WO2013179836A1 - 発熱装置 - Google Patents
発熱装置 Download PDFInfo
- Publication number
- WO2013179836A1 WO2013179836A1 PCT/JP2013/062436 JP2013062436W WO2013179836A1 WO 2013179836 A1 WO2013179836 A1 WO 2013179836A1 JP 2013062436 W JP2013062436 W JP 2013062436W WO 2013179836 A1 WO2013179836 A1 WO 2013179836A1
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- WIPO (PCT)
- Prior art keywords
- back surface
- heat generating
- insulating base
- heat
- heating
- Prior art date
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 60
- 239000000463 material Substances 0.000 claims abstract description 20
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 7
- 239000002344 surface layer Substances 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 6
- 239000004697 Polyetherimide Substances 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 229920002530 polyetherether ketone Polymers 0.000 description 6
- 229920001601 polyetherimide Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000002923 metal particle Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910018100 Ni-Sn Inorganic materials 0.000 description 2
- 229910018532 Ni—Sn Inorganic materials 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/267—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an organic material, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/009—Heaters using conductive material in contact with opposing surfaces of the resistive element or resistive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/022—Heaters specially adapted for heating gaseous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
Definitions
- the present invention relates to a heat generating device provided with a heat generating resistor that generates heat when energized.
- Japanese Patent Application Laid-Open No. 9-63755 proposes a heat generating device in which a plurality of wire-like heat generating resistors are provided between two rubber sheets. Such a heat generating device generates heat when a heat generating resistor is energized, and one surface of the rubber sheet is heated to an arbitrary temperature and used.
- the heat generating resistors are constituted by wires, and they are connected in one. That is, the heat generating parts are continuously arranged, and the heat mass (heat capacity) becomes large.
- the heat generating device is used, for example, as a heating device which is disposed on the lower surface of the steering column in the vehicle compartment and heats the vicinity of the feet of the occupant by radiant heat.
- the limbs of the occupant may come into contact with the heat generating device, and if the heat mass of the heat generating resistor is large, a large amount of heat may be applied to the occupant from the contact location, and the occupant may burn.
- An object of the present invention is to provide a heat generating device capable of suppressing the application of a large amount of heat from the contact point as much as possible even when contacting the heat generating device.
- the invention according to claim 1 comprises a thermoplastic resin, has a surface (10a) and a back surface (10b) opposite to the surface, and has a plurality of penetrations in the thickness direction. And a heat generating resistor (40) disposed in each of the plurality of via holes, the heat generating resistor (40) generating heat when energized, and at least one of the heat generating resistors is provided. It is characterized in that two or more are connected in parallel.
- the heat mass of each heating resistor can be reduced.
- the plurality of heat generating resistors are disposed apart from each other on the insulating base material containing a thermoplastic resin, the insulating base material prevents the movement of heat in the planar direction. Therefore, when a person's limbs come into contact with the heat generating device, it is possible to minimize the application of a large amount of heat from the contact point.
- FIG. 3 is a cross-sectional view taken along the line III-III in FIGS. 1 and 2; 4 (a) to 4 (f) are cross-sectional views showing manufacturing steps of the heat generating device shown in FIG.
- FIG. A) is a schematic diagram which shows the calorie
- FIG. 8 is a cross-sectional view taken along the line VIII-VIII in FIG. 7;
- FIG. 8 is a cross-sectional view taken along the line IX-IX in FIG. 7;
- FIGS. 1 to 3 in the heat generating device 1 of the present embodiment, the insulating base 10, the surface protecting member 20, and the back surface protecting member 30 are integrated, and the heat generating resistor is built in the integrated unit. 40 are arranged and configured.
- FIG. 1 the surface protection member 20 is omitted for easy understanding.
- FIG. 2 is shown with the back surface protection member 30 omitted for the sake of easy understanding.
- FIG. 1 and FIG. 2 are not sectional drawing, the heating resistor 40 is hatched.
- the insulating base material 10 is formed of a flat rectangular thermoplastic resin film configured to include polyetheretherketone (PEEK) or polyetherimide (PEI). A plurality of via holes 11 penetrating in the thickness direction are formed in the insulating base 10.
- the via hole 11 is in a cylindrical shape having a constant diameter from the front surface 10a to the back surface 10b, the via hole 11 may be tapered in which the diameter decreases from the front surface 10a to the back surface 10b. And may be in the shape of a square tube.
- each via hole 11 one heating resistor 40 is disposed.
- the insulating base 10 occupies between the heating resistors 40, and all the heating resistors 40 are separated by the insulating base 10.
- the heating resistor 40 is formed by sintering a conductive paste containing metal particles such as Ni-Sn.
- a surface protection member 20 made of a flat rectangular thermoplastic resin film containing polyetheretherketone (PEEK) or polyetherimide (PEI) is disposed on the surface 10a of the insulating base material 10.
- the surface protecting member 20 has the same size as the insulating base 10 in plan view, and a plurality of patterned surface layers 21 are formed on the side of the surface 20 a facing the insulating base 10. Each of the surface layers 21 electrically connects two adjacent heating resistors 40.
- a flat rectangular back surface protection member 30 made of a thermoplastic resin film containing polyetheretherketone (PEEK) or polyetherimide (PEI) is disposed on the back surface 10b of the insulating base material 10.
- the back surface protection member 30 has the same size in plan view as the insulating base material 10, and a plurality of patterned back surface layers 31 are formed on the one surface 30a side facing the insulating base material 10.
- Each back surface layer 31 is electrically connected to two heating resistors 40 respectively connected to different ones of two adjacent surface layers 21.
- a plurality of heating resistor groups 42 in which a plurality of heating resistors 40 are connected in series via the surface layer 21 and the back surface layer 31 are configured.
- twelve heating resistor groups 42 in which fourteen heating resistors 40 are connected in series are formed.
- the heating resistor 40 located at the end of the heating resistor group 42 is not connected to the back surface layer 31.
- the back surface protection member 30 includes a first feeding portion 91 connected to the heating resistor 40 located at one end of each heating resistor group 42, and a heating resistor located at the other end of each heating resistor group 42. 40 and a second power supply unit 92 connected thereto are formed.
- the heating resistor groups 42 are connected in parallel via the first and second power feeding units 91 and 92.
- the back surface protection member 30 is electrically connected to the first and second power feeding portions 91 and 92, and of the back surface protection member 30 on the opposite side to the insulating base 10 side.
- An interlayer connection member exposed from one side is formed.
- the first and second power feeding units 91 and 92 can be electrically connected to the outside by the interlayer connection member.
- FIGS. 4 (a) to 4 (f) are cross-sectional views taken along the line III-III in FIG.
- the insulating base 10 is prepared, and the plurality of via holes 11 are formed by a drill or the like.
- each via hole 11 is filled with a conductive paste 41.
- a conductive paste 41 a paste obtained by adding an organic solvent such as paraffin to a Ni—Sn-based metal particle is used.
- the insulating base 10 is disposed on a holding table (not shown) via the suction paper 60 so that the back surface 10 b faces the suction paper 60.
- the adsorbing paper 60 may be made of any material that can absorb the organic solvent of the conductive paste 41, and general high quality paper or the like is used.
- the conductive paste 41 is filled in the via hole 11 while melting the conductive paste 41.
- the organic solvent of the conductive paste 41 is adsorbed to the adsorbing paper 60, and the metal particles are disposed in close contact with the via holes 11.
- the insulating base 10 filled with the conductive paste 41 is prepared.
- one surface 20a, 30a of the surface protection member 20 and the back surface protection member 30 facing the insulating base 10 Form copper foil etc. Then, the copper foil is appropriately patterned to prepare the back surface protection member 20 on which the front surface layer 21 is formed, the back surface layer 31 and the back surface protection member 30 on which the first and second power feeding portions 91 and 92 are formed.
- the back surface protection member 30, the insulating base 10, and the surface protection member 20 are sequentially laminated to form a laminate 70.
- the surface protection member 20 is disposed on the surface 10 a side of the insulating base material 10 in a state where each conductive paste 41 is in contact with the predetermined surface layer 21.
- the back surface protection member 30 is disposed on the back surface 10 b side of the insulating base material 10 in a state where each conductive paste 41 is in contact with the predetermined back surface layer 31 or the first and second power feeding portions 91 and 92.
- the laminate 70 is disposed between a pair of press plates (not shown), and pressure is applied while heating in vacuum from both upper and lower sides in the laminating direction to integrate the laminate 70.
- the conductive paste 41 is sintered to form the heating resistor 40. Thereby, the heat generating device 1 is manufactured.
- such a heat generating device 1 is disposed along the outside of an instrument panel 80 which constitutes a vehicle instrument panel etc. at the foremost part of a vehicle compartment, more specifically along the lower surface of the steering column. It is used as an immediate heating system around the feet of the occupant.
- the vehicle is usually equipped with a heating device for heating the vehicle interior using the engine cooling water as a heat source, when the engine is started, etc., a sufficient heat source for heating the vehicle interior can be obtained from the engine cooling water. It is difficult to warm up the passenger compartment. For this reason, by operating the heat generating device 1, it is possible to heat the area around the feet of the occupant immediately.
- the heating device 1 may be bent along the lower surface of the steering column. it can.
- the heat generating device 1 may be provided, for example, on the lower side (lower side than the window glass) of the door body portion among the left and right doors of the vehicle.
- the plurality of heating resistor groups 42 are connected in parallel by the first and second power feeding units 91 and 92.
- at least two of the heat generating resistors 40 are connected in parallel.
- the heat mass of one heating resistor group 42 (heating resistor 40) can be reduced, and when the heating device 1 is used as shown in FIG. The application of heat can be minimized, and burns of the occupant can be minimized.
- the plurality of heat generating resistors 40 are disposed apart from each other on the insulating base 10.
- the insulating base 10 is disposed between the heating resistors 40. For this reason, it can suppress that heat moves to a plane direction (plane direction of insulating substrate 10) by insulating substrate 10. Therefore, when the heat generating device 1 is used as shown in FIG. 5, the heat of the heat generating resistor 40 which is not located in the vicinity of the contact point can be minimized also transmitted to the heat generating resistor 40 in the vicinity of the contact point. It is possible to further suppress the problem.
- the case where a human finger comes in contact with the heating device 1 will be examined.
- the heat generating resistors J40 as shown in FIG. 6A are connected in one (for example, in the form of a wire)
- the heat mass of the heat generating resistor J40 is large.
- the heat generating resistors J40 are connected in one, heat easily moves in the heat generating resistors J40. For this reason, for example, when a finger of a person comes in contact with the surface protection member J20, a large amount of heat may be applied from the contact point to cause burns.
- the heating resistor group 42 is connected in parallel, and the heat mass of each heating resistor group 42 is reduced. Further, the insulating base 10 is disposed between the heat generating resistors 40, and the movement of heat in the surface direction of the insulating base 10 is suppressed. For this reason, even if a human finger contacts the surface protection member J20, the application of a large amount of heat from the contact point can be suppressed as much as possible, and burns can be suppressed as much as possible.
- the temperature of one surface of the surface protection member 20 opposite to the side of the insulating base 10 is set to a temperature sufficient to warm the vicinity of the foot of the occupant. Even if the occupant's limbs come into contact with the heat-producing device 1 while being maintained, burns can be minimized.
- the heating device 1 is configured such that the heating resistor 40 is disposed in each of the plurality of via holes 11. Therefore, the temperature distribution in the plane can be easily adjusted by appropriately changing the place where the via hole 11 is formed, the size of the via hole 11, the distribution density of the via hole 11, and the like.
- the heat generating device 1 of the present embodiment is the same as the first embodiment except that all the heat generating resistors 40 are connected in parallel with respect to the first embodiment, and the other parts are the same as the first embodiment. .
- one surface layer 21 is formed on the side of the surface 20a facing the insulating base material 10.
- the surface layer 21 is electrically connected to all the heating resistors 40. That is, each heating resistor 40 is electrically connected to the same surface layer 21.
- the surface protection member 20 is omitted for easy understanding, and although not a cross-sectional view, each heating resistor 40 is hatched. Further, although not particularly illustrated, the surface protection member 20 is an interlayer connection member electrically connected to the surface layer 21 and exposed from one surface of the surface protection member 20 opposite to the insulating base 10 side. Is formed. The surface layer 21 can be electrically connected to the outside by the interlayer connection member.
- the back surface layers 31 of the same number as the heating resistors 40 are formed on the one surface 30 a side facing the insulating base material 10.
- Each back surface layer 31 is electrically connected to one heat generating resistor 40. That is, the heating device 1 is configured such that all the heating resistors 40 are connected in parallel to the surface layer 21.
- the back surface protection member 30 is electrically connected to the respective back surface layers 31 and is an interlayer connection which is exposed from one surface of the back surface protection member 30 opposite to the insulating base 10 side. A member is formed. Each back surface layer 31 can be electrically connected to the outside by this interlayer connection member.
- the heat generating resistors 40 are connected in parallel to the surface layer 21, and the same effect as that of the first embodiment can be obtained.
- the heat generating device 1 of the present embodiment can selectively generate heat from the heat generating resistor 40. For this reason, for example, it is possible to use as what changes to Braille by making the heating resistor 40 generate heat so that a desired character, a number, a symbol, etc. can be recognized. And, when using the heat-generating device 1 in this way, a human hand or the like comes into contact with the heat-generating device 1, but as described above, it is possible to minimize the application of a large amount of heat from the contact location. It is possible to minimize burns while maintaining a recognizable surface temperature.
- the back surface protection member 30 having the back surface layer 31 and the first and second power feeding portions 91 and 92 formed is prepared, and the back surface protection member 30, the insulating base 10, and the surface protection member 20 are prepared.
- the heat generating device 1 may be configured using a back surface layer 31 and the first and second power feeding portions 91 and 92 formed on the back surface 10 b of the insulating base material 10. In this case, when the process of FIG. 4A is performed, the bottomed via hole 11 having the bottom surface layer 31 or the first and second power feeding portions 91 and 92 as the bottom is formed, and the process of FIG.
- the conductive paste 41 may be filled in each via hole 11 without using the suction paper 60.
- the heating device 1 may be configured using one in which the back surface layer 31 is formed on the back surface 10 b of the insulating base material 10.
- the back surface protection member 30, the back surface layer 31, the first and second power feeding portions 91 and 92, the insulating base material 10, the surface layer 21, and the surface protection member 20 are sequentially laminated and integrated. It is also good. That is, the surface protection member 20 and the surface layer 21, the back surface protection member 30, the back surface layer 31, and the first and second power feeding portions 91 and 92 may be separate members until the laminate 70 is integrated. Similarly, in the second embodiment, the surface protection member 20 and the surface layer 21, and the back surface protection member 30 and the back surface layer 31 may be separate members until the laminate 70 is integrated.
- only one back surface layer 31 is formed on the one surface 30 a side of the back surface protection member 30 facing the insulating base material 10, and the back surface layer 31 and each heating resistor 40 are formed. It may be electrically connected.
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Abstract
Description
本発明の第1実施形態について図面を参照しつつ説明する。図1~図3に示されるように、本実施形態の発熱装置1は、絶縁基材10、表面保護部材20、裏面保護部材30が一体化され、この一体化されたものの内部に発熱抵抗体40が配置されて構成されている。
本発明の第2実施形態の発熱装置1について説明する。本実施形態の発熱装置1は、第1実施形態に対して、全発熱抵抗体40を並列に接続したものであり、その他に関しては第1実施形態と同様であるため、ここでは説明を省略する。
上記第1実施形態では、裏面保護部材30に裏面層31および第1、第2給電部91、92が形成されたものを用意し、裏面保護部材30、絶縁基材10、表面保護部材20を積層して一体化するものについて説明したが、例えば、次のようにしてもよい。すなわち、絶縁基材10の裏面10bに裏面層31および第1、第2給電部91、92が形成されているものを用いて発熱装置1を構成してもよい。この場合は、図4(a)の工程を行う際、裏面層31または第1、第2給電部91、92を底面とする有底のビアホール11を形成し、図4(b)の工程を行う際、吸着紙60を用いずに導電性ペースト41を各ビアホール11に充填すればよい。同様に、上記第2実施形態において、絶縁基材10の裏面10bに裏面層31が形成されているものを用いて発熱装置1を構成してもよい。
Claims (3)
- 熱可塑性樹脂を含んで構成され、表面(10a)および前記表面と反対側の裏面(10b)を有し、厚さ方向に貫通する複数のビアホール(11)が形成された絶縁基材(10)と、
前記複数のビアホールのそれぞれに配置され、通電されることにより発熱する発熱抵抗体(40)と、を備え、
前記発熱抵抗体の内、すくなくとも2以上が並列に接続されていることを特徴とする発熱装置。 - 前記絶縁基材の表面側には、所定の前記発熱抵抗体と接続される複数の表面層(21)が配置され、
前記絶縁基材の裏面側には、所定の前記発熱抵抗体と接続される複数の裏面層(31)が配置され、
前記複数の発熱抵抗体は、前記表面層および裏面層によって直列に接続された発熱抵抗体群(42)を複数構成しており、
前記複数の発熱抵抗体群は、前記絶縁基材の表面または裏面に配置された給電部(91、92)と接続されることによって並列に接続されていることを特徴とする請求項1に記載の発熱装置。 - 前記絶縁基材の表面側には、前記複数の発熱抵抗体すべてと電気的に接続される1つの表面層(21)が配置され、
前記絶縁基材の裏面側には、前記複数の発熱抵抗体とそれぞれ電気的に接続され、互いに離間している複数の裏面層(31)が配置され、
前記複数の発熱抵抗体は、前記表面層および前記裏面層によって並列に接続されていることを特徴とする請求項1に記載の発熱装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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CN201380028058.0A CN104335677B (zh) | 2012-05-30 | 2013-04-26 | 发热装置 |
US14/404,888 US20150122799A1 (en) | 2012-05-30 | 2013-04-26 | Heat generating device |
DE112013002761.5T DE112013002761T5 (de) | 2012-05-30 | 2013-04-26 | Wärmeerzeugende Vorrichtung |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2012-122823 | 2012-05-30 | ||
JP2012122823 | 2012-05-30 | ||
JP2013027279A JP5888260B2 (ja) | 2012-05-30 | 2013-02-15 | 発熱装置 |
JP2013-027279 | 2013-11-21 |
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WO2013179836A1 true WO2013179836A1 (ja) | 2013-12-05 |
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PCT/JP2013/062436 WO2013179836A1 (ja) | 2012-05-30 | 2013-04-26 | 発熱装置 |
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US (1) | US20150122799A1 (ja) |
JP (1) | JP5888260B2 (ja) |
CN (1) | CN104335677B (ja) |
DE (1) | DE112013002761T5 (ja) |
WO (1) | WO2013179836A1 (ja) |
Cited By (1)
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WO2018092459A1 (ja) * | 2016-11-16 | 2018-05-24 | 株式会社デンソー | 輻射ヒータ装置 |
Families Citing this family (3)
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JP6304338B1 (ja) * | 2016-10-07 | 2018-04-04 | 株式会社デンソー | 熱電変換装置の製造方法 |
TWI643522B (zh) * | 2017-05-22 | 2018-12-01 | 許詔智 | Ceramic heating sheet structure |
CN109184489A (zh) * | 2018-09-13 | 2019-01-11 | 东北石油大学 | 填充导电蓄热纳米流体的可控红外辐射加热保温玻璃窗 |
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JPH07176369A (ja) * | 1993-12-21 | 1995-07-14 | Sekisui Plastics Co Ltd | ヒーター |
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JP2012069281A (ja) * | 2010-09-21 | 2012-04-05 | Denso Corp | 加熱装置 |
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SG86345A1 (en) * | 1998-05-14 | 2002-02-19 | Matsushita Electric Ind Co Ltd | Circuit board and method of manufacturing the same |
CN2370644Y (zh) * | 1999-01-15 | 2000-03-22 | 张宇平 | 电热毯 |
DE10201262B4 (de) * | 2002-01-15 | 2006-09-07 | Webasto Ag | Widerstandsheizelement |
JP2006140367A (ja) * | 2004-11-15 | 2006-06-01 | Sumitomo Electric Ind Ltd | 半導体製造装置用加熱体およびこれを搭載した加熱装置 |
JP4530089B2 (ja) * | 2008-03-12 | 2010-08-25 | 株式会社デンソー | 配線基板の製造方法 |
TWI433627B (zh) * | 2010-03-08 | 2014-04-01 | Denso Corp | A method for manufacturing a multilayer circuit board in which a conductive material is inserted through a through hole, a conductive material filling device for a through hole, and a method of using the same |
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2013
- 2013-02-15 JP JP2013027279A patent/JP5888260B2/ja not_active Expired - Fee Related
- 2013-04-26 US US14/404,888 patent/US20150122799A1/en not_active Abandoned
- 2013-04-26 DE DE112013002761.5T patent/DE112013002761T5/de not_active Withdrawn
- 2013-04-26 CN CN201380028058.0A patent/CN104335677B/zh not_active Expired - Fee Related
- 2013-04-26 WO PCT/JP2013/062436 patent/WO2013179836A1/ja active Application Filing
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JPH07176369A (ja) * | 1993-12-21 | 1995-07-14 | Sekisui Plastics Co Ltd | ヒーター |
JPH09312193A (ja) * | 1996-05-23 | 1997-12-02 | Sekisui Plastics Co Ltd | 面状ヒータ |
JP2003123945A (ja) * | 2001-08-08 | 2003-04-25 | Fuji Name Plate Kk | ヒータ |
JP2012069281A (ja) * | 2010-09-21 | 2012-04-05 | Denso Corp | 加熱装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018092459A1 (ja) * | 2016-11-16 | 2018-05-24 | 株式会社デンソー | 輻射ヒータ装置 |
JPWO2018092459A1 (ja) * | 2016-11-16 | 2019-03-22 | 株式会社デンソー | 輻射ヒータ装置 |
CN109952810A (zh) * | 2016-11-16 | 2019-06-28 | 株式会社电装 | 辐射加热装置 |
CN109952810B (zh) * | 2016-11-16 | 2022-01-11 | 株式会社电装 | 辐射加热装置 |
US11440375B2 (en) | 2016-11-16 | 2022-09-13 | Denso Corporation | Radiant heater device |
Also Published As
Publication number | Publication date |
---|---|
CN104335677B (zh) | 2017-10-24 |
CN104335677A (zh) | 2015-02-04 |
US20150122799A1 (en) | 2015-05-07 |
JP5888260B2 (ja) | 2016-03-16 |
DE112013002761T5 (de) | 2015-05-21 |
JP2014007140A (ja) | 2014-01-16 |
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