WO2013171924A1 - Multichannel dc-dc converter - Google Patents

Multichannel dc-dc converter Download PDF

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Publication number
WO2013171924A1
WO2013171924A1 PCT/JP2012/079322 JP2012079322W WO2013171924A1 WO 2013171924 A1 WO2013171924 A1 WO 2013171924A1 JP 2012079322 W JP2012079322 W JP 2012079322W WO 2013171924 A1 WO2013171924 A1 WO 2013171924A1
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WO
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Prior art keywords
control
input terminal
converter
inductor
channel
Prior art date
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PCT/JP2012/079322
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French (fr)
Japanese (ja)
Inventor
野間隆嗣
Original Assignee
株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2014515456A priority Critical patent/JP5880697B2/en
Priority to CN201290001130.1U priority patent/CN204244072U/en
Publication of WO2013171924A1 publication Critical patent/WO2013171924A1/en

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/0067—Converter structures employing plural converter units, other than for parallel operation of the units on a single load
    • H02M1/008—Plural converter units for generating at two or more independent and non-parallel outputs, e.g. systems with plural point of load switching regulators
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Definitions

  • the present invention relates to a DC-DC converter equipped with a switching element, and more particularly to a multi-channel type DC-DC converter.
  • an object of the present invention is to provide a multi-channel DC-DC converter that suppresses the voltage fluctuation when a plurality of control ICs are mounted.
  • a multi-channel DC-DC converter according to the present invention is provided on a multilayer substrate including a magnetic material, a first inductor and a second inductor formed inside the multilayer substrate, and a component mounting surface of the multilayer substrate. And a first control IC and a second control IC connected to the first inductor and the second inductor, respectively.
  • the multi-channel DC-DC converter according to the present invention includes an input terminal provided on a mounting surface of the multilayer substrate facing the component mounting surface, a power input terminal of the first control IC, and the second And the power input terminal of the first control IC and the power input terminal of the second control IC are connected via an internal wiring of the magnetic body. It is characterized by being.
  • the power supply input terminals of the control ICs are connected via the internal wiring of the magnetic material, so that a parasitic inductor exists between the power supply input terminals. Therefore, the power supply input terminals of each control IC are separated by a high resistance at high frequencies due to the parasitic inductor, so that voltage fluctuation is suppressed.
  • first output terminal provided on the mounting surface and the output terminal of the first control IC are the second output terminal provided on the mounting surface and the output terminal of the second control IC are In addition, it is possible to adopt a mode in which they are connected via wiring inside the magnetic body.
  • the wiring inside the magnetic material may be a via hole conductor formed in the stacking direction of the multilayer substrate, and the wiring is formed on the upper surface of the multilayer substrate, and the end surface of the multilayer substrate is It is also possible to connect via
  • the first inductor is provided between a power output terminal of the first control IC and a first output terminal provided on the mounting surface.
  • a step-down DC-DC converter is configured by connecting and connecting the second inductor between a power supply output terminal of the second control IC and a second output terminal provided on the mounting surface. It is also possible to connect the first inductor between the power input terminal of the first control IC and the input terminal provided on the mounting surface, and the second control IC.
  • a step-up DC-DC converter can be configured by connecting the second inductor between a power supply input terminal and an input terminal provided on the mounting surface.
  • the voltage fluctuation can be suppressed when a plurality of control ICs are mounted.
  • FIG. 5 is a circuit diagram when the multi-channel DC-DC converter is a step-down DC-DC converter.
  • FIG. 5 is a circuit diagram when the multi-channel DC-DC converter is a step-up DC-DC converter.
  • FIG. 4A is a top view of a multi-channel DC-DC converter according to Modification 1
  • FIG. 4B is a circuit diagram.
  • FIG. 5A is a top view of a multi-channel DC-DC converter according to Modification 2
  • FIG. 5B is a circuit diagram.
  • 10 is a circuit diagram of a multi-channel DC-DC converter according to Modification 3.
  • FIG. 5 is a circuit diagram when the multi-channel DC-DC converter is a step-down DC-DC converter.
  • FIG. 5 is a circuit diagram when the multi-channel DC-DC converter is a step-up DC-DC converter.
  • FIG. 4A is a top view of a multi-channel DC-DC converter according to Modification 1
  • FIG. 4B is a circuit diagram
  • FIG. 10 is a circuit diagram of a multi-channel DC-DC converter according to Modification 4.
  • FIG. FIG. 8A is a top view of a multi-channel DC-DC converter according to Modification 5
  • FIG. 8B is a circuit diagram.
  • FIG. 9A is a top view of a multi-channel DC-DC converter according to Modification 6, and
  • FIG. 9B is a circuit diagram.
  • FIG. 1A is a top view of a multi-channel DC-DC converter according to an embodiment of the present invention (a diagram showing a main surface of a multilayer board), and FIG. 1B is a coil of the multilayer board.
  • FIG. 2 is a cross-sectional view of a portion where a conductor is formed (a cross-sectional view taken along line AA in FIG. 1A).
  • FIG. 2 is a circuit diagram when the multi-channel DC-DC converter is a step-down DC-DC converter.
  • the multi-channel DC-DC converter 1 is equipped with components on a multilayer substrate 2 in which a plurality of magnetic ceramic green sheets are laminated and fired.
  • Electronic components including a control IC 3A, a control IC 3B, an input side capacitor 12A, an input side capacitor 12B, an output side capacitor 13A, and an output side capacitor 13B are mounted on the surface.
  • the multilayer substrate 2 is composed of a magnetic material (ferrite) layer having a high magnetic permeability, and a coil conductor is provided between the laminated sheets to constitute an inductor 31A and an inductor 31B connected in the lamination direction.
  • a DC-DC converter using these inductors as choke coils can be realized.
  • a non-magnetic layer or a low-permeability layer having a lower magnetic permeability than the magnetic layer may be provided on the front surface, back surface, or part of the inner layer of the multilayer substrate 2.
  • control IC 3A and the control IC 3B are connected to the plurality of inductors 31A and 31B, respectively, different output voltages can be obtained, and a multi-channel DC-DC converter can be realized.
  • an inductor is interposed between the power input terminal 30A of the control IC 3A and the power input terminal 30B of the control IC 3B.
  • the power input terminals of the control ICs are separated in a high frequency manner to suppress voltage fluctuations.
  • the power input terminal 30A of the control IC 3A is connected to the input-side capacitor 12A and the via-hole conductor 11A via the input wiring 51A.
  • the ground electrode of the input-side capacitor 12A is connected to the end face through-hole conductor 91 via the ground wiring 71 and grounded.
  • the end face through-hole conductor 91 is an electrode penetrating the inside of the laminated substrate in the laminating direction, but a part of the end face through-hole conductor 91 is exposed to the outside and forms an open magnetic circuit. Therefore, the influence of the parasitic inductance of the end face through-hole conductor 91 can be almost ignored.
  • the power supply output terminal of the control IC 3A is connected to the inductor 31A, and finally connected to the output-side capacitor 13A and the via-hole conductor 14A via the output wiring 52A.
  • the ground terminal of the control IC 3A is connected to the output-side capacitor 13A and the end face through-hole conductor 91 via the ground wiring 71 and grounded.
  • the via-hole conductor 11 ⁇ / b> A penetrates the inside of the multilayer substrate 2 in the stacking direction and is connected to an input terminal 41 provided on a mounting surface facing the component mounting surface of the multilayer substrate 2.
  • the input terminal 41 is connected to an electrode for power supply input on the mounting substrate side.
  • the via-hole conductor 14A penetrates the multilayer substrate 2 in the stacking direction and is connected to an output terminal (Vout1) provided on the mounting surface.
  • the output terminal is connected to a power output electrode on the mounting substrate side.
  • the power input terminal 30B of the control IC 3B is connected to the input-side capacitor 12B and the via-hole conductor 11B via the input wiring 51B.
  • the ground electrode of the input-side capacitor 12B is connected to the end face through-hole conductor 91 via the ground wiring 71 and grounded.
  • the power supply output terminal of the control IC 3B is connected to the inductor 31B, and finally connected to the output-side capacitor 13B and the via-hole conductor 14B via the output wiring 52B.
  • the ground terminal of the control IC 3B is connected to the output-side capacitor 13B and the end face through-hole conductor 91 via the ground wiring 71 and grounded.
  • the via-hole conductor 11B penetrates the multilayer substrate 2 in the stacking direction and is connected to the input terminal 41.
  • the via-hole conductor 14B penetrates the multilayer substrate 2 in the stacking direction and is connected to an output terminal (Vout2) provided on the mounting surface.
  • the output terminal is connected to a power output electrode on the mounting substrate side.
  • the input terminal 41, the power input terminal 30A of the control IC 3A, and the power input terminal 30B of the control IC 3B are connected to each other, and the power input terminal 30A and the power input terminal 30B are formed inside the magnetic body. It will be connected through the wiring.
  • the via-hole conductor 11A and the via-hole conductor 11B penetrate the inside of the multilayer substrate 2 including the magnetic material in the stacking direction and are surrounded by the magnetic material, so that each inductor is shown in FIG. It functions as LinA and inductor LinB. Further, the via-hole conductor 14A and the via-hole conductor 14B also penetrate through the multilayer substrate 2 in the stacking direction and are surrounded by a magnetic material, so that the inductor LoutA and the inductor LoutB are respectively shown in FIG. Function.
  • the power input terminal 30A and the power input terminal 30B are separated by these inductors with high resistance in terms of high frequency.
  • a smoothing filter is configured by the inductor LinA and the input side capacitor 12A (inductor LinB and input side capacitor 12B). Therefore, even if the frequencies of the control IC 3A and the control IC 3B are different, the difference frequency does not appear as a voltage fluctuation.
  • the example using the via-hole conductor penetrating the inside of the multilayer substrate 2 in the stacking direction has been described.
  • the wiring is formed on the magnetic material layer constituting the multilayer substrate 2, it functions as an inductor. It is possible to make it.
  • FIG. 4 (A) is a top view of the multi-channel DC-DC converter according to Modification 1
  • FIG. 4 (B) is a circuit diagram thereof. Components that are the same as those in FIG. 1A and FIG. 2 are given the same reference numerals, and descriptions thereof are omitted.
  • the multi-channel DC-DC converter according to Modification 1 is provided with an end face through-hole conductor 92A and an end face through-hole conductor 92B in place of the via hole conductor 14A and the via hole conductor 14B, respectively.
  • the power supply output terminal of the control IC 3A is connected to the inductor 31A, and finally connected to the output-side capacitor 13A and the end face through-hole conductor 92A via the output wiring 52A.
  • the power output terminal of the control IC 3B is connected to the inductor 31B, and finally connected to the output-side capacitor 13A and the end face through-hole conductor 92B via the output wiring 52B.
  • the end face through-hole conductor 92A and the end face through-hole conductor 92B are electrodes that penetrate the laminated substrate in the laminating direction, but at least a part of the side faces are exposed to the outside and are open magnetic paths.
  • the output side inductor LoutA and the inductor LoutB do not exist. Also in this case, since the power supply input terminal 30A and the power supply input terminal 30B are separated by the inductor LinA and the inductor LinB with high resistance in terms of high frequency, no voltage fluctuation appears. However, when a capacitor is provided at the subsequent stage of the output terminal Vout1 and the output terminal Vout2, that is, on the mounting substrate side, if the inductor LoutA and the inductor LoutB are formed by the via-hole conductor 14A and the via-hole conductor 14B, a smoothing filter is configured by these inductors and capacitors. This contributes to noise suppression.
  • FIG. 5 (A) is a top view of a multi-channel DC-DC converter according to Modification 2
  • FIG. 5 (B) is a circuit diagram thereof. Components that are the same as those in FIG. 1A and FIG. 2 are given the same reference numerals, and descriptions thereof are omitted.
  • the multi-channel DC-DC converter according to Modification 2 is provided with an end face through-hole conductor 93B instead of the via-hole conductor 11B.
  • the power input terminal 30B of the control IC 3B is connected to the input-side capacitor 12B and the end face through-hole conductor 93B via the input wiring 51B.
  • the end face through-hole conductor 93B is an electrode that penetrates the inside of the laminated substrate in the laminating direction, but a part thereof is exposed to the outside and is an open magnetic circuit.
  • the inductor LinB on the input side does not exist. Even in this case, the power input terminal 30A and the power input terminal 30B are separated by the inductor LinA with high resistance in terms of high frequency, so that voltage fluctuation does not appear.
  • the wiring length on the component mounting surface can be made shorter than the end face through-hole conductor, so that the wiring pattern is not complicated and the increase in the mounting area of the element is prevented. In addition, loss due to wiring resistance can be reduced.
  • FIG. 6 is a circuit diagram of a multi-channel DC-DC converter according to Modification 3. Components that are the same as those in FIG. 2 are given the same reference numerals, and descriptions thereof are omitted.
  • the multi-channel DC-DC converter according to Modification 3 is a three-channel DC-DC converter that further includes an input side capacitor 12C, a control IC 3C, and an output side capacitor 13C, and is provided with an inductor 31C.
  • the power input terminal 30C of the control IC 3C is connected to the input terminal 41 via the via-hole conductor, and therefore between the input terminal 41 and the power input terminal 30C.
  • the inductor LinC intervenes in.
  • the input terminal 41, the power input terminal 30A of the control IC 3A, the power input terminal 30B of the control IC 3B, and the power input terminal 30C of the control IC 3C are connected to each other, and the power input terminal 30A and the power input terminal are connected.
  • 30B and the power input terminal 30C are connected via an internal wiring of a magnetic body, and the power input terminal 30A, the power input terminal 30B, and the power input terminal 30C are separated by these inductors with high resistance in terms of high frequency. become.
  • the difference frequency does not appear as a voltage fluctuation.
  • the inductor LinA and the power input terminal 30B are not connected between the power input terminal 30A and the power input terminal 30B.
  • the inductor LinB is separated by a high resistance in terms of high frequency
  • the power supply input terminal 30A and the power supply input terminal 30C are separated by a high frequency resistance by the inductor LinA
  • the power supply input terminal 30B and the power supply input terminal 30C are separated by an inductor LinB.
  • the multi-channel DC-DC converter of the present embodiment has a configuration in which each electronic component is grounded via the end face through-hole conductor 91.
  • the modification shown in FIGS. 8A and 8B is used.
  • the end face through-hole conductor 91 is not an essential configuration.
  • a multi-channel type DC-DC converter according to Modification 5 is provided with a via-hole conductor 901 instead of the end face through-hole conductor 91.
  • the ground terminals of the control IC 3A, the control IC 3B, the input side capacitor 12A, the input side capacitor 12B, the output side capacitor 13A, and the output side capacitor 13B are connected to the via-hole conductor 901 via the ground wiring 71 and grounded.
  • the via-hole conductor 901 functions as an inductor LGND as shown in FIG. 8B because it passes through the inside of the multilayer substrate 2 containing the magnetic material in the stacking direction and is not exposed to the outside. In this case, the switching signal does not fall to the ground due to the inductor LGND but may appear as noise. In this case as well, the frequency between the power input terminal 30A and the power input terminal 30B is high due to the inductor LinA and the inductor LinB. Since they are separated by resistors, voltage fluctuations do not appear.
  • via hole conductor 901A via hole conductor 901A, via hole conductor 901B, and via hole. It is also possible to provide a conductor 901C).

Abstract

Provided is a multichannel DC-DC converter that minimizes voltage fluctuations when multiple switching ICs are mounted. An input terminal (41) is respectively connected to a power supply input terminal (30A) of a control IC (3A) and a power supply input terminal (30B) of a control IC (3B), and power supply input terminal (30A) and power supply input terminal (30B) are connected together via internal wiring of a magnetic body. Additionally, since a via hole conductor (11A) and a via hole conductor (11B) penetrate into a multilayer substrate (2), which contains the magnetic body, in the lamination direction without being exposed to the outside, the respective via hole conductors function as inductors. Power supply input terminal (30A) of control IC (3A) and power supply input terminal (30B) of control IC (3B) are separated from each other at high frequencies by the inductors in order to minimize voltage fluctuations.

Description

多チャンネル型ＤＣ－ＤＣコンバータMulti-channel DC-DC converter
　この発明は、スイッチング素子を搭載したＤＣ－ＤＣコンバータに関し、特に多チャンネル型のＤＣ－ＤＣコンバータに関するものである。 The present invention relates to a DC-DC converter equipped with a switching element, and more particularly to a multi-channel type DC-DC converter.
　従来、磁性体基板内部にコイルパターンを形成し、磁性体基板上部に制御ＩＣを搭載することで、ＤＣ－ＤＣコンバータを実現するものが知られている（例えば特許文献１を参照）。 Conventionally, it has been known that a DC-DC converter is realized by forming a coil pattern inside a magnetic substrate and mounting a control IC on the magnetic substrate (see, for example, Patent Document 1).
　また、１つの磁性体基板内部に複数のコイルを形成し、多チャンネル型のＤＣ－ＤＣコンバータを構成することも知られている（例えば特許文献２を参照）。 It is also known to form a multi-channel DC-DC converter by forming a plurality of coils inside one magnetic substrate (see, for example, Patent Document 2).
国際公開第２００８／０８７７８１号International Publication No. 2008/087781 特開２００４－３４３９７６号公報JP 2004-343976 A
　多チャンネル型のＤＣ－ＤＣコンバータにおいて、複数の制御ＩＣを搭載する場合、各制御ＩＣの電源入力端子間が接続されることになるため、各制御ＩＣの周波数が異なると、その差分の周波数が電圧変動として現れるという課題がある。 In a multi-channel DC-DC converter, when a plurality of control ICs are mounted, the power input terminals of each control IC are connected. Therefore, if the frequency of each control IC is different, the difference frequency is There is a problem of appearing as voltage fluctuation.
　そこで、この発明は、複数の制御ＩＣを搭載する場合において、上記電圧変動を抑制する多チャンネル型ＤＣ－ＤＣコンバータを提供することを目的とする。 Therefore, an object of the present invention is to provide a multi-channel DC-DC converter that suppresses the voltage fluctuation when a plurality of control ICs are mounted.
　本発明の多チャンネル型ＤＣ－ＤＣコンバータは、磁性体を含む多層基板と、前記多層基板の内部に形成された第１のインダクタおよび第２のインダクタと、前記多層基板の部品搭載面上に設けられ、前記第１のインダクタおよび第２のインダクタとそれぞれ接続される第１の制御ＩＣおよび第２の制御ＩＣと、を備えている。 A multi-channel DC-DC converter according to the present invention is provided on a multilayer substrate including a magnetic material, a first inductor and a second inductor formed inside the multilayer substrate, and a component mounting surface of the multilayer substrate. And a first control IC and a second control IC connected to the first inductor and the second inductor, respectively.
　そして、本発明の多チャンネル型ＤＣ－ＤＣコンバータは、前記多層基板の前記部品搭載面と対向する実装面に設けられた入力端子と、前記第１の制御ＩＣの電源入力端子と、前記第２の制御ＩＣの電源入力端子と、がそれぞれ接続され、前記第１の制御ＩＣの電源入力端子および前記第２の制御ＩＣの電源入力端子は、前記磁性体の内部の配線を介して接続されていることを特徴とする。 The multi-channel DC-DC converter according to the present invention includes an input terminal provided on a mounting surface of the multilayer substrate facing the component mounting surface, a power input terminal of the first control IC, and the second And the power input terminal of the first control IC and the power input terminal of the second control IC are connected via an internal wiring of the magnetic body. It is characterized by being.
　複数の制御ＩＣを搭載する場合、各制御ＩＣの電源入力端子間が接続されているため、各制御ＩＣの周波数が異なると、その差分の周波数が電圧変動として現れるが、本発明の多チャンネル型ＤＣ－ＤＣコンバータでは、上記のように、各制御ＩＣの電源入力端子間が磁性体の内部の配線を介して接続されているため、電源入力端子間に寄生インダクタが存在することになる。したがって、当該寄生インダクタによって各制御ＩＣの電源入力端子間が高周波的には高い抵抗で分離されていることになるため、電圧変動が抑制される。 When a plurality of control ICs are mounted, since the power input terminals of each control IC are connected, if the frequency of each control IC is different, the difference frequency appears as a voltage fluctuation. In the DC-DC converter, as described above, the power supply input terminals of the control ICs are connected via the internal wiring of the magnetic material, so that a parasitic inductor exists between the power supply input terminals. Therefore, the power supply input terminals of each control IC are separated by a high resistance at high frequencies due to the parasitic inductor, so that voltage fluctuation is suppressed.
　なお、前記実装面に設けられた第１の出力端子および前記第１の制御ＩＣの出力端子は、および前記実装面に設けられた第２の出力端子および前記第２の制御ＩＣの出力端子は、それぞれ前記磁性体の内部の配線を介して接続されている態様とすることも可能である。 Note that the first output terminal provided on the mounting surface and the output terminal of the first control IC are the second output terminal provided on the mounting surface and the output terminal of the second control IC are In addition, it is possible to adopt a mode in which they are connected via wiring inside the magnetic body.
　また、磁性体の内部の配線とは、多層基板の積層方向に形成されたビアホール導体とする態様も可能であるし、多層基板のうち、ある基板上面に配線を形成し、多層基板の端面を介して接続することでも可能である。 In addition, the wiring inside the magnetic material may be a via hole conductor formed in the stacking direction of the multilayer substrate, and the wiring is formed on the upper surface of the multilayer substrate, and the end surface of the multilayer substrate is It is also possible to connect via
　なお、本発明の多チャンネル型ＤＣ－ＤＣコンバータは、前記第１の制御ＩＣの電源出力端子と、前記実装面上に設けられた第１の出力端子と、の間に前記第１のインダクタを接続し、前記第２の制御ＩＣの電源出力端子と、前記実装面上に設けられた第２の出力端子と、の間に前記第２のインダクタを接続して降圧型ＤＣ－ＤＣコンバータを構成することも可能であるし、前記第１の制御ＩＣの電源入力端子と、前記実装面に設けられた入力端子と、の間に前記第１のインダクタを接続し、前記第２の制御ＩＣの電源入力端子と、前記実装面に設けられた入力端子と、の間に前記第２のインダクタを接続して昇圧型ＤＣ－ＤＣコンバータを構成することも可能である。 In the multi-channel DC-DC converter of the present invention, the first inductor is provided between a power output terminal of the first control IC and a first output terminal provided on the mounting surface. A step-down DC-DC converter is configured by connecting and connecting the second inductor between a power supply output terminal of the second control IC and a second output terminal provided on the mounting surface. It is also possible to connect the first inductor between the power input terminal of the first control IC and the input terminal provided on the mounting surface, and the second control IC. A step-up DC-DC converter can be configured by connecting the second inductor between a power supply input terminal and an input terminal provided on the mounting surface.
　この発明によれば、複数の制御ＩＣを搭載する場合において、上記電圧変動を抑制することができる。 According to the present invention, the voltage fluctuation can be suppressed when a plurality of control ICs are mounted.
多チャンネル型ＤＣ－ＤＣコンバータの上面図および横断面図を示す図である。It is a figure which shows the top view and cross-sectional view of a multichannel type DC-DC converter. 多チャンネル型ＤＣ－ＤＣコンバータを降圧型ＤＣ－ＤＣコンバータとする場合の回路図である。FIG. 5 is a circuit diagram when the multi-channel DC-DC converter is a step-down DC-DC converter. 多チャンネル型ＤＣ－ＤＣコンバータを昇圧型ＤＣ－ＤＣコンバータとする場合の回路図である。FIG. 5 is a circuit diagram when the multi-channel DC-DC converter is a step-up DC-DC converter. 図４（Ａ）は、変形例１に係る多チャンネル型ＤＣ－ＤＣコンバータの上面図であり、図４（Ｂ）は、回路図である。FIG. 4A is a top view of a multi-channel DC-DC converter according to Modification 1, and FIG. 4B is a circuit diagram. 図５（Ａ）は、変形例２に係る多チャンネル型ＤＣ－ＤＣコンバータの上面図であり、図５（Ｂ）は、回路図である。FIG. 5A is a top view of a multi-channel DC-DC converter according to Modification 2, and FIG. 5B is a circuit diagram. 変形例３に係る多チャンネル型ＤＣ－ＤＣコンバータの回路図である。10 is a circuit diagram of a multi-channel DC-DC converter according to Modification 3. FIG. 変形例４に係る多チャンネル型ＤＣ－ＤＣコンバータの回路図である。10 is a circuit diagram of a multi-channel DC-DC converter according to Modification 4. FIG. 図８（Ａ）は、変形例５に係る多チャンネル型ＤＣ－ＤＣコンバータの上面図であり、図８（Ｂ）は、回路図である。FIG. 8A is a top view of a multi-channel DC-DC converter according to Modification 5, and FIG. 8B is a circuit diagram. 図９（Ａ）は、変形例６に係る多チャンネル型ＤＣ－ＤＣコンバータの上面図であり、図９（Ｂ）は、回路図である。FIG. 9A is a top view of a multi-channel DC-DC converter according to Modification 6, and FIG. 9B is a circuit diagram.
　図１（Ａ）は、本発明の実施形態に係る多チャンネル型ＤＣ－ＤＣコンバータの上面図（多層基板の主面を示す図）であり、図１（Ｂ）は、多層基板のうち、コイル導体が形成されている部分の横断面図（図１（Ａ）におけるＡ－Ａ線の断面図）である。図２は、多チャンネル型ＤＣ－ＤＣコンバータを降圧型ＤＣ－ＤＣコンバータとする場合の回路図である。 1A is a top view of a multi-channel DC-DC converter according to an embodiment of the present invention (a diagram showing a main surface of a multilayer board), and FIG. 1B is a coil of the multilayer board. FIG. 2 is a cross-sectional view of a portion where a conductor is formed (a cross-sectional view taken along line AA in FIG. 1A). FIG. 2 is a circuit diagram when the multi-channel DC-DC converter is a step-down DC-DC converter.
　図１（Ａ）および図１（Ｂ）に示すように、本実施形態の多チャンネル型ＤＣ－ＤＣコンバータ１は、複数の磁性体セラミックグリーンシートが積層・焼成されてなる多層基板２の部品搭載面上に制御ＩＣ３Ａ、制御ＩＣ３Ｂ、入力側コンデンサ１２Ａ、入力側コンデンサ１２Ｂ、出力側コンデンサ１３Ａ、および出力側コンデンサ１３Ｂからなる電子部品を搭載したものである。 As shown in FIGS. 1 (A) and 1 (B), the multi-channel DC-DC converter 1 according to the present embodiment is equipped with components on a multilayer substrate 2 in which a plurality of magnetic ceramic green sheets are laminated and fired. Electronic components including a control IC 3A, a control IC 3B, an input side capacitor 12A, an input side capacitor 12B, an output side capacitor 13A, and an output side capacitor 13B are mounted on the surface.
　多層基板２は、高透磁率を有する磁性体（フェライト）層にて構成されており、積層されるシート間にコイル導体を設け、積層方向に接続したインダクタ３１Ａおよびインダクタ３１Ｂを構成することで、これらインダクタをチョークコイルとして用いたＤＣ－ＤＣコンバータを実現することができる。なお、多層基板２の表面、裏面、あるいは一部内層に、非磁性体層や前記磁性体層よりも低い透磁率を有する低透磁率層が設けられていてもよい。 The multilayer substrate 2 is composed of a magnetic material (ferrite) layer having a high magnetic permeability, and a coil conductor is provided between the laminated sheets to constitute an inductor 31A and an inductor 31B connected in the lamination direction. A DC-DC converter using these inductors as choke coils can be realized. Note that a non-magnetic layer or a low-permeability layer having a lower magnetic permeability than the magnetic layer may be provided on the front surface, back surface, or part of the inner layer of the multilayer substrate 2.
　また、これら複数のインダクタ３１Ａおよびインダクタ３１Ｂのそれぞれに制御ＩＣ３Ａおよび制御ＩＣ３Ｂを接続することで、それぞれ異なる出力電圧を得ることができ、多チャンネル型ＤＣ－ＤＣコンバータを実現することができる。 Further, by connecting the control IC 3A and the control IC 3B to the plurality of inductors 31A and 31B, respectively, different output voltages can be obtained, and a multi-channel DC-DC converter can be realized.
　このように複数の制御ＩＣを搭載する場合、各制御ＩＣの電源入力端子間が接続されているため、各制御ＩＣの周波数が異なると、その差分の周波数が電圧変動として現れることになる。差分の周波数は、それぞれの制御ＩＣの周波数よりも低いため、出力側の平滑化フィルタでは電圧変動を抑制することができない。また、差分の周波数が制御ＩＣの応答速度よりも高い周波数である場合も、電圧変動を抑制することができない。 When a plurality of control ICs are mounted in this way, since the power input terminals of each control IC are connected, if the frequency of each control IC is different, the difference frequency appears as a voltage fluctuation. Since the frequency of the difference is lower than the frequency of each control IC, the output side smoothing filter cannot suppress voltage fluctuation. Also, voltage fluctuation cannot be suppressed when the difference frequency is higher than the response speed of the control IC.
　そこで、本実施形態の多チャンネル型ＤＣ－ＤＣコンバータ１では、図２の回路図に示すように、制御ＩＣ３Ａの電源入力端子３０Ａおよび制御ＩＣ３Ｂの電源入力端子３０Ｂの間にインダクタを介在させることで、各制御ＩＣの電源入力端子間を高周波的に分離し、電圧変動を抑制する。以下、当該回路構成を実現するための構造的特徴について説明する。 Therefore, in the multi-channel DC-DC converter 1 of the present embodiment, as shown in the circuit diagram of FIG. 2, an inductor is interposed between the power input terminal 30A of the control IC 3A and the power input terminal 30B of the control IC 3B. The power input terminals of the control ICs are separated in a high frequency manner to suppress voltage fluctuations. Hereinafter, structural features for realizing the circuit configuration will be described.
　図１（Ａ）に示すように、制御ＩＣ３Ａの電源入力端子３０Ａは、入力用配線５１Ａを介して入力側コンデンサ１２Ａおよびビアホール導体１１Ａに接続されている。また、入力側コンデンサ１２Ａのグランド電極は、グランド用配線７１を介して端面スルーホール導体９１に接続され、接地される。端面スルーホール導体９１は、積層基板内部を積層方向に貫通した電極であるが、一部が外部に露出し、開磁路となっている。したがって、端面スルーホール導体９１の寄生インダクタンスの影響はほぼ無視することができる。 As shown in FIG. 1A, the power input terminal 30A of the control IC 3A is connected to the input-side capacitor 12A and the via-hole conductor 11A via the input wiring 51A. The ground electrode of the input-side capacitor 12A is connected to the end face through-hole conductor 91 via the ground wiring 71 and grounded. The end face through-hole conductor 91 is an electrode penetrating the inside of the laminated substrate in the laminating direction, but a part of the end face through-hole conductor 91 is exposed to the outside and forms an open magnetic circuit. Therefore, the influence of the parasitic inductance of the end face through-hole conductor 91 can be almost ignored.
　制御ＩＣ３Ａの電源出力端子は、インダクタ３１Ａに接続され、最終的に出力用配線５２Ａを介して出力側コンデンサ１３Ａおよびビアホール導体１４Ａに接続される。また、制御ＩＣ３Ａのグランド端子は、グランド用配線７１を介して出力側コンデンサ１３Ａおよび端面スルーホール導体９１に接続され、接地される。 The power supply output terminal of the control IC 3A is connected to the inductor 31A, and finally connected to the output-side capacitor 13A and the via-hole conductor 14A via the output wiring 52A. The ground terminal of the control IC 3A is connected to the output-side capacitor 13A and the end face through-hole conductor 91 via the ground wiring 71 and grounded.
　ビアホール導体１１Ａは、多層基板２の内部を積層方向に貫通し、多層基板２の部品搭載面と対向する実装面上に設けられた入力端子４１に接続されている。入力端子４１は、実装基板側の電源入力用の電極等と接続される。ビアホール導体１４Ａは、多層基板２の内部を積層方向に貫通し、実装面上に設けられた出力端子（Ｖｏｕｔ１）に接続されている。出力端子は、実装基板側の電源出力用の電極等と接続される。 The via-hole conductor 11 </ b> A penetrates the inside of the multilayer substrate 2 in the stacking direction and is connected to an input terminal 41 provided on a mounting surface facing the component mounting surface of the multilayer substrate 2. The input terminal 41 is connected to an electrode for power supply input on the mounting substrate side. The via-hole conductor 14A penetrates the multilayer substrate 2 in the stacking direction and is connected to an output terminal (Vout1) provided on the mounting surface. The output terminal is connected to a power output electrode on the mounting substrate side.
　一方、制御ＩＣ３Ｂの電源入力端子３０Ｂは、入力用配線５１Ｂを介して入力側コンデンサ１２Ｂおよびビアホール導体１１Ｂに接続されている。また、入力側コンデンサ１２Ｂのグランド電極は、グランド用配線７１を介して端面スルーホール導体９１に接続され、接地される。 On the other hand, the power input terminal 30B of the control IC 3B is connected to the input-side capacitor 12B and the via-hole conductor 11B via the input wiring 51B. The ground electrode of the input-side capacitor 12B is connected to the end face through-hole conductor 91 via the ground wiring 71 and grounded.
　制御ＩＣ３Ｂの電源出力端子は、インダクタ３１Ｂに接続され、最終的に出力用配線５２Ｂを介して出力側コンデンサ１３Ｂおよびビアホール導体１４Ｂに接続される。また、制御ＩＣ３Ｂのグランド端子は、グランド用配線７１を介して出力側コンデンサ１３Ｂおよび端面スルーホール導体９１に接続され、接地される。 The power supply output terminal of the control IC 3B is connected to the inductor 31B, and finally connected to the output-side capacitor 13B and the via-hole conductor 14B via the output wiring 52B. The ground terminal of the control IC 3B is connected to the output-side capacitor 13B and the end face through-hole conductor 91 via the ground wiring 71 and grounded.
　ビアホール導体１１Ｂは、多層基板２の内部を積層方向に貫通し、入力端子４１に接続されている。また、ビアホール導体１４Ｂは、多層基板２の内部を積層方向に貫通し、実装面上に設けられた出力端子（Ｖｏｕｔ２）に接続されている。出力端子は、実装基板側の電源出力用の電極等と接続される。 The via-hole conductor 11B penetrates the multilayer substrate 2 in the stacking direction and is connected to the input terminal 41. The via-hole conductor 14B penetrates the multilayer substrate 2 in the stacking direction and is connected to an output terminal (Vout2) provided on the mounting surface. The output terminal is connected to a power output electrode on the mounting substrate side.
　したがって、入力端子４１と、制御ＩＣ３Ａの電源入力端子３０Ａと、制御ＩＣ３Ｂの電源入力端子３０Ｂと、がそれぞれ接続されることになり、かつ電源入力端子３０Ａおよび電源入力端子３０Ｂは、磁性体の内部の配線を介して接続されることになる。 Therefore, the input terminal 41, the power input terminal 30A of the control IC 3A, and the power input terminal 30B of the control IC 3B are connected to each other, and the power input terminal 30A and the power input terminal 30B are formed inside the magnetic body. It will be connected through the wiring.
　そして、ビアホール導体１１Ａおよびビアホール導体１１Ｂは、磁性体が含まれる多層基板２の内部を積層方向に貫通し、かつその全周が磁性体で囲まれているため、図２に示すようにそれぞれインダクタＬｉｎＡおよびインダクタＬｉｎＢとして機能する。また、ビアホール導体１４Ａおよびビアホール導体１４Ｂも、多層基板２の内部を積層方向に貫通し、かつその全周が磁性体で囲まれているため、図２に示すようにそれぞれインダクタＬｏｕｔＡおよびインダクタＬｏｕｔＢとして機能する。 The via-hole conductor 11A and the via-hole conductor 11B penetrate the inside of the multilayer substrate 2 including the magnetic material in the stacking direction and are surrounded by the magnetic material, so that each inductor is shown in FIG. It functions as LinA and inductor LinB. Further, the via-hole conductor 14A and the via-hole conductor 14B also penetrate through the multilayer substrate 2 in the stacking direction and are surrounded by a magnetic material, so that the inductor LoutA and the inductor LoutB are respectively shown in FIG. Function.
　したがって、電源入力端子３０Ａおよび電源入力端子３０Ｂ間は、これらインダクタによって高周波的には高い抵抗で分離されていることになる。また、機能的には、インダクタＬｉｎＡおよび入力側コンデンサ１２Ａ（インダクタＬｉｎＢおよび入力側コンデンサ１２Ｂ）により平滑化フィルタを構成することになる。したがって、制御ＩＣ３Ａおよび制御ＩＣ３Ｂの周波数が異なる場合であっても、その差分の周波数が電圧変動として現れることはない。 Therefore, the power input terminal 30A and the power input terminal 30B are separated by these inductors with high resistance in terms of high frequency. Functionally, a smoothing filter is configured by the inductor LinA and the input side capacitor 12A (inductor LinB and input side capacitor 12B). Therefore, even if the frequencies of the control IC 3A and the control IC 3B are different, the difference frequency does not appear as a voltage fluctuation.
　なお、上記の例では、降圧型ＤＣ－ＤＣコンバータの例を示したが、本発明は、図３に示すように昇圧型ＤＣ－ＤＣコンバータの場合にも適用することが可能である。 In the above example, an example of a step-down DC-DC converter is shown, but the present invention can also be applied to a step-up DC-DC converter as shown in FIG.
　なお、上記の例では、多層基板２の内部を積層方向に貫通するビアホール導体を用いた例について説明したが、多層基板２を構成する磁性体の層間上に配線を形成することでもインダクタとして機能させることが可能である。 In the above example, the example using the via-hole conductor penetrating the inside of the multilayer substrate 2 in the stacking direction has been described. However, even if the wiring is formed on the magnetic material layer constituting the multilayer substrate 2, it functions as an inductor. It is possible to make it.
　また、ビアホール導体を複数設け、多層基板２の磁性体内部を通る配線の長さを長くし、より高いインダクタンスを実現することも可能である。 It is also possible to provide a plurality of via-hole conductors, increase the length of the wiring passing through the inside of the magnetic body of the multilayer substrate 2, and realize higher inductance.
　次に、図４（Ａ）は、変形例１に係る多チャンネル型ＤＣ－ＤＣコンバータの上面図であり、図４（Ｂ）は、その回路図である。図１（Ａ）および図２と共通する構成については同一の符号を付し、その説明を省略する。 Next, FIG. 4 (A) is a top view of the multi-channel DC-DC converter according to Modification 1, and FIG. 4 (B) is a circuit diagram thereof. Components that are the same as those in FIG. 1A and FIG. 2 are given the same reference numerals, and descriptions thereof are omitted.
　変形例１に係る多チャンネル型ＤＣ－ＤＣコンバータは、ビアホール導体１４Ａおよびビアホール導体１４Ｂに変えて、それぞれ端面スルーホール導体９２Ａおよび端面スルーホール導体９２Ｂを設けたものである。この場合、制御ＩＣ３Ａの電源出力端子は、インダクタ３１Ａに接続され、最終的に出力用配線５２Ａを介して出力側コンデンサ１３Ａおよび端面スルーホール導体９２Ａに接続される。また、制御ＩＣ３Ｂの電源出力端子は、インダクタ３１Ｂに接続され、最終的に出力用配線５２Ｂを介して出力側コンデンサ１３Ａおよび端面スルーホール導体９２Ｂに接続される。 The multi-channel DC-DC converter according to Modification 1 is provided with an end face through-hole conductor 92A and an end face through-hole conductor 92B in place of the via hole conductor 14A and the via hole conductor 14B, respectively. In this case, the power supply output terminal of the control IC 3A is connected to the inductor 31A, and finally connected to the output-side capacitor 13A and the end face through-hole conductor 92A via the output wiring 52A. The power output terminal of the control IC 3B is connected to the inductor 31B, and finally connected to the output-side capacitor 13A and the end face through-hole conductor 92B via the output wiring 52B.
　端面スルーホール導体９２Ａおよび端面スルーホール導体９２Ｂは、積層基板内部を積層方向に貫通した電極であるが、側面の少なくとも一部が外部に露出し、開磁路となっている。 The end face through-hole conductor 92A and the end face through-hole conductor 92B are electrodes that penetrate the laminated substrate in the laminating direction, but at least a part of the side faces are exposed to the outside and are open magnetic paths.
　よって、図４（Ｂ）に示すように、変形例１に係る多チャンネル型ＤＣ－ＤＣコンバータの場合、出力側のインダクタＬｏｕｔＡおよびインダクタＬｏｕｔＢが存在しない。この場合においても、電源入力端子３０Ａおよび電源入力端子３０Ｂ間は、インダクタＬｉｎＡおよびインダクタＬｉｎＢによって高周波的に高い抵抗で分離されているため、電圧変動が現れることはない。ただし、出力端子Ｖｏｕｔ１および出力端子Ｖｏｕｔ２の後段、つまり実装基板側においてコンデンサを設ける場合、ビアホール導体１４Ａおよびビアホール導体１４ＢによるインダクタＬｏｕｔＡおよびインダクタＬｏｕｔＢが存在すると、これらインダクタおよびコンデンサにより平滑化フィルタを構成することができるため、ノイズ抑制に寄与する。 Therefore, as shown in FIG. 4B, in the case of the multichannel DC-DC converter according to the first modification, the output side inductor LoutA and the inductor LoutB do not exist. Also in this case, since the power supply input terminal 30A and the power supply input terminal 30B are separated by the inductor LinA and the inductor LinB with high resistance in terms of high frequency, no voltage fluctuation appears. However, when a capacitor is provided at the subsequent stage of the output terminal Vout1 and the output terminal Vout2, that is, on the mounting substrate side, if the inductor LoutA and the inductor LoutB are formed by the via-hole conductor 14A and the via-hole conductor 14B, a smoothing filter is configured by these inductors and capacitors. This contributes to noise suppression.
　次に、図５（Ａ）は、変形例２に係る多チャンネル型ＤＣ－ＤＣコンバータの上面図であり、図５（Ｂ）は、その回路図である。図１（Ａ）および図２と共通する構成については同一の符号を付し、その説明を省略する。 Next, FIG. 5 (A) is a top view of a multi-channel DC-DC converter according to Modification 2, and FIG. 5 (B) is a circuit diagram thereof. Components that are the same as those in FIG. 1A and FIG. 2 are given the same reference numerals, and descriptions thereof are omitted.
　変形例２に係る多チャンネル型ＤＣ－ＤＣコンバータは、ビアホール導体１１Ｂに変えて、端面スルーホール導体９３Ｂを設けたものである。この場合、制御ＩＣ３Ｂの電源入力端子３０Ｂは、入力用配線５１Ｂを介して入力側コンデンサ１２Ｂおよび端面スルーホール導体９３Ｂに接続されている。 The multi-channel DC-DC converter according to Modification 2 is provided with an end face through-hole conductor 93B instead of the via-hole conductor 11B. In this case, the power input terminal 30B of the control IC 3B is connected to the input-side capacitor 12B and the end face through-hole conductor 93B via the input wiring 51B.
　端面スルーホール導体９３Ｂは、積層基板内部を積層方向に貫通した電極であるが、一部が外部に露出し、開磁路となっている。 The end face through-hole conductor 93B is an electrode that penetrates the inside of the laminated substrate in the laminating direction, but a part thereof is exposed to the outside and is an open magnetic circuit.
　よって、図５（Ｂ）に示すように、変形例２に係る多チャンネル型ＤＣ－ＤＣコンバータの場合、入力側のインダクタＬｉｎＢが存在しない。この場合においても、電源入力端子３０Ａおよび電源入力端子３０Ｂ間は、インダクタＬｉｎＡによって高周波的に高い抵抗で分離されているため、電圧変動が現れることはない。ただし、ビアホール導体とした場合、端面スルーホール導体よりも部品搭載面上における配線長さを短くすることができるため、配線パターンが煩雑化することがなく、素子の実装面積の増大を防止しつつ、配線抵抗による損失を低減することもできる。 Therefore, as shown in FIG. 5B, in the case of the multi-channel DC-DC converter according to the modification 2, the inductor LinB on the input side does not exist. Even in this case, the power input terminal 30A and the power input terminal 30B are separated by the inductor LinA with high resistance in terms of high frequency, so that voltage fluctuation does not appear. However, when the via-hole conductor is used, the wiring length on the component mounting surface can be made shorter than the end face through-hole conductor, so that the wiring pattern is not complicated and the increase in the mounting area of the element is prevented. In addition, loss due to wiring resistance can be reduced.
　次に、図６は、変形例３に係る多チャンネル型ＤＣ－ＤＣコンバータの回路図である。図２と共通する構成については同一の符号を付し、その説明を省略する。 Next, FIG. 6 is a circuit diagram of a multi-channel DC-DC converter according to Modification 3. Components that are the same as those in FIG. 2 are given the same reference numerals, and descriptions thereof are omitted.
　変形例３に係る多チャンネル型ＤＣ－ＤＣコンバータは、入力側コンデンサ１２Ｃ、制御ＩＣ３Ｃ、および出力側コンデンサ１３Ｃをさらに搭載し、インダクタ３１Ｃを設けた３チャンネル型のＤＣ－ＤＣコンバータである。 The multi-channel DC-DC converter according to Modification 3 is a three-channel DC-DC converter that further includes an input side capacitor 12C, a control IC 3C, and an output side capacitor 13C, and is provided with an inductor 31C.
　変形例３に係る多チャンネル型ＤＣ－ＤＣコンバータにおいて、制御ＩＣ３Ｃの電源入力端子３０Ｃは、ビアホール導体を介して上記入力端子４１に接続されているため、入力端子４１と電源入力端子３０Ｃとの間には、インダクタＬｉｎＣが介在する。そして、入力端子４１と、制御ＩＣ３Ａの電源入力端子３０Ａと、制御ＩＣ３Ｂの電源入力端子３０Ｂと、制御ＩＣ３Ｃの電源入力端子３０Ｃがそれぞれ接続されることになり、かつ電源入力端子３０Ａ、電源入力端子３０Ｂおよび電源入力端子３０Ｃは、磁性体の内部の配線を介して接続され、電源入力端子３０Ａ、電源入力端子３０Ｂおよび電源入力端子３０Ｃ間は、これらインダクタによって高周波的に高い抵抗で分離されることになる。 In the multi-channel DC-DC converter according to the modification 3, the power input terminal 30C of the control IC 3C is connected to the input terminal 41 via the via-hole conductor, and therefore between the input terminal 41 and the power input terminal 30C. The inductor LinC intervenes in. The input terminal 41, the power input terminal 30A of the control IC 3A, the power input terminal 30B of the control IC 3B, and the power input terminal 30C of the control IC 3C are connected to each other, and the power input terminal 30A and the power input terminal are connected. 30B and the power input terminal 30C are connected via an internal wiring of a magnetic body, and the power input terminal 30A, the power input terminal 30B, and the power input terminal 30C are separated by these inductors with high resistance in terms of high frequency. become.
　したがって、この変形例３に係る多チャンネル型ＤＣ－ＤＣコンバータにおいても、制御ＩＣ３Ａ、制御ＩＣ３Ｂおよび制御ＩＣ３Ｃの周波数が異なる場合であっても、その差分の周波数が電圧変動として現れることはない。 Therefore, even in the multi-channel DC-DC converter according to the third modification, even if the frequencies of the control IC 3A, the control IC 3B, and the control IC 3C are different, the difference frequency does not appear as a voltage fluctuation.
　なお、図７の変形例４に係る多チャンネル型ＤＣ－ＤＣコンバータの回路図のように、インダクタＬｉｎＣが存在しない場合であっても、電源入力端子３０Ａおよび電源入力端子３０Ｂ間は、インダクタＬｉｎＡおよびインダクタＬｉｎＢによって高周波的に高い抵抗で分離され、電源入力端子３０Ａおよび電源入力端子３０Ｃ間は、インダクタＬｉｎＡによって高周波的に高い抵抗で分離され、電源入力端子３０Ｂおよび電源入力端子３０Ｃ間は、インダクタＬｉｎＢによって高周波的に高い抵抗で分離される。 Note that, as in the circuit diagram of the multi-channel DC-DC converter according to the modification 4 of FIG. 7, even when the inductor LinC does not exist, the inductor LinA and the power input terminal 30B are not connected between the power input terminal 30A and the power input terminal 30B. The inductor LinB is separated by a high resistance in terms of high frequency, the power supply input terminal 30A and the power supply input terminal 30C are separated by a high frequency resistance by the inductor LinA, and the power supply input terminal 30B and the power supply input terminal 30C are separated by an inductor LinB. Are separated by high resistance in terms of high frequency.
　つまり、ある制御ＩＣ（第１の制御ＩＣ）の電源入力端子と、他の制御ＩＣ（第２の制御ＩＣ）の電源入力端子とが、磁性体の内部の配線を介して接続されている態様とすれば、さらに多チャンネルのＤＣ－ＤＣコンバータの場合であっても電圧変動を抑えることが可能である。 That is, a mode in which a power supply input terminal of a certain control IC (first control IC) and a power supply input terminal of another control IC (second control IC) are connected via a wiring inside the magnetic body. If so, it is possible to suppress voltage fluctuations even in the case of a multi-channel DC-DC converter.
　なお、本実施形態の多チャンネル型ＤＣ－ＤＣコンバータは、端面スルーホール導体９１を介して各電子部品を接地する構成を示したが、図８（Ａ）および図８（Ｂ）に示す変形例５に係る多チャンネル型ＤＣ－ＤＣコンバータのように、端面スルーホール導体９１は必須の構成ではない。 The multi-channel DC-DC converter of the present embodiment has a configuration in which each electronic component is grounded via the end face through-hole conductor 91. However, the modification shown in FIGS. 8A and 8B is used. As in the multi-channel DC-DC converter according to No. 5, the end face through-hole conductor 91 is not an essential configuration.
　変形例５に係る多チャンネル型ＤＣ－ＤＣコンバータは、端面スルーホール導体９１に変えて、ビアホール導体９０１を設けたものである。この場合、制御ＩＣ３Ａ、制御ＩＣ３Ｂ、入力側コンデンサ１２Ａ、入力側コンデンサ１２Ｂ、出力側コンデンサ１３Ａ、および出力側コンデンサ１３Ｂのグランド端子は、グランド用配線７１を介してビアホール導体９０１に接続され、接地される。 A multi-channel type DC-DC converter according to Modification 5 is provided with a via-hole conductor 901 instead of the end face through-hole conductor 91. In this case, the ground terminals of the control IC 3A, the control IC 3B, the input side capacitor 12A, the input side capacitor 12B, the output side capacitor 13A, and the output side capacitor 13B are connected to the via-hole conductor 901 via the ground wiring 71 and grounded. The
　ビアホール導体９０１は、磁性体が含まれる多層基板２の内部を積層方向に貫通し、かつ外部に露出しないため、図８（Ｂ）に示すようにインダクタＬＧＮＤとして機能する。この場合、インダクタＬＧＮＤによってスイッチング信号がグランドに落ちず、ノイズとして現れる可能性があるが、この場合においても、電源入力端子３０Ａおよび電源入力端子３０Ｂ間は、インダクタＬｉｎＡおよびインダクタＬｉｎＢによって高周波的に高い抵抗で分離されているため、電圧変動が現れることはない。 The via-hole conductor 901 functions as an inductor LGND as shown in FIG. 8B because it passes through the inside of the multilayer substrate 2 containing the magnetic material in the stacking direction and is not exposed to the outside. In this case, the switching signal does not fall to the ground due to the inductor LGND but may appear as noise. In this case as well, the frequency between the power input terminal 30A and the power input terminal 30B is high due to the inductor LinA and the inductor LinB. Since they are separated by resistors, voltage fluctuations do not appear.
　また、図９（Ａ）および図９（Ｂ）に示す変形例６に係る多チャンネル型ＤＣ－ＤＣコンバータのように、さらに多数のビアホール導体（この例ではビアホール導体９０１Ａ、ビアホール導体９０１Ｂ、およびビアホール導体９０１Ｃ）を設ける態様とすることも可能である。 Further, as in the multi-channel DC-DC converter according to Modification 6 shown in FIGS. 9A and 9B, a larger number of via hole conductors (in this example, via hole conductor 901A, via hole conductor 901B, and via hole). It is also possible to provide a conductor 901C).
　この場合、グランド側には、複数のインダクタが並列接続されることになるため、合成インダクタンスとしてはより低い値となり、図８の例に比べてより安定的な動作が可能になる。 In this case, since a plurality of inductors are connected in parallel on the ground side, the combined inductance becomes a lower value, and more stable operation is possible as compared with the example of FIG.
１…ＤＣ－ＤＣコンバータ
２…多層基板
３Ａ，３Ｂ…制御ＩＣ
１１Ａ，１１Ｂ…ビアホール導体
１２Ａ，１２Ｂ…入力側コンデンサ
１３Ａ，１３Ｂ…出力側コンデンサ
１４Ａ，１４Ｂ…ビアホール導体
３０Ａ，３０Ｂ…電源入力端子
３１Ａ，３１Ｂ…インダクタ
４１…入力端子
５１Ａ，５１Ｂ…入力用配線
５２Ａ，５２Ｂ…出力用配線
７１…グランド用配線
９１…端面スルーホール導体 DESCRIPTION OF SYMBOLS 1 ... DC-DC converter 2 ... Multilayer substrate 3A, 3B ... Control IC
11A, 11B ... via- hole conductors 12A, 12B ... input- side capacitors 13A, 13B ... output- side capacitors 14A, 14B ... via- hole conductors 30A, 30B ... power input terminals 31A, 31B ... inductors 41 ... input terminals 51A, 51B ... input wiring 52A , 52B ... Output wiring 71 ... Ground wiring 91 ... End face through-hole conductor

Claims (5)

  1. 　磁性体を含む多層基板と、
    　前記多層基板の内部に形成された第１のインダクタおよび第２のインダクタと、
    　前記多層基板の部品搭載面上に設けられ、前記第１のインダクタおよび第２のインダクタとそれぞれ接続される第１の制御ＩＣおよび第２の制御ＩＣと、
    　を備えた多チャンネル型ＤＣ－ＤＣコンバータであって、
    　前記多層基板の前記部品搭載面と対向する実装面に設けられた入力端子と、前記第１の制御ＩＣの電源入力端子と、前記第２の制御ＩＣの電源入力端子と、がそれぞれ接続され、前記第１の制御ＩＣの電源入力端子および前記第２の制御ＩＣの電源入力端子は、前記磁性体の内部の配線を介して接続されていることを特徴とする多チャンネル型ＤＣ－ＤＣコンバータ。     A multilayer substrate including a magnetic material;
    A first inductor and a second inductor formed inside the multilayer substrate;
    A first control IC and a second control IC which are provided on a component mounting surface of the multilayer substrate and are connected to the first inductor and the second inductor, respectively;
    A multi-channel DC-DC converter with
    An input terminal provided on a mounting surface opposite to the component mounting surface of the multilayer substrate, a power input terminal of the first control IC, and a power input terminal of the second control IC are respectively connected. The multi-channel DC-DC converter, wherein a power input terminal of the first control IC and a power input terminal of the second control IC are connected via an internal wiring of the magnetic body.
  2. 　前記実装面に設けられた第１の出力端子および前記第１の制御ＩＣの出力端子は、および前記実装面に設けられた第２の出力端子および前記第２の制御ＩＣの出力端子は、それぞれ前記磁性体の内部の配線を介して接続されていることを特徴とする請求項１に記載の多チャンネル型ＤＣ－ＤＣコンバータ。 The first output terminal provided on the mounting surface and the output terminal of the first control IC, and the second output terminal provided on the mounting surface and the output terminal of the second control IC are respectively 2. The multi-channel DC-DC converter according to claim 1, wherein the multi-channel DC-DC converter is connected via an internal wiring of the magnetic body.
  3. 　前記磁性体の内部の配線は、ビアホール導体を含むことを特徴とする請求項１または請求項２に記載の多チャンネル型ＤＣ－ＤＣコンバータ。 The multi-channel DC-DC converter according to claim 1 or 2, wherein the wiring inside the magnetic body includes a via-hole conductor.
  4. 　前記第１の制御ＩＣの電源出力端子と、前記実装面上に設けられた第１の出力端子と、の間に前記第１のインダクタを接続し、前記第２の制御ＩＣの電源出力端子と、前記実装面上に設けられた第２の出力端子と、の間に前記第２のインダクタを接続して降圧型ＤＣ－ＤＣコンバータを構成したことを特徴とする請求項１～３のいずれかに記載の多チャンネル型ＤＣ－ＤＣコンバータ。 The first inductor is connected between a power output terminal of the first control IC and a first output terminal provided on the mounting surface, and a power output terminal of the second control IC 4. The step-down DC-DC converter is configured by connecting the second inductor between a second output terminal provided on the mounting surface. The multi-channel DC-DC converter described in 1.
  5. 　前記第１の制御ＩＣの電源入力端子と、前記実装面に設けられた入力端子と、の間に前記第１のインダクタを接続し、前記第２の制御ＩＣの電源入力端子と、前記実装面に設けられた入力端子と、の間に前記第２のインダクタを接続して昇圧型ＤＣ－ＤＣコンバータを構成したことを特徴とする請求項１～３のいずれかに記載の多チャンネル型ＤＣ－ＤＣコンバータ。 The first inductor is connected between a power input terminal of the first control IC and an input terminal provided on the mounting surface, and the power input terminal of the second control IC and the mounting surface The multi-channel DC-DC converter according to any one of claims 1 to 3, wherein the step-up DC-DC converter is configured by connecting the second inductor between the input terminal and the input terminal. DC converter.
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