WO2014014299A3 - 반도체 발광소자 - Google Patents
반도체 발광소자 Download PDFInfo
- Publication number
- WO2014014299A3 WO2014014299A3 PCT/KR2013/006458 KR2013006458W WO2014014299A3 WO 2014014299 A3 WO2014014299 A3 WO 2014014299A3 KR 2013006458 W KR2013006458 W KR 2013006458W WO 2014014299 A3 WO2014014299 A3 WO 2014014299A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- semiconductor
- electrode
- emitting element
- layer
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 7
- 239000000463 material Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/387—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
본 개시는 복수의 반도체층에 전자와 정공 중의 하나를 공급하는 제1 전극; 복수의 반도체층에 전자와 정공 중의 나머지 하나를 공급하는 제2 전극; 성장 기판 측인 제1 반도체층 측에 구비되며, 활성층에서 생성된 제1 파장의 빛을 제2 파장의 빛으로 전환하는 형광체부; 그리고, 활성층으로부터의 빛을 성장 기판 측인 제1 반도체층 측으로 반사하도록 제2 반도체층 위에 형성되는 비도전성 반사막;으로서, 형광체부에서 전환된 빛을 기준으로 설계된 분포 브래그 리플렉터를 가지는 비도전성 반사막;을 포함하는 것을 특징으로 하는 반도체 발광소자에 관한 것이다.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201380004181.9A CN104011887A (zh) | 2012-07-18 | 2013-07-18 | 半导体发光器件 |
EP13819478.2A EP2782149B1 (en) | 2012-07-18 | 2013-07-18 | Semiconductor light-emitting device |
US14/118,599 US10535798B2 (en) | 2012-07-18 | 2013-07-18 | Semiconductor light emitting device comprising finger electrodes |
US16/704,574 US20200127161A1 (en) | 2012-07-18 | 2019-12-05 | Semiconductor light emitting device comprising finger electrodes |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0078270 | 2012-07-18 | ||
KR1020120078270A KR101363495B1 (ko) | 2012-07-18 | 2012-07-18 | 반도체 발광소자 |
KR10-2012-0083091 | 2012-07-30 | ||
KR1020120083091A KR101370575B1 (ko) | 2012-07-30 | 2012-07-30 | 반도체 발광소자 |
KR10-2013-0002949 | 2013-01-10 | ||
KR1020130002949A KR101378946B1 (ko) | 2013-01-10 | 2013-01-10 | 반도체 발광소자의 제조 방법 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/118,599 A-371-Of-International US10535798B2 (en) | 2012-07-18 | 2013-07-18 | Semiconductor light emitting device comprising finger electrodes |
US16/704,574 Continuation US20200127161A1 (en) | 2012-07-18 | 2019-12-05 | Semiconductor light emitting device comprising finger electrodes |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2014014299A2 WO2014014299A2 (ko) | 2014-01-23 |
WO2014014299A3 true WO2014014299A3 (ko) | 2014-03-13 |
Family
ID=49949324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2013/006458 WO2014014299A2 (ko) | 2012-07-18 | 2013-07-18 | 반도체 발광소자 |
Country Status (4)
Country | Link |
---|---|
US (2) | US10535798B2 (ko) |
EP (1) | EP2782149B1 (ko) |
CN (10) | CN108598230A (ko) |
WO (1) | WO2014014299A2 (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103946994B (zh) * | 2012-01-13 | 2016-10-12 | 世迈克琉明有限公司 | 半导体发光器件 |
CN103975451B (zh) | 2012-07-18 | 2016-10-12 | 世迈克琉明有限公司 | 制造半导体发光器件的方法 |
US9530941B2 (en) | 2012-07-18 | 2016-12-27 | Semicon Light Co., Ltd. | Semiconductor light emitting device |
WO2015122694A1 (ko) | 2014-02-11 | 2015-08-20 | 주식회사 세미콘라이트 | 반도체 발광소자 |
US9997676B2 (en) | 2014-05-14 | 2018-06-12 | Genesis Photonics Inc. | Light emitting device and manufacturing method thereof |
US10797188B2 (en) * | 2014-05-24 | 2020-10-06 | Hiphoton Co., Ltd | Optical semiconductor structure for emitting light through aperture |
CN106663734B (zh) * | 2014-06-10 | 2019-06-14 | 世迈克琉明有限公司 | 半导体发光元件 |
TW201603316A (zh) * | 2014-07-04 | 2016-01-16 | 新世紀光電股份有限公司 | 發光元件 |
TWI641285B (zh) | 2014-07-14 | 2018-11-11 | 新世紀光電股份有限公司 | 發光模組與發光單元的製作方法 |
KR101888608B1 (ko) | 2014-10-17 | 2018-09-20 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 조명 장치 |
US10157960B2 (en) * | 2014-12-16 | 2018-12-18 | Episky Corporation (Xiamem) Ltd | Light-emitting device with electrode extending layer |
CN106328798B (zh) * | 2015-06-15 | 2023-12-22 | 晶宇光电(厦门)有限公司 | 一种发光二极管芯片 |
TWI584496B (zh) * | 2015-08-13 | 2017-05-21 | 隆達電子股份有限公司 | 半導體發光結構 |
US10615311B2 (en) * | 2016-04-22 | 2020-04-07 | Lg Innotek Co., Ltd. | Light emitting device and display comprising same |
DE102016124847B4 (de) * | 2016-12-19 | 2023-06-07 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
US10784407B2 (en) | 2018-04-23 | 2020-09-22 | Asahi Kasei Kabushiki Kaisha | Nitride semiconductor light emitting element and nitride semiconductor light emitting device |
JP6570702B1 (ja) * | 2018-05-29 | 2019-09-04 | 日機装株式会社 | 半導体発光素子および半導体発光素子の製造方法 |
CN113939920A (zh) * | 2019-06-05 | 2022-01-14 | 新唐科技日本株式会社 | 半导体发光元件 |
JP7307662B2 (ja) * | 2019-10-31 | 2023-07-12 | 日機装株式会社 | 半導体発光素子および半導体発光素子の製造方法 |
CN111081832B (zh) * | 2019-12-26 | 2021-08-24 | 福建兆元光电有限公司 | 一种Mini LED芯片及制造方法 |
US20240063345A1 (en) * | 2021-01-19 | 2024-02-22 | Ams-Osram International Gmbh | Radiation-emitting semiconductor chip and method for producing a radiation-emitting semiconductor chip |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009088299A (ja) * | 2007-09-29 | 2009-04-23 | Nichia Corp | 発光素子及びこれを備える発光装置 |
KR20110053064A (ko) * | 2009-11-13 | 2011-05-19 | 서울옵토디바이스주식회사 | 분포 브래그 반사기를 갖는 발광 다이오드 칩 및 발광 다이오드 패키지 |
KR20110095177A (ko) * | 2010-02-17 | 2011-08-24 | 도요다 고세이 가부시키가이샤 | 반도체 발광 소자 |
KR20120045542A (ko) * | 2010-10-29 | 2012-05-09 | 엘지이노텍 주식회사 | 발광소자 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1174559A (ja) | 1997-08-28 | 1999-03-16 | Fuji Photo Film Co Ltd | 半導体発光素子および露光装置 |
US6194743B1 (en) | 1997-12-15 | 2001-02-27 | Agilent Technologies, Inc. | Nitride semiconductor light emitting device having a silver p-contact |
US20020017108A1 (en) * | 1999-11-30 | 2002-02-14 | Schooley Frank W. | Portable marine air conditioner and dehumidifier |
US6486499B1 (en) * | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
JP2003017806A (ja) * | 2001-06-29 | 2003-01-17 | Toshiba Corp | 化合物半導体発光素子とその製造方法および化合物半導体発光装置 |
JP3776039B2 (ja) * | 2001-12-26 | 2006-05-17 | シャープ株式会社 | コーナーキューブアレイを有する表示装置 |
KR100576718B1 (ko) * | 2003-12-24 | 2006-05-03 | 한국전자통신연구원 | 실리콘 발광 소자 |
US7166483B2 (en) * | 2004-06-17 | 2007-01-23 | Tekcore Co., Ltd. | High brightness light-emitting device and manufacturing process of the light-emitting device |
JP4453515B2 (ja) | 2004-10-22 | 2010-04-21 | 豊田合成株式会社 | 半導体発光素子 |
KR100730082B1 (ko) | 2005-10-17 | 2007-06-19 | 삼성전기주식회사 | 질화물계 반도체 발광소자 |
JP2008112957A (ja) | 2006-10-06 | 2008-05-15 | Mitsubishi Cable Ind Ltd | GaN系LEDチップ |
WO2008047923A1 (fr) | 2006-10-20 | 2008-04-24 | Mitsubishi Chemical Corporation | Dispositif de diode émettrice de lumière à semi-conducteur à base de nitrure |
JP5064782B2 (ja) * | 2006-12-18 | 2012-10-31 | キヤノン株式会社 | インク及びインクジェット記録装置 |
CN101226972B (zh) * | 2007-01-16 | 2011-01-12 | 台达电子工业股份有限公司 | 发光二极管装置及其制造方法 |
JP5012187B2 (ja) * | 2007-05-09 | 2012-08-29 | 豊田合成株式会社 | 発光装置 |
US8368100B2 (en) * | 2007-11-14 | 2013-02-05 | Cree, Inc. | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
JP2009164423A (ja) | 2008-01-08 | 2009-07-23 | Nichia Corp | 発光素子 |
JP4871967B2 (ja) * | 2009-02-10 | 2012-02-08 | Dowaエレクトロニクス株式会社 | 半導体発光素子およびその製造方法 |
JP5021693B2 (ja) | 2009-04-14 | 2012-09-12 | スタンレー電気株式会社 | 半導体発光素子 |
JP5152133B2 (ja) * | 2009-09-18 | 2013-02-27 | 豊田合成株式会社 | 発光素子 |
TWI531088B (zh) | 2009-11-13 | 2016-04-21 | 首爾偉傲世有限公司 | 具有分散式布拉格反射器的發光二極體晶片 |
JP5531575B2 (ja) * | 2009-11-18 | 2014-06-25 | 豊田合成株式会社 | Iii族窒化物化合物半導体発光素子 |
JP5719110B2 (ja) * | 2009-12-25 | 2015-05-13 | 日亜化学工業株式会社 | 発光素子 |
KR101020995B1 (ko) * | 2010-02-18 | 2011-03-09 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
JP5494005B2 (ja) * | 2010-02-26 | 2014-05-14 | 豊田合成株式会社 | 半導体発光素子 |
US20110220945A1 (en) * | 2010-03-09 | 2011-09-15 | Dae Sung Kang | Light emitting device and light emitting device package having the same |
JP5195798B2 (ja) | 2010-03-23 | 2013-05-15 | 豊田合成株式会社 | 半導体発光素子の製造方法 |
KR101666442B1 (ko) | 2010-03-25 | 2016-10-17 | 엘지이노텍 주식회사 | 발광 다이오드 및 이를 포함하는 발광 소자 패키지 |
KR101158075B1 (ko) | 2010-08-10 | 2012-06-22 | 서울옵토디바이스주식회사 | 분포 브래그 반사기를 갖는 발광 다이오드 |
EP2599133A2 (en) * | 2010-07-28 | 2013-06-05 | Seoul Opto Device Co., Ltd. | Light emitting diode having distributed bragg reflector |
US20120037946A1 (en) * | 2010-08-12 | 2012-02-16 | Chi Mei Lighting Technology Corporation | Light emitting devices |
KR101752425B1 (ko) | 2010-11-18 | 2017-07-11 | 서울반도체 주식회사 | 파장변환층을 갖는 발광 다이오드 칩, 그것을 제조하는 방법 및 그것을 갖는 패키지 |
CN102339913B (zh) * | 2011-09-30 | 2013-06-19 | 映瑞光电科技(上海)有限公司 | 高压led器件及其制造方法 |
US9530941B2 (en) | 2012-07-18 | 2016-12-27 | Semicon Light Co., Ltd. | Semiconductor light emitting device |
CN103975451B (zh) | 2012-07-18 | 2016-10-12 | 世迈克琉明有限公司 | 制造半导体发光器件的方法 |
CN104471727B (zh) * | 2013-04-30 | 2018-01-05 | 世迈克琉明有限公司 | 半导体发光器件 |
-
2013
- 2013-07-18 EP EP13819478.2A patent/EP2782149B1/en active Active
- 2013-07-18 CN CN201810342701.1A patent/CN108598230A/zh active Pending
- 2013-07-18 CN CN201810343137.5A patent/CN108365074A/zh active Pending
- 2013-07-18 CN CN201810343596.3A patent/CN108598231A/zh active Pending
- 2013-07-18 CN CN201810879444.5A patent/CN108807635A/zh active Pending
- 2013-07-18 WO PCT/KR2013/006458 patent/WO2014014299A2/ko active Application Filing
- 2013-07-18 CN CN201810343598.2A patent/CN108550672A/zh active Pending
- 2013-07-18 CN CN201810342699.8A patent/CN108598229A/zh active Pending
- 2013-07-18 CN CN201810343207.7A patent/CN108550671A/zh active Pending
- 2013-07-18 CN CN201810343138.XA patent/CN108493308A/zh active Pending
- 2013-07-18 CN CN201380004181.9A patent/CN104011887A/zh active Pending
- 2013-07-18 US US14/118,599 patent/US10535798B2/en active Active
- 2013-07-18 CN CN201810343147.9A patent/CN108565323A/zh active Pending
-
2019
- 2019-12-05 US US16/704,574 patent/US20200127161A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009088299A (ja) * | 2007-09-29 | 2009-04-23 | Nichia Corp | 発光素子及びこれを備える発光装置 |
KR20110053064A (ko) * | 2009-11-13 | 2011-05-19 | 서울옵토디바이스주식회사 | 분포 브래그 반사기를 갖는 발광 다이오드 칩 및 발광 다이오드 패키지 |
KR20110095177A (ko) * | 2010-02-17 | 2011-08-24 | 도요다 고세이 가부시키가이샤 | 반도체 발광 소자 |
KR20120045542A (ko) * | 2010-10-29 | 2012-05-09 | 엘지이노텍 주식회사 | 발광소자 |
Also Published As
Publication number | Publication date |
---|---|
US10535798B2 (en) | 2020-01-14 |
EP2782149A2 (en) | 2014-09-24 |
CN108598229A (zh) | 2018-09-28 |
EP2782149B1 (en) | 2022-10-19 |
US20200127161A1 (en) | 2020-04-23 |
CN108598230A (zh) | 2018-09-28 |
US20140291714A1 (en) | 2014-10-02 |
EP2782149A4 (en) | 2015-08-05 |
CN108807635A (zh) | 2018-11-13 |
CN108550672A (zh) | 2018-09-18 |
CN108365074A (zh) | 2018-08-03 |
CN108598231A (zh) | 2018-09-28 |
CN104011887A (zh) | 2014-08-27 |
CN108550671A (zh) | 2018-09-18 |
CN108493308A (zh) | 2018-09-04 |
CN108565323A (zh) | 2018-09-21 |
WO2014014299A2 (ko) | 2014-01-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2014014299A3 (ko) | 반도체 발광소자 | |
WO2014014300A3 (ko) | 반도체 발광소자 | |
WO2011162479A3 (en) | Light emitting diode | |
TW201130165A (en) | Light emitting diode chip having distributed bragg reflector, method of fabricating the same, and light emitting diode package having distributed bragg reflector | |
WO2009120044A3 (ko) | 발광소자 및 그 제조방법 | |
EP2482343A3 (en) | Light emitting diode | |
WO2009020547A3 (en) | Semiconductor light emitting diodes with applied wavelength materials and methods of forming the same | |
EP2403022A3 (en) | Semiconductor light emitting diode and manufacturing method thereof | |
WO2011126248A3 (en) | Light emitting diode and method of fabricating the same | |
WO2014151689A3 (en) | Ultra-thin printed led layer removed from substrate | |
WO2009154383A3 (ko) | 반도체 발광소자 | |
WO2010123809A3 (en) | Non-radiatively pumped wavelength converter | |
WO2012108627A3 (en) | Light emitting diode having photonic crystal structure and method of fabricating the same | |
EP2690725A3 (en) | Surface emitting laser device and atomic oscillator | |
WO2011099771A3 (en) | Light emitting diode chip having distributed bragg reflector and method of fabricating the same | |
TW201130166A (en) | Reduced color over angle variation LEDs | |
EP2503603A3 (en) | Light emitting device and method for manufacturing the same | |
WO2013017364A3 (de) | Optoelektronische anordnung und verfahren zur herstellung einer optoelektronischen anordnung | |
WO2011022128A3 (en) | High brightness led utilizing a roughened active layer and conformal cladding | |
WO2013083528A3 (de) | Halbleiterleuchte | |
WO2009002129A3 (en) | Semiconductor light emitting device and method of manufacturing the same | |
TR201111229A2 (tr) | Aşınma durdurma katmanlı n-tipi kapatma yapısına sahip dikey ışık yayan diyot (vled) kalıp ve bunun üretim yöntemi. | |
EP2262014A3 (en) | Light emitting device, light emitting device package and lighting system having the same | |
WO2019067182A3 (en) | Mesa shaped micro light emitting diode with bottom n-contact | |
EP2312652A3 (en) | Light emitting device, light emitting device package and lighting system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13819478 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14118599 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2013819478 Country of ref document: EP |