WO2013153953A1

WO2013153953A1 - Device for applying adhesive film, method for applying adhesive film, and connection structure

Info

Publication number: WO2013153953A1
Application number: PCT/JP2013/059098
Authority: WO
Inventors: 美佐夫小西
Original assignee: デクセリアルズ株式会社
Priority date: 2012-04-12
Filing date: 2013-03-27
Publication date: 2013-10-17
Also published as: JP5996241B2; CN104203786A; KR20160091444A; JP2013216833A; KR20140124848A

Abstract

A device for applying an adhesive film, the device being provided with: a conveyance mechanism for conveying an adhesive film tape with a base film and an adhesive layer supported on the base film; a support section for supporting an application object on which the adhesive layer is to be applied; a head, which is provided facing the support section and presses the adhesive film that has been conveyed above the application object onto the application object to apply the adhesive layer on the application object; and a removing member, which is provided on the downstream side of the support section and the head in the direction of adhesive film conveyance and removes adhesive film layer remaining on the base film.

Description

Adhesive film sticking device, adhesive film sticking method, and connection structure

The present invention relates to a bonding apparatus for bonding a tape-shaped adhesive film to an object to be bonded, and in particular, an adhesive film bonding apparatus, an adhesive film bonding method, and a connection that have been improved in the adhesive film transport process. Concerning the structure.

Conventionally, a mounting method has been used in which an electronic component is mounted on an object to be connected such as a glass substrate using an adhesive film. For example, a COG (Chip on Glass) mounting method in which an IC chip that is a liquid crystal driving circuit is mounted on the periphery of a liquid crystal display panel (LCD panel) via a conductive adhesive film, or a tab that serves as an interconnector in a solar cell The connection method which connects a line is mentioned.

The conductive adhesive film 50 is obtained by forming an adhesive layer 50a in which conductive particles are dispersed in a binder resin on a base film 50b serving as a support. Such a conductive adhesive film 50 is used in the form of a film wound body wound around a core 53 of a reel member 51 having a pair of reel flanges 52 as shown in FIG. , See Patent Document 1).

As shown in FIG. 8A, the conductive adhesive film 50 unwound from the reel member 51 is conveyed onto a support base 56 on which a connection object 55 such as a glass substrate is supported while being guided by a plurality of guide rollers 54. Then, the adhesive layer 50 a side is temporarily attached to the terminal electrode region formed on the connection object 55. At this time, the conductive adhesive film 50 is provided on the support base 56 so as to be movable up and down, and is heated from the base film 50b side at a predetermined pressure and a predetermined time by a heating and pressing head 57 heated to a predetermined temperature. Pressed. Thereby, as for the electroconductive adhesive film 50, the adhesive bond layer 50a peels from the base film 50b, and it sticks on the connection target object 55 side (for example, refer patent document 2).

Next, as shown in FIG. 8B, when the heating and pressing head 57 is separated from the conductive adhesive film 50, the base film 50b from which the adhesive layer 50a has been peeled is sandwiched between a pair of chucking pieces 58. By being pulled by 58, it is conveyed downstream by a predetermined length. As a result, as shown in FIG. 8C, a new conductive adhesive film 50 is transported to the support base 56 and used for sticking to the connection object 55.

JP 2001-171033 A JP 2010-114301 A

By the way, due to the recent demand for adhesion to the conductive adhesive film 50 at a low temperature and low pressure, the temperature and pressure for temporarily attaching the conductive adhesive film 50 are also required to be further reduced in temperature and pressure.
However, if temporary bonding is performed at a low temperature, the adhesive layer 50a of the conductive adhesive film 50 may not be sufficiently peeled off from the base film 50b, and an error in sticking to the connection object 55 may occur.

As shown in FIG. 9, when the base film 50b is sandwiched between the chucking pieces 58 with the adhesive layer 50a remaining, the binder resin of the adhesive layer 50a adheres to the chucking pieces 58. An error occurs when the base film 50b is sandwiched and conveyed. For this reason, there may be a large time loss in processes such as COG mounting, such as once stopping the production line and removing the binder resin adhering to the chucking piece 58.

This invention makes it a subject to solve the said various problems in the past and to achieve the following objectives. That is, according to the present invention, even when the adhesive layer of the adhesive film is not sufficiently peeled from the base film and a sticking error occurs, the subsequent temporary sticking process can be continued without stopping the production line. An object of the present invention is to provide an adhesive film sticking apparatus, an adhesive film sticking method, and a connection structure manufactured thereby.

Means for solving the problems are as follows. That is,
<1> A transport mechanism for transporting a tape-like adhesive film having a base film and an adhesive layer supported on the base film;
A support part for supporting an object to be adhered to which the adhesive layer is adhered;
A head that is provided facing the support portion and presses the adhesive film conveyed onto the sticking object against the sticking object, and causes the adhesive layer to stick to the sticking object. When,
It is an adhesive film sticking device provided with the removal member which removes the adhesive layer which is provided in the conveyance direction of the adhesive film rather than the support part and the head, and which remains on the base film.
<2> The adhesive film sticking apparatus according to <1>, wherein the removal member is an adhesive tape.
<3> The adhesive film sticking apparatus according to <1>, wherein the removal member is a roll.
<4> The transport mechanism includes a plurality of guide rollers that guide the adhesive film, and chucking pieces that sandwich and pull the base film from which the adhesive layer has been peeled. > An adhesive film sticking apparatus according to any one of the above.
<5> After the adhesive film has been transported onto the object to be adhered, the adhesive film according to any one of <1> to <4>, including a cut mechanism that half-cuts the adhesive layer side. Landing gear.
<6> From the above <1>, the adhesive film is a conductive adhesive film in which conductive particles are dispersed in the adhesive layer, or an insulating adhesive film in which conductive particles are not contained in the adhesive layer. <4> An adhesive film sticking apparatus according to any one of the above.
<7> A transporting step of transporting a tape-like adhesive film having a base film and an adhesive layer supported on the base film onto an object to be bonded supported by a support part by a transport mechanism;
A sticking step of pressing the adhesive layer against the sticking object, and sticking the adhesive layer to the sticking object, by a head provided facing the support part;
A downstream transport step of transporting the base film to the downstream side in the transport direction of the adhesive film from the support and the head by the transport mechanism;
In the downstream conveying step, an adhesive film sticking method for removing the adhesive layer remaining on the base film by a removing member at a downstream side of the supporting portion and the head in the conveying direction of the adhesive film. is there.
<8> The method for attaching an adhesive film according to <7>, wherein the removing member is an adhesive tape.
<9> The adhesive film sticking method according to <7>, wherein the removing member is a roll.
<10> From the above <7> to <9, the transport mechanism includes a plurality of guide rollers that guide the adhesive film, and a chucking piece that sandwiches and pulls the base film from which the adhesive layer has been peeled off. > An adhesive film sticking method according to any one of the above.
<11> A connection structure manufactured using the adhesive film sticking method according to any one of <7> to <10>.

According to the present invention, the above-described problems can be solved, the adhesive layer does not remain on the base film, and the adhesive layer does not adhere to the transport mechanism. Therefore, an error does not occur when the base film is sandwiched or pulled by the adhesive layer, and time loss due to the stop of the production line can be prevented.

FIG. 1 is a side view showing an example of a sticking apparatus to which the present invention is applied. FIG. 2 is a cross-sectional view showing an example of the configuration of the adhesive film. FIG. 3 is a side view showing another example of another sticking apparatus to which the present invention is applied. FIG. 4A is a side view showing a sticking process by an example sticking apparatus to which the present invention is applied, and is a side view showing a process of heat-pressing an adhesive film. FIG. 4B is a side view showing a sticking process by an example sticking apparatus to which the present invention is applied, and is a side view showing a state where an adhesive layer of an adhesive film is stuck to a substrate. FIG. 4C is a side view showing a sticking process by an example sticking apparatus to which the present invention is applied. The base film is sandwiched and pulled by a chucking piece and is removed onto the base film by a removing member (adhesive tape). It is a side view which shows the state which removes the remaining binder. FIG. 5A is a side view showing a sticking process by an example sticking apparatus to which the present invention is applied, and is a side view showing a process of heat-pressing an adhesive film. FIG. 5B is a side view showing a sticking process by an example sticking apparatus to which the present invention is applied, and is a side view showing a state where an adhesive layer of an adhesive film is stuck to a substrate. FIG. 5C is a side view showing a sticking process by an example sticking apparatus to which the present invention is applied. The base film is sandwiched and pulled by a chucking piece and remains on the base film by a removing member (roll). It is a side view which shows the state which removes the binder to perform. FIG. 6A is a side view showing a sticking process by an example sticking apparatus to which the present invention is applied, and is a side view showing a process of heat-pressing an adhesive film. FIG. 6B is a side view showing a sticking process by an example sticking apparatus to which the present invention is applied, and is a side view showing a state where an adhesive layer of an adhesive film is stuck to a substrate. FIG. 6C is a side view showing a sticking process by an example sticking apparatus to which the present invention is applied. The base film is sandwiched and pulled by a chucking piece and remains on the base film by a removing member (roll). It is a side view which shows the state which removes the binder to perform. FIG. 7 is a perspective view showing a reel member around which an adhesive film is wound. FIG. 8A is a side view showing a sticking process by a conventional sticking apparatus, and is a side view showing a process of heat-pressing an adhesive film. FIG. 8B is a side view showing a sticking process by a conventional sticking apparatus, and is a side view showing a state where an adhesive layer of an adhesive film is stuck to a substrate. FIG. 8C is a side view showing a sticking process by a conventional sticking apparatus, and is a side view showing a state in which the base film is sandwiched and pulled by a chucking piece. FIG. 9 is a side view showing a state in which a conventional sticking apparatus is held and pulled by a chucking piece while an adhesive layer remains on the base film due to a temporary sticking failure.

Hereinafter, an adhesive film sticking apparatus to which the present invention is applied, an adhesive film sticking method, and a connection structure manufactured thereby will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

The attachment device 1 for the adhesive film 20 to which the present invention is applied is preliminarily applied to an object to be attached when an electronic component such as an IC chip or a flexible substrate is mounted on an object to be attached such as a glass substrate or a printed wiring board. An adhesive film 20 such as an anisotropic conductive adhesive film (ACF) is temporarily attached on the provided terminal electrode. Below, the board | substrates 10, such as a glass substrate and a printed wiring board, are demonstrated to an example as a sticking target object.

As shown in FIG. 1, the sticking apparatus 1 includes a transport mechanism 2 that transports a tape-like adhesive film 20, a support base 3 that supports a substrate 10 to which an adhesive layer 21 is pasted, and a support base 3. The heating press head 4 that presses the adhesive film 20 conveyed on the substrate 10 against the substrate 10 and attaches the adhesive layer to the substrate 10, the support base 3, and the heating press head 4. The removal member 5 is provided further on the downstream side in the transport direction of the adhesive film 20 and removes the adhesive layer 21 remaining on the base film 22. In addition, as shown in FIG. 2, the adhesive film 20 temporarily attached by the sticking apparatus 1 includes an adhesive layer 21 made of a binder (insulating adhesive composition) 21a containing conductive particles 23 and an adhesive. And a base film 22 serving as a support for supporting the layer 21. The adhesive film 20 will be described in detail later.

[Supporting part / Heat pressing head]
The support base 3 supports the substrate 10 to which the adhesive film 20 is temporarily attached. The support 3 is provided with a positioning mechanism (not shown) for positioning the substrate 10. The support 3 is supported by an XY stage and can align the terminal electrodes of the substrate 10 with respect to the adhesive film 20 and the heating and pressing head 4. Above the support 3, a heating and pressing head 4 that heat-presses the adhesive film 20 against the substrate 10 is provided.

The heater 4a for heating the adhesive film 20 is built in the heating and pressing head 4. The heating and pressing head 4 can be moved up and down by an elevating mechanism 6. The elevating mechanism 6 includes, for example, a drive cylinder and a rod to which the heating and pressing head 4 is attached, and raises and lowers the heating and pressing head 4 according to the operation of the rod. In addition, the raising / lowering mechanism 6 can be comprised by a well-known mechanism other than using the mechanism which consists of a drive cylinder and a rod.

The adhering apparatus 1 is a temporary adhering position where the adhesive layer 21 of the adhesive film 20 is temporarily adhering to the substrate 10 between the support 3 and the heating and pressing head 4.

[Transport mechanism]
The conveyance mechanism 2 that conveys the adhesive film 20 between the support 3 and the heating and pressing head 4 includes a supply reel 11 around which the tape-like adhesive film 20 is wound and a base film 22 from which the adhesive layer 21 has been peeled off. A take-up reel 12, a plurality of guide rollers 13 for guiding the adhesive film 20 between the supply reel 11 and the take-up reel 12, and a base film 22 provided on the downstream side in the transport direction from the temporary attachment position; A pair of chucking pieces 14 to be pulled.

As shown in FIG. 2, the supply reel 11 includes a winding core 16 around which a tape-like adhesive film 20 is wound, and reel flanges 17 provided on both sides of the winding core 16. The adhesive film 20 wound around the supply reel 11 forms a film winding body 18 by being wound around the core 16. Similarly, the take-up reel 12 also includes a core around which the base film 22 from which the adhesive layer 21 has been peeled is wound, and reel flanges provided on both sides of the core.

Further, the supply reel 11 and the take-up reel 12 are both engaged with a rotational drive source (not shown), and are rotated by the rotational drive source to unwind the adhesive film 20 or peel off the adhesive layer 21. The base film 22 is wound up.

The pair of chucking pieces 14 sandwich the base film 22 and pull it in the direction of arrow A in FIG. Thus, the pair of chucking pieces 14 conveys the base film 22 to the take-up reel 12 and conveys a new adhesive film 20 to the temporary attachment position.

The chucking piece 14 can be moved close to and away from the traction drive source 19 to sandwich and release the base film 22. The chucking piece 14 is linearly driven in the vertical direction between the position indicated by the solid line and the position indicated by the broken line in FIG.

The traction drive source 19, the rotation drive source that rotates the supply reel 11, and the rotation drive source that rotates the take-up reel 12 are all operated in synchronization. Therefore, the transport mechanism 2 performs unwinding of the adhesive film 20, pulling of the base film 22 from which the adhesive layer 21 has been peeled, and winding of the base film 22 in synchronism, thereby transporting the adhesive film 20. It can be carried out.

[Removal member / Adhesive tape]
The removing member 5 is for removing the binder 21a remaining in the base film 22 in advance before the base film 22 is sandwiched between the chucking pieces 14 and preventing a pinching error and a traction error due to the chucking pieces 14. is there. The removal member 5 is provided on the downstream side in the transport direction of the adhesive film 20 from the temporary attachment position, and is provided on the upstream side in the transport direction of the adhesive film 20 from the chucking piece 14.

The removal member 5 is constituted by an adhesive tape 30, for example, as shown in FIG. As the pressure-sensitive adhesive tape 30, a known pressure-sensitive adhesive tape can be used as long as it has an adhesive force larger than the adhesive force with the base film 22 between the adhesive layer 21. The adhesive force between the adhesive layer 21 and the base film 22 is, for example, 1.6 mN / cm. Therefore, the adhesive tape 30 has an adhesive force with the binder 21a of 1.6 mN / cm or more.

The adhesive tape 30 is wound around the first winding core 31, unwound from the first winding core 31, then drawn along the transport route of the base film 22, and the second winding core 32. Rolled up. The adhesive tape 30 is supported to face the base film 22 by a pressing member 35 provided between the temporary attachment position on the transport route of the base film 22 and the chucking piece 14. The pressing member 35 presses the adhesive surface of the adhesive tape 30 against the base film 22, and is driven by a driving mechanism (not shown) so that the adhesive tape 30 can be pressed toward the base film 22 side.

The sticking apparatus 1 normally retracts the pressing member 35 downward and separates the adhesive tape 30 from the base film 22. In addition, the sticking apparatus 1 is provided with a detection means 25 such as a camera or a sensor on the downstream side of the temporary sticking position, and monitors whether or not the binder 21a remains on the base film 22. When the adhesive layer 21 of the adhesive film 20 is not sufficiently peeled off from the base film 22 and causes a sticking error, the sticking device 1 detects the binder 21a remaining on the base film 22 and then presses the pressing member. 35 is driven to press the adhesive tape 30 against the base film 22, and the remaining binder 21 a is removed from the base film 22.

Thus, the binder 21a does not remain on the base film 22, and the binder 21a does not adhere to the chucking piece 14 even when the chucking piece 14 holds the binder 21a. Therefore, even when the chucking piece 14 holds and pulls the base film 22 thereafter, a chucking error due to the attachment of the binder 21a does not occur, and time loss due to the stop of the production line can be prevented. .

[Removal member / roll]
Moreover, you may comprise the removal member 5 with the roll 40 to which the binder 21a adheres, as shown in FIG. As long as the roll 40 can be stuck to the adhesive layer 21 with a force larger than the adhesive force to the base film 22 without particularly performing a peeling treatment, a roll of any material is used. Can do.

The roll 40 is supported between the temporary attachment position on the transport route of the base film 22 and the chucking piece 14 with the rolling direction parallel to the transport direction of the base film 22. The roll 40 is always supported at a position in contact with the base film 22 and may always roll following the conveyance of the base film 22, or may be supported so as to be close to and away from the base film 22. When the remaining of the binder 21a is detected on the film 22, the base film 22 may be slidably contacted.

The sticking apparatus 1 provided with the roll 40 as the removing member 5 can stick the binder 21a remaining on the base film 22 to the roll 40 and remove the base film 22 by rolling the roll 40.

In addition, the sticking apparatus 1 wipes the stuck binder 21a from the roll 40 by bringing a scraper (not shown) into contact with the roll 40 or rolling another roll, and maintains the removal performance of the binder 21a. You may make it do. Further, every time the binder 21a remaining on the base film 22 is detected, the sticking apparatus 1 makes the roll 40 contact with the base film 22 and replaces it with a clean roll 40 each time the binder 21a is removed. May be.

[Adhesive film]
Here, the adhesive film 20 conveyed to the sticking apparatus 1 will be described. As shown in FIG. 2, the adhesive film 20 includes an adhesive layer 21 and a base film 22 serving as a support that supports the adhesive layer 21.

The adhesive layer 21 can be an anisotropic conductive film (ACF: Anisotropic Conductive Film) containing conductive particles 23 in a binder (insulating adhesive composition) 21a, but is not limited thereto. An insulating adhesive film (NCF: Non-Conductive Film) that does not contain the conductive particles 23 in 21a may be used.

As the binder 21a of the adhesive film 20, for example, a normal binder containing a film-forming resin, a thermosetting resin, a latent curing agent, a silane coupling agent, or the like can be used. For the adhesive film 20, an anisotropic conductive composition in which conductive particles 23 are dispersed in a binder 21 a or an insulating adhesive composition that does not contain the conductive particles 23 in a binder 21 a is applied on the base film 22. Thus, the film is formed on the base film 22.

The base film 22 supports the binder 21a in the form of a film. For example, PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), and the like. It is formed by applying a release agent such as.

The film forming resin contained in the binder 21a is preferably a resin having an average molecular weight of about 10,000 to 80,000. Examples of the film forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.

The thermosetting resin is not particularly limited as long as it has fluidity at room temperature, and examples thereof include commercially available epoxy resins and acrylic resins.

The epoxy resin is not particularly limited. For example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin. Naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like. These may be used alone or in combination of two or more.

There is no restriction | limiting in particular as an acrylic resin, According to the objective, an acrylic compound, liquid acrylate, etc. can be selected suitably. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy- 1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclo Examples include decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, and epoxy acrylate. In addition, what made acrylate the methacrylate can also be used. These may be used individually by 1 type and may use 2 or more types together.

The latent curing agent is not particularly limited, and examples thereof include various curing agents such as a heat curing type and a UV curing type. The latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction. The activation method of the thermally activated latent curing agent includes a method of generating active species (cations and anions) by a dissociation reaction by heating, and the like. There are a method in which a curing reaction is started by dissolving or dissolving, a method in which a molecular sieve encapsulated type curing agent is eluted at a high temperature to start a curing reaction, a curing method by elution from a microcapsule, and the like. Thermally active latent curing agents include imidazole series, hydrazide series, boron trifluoride-amine complex, sulfonium salt, amine imide, polyamine salt, dicyandiamide, and modified products thereof. The above mixture may be sufficient. Among these, a microcapsule type imidazole-based latent curing agent is preferable.

The silane coupling agent is not particularly limited, and examples thereof include an epoxy type, an amino type, a mercapto sulfide type, and a ureido type. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.

Examples of the conductive particles 23 include any known conductive particles used in anisotropic conductive films. Examples of the conductive particles 23 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.

In the above description, the adhesive film 20 in which the adhesive layer 21 made of ACF or NCF is laminated on the base film 22 is used. However, the present invention is not limited to this example. For example, the film laminate may be an anisotropic conductive film having two or more layers in which ACF and NCF are laminated.

Further, the adhesive film 20 may have a configuration in which a cover film is provided on the side of the adhesive layer 21 opposite to the side on which the base film 22 is laminated. For example, it is good also as a conductive adhesive film for electrically connecting a photovoltaic cell and a tab wire.

[Adhesion method]
Next, a process of sticking the adhesive layer 21 to the substrate 10 using the sticking apparatus 1 will be described. First, the adhesive film 20 is unwound from the supply reel 11 and set in the sticking device 1. The adhesive film 20 is supported by the plurality of guide rollers 13 on the side of the base film 22, so that the adhesive film 20 is drawn to the take-up reel through the temporary attachment position between the support base 3 and the heating and pressing head 4. Thereby, as for the adhesive film 20, the adhesive bond layer 21 is supported toward the support stand 3 side.

At this time, it is desirable that the adhesive layer 20 is peeled off from the base film 22 in advance by the removing member 5 or other methods from the temporary attachment position to the chucking piece 14. Thereby, adhesion of the binder 21a to the chucking piece 14 can be prevented. Further, it is desirable that the removing member 5 made of the adhesive tape 30 or the roll 40 is separated from the base film 22. Further, the chucking pieces 14 are separated from each other and are lowered in the direction of the arrow A in FIG.

Next, the substrate 10 is placed on the support 3 and alignment adjustment with the adhesive film 20 is performed. Further, the adhesive film 20 is half-cut by the cutting mechanism 41 to a predetermined length corresponding to the length of the adhesive layer 21 attached to the substrate 10. At this time, the adhesive film 20 is not cut up to the base film 22.

Next, as shown in FIG. 4A, the heating and pressing head 4 heated to a predetermined temperature is lowered by the elevating mechanism 6 and heat-pressed at a predetermined pressure and time from the base film 22 side of the adhesive film 20. The heating temperature by the heating and pressing head 4 is set to a predetermined temperature that exhibits fluidity although the binder 21a of the adhesive layer 21 is not thermally cured, and is set within a range of, for example, 30 ° C. to 120 ° C. due to a demand for low temperature. . As a result, as shown in FIG. 4B, the adhesive film 20 is temporarily attached to the substrate 10 with the adhesive layer 21 peeled off from the base film 22.

When the temporary sticking of the adhesive layer 21 is completed, the chucking piece 14 driven by the pulling drive source 19 sandwiches the base film 22 and pulls in the direction of arrow A in FIG. 4C. Thereby, the base film 22 from which the adhesive layer 21 has been peeled is conveyed downstream from the temporary attachment position.

At this time, the sticking apparatus 1 monitors whether or not the binder 21a of the adhesive layer 21 remains on the base film 22 by the detecting means 25. As a result, when the binder 21a remains on the base film 22, the residue of the binder 21a is removed by the removing member 5.

Specifically, when the adhesive tape 30 is used as the removing member 5, as shown in FIG. 4C, the sticking device 1 drives the pressing member 35 to press the adhesive tape 30 against the base film 22 and remains. The binder 21a to be removed is removed from the base film 22. At this time, since the adhesive tape 30 has an adhesive force with the binder 21a that is larger than the adhesive force between the binder 21a and the base film 22, for example, 1.6 mN / cm or more, it remains on the base film 22. The binder 21a can be reliably adhered.

When the binder 21 a is adhered, the adhesive tape 30 is separated from the base film 22 by the pressing member 35 and wound around the second core 32. Thereby, the adhesive tape 30 is removed by attaching an unused part from the first core 31. At this time, the roll 40 is not subjected to a peeling treatment on the surface, and the roll surface and the adhesive layer are more than the adhesive force between the base film 22 coated with a release agent such as silicone and the adhesive layer 21. The binder 21a remaining on the base film 22 can be reliably adhered by making the adhesive strength with the substrate 21 large, for example, 1.6 mN / cm or more.

The roll 40 is prepared for subsequent use by wiping the adhered binder 21a by sliding contact with a scraper or another roll.

Alternatively, as illustrated in FIGS. 6A and 6B, the sticking apparatus 1 causes the roll 40 to be separated from the base film 22 in a normal state, and the binder 21a remains on the base film 22 as illustrated in FIG. 6C. When this is detected, the roll 40 that has been waiting after being separated from the base film 22 is brought into contact with the base film 22 and is removed by adhering the remaining binder 21a. The roll 40 is separated from the base film 22 when the binder 21a is adhered. Moreover, the roll 40 is prepared for use after the next time by wiping away the binder 21a stuck by a scraper or another roll, or replacing the roll 40 with a new roll 40.

Thus, according to the sticking method using the sticking apparatus 1, the binder 21 a does not remain on the base film 22, and even when the chucking piece 14 is sandwiched in the subsequent process, The binder 21a does not adhere. Therefore, the chucking piece 14 does not cause a chucking error when holding or towing the base film 22 thereafter, and time loss due to the stop of the production line can be prevented.

The substrate 10 on which the adhesive layer 21 of the adhesive film 20 is temporarily attached is placed on an electronic component such as an IC chip or a flexible substrate, and is heated and pressed from above the electronic component by a heating and pressing head. As a result, the adhesive layer 21 has the binder 21a flowing out from between the electrode terminals of the substrate 10 and the electronic component, and the conductive particles are sandwiched between the electrode terminals. Manufactured.

In the above description, the process of temporarily bonding the adhesive layer 21 of the adhesive film 20 to the substrate 10 has been described. However, the process of removing the adhesive layer 21 by the bonding apparatus 1 is performed when the supply reel 11 is replaced. The present invention can also be applied to a case where 21 is not attached to the substrate and is conveyed as it is. Also in this case, by removing the adhesive layer 21 from the base film 22 by the removing member 5, the adhesive film 20 can be transported without the binder 21a adhering to the chucking piece 14, and the production line is stopped. The temporary sticking process of the adhesive film 20 can be performed following the replacement of the supply reel 11 without any change.

Next, examples of the present invention will be described. In this example, an adhesive film was temporarily pasted on the terminal electrode of the glass substrate for evaluation using the pasting apparatus 1 having the removing member 5 and the conventional pasting apparatus not having the removing member 5. Temporary pasting was performed 500 times each at different heating temperatures, and the number of binder sticking errors and the number of base film chucking errors due to chucking pieces were counted.

As the adhesive film to be used, a supply reel in which ACF: CP6920F3 manufactured by Dexerials Co., Ltd. was wound around a reel wound body having a width of 1 mm was used.
Moreover, it was 1.6 mN / cm when the peeling force of the adhesive bond layer of an adhesive film and a base film was measured.

In Example 1, a sticking device using an adhesive tape (see FIG. 1) was used as the removing member. It was 5,600 mN / cm when the adhesive force of an adhesive tape and the binder of an adhesive film was measured. Moreover, the sticking temperature by a heating press head was 30 degreeC.

In Example 2, the conditions were the same as in Example 1 except that the application temperature by the heating and pressing head was 60 ° C. Moreover, it was 5,600 mN / cm when the adhesive force of an adhesive tape and the binder of an adhesive film was measured.

In Example 3, the conditions were the same as in Example 1 except that the sticking temperature by the heating and pressing head was 90 ° C. Moreover, it was 5,600 mN / cm when the adhesive force of an adhesive tape and the binder of an adhesive film was measured.

In Example 4, the conditions were the same as in Example 1 except that the sticking temperature by the heating and pressing head was 120 ° C. Moreover, it was 5,600 mN / cm when the adhesive force of an adhesive tape and the binder of an adhesive film was measured.

In Example 5, a sticking device using a roll (see FIG. 3) was used as the removing member. Moreover, it heated so that the temperature of the roll surface might be set to 50 degreeC. It was 640 mN / cm when the adhesive force of the binder of an adhesive film and a roll was measured on these conditions. Moreover, the sticking temperature by a heating press head was 30 degreeC.

In Example 6, the conditions were the same as in Example 5 except that the sticking temperature by the heating and pressing head was 60 ° C. Moreover, it was 640 mN / cm when the adhesive force of the binder and roll of an adhesive film was measured.

In Example 7, the conditions were the same as in Example 5 except that the application temperature by the heating and pressing head was 90 ° C. Moreover, it was 640 mN / cm when the adhesive force of the binder and roll of an adhesive film was measured.

In Example 8, the conditions were the same as in Example 5 except that the sticking temperature by the heating and pressing head was 120 ° C. Moreover, it was 640 mN / cm when the adhesive force of the binder and roll of an adhesive film was measured.

In Comparative Example 1, a conventional sticking apparatus (see FIG. 8) that does not include a removal member was used, and the sticking temperature by the heating press head was set to 30 ° C.

In Comparative Example 2, the conditions were the same as those in Comparative Example 1 except that the application temperature by the heating and pressing head was 60 ° C.

As shown in Tables 1 and 2, in both Examples and Comparative Examples, the number of binder sticking errors increased as the sticking temperature decreased. This is because the heating temperature is low and the viscosity of the adhesive layer is high, so that peeling from the base film becomes insufficient.

However, in the example provided with the removal member, the number of chucking errors due to the chucking piece was zero, and there was no influence on the production line. On the other hand, in the comparative example having no removal member, the number of chucking errors due to the chucking pieces increased in proportion to the number of binder sticking errors.

DESCRIPTION OF SYMBOLS 1 Sticking apparatus 2 Conveyance mechanism 3 Support stand 4 Heating press head 4a Heater 5 Removal member 6 Elevating mechanism 10 Substrate 11 Supply reel 12 Take-up reel 13 Guide roller 14 Chucking piece 16 Winding core 17 Reel flange 18 Film winding body 19 Pulling drive source 20 Adhesive film 21 Adhesive layer 22 Base film 23 Conductive particles 25 Detection means 30 Adhesive tape 31 First winding core 32 Second winding core 35 Press member 40 Roll 41 Cut mechanism

Claims

A transport mechanism for transporting a tape-like adhesive film having a base film and an adhesive layer supported on the base film;
A support part for supporting an object to be adhered to which the adhesive layer is adhered;
A head that is provided facing the support portion and presses the adhesive film conveyed onto the sticking object against the sticking object, and causes the adhesive layer to stick to the sticking object. When,
An adhesive film sticking apparatus comprising: a removing member that is provided on the downstream side of the support portion and the head in the transport direction of the adhesive film and removes the adhesive layer remaining on the base film.
The adhesive film sticking apparatus according to claim 1, wherein the removing member is an adhesive tape.
The adhesive film sticking apparatus according to claim 1, wherein the removing member is a roll.
The said conveyance mechanism has a several guide roller which guides the said adhesive film, and the chucking piece which pinches and pulls the said base film from which the said adhesive bond layer peeled. Adhesive film sticking device.
The adhesive film sticking apparatus according to any one of claims 1 to 4, further comprising a cutting mechanism that half-cuts the adhesive layer side after the adhesive film is conveyed onto the sticking object.
5. The adhesive film according to claim 1, wherein the adhesive film is a conductive adhesive film in which conductive particles are dispersed in the adhesive layer, or an insulating adhesive film in which conductive particles are not contained in the adhesive layer. The adhesive film sticking apparatus described in 1.
A transporting step of transporting a tape-like adhesive film having a base film and an adhesive layer supported on the base film onto a sticking object supported by a support unit by a transport mechanism;
A sticking step of pressing the adhesive layer against the sticking object, and sticking the adhesive layer to the sticking object, by a head provided facing the support part;
A downstream transport step of transporting the base film to the downstream side in the transport direction of the adhesive film from the support and the head by the transport mechanism;
In the downstream conveying step, an adhesive film sticking method in which the adhesive layer remaining on the base film is removed by a removing member on the downstream side of the supporting portion and the head in the conveying direction of the adhesive film.
The adhesive film sticking method according to claim 7, wherein the removing member is an adhesive tape.
The adhesive film sticking method according to claim 7, wherein the removing member is a roll.
The said conveyance mechanism has a several guide roller which guides the said adhesive film, and the chucking piece which pinches and pulls the said base film from which the said adhesive bond layer was peeled. To attach the adhesive film.
A connection structure manufactured using the method for attaching an adhesive film according to any one of claims 7 to 10.