WO2018147423A1 - Élément de masse, carte de circuit imprimé blindée et procédé de fabrication de ladite carte - Google Patents

Élément de masse, carte de circuit imprimé blindée et procédé de fabrication de ladite carte Download PDF

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Publication number
WO2018147423A1
WO2018147423A1 PCT/JP2018/004654 JP2018004654W WO2018147423A1 WO 2018147423 A1 WO2018147423 A1 WO 2018147423A1 JP 2018004654 W JP2018004654 W JP 2018004654W WO 2018147423 A1 WO2018147423 A1 WO 2018147423A1
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WO
WIPO (PCT)
Prior art keywords
shield
layer
film
ground member
printed wiring
Prior art date
Application number
PCT/JP2018/004654
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English (en)
Japanese (ja)
Inventor
裕介 春名
貴彦 香月
長谷川　剛
宏 田島
Original Assignee
タツタ電線株式会社
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Application filed by タツタ電線株式会社 filed Critical タツタ電線株式会社
Priority to JP2018567514A priority Critical patent/JP6872567B2/ja
Publication of WO2018147423A1 publication Critical patent/WO2018147423A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to a ground member, a shield printed wiring board, and a method for manufacturing a shield printed wiring board.
  • Flexible printed wiring boards are frequently used to incorporate circuits in complex mechanisms in electronic devices such as mobile phones, video cameras, and notebook computers that are rapidly becoming smaller and more functional. Furthermore, taking advantage of its excellent flexibility, it is also used for connection between a movable part such as a printer head and a control part. In these electronic devices, electromagnetic wave shielding measures are indispensable, and flexible printed wiring boards used in the device are also described as flexible printed wiring boards (hereinafter referred to as “shield printed wiring boards”). Have been used.
  • a general shield printed wiring board is usually a base film in which a printed circuit and an insulating film are sequentially provided on a base film, an adhesive layer, a shield layer laminated on the adhesive layer, and the adhesive layer And a shielding film that covers the base film so that the adhesive layer is in contact with the base film.
  • the printed circuit includes a ground circuit, and the ground circuit is electrically connected to the casing of the electronic device in order to obtain a ground.
  • the insulating film is provided on the printed circuit including the ground circuit.
  • the base film is covered with a shield film having an insulating layer. Therefore, in order to electrically connect the ground circuit and the casing of the electronic device, it is necessary to make holes in advance in part of the insulating film and the shield film. This has been a factor that hinders the degree of freedom in designing a printed circuit.
  • a cover film is coated on one side of a separate film, a shield layer composed of a metal thin film layer and an adhesive layer is provided on the surface of the cover film, and the cover film is provided on one end side.
  • the ground member is pressed against the cover film so that the projection of the ground member penetrates the cover film. Therefore, the ground member can be disposed at an arbitrary position of the shield film.
  • the ground circuit and the housing of the electronic device can be electrically connected at an arbitrary position.
  • the shield printed wiring board is repeatedly heated and cooled in a solder reflow process or the like.
  • the change in volume due to thermal expansion and thermal shrinkage causes the protrusion of the ground member and the shield layer to In some cases, the connection is damaged and the resistance value increases.
  • the present invention is an invention made to solve the above-described problems, and an object of the present invention is a ground member that can be disposed at an arbitrary position, and a shield printed wiring board using the ground member is heated and An object of the present invention is to provide a ground member that is less likely to be displaced between the conductive protrusions of the ground member and the shield layer of the shield film when the components are mounted by repeating cooling.
  • the ground member of the present invention has a first main surface and a second main surface opposite to the first main surface, and is composed of an external connection member having conductivity, and the first main surface. Is a ground member having conductive protrusions, and a low melting point metal layer is formed on the surface of the conductive protrusions.
  • the ground member of the present invention is used for a shield printed wiring board composed of a base film and a shield film.
  • the base film is a film formed by sequentially providing a printed circuit including a ground circuit and an insulating film on a base film.
  • the shield film is a film composed of a shield layer and an insulating layer laminated on the shield layer.
  • the shield film covers the base film so that the shield layer of the shield film is disposed closer to the base film than the insulating layer.
  • the ground member of the present invention is disposed by being pressed against the shield printed wiring board so that the conductive protrusion of the ground member of the present invention penetrates the insulating layer of the shield film. Further, when the ground member of the present invention is arranged on the shield printed wiring board as described above, it is not necessary to provide a hole or the like in the insulating layer of the shield film of the shield printed wiring board in advance, and the ground member of the present invention is placed at an arbitrary position. Can be arranged.
  • a low melting point metal layer is formed on the surface of the conductive protrusion.
  • heating is also performed. By this heating, the low melting point metal layer is softened, and the adhesion between the conductive protrusion of the ground member and the shield layer of the shield film can be improved. Therefore, even if the component is mounted by repeatedly heating and cooling the shield printed wiring board using the ground member of the present invention, a deviation occurs between the conductive protrusion of the ground member and the shield layer of the shield film. Hateful.
  • the low melting point metal layer is preferably formed of a metal having a melting point of 300 ° C. or lower.
  • the low melting point metal layer is formed of a metal having a melting point of 300 ° C. or lower, the low melting point metal layer is easily softened when the ground member is placed on the shield printed wiring board, and the conductive protrusion of the ground member
  • the adhesion of the shield film with the shield layer can be preferably improved.
  • the low melting point metal layer is formed of a metal having a melting point exceeding 300 ° C., the heating temperature when the ground member is arranged on the shield printed wiring board becomes high. Therefore, the ground member and the shield printed wiring board are easily damaged by heat.
  • the thickness of the low melting point metal layer is preferably 0.1 to 50 ⁇ m.
  • the thickness of the low melting point metal layer is less than 0.1 ⁇ m, the amount of metal constituting the low melting point metal layer is small. Therefore, when the ground member is placed on the shield printed wiring board, the conductive protrusion of the ground member And it becomes difficult to improve adhesiveness with the shield layer of a shield film.
  • the thickness of the low melting point metal layer exceeds 50 ⁇ m, the low melting point metal layer is thick, so that the conductive protrusion of the ground member becomes thick. Therefore, when arrange
  • the low melting point metal layer contains a flux.
  • the metal constituting the low melting point metal layer is softened by including the flux in the low melting point metal layer, the metal constituting the low melting point metal layer, the conductive protrusion of the ground member, and the shield layer of the shield film, Becomes easier to adhere. As a result, the adhesion between the conductive protrusion of the ground member and the shield layer of the shield film can be further improved.
  • the external connection member preferably includes at least one selected from the group consisting of copper, aluminum, silver, gold, nickel, chromium, titanium, zinc, and stainless steel. These materials are suitable for electrically connecting the ground member and the external ground.
  • a corrosion-resistant layer is formed on the second main surface.
  • the corrosion-resistant layer is formed on the second main surface of the ground member, the ground member can be prevented from being corroded.
  • the corrosion-resistant layer contains at least one selected from the group consisting of nickel, gold, silver, platinum, palladium, rhodium, iridium, ruthenium, osmium, and alloys thereof. These materials are not susceptible to corrosion. Therefore, these materials are materials suitable for the corrosion-resistant layer of the ground member of the present invention.
  • the conductive protrusions may be columnar.
  • the conductive protrusions are columnar, it is easy to penetrate the insulating layer when the ground member is pressed against the insulating layer of the shield film.
  • the area of the bottom surface of the conductive protrusion is preferably 1.0 to 1.0 ⁇ 10 6 ⁇ m 2 .
  • the area of the bottom surface of the conductive protrusion is less than 1.0 ⁇ m 2 , the strength of the conductive protrusion becomes weak and the conductive protrusion is easily broken.
  • the electrical connection between the conductive protrusion and the external connection member is broken.
  • the conductive protrusion When the area of the bottom surface of the conductive protrusion exceeds 1.0 ⁇ 10 6 ⁇ m 2 , the conductive protrusion is too thick, so that it is difficult to penetrate the insulating layer of the shield film when the ground member is disposed on the shield printed wiring board. .
  • the pitch between the conductive protrusions is preferably 1 to 1000 ⁇ m. It is technically difficult to produce a ground member in which the pitch between the conductive protrusions is less than 1 ⁇ m.
  • the pitch between the conductive protrusions exceeds 1000 ⁇ m, the density of the conductive protrusions decreases, and the total contact area between the conductive protrusions and the shield layer of the shield film decreases. Therefore, the adhesiveness between the conductive protrusion and the shield layer of the shield film tends to be lowered.
  • the external connection member may be bent so that the first main surface side protrudes, and a part of the protruded external connection member may be the conductive protrusion.
  • the ground member having such a shape can be easily manufactured simply by bending the external connection member.
  • the shield printed wiring board of the present invention comprises a base film in which a printed circuit including a ground circuit and an insulating film are sequentially provided on a base film, a shield layer, and an insulating layer laminated on the shield layer.
  • a shield printed wiring board comprising: a shield film that covers the base film so that the shield layer is disposed closer to the base film than the insulating layer; and a ground member that is disposed on the insulating layer of the shield film.
  • the ground member has a first main surface and a second main surface opposite to the first main surface, and has a conductive external connection member and the first main surface side.
  • a low melting point metal layer is formed on the surface of the conductive protrusion, and the conductive protrusion of the ground member is formed of the shield film.
  • the insulating layer penetrates, the low melting point metal layer of the ground member is connected to the shield layer of the shield film, and the external connection member of the ground member can be electrically connected to the external ground. It is characterized by that.
  • the shield printed wiring board of the present invention has a first main surface and a second main surface opposite to the first main surface, and has an external connection member having conductivity, and the first main surface.
  • a ground member having a low melting point metal layer formed on the surface of the conductive protrusion, that is, the ground member of the present invention is used. Therefore, even if heating and cooling are repeated and components are mounted on the shield printed wiring board of the present invention, it is difficult for deviation to occur between the conductive protrusions of the ground member and the shield layer of the shield film.
  • the shield film includes an adhesive layer, the shield layer laminated on the adhesive layer, and the insulating layer laminated on the shield layer. It is desirable that the adhesive layer is in contact with the base film. When the shield film has an adhesive layer, the shield film can be easily adhered to the base film during the production of the shield printed wiring board.
  • the adhesive layer of the shield film is preferably a conductive adhesive layer.
  • the adhesive layer of the shield film is a conductive adhesive layer
  • the conductive protrusion of the ground member penetrates the insulating layer of the shield film, so that the conductive protrusion of the ground member and the conductive adhesive layer contact each other.
  • the external connection member of the ground member and the ground circuit of the base film can be electrically connected.
  • the shield layer of the shield film is preferably made of metal.
  • the metal suitably functions as a shield layer that shields electromagnetic waves.
  • a low melting point metal layer of the shield film is formed between the adhesive layer and the shield layer and / or between the shield layer and the insulating layer.
  • the low melting point metal layer of the shield film is preferably connected to the conductive protrusion of the ground member.
  • the shield layer of the shield film is a conductive adhesive layer, and the conductive adhesive layer may be in contact with the base film.
  • the shield layer is a conductive adhesive layer
  • the shield layer has both a function for adhering the shield film to the base film and a function for shielding electromagnetic waves.
  • a low melting point metal layer of a shield film is formed between the shield layer and the insulating layer, and the low melting point metal layer of the shield film is a conductive material of the ground member. It is desirable to connect with the protrusion. With such a configuration, the adhesion between the conductive protrusion of the ground member and the shield layer of the shield film can be improved.
  • the method for producing a shield printed wiring board according to the present invention includes a base film in which a printed circuit including a ground circuit and an insulating film are sequentially provided on a base film, a shield layer, and an insulating layer laminated on the shield layer.
  • a shield printed wiring board comprising a shield film having the above and a ground member of the present invention disposed on an insulating layer of the shield film, wherein the substrate film side is more than the insulating layer of the shield film.
  • a heating step of heating and softening the low melting point metal layer of the ground member In order to connect the low-melting point metal layer of the ground member to the shield layer of the shield film, a pressurizing step of pressurizing the ground member so that the conductive protrusion of the ground member penetrates the insulating layer of the shield film.
  • the shield printed wiring board of the present invention can be manufactured.
  • the shield film may include an adhesive layer, the shield layer laminated on the adhesive layer, and the insulating layer laminated on the shield layer. desirable.
  • the shield film has an adhesive layer, the shield film can be easily adhered to the base film in the shield film placing step.
  • the adhesive bond layer of the said shield film is a conductive adhesive layer. If the adhesive layer of the shield film is a conductive adhesive layer, the conductive protrusions of the ground member are brought into contact with each other by passing the conductive protrusions of the ground member through the insulating layer of the shield film. The external connection member of the ground member and the ground circuit of the base film can be electrically connected.
  • the shield layer of the said shield film in the manufacturing method of the shield printed wiring board of this invention, it is desirable for the shield layer of the said shield film to consist of metals.
  • the metal suitably functions as a shield layer that shields electromagnetic waves.
  • a low melting point metal layer of the shield film is provided between the adhesive layer and the shield layer and / or between the shield layer and the insulating layer.
  • the low melting point metal layer of the shield film is preferably softened and connected to the conductive protrusion of the ground member.
  • the shield layer of the shield film may be a conductive adhesive layer.
  • the shield layer has both a function for adhering the shield film to the base film and a function for shielding electromagnetic waves.
  • a low melting point metal layer of the shield film is formed between the shield layer and the insulating layer.
  • the shield film It is desirable to soften the low melting point metal layer and connect it to the conductive protrusion of the ground member. By doing in this way, the adhesiveness of the electroconductive protrusion of a ground member and the shield layer of a shield film can be improved.
  • the ground member of the present invention When the ground member of the present invention is disposed on the shield printed wiring board, it is not necessary to previously provide a hole or the like in the insulating layer of the shield film of the shield printed wiring board, and the ground member of the present invention can be disposed at an arbitrary position. . In addition, when a component is mounted by repeatedly heating and cooling the shield printed wiring board using the ground member of the present invention, the gap between the conductive protrusion of the ground member and the shield layer or adhesive layer of the shield film Can be prevented from occurring.
  • FIG. 1 is a cross-sectional view schematically showing an example of the ground member of the present invention.
  • FIG. 2 is a cross-sectional view schematically showing an example of a shield printed wiring board in which the ground member of the present invention is used.
  • FIGS. 3A and 3B are schematic views schematically showing an example in which the ground member of the present invention is used in a shield printed wiring board.
  • 4 (a) to 4 (d) are process diagrams schematically showing an example of the manufacturing method of the ground member of the present invention in the order of processes. It is process drawing which shows typically an example of the shield film mounting process of the manufacturing method of the shield printed wiring board of this invention.
  • FIG. 1 is a cross-sectional view schematically showing an example of the ground member of the present invention.
  • FIG. 2 is a cross-sectional view schematically showing an example of a shield printed wiring board in which the ground member of the present invention is used.
  • FIGS. 3A and 3B are schematic views schematically showing an example in which the ground member of
  • FIG. 6 is a process chart schematically showing an example of a ground member arranging process in the method for manufacturing a shield printed wiring board according to the present invention.
  • FIG. 7 is a process diagram schematically showing an example of a pressurizing process of the method for manufacturing a shield printed wiring board according to the present invention.
  • FIG. 8 is a process diagram schematically showing an example of a heating process of the method for manufacturing a shield printed wiring board of the present invention.
  • FIGS. 9A and 9B are diagrams schematically showing an example of a method for manufacturing a shield printed wiring board in which the ground member of the present invention is used.
  • FIG. 10 is a cross-sectional view schematically showing an example of a shield printed wiring board in which the ground member of the present invention is used.
  • FIG. 11 is a schematic view schematically showing an example of the case where the ground member of the present invention is used for a shield printed wiring board.
  • FIG. 12 is a cross-sectional view schematically showing an example of a shield printed wiring board in which the ground member of the present invention is used.
  • FIG. 13 is a schematic view schematically showing an example of the case where the ground member of the present invention is used for a shield printed wiring board.
  • FIG. 14 is a cross-sectional view schematically showing an example of a shield printed wiring board in which the ground member of the present invention is used.
  • FIG. 15 is a schematic view schematically showing an example in which the ground member of the present invention is used for a shield printed wiring board.
  • FIG. 16 is a cross-sectional view schematically showing an example of the ground member of the present invention.
  • FIG. 17 is a schematic view schematically showing an example of the case where the ground member of the present invention is used for a shield printed wiring board.
  • FIG. 18 is a graph showing the results of a measurement test of changes in electrical resistance value due to heating and cooling.
  • FIG. 1 is a cross-sectional view schematically showing an example of the ground member of the present invention.
  • the ground member 1 includes a first main surface 11 and a second main surface 12 opposite to the first main surface 11 and includes an external connection member 10 having conductivity.
  • conductive protrusions 20 are formed on the first main surface 11.
  • a low melting point metal layer 21 is formed on the surface of the conductive protrusion 20.
  • the ground member 1 is used for a shield printed wiring board composed of a base film and a shield film.
  • FIG. 2 is a cross-sectional view schematically showing an example of a shield printed wiring board in which the ground member of the present invention is used.
  • the shield printed wiring board 50 includes a base film 60 and a shield film 70.
  • the base film 60 is a film in which a printed circuit 62 including a ground circuit 62 a and an insulating film 63 are sequentially provided on a base film 61.
  • the shield film 70 is a film including an adhesive layer 71, a shield layer 72 laminated on the adhesive layer 71, and an insulating layer 73 laminated on the shield layer 72.
  • the shield film 70 covers the base film 60 so that the adhesive layer 71 of the shield film 70 is in contact with the base film 60.
  • the adhesive layer 71 of the shield film 70 is a conductive adhesive layer.
  • FIGS. 3A and 3B are schematic views schematically showing an example in which the ground member of the present invention is used in a shield printed wiring board.
  • the ground member 1 is disposed by being pressed against the shield printed wiring board 50 so that the conductive protrusion 20 of the ground member 1 penetrates the insulating layer 73 of the shield film 70.
  • the ground member 1 is further pressed so that the conductive protrusion 20 of the ground member 1 penetrates the shield layer 72 of the shield film 70, and the conductive protrusion 20 and the shield film of the ground member 1 are pressed.
  • adhesive layers 71 may be brought into contact with each other. Further, as shown in FIG. 3B, the conductive protrusion 20 of the ground member 1 may be brought into contact with only the shield layer 72 of the shield film 70. Since the adhesive layer 71 is a conductive adhesive layer, the ground member is obtained by bringing the conductive protrusion 20 into contact with the adhesive layer 71 and the shield layer 72 or by bringing the conductive protrusion 20 into contact with the shield layer 72. 1 external connection member 10 and the ground circuit 62a of the base film 60 can be electrically connected. In addition, the external connection member 10 of the ground member 1 is connected to the external ground GND.
  • the ground member 1 is arranged on the shield printed wiring board 50 in this way, it is not necessary to previously provide a hole or the like in the insulating layer 73 of the shield film 70 of the shield printed wiring board 50, and the ground member 1 is arranged at an arbitrary position. be able to.
  • a low melting point metal layer 21 is formed on the surface of the conductive protrusion 20. Heating is also performed when the ground member 1 is arranged on the shield printed wiring board 50 or in the component mounting process after the arrangement. By this heating, the low melting point metal layer 21 is softened, and the adhesiveness between the conductive protrusion 20 of the ground member 1 and the shield layer 72 of the shield film 70 or the adhesive layer of the conductive protrusion 20 of the ground member 1 and the shield film 70. Adhesiveness with 71 can be improved.
  • the low melting point metal layer 21 may be softened in a process of mounting components on the shield printed wiring board after the conductive protrusions 20 of the ground member 1 are connected to the shield layer 72. For example, when solder is used to mount a component, a solder reflow process is performed. In this case, the low melting point metal layer 21 can be softened by heat during reflow.
  • the low melting point metal layer 21 is preferably formed of a metal having a melting point of 300 ° C. or lower.
  • the low melting point metal layer 21 is formed of a metal having a melting point of 300 ° C. or lower, the low melting point metal layer 21 is easily softened when the ground member 1 is disposed on the shield printed wiring board 50, and the ground member 1
  • the adhesion between the conductive protrusions 20 and the shield layer 72 and the adhesive layer 71 of the shield film 70 can be suitably improved.
  • the low melting point metal layer is formed of a metal having a melting point exceeding 300 ° C., the heating temperature when the ground member is arranged on the shield printed wiring board becomes high. Therefore, the ground member and the shield printed wiring board are easily damaged by heat.
  • the metal forming the low melting point metal layer 21 is not particularly limited, but desirably includes at least one selected from the group consisting of indium, tin, lead, and bismuth. These metals have a melting point and conductivity suitable for forming the low melting point metal layer 21.
  • the thickness of the low melting point metal layer 21 is preferably 0.1 to 50 ⁇ m.
  • the thickness of the low melting point metal layer is less than 0.1 ⁇ m, the amount of metal that forms the low melting point metal layer is small. Therefore, when the ground member is placed on the shield printed wiring board, the conductive protrusion of the ground member And the adhesiveness with the shield layer and adhesive bond layer of a shield film becomes difficult to improve.
  • the thickness of the low melting point metal layer exceeds 50 ⁇ m, the low melting point metal layer is thick, so that the conductive protrusion of the ground member becomes thick. Therefore, when arrange
  • the low melting point metal layer 21 preferably includes a flux.
  • the metal constituting the low melting point metal layer 21 is softened by including the flux in the low melting point metal layer 21, the metal constituting the low melting point metal layer 21, the conductive protrusion 20 of the ground member 1, and the shield
  • the shield layer 72 and the adhesive layer 71 of the film 70 are easily adhered. As a result, the adhesion between the conductive protrusion 20 of the ground member 1 and the shield layer 72 and the adhesive layer 71 of the shield film 70 can be further improved.
  • the external connection member 10 preferably includes at least one selected from the group consisting of copper, aluminum, silver, gold, nickel, chromium, titanium, zinc, and stainless steel. These materials are materials suitable for electrically connecting the ground member 1 and the external ground GND.
  • the low-melting-point metal layer 21 is made of tin or an alloy thereof
  • nickel is desirably present on the surface of the conductive protrusion 20. That is, it is desirable that the surface of the conductive protrusion 20 is covered with a nickel layer, and the low melting point metal layer 21 is provided thereon.
  • the low melting point metal layer 21 is made of tin or an alloy thereof
  • the low melting point metal layer 21 and the metal on the surface of the conductive protrusion 20 may form an alloy.
  • the presence of nickel on the surface of the conductive protrusion 20 can prevent the tin constituting the low melting point metal layer 21 from forming an alloy with the metal constituting the conductive protrusion 20.
  • tin constituting the low melting point metal layer 21 can efficiently form an alloy with the shield layer. Therefore, the amount of tin used for the low melting point metal layer 21 can be reduced.
  • ground member 1 it is desirable that a corrosion-resistant layer is formed on the second main surface 12.
  • the corrosion-resistant layer is formed on the second main surface 12 of the ground member 1, the ground member 1 can be prevented from corroding.
  • the corrosion-resistant layer contains at least one selected from the group consisting of nickel, gold, silver, platinum, palladium, rhodium, iridium, ruthenium, osmium, and alloys thereof. These materials are not susceptible to corrosion. Therefore, these materials are materials suitable for the corrosion-resistant layer of the ground member 1.
  • the conductive protrusion 20 may be columnar, and may be, for example, a cylinder, an elliptical column, a triangular column, a quadrangular column, a pentagonal column, a hexagonal column, an octagonal column, or the like.
  • the insulating member 73 can be easily penetrated when the ground member 1 is pressed against the insulating layer 73 of the shield film 70.
  • the area of the bottom surface of the conductive protrusion 20 is preferably 1.0 to 1.0 ⁇ 10 6 ⁇ m 2 .
  • the strength of the conductive protrusion becomes weak and the conductive protrusion is easily broken.
  • the electrical connection between the conductive protrusion and the external connection member is broken. Therefore, the electrical resistance between the ground circuit of the base film and the external ground tends to increase. In addition, it is technically difficult to form such thin conductive protrusions.
  • the conductive protrusion When the area of the bottom surface of the conductive protrusion exceeds 1.0 ⁇ 10 6 ⁇ m 2 , the conductive protrusion is too thick, so that it is difficult to penetrate the insulating layer of the shield film when the ground member is disposed on the shield printed wiring board. .
  • the pitch between the conductive protrusions is preferably 1 to 1000 ⁇ m. It is technically difficult to produce a ground member in which the pitch between the conductive protrusions is less than 1 ⁇ m.
  • the pitch between the conductive protrusions exceeds 1000 ⁇ m, the density of the conductive protrusions decreases, and the total contact area between the conductive protrusions and the shield layer or adhesive layer of the shield film decreases. Therefore, the electrical resistance between the ground circuit of the base film and the external ground tends to increase.
  • the method for producing a ground member of the present invention includes (1) a base preparation step, (2) a conductive protrusion forming step, and (3) a low melting point metal layer forming step.
  • 4 (a) to 4 (d) are process diagrams schematically showing an example of the manufacturing method of the ground member of the present invention in the order of processes.
  • a metal foil 2 that serves as a base of a ground member is prepared.
  • the metal foil 2 is desirably the metal described in the description of the material of the external connection member of the ground member.
  • the metal foil 2 is etched. It is desirable that the etching solution used for etching is appropriately selected according to the material of the metal foil. For example, when the metal foil is a copper foil, it is desirable to use an aqueous sodium persulfate solution, a mixed solution of hydrogen peroxide and sulfuric acid, an aqueous iron chloride solution, an aqueous copper chloride solution, or the like as the etching solution.
  • the external connection member 10 and the conductive protrusion 20 of the ground member 1 can be formed.
  • a low melting point metal layer 21 is formed on the surface of the conductive protrusion 20.
  • a method for forming the low melting point metal layer 21 is not particularly limited, but a plating method or the like can be employed.
  • electroless plating or electrolytic plating can be used.
  • the ground member 1 can be manufactured through the above steps.
  • the method for producing a shield printed wiring board according to the present invention includes a base film in which a printed circuit including a ground circuit and an insulating film are sequentially provided on a base film, a shield layer, and an insulating layer laminated on the shield layer. It is a manufacturing method of the shield printed wiring board provided with the shield film which has and the said ground member 1 arrange
  • FIG. 5 is a process chart schematically showing an example of a shield film placing process in the method for producing a shield printed wiring board of the present invention.
  • FIG. 6 is a process chart schematically showing an example of a ground member arranging process in the method for manufacturing a shield printed wiring board according to the present invention.
  • FIG. 7 is a process diagram schematically showing an example of a pressurizing process of the method for manufacturing a shield printed wiring board according to the present invention.
  • FIG. 8 is a process diagram schematically showing an example of a heating process of the method for manufacturing a shield printed wiring board of the present invention.
  • a base film 60 is prepared in which a printed circuit 62 including a ground circuit 62a and an insulating film 63 are sequentially provided on a base film 61.
  • a shield film 70 including an adhesive layer 71 which is a conductive adhesive layer, a shield layer 72 laminated on the adhesive layer 71, and an insulating layer 73 laminated on the shield layer 72 is also prepared.
  • the shield film 70 is mounted so that the adhesive bond layer 71 of the shield film 70 may contact
  • the materials of the base film 61 and the insulating film 63 constituting the base film 60 are not particularly limited, but are preferably made of engineering plastic.
  • engineering plastics include resins such as polyethylene terephthalate, polypropylene, crosslinked polyethylene, polyester, polybenzimidazole, polyimide, polyimide amide, polyether imide, and polyphenylene sulfide.
  • a polyphenylene sulfide film is desirable when flame retardancy is required, and a polyimide film is desirable when heat resistance is required.
  • the thickness of the base film 61 is desirably 10 to 40 ⁇ m
  • the thickness of the insulating film 63 is desirably 10 to 30 ⁇ m.
  • the insulating film 63 has a hole 63a for exposing a part of the printed circuit 62.
  • the method for forming the hole 63a is not particularly limited, and a conventional method such as laser processing can be employed.
  • the adhesive layer 71 of the shield film 70 is a conductive adhesive layer made of a resin and conductive fine particles.
  • the resin constituting the adhesive layer 71 is not particularly limited, but may be an acrylic resin, an epoxy resin, a silicon resin, a thermoplastic elastomer resin, a rubber resin, a polyester resin, a urethane resin, or the like. desirable.
  • the adhesive layer 71 contains tackifiers such as fatty acid hydrocarbon resins, C5 / C9 mixed resins, rosin, rosin derivatives, terpene resins, aromatic hydrocarbon resins, and heat-reactive resins. Also good. When these tackifiers are contained, the tackiness of the adhesive layer 71 can be improved.
  • electroconductive fine particles which comprise the adhesive bond layer 71
  • Copper powder, silver powder, nickel powder, silver coat copper powder (Ag coat Cu powder), gold coat copper powder, silver coat nickel powder (Ag coat Ni) Powder) and gold-coated nickel powder, and these metal powders can be produced by an atomizing method, a carbonyl method or the like.
  • particles obtained by coating a metal powder with a resin and particles obtained by coating a resin with a metal powder can also be used.
  • the conductive fine particles are preferably Ag-coated Cu powder or Ag-coated Ni powder. This is because conductive fine particles having stable conductivity can be obtained with an inexpensive material.
  • the shape of the conductive fine particles is not necessarily limited to a spherical shape, and may be, for example, a dendritic shape, a flake shape, a spike shape, a rod shape, a fiber shape, a needle shape, or the like.
  • a low melting point metal layer can be provided on the surface of the conductive fine particles. As the low melting point metal layer in this case, those described above can be used.
  • the adhesive layer 71 of the shield film 70 is a conductive adhesive layer
  • the conductive protrusion 20 of the ground member 1 penetrates the insulating layer 73 of the shield film 70, so that the conductive protrusion 20 of the ground member 1
  • the shield layer 72 and the adhesive layer 71 of the shield film 70 are in contact with each other, or the conductive protrusion 20 of the ground member 1 and the shield layer 72 of the shield film 70 are in contact with each other, and the external connection member 10 of the ground member 1 and the base film.
  • 60 ground circuits 62a can be electrically connected.
  • the adhesive layer 71 may be an anisotropic conductive adhesive layer or an isotropic conductive adhesive layer, but is more preferably an anisotropic conductive adhesive layer.
  • the conductive fine particles are preferably contained in the range of 3 to 39% by weight with respect to the total amount of the adhesive layer 71.
  • the average particle diameter of the conductive fine particles is desirably in the range of 2 to 20 ⁇ m, but it is desirable to select an optimum size according to the thickness of the anisotropic conductive adhesive layer.
  • the conductive fine particles may be included in the range of more than 39% by weight and 95% by weight or less with respect to the total amount of the adhesive layer 71. desirable.
  • the average particle diameter of the conductive fine particles can be selected in the same manner as in the anisotropic conductive adhesive layer.
  • the shield layer 72 of the shield film 70 may be made of any material as long as it exhibits a shielding effect that shields unwanted radiation from electrical signals and noises such as external electromagnetic waves.
  • the shield layer 72 may be made of isotropic conductive resin or metal.
  • the shield layer 72 may be a metal layer such as a metal foil or a vapor deposition film, or may be an aggregate of conductive particles formed in a layer shape.
  • the material constituting the metal is at least one selected from the group consisting of nickel, copper, silver, gold, palladium, aluminum, chromium, titanium, zinc, and alloys thereof. It is desirable to include seeds.
  • the shield layer 72 is an aggregate of conductive particles, the above-described conductive fine particles can be used. These materials have high conductivity and are suitable as a shield layer.
  • the thickness of the shield layer 72 of the shield film 70 is preferably 0.01 to 10 ⁇ m. If the thickness of the shield layer is less than 0.01 ⁇ m, it is difficult to obtain a sufficient shielding effect. When the thickness of the shield layer exceeds 10 ⁇ m, it becomes difficult to bend.
  • the material of the insulating layer 73 of the shield film 70 is not particularly limited, but is preferably an epoxy resin, a polyester resin, an acrylic resin, a phenol resin, a urethane resin, or the like.
  • the thickness of the insulating layer 73 of the shield film 70 is preferably 1 to 10 ⁇ m.
  • ground member placement step In this step, the ground member 1 is placed on the shield film 70 so that the conductive protrusions 20 of the ground member 1 face the insulating layer 73 side of the shield film 70 as shown in FIG. .
  • the conductive protrusion 20 of the ground member 1 is used in order to electrically connect the external connection member 10 of the ground member 1 to the ground circuit 62a of the base film 60. Pressurizes the ground member 1 so as to penetrate the insulating layer 73 of the shield film 70. Thereby, the conductive protrusion 20 of the ground member 1 comes into contact with the adhesive layer 71 and the shield layer 72 of the shield film 70.
  • the pressure at the time of pressurization is desirably 0.5 MPa to 10 MPa.
  • the conductive protrusion 20 of the ground member 1 may penetrate only the insulating layer 73 of the shield film 70, and the conductive protrusion 20 of the ground member 1 may be in contact with only the shield layer 72 of the shield film 70.
  • the low melting point metal layer 21 of the ground member 1 is heated to connect the low melting point metal layer 21 of the ground member 1 to the shield layer 72 of the shield film 70 as shown in FIG. And soften.
  • the temperature at which the low melting point metal layer 21 of the ground member 1 is softened is not particularly limited, but is preferably 100 to 300 ° C.
  • the heating step is performed at any stage as long as the low melting point metal layer of the conductive protrusion of the ground member can be softened and connected to the shield layer of the shield film. May be. For example, it may be performed simultaneously with the pressurizing step or may be performed as a single step. Manufacturing efficiency can be improved by performing a pressurization process and a heating process simultaneously.
  • a solder reflow process is performed.
  • the low melting point metal layer may be softened by heat during reflow in this reflow step. In this case, the heating process and the component mounting are performed simultaneously.
  • the shield printed wiring board 50 including the ground member 1 can be manufactured.
  • the shield printed wiring board 50 including the ground member 1 manufactured in this way is an example of the shield printed wiring board of the present invention.
  • a low melting point metal layer is provided between the adhesive layer and the shield layer and / or between the shield layer and the insulating layer. You may prepare the formed shield film. Furthermore, in the heating step, it is desirable to soften the low melting point metal layer of the shield film and connect it to the conductive protrusion of the ground member. By doing in this way, the adhesiveness of the electroconductive protrusion of a ground member and the shield layer of a shield film and the adhesiveness of the electroconductive protrusion of a ground member and the adhesive bond layer of a shield film can be improved.
  • the low melting point metal layer of the shield film is preferably formed of a metal having a melting point of 300 ° C. or lower.
  • the low melting point metal layer of the shield film is easily softened when the ground member is placed on the shield printed wiring board. Adhesiveness between the conductive protrusion of the member and the shield layer or adhesive layer of the shield film can be preferably improved.
  • the metal forming the low melting point metal layer of the shield film is not particularly limited, but it is desirable to include at least one selected from the group consisting of indium, tin, lead and bismuth. These metals have a suitable melting point and conductivity in forming a low melting point metal layer.
  • the thickness of the low melting point metal layer of the shield film is preferably 0.1 to 50 ⁇ m, and more preferably 0.1 to 10 ⁇ m.
  • the thickness of the low melting point metal layer is less than 0.1 ⁇ m, the amount of metal that forms the low melting point metal layer is small. Therefore, when the ground member is placed on the shield printed wiring board, the conductive protrusion of the ground member And the adhesiveness with the shield layer and conductive layer of a shield film becomes difficult to improve.
  • the thickness of the low melting point metal layer of the shield film exceeds 50 ⁇ m, the shield layer is easily deformed when the low melting point metal layer of the shield film is softened. As a result, the shield characteristics of the shield film are likely to deteriorate.
  • the low melting point metal layer of the shield film desirably contains a flux.
  • the metal constituting the low melting point metal layer of the shield film is softened by the fact that the low melting point metal layer of the shield film contains a flux, the metal constituting the low melting point metal layer of the shield film and the conductive protrusion of the ground member It becomes easy to adhere. As a result, the adhesion between the low melting point metal layer of the shield film and the conductive protrusion of the ground member can be further improved.
  • FIGS. 9A and 9B are diagrams schematically showing an example of a method for manufacturing a shield printed wiring board in which the ground member of the present invention is used.
  • FIG. 10 is a cross-sectional view schematically showing an example of a shield printed wiring board in which the ground member of the present invention is used.
  • the shield film 170 is placed on the base film 160.
  • the base film 160 is a film in which a printed circuit 162 including a ground circuit 162a and an insulating film 163 are sequentially provided on a base film 161.
  • the shield film 170 is a film including an adhesive layer 171, a shield layer 172 laminated on the adhesive layer 171, and an insulating layer 173 laminated on the shield layer 172.
  • the shield layer 172 includes a convex portion 172 a. And a wavy shape having a recess 172b. Note that the adhesive layer 171 of the shield film 170 may or may not have conductivity.
  • the shield printed wiring board 150 can be manufactured by pressing. During the pressing, the convex portion 172a of the shield layer 172 of the shield film 170 pushes the adhesive layer 171 and is connected to the ground circuit 162a of the base film 160.
  • the shield printed wiring board 150 includes a base film 160 and a shield film 170.
  • the base film 160 is a film in which a printed circuit 162 including a ground circuit 162a and an insulating film 163 are sequentially provided on a base film 161.
  • the shield film 170 is a film including an adhesive layer 171, a shield layer 172 laminated on the adhesive layer 171, and an insulating layer 173 laminated on the shield layer 172.
  • the shield layer 172 includes a convex portion 172 a. And a wavy shape having a recess 172b.
  • the shield film 170 covers the base film 160 so that the adhesive layer 171 of the shield film 170 is in contact with the base film 160. A part of the convex portion 172 a of the shield layer 172 is exposed from the adhesive layer 171 and is in contact with the ground circuit 162 a of the base film 160.
  • FIG. 11 is a schematic view schematically showing an example of the case where the ground member of the present invention is used for a shield printed wiring board.
  • the ground member 1 is arranged to be pressed against the shield printed wiring board 150 so that the conductive protrusion 20 of the ground member 1 penetrates the insulating layer 173 of the shield film 170. Then, the conductive protrusion 20 of the ground member 1 comes into contact with the shield layer 172 of the shield film 170.
  • the external connection member 10 of the ground member 1 and the ground circuit 162a of the base film 160 are electrically connected. Will be.
  • the external connection member 10 of the ground member 1 is connected to the external ground GND.
  • the ground member 1 is arranged on the shield printed wiring board 150 in this way, it is not necessary to previously provide a hole or the like in the insulating layer 173 of the shield film 170 of the shield printed wiring board 150, and the ground member 1 is arranged at an arbitrary position. be able to.
  • a low melting point metal layer 21 is formed on the surface of the conductive protrusion 20. Heating is also performed when the ground member 1 is arranged on the shield printed wiring board 150 or in the component mounting process after the arrangement. By this heating, the low melting point metal layer 21 is softened, and the adhesion between the conductive protrusion 20 of the ground member 1 and the shield layer 172 of the shield film 170 can be improved. Therefore, even if the component is mounted by repeatedly heating and cooling the shield printed wiring board 150 using the ground member 1, the conductive projection 20 of the ground member 1 and the shield layer 172 of the shield film 170 are interposed between them. Deviation is unlikely to occur. As a result, an increase in electrical resistance between the ground circuit 162a of the base film 160 and the external ground GND can be suppressed.
  • a desirable base film 160 is the same as the base film 60 described in the description of the shield printed wiring board 50.
  • shield printed wiring board 150 desirable materials of the shield layer 172 and the insulating layer 173 constituting the shield film 170 are the same as the shield layer 72 and the insulating layer 73 of the shield film 70 described in the description of the shield printed wiring board 50. is there.
  • a desirable material for the adhesive layer 171 of the shield film 170 constituting the shield film 170 is not particularly limited, but acrylic resin, epoxy resin, silicon resin, thermoplastic elastomer resin, rubber It is desirable that the resin is a polyester resin, polyester resin, urethane resin, or the like.
  • the adhesive layer 171 contains tackifiers such as fatty acid hydrocarbon resins, C5 / C9 mixed resins, rosin, rosin derivatives, terpene resins, aromatic hydrocarbon resins, and heat-reactive resins. Also good. When these tackifiers are included, the tackiness of the adhesive layer 171 can be improved.
  • the low melting point metal layer of the shield film 170 is formed between the shield layer 172 and the insulating layer 173, and the low melting point metal layer of the shield film 170 is
  • the conductive protrusion 20 of the ground member 1 may be connected. With such a configuration, the adhesion between the conductive protrusion 20 of the ground member 1 and the shield layer 172 of the shield film 170 can be improved.
  • FIG. 12 is a cross-sectional view schematically showing an example of a shield printed wiring board in which the ground member of the present invention is used.
  • the shield printed wiring board 250 includes a base film 260 and a shield film 270.
  • the base film 260 is a film in which a printed circuit 262 including a ground circuit 262a and an insulating film 263 are sequentially provided on a base film 261.
  • the shield film 270 is a film including an adhesive layer 271, a shield layer 272 stacked on the adhesive layer 271, and an insulating layer 273 stacked on the shield layer 272.
  • the shield film 270 covers the base film 260 so that the adhesive layer 271 of the shield film 270 is in contact with the base film 260. Further, the adhesive layer 271 of the shield film 270 does not have conductivity, and the printed circuit 262 and the shield layer 272 are not electrically connected.
  • FIG. 13 is a schematic view schematically showing an example of the case where the ground member of the present invention is used for a shield printed wiring board.
  • the ground member 1 is pressed against the shield printed wiring board 250 so that the conductive protrusion 20 of the ground member 1 penetrates the insulating layer 273 of the shield film 270 and is connected to the shield layer 272. Will be placed.
  • the conductive protrusion 20 of the ground member 1 and the shield layer 272 of the shield film 270 come into contact with each other. Therefore, the external connection member 10 of the ground member 1 and the shield layer 272 of the shield film 270 can be electrically connected.
  • the external connection member 10 of the ground member 1 is connected to the external ground GND.
  • the shield layer 272 of the shield film 270 is electrically connected to the external ground GND, so that the shield layer 272 is suitable as an electromagnetic wave shield that shields electromagnetic waves. Act on.
  • the ground member 1 is arranged on the shield printed wiring board 250 in this way, it is not necessary to previously provide a hole or the like in the insulating layer 273 of the shield film 270 of the shield printed wiring board 250, and the ground member 1 is arranged at an arbitrary position. be able to.
  • a low melting point metal layer 21 is formed on the surface of the conductive protrusion 20. Heating is also performed when the ground member 1 is arranged on the shield printed wiring board 250 or in the component mounting process after the arrangement. By this heating, the low melting point metal layer 21 is softened, and the adhesion between the conductive protrusion 20 of the ground member 1 and the shield layer 272 of the shield film 270 can be improved. Therefore, even if the component is mounted by repeatedly heating and cooling the shield printed wiring board 250 using the ground member 1, it is between the conductive protrusion 20 of the ground member 1 and the shield layer 272 of the shield film 270. Deviation is unlikely to occur.
  • the adhesive layer 271 does not contain conductive fine particles, the raw material cost of the adhesive layer 271 can be reduced, and the adhesive layer 271 can be thinned.
  • a desirable base film 260 is the same as the base film 60 described in the description of the shield printed wiring board 50.
  • shield printed wiring board 250 desirable materials for the shield layer 272 and the insulating layer 273 constituting the shield film 270 are the same as the shield layer 72 and the insulating layer 73 of the shield film 70 described in the description of the shield printed wiring board 50. is there.
  • a desirable material for the adhesive layer 271 of the shield film 270 constituting the shield film 270 is not particularly limited, but acrylic resin, epoxy resin, silicon resin, thermoplastic elastomer resin, rubber It is desirable that the resin is a polyester resin, a polyester resin, a urethane resin, or the like.
  • the adhesive layer 271 contains tackifiers such as fatty acid hydrocarbon resins, C5 / C9 mixed resins, rosin, rosin derivatives, terpene resins, aromatic hydrocarbon resins, and heat-reactive resins. Also good. When these tackifiers are contained, the tackiness of the adhesive layer 271 can be improved.
  • the low melting point metal layer of the shield film 270 is formed between the shield layer 272 and the insulating layer 273, and the low melting point metal layer of the shield film 270 is The conductive protrusion 20 of the ground member 1 may be connected. With such a configuration, the adhesion between the conductive protrusion 20 of the ground member 1 and the shield layer 272 of the shield film 270 can be improved.
  • FIG. 14 is a cross-sectional view schematically showing an example of a shield printed wiring board in which the ground member of the present invention is used.
  • the shield printed wiring board 350 includes a base film 360 and a shield film 370.
  • the base film 360 is a film in which a printed circuit 362 including a ground circuit 362a and an insulating film 363 are sequentially provided on a base film 361.
  • the shield film 370 is a film including a shield layer 372 and an insulating layer 373 stacked on the shield layer 372.
  • the shield film 370 covers the base film 360 so that the shield layer 372 of the shield film 370 is in contact with the base film 360.
  • the shield layer 372 of the shield film 370 is a conductive adhesive layer.
  • FIG. 15 is a schematic view schematically showing an example in which the ground member of the present invention is used for a shield printed wiring board.
  • the ground member 1 is arranged to be pressed against the shield printed wiring board 350 so that the conductive protrusion 20 of the ground member 1 penetrates the insulating layer 373 of the shield film 370. Then, the conductive protrusion 20 of the ground member 1 comes into contact with the shield layer 372 of the shield film 370.
  • the external connection member 10 of the ground member 1 and the ground circuit 362a of the base film 360 are electrically connected. Will be.
  • the external connection member 10 of the ground member 1 is connected to the external ground GND.
  • the ground member 1 is arranged on the shield printed wiring board 350 in this way, it is not necessary to previously provide a hole or the like in the insulating layer 373 of the shield film 370 of the shield printed wiring board 350, and the ground member 1 is arranged at an arbitrary position. be able to.
  • a low melting point metal layer 21 is formed on the surface of the conductive protrusion 20. Heating is also performed when the ground member 1 is arranged on the shield printed wiring board 350 or in the component mounting process after the arrangement. By this heating, the low melting point metal layer 21 is softened, and the adhesion between the conductive protrusion 20 of the ground member 1 and the shield layer 372 of the shield film 370 can be improved. Therefore, even if a component is mounted on the shield printed wiring board 350 using the ground member 1 by repeatedly heating and cooling, it is between the conductive protrusion 20 of the ground member 1 and the shield layer 372 of the shield film 370. Deviation is unlikely to occur. As a result, an increase in electrical resistance between the ground circuit 362a of the base film 360 and the external ground GND can be suppressed.
  • the shield layer 372 of the shield film 370 is a conductive adhesive layer. Therefore, the shield layer 372 of the shield film 370 has a function for adhering the shield film 370 to the base film 360 and electromagnetic waves. You will have both the ability to shield. Therefore, the shield film 370 can be easily adhered to the base film 360 without using an adhesive or the like to adhere to the base film 360.
  • a desirable base film 360 is the same as the base film 60 described in the description of the shield printed wiring board 50.
  • the desirable material of the insulating layer 373 constituting the shield film 370 is the same as the insulating layer 73 of the shield film 70 described in the description of the shield printed wiring board 50.
  • the shield layer 372 of the shield film 370 is a conductive adhesive layer made of resin and conductive fine particles.
  • the resin constituting the shield layer 372 is not particularly limited, but is preferably an acrylic resin, an epoxy resin, a silicon resin, a thermoplastic elastomer resin, a rubber resin, a polyester resin, a urethane resin, or the like.
  • the shield layer 372 may contain tackifiers such as fatty acid hydrocarbon resins, C5 / C9 mixed resins, rosin, rosin derivatives, terpene resins, aromatic hydrocarbon resins, and heat-reactive resins. Good. When these tackifiers are included, the tackiness of the shield layer 372 can be improved.
  • electroconductive fine particles which comprise the shield layer 372
  • Copper powder, silver powder, nickel powder, silver coat copper powder (Ag coat Cu powder), gold coat copper powder, silver coat nickel powder (Ag coat Ni powder) ), Gold-coated nickel powder, and these metal powders can be produced by an atomizing method, a carbonyl method, or the like.
  • particles obtained by coating a metal powder with a resin and particles obtained by coating a resin with a metal powder can also be used.
  • the conductive fine particles are preferably Ag-coated Cu powder or Ag-coated Ni powder. This is because conductive fine particles having stable conductivity can be obtained with an inexpensive material.
  • the shape of the conductive fine particles is not necessarily limited to a spherical shape, and may be, for example, a dendritic shape, a flake shape, a spike shape, a rod shape, a fiber shape, a needle shape, or the like.
  • the shield layer 372 of the shield film 370 is desirably an isotropic conductive adhesive layer.
  • the conductive fine particles are contained in the range of more than 39% by weight and 95% by weight or less with respect to the total amount of the shield layer.
  • the average particle diameter of the conductive fine particles is desirably 2 to 20 ⁇ m.
  • a low melting point metal layer of the shield film 370 may be formed between the shield layer 372 and the insulating layer 373.
  • the layer may be connected to the conductive protrusion 20 of the ground member 1.
  • the shield printed wiring board 150 using the ground member 1, the shield printed wiring board 250 using the ground member 1, and the shield printed wiring board 350 using the ground member 1 described above are described in the present invention. This is an example of the shield printed wiring board.
  • the shield printed wiring board 150 using the ground member 1, the shield printed wiring board 250 using the ground member 1, or the shield printed wiring board 350 using the ground member 1 is the same as the ground member 1.
  • the shield film 270, or the shield film 370 instead of the shield film 70 in the “(1) shield film placement step” of the method of manufacturing the shield printed wiring board 50 used. Can be manufactured.
  • FIG. 16 is a cross-sectional view schematically showing an example of the ground member of the present invention.
  • the ground member 101 includes a first main surface 111 and a second main surface 112 opposite to the first main surface 111, and includes a conductive external connection member 110.
  • the external connection member 110 is bent a plurality of times so that the first main surface 111 side protrudes, and a part of the protruded external connection member 110 is a conductive protrusion 120.
  • a low melting point metal layer 121 is formed on the surface of the conductive protrusion 120, that is, on the first main surface 111 of the external connection member 110.
  • the ground member 101 having such a shape can be easily manufactured simply by bending the external connection member 110.
  • FIG. 17 is a schematic view schematically showing an example of the case where the ground member of the present invention is used for a shield printed wiring board.
  • the ground member 101 is disposed by being pressed against the shield printed wiring board 50 so that the conductive protrusion 120 of the ground member 101 penetrates the insulating layer 73 and the shield layer 72 of the shield film 70. become. Then, the conductive protrusion 120 of the ground member 101 comes into contact with the adhesive layer 71 and the shield layer 72 of the shield film 70.
  • the adhesive layer 71 of the shield film 70 is in contact with the ground circuit 62a of the base film 60, the external connection member 110 of the ground member 101 and the ground circuit 62a of the base film 60 are electrically connected. Will be connected. Further, the external connection member 110 of the ground member 101 is connected to the external ground GND.
  • Example 1-1 Metal foil preparation process First, a copper foil having a thickness of 35 ⁇ m was prepared.
  • Example 1-2 to (Example 1-36) and (Comparative Example 1-1) to (Comparative Example 1-15) Except that the diameter of the bottom surface of the conductive protrusion, the width of the pitch between the conductive protrusions, and the size of the ground member after cutting were changed as shown in Tables 1 and 2, the same procedure as in Example 1-1 was performed.
  • the ground members of Example 1-2 to Example 1-36 and Comparative Example 1-1 to Comparative Example 1-15 were manufactured.
  • Example 1 except that the Sn plating layer was not provided and the diameter of the bottom surface of the conductive protrusions, the width of the pitch between the conductive protrusions, and the size of the ground member after cutting were changed as shown in Table 2.
  • the ground members of Comparative Example 1-1 to Comparative Example 1-15 were manufactured in the same manner as -1.
  • Example 2-1 Using the ground member of Example 1-1, a shield printed wiring board according to Example 2-1 was manufactured by the method described below.
  • a base film was prepared by sequentially providing a printed circuit including a ground circuit and an insulating film on a base film.
  • the base film was made of polyimide
  • the ground circuit and the printed circuit were made of copper
  • the insulating film was made of polyimide. Note that a hole for exposing a part of the printed circuit was formed in the insulating film.
  • the shield film in which the anisotropic conductive adhesive layer, the shield layer, and the insulating layer were laminated in order was prepared.
  • the anisotropic conductive adhesive layer had a thickness of 9 ⁇ m.
  • the shield layer was made of copper and had a thickness of 2 ⁇ m.
  • the insulating layer was made of an epoxy resin and had a thickness of 6 ⁇ m.
  • the shield film was placed so that the anisotropic conductive adhesive layer was in contact with the base film.
  • the ground member, the shield film, and the wiring board were put into a heating process (reflow process) in which heating was performed at 260 ° C. for 5 seconds.
  • a heating process reflow process
  • the low melting point metal layer formed on the surface of the conductive protrusion of the ground member according to Example 1-1 is softened, and the conductive protrusion of the ground member and the shield film are formed by the low melting point metal layer.
  • the anisotropic conductive adhesive layer and the shield layer were connected.
  • Example 2-2 Example 2-2 was performed in the same manner as Example 2-1 except that the ground member of Example 1-2 to Example 1-36 and Comparative Example 1-1 to Comparative Example 1-15 was used as the ground member.
  • -Shield printed wiring boards according to Example 2-36 and Comparative Examples 2-1 to 2-15 were manufactured.
  • FIG. 18 is a graph showing the results of a measurement test of changes in electrical resistance value due to heating and cooling.
  • Table 3 shows the average value and standard deviation of the measured electrical resistance values.
  • the shield printed wiring boards according to Example 2-1 to Example 2-36 are less likely to change in electric resistance value even after repeated heating and cooling after the initial heating. It was shown that the electrical resistance value was stabilized by repeated heating and cooling.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

La présente invention vise à fournir un élément de masse pouvant être positionné selon les besoins, et qui, lors d'un recours à un chauffage et à un refroidissement répété dans le but de monter des composants sur une carte de circuit imprimé blindée à l'aide de l'élément de masse, présente moins de risques d'écarts apparaissant entre des saillies conductrices de l'élément de masse et une couche de blindage d'un film de blindage. Ledit élément de masse comprend un élément de connexion externe pourvu de première et seconde surfaces principales opposées entre elles, et qui est conducteur. La première surface principale de l'élément de masse comporte des saillies conductrices, et l'élément de masse est caractérisé en ce qu'une couche d'un métal ayant un point de fusion bas est formée sur la surface des saillies conductrices.
PCT/JP2018/004654 2017-02-13 2018-02-09 Élément de masse, carte de circuit imprimé blindée et procédé de fabrication de ladite carte WO2018147423A1 (fr)

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JPWO2020189686A1 (fr) * 2019-03-19 2020-09-24
JP7001187B1 (ja) 2021-03-19 2022-01-19 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびその製造方法、シールド性配線基板、並びに電子機器
JP2022145436A (ja) * 2021-03-19 2022-10-04 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびその製造方法、シールド性配線基板、並びに電子機器

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CN110461086B (zh) * 2019-08-30 2021-01-08 维沃移动通信有限公司 一种电路板、电路板制作方法及终端
TW202214050A (zh) 2020-09-18 2022-04-01 日商拓自達電線股份有限公司 附接地構件之屏蔽印刷配線板及接地構件

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JP2022145436A (ja) * 2021-03-19 2022-10-04 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびその製造方法、シールド性配線基板、並びに電子機器
JP2022145270A (ja) * 2021-03-19 2022-10-03 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびその製造方法、シールド性配線基板、並びに電子機器
KR102683110B1 (ko) * 2021-03-19 2024-07-10 아티엔스 가부시키가이샤 전자파 쉴드 시트 및 그 제조 방법, 쉴드성 배선 기판, 그리고 전자 기기
WO2022196402A1 (fr) * 2021-03-19 2022-09-22 東洋インキＳｃホールディングス株式会社 Feuille de blindage contre les ondes électromagnétiques, son procédé de fabrication, carte de câblage de blindage, et dispositif électronique

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