WO2013168711A1 - Module d'alimentation, structure de montage de borne de connexion dans un module d'alimentation et borne de connexion - Google Patents

Module d'alimentation, structure de montage de borne de connexion dans un module d'alimentation et borne de connexion Download PDF

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Publication number
WO2013168711A1
WO2013168711A1 PCT/JP2013/062852 JP2013062852W WO2013168711A1 WO 2013168711 A1 WO2013168711 A1 WO 2013168711A1 JP 2013062852 W JP2013062852 W JP 2013062852W WO 2013168711 A1 WO2013168711 A1 WO 2013168711A1
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Prior art keywords
connection terminal
holding member
power module
substrate
tightly wound
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PCT/JP2013/062852
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English (en)
Japanese (ja)
Inventor
貴広 藤井
潤 冨永
浩嗣 石川
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日本発條株式会社
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Publication of WO2013168711A1 publication Critical patent/WO2013168711A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

Definitions

  • the present invention relates to a power module including a semiconductor element for power control, a connection terminal mounting structure and a connection terminal in the power module.
  • a power module including a power control semiconductor element is known as a key device for energy saving used in a wide range of fields from power control to motor control for industrial and automobile use.
  • the power module includes a substrate on which a plurality of semiconductor elements are mounted, and a plurality of connection terminals that are connected to the respective semiconductor elements and input / output power.
  • connection terminal In the power module, it is required for the connection terminal to ensure electrical continuity between the external circuit board and the power module board.
  • a first contact device that forms a pin shape and contacts an electrode of a substrate
  • a second contact device that forms a curved shape and contacts an external control circuit substrate
  • a coil spring shape A connection terminal including an elastic portion provided between the first contact device and the second contact device is disclosed. The connection terminal having such a configuration is inserted and held in a hole formed in the housing of the power module.
  • connection terminal since the connection terminal is not completely fixed to the housing, it does not come out of the board unless a control circuit board is attached to generate a compressive force. There was a problem that it was easy.
  • the present invention has been made in view of the above, and a power module that can prevent a connection terminal from coming off from a substrate and can stably maintain a good contact state, a connection terminal mounting structure in the power module, and a connection terminal
  • the purpose is to provide.
  • the power module according to the present invention has a substrate on which a semiconductor element is mounted, a coil spring formed by winding a wire in a spiral shape, and contacts an external circuit. And a conductive connection terminal for electrically connecting the circuit and the substrate, and a conductive material which is bonded to the surface of the substrate and has a column shape extending in a direction perpendicular to the surface, and holds the connection terminal.
  • the connecting terminal, and the connection terminal is tightly wound around the wire, and is at least partially in contact with the holding member and held by the holding member, and is rougher than the tightly wound portion. And a coarsely wound portion around which the wire is wound at a pitch.
  • the power module according to the present invention is characterized in that, in the above invention, the holding member is formed with a hollow portion for holding the tightly wound portion.
  • the power module according to the present invention is characterized in that, in the above-mentioned invention, the holding member is provided on an inner peripheral surface facing the hollow portion, and has a retaining means for retaining the connection terminal.
  • the retaining means is a recess provided in the inner peripheral surface, and the tightly wound portion is fitted with the recessed portion, It has the flange part whose diameter is larger than a part, It is characterized by the above-mentioned.
  • the power module according to the present invention is characterized in that, in the above invention, the retaining means is a projecting portion projecting from the inner peripheral surface.
  • the power module according to the present invention is characterized in that, in the above invention, the connection terminal is press-fitted into an outer peripheral surface of the holding member.
  • the power module according to the present invention is characterized in that, in the above invention, the power module has a retaining means that is provided on an outer peripheral surface of the retaining member and retains the connecting terminal while retaining the connecting terminal.
  • the retaining means is a notch part in which a part of the outer peripheral surface is notched, and the tightly wound part is fitted to the notch part, It has the small diameter part whose diameter is smaller than the other part of a winding part, It is characterized by the above-mentioned.
  • a mounting structure of a connection terminal in a power module includes a semiconductor element, a substrate on which the semiconductor element is mounted, and a conductive connection terminal that electrically connects an external circuit and the substrate.
  • a connection structure for a connection terminal in a power module comprising a columnar shape bonded to the surface of the substrate and extending in a direction perpendicular to the surface, and having a conductive holding member for holding the connection terminal, The wire is tightly wound in a spiral shape, at least part of the wire is in contact with the holding member and held by the holding member, and the wire is wound in a spiral shape at a pitch coarser than the tightly wound portion. And a coarsely wound portion.
  • connection terminal in the power module according to the present invention is characterized in that, in the above invention, the holding member is formed with a hollow portion for holding the tightly wound portion.
  • connection terminal in the power module according to the present invention is characterized in that, in the above invention, the connection terminal is press-fitted into an outer peripheral surface of the holding member.
  • a connection terminal includes a semiconductor element, a substrate on which the semiconductor element is mounted, and a conductive holding member that is joined to the surface of the substrate and has a columnar shape extending in a direction orthogonal to the surface.
  • a conductive connection terminal that is part of a power module and is electrically connected to an external circuit and the substrate by being held by the holding member, and the wire is tightly wound in a spiral shape.
  • a tightly wound portion that is held by the holding member in contact with the holding member, and a coarsely wound portion in which the wire is wound spirally at a pitch that is coarser than the tightly wound portion.
  • a coil spring shape in which a wire is wound in a spiral shape is formed, and a conductive connection terminal that electrically connects the circuit and the substrate by contact with an external circuit, and a surface of the substrate. And a conductive holding member that holds the connection terminal.
  • the connection terminal has a wire rod tightly wound, and at least part of the connection terminal is in contact with the holding member. Since the contact winding portion held by the holding member and the rough winding portion around which the wire is wound at a coarser pitch than the contact winding portion, the connection terminal is removed from the substrate by the contact between the contact winding portion and the holding member. It is difficult to come off and a good contact state can be stably maintained.
  • FIG. 1 is a perspective view showing a configuration of a power module according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional view showing a configuration of a main part of the power module according to Embodiment 1 of the present invention.
  • FIG. 3 is a cross-sectional view showing the configuration of the main part of the power module according to Embodiment 2 of the present invention.
  • FIG. 4 is a cross-sectional view showing the configuration of the main part of the power module according to Embodiment 3 of the present invention.
  • FIG. 5 is a cross-sectional view showing the configuration of the main part of the power module according to Embodiment 4 of the present invention.
  • FIG. 6 is a cross-sectional view showing a configuration of a main part of a power module according to Embodiment 5 of the present invention.
  • FIG. 1 is a perspective view showing a configuration of a power module according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional view showing a configuration of a main part of the power module according to the first embodiment.
  • the power module 1 shown in FIG. 1 and FIG. 2 has a conductive property that electrically connects a substrate 2 on which a plurality of semiconductor elements are mounted and an external circuit, thereby electrically connecting the circuit and the substrate 2.
  • a conductive holding member 4 that holds the connection terminal 3 in a columnar shape that is joined to the surface of the substrate 2 and extends in a direction orthogonal to the surface.
  • the substrate 2 includes a plate-like base material 5 made of an insulating material such as an insulating resin or ceramics, a plurality of semiconductor elements 6 mounted on the main surface of the base material 5, and the base material 5. It has the some electrode 7 provided in a main surface, and the wire 8 which electrically connects the semiconductor element 6 and the electrode 7.
  • Ceramics constituting the base material 5 include nitride ceramics such as aluminum nitride and silicon nitride, and oxide ceramics such as alumina, magnesia, zirconia, steatite, forsterite, mullite, titania, silica, and sialon. Can be applied. Among these, nitride ceramics are preferable from the viewpoint of durability, thermal conductivity, and the like.
  • the semiconductor element 6 is any one of power devices such as a diode, a transistor, and an IGBT (insulated gate bipolar transistor). In FIG. 1, all semiconductor elements are described as “semiconductor elements 6”, but these semiconductor elements 6 may be of different types.
  • the semiconductor element 6 is bonded onto the substrate 2 by solder.
  • the electrode 7 forms a part of a circuit pattern for transmitting an electric signal to the semiconductor element 6 or the like mounted on the substrate 2 by patterning using a metal or alloy such as copper or aluminum.
  • connection terminal 3 is a coil spring in which a wire is wound in a spiral shape, the wire is tightly wound, and is tightly wound around the hollow portion 41 of the holding member 4 and tightly fixed to the holding member 4.
  • a wire rod is wound at a pitch that is coarser than that of the winding portion 31, and has a rough winding portion 32 that comes into contact with an external control circuit board (not shown) at the tip.
  • the outer diameter of the connection terminal 3 is slightly larger than the diameter of the hollow portion 41.
  • the connection terminal 3 having the above configuration is configured using a metal or an alloy.
  • the connection terminal 3 is configured using, for example, a copper alloy such as phosphor bronze, chrome copper, beryllium copper, or Corson copper.
  • the holding member 4 is erected in a direction perpendicular to the surface of the electrode 7 of the substrate 2 and is made of a metal or alloy having a hollow cylindrical shape.
  • the holding member 4 holds the tightly wound portion 31 of the connection terminal 3 in a close contact state with a hollow portion 41 formed in a cylindrical shape.
  • the holding member 4 is joined to the electrode 7 with solder or the like.
  • connection terminal 3 When fixing the connection terminal 3 to the holding member 4, the inner circumferential surface of the holding member 4 is scraped to expose the new surface, and then the tightly wound portion 31 is twisted in a direction in which the outer diameter of the tightly wound portion 31 is reduced. Insert into the hollow part 41 in a state and press fit. Thereby, the attachment structure of the connection terminal 3 in the power module 1 is implement
  • a coil spring is formed by winding a wire in a spiral shape, and the conductive and electrically connected circuit and substrate are brought into contact with an external circuit.
  • a connection terminal and a conductive holding member that is bonded to the surface of the substrate and extends in a direction perpendicular to the surface, and holds the connection terminal.
  • the contact portion is in contact with the holding member and the tightly wound portion held by the holding member, and the coarsely wound portion around which the wire is wound at a pitch coarser than the tightly wound portion. Due to this contact, the connection terminal is unlikely to be detached from the substrate, and a good contact state can be stably maintained.
  • connection terminal it is only necessary to press-fit the connection terminal into the hollow portion of the holding member, so that the connection terminal can be easily replaced.
  • FIG. 3 is a cross-sectional view showing the configuration of the main part of the power module according to Embodiment 2 of the present invention.
  • the power module 9 shown in the figure is bonded to the surface of the substrate 2, the conductive connection terminal 10 for electrically connecting the external circuit and the substrate 2, and extends in a direction perpendicular to the surface.
  • a conductive holding member 11 that has a columnar shape and holds the connection terminal 10.
  • connection terminal 10 is a coil spring, and has a tightly wound portion 101 that is press-fitted into the outer peripheral portion of the holding member 11 and fixed in close contact, and a coarsely wound portion 102 that comes into contact with the control circuit board at the tip.
  • the inner diameter of the connection terminal 10 is slightly smaller than the diameter of the holding member 11.
  • the connection terminal 10 is configured using the same material as that of the connection terminal 3.
  • the holding member 11 is erected in a direction orthogonal to the surface of the electrode 7 of the substrate 2 and is made of a columnar metal or alloy.
  • the holding member 11 holds the tightly wound portion 101 of the connection terminal 10 in a close contact state at the outer peripheral portion.
  • the holding member 11 is joined to the electrode 7 with solder or the like.
  • connection terminal 10 When fixing the connection terminal 10 to the holding member 11, the outer peripheral surface of the holding member 11 is shaved to expose the new surface, and then the tightly wound portion 101 is twisted in the direction in which the inner diameter of the tightly wound portion 101 is enlarged. Press fit into the holding member 11. Thereby, the attachment structure of the connection terminal 10 in the power module 9 is implement
  • connection terminals are unlikely to be detached from the substrate, and a good contact state can be stably maintained.
  • connection terminals can be easily replaced.
  • connection terminal since the connection terminal is press-fitted into the outer peripheral side of the holding member, the diameter of the connection terminal can be increased as compared with the case of press-fitting into the inner peripheral side. Therefore, it is easy to form the connection terminal, and it is easy to insert it into the holding member.
  • the holding member may have a hollow cylindrical shape.
  • FIG. 4 is a cross-sectional view showing the configuration of the main part of the power module according to Embodiment 3 of the present invention.
  • the power module 12 shown in the figure is bonded to the surface of the substrate 2, the conductive connection terminal 13 that electrically connects the external circuit and the substrate 2, and extends in a direction perpendicular to the surface.
  • a conductive holding member 14 that has a columnar shape and holds the connection terminal 13.
  • connection terminal 13 is a coil spring, and has a tightly wound portion 131 that is press-fitted into the holding member 14 and fixed in close contact, and a coarsely wound portion 132 that contacts the control circuit board at the tip.
  • the connection terminal 13 is configured using the same material as the connection terminal 3.
  • the tightly wound portion 131 is connected to the coarsely wound portion 132, and a taper portion 131a whose diameter gradually decreases as the distance from the coarsely wound portion 132 is increased.
  • a flange portion 131c is provided at an intermediate portion of the small-diameter portion 131b and returns to the same diameter as the small-diameter portion 131b after the diameter gradually increases along the longitudinal direction.
  • the holding member 14 is erected in a direction perpendicular to the surface of the electrode 7 of the substrate 2 and is made of a cylindrical metal or alloy in which a hollow portion 141 is formed.
  • a concave portion 142 formed in the outer peripheral side of the holding member 14 is formed on the inner peripheral surface facing the substantially central portion in the height direction of the hollow portion 141.
  • the concave portion 142 has a shape that substantially coincides with the outer peripheral surface of the flange portion 131c, and prevents the connection terminal 13 from coming off from the holding member 14 by fitting with the flange portion 131c.
  • the maximum diameter of the recess 142 is slightly smaller than the maximum diameter of the flange portion 131c.
  • connection terminal 13 When fixing the connection terminal 13 to the holding member 14, the inner peripheral surface of the holding member 14 is scraped to expose the new surface, and then the tightly wound portion 131 is twisted in a direction in which the outer diameter of the tightly wound portion 131 decreases. In the state, it inserts in the hollow part 141, and it press-fits so that the flange part 131c may fit with the recessed part 142. FIG. Thereby, the attachment structure of the connection terminal 13 in the power module 12 is implement
  • connection terminals are not easily detached from the substrate, and a good contact state can be stably maintained.
  • a concave portion as a retaining means is formed on the inner peripheral surface of the holding member, while the connecting terminal is provided with a flange portion that can be fitted to the concave portion. It becomes difficult to come off.
  • FIG. 5 is a cross-sectional view showing the configuration of the main part of the power module according to Embodiment 4 of the present invention.
  • the power module 15 shown in the figure is bonded to the surface of the substrate 2, the conductive connection terminal 16 that electrically connects the external circuit and the substrate 2, and extends in a direction perpendicular to the surface.
  • a conductive holding member 17 that has a columnar shape and holds the connection terminal 16.
  • connection terminal 16 is a coil spring, and has a tightly wound portion 161 that is press-fitted into the holding member 17 and fixed in close contact, and a coarsely wound portion 162 that contacts the control circuit board at the tip.
  • the connection terminal 16 is configured using the same material as the connection terminal 3.
  • the tightly wound portion 161 is connected to the coarsely wound portion 162, and a tapered portion 161a whose diameter gradually decreases as the distance from the coarsely wound portion 162 is increased, and a small diameter portion 161b that is connected to an end portion having the minimum diameter of the tapered portion 161a.
  • the holding member 17 is made of a cylindrical metal or alloy that is erected in a direction orthogonal to the surface of the electrode 7 of the substrate 2 and in which a columnar hollow portion 171 is formed.
  • a projecting portion 172 is formed at a substantially central portion in the height direction of the hollow portion 171 and has a spiral shape along the winding direction of the small diameter portion 161b and projects from the inner peripheral surface toward the hollow portion 171.
  • the protruding portion 172 enters between adjacent wires of the tightly wound portion 161 and prevents the connection terminal 16 from coming off from the holding member 17.
  • the diameter of the hollow portion 171 is slightly smaller than the outer diameter of the small diameter portion 161b.
  • connection terminal 16 When fixing the connection terminal 16 to the holding member 17, the inner peripheral surface of the holding member 17 is scraped to expose the new surface, and then the tightly wound portion 161 is twisted in a direction in which the outer diameter of the tightly wound portion 161 is reduced. In this state, it is press-fitted into the hollow portion 171 while rotating around the central axis. At the time of this press-fitting, the small diameter portion 161 b gets over the projection 172 by a predetermined length and enters the hollow portion 171. Thereby, the attachment structure of the connection terminal 16 in the power module 15 is implement
  • connection terminals are unlikely to be detached from the substrate, and a good contact state can be stably maintained.
  • the connection terminal since the protrusion as the retaining means is formed on the inner peripheral surface of the holding member, the connection terminal is more difficult to come off.
  • FIG. 6 is a cross-sectional view showing a configuration of a main part of a power module according to Embodiment 5 of the present invention.
  • the power module 18 shown in the figure is bonded to the surface of the substrate 2, the conductive connection terminals 19 that electrically connect the external circuit and the substrate 2, and extends in a direction perpendicular to the surface.
  • a conductive holding member 20 that has a columnar shape and holds the connection terminal 19.
  • connection terminal 19 is a coil spring, and has a tightly wound portion 191 that is press-fitted into the outer peripheral portion of the holding member 20 and is firmly fixed, and a coarsely wound portion 192 that contacts the control circuit board at the tip.
  • the connection terminal 19 is configured using the same material as that of the connection terminal 3.
  • the tightly wound portion 191 includes a connecting portion 191a that is connected to the rough winding portion 192, and a small-diameter portion 191b that is connected to the end of the connecting portion 191a and has a smaller diameter than the connecting portion 191a.
  • the holding member 20 is erected in a direction orthogonal to the surface of the electrode 7 of the substrate 2 and is made of a substantially columnar metal or alloy.
  • the holding member 20 holds the connection terminal 19 in close contact with the outer peripheral portion.
  • the holding member 20 is joined to the electrode 7 with solder or the like.
  • a notch 201 having a diameter smaller than that of the other part is formed on the outer peripheral surface of the holding member 20 and joined to the electrode 7.
  • the notch 201 keeps the connection terminal 19 from coming off from the holding member 20 by being in close contact with the small-diameter portion 191b of the tightly wound portion 191.
  • the holding member 20 is joined to the electrode 7 with solder or the like.
  • connection terminal 19 When fixing the connection terminal 19 to the holding member 20, the outer peripheral surface of the holding member 20 is shaved to expose the new surface, and then the tightly wound portion 191 is twisted in the direction in which the inner diameter of the tightly wound portion 191 is enlarged.
  • the holding member 20 is press-fitted into the outer peripheral surface, and the small-diameter portion 191b is fitted into the notch portion 201 to be closely fixed. Thereby, the attachment structure of the connection terminal 19 in the power module 18 is realized.
  • connection terminals are not easily detached from the substrate, and a good contact state can be stably maintained.
  • the connection terminal since the notch portion as the retaining means is formed on the outer peripheral surface of the holding member, the connection terminal is more difficult to come off.
  • connection terminal since the connection terminal is press-fitted into the outer peripheral side of the holding member, the diameter of the connection terminal can be increased. Therefore, it is easy to form the connection terminal, and it is easy to insert the connection terminal into the holding member.
  • the holding member may have a hollow cylindrical shape.
  • the notch portion of the holding member can be formed at an arbitrary position of the holding member.
  • the small diameter portion of the connection terminal is provided according to the formation position of the notch.
  • the diameters of the connection terminal and the holding member may be changed for the control signal and the current.
  • the diameters of the connection terminal for current and the holding member through which a large current flows may be larger than the diameters of the connection terminal for control signal and the holding member that require a relatively small current.
  • the holding member may have a prismatic shape or a hollow prismatic shape.
  • the surface of the substrate may be sealed with resin up to the height of the holding member.
  • a resin for example, an epoxy resin filled with silica powder as a filler can be used.
  • connection terminal holder may be provided which is formed using an insulating material such as a resin such as silicon or a machinable ceramic and is attached to a substrate and individually accommodates a plurality of connection terminals.
  • the present invention can include various embodiments not described herein, and various design changes and the like can be made without departing from the technical idea specified by the claims. It is possible to apply.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

La présente invention concerne un module d'alimentation doté : d'un substrat sur lequel un élément semi-conducteur doit être monté ; d'une borne de connexion électriquement conductrice qui est réalisée avec une forme de ressort hélicoïdal à partir d'un matériau de fil métallique enroulé en spirale, et qui, en établissant un contact avec un circuit externe, connecte électriquement le circuit et le substrat ; et d'un élément de maintien électriquement conducteur qui est lié à la surface avant du substrat, réalisé avec une forme de colonne s'étendant dans une direction orthogonale à la surface avant et qui maintient la borne de connexion. Selon l'invention, la borne de connexion comprend : une section d'enroulement serré dans laquelle le matériau de fil métallique est enroulé de manière serrée, et dans laquelle au moins une partie de celui-ci contacte l'élément de maintien et est maintenue par l'élément de maintien ; et une section d'enroulement grossier dans laquelle le matériau de fil métallique est enroulé suivant un pas plus grossier que dans la section d'enroulement serré.
PCT/JP2013/062852 2012-05-10 2013-05-07 Module d'alimentation, structure de montage de borne de connexion dans un module d'alimentation et borne de connexion WO2013168711A1 (fr)

Applications Claiming Priority (2)

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JP2012-108676 2012-05-10
JP2012108676A JP2013236015A (ja) 2012-05-10 2012-05-10 パワーモジュール、パワーモジュールにおける接続端子の取付構造および接続端子

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WO2013168711A1 true WO2013168711A1 (fr) 2013-11-14

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EP2903024A1 (fr) * 2014-01-31 2015-08-05 Vincotech GmbH Élément de contact, module semi-conducteur de puissance et son procédé de fabrication
DE102018123995A1 (de) * 2018-09-28 2020-04-02 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiereinrichtung zum elektrischen Kontaktieren einer Leiterplatte mit einem Spulenkörper für ein Magnetventil für eine Bremseinrichtung für ein Fahrzeug, Magnetventil mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung
DE102018123994A1 (de) * 2018-09-28 2020-04-02 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiervorrichtung zum federbaren Kontaktieren einer Platine mit einem Kontaktelement für eine Magnetspule oder einen Sensor für ein Fahrzeugsystem, Fahrzeugsystem mit einer Kontaktiervorrichtung und Verfahren zum Herstellen einer Kontaktiervorrichtung
DE102018123993A1 (de) * 2018-09-28 2020-04-02 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiereinrichtung zum elektrischen Kontaktieren einer Stromführungseinrichtung mit einem Modul für ein Fahrzeugsystem für ein Fahrzeug, Kontaktvorrichtung mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung
WO2022177617A1 (fr) * 2021-02-22 2022-08-25 United Silicon Carbide, Inc. Ensemble de pile de puces à double face avec de multiples connexions supérieures

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JPWO2015020176A1 (ja) * 2013-08-09 2017-03-02 日本発條株式会社 通電ユニット
JP7166471B2 (ja) * 2019-10-29 2022-11-07 三菱電機株式会社 半導体装置、電力変換装置、および半導体装置の製造方法

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WO2008090734A1 (fr) * 2007-01-22 2008-07-31 Mitsubishi Electric Corporation Dispositif semi-conducteur pour énergie
JP2009038005A (ja) * 2007-07-06 2009-02-19 Kitagawa Ind Co Ltd 表面実装コンタクト
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EP2903024A1 (fr) * 2014-01-31 2015-08-05 Vincotech GmbH Élément de contact, module semi-conducteur de puissance et son procédé de fabrication
CN104966710A (zh) * 2014-01-31 2015-10-07 文科泰克(德国)有限责任公司 接触元件、功率半导体模块及其制造方法
DE102018123995A1 (de) * 2018-09-28 2020-04-02 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiereinrichtung zum elektrischen Kontaktieren einer Leiterplatte mit einem Spulenkörper für ein Magnetventil für eine Bremseinrichtung für ein Fahrzeug, Magnetventil mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung
DE102018123994A1 (de) * 2018-09-28 2020-04-02 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiervorrichtung zum federbaren Kontaktieren einer Platine mit einem Kontaktelement für eine Magnetspule oder einen Sensor für ein Fahrzeugsystem, Fahrzeugsystem mit einer Kontaktiervorrichtung und Verfahren zum Herstellen einer Kontaktiervorrichtung
DE102018123993A1 (de) * 2018-09-28 2020-04-02 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiereinrichtung zum elektrischen Kontaktieren einer Stromführungseinrichtung mit einem Modul für ein Fahrzeugsystem für ein Fahrzeug, Kontaktvorrichtung mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung
CN112789769A (zh) * 2018-09-28 2021-05-11 克诺尔商用车制动系统有限公司 用于使电路板与用于车辆制动装置的电磁阀的线圈体电接触的接触装置、具有接触装置的电磁阀和用于制造接触装置的方法
DE102018123994B4 (de) 2018-09-28 2022-05-25 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiervorrichtung zum federbaren Kontaktieren einer Platine mit einem Kontaktelement für eine Magnetspule oder einen Sensor für ein Fahrzeugsystem, Fahrzeugsystem mit einer Kontaktiervorrichtung und Verfahren zum Herstellen einer Kontaktiervorrichtung
DE102018123993B4 (de) 2018-09-28 2022-05-25 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiereinrichtung zum elektrischen Kontaktieren einer Stromführungseinrichtung mit einem Modul für ein Fahrzeugsystem für ein Fahrzeug, Kontaktvorrichtung mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung
US11715894B2 (en) 2018-09-28 2023-08-01 Knorr-Bremse Systeme Fuer Nutzfahrzeuge Gmbh Contacting device for the resilient contacting of a printed circuit board with a contact element for a solenoid or a sensor for a vehicle system, vehicle system with a contacting device and method for producing a contacting device
US11837807B2 (en) 2018-09-28 2023-12-05 Knorr-Bremse Systeme Fuer Nutzfahrzeuge Gmbh Contact-making device for making electrical contact with a printed circuit board by a coil former for a solenoid valve for a brake device for a vehicle, solenoid valve comprising a contact-making device and method for producing a contact-making device
WO2022177617A1 (fr) * 2021-02-22 2022-08-25 United Silicon Carbide, Inc. Ensemble de pile de puces à double face avec de multiples connexions supérieures

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TW201405769A (zh) 2014-02-01

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