JP5888260B2 - 発熱装置 - Google Patents
発熱装置 Download PDFInfo
- Publication number
- JP5888260B2 JP5888260B2 JP2013027279A JP2013027279A JP5888260B2 JP 5888260 B2 JP5888260 B2 JP 5888260B2 JP 2013027279 A JP2013027279 A JP 2013027279A JP 2013027279 A JP2013027279 A JP 2013027279A JP 5888260 B2 JP5888260 B2 JP 5888260B2
- Authority
- JP
- Japan
- Prior art keywords
- back surface
- heat generating
- insulating base
- heating resistor
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title claims description 72
- 239000000463 material Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 10
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 6
- 239000004697 Polyetherimide Substances 0.000 description 6
- 229920002530 polyetherether ketone Polymers 0.000 description 6
- 229920001601 polyetherimide Polymers 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 206010037660 Pyrexia Diseases 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910018100 Ni-Sn Inorganic materials 0.000 description 2
- 229910018532 Ni—Sn Inorganic materials 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003463 adsorbent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/267—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an organic material, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/009—Heaters using conductive material in contact with opposing surfaces of the resistive element or resistive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/022—Heaters specially adapted for heating gaseous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Description
本発明の第1実施形態について図面を参照しつつ説明する。図1〜図3に示されるように、本実施形態の発熱装置1は、絶縁基材10、表面保護部材20、裏面保護部材30が一体化され、この一体化されたものの内部に発熱抵抗体40が配置されて構成されている。
本発明の第2実施形態について説明する。本実施形態は、第1実施形態に対して、各発熱抵抗体40を並列に接続したものであり、その他に関しては第1実施形態と同様であるため、ここでは説明を省略する。
上記第1実施形態では、裏面保護部材30に裏面パターン31および第1、第2給電部91、92が形成されたものを用意し、裏面保護部材30、絶縁基材10、表面保護部材20を積層して一体化するものについて説明したが、例えば、次のようにしてもよい。すなわち、絶縁基材10の裏面10bに裏面パターン31および第1、第2給電部91、92が形成されているものを用いて発熱装置1を構成してもよい。この場合は、図4(a)の工程を行う際、裏面パターン31または第1、第2給電部91、92を底面とする有底のビアホール11を形成し、図4(b)の工程を行う際、吸着紙60を用いずに導電性ペースト41を各ビアホール11に充填すればよい。同様に、上記第2実施形態において、絶縁基材10の裏面10bに裏面パターン31が形成されているものを用いて発熱装置1を構成してもよい。
10 絶縁基材
11 ビアホール
20 表面保護部材
30 裏面保護部部材
40 発熱抵抗体
Claims (2)
- 熱可塑性樹脂を含んで構成され、表面(10a)および前記表面と反対側の裏面(10b)を有し、厚さ方向に貫通する複数のビアホール(11)が形成された絶縁基材(10)と、
前記複数のビアホールのそれぞれに配置され、通電されることにより発熱する発熱抵抗体(40)と、を備え、
前記絶縁基材の表面側には、所定の前記発熱抵抗体と接続される複数の表面パターン(21)が配置され、
前記絶縁基材の裏面側には、所定の前記発熱抵抗体と接続される複数の裏面パターン(31)が配置され、
前記複数のビアホールは、それぞれ前記厚さ方向が長手方向とされ、
前記複数の発熱抵抗体は、それぞれ前記厚さ方向が長手方向とされていると共に、前記表面パターンおよび裏面パターンによって直列に接続された発熱抵抗体群(42)を複数構成しており、
前記複数の発熱抵抗体群は、前記絶縁基材の表面または裏面に配置された給電部(91、92)と接続されることによって並列に接続されていることを特徴とする発熱装置。 - 熱可塑性樹脂を含んで構成され、表面(10a)および前記表面と反対側の裏面(10b)を有し、厚さ方向に貫通する複数のビアホール(11)が形成された絶縁基材(10)と、
前記複数のビアホールのそれぞれに配置され、通電されることにより発熱する発熱抵抗体(40)と、を備え、
前記絶縁基材の表面側には、前記複数の発熱抵抗体と電気的に接続される1つの表面パターン(21)が配置され、
前記絶縁基材の裏面側には、前記複数の発熱抵抗体とそれぞれ電気的に接続され、互いに離間している複数の裏面パターン(31)が配置され、
前記複数のビアホールは、それぞれ前記厚さ方向が長手方向とされ、
前記複数の発熱抵抗体は、それぞれ前記厚さ方向が長手方向とされていると共に、前記表面パターンおよび前記裏面パターンによって並列に接続されていることを特徴とする発熱装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013027279A JP5888260B2 (ja) | 2012-05-30 | 2013-02-15 | 発熱装置 |
DE112013002761.5T DE112013002761T5 (de) | 2012-05-30 | 2013-04-26 | Wärmeerzeugende Vorrichtung |
CN201380028058.0A CN104335677B (zh) | 2012-05-30 | 2013-04-26 | 发热装置 |
PCT/JP2013/062436 WO2013179836A1 (ja) | 2012-05-30 | 2013-04-26 | 発熱装置 |
US14/404,888 US20150122799A1 (en) | 2012-05-30 | 2013-04-26 | Heat generating device |
TW102124181A TWI590703B (zh) | 2013-02-15 | 2013-07-05 | Heating device |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012122823 | 2012-05-30 | ||
JP2012122823 | 2012-05-30 | ||
JP2013027279A JP5888260B2 (ja) | 2012-05-30 | 2013-02-15 | 発熱装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014007140A JP2014007140A (ja) | 2014-01-16 |
JP5888260B2 true JP5888260B2 (ja) | 2016-03-16 |
Family
ID=49673040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013027279A Expired - Fee Related JP5888260B2 (ja) | 2012-05-30 | 2013-02-15 | 発熱装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150122799A1 (ja) |
JP (1) | JP5888260B2 (ja) |
CN (1) | CN104335677B (ja) |
DE (1) | DE112013002761T5 (ja) |
WO (1) | WO2013179836A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6304338B1 (ja) * | 2016-10-07 | 2018-04-04 | 株式会社デンソー | 熱電変換装置の製造方法 |
JP6725005B2 (ja) | 2016-11-16 | 2020-07-15 | 株式会社デンソー | 輻射ヒータ装置 |
TWI643522B (zh) * | 2017-05-22 | 2018-12-01 | 許詔智 | Ceramic heating sheet structure |
CN109184489A (zh) * | 2018-09-13 | 2019-01-11 | 东北石油大学 | 填充导电蓄热纳米流体的可控红外辐射加热保温玻璃窗 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07176369A (ja) * | 1993-12-21 | 1995-07-14 | Sekisui Plastics Co Ltd | ヒーター |
JPH09312193A (ja) * | 1996-05-23 | 1997-12-02 | Sekisui Plastics Co Ltd | 面状ヒータ |
SG86345A1 (en) * | 1998-05-14 | 2002-02-19 | Matsushita Electric Ind Co Ltd | Circuit board and method of manufacturing the same |
CN2370644Y (zh) * | 1999-01-15 | 2000-03-22 | 张宇平 | 电热毯 |
JP2003123945A (ja) * | 2001-08-08 | 2003-04-25 | Fuji Name Plate Kk | ヒータ |
DE10201262B4 (de) * | 2002-01-15 | 2006-09-07 | Webasto Ag | Widerstandsheizelement |
JP2006140367A (ja) * | 2004-11-15 | 2006-06-01 | Sumitomo Electric Ind Ltd | 半導体製造装置用加熱体およびこれを搭載した加熱装置 |
JP4530089B2 (ja) * | 2008-03-12 | 2010-08-25 | 株式会社デンソー | 配線基板の製造方法 |
TWI433627B (zh) * | 2010-03-08 | 2014-04-01 | Denso Corp | A method for manufacturing a multilayer circuit board in which a conductive material is inserted through a through hole, a conductive material filling device for a through hole, and a method of using the same |
JP2012069281A (ja) * | 2010-09-21 | 2012-04-05 | Denso Corp | 加熱装置 |
-
2013
- 2013-02-15 JP JP2013027279A patent/JP5888260B2/ja not_active Expired - Fee Related
- 2013-04-26 US US14/404,888 patent/US20150122799A1/en not_active Abandoned
- 2013-04-26 DE DE112013002761.5T patent/DE112013002761T5/de not_active Withdrawn
- 2013-04-26 WO PCT/JP2013/062436 patent/WO2013179836A1/ja active Application Filing
- 2013-04-26 CN CN201380028058.0A patent/CN104335677B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN104335677B (zh) | 2017-10-24 |
WO2013179836A1 (ja) | 2013-12-05 |
DE112013002761T5 (de) | 2015-05-21 |
CN104335677A (zh) | 2015-02-04 |
US20150122799A1 (en) | 2015-05-07 |
JP2014007140A (ja) | 2014-01-16 |
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