of the panel conveyance with respect to the pinching roll 18b.
  • the conveying device 18a is a bonding position in the third bonding device 18, and the third optical member sheet F3 has a bonding surface with the second single-sided bonding panel P12 of the third optical member sheet F3 facing downward. Set the transport route.
  • the pinching roll 18b has a pair of laminating rollers arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers. The inside of this gap becomes the bonding position of the third bonding apparatus 18.
  • the second single-sided bonding panel P12 and the third optical member sheet F3 are overlapped and introduced.
  • seat F3 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers.
  • the third bonding device 18 places the plurality of second single-sided bonding panels P12 at a predetermined interval.
  • seat F23 bonded continuously to the lower surface of elongate 3rd optical member sheet
  • 3rd cutting device 19 is located in the panel conveyance downstream rather than pinching roll 18b, and cuts 3rd optical member sheet F3.
  • the third cutting device 19 is a laser beam irradiation device 30 (see FIGS. 2 and 3) similar to the second cutting device 16.
  • the third cutting device 19 cuts the third optical member sheet F3 endlessly along the outer peripheral edge of the liquid crystal panel P.
  • the 3rd cutting device 19 bonded the 3rd optical member F13 on the upper surface of the 2nd single-sided bonding panel P12 by cut
  • the double-sided bonding panel P13 is formed.
  • seat F23 is the surplus part of the 3rd optical member sheet
  • a plurality of surplus portions of the third optical member sheet F3 are connected in a ladder shape. The surplus portion of the third optical member sheet F3 is taken up by the collection unit 18d.
  • the “opposite part to the display area P4” is an area not less than the size of the display area P4 and not more than the size of the outer shape of the liquid crystal panel P.
  • the double-sided bonding panel P13 is inspected for defects (bonding failure, etc.) through a defect inspection device (not shown) and then conveyed to the downstream process for other processing.
  • the liquid crystal panel P includes, for example, a rectangular first substrate P1 made of, for example, a TFT substrate, a second substrate P2 having the same rectangular shape disposed opposite to the first substrate P1, and a first substrate.
  • a liquid crystal layer P3 sealed between P1 and the second substrate P2 is included.
  • hatching of each layer in the cross-sectional view may be omitted.
  • the first substrate P1 has three outer peripheral edges along the corresponding three sides of the second substrate P2, and the remaining one of the outer peripheral edges corresponds to the second substrate P2. Project outside of one side. As a result, an electrical component mounting portion P5 that projects outward from the second substrate P2 is provided on the one side of the first substrate P1.
  • the second cutting device 16 detects the outer peripheral edge of the liquid crystal panel P with a detection unit such as a camera 16 a, and the first and second along the inner side of the outer peripheral edge of the liquid crystal panel P.
  • the optical member sheets F1 and F2 are cut.
  • the third cutting device 19 cuts the third optical member sheet F3 along the inner side of the outer peripheral edge of the liquid crystal panel P while detecting the outer peripheral edge of the liquid crystal panel P with a detection unit such as a camera 19a.
  • a frame portion G having a predetermined width for arranging a sealant or the like for joining the first substrate P1 and the second substrate P2 is provided.
  • Each of the cutting devices 16 and 19 performs laser cutting within the width of the frame portion G.
  • the cut end t of the optical member sheet FX may be swollen or wavy due to thermal deformation. For this reason, when the optical member sheet FX after laser cutting is bonded to the optical display component PX, poor bonding such as air mixing and distortion is likely to occur in the optical member sheet FX.
  • the cut end t of the optical member sheet FX is the glass surface of the liquid crystal panel P. Is backed up. Therefore, the optical member sheet FX after laser cutting is less likely to cause swelling or undulation of the cut end t of the optical member sheet FX. Moreover, since it is after bonding to liquid crystal panel P, the said bonding defect cannot arise.
  • the runout width (tolerance) of the cutting line of the laser processing machine is smaller than the tolerance of the cutting blade. Therefore, in the film bonding system 1 of this embodiment, compared with the case where the optical member sheet
  • FIG. As a result, the liquid crystal panel P applied to the film bonding system 1 of the present embodiment can reduce the size of the liquid crystal panel P and / or increase the size of the display region P4. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.
  • the optical member sheet FX is cut into a sheet piece that matches the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and the dimensional tolerances of the relative bonding positions thereof. Overlap. Therefore, it becomes difficult to narrow the width of the frame portion G of the liquid crystal panel P (it becomes difficult to enlarge the display area).
  • the tolerance of the width of the frame part G can be reduced ( ⁇ 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).
  • the optical member sheet FX is cut with a laser beam instead of a blade. Therefore, in the film bonding system 1, the force at the time of cutting is not input to the liquid crystal panel P, and cracks and chips are less likely to occur at the edge of the substrate of the liquid crystal panel P, and durability against heat cycles and the like is improved. Similarly, in the film bonding system 1, since it is non-contact with the liquid crystal panel P when cutting the optical member sheet
  • the third cutting device 19 performs laser cutting on an extension of one long side of the display region P4, for example.
  • a starting point pt1 is set, and cutting of the one long side is started from the starting point pt1.
  • the third cutting device 19 sets the laser cut end point pt2 to a position where the laser light goes around the inside of the outer edge of the liquid crystal panel P and reaches the extension of the short side on the start point side of the display region P4.
  • the start point pt1 and the end point pt2 are set so as to be able to withstand the tension when the optical member sheet FX is wound, leaving a predetermined connection allowance in the surplus portion of the optical member sheet FX.
  • the control device 20 of the present embodiment is configured to include a computer system.
  • This computer system includes an arithmetic processing unit 20a such as a CPU and a storage unit 20b such as a memory or a hard disk.
  • the control device 20 of the present embodiment includes an interface capable of executing communication with a device external to the computer system.
  • An input device that can input an input signal may be connected to the control device 20.
  • the input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from a device external to the computer system.
  • the control device 20 may include a display device such as a liquid crystal display that indicates the operation status of each part of the film bonding system 1, or may be connected to the display device.
  • An operating system (OS) that controls the computer system is installed in the storage unit 20b of the control device 20.
  • the storage unit 20b of the control device 20 causes the arithmetic processing unit 20a to control each unit of the film bonding system 1, thereby causing the respective units of the film bonding system 1 to perform processing for accurately conveying the polarizing film F.
  • the program is recorded.
  • Various types of information including programs recorded in the storage unit 20b can be read by the arithmetic processing unit 20a of the control device 20.
  • the control device 20 may include a logic circuit such as an ASIC that executes various processes required for controlling each part of the film bonding system 1.
  • the storage unit 20b is a concept including a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), an external storage device such as a hard disk, a CD-ROM reader, and a disk-type storage medium.
  • the storage unit 20b is functionally a storage area for storing program software in which the operation procedure of the moving device 32 and the operation procedure of the first irradiation position adjustment device 161 and the second irradiation position adjustment device 162 are described.
  • a storage area for storing the irradiation position in the optical member sheet FX for realizing a desired locus shown in FIG. 2 as coordinate data, and a movement amount of the second cutting device 16 in each direction of XYZ in FIG. And other various storage areas are set.
  • FIG. 2 is a perspective view showing an example of a laser beam irradiation apparatus 30 used as a cutting part of the optical member sheet.
  • the laser light irradiation device 30 includes a table 31, a second cutting device 16 (corresponding to a “scanner” in the claims), a moving device 32, and a laser light control device 33. ing.
  • the laser beam irradiation device 30 is a device for irradiating the optical member sheet FX with laser light and cutting the optical member sheet FX into optical members FS having a predetermined size.
  • the second cutting device 16 is described as the laser light irradiation device 30, but the third cutting device 19 is also applicable as the laser light irradiation device 30.
  • the table 31 has a holding surface 31a that holds the optical member sheet FX (irradiation target).
  • the second cutting device 16 emits laser light to the optical member sheet FX in order to cut the optical member sheet FX held on the table 31.
  • the second cutting device 16 is capable of biaxial scanning with laser light in a plane parallel to the holding surface 31a of the table 31 (in the XY plane). That is, the second cutting device 16 can move relative to the table 31 independently in the X direction and the Y direction. Thereby, the 2nd cutting device 16 can be moved to the arbitrary positions on the table 31, and it can irradiate a laser beam to the arbitrary positions of the optical member sheet
  • the moving device 32 can relatively move the table 31 and the second cutting device 16.
  • the moving device 32 moves the second cutting device 16 relative to the table 31 in a first direction V1 (X direction) parallel to the holding surface 31a, a second direction parallel to the holding surface 31a and orthogonal to the first direction V1.
  • the relative movement is performed in the direction V2 (Y direction) and the third direction V3 (Z direction) which is the normal direction of the holding surface 31a.
  • the moving device 32 moves only the second cutting device 16 without moving the table 31.
  • the second cutting device 16 is provided with a slider mechanism (not shown) that allows the second cutting device 16 to move in each direction of XYZ.
  • the moving device 32 operates the linear motor built in the slider mechanism to move the second cutting device 16 in each direction of XYZ.
  • the linear motor that is pulse-driven in the slider mechanism can finely control the rotation angle of the output shaft by the pulse signal supplied to the linear motor. Therefore, the position in each direction of XYZ of the 2nd cutting device 16 supported by the slider mechanism can be controlled with high precision.
  • the position control of the second cutting device 16 is not limited to position control using a pulse motor, and can be realized by feedback control using a servo motor or any other control method.
  • the form of relative movement by the moving device is not limited to this.
  • the second cutting device 16 is moved relative to the table 31 by moving only the table 31 without moving the second cutting device 16 or by moving both the table 31 and the second cutting device 16.
  • the present invention can also be applied to the moving form.
  • FIG. 3 is a perspective view showing an internal configuration of the second cutting device 16 in the laser beam irradiation device 30.
  • illustration of the moving device 32 and the laser light control device 33 is omitted for convenience.
  • the second cutting device 16 includes a laser beam oscillator 160, a first irradiation position adjusting device 161, a second irradiation position adjusting device 162, and a condenser lens 163.
  • the laser beam oscillator 160 is a member that oscillates the laser beam L.
  • the laser oscillator 160 may be a CO 2 laser oscillator (carbon dioxide laser oscillator), a UV laser oscillator, a semiconductor laser oscillator, a YAG laser oscillator, an excimer laser oscillator, or the like.
  • An oscillator can be used.
  • the specific configuration is not particularly limited.
  • the CO 2 laser light oscillator is more preferable because it can oscillate laser light at a high output suitable for, for example, cutting processing of a polarizing film.
  • the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 constitute a scanning element capable of biaxially scanning the laser beam oscillated from the laser beam oscillator 160 in a plane parallel to the holding surface 31a. .
  • a galvano scanner is used as the first irradiation position adjustment device 161 and the second irradiation position adjustment device 162 .
  • the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are arranged in this order on the optical path of the laser light between the laser light oscillator 160 and the condenser lens 163.
  • the scanning element is not limited to a galvano scanner, and a gimbal can be used.
  • the first irradiation position adjusting device 161 includes a mirror 161a and an actuator 161b that adjusts the installation angle of the mirror 161a.
  • the actuator 161b has a rotation shaft 161c parallel to the Z direction.
  • the rotating shaft 161c is connected to the mirror 161a.
  • the actuator 161b rotates the mirror 161a around the Z axis based on the control of the laser light control device 33.
  • the second irradiation position adjusting device 162 includes a mirror 162a and an actuator 162b that adjusts the installation angle of the mirror 162a.
  • the actuator 162b has a rotation shaft 162c parallel to the Y direction.
  • the rotating shaft 162c is connected to the mirror 162a.
  • the actuator 162b rotates the mirror 162a around the Y axis based on the control of the laser light control device 33.
  • the laser beam L oscillated from the laser beam oscillator 160 is applied to the optical member sheet FX held on the table 31 via the mirror 161a, the mirror 162a, and the condenser lens 163.
  • the first irradiation position adjustment device 161 and the second irradiation position adjustment device 162 are irradiated from the laser light oscillator 160 toward the optical member sheet FX held on the table 31 based on the control of the laser light control device 33. Adjust the laser beam irradiation position.
  • Actuators 161b and 162b rotate the mirrors 161a and 162a based on the control of the laser light control device 33 to adjust the optical path of the laser light L irradiated toward the optical member sheet FX.
  • the optical path of the laser beam L is changed from the state indicated by the solid line in FIG. 3 to the state indicated by the one-dot chain line or the state indicated by the two-dot difference line.
  • the laser beam L oscillated from the laser beam oscillator 160 is collected at the condensing point Qa. .
  • the laser beam L oscillated from the laser beam oscillator 160 is displaced by a predetermined amount from the condensing point Qa.
  • the light is condensed on the condensing point Qb.
  • the laser beam L oscillated from the laser beam oscillator 160 is a predetermined amount from the condensing point Qa. It is condensed on the displaced condensing point Qc.
  • the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are arranged on the optical member sheet FX held on the table 31 by the condenser lens 163 based on the control of the laser light control device 33.
  • the condensing point position (Qa, Qb, Qc) of the focused laser beam L is adjusted.
  • the condensing lens 163 is disposed at the tip of the second cutting device 16 (the portion facing the optical member sheet FX).
  • the condensing lens 163 condenses the laser light L, which is oscillated from the laser light oscillator 160 and whose optical path is adjusted by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162, at a predetermined position of the optical member sheet FX. To do.
  • the condenser lens 163 an f ⁇ lens is used as the condenser lens 163. Accordingly, the laser beam L indicated by the solid line, the one-dot chain line, and the two-dot chain line input in parallel to the condenser lens 163 from the mirror 162a can be condensed in parallel to the optical member sheet FX.
  • the laser light control device 33 includes the moving device 32 and the first irradiation position adjusting device 161 so that the laser light L emitted from the second cutting device 16 draws a desired locus on the optical member sheet FX held on the table 31.
  • the second irradiation position adjusting device 162 is controlled.
  • FIG. 12 is a flowchart illustrating an embodiment of a method for producing an optical display device.
  • the optical display device production method of the present embodiment uses the laser beam irradiation device 30 shown in FIG. 2 to cut the optical member sheet FX into optical members FS of a predetermined size (in this embodiment, the same size as the liquid crystal panel). It is a method to do.
  • a predetermined size in this embodiment, the same size as the liquid crystal panel.
  • the production method of the optical display device includes a bonding step S10 and a cutting step S20.
  • the process by the 2nd bonding apparatus 15 is demonstrated to an example as bonding process S10
  • the process by the 2nd cutting apparatus 16 is demonstrated to an example as cutting process S20.
  • the bonding process by the 3rd bonding apparatus 18 and the cutting process by the 3rd cutting device 19 can also be performed similarly to the following description.
  • bonding process S10 bonds the 2nd optical member sheet
  • bonding process S10 the upper surface of the 1st single-sided bonding panel P11 is bonded with respect to the lower surface of the 2nd optical member sheet
  • seat F2 are conveyed in the mutually accumulated state by the conveying apparatus 15a of the 2nd bonding apparatus 15, and it introduce
  • the cutting step S20 is performed.
  • the cutting step S ⁇ b> 20 includes the holding step S ⁇ b> 20 ⁇ / b> A that holds the optical member sheet FX on the holding surface 31 a of the table 31, and the second cutting device 16 while relatively moving the table 31 and the second cutting device 16.
  • the second cutting device 16 is moved with respect to the table 31 so that the laser light irradiated from the second cutting device 16 draws a desired locus on the optical member sheet FX held on the table 31. Then, relative movement is performed in a first direction V1 parallel to the holding surface 31a and a second direction V2 parallel to the holding surface 31a and perpendicular to the first direction V1. And the irradiation position of the laser beam irradiated to the optical member sheet
  • an operation until the optical member sheet FX is cut into an optical member FS having a predetermined size using the laser beam irradiation device 30 will be described.
  • the liquid crystal panel P transported by the transport device 15a (see FIG. 1) is stopped at a predetermined position.
  • the liquid crystal panel P is held on the holding surface 31 a of the table 31 based on the control of the control device 20.
  • the optical member sheet FX held on the table 31 is irradiated with laser light to cut out an optical member FS (see FIG. 2) having a predetermined size from the optical member sheet.
  • the laser light control device 33 draws a desired locus on the optical member sheet FX held by the table 31 with the laser light emitted from the second cutting device 16.
  • the moving device 32, the first irradiation position adjusting device 161 (see FIG. 3), and the second irradiation position adjusting device 162 are controlled.
  • FIG. 13 is an explanatory diagram of the laser light irradiation step S20B, and is an explanatory diagram of a movement locus caused by relative movement between the table 31 and the second cutting device 16 (see FIG. 2).
  • FIG. 14 is an explanatory diagram of the laser beam irradiation step S20B, and is an explanatory diagram of an actual laser beam movement locus on the optical member sheet FX.
  • reference numeral Tr ⁇ b> 1 indicates a trajectory obtained by projecting a movement trajectory due to relative movement between the table 31 (see FIG. 2) and the second cutting device 16 (scanner) onto the optical member sheet FX (“ It is equivalent to “relative movement locus”. That is, the light source relative movement trajectory Tr1 is a state where the scanning element (the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162) included in the second cutting device 16 is fixed in a fixed posture and the second light source relative movement locus Tr1. When the laser beam is irradiated while relatively moving the cutting device 16, the laser beam corresponds to a locus drawn on the optical member sheet FX.
  • the “constant posture” is, for example, a posture in which the central axis of the irradiated laser light is parallel to the normal line of the optical member sheet FX.
  • Reference sign SA1 is a straight section other than the corner C1 of the liquid crystal panel P
  • reference sign SA2 is a bent section of the corner C1 of the liquid crystal panel P.
  • symbol Tr is an actual laser beam movement locus on the optical member sheet FX (hereinafter, also referred to as “laser beam movement locus”).
  • the laser beam movement locus Tr corresponds to the outer shape of the cut optical member FS.
  • Reference numeral Fr denotes an extension line of the laser beam movement trajectory Tr along one side and an extension line of the laser beam movement trajectory Tr along the other side of the two sides sandwiching the corner C1 of the liquid crystal panel P. This is a virtual bent shape formed at the intersection CR.
  • reference numeral Tr2 indicates how much is adjusted (adjusted) from the virtual bent shape Fr toward the outside of the light source relative movement locus Tr1 when the second cutting device 16 (see FIG. 2) scans the laser beam.
  • adjustment curve The deviation amount (adjustment amount) of the laser irradiation position is indicated by the distance between the adjustment curve Tr2 and the virtual bent shape Fr in the direction orthogonal to the tangent to the light source relative movement locus Tr1.
  • the table 31 and the second cutting device 16 relatively move in the straight section SA ⁇ b> 1 and the bending section SA ⁇ b> 2 inside the outer edge of the liquid crystal panel P.
  • the second cutting device 16 moves relative to the table 31 along a linear light source relative movement locus Tr1 corresponding to the outer edge of the liquid crystal panel P.
  • the shape of the optical member FS to be cut out matches the light source relative movement locus Tr1. Therefore, the laser light control device 33 adjusts the laser light irradiation position without adjusting the laser light by the first irradiation position adjusting device 161 (see FIG. 3) and the second irradiation position adjusting device 162 (see FIG. 3) (scanning). With the element fixed in a certain posture), the optical member sheet FX is irradiated with laser light from the second cutting device 16 as it is.
  • the second cutting device 16 moves relative to the table 31 along the light source relative movement locus Tr1 having a shape in which the corner portion C1 of the liquid crystal panel P is curved inward.
  • the reason is as follows. If the light source relative movement locus Tr1 has a rectangular shape in the bending section SA2, the moving speed of the second cutting device 16 becomes slow at the corners of the rectangle, and the corners of the cut optical member FS are swollen by the heat of the laser light. There is a risk of undulation. Therefore, the table 31 and the second cutting device 16 are relatively moved along the light source relative movement locus Tr1 in which the corner portion C1 of the liquid crystal panel P is curved inward. Thereby, in bending
  • the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 cause the irradiation position to be a corner portion of the virtual bent shape Fr ( That is, the laser beam is scanned so as to bulge outward from the corner portion of the virtual bent shape Fr (that is, the crossing portion CR) so as to approach the crossing portion CR).
  • the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 cause the irradiation position of the laser light to be an angle of the virtual bent shape Fr. It is shifted so as to bulge outward from the portion (that is, the intersecting portion CR).
  • the irradiation position of the laser beam is orthogonal to the light source relative movement locus Tr1 by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162.
  • the distance is shifted from the corner of the virtual bent shape Fr (ie, the intersection CR) by the distance W1.
  • W2 is set so as to satisfy the following expression (1).
  • the above-described cutting is performed by laser cutting the surplus portion along the outer peripheral edge of the liquid crystal panel P on three sides excluding the functional portion of the rectangular liquid crystal panel P in plan view, and on one side corresponding to the functional portion. Further, it is possible to employ a configuration in which the surplus portion is laser-cut at a position where the liquid crystal panel P appropriately enters the display region P4 side from the outer peripheral edge.
  • the first substrate P1 is a TFT substrate
  • the second cutting device 16 (scanner) relatively moves with respect to the table 31 along the light source relative movement locus Tr1 having a curved shape inside the corner portion C1 of the liquid crystal panel P. Therefore, a decrease in the relative movement speed between the table 31 and the second cutting device 16 can be suppressed. Further, the second cutting device 16 irradiates laser light toward the outside of the light source relative movement locus Tr1 so that the laser beam movement locus Tr follows the corner C1 of the liquid crystal panel P. Therefore, the laser beam movement trajectory Tr obtained when the light source relative movement trajectory Tr1 of the table 31 and the second cutting device 16 and the adjustment curve Tr2 by the second cutting device 16 are combined is displayed on the corner C1 of the liquid crystal panel P. The shape can be along.
  • the laser beam movement trajectory Tr can be accurately controlled. Therefore, when the optical member FS is cut out from the optical member sheet FX, the corners of the optical member FS are not curved inward, so that the corners of the optical member FS can be prevented from having an R shape.
  • the laser beam oscillator 160 when the laser beam oscillator 160 is large and unsuitable for moving, the laser beam oscillator 160 is fixed and the scanning elements (the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162) are moved.
  • the scanning elements the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162
  • the table 31 is moved relative to the table 31 can be employed.
  • the condenser lens 163 may be moved following the scanning element.
  • the 2nd cutting device 16 detects the outer periphery of liquid crystal panel P with detection parts, such as a camera 16a, and it is 1st and 2nd optical along the inner side of the outer periphery of liquid crystal panel P.
  • the member sheets F1 and F2 were cut.
  • the 3rd cutting device 19 decided to cut
  • FIGS. 15 to 18 are explanatory diagrams of modified examples of the film bonding system, and are diagrams illustrating in detail the detection of the outer peripheral edge of the bonding surface.
  • FIG. 15 is a schematic diagram of the first detection unit 61 that detects the outer peripheral edge of the bonding surface.
  • the 1st detection part 61 with which the film bonding system 1 of this embodiment is provided is the bonding surface (henceforth 1st bonding surface TA1) of liquid crystal panel P and the sheet piece F1S in the 2nd bonding sheet
  • Imaging device 63 that captures an image of outer peripheral edge ED
  • illumination light source 64 that illuminates outer peripheral edge ED
  • a control unit 65 that performs an operation for the purpose.
  • Such a first detection unit 61 is provided on the panel transport upstream side of the second cutting device 16 in FIG. 1 and is provided between the pinching roll 15 b and the second cutting device 16.
  • the imaging device 63 is fixed and arranged inside the first bonding surface TA1 with respect to the outer peripheral edge ED, and the normal line of the first bonding surface TA1 and the normal line of the imaging surface 63a of the imaging device 63 are arranged.
  • the posture is inclined so as to form an angle ⁇ (hereinafter referred to as an inclination angle ⁇ of the imaging device 63).
  • the imaging device 63 takes the image of the outer peripheral edge ED from the side where the sheet piece F1S is bonded in the second bonding sheet F22 with the imaging surface 63a facing the outer peripheral edge ED.
  • the inclination angle ⁇ of the imaging device 63 is preferably set so that the outer periphery of the first substrate P1 that forms the first bonding surface TA1 can be reliably imaged.
  • the liquid crystal panel P is formed by so-called multiple chamfering, in which the mother panel is divided into a plurality of liquid crystal panels, the liquid crystal panel P is shifted to the outer peripheral edge of the first substrate P1 and the second substrate P2 constituting the liquid crystal panel P. May occur, and the end surface of the second substrate P2 may be displaced outward from the end surface of the first substrate P1.
  • the inclination angle ⁇ of the imaging device 63 is a distance H between the first bonding surface TA1 and the center of the imaging surface 63a of the imaging device 63 (hereinafter referred to as a height H of the imaging device 63). It is preferable to set so that it may fit. For example, when the height H of the imaging device 63 is 50 mm or more and 100 mm or less, the inclination angle ⁇ of the imaging device 63 is preferably set to an angle in the range of 5 ° or more and 20 ° or less. However, when the deviation amount is empirically known, the height H of the imaging device 63 and the inclination angle ⁇ of the imaging device 63 can be obtained based on the deviation amount. In the present embodiment, the height H of the imaging device 63 is set to 78 mm, and the inclination angle ⁇ of the imaging device 63 is set to 10 °.
  • the inclination angle ⁇ of the imaging device 63 may be 0 °.
  • FIG. 16 is a schematic diagram illustrating a modified example of the first detection unit 61, and is an example in the case where the inclination angle ⁇ of the imaging device 63 is 0 °.
  • each of the imaging device 63 and the illumination light source 64 may be disposed at a position overlapping the outer peripheral edge ED along the normal direction of the first bonding surface TA1.
  • a distance Ha between the first bonding surface TA1 and the center of the imaging surface 63a of the imaging device 63 detects the outer peripheral edge ED of the first bonding surface TA1. It is preferable to set the position at an easy position.
  • the height Ha of the imaging device 63 is preferably set in a range of 50 mm to 150 mm.
  • the illumination light source 64 is fixed and arranged on the opposite side to the side where the sheet piece F1S in the second bonding sheet F22 is bonded.
  • the illumination light source 64 is arrange
  • the optical axis of the illumination light source 64 and the normal line of the imaging surface 63a of the imaging device 63 are parallel.
  • the illumination light source 64 may be arrange
  • the optical axis of the illumination light source 64 and the normal line of the imaging surface 63a of the imaging device 63 intersect. It may be.
  • FIG. 17 is a plan view showing a position for detecting the outer peripheral edge of the bonding surface.
  • An inspection area CA is set on the conveyance path of the second bonding sheet F22 shown in the drawing.
  • region CA is set in the position corresponding to the outer periphery ED of 1st bonding surface TA1 in the liquid crystal panel P conveyed.
  • the inspection area CA is set at four locations corresponding to the four corners of the first bonding surface TA1 having a rectangular shape in plan view, and detects the corners of the first bonding surface TA1 as the outer peripheral edge ED. It has a configuration.
  • among the outer peripheral edges of the first bonding surface TA1, a hook-shaped portion corresponding to the corner is shown as the outer peripheral edge ED.
  • the first detection unit 61 in FIG. 15 detects the outer peripheral edge ED in the four inspection areas CA. Specifically, the imaging device 63 and the illumination light source 64 are disposed in each inspection area CA, and the first detection unit 61 is provided at each corner of the first bonding surface TA1 for each liquid crystal panel P to be transported. And the outer peripheral edge ED is detected based on the imaging data. Data of the detected outer peripheral edge ED is stored in the control unit 65 shown in FIG.
  • region CA may be arrange
  • each side (four sides) of the first bonding surface TA1 is detected as an outer peripheral edge.
  • the imaging device 63 and the illumination light source 64 are not limited to the configuration arranged in each inspection area CA, and are configured to be able to move along a movement path set along the outer peripheral edge ED of the first bonding surface TA1. It may be.
  • the imaging device 63 and the illumination light source 64 are configured to detect the outer peripheral edge ED when the imaging device 63 and the illumination light source 64 are positioned in each inspection area CA, so that one imaging device 63 and one illumination light source 64 are provided. In this case, the outer periphery ED can be detected.
  • FIG. 18 is a schematic diagram of the second detection unit 62 that detects the outer periphery of the bonding surface.
  • the 2nd detection part 62 with which the film bonding system 1 of this embodiment is provided is the bonding surface (henceforth, 2nd bonding surface TA2) of liquid crystal panel P and the 3rd optical member sheet
  • the imaging device 63 that captures an image of the outer peripheral edge ED, the illumination light source 64 that illuminates the outer peripheral edge ED, and the image captured by the imaging device 63 are stored, and the outer peripheral edge ED is based on the image.
  • a control unit 65 that performs a calculation for detecting.
  • the second detection unit 62 has the same configuration as the first detection unit 61 described above.
  • Such a second detection unit 62 is provided on the upstream side of the panel conveyance of the third cutting device 19 in FIG. 1, and is provided between the pinching roll 18 b and the third cutting device 19.
  • the 2nd detection part 62 detects the outer periphery ED of 2nd bonding surface TA2 similarly to the above-mentioned 1st detection part 61 in the test
  • the outer peripheral edge of the liquid crystal panel can be suitably detected by detecting the outer peripheral edge of the bonding surface between the liquid crystal panel and the optical member sheet.
  • FIG. 19 is an explanatory diagram of a modified example of the laser beam irradiation step S20B and corresponds to FIG.
  • the outer peripheral edge of the bonding surface between the optical member sheet and the liquid crystal panel is detected, and the position (that is, the virtual bent shape Fr) for separating the optical member FS is set along the detected outer peripheral edge.
  • the position to be separated is appropriately set by, for example, the control unit 65 or a separate calculation unit based on the detected data of the outer periphery.
  • the light source relative movement locus Tr1 is a substantially rectangular movement locus with curved corners.
  • the light source relative movement trajectory Tr1 and the laser light movement trajectory Tr are substantially the same (except for the corner), and the shapes of both are different only in a narrow area of the corner. If the light source relative movement trajectory Tr1 has a rectangular shape, the moving speed of the second cutting device 16 becomes slow at the corners of the rectangle, and the corners may swell or wave due to the heat of the laser light. For this reason, in FIG. 19, the corner of the light source relative movement locus Tr1 is curved so that the moving speed of the second cutting device 16 is substantially constant over the entire light source relative movement locus Tr1.
  • the control device 33 causes the second cutting device 16 to irradiate the optical member sheet with the laser light as it is without adjusting the irradiation position of the laser light by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162. .
  • the control device 33 controls the irradiation position of the laser beam by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162, and the irradiation position of the laser beam is arranged on the laser beam movement locus Tr.
  • the irradiation position of the laser beam is orthogonal to the light source relative movement locus Tr1 by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162. It is shifted in the direction N1 by a distance (deviation amount) W1.
  • the distance W1 is set to be the same as the distance W2 between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction N1 orthogonal to the light source relative movement locus Tr1.
  • the light source relative movement locus Tr1 is arranged on the inner side of the laser beam movement locus Tr.
  • the irradiation position of the laser beam is set higher than the laser beam movement locus Tr by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162. Shifted outward. For this reason, the control device 33 cancels the deviation and the laser light irradiation position is arranged on the laser light movement locus Tr.
  • the optical member FS having a shape along the outer peripheral edge of the liquid crystal panel P can be cut out from the optical member sheet FX.
  • the outer periphery of the bonding surface was detected for every some liquid crystal panel P using the detection part, and it bonded for every liquid crystal panel P based on the detected outer periphery.
  • the cutting positions of the sheet piece F1S, the second optical member sheet F2, and the second optical member sheet 3 are set.
  • an optical member having a desired size can be separated regardless of individual differences in the sizes of the liquid crystal panel P and the sheet piece F1S, so that quality variation due to individual differences in the sizes of the liquid crystal panel P and the sheet piece F1S can be achieved.
  • the frame portion around the display area can be reduced to enlarge the display area and downsize the device.
PCT/JP2013/071228 2012-08-08 2013-08-06 光学表示デバイスの生産方法および光学表示デバイスの生産システム WO2014024872A1 (ja)

Priority Applications (3)

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CN201380041638.3A CN104520917B (zh) 2012-08-08 2013-08-06 光学显示器件的生产方法以及光学显示器件的生产系统
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