WO2013183692A1 - Panneau de câblage imprimé flexible et procédé pour produire un panneau de câblage imprimé flexible - Google Patents

Panneau de câblage imprimé flexible et procédé pour produire un panneau de câblage imprimé flexible Download PDF

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Publication number
WO2013183692A1
WO2013183692A1 PCT/JP2013/065644 JP2013065644W WO2013183692A1 WO 2013183692 A1 WO2013183692 A1 WO 2013183692A1 JP 2013065644 W JP2013065644 W JP 2013065644W WO 2013183692 A1 WO2013183692 A1 WO 2013183692A1
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WIPO (PCT)
Prior art keywords
conductor
wiring board
printed wiring
flexible printed
conductive
Prior art date
Application number
PCT/JP2013/065644
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English (en)
Japanese (ja)
Inventor
岡　良雄
春日　隆
直太 上西
Original Assignee
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 住友電気工業株式会社 filed Critical 住友電気工業株式会社
Priority to CN201380023779.2A priority Critical patent/CN104272882B/zh
Publication of WO2013183692A1 publication Critical patent/WO2013183692A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts

Definitions

  • the present invention relates to a flexible printed wiring board provided with a blind via formed of a conductive paste, and a method for manufacturing the flexible printed wiring board.
  • Patent Document 1 discloses an example of a printed wiring board in which blind vias are formed using a conductive paste.
  • the blind via 100 includes a first land portion 111 formed on the first surface of the substrate 110, a second land portion 112 formed on the second surface of the substrate 110, and a first land. And a conductor 114 that connects the portion 111 and the second land portion 112.
  • the conductor 114 is formed by filling the via hole 113 with a conductive paste and curing the conductive paste.
  • the surface 115 of the conductor 114 is processed flat.
  • the flexible printed wiring board is disclosed also in patent document 2, the shape of the conductor 210 is different from the flexible printed wiring board of FIG. As shown in FIG. 9, a depression 212 is provided on the surface 211 of the conductor 210 of the blind via 200.
  • ⁇ Flexible printed circuit boards are placed in a bent state or bent repeatedly.
  • a force is applied to the blind via. Therefore, when the stress applied to the conductive layer and the conductor becomes larger than the adhesive force between the conductive layer and the conductor, the conductor peels from the conductive layer. Peeling between the conductive layer and the conductor increases the contact resistance of the blind via and reduces the reliability of the electric circuit using the flexible printed wiring board. For this reason, it is required that the contact resistance between the conductor and the conductive layer does not increase due to bending of the flexible printed wiring board.
  • the present invention has been made to solve such problems, and an object of the present invention is to provide a flexible printed wiring board capable of suppressing an increase in the contact resistance of a blind via against bending, and the flexible printed wiring board. It is in providing the manufacturing method of.
  • the base material the first conductive layer formed on the first surface of the base material, and the second conductive layer formed on the second surface of the base material.
  • a flexible printed wiring board provided with the conductor which connects a said 1st conductive layer and a said 2nd conductive layer is provided.
  • the flexible printed wiring board includes a first land portion provided on the first conductive layer and a second land portion provided on the opposite side of the first land portion with the base material sandwiched between the second conductive layers. And a via hole penetrating the first land portion and the base material and reaching the second land portion.
  • the conductor is formed of a conductive paste, and the conductor fills the via hole so as to cover the entire bottom surface of the via hole, and at least a part of the surface of the first land portion. And the thickness of the conductor on the central axis of the via hole is smaller than the sum of the thickness of the base material and the thickness of the first land portion.
  • the outer surface of the substrate extends and the inner surface contracts. At this time, force is applied in a direction in which the first land portion and the conductor are separated from each other. As a result, a gap is generated between the conductor and the first land portion, and the contact resistance of the blind via is increased.
  • the degree of increase in the contact resistance of the blind via depends on the structure of the conductor constituting the blind via.
  • the thickness of the conductor on the central axis of the via hole is made smaller than the sum of the thickness of the base material and the thickness of the first land portion.
  • a recess is provided on the central axis of the via hole so that the conductor is easily deformed, and the conductor is easily deformed following the deformation of the base material.
  • the thickness of the conductor on the central axis of the via hole is preferably 5 ⁇ m or more.
  • the conductor is deformed when the flexible printed wiring board is bent.
  • the conductor is thin, there is a high possibility that the conductor will crack. Therefore, if the thickness of the conductor is 5 ⁇ m or more, it is possible to suppress the occurrence of cracks in the conductor as compared with the case where the thickness of the conductor on the central axis of the via hole is less than 5 ⁇ m.
  • the thickness of the thickest portion of the conductor covering the first land portion is 2 ⁇ m or more.
  • the contact resistance between the conductor and the first land portion increases. Considering this point, if the thickness of the thickest portion covering the first land portion is 2 ⁇ m or more, the occurrence of cracks in the portion covering the first land portion can be suppressed.
  • an inner circle and an outer circle of the cross section In a cross section of the conductor when the conductor is cut by a plane perpendicular to the central axis of the via hole and including the surface of the first land portion, an inner circle and an outer circle of the cross section The distance between is preferably 5 ⁇ m or more.
  • the portion of the conductor corresponding to the opening of the via hole is likely to crack. Considering this point, if the distance between the inner circle and the outer circle of the cross section of the conductor is set to 5 ⁇ m or more, a crack occurs in a portion corresponding to the opening on the first land side of the via hole. This can be suppressed.
  • the conductor preferably includes flat spherical conductive particles and a combination thereof.
  • the gaps between the conductive particles increase.
  • the conductive particles are flat spherical, the gap between the conductive particles is small.
  • the base material the first conductive layer formed on the first surface of the base material, and the second conductive layer formed on the second surface of the base material.
  • a method of manufacturing a flexible printed wiring board comprising a conductor connecting the first conductive layer and the second conductive layer.
  • the method includes forming the conductor using a conductive paste having a thixotropy index of 0.25 or less represented by the following formula (1).
  • Thixotropic index log ( ⁇ 1 / ⁇ 2) / log (D2 / D1) (1)
  • ⁇ 1 indicates the viscosity of the conductive paste when the shear rate D1 is 2 s ⁇ 1
  • ⁇ 2 indicates the viscosity of the conductive paste when the shear rate D2 is 20 s ⁇ 1 .
  • the upper part of the conductor is raised by the surface tension.
  • the electrically conductive paste of this invention the center part of the upper part of a conductor can be depressed. This is due to the following reason.
  • the conductive paste has a property that the viscosity increases as it approaches a state where no shear stress is applied, that is, thixotropic property.
  • the thixotropy index indicates that the smaller the value, the lower the thixotropy. That is, after applying a conductive paste having a thixotropy index of 0.25 or less to a substrate, the conductive paste can be flowed, so that a depression can be formed in the upper central portion of the conductor.
  • the conductor may be formed using a conductive paste containing flat spherical conductive particles and having a mass ratio of the flat spherical conductive particles of 70% by mass or more. desirable.
  • the upper central portion of the conductor can be recessed.
  • the conductive paste further includes spherical conductive particles having an average particle size of 30 nm to 200 nm.
  • the upper central portion of the conductor can be recessed.
  • the conductive paste includes, as the flat spherical conductive particles, first conductive particles having an average particle size of 1.4 ⁇ m or more and 3.3 ⁇ m or less, and first conductive particles having an average particle size of 0.5 ⁇ m or more and 1.8 ⁇ m or less. 2 conductive particles are desirably included. In this case, the upper central portion of the conductor can be recessed.
  • conductive particles having an average particle size of 1.4 ⁇ m or more and 3.3 ⁇ m or less are included in the conductive paste, the following effects can be obtained. That is, conductive particles having a size of 1.4 ⁇ m or more and 3.3 ⁇ m or less increase the thickness of the conductive paste. Thereby, it can suppress that the film thickness of an electrically conductive paste becomes small too much. If conductive particles having an average particle size larger than 3.3 ⁇ m are included in the conductive paste, the film thickness becomes too thick.
  • the present invention it is possible to provide a flexible printed wiring board capable of suppressing an increase in the contact resistance of the blind via against bending and a method for manufacturing the flexible printed wiring board.
  • the flexible printed wiring board 1 includes a base material 30, a first conductive pattern 10 (first conductive layer) formed on the first surface 31 of the base material 30, and a second surface 32 of the base material 30.
  • 2 conductive pattern 20 (2nd conductive layer), and the conductor 40 which connects the 1st conductive pattern 10 and the 2nd conductive pattern 20 are provided.
  • the second surface 32 of the substrate 30 is located on the side opposite to the first surface 31.
  • the base material 30 is formed of a flexible insulating film.
  • the base material 30 is made of polyimide, polyethylene terephthalate, or the like.
  • the thickness of the base material 30 is appropriately selected according to the use of the flexible printed wiring board 1. Specifically, a substrate 30 having a thickness of 5 ⁇ m to 50 ⁇ m is employed.
  • Each conductive pattern 10 and 20 is formed by processing the metal layer of the base material 30.
  • the conductive patterns 10 and 20 are formed by etching a double-sided copper-clad laminate.
  • it may replace with a double-sided copper clad laminated board, and may use the board
  • the thickness of the first conductive pattern 10 is appropriately selected according to the use of the flexible printed wiring board 1.
  • the second conductive pattern 20 is formed in the same manner as the first conductive pattern 10.
  • the blind via 50 that connects the first conductive pattern 10 and the second conductive pattern 20 will be described.
  • the blind via 50 includes a first land portion 11, a second land portion 21, and a conductor 40 that connects the land portions 11 and 21.
  • the first land portion 11 is circular, and a land hole 11b is formed at the center thereof.
  • the diameter of the first land portion 11 is set to 300 ⁇ m to 1000 ⁇ m, for example.
  • the first land portion 11 is a part of the first conductive pattern 10.
  • the second land portion 21 is provided on the opposite side of the first land portion 11 with the base material 30 interposed therebetween.
  • the second land portion 21 is formed in a circular shape.
  • the diameter of the second land portion 21 is set to 100 ⁇ m to 1000 ⁇ m.
  • the second land portion 21 is a part of the second conductive pattern 20.
  • the shape of the 1st land part 11 and the 2nd land part 21 should not be limited to circular, A rectangle may be sufficient.
  • the first land portion 11 and the base material 30 are formed with via holes 33 penetrating the first land portion 11 and the base material 30 up to the second land portion 21.
  • the bottom surface 33 b of the via hole 33 corresponds to the inner surface of the second land portion 21.
  • the bottom surface 33b of the via hole 33 is substantially circular.
  • the via hole 33 is formed by, for example, laser irradiation.
  • the diameter of the via hole 33 is, for example, 20 ⁇ m to 300 ⁇ m.
  • the land hole 11 b constitutes a part of the via hole 33.
  • the conductor 40 fills the via hole 33 so as to cover the entire bottom surface 33 b of the via hole 33.
  • the conductor 40 covers part or all of the surface 11 a of the first land portion 11.
  • the bottom portion 42 of the conductor 40 is in contact with the second land portion 21.
  • the upper portion 41 of the conductor 40 is in contact with the first land portion 11.
  • a depression 44 exists in the central portion of the upper portion 41 of the conductor 40.
  • the bottom portion 42 of the conductor 40 is in contact with the second conductive pattern 20 in the central axis direction Da of the via hole 33.
  • the upper portion 41 of the conductor 40 includes a portion that contacts the first conductive pattern 10 in the central axis direction Da of the via hole 33 and partially covers the first land portion 11.
  • the thickness td of the conductor 40 on the central axis Ca of the via hole 33 is smaller than the sum of the thickness ta of the base material 30 and the thickness tb of the first land portion 11. Further, the thickness td of the conductor 40 on the central axis Ca of the via hole 33 is set to 5 ⁇ m or more.
  • the thickness te of the thickest portion of the conductor 40 that covers the first land portion 11 is 2 ⁇ m or more.
  • an inner circle and an outer portion of the cross section of the conductor 40 are cut.
  • the distance Df between the circle (via hole 33) is 5 ⁇ m or more.
  • the conductor 40 is formed of a conductive paste containing conductive particles 60 and a binder resin. That is, the conductor 40 is a structure including the conductive particles 60 and a combined body that couples the conductive particles 60.
  • the conductive particles 60 are melt bonded or sintered bonded at the contact portion. There is also a portion where the conductive particles 60 are simply in contact with each other.
  • the conductive particles 60 are fixed to each other with a binder resin. Since the binder resin shrinks during heat curing, the conductive particles 60 are present in a state where they are pressed against each other.
  • the binder resin is a thermosetting resin and exists as a cured product in the conductor 40.
  • Part or all of the conductive particles 60 included in the conductive paste are metal particles having a flattened sphere shape (hereinafter referred to as “flattened spherical shape”), and in the conductor 40, they exist as a bonded body. .
  • the metal particles are made of silver, copper, nickel or the like.
  • FIG. 3A shows a perspective view of the conductive particles 60.
  • FIG. 3B is a plan view of the conductive particles 60 viewed from a direction along the rotational symmetry axis Cr (hereinafter, rotational symmetry axis direction Dr).
  • FIG. 3C shows a cross-sectional view of the conductive particles 60.
  • the shape of the conductive particles 60 viewed from the rotationally symmetric axis direction Dr is substantially circular (a shape approximated to a circle).
  • the cross section when the conductive particles 60 are cut along the plane including the rotational symmetry axis Cr is a shape obtained by crushing a circle.
  • the ratio of the short side Lx to the long side Ly (short side Lx / long side Ly) of the cross section is 0.2 or more and less than 1.0.
  • Such flat spherical conductive particles 60 are formed by crushing spherical metal particles with a pressing machine or the like.
  • the blind via 350 having a conventional structure is one having no depression 44 on the central axis Cb of the via hole 333.
  • a shear stress Fx is generated along the boundary surface between the surface 311a of the first land portion 311 and the conductor 340.
  • a vertical stress Fy is generated in a direction perpendicular to the boundary surface between the inner peripheral surface 333a of the via hole 333 and the conductor 340.
  • a tensile stress Fz is generated in the upper part 341 of the conductor 340.
  • the upper part 341 of the conductor 340 is deformed following the base material 330. That is, when the bending of the flexible printed wiring board 300 is small, the shear stress Fx is smaller than the adhesive force between the surface 311 a of the first land portion 311 and the conductor 340, or the vertical stress Fy is the via hole 333. Since it is smaller than the adhesive force between the inner peripheral surface 333a and the conductor 340, the conductor 340 does not peel from the first land portion 311.
  • the upper portion 341 of the conductor 340 is peeled from the first land portion 311. That is, when the bending of the flexible printed wiring board 300 is large, the upper portion 341 of the conductor 340 is greatly bent, the strain ⁇ increases, and the tensile stress Fz applied to the upper portion 341 of the conductor 340 increases. As a result, the shear stress Fx becomes larger than the adhesive force between the surface 311a of the first land portion 311 and the conductor 340, and the vertical stress Fy is between the inner peripheral surface 333a of the via hole 333 and the conductor 340. Since it becomes larger than the adhesive force, the upper portion 341 of the conductor 340 is peeled from the first land portion 311 as shown in FIG.
  • Such peeling occurs when the bending of the flexible printed wiring board 300 is smaller than a predetermined curvature but the bending frequency is high.
  • the bending frequency is high, since the shear stress Fx is repeatedly applied to the bonding portion between the surface 311a of the first land portion 311 and the conductor 340, the bonding force of the bonding portion gradually decreases and peeling occurs.
  • the strain ⁇ of the upper portion 41 of the conductor 40 when the flexible printed wiring board 1 is bent is small. That is, the upper portion 41 of the conductor 40 is recessed unlike the blind via 350 having a conventional structure. Such a depression 44 shortens the length Ls from the second land portion 21 to the surface 43 of the conductor 40 as compared with the blind via 350 having a conventional structure. Since the magnitude of the strain ⁇ of the surface portion of the conductor 40 is smaller as it is closer to the second land portion 21, the strain ⁇ of the upper portion 41 of the conductor 40 is reduced by the presence of such a depression 44.
  • the shear stress Fx becomes larger than the adhesive force between the surface 11a of the first land portion 11 and the conductor 40, or the vertical stress Fy. Is prevented from becoming larger than the adhesive force between the inner peripheral surface 33a of the via hole 33 and the conductor 40. For this reason, as shown in FIG. 5, the upper portion 41 of the conductor 40 does not peel from the first land portion 11, and the upper portion 41 of the conductor 40 is deformed following the base material 30. Next, a method for manufacturing the flexible printed wiring board 1 will be described.
  • the conductive patterns 10 and 20 are formed on both surfaces of the base material 30 by an etching method.
  • the first conductive pattern 10 includes a land portion.
  • the second conductive pattern 20 includes a second land portion 21.
  • the land portion of the first conductive pattern 10 is changed to the first land portion 11 by forming a land hole 11b by a laser in the next step.
  • the via hole 33 is formed by a laser. Specifically, by irradiating the land portion of the first conductive pattern 10 with a laser, a hole (via hole 33) penetrating both the land portion and the substrate 30 is formed.
  • the via paste 33 is filled with the conductive paste by a printing method. After filling, the conductive paste is allowed to flow until the conductive paste is in a stable and static state. That is, the conductive paste is caused to flow until the central portion of the via hole 33 is depressed. Specifically, the base material 30 after filling with the conductive paste is left at room temperature for several minutes to several hours. Thereafter, the substrate 30 is heated to cure the conductive paste. Conductive paste Next, the conductive paste will be described.
  • the conductive paste has a property that after filling the via hole 33, it flows for a period of time and does not spread too much along the via hole 33.
  • the conductive paste contains conductive particles, a binder resin, and a solvent.
  • the conductive particles the flat spherical metal particles (corresponding to the second conductive particles in Table 1) shown in FIG. 3 are used.
  • the mass ratio of the silver particles to the entire conductive paste (hereinafter also simply referred to as mass ratio) is preferably 70% by mass or more.
  • the average particle size indicates a particle size corresponding to a value of 50% in terms of a volume cumulative value in a volume cumulative distribution of the particle size of the conductive particles 60 (diameter of the conductive particles 60 in plan view).
  • the conductive paste preferably contains two or more kinds of conductive particles having different average particle diameters as flat spherical conductive particles.
  • conductive particles having an average particle size of 0.5 ⁇ m to 1.8 ⁇ m hereinafter referred to as second conductive particles
  • conductive particles having an average particle size of 1.4 ⁇ m to 3.3 ⁇ m hereinafter referred to as first particles. (Referred to as conductive particles) in the conductive paste.
  • spherical conductive particles (hereinafter referred to as third conductive particles) be present in addition to the flat spherical conductive particles 60 in the conductive paste.
  • the spherical conductive particles preferably have an average particle size smaller than the average particle size of the flat spherical conductive particles 60.
  • spherical conductive particles having an average particle size of 30 nm to 200 nm are used.
  • the mass ratio of the spherical conductive particles is set smaller than the mass ratio of the flat spherical conductive particles 60.
  • the mass ratio of the spherical conductive particles is set to 1.0% by mass or more and 15% by mass or less.
  • conductive particles having an average particle size of 1.4 ⁇ m or more and 3.3 ⁇ m or less
  • coating particles whose surfaces are coated with metal can be used.
  • silver-coated copper particles in which copper particles are coated with silver can be used.
  • epoxy resin epoxy resin, phenol resin, polyester resin, acrylic resin, melamine resin, polyimide resin, polyamideimide resin, phenoxy resin, or the like is used.
  • a thermosetting resin is employed. Epoxy resins are particularly suitable.
  • the type of epoxy resin is not particularly limited.
  • a bisphenol type epoxy resin made from bisphenol A, bisphenol F, bisphenol S, bisphenol AD or the like is used.
  • a naphthalene type epoxy resin, a novolac type epoxy resin, a biphenyl type epoxy resin, a dicyclopentadiene type epoxy resin, or the like can also be used.
  • Epoxy resins include one-component and two-component epoxy resins, and any of them can be used.
  • a one-component epoxy resin in which a microcapsule type curing agent is dispersed in a main agent (epoxy resin).
  • a microcapsule type curing agent for example, butyl carbitol acetate or ethyl carbitol acetate is used as a solvent.
  • the mass ratio of the various conductive particles, the binder resin, and the solvent is set so as to satisfy the following expression (1).
  • Thixotropic index ⁇ 0.25
  • Thixotropic index log ( ⁇ 1 / ⁇ 2) / log (D2 / D1)
  • ⁇ 1 indicates the viscosity (Pa ⁇ s) of the conductive paste when the shear rate D1 is 2 s ⁇ 1
  • ⁇ 2 indicates the viscosity (Pa ⁇ s) of the conductive paste when the shear rate D2 is 20 s ⁇ 1 .
  • the average particle diameter and mass ratio of the conductive particles 60, the type and number of types of the conductive particles 60 included in the conductive paste, the type and mass ratio of the binder resin, the type and mass ratio of the solvent so that the formula (1) is satisfied. Etc. are set.
  • the type of the conductive particles 60 indicates a classification according to shape, such as spherical conductive particles and flat spherical conductive particles.
  • the number of types indicates the number of types of conductive particles included in the conductive paste.
  • Such a conductive paste has the following properties.
  • the conductive paste flows for a while.
  • a recess 44 is formed on the central axis Ca of the via hole 33.
  • Such properties can be realized by selecting the shape of the conductive particles 60. Hereinafter, this point will be described.
  • the fluidity of the conductive paste can be adjusted by the binder resin.
  • the mass ratio of the binder resin to the entire conductive paste is small, the fluidity adjustment range is small. For this reason, it is difficult to adjust the thixotropy index by selecting the type of binder resin.
  • the fluidity of the conductive paste is small because the scaly conductive particles 60 are present in a state of being caught with each other.
  • the spherical conductive particles 60 are the main component of the conductive paste, since the spherical conductive particles 60 are not caught, the fluidity of the conductive paste increases and may spread beyond the first land portion 11. .
  • flat spherical conductive particles 60 having an average particle size of 0.5 ⁇ m or more and 3.3 ⁇ m or less are used as the main component of the conductive paste.
  • the conductive particles 60 having such a shape the fluidity and shape retention shown above are exhibited. This is because the flat spherical conductive particles 60 are easy to flow because the mutual catching is small, and the flat spherical conductive particles 60 are rearranged into a dense and structurally stable state with this flow. It is thought that it is caused by being done.
  • Table 1 gives examples of conductive paste.
  • the conductive pastes 1 to 4 are suitable for manufacturing the flexible printed wiring board 1 of the present embodiment.
  • the conductive pastes 1 to 3 are particularly preferable for use in manufacturing the flexible printed wiring board 1 of the present embodiment.
  • the conductive paste 5 is an example of a conductive paste to be compared.
  • the first conductive particles are silver-coated copper particles and have a flat spherical shape as shown in FIG.
  • the average particle diameter (diameter in plan view) of the first conductive particles is 1.9 ⁇ m.
  • the second conductive particles are silver particles and have a flat spherical shape as shown in FIG.
  • the average particle size of the second conductive particles is 0.9 ⁇ m.
  • the third conductive particles are spherical silver particles.
  • the average particle diameter of the third conductive particles is 100 nm.
  • the epoxy resin is a bisphenol A type epoxy resin having a molecular weight of 45000 to 55000.
  • the curing agent indicates a microencapsulated imidazole-based latent curing agent (manufactured by Asahi Kasei E-Materials Co., Ltd., NovaCure (registered trademark) HX3941HP).
  • the viscosity of each conductive paste was measured using a viscometer (manufactured by Toki Sangyo Co., Ltd., TVE-22HT) at a temperature of 25 ° C. ⁇ 0.2 ° C. and a cone rotor (manufactured by Toki Sangyo Co., Ltd., 3 ° ⁇ R7.7 ( Measurement was performed using a rotor cord 07)).
  • the conductive pastes 1 to 3 satisfy the above formula (1) (thixotropic index is 0.25 or less). This is because the mass ratio of the flat spherical conductive particles (first conductive particles and second conductive particles) is set to 70% by mass or more, and the mass ratio of the first conductive particles is smaller than the mass ratio of the second conductive particles. This is because the conductive paste was prepared.
  • the conductive pastes 4 and 5 do not satisfy the above formula (1) (thixotropic index is 0.25 or less). This is because the mass ratio of the flat spherical first conductive particles is excessively increased.
  • the first conductive particles are flat spherical conductive particles having an average particle diameter of 1.9 ⁇ m
  • the second conductive particles are flat spherical conductive particles having an average particle diameter of 0.9 ⁇ m.
  • a conductive paste satisfying the equation is realized.
  • the mass ratio of the conductive particles is set to 70% by mass or more and the mass of the first conductive particles is set.
  • the conductive paste 4 is slightly deviated from the range defined in the above formula (1).
  • this conductive paste 4 as shown in Example 4 below, the depression 44 of the present embodiment A blind via 50 can be formed. However, the depth of the recess 44 of the blind via 50 is small.
  • Example An example of the flexible printed wiring board 1 will be described.
  • the flexible printed wiring board 1 of each embodiment has the same structure except for the structure of the blind via 50.
  • FIGS. 6A and 6B show the flexible printed wiring board 1 according to each embodiment.
  • FIG. 6A is a plan view of the flexible printed wiring board 1
  • FIG. 6B is a cross-sectional view of the flexible printed wiring board 1.
  • FIG. The flexible printed wiring board 1 has 36 blind vias 50 connected in a daisy chain shape.
  • Each first land portion 11 is formed on the first surface 31 of the base material 30.
  • Each second land portion 21 is formed on the second surface 32 of the base material 30.
  • the first land portions 11 are connected by connecting patterns 12 in order of two from the end.
  • Two second land portions 21 are connected by connecting patterns 22 in order from the end.
  • the connection pattern 12 of the second surface 32 is formed on the opposite side of the portion of the first surface 31 where there is no connection pattern 12 with the base material 30 in between. That is, in the plan view, the connection pattern 12 on the first surface 31 and the connection pattern 22 on the second surface 32 are alternately arranged.
  • each member is as follows (see FIGS. 2 and 6).
  • Dimension Dc (inner diameter of via hole 33) is 100 ⁇ m.
  • the outer diameter of the first land portion 11 is 500 ⁇ m.
  • the outer diameter of the second land portion 21 is 500 ⁇ m.
  • Dimension TD (dimension ta + dimension tb) is 24 ⁇ m.
  • “Dimension ta” in Table 2 indicates the thickness of the base material 30. “Dimension tb” indicates the thickness of the first land portion 11. “Dimension Dc” indicates the inner diameter of the via hole 33. “Dimension TD” indicates the sum of the dimension ta and the dimension tb. “Dimension td” indicates the thickness of the conductor 40 on the central axis Ca of the via hole 33. “Dimension te” indicates the thickness of the thickest portion of the conductor 40 that covers the first land portion 11 (covering portion).
  • the “dimension Df” is a cross section of the conductor 40 when the conductor 40 is cut along a plane that is perpendicular to the central axis Ca of the via hole 33 and includes the surface 11a of the first land portion 11. The distance of the smallest part in the distance between the inner circle and outer circle (via hole 33) of a cross section is shown. “Dimension Dg” indicates the distance of the portion of the conductor 40 having the smallest interval between the inner peripheral surface 33a of the via hole 33 and the outer periphery of the portion covering the first land portion 11 (covering portion). . These dimensions ta, tb, Dc, td, te, Df, and Dg indicate the average values of the 36 blind vias 50 of the flexible printed wiring board 1.
  • Example 1 the flexible printed wiring board 1 was formed using the conductive paste 1 shown in Table 1.
  • the shape of the blind via 50 is as follows (see Table 2).
  • a depression 44 was formed on the central axis Ca of the via hole 33.
  • the thickness te of the covering portion of the conductor 40 was 2 ⁇ m or more.
  • the distance Df of the conductor 40 was 5 ⁇ m or more.
  • the distance Dg of the covering portion of the conductor 40 was 5 ⁇ m or more.
  • the resistance increase rate of the blind via 50 before and after the bending test was 0.6%. This value is smaller than the determination value (10%).
  • a brass bending jig 70 having a curved surface with a radius r of 1.0 mm at the tip is prepared. Prior to the bending test, the resistance of the conductive pattern is measured. Next, a bending test is performed.
  • the first surface 31 of the flexible printed wiring board 1 according to the test is disposed outside and the flexible printed wiring board 1 is brought into close contact with the bending jig 70.
  • the flexible printed wiring board 1 is moved so as to pass through the curved surface.
  • the second surface 32 of the flexible printed wiring board 1 is set to the outside, and the flexible printed wiring board 1 is brought into close contact with the bending jig 70 so as to be curved from the first surface 71 to the second surface 72 of the bending jig 70. Move to pass.
  • Such a bending operation is counted as one time, and a total of 10 bending operations are performed.
  • the resistance change rate is obtained based on the resistance of the conductive pattern before and after the bending test.
  • the resistance change rate is obtained as an average value of the resistance change rates of the 36 blind vias 50.
  • Example 2 a flexible printed wiring board 1 having the same structure as Example 1 was formed using the conductive paste 2 shown in Table 1.
  • a depression 44 was formed on the central axis Ca of the via hole 33.
  • the thickness te (dimension te) of the covering portion of the conductor 40 was 2 ⁇ m or more.
  • the distance Df (dimension Df) of the conductor 40 was 5 ⁇ m or more.
  • the distance Dg (dimension Dg) of the covering portion of the conductor 40 was 5 ⁇ m or more.
  • the change rate of the resistance of the blind via 50 before and after the bending test was 1.4%. This value is smaller than the determination value (10%). No peeling was observed between the conductor 40 and the first land portion 11 after the bending test. That is, the same result as in Example 1 was obtained.
  • Example 3 a flexible printed wiring board 1 having the same structure as Example 1 was formed using the conductive paste 3 shown in Table 1.
  • a depression 44 was formed on the central axis Ca of the via hole 33.
  • the thickness te (dimension te) of the covering portion of the conductor 40 was 2 ⁇ m or more.
  • the distance Df (dimension Df) of the conductor 40 was 5 ⁇ m or more.
  • the distance Dg (dimension Dg) of the covering portion of the conductor 40 was 5 ⁇ m or more.
  • the change rate of the resistance of the blind via 50 before and after the bending test was 2.1%. This value is smaller than the determination value (10%). No peeling was observed between the conductor 40 and the first land portion 11 after the bending test. That is, the same result as in Example 1 was obtained.
  • Example 4 the flexible printed wiring board 1 having the same structure as that of Example 1 was formed using the conductive paste 4 shown in Table 1.
  • the recess 44 was not formed in the via hole 33 in the conductor 40.
  • the rate of change in the resistance of the blind via 50 before and after the bending test was 18.2%. This value is larger than the determination value (10%). Separation occurred between the conductor 40 and the first land portion 11 after the bending test.
  • the increment of the contact resistance of the blind via 50 with respect to the bending of the flexible printed wiring board 1 is reduced. This is mainly due to a decrease in the flexural modulus of the blind via 50 due to the presence of the recess 44.
  • Example 4 it is shown that it is more preferable to use a conductive paste having a thixotropy index of 0.25 or less in order to form the blind via 350 having such a depression 44.
  • the conductive paste having a thixotropy index of 0.28 is used to form the blind via 350 having the depression 44 and having a resistance increase rate of 10% or less after the test.
  • the depth is small. For this reason, in order to form the hollow 44 reliably, it can be said that it is preferable to make the thixotropy index
  • the mass ratio of the first conductive particles (conductive particles having an average particle size of 1.4 ⁇ m to 3.3 ⁇ m) is set to the second conductive particles (average particle size is The mass ratio of the conductive particles (0.5 ⁇ m to 1.8 ⁇ m) is preferably smaller. That is, in Example 4, the conductive paste 4 in which the mass ratio of the first conductive particles is larger than the mass ratio of the second conductive particles is used. And also with this electrically conductive paste 4, the blind via
  • the thickness (dimension td) of the conductor 40 on the central axis Ca of the via hole 33 is the same as the thickness (dimension ta) of the substrate 30 and the thickness (dimension) of the first land portion 11. It is smaller than the sum (dimension TD) with tb).
  • the degree of increase in the contact resistance of the blind via 50 depends on the structure of the conductor 40 constituting the blind via 50.
  • the conductor 40 is not deformed when the flexible printed wiring board 1 is bent, the inner peripheral surface 33a of the via hole 33 and the conductor 40 are separated from each other, or the conductor 40 is peeled from the first land portion 11. For this reason, the contact resistance of the blind via 50 increases.
  • the thickness (dimension td) of the conductor 40 on the central axis Ca of the via hole 33 is set to the thickness (dimension ta) of the substrate 30. It is smaller than the sum of the thickness (dimension tb) of the first land portion 11. That is, in the conductor 40, a recess 44 is provided on the central axis Ca of the via hole 33 so that the conductor 40 is easily deformed, and the conductor 40 is easily deformed following the deformation of the substrate 30. . Thereby, the increase in the contact resistance of the blind via 50 with respect to the bending of the flexible printed wiring board 1 can be suppressed.
  • the thickness (dimension td) of the conductor 40 on the central axis Ca of the via hole 33 is 5 ⁇ m or more.
  • the conductor 40 When the flexible printed wiring board 1 is bent, the conductor 40 is deformed. When the conductor 40 is thin, there is a high possibility that the conductor 40 will crack. In the conductor 40, if the thickness td on the central axis Ca of the via hole 33 is less than 5 ⁇ m, the possibility that the conductor 40 will crack increases. Therefore, the thickness td of the conductor 40 is set to 5 ⁇ m or more. Thereby, compared with the case where the thickness td of the conductor 40 on the central axis Ca of the via hole 33 is less than 5 ⁇ m, the occurrence of cracks in the conductor 40 can be suppressed.
  • the thickness (dimension te) of the thickest portion of the conductor 40 covering the first land portion 11 is set to 2 ⁇ m or more.
  • the portion of the conductor 40 that covers the first land portion 11 is related to the magnitude of the contact resistance between the conductor 40 and the first land portion 11.
  • the contact resistance between the conductor 40 and the first land portion 11 increases.
  • the thickness te of the thickest portion covering the first land portion 11 is set to 2 ⁇ m or more. Thereby, it can suppress that a crack generate
  • the distance Df (dimension Df) is 5 ⁇ m or more.
  • a portion of the conductor 40 corresponding to the opening 34 of the via hole 33 is likely to crack. Therefore, in the donut-shaped cross section when the conductor 40 is cut by a plane perpendicular to the central axis Ca of the via hole 33 and including the surface 11a of the first land portion 11, an inner circle of the cross section of the conductor 40 is obtained.
  • the distance Df (dimension Df) between the outer circle and the outer circle (a circle corresponding to the inner peripheral surface 33a of the via hole 33) is 5 ⁇ m or more. Thereby, it can suppress that a crack generate
  • the distance Dg (dimension Dg) is 5 ⁇ m or more.
  • the distance between the inner peripheral surface 33a of the via hole 33 and the outer periphery of the covering portion covering the first land portion 11 is the smallest distance.
  • the distance Dg (dimension Dg) is set to 5 ⁇ m or more. Thereby, it can suppress that a crack generate
  • the conductor 40 has a structure including flat spherical conductive particles 60 and a combination thereof.
  • the conductor 40 When there are protrusions on the surface of the conductive particles 60 constituting the conductor 40, the gap between the adjacent conductive particles 60 increases. Therefore, the conductor 40 is composed of flat spherical conductive particles 60, and the density of the conductive particles 60 is increased. Thereby, the allowable current amount of the blind via 50 can be increased.
  • a conductive paste having a thixotropy index of 0.25 or less is used as shown in the above formula (1).
  • the upper portion 41 of the conductor 40 rises due to surface tension.
  • the central portion of the upper portion 41 of the conductor 40 can be recessed. This is due to the following reason.
  • a conductive paste having a large thixotropy index that is, a conductive paste having an increased viscosity when no shear stress is applied, has been used. For this reason, after filling the via hole 33 with the conductive paste, the conductive paste did not spread and was in a raised state.
  • a conductive paste having a thixotropy index of 0.25 or less is used.
  • an electrically conductive paste can be made to flow.
  • the conductive paste flows along the shape of the via hole 33, and the central portion of the conductor 40 is depressed. That is, the depression 44 can be formed in the central portion of the conductor 40 by using a conductive paste having a thixotropy index of 0.25 or less.
  • a conductive paste having a thixotropy index of 0.25 or less, including flat spherical conductive particles, and a mass ratio of these flat spherical conductive particles to the entire conductive paste is 70% by mass or more is used. . Thereby, the central part of the surface 43 of the conductor 40 can be depressed.
  • the conductive paste has an average particle size of 0.5 ⁇ m or more and 1.8 ⁇ m or less and a flat spherical conductive particle (second conductive particle), and an average particle size of 1.4 ⁇ m or more and 3.3 ⁇ m or less of conductive particles (first Conductive particles). Thereby, the center part of the upper part 41 of the conductor 40 can be depressed.
  • conductive particles (first conductive particles) having an average particle size of 1.4 ⁇ m or more and 3.3 ⁇ m or less are included in the conductive paste, the following effects can be obtained. That is, the conductive particles (first conductive particles) having a size of 1.4 ⁇ m or more and 3.3 ⁇ m or less increase the thickness of the conductive paste. Thereby, it can suppress that an electrically conductive paste becomes thin too much.
  • the mass ratio of the first conductive particles is 30% by mass or less.
  • the recess 44 is difficult to be formed.
  • the depression 44 can be more reliably formed by setting the mass ratio of the first conductive particles to 30 mass% or less.
  • the spherical conductive particles (third conductive particles) having an average particle size of 30 nm to 200 nm are included in the conductive paste, and the thixotropic index of the conductive paste is set to 0.25 or less. Thereby, the center part of the upper part 41 of the conductor 40 can be depressed.
  • the means for forming the depression 44 in the conductor 40 the use of a conductive paste having a thixotropy index of 0.25 or more is adopted, but the means for forming the depression 44 is not limited to this.
  • a means of forming the depression 44 on the central axis Ca of the via hole 33 can be adopted.
  • the depth, shape, and the like of the recess 44 can be arbitrarily set by selecting a mold.
  • the structure of the conductor 40 having the depression 44 is applied to the blind via 50, but this structure is not applied only to the blind via 50.
  • the present invention can also be applied to the conductor 40. Also in this case, peeling of the conductor 40 from the hole or groove corresponding to the via hole 33 can be suppressed.
  • the present invention can also be applied to a multilayer flexible printed wiring board having three or more layers.
  • SYMBOLS 1 Flexible printed wiring board, 10 ... 1st conductive pattern, 11 ... 1st land part, 11a ... Surface, 11b ... Land hole, 12 ... Connection pattern, 20 ... 2nd conductive pattern, 21 ... 2nd land part, 22 Connection pattern, 30 ... base material, 31 ... first surface, 32 ... second surface, 33 ... via hole, 33a ... inner peripheral surface, 33b ... bottom surface, 34 ... opening, 40 ... conductor, 41 ... upper part, 42 ... bottom, 43 ... surface, 44 ... depression, 50 ... blind via, 60 ... conductive particles, 70 ... bending jig, 71 ... first surface, 72 ... second surface, 100 ...
  • blind via 110 ... base material, DESCRIPTION OF SYMBOLS 111 ... 1st land part, 112 ... 2nd land part, 113 ... Via hole, 114 ... Conductor, 115 ... Surface, 200 ... Blind via, 210 ... Conductor, 211 ... Surface, 212 ... Depression, 300 ... Flexible print wiring , 311 ... first land portion, 311a ... surface, 321 ... second land portion, 330 ... substrate, 333 ... via hole, 333a ... inner peripheral surface, 340 ... conductor, 341 ... top 350 ... blind vias.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

La présente invention concerne un panneau de câblage imprimé flexible qui comporte une base (30), un premier motif conducteur, un second motif conducteur, et un conducteur (40) qui connecte le premier motif conducteur et le second motif conducteur l'un avec l'autre. Le premier motif conducteur a une première partie de plage (11), et le second motif conducteur a une seconde partie de plage (21) qui est disposée de manière opposée à la première partie de plage (11), de part et d'autre de la base (30) se trouvant entre elles. Le conducteur (40) est formé d'une pâte conductrice et est disposé de telle sorte qu'un trou de raccordement (33) qui pénètre à travers la première partie de plage (11) et la base (30) et atteint la seconde partie de plage (21) est rempli par le conducteur (40) et au moins une partie de la surface de la première partie de plage (11) est recouverte du conducteur (40). L'épaisseur du conducteur (40) au-dessus de l'axe central (Ca) du trou de raccordement (33) est définie pour être plus petite que la somme de l'épaisseur de la base (30) et de l'épaisseur de la première partie de plage (11).
PCT/JP2013/065644 2012-06-08 2013-06-06 Panneau de câblage imprimé flexible et procédé pour produire un panneau de câblage imprimé flexible WO2013183692A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201380023779.2A CN104272882B (zh) 2012-06-08 2013-06-06 挠性印刷配线板以及挠性印刷配线板的制造方法

Applications Claiming Priority (2)

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JP2012131159A JP5793113B2 (ja) 2012-06-08 2012-06-08 フレキシブルプリント配線板
JP2012-131159 2012-06-08

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WO2013183692A1 true WO2013183692A1 (fr) 2013-12-12

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Cited By (1)

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JPWO2016132424A1 (ja) * 2015-02-16 2017-11-24 日本メクトロン株式会社 フレキシブルプリント配線板の製造方法

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CN106134299B (zh) 2014-03-20 2018-10-23 住友电气工业株式会社 印刷线路板用基板、印刷线路板以及制造印刷线路板用基板的方法
WO2015147219A1 (fr) * 2014-03-27 2015-10-01 住友電気工業株式会社 Substrat pour cartes de circuits imprimés, carte de circuits imprimés et procédé de fabrication de substrat pour cartes de circuits imprimés
WO2016117575A1 (fr) 2015-01-22 2016-07-28 住友電気工業株式会社 Substrat pour carte de circuit imprimé, carte de circuit imprimé, et procédé de fabrication de carte de circuit imprimé
JP7048877B2 (ja) * 2017-09-22 2022-04-06 日亜化学工業株式会社 多層基板の製造方法、および、部品実装基板の製造方法

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JP2011199103A (ja) * 2010-03-23 2011-10-06 Fujikura Ltd 配線基板及びその製造方法
JP2011199250A (ja) * 2010-02-25 2011-10-06 Panasonic Corp 多層配線基板、及び多層配線基板の製造方法

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JP2775715B2 (ja) * 1995-03-13 1998-07-16 北陸電気工業株式会社 回路基板とその製造方法
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JP2008103548A (ja) * 2006-10-19 2008-05-01 Sumitomo Electric Ind Ltd 多層プリント配線板及びその製造方法
JP2011199250A (ja) * 2010-02-25 2011-10-06 Panasonic Corp 多層配線基板、及び多層配線基板の製造方法
JP2011199103A (ja) * 2010-03-23 2011-10-06 Fujikura Ltd 配線基板及びその製造方法

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JP2013254910A (ja) 2013-12-19
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CN104272882B (zh) 2017-12-22

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