WO2013171924A1 - Convertisseur cc-cc multicanal - Google Patents

Convertisseur cc-cc multicanal Download PDF

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Publication number
WO2013171924A1
WO2013171924A1 PCT/JP2012/079322 JP2012079322W WO2013171924A1 WO 2013171924 A1 WO2013171924 A1 WO 2013171924A1 JP 2012079322 W JP2012079322 W JP 2012079322W WO 2013171924 A1 WO2013171924 A1 WO 2013171924A1
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WO
WIPO (PCT)
Prior art keywords
control
input terminal
converter
inductor
channel
Prior art date
Application number
PCT/JP2012/079322
Other languages
English (en)
Japanese (ja)
Inventor
野間隆嗣
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2014515456A priority Critical patent/JP5880697B2/ja
Priority to CN201290001130.1U priority patent/CN204244072U/zh
Publication of WO2013171924A1 publication Critical patent/WO2013171924A1/fr

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/0067—Converter structures employing plural converter units, other than for parallel operation of the units on a single load
    • H02M1/008—Plural converter units for generating at two or more independent and non-parallel outputs, e.g. systems with plural point of load switching regulators
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Definitions

  • the present invention relates to a DC-DC converter equipped with a switching element, and more particularly to a multi-channel type DC-DC converter.
  • an object of the present invention is to provide a multi-channel DC-DC converter that suppresses the voltage fluctuation when a plurality of control ICs are mounted.
  • a multi-channel DC-DC converter according to the present invention is provided on a multilayer substrate including a magnetic material, a first inductor and a second inductor formed inside the multilayer substrate, and a component mounting surface of the multilayer substrate. And a first control IC and a second control IC connected to the first inductor and the second inductor, respectively.
  • the multi-channel DC-DC converter according to the present invention includes an input terminal provided on a mounting surface of the multilayer substrate facing the component mounting surface, a power input terminal of the first control IC, and the second And the power input terminal of the first control IC and the power input terminal of the second control IC are connected via an internal wiring of the magnetic body. It is characterized by being.
  • the power supply input terminals of the control ICs are connected via the internal wiring of the magnetic material, so that a parasitic inductor exists between the power supply input terminals. Therefore, the power supply input terminals of each control IC are separated by a high resistance at high frequencies due to the parasitic inductor, so that voltage fluctuation is suppressed.
  • first output terminal provided on the mounting surface and the output terminal of the first control IC are the second output terminal provided on the mounting surface and the output terminal of the second control IC are In addition, it is possible to adopt a mode in which they are connected via wiring inside the magnetic body.
  • the wiring inside the magnetic material may be a via hole conductor formed in the stacking direction of the multilayer substrate, and the wiring is formed on the upper surface of the multilayer substrate, and the end surface of the multilayer substrate is It is also possible to connect via
  • the first inductor is provided between a power output terminal of the first control IC and a first output terminal provided on the mounting surface.
  • a step-down DC-DC converter is configured by connecting and connecting the second inductor between a power supply output terminal of the second control IC and a second output terminal provided on the mounting surface. It is also possible to connect the first inductor between the power input terminal of the first control IC and the input terminal provided on the mounting surface, and the second control IC.
  • a step-up DC-DC converter can be configured by connecting the second inductor between a power supply input terminal and an input terminal provided on the mounting surface.
  • the voltage fluctuation can be suppressed when a plurality of control ICs are mounted.
  • FIG. 5 is a circuit diagram when the multi-channel DC-DC converter is a step-down DC-DC converter.
  • FIG. 5 is a circuit diagram when the multi-channel DC-DC converter is a step-up DC-DC converter.
  • FIG. 4A is a top view of a multi-channel DC-DC converter according to Modification 1
  • FIG. 4B is a circuit diagram.
  • FIG. 5A is a top view of a multi-channel DC-DC converter according to Modification 2
  • FIG. 5B is a circuit diagram.
  • 10 is a circuit diagram of a multi-channel DC-DC converter according to Modification 3.
  • FIG. 5 is a circuit diagram when the multi-channel DC-DC converter is a step-down DC-DC converter.
  • FIG. 5 is a circuit diagram when the multi-channel DC-DC converter is a step-up DC-DC converter.
  • FIG. 4A is a top view of a multi-channel DC-DC converter according to Modification 1
  • FIG. 4B is a circuit diagram
  • FIG. 10 is a circuit diagram of a multi-channel DC-DC converter according to Modification 4.
  • FIG. FIG. 8A is a top view of a multi-channel DC-DC converter according to Modification 5
  • FIG. 8B is a circuit diagram.
  • FIG. 9A is a top view of a multi-channel DC-DC converter according to Modification 6, and
  • FIG. 9B is a circuit diagram.
  • FIG. 1A is a top view of a multi-channel DC-DC converter according to an embodiment of the present invention (a diagram showing a main surface of a multilayer board), and FIG. 1B is a coil of the multilayer board.
  • FIG. 2 is a cross-sectional view of a portion where a conductor is formed (a cross-sectional view taken along line AA in FIG. 1A).
  • FIG. 2 is a circuit diagram when the multi-channel DC-DC converter is a step-down DC-DC converter.
  • the multi-channel DC-DC converter 1 is equipped with components on a multilayer substrate 2 in which a plurality of magnetic ceramic green sheets are laminated and fired.
  • Electronic components including a control IC 3A, a control IC 3B, an input side capacitor 12A, an input side capacitor 12B, an output side capacitor 13A, and an output side capacitor 13B are mounted on the surface.
  • the multilayer substrate 2 is composed of a magnetic material (ferrite) layer having a high magnetic permeability, and a coil conductor is provided between the laminated sheets to constitute an inductor 31A and an inductor 31B connected in the lamination direction.
  • a DC-DC converter using these inductors as choke coils can be realized.
  • a non-magnetic layer or a low-permeability layer having a lower magnetic permeability than the magnetic layer may be provided on the front surface, back surface, or part of the inner layer of the multilayer substrate 2.
  • control IC 3A and the control IC 3B are connected to the plurality of inductors 31A and 31B, respectively, different output voltages can be obtained, and a multi-channel DC-DC converter can be realized.
  • an inductor is interposed between the power input terminal 30A of the control IC 3A and the power input terminal 30B of the control IC 3B.
  • the power input terminals of the control ICs are separated in a high frequency manner to suppress voltage fluctuations.
  • the power input terminal 30A of the control IC 3A is connected to the input-side capacitor 12A and the via-hole conductor 11A via the input wiring 51A.
  • the ground electrode of the input-side capacitor 12A is connected to the end face through-hole conductor 91 via the ground wiring 71 and grounded.
  • the end face through-hole conductor 91 is an electrode penetrating the inside of the laminated substrate in the laminating direction, but a part of the end face through-hole conductor 91 is exposed to the outside and forms an open magnetic circuit. Therefore, the influence of the parasitic inductance of the end face through-hole conductor 91 can be almost ignored.
  • the power supply output terminal of the control IC 3A is connected to the inductor 31A, and finally connected to the output-side capacitor 13A and the via-hole conductor 14A via the output wiring 52A.
  • the ground terminal of the control IC 3A is connected to the output-side capacitor 13A and the end face through-hole conductor 91 via the ground wiring 71 and grounded.
  • the via-hole conductor 11 ⁇ / b> A penetrates the inside of the multilayer substrate 2 in the stacking direction and is connected to an input terminal 41 provided on a mounting surface facing the component mounting surface of the multilayer substrate 2.
  • the input terminal 41 is connected to an electrode for power supply input on the mounting substrate side.
  • the via-hole conductor 14A penetrates the multilayer substrate 2 in the stacking direction and is connected to an output terminal (Vout1) provided on the mounting surface.
  • the output terminal is connected to a power output electrode on the mounting substrate side.
  • the power input terminal 30B of the control IC 3B is connected to the input-side capacitor 12B and the via-hole conductor 11B via the input wiring 51B.
  • the ground electrode of the input-side capacitor 12B is connected to the end face through-hole conductor 91 via the ground wiring 71 and grounded.
  • the power supply output terminal of the control IC 3B is connected to the inductor 31B, and finally connected to the output-side capacitor 13B and the via-hole conductor 14B via the output wiring 52B.
  • the ground terminal of the control IC 3B is connected to the output-side capacitor 13B and the end face through-hole conductor 91 via the ground wiring 71 and grounded.
  • the via-hole conductor 11B penetrates the multilayer substrate 2 in the stacking direction and is connected to the input terminal 41.
  • the via-hole conductor 14B penetrates the multilayer substrate 2 in the stacking direction and is connected to an output terminal (Vout2) provided on the mounting surface.
  • the output terminal is connected to a power output electrode on the mounting substrate side.
  • the input terminal 41, the power input terminal 30A of the control IC 3A, and the power input terminal 30B of the control IC 3B are connected to each other, and the power input terminal 30A and the power input terminal 30B are formed inside the magnetic body. It will be connected through the wiring.
  • the via-hole conductor 11A and the via-hole conductor 11B penetrate the inside of the multilayer substrate 2 including the magnetic material in the stacking direction and are surrounded by the magnetic material, so that each inductor is shown in FIG. It functions as LinA and inductor LinB. Further, the via-hole conductor 14A and the via-hole conductor 14B also penetrate through the multilayer substrate 2 in the stacking direction and are surrounded by a magnetic material, so that the inductor LoutA and the inductor LoutB are respectively shown in FIG. Function.
  • the power input terminal 30A and the power input terminal 30B are separated by these inductors with high resistance in terms of high frequency.
  • a smoothing filter is configured by the inductor LinA and the input side capacitor 12A (inductor LinB and input side capacitor 12B). Therefore, even if the frequencies of the control IC 3A and the control IC 3B are different, the difference frequency does not appear as a voltage fluctuation.
  • the example using the via-hole conductor penetrating the inside of the multilayer substrate 2 in the stacking direction has been described.
  • the wiring is formed on the magnetic material layer constituting the multilayer substrate 2, it functions as an inductor. It is possible to make it.
  • FIG. 4 (A) is a top view of the multi-channel DC-DC converter according to Modification 1
  • FIG. 4 (B) is a circuit diagram thereof. Components that are the same as those in FIG. 1A and FIG. 2 are given the same reference numerals, and descriptions thereof are omitted.
  • the multi-channel DC-DC converter according to Modification 1 is provided with an end face through-hole conductor 92A and an end face through-hole conductor 92B in place of the via hole conductor 14A and the via hole conductor 14B, respectively.
  • the power supply output terminal of the control IC 3A is connected to the inductor 31A, and finally connected to the output-side capacitor 13A and the end face through-hole conductor 92A via the output wiring 52A.
  • the power output terminal of the control IC 3B is connected to the inductor 31B, and finally connected to the output-side capacitor 13A and the end face through-hole conductor 92B via the output wiring 52B.
  • the end face through-hole conductor 92A and the end face through-hole conductor 92B are electrodes that penetrate the laminated substrate in the laminating direction, but at least a part of the side faces are exposed to the outside and are open magnetic paths.
  • the output side inductor LoutA and the inductor LoutB do not exist. Also in this case, since the power supply input terminal 30A and the power supply input terminal 30B are separated by the inductor LinA and the inductor LinB with high resistance in terms of high frequency, no voltage fluctuation appears. However, when a capacitor is provided at the subsequent stage of the output terminal Vout1 and the output terminal Vout2, that is, on the mounting substrate side, if the inductor LoutA and the inductor LoutB are formed by the via-hole conductor 14A and the via-hole conductor 14B, a smoothing filter is configured by these inductors and capacitors. This contributes to noise suppression.
  • FIG. 5 (A) is a top view of a multi-channel DC-DC converter according to Modification 2
  • FIG. 5 (B) is a circuit diagram thereof. Components that are the same as those in FIG. 1A and FIG. 2 are given the same reference numerals, and descriptions thereof are omitted.
  • the multi-channel DC-DC converter according to Modification 2 is provided with an end face through-hole conductor 93B instead of the via-hole conductor 11B.
  • the power input terminal 30B of the control IC 3B is connected to the input-side capacitor 12B and the end face through-hole conductor 93B via the input wiring 51B.
  • the end face through-hole conductor 93B is an electrode that penetrates the inside of the laminated substrate in the laminating direction, but a part thereof is exposed to the outside and is an open magnetic circuit.
  • the inductor LinB on the input side does not exist. Even in this case, the power input terminal 30A and the power input terminal 30B are separated by the inductor LinA with high resistance in terms of high frequency, so that voltage fluctuation does not appear.
  • the wiring length on the component mounting surface can be made shorter than the end face through-hole conductor, so that the wiring pattern is not complicated and the increase in the mounting area of the element is prevented. In addition, loss due to wiring resistance can be reduced.
  • FIG. 6 is a circuit diagram of a multi-channel DC-DC converter according to Modification 3. Components that are the same as those in FIG. 2 are given the same reference numerals, and descriptions thereof are omitted.
  • the multi-channel DC-DC converter according to Modification 3 is a three-channel DC-DC converter that further includes an input side capacitor 12C, a control IC 3C, and an output side capacitor 13C, and is provided with an inductor 31C.
  • the power input terminal 30C of the control IC 3C is connected to the input terminal 41 via the via-hole conductor, and therefore between the input terminal 41 and the power input terminal 30C.
  • the inductor LinC intervenes in.
  • the input terminal 41, the power input terminal 30A of the control IC 3A, the power input terminal 30B of the control IC 3B, and the power input terminal 30C of the control IC 3C are connected to each other, and the power input terminal 30A and the power input terminal are connected.
  • 30B and the power input terminal 30C are connected via an internal wiring of a magnetic body, and the power input terminal 30A, the power input terminal 30B, and the power input terminal 30C are separated by these inductors with high resistance in terms of high frequency. become.
  • the difference frequency does not appear as a voltage fluctuation.
  • the inductor LinA and the power input terminal 30B are not connected between the power input terminal 30A and the power input terminal 30B.
  • the inductor LinB is separated by a high resistance in terms of high frequency
  • the power supply input terminal 30A and the power supply input terminal 30C are separated by a high frequency resistance by the inductor LinA
  • the power supply input terminal 30B and the power supply input terminal 30C are separated by an inductor LinB.
  • the multi-channel DC-DC converter of the present embodiment has a configuration in which each electronic component is grounded via the end face through-hole conductor 91.
  • the modification shown in FIGS. 8A and 8B is used.
  • the end face through-hole conductor 91 is not an essential configuration.
  • a multi-channel type DC-DC converter according to Modification 5 is provided with a via-hole conductor 901 instead of the end face through-hole conductor 91.
  • the ground terminals of the control IC 3A, the control IC 3B, the input side capacitor 12A, the input side capacitor 12B, the output side capacitor 13A, and the output side capacitor 13B are connected to the via-hole conductor 901 via the ground wiring 71 and grounded.
  • the via-hole conductor 901 functions as an inductor LGND as shown in FIG. 8B because it passes through the inside of the multilayer substrate 2 containing the magnetic material in the stacking direction and is not exposed to the outside. In this case, the switching signal does not fall to the ground due to the inductor LGND but may appear as noise. In this case as well, the frequency between the power input terminal 30A and the power input terminal 30B is high due to the inductor LinA and the inductor LinB. Since they are separated by resistors, voltage fluctuations do not appear.
  • via hole conductor 901A via hole conductor 901A, via hole conductor 901B, and via hole. It is also possible to provide a conductor 901C).

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dc-Dc Converters (AREA)

Abstract

La présente invention se rapporte à un convertisseur CC-CC multicanal qui réduit à un minimum les fluctuations de tension lorsque de multiples circuits intégrés de commutation sont montés. Une borne d'entrée (41) est respectivement raccordée à une borne d'entrée d'alimentation électrique (30A) d'un circuit intégré de contrôle (3A) et à une borne d'entrée d'alimentation électrique (30B) d'un circuit intégré de contrôle (3B), et la borne d'entrée d'alimentation électrique (30A) ainsi que la borne d'entrée d'alimentation électrique (30B) sont raccordées ensemble par l'intermédiaire d'un câblage interne d'un corps magnétique. De plus, puisqu'un conducteur de trou d'interconnexion (11A) et un conducteur de trou d'interconnexion (11B) pénètrent dans un substrat multicouche (2), qui contient le corps magnétique, dans la direction de stratification sans être exposés à l'extérieur, les conducteurs de trou d'interconnexion respectifs font office d'inducteurs. La borne d'entrée d'alimentation électrique (30A) du circuit intégré de contrôle (3A) et la borne d'entrée d'alimentation électrique (30B) du circuit intégré de contrôle (3B) sont séparées l'une de l'autre à des fréquences élevées par les inducteurs afin de réduire à un minimum les fluctuations de tension.
PCT/JP2012/079322 2012-05-15 2012-11-13 Convertisseur cc-cc multicanal WO2013171924A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014515456A JP5880697B2 (ja) 2012-05-15 2012-11-13 多チャンネル型ｄｃ−ｄｃコンバータ
CN201290001130.1U CN204244072U (zh) 2012-05-15 2012-11-13 多通道型dc-dc转换器

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Application Number Priority Date Filing Date Title
JP2012-111632 2012-05-15
JP2012111632 2012-05-15

Publications (1)

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WO2013171924A1 true WO2013171924A1 (fr) 2013-11-21

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CN (1) CN204244072U (fr)
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Cited By (2)

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Publication number Priority date Publication date Assignee Title
WO2016116429A1 (fr) * 2015-01-19 2016-07-28 Efficient Energy Gmbh Réseau de bobines
CN110268627A (zh) * 2017-02-10 2019-09-20 松下知识产权经营株式会社 多层基板滤波器

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WO2008087781A1 (fr) * 2007-01-19 2008-07-24 Murata Manufacturing Co., Ltd. Module convertisseur continu-continu
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