WO2013134997A1 - 含双酚a骨架结构的分子玻璃光刻胶及其制备方法和应用 - Google Patents

含双酚a骨架结构的分子玻璃光刻胶及其制备方法和应用 Download PDF

Info

Publication number
WO2013134997A1
WO2013134997A1 PCT/CN2012/075707 CN2012075707W WO2013134997A1 WO 2013134997 A1 WO2013134997 A1 WO 2013134997A1 CN 2012075707 W CN2012075707 W CN 2012075707W WO 2013134997 A1 WO2013134997 A1 WO 2013134997A1
Authority
WO
WIPO (PCT)
Prior art keywords
compound
alkyl
formula
photoresist
lithography
Prior art date
Application number
PCT/CN2012/075707
Other languages
English (en)
French (fr)
Inventor
杨国强
许箭
陈力
王双青
李沙瑜
Original Assignee
中国科学院化学研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中国科学院化学研究所 filed Critical 中国科学院化学研究所
Priority to JP2014561253A priority Critical patent/JP5977842B2/ja
Priority to US14/385,238 priority patent/US9454076B2/en
Publication of WO2013134997A1 publication Critical patent/WO2013134997A1/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/96Esters of carbonic or haloformic acids
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C37/00Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
    • C07C37/11Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms
    • C07C37/16Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms by condensation involving hydroxy groups of phenols or alcohols or the ether or mineral ester group derived therefrom
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/15Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings, e.g. phenylphenol
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/15Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings, e.g. phenylphenol
    • C07C39/16Bis-(hydroxyphenyl) alkanes; Tris-(hydroxyphenyl)alkanes
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/17Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings containing other rings in addition to the six-membered aromatic rings, e.g. cyclohexylphenol
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C41/00Preparation of ethers; Preparation of compounds having groups, groups or groups
    • C07C41/01Preparation of ethers
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00Ethers; Compounds having groups, groups or groups
    • C07C43/02Ethers
    • C07C43/20Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring
    • C07C43/205Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring the aromatic ring being a non-condensed ring
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00Ethers; Compounds having groups, groups or groups
    • C07C43/02Ethers
    • C07C43/20Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring
    • C07C43/205Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring the aromatic ring being a non-condensed ring
    • C07C43/2055Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring the aromatic ring being a non-condensed ring containing more than one ether bond
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00Ethers; Compounds having groups, groups or groups
    • C07C43/02Ethers
    • C07C43/20Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring
    • C07C43/21Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring containing rings other than six-membered aromatic rings
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C68/00Preparation of esters of carbonic or haloformic acids
    • C07C68/06Preparation of esters of carbonic or haloformic acids from organic carbonates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2603/00Systems containing at least three condensed rings
    • C07C2603/92Systems containing at least three condensed rings with a condensed ring system consisting of at least two mutually uncondensed aromatic ring systems, linked by an annular structure formed by carbon chains on non-adjacent positions of the aromatic system, e.g. cyclophanes

Definitions

  • the present invention relates to a series of molecular glass photoresists comprising a bisphenol A framework structure and a process for the preparation of such compounds and their use in lithography, especially in extreme ultraviolet lithography. Background technique
  • the photoresist used in 193nm lithography is mainly a polymer system, and 193nm lithography has been difficult to meet as lithography has increased requirements for resolution, sensitivity, and line edge roughness.
  • EUV lithography can achieve 32nm and 22nm nodes, even lower technology nodes, by using only 13.5nm light source, which makes EUV lithography will play a very important role in the future lithography field. Important role. Since EUV lithography has different characteristics from other lithography technologies, the corresponding photoresist materials will have more stringent requirements.
  • EUV photoresists require low absorbance, high transparency, high etch resistance, high resolution (less than 22nm), high sensitivity, low exposure dose (less than 10mJ/cm 2 ), high environmental stability, low gas production and low Line edge roughness (less than 1. 5nm) and the like. Therefore, the original polymer system cannot meet the requirements of EUV lithography due to its large molecular weight and non-uniformity. The development of such new photoresists is very important.
  • Molecular glass is a small molecular organic compound with a high glass transition temperature (TJ). It combines the advantages of a polymer with a small molecule. It has a small molecular weight and is monodispersed, and has an amorphous state. It has high thermal stability. And it has a glass transition process peculiar to polymer compounds, and is an ideal photoresist material. Due to the excellent properties of molecular glass photoresist, it can be used not only in the traditional 248nm and 193nm lithography technologies. It will become the preferred host compound material for next-generation lithography technologies such as EUV lithography, nanoimprint lithography and electron beam lithography.
  • TJ glass transition temperature
  • the more common molecular glass photoresists are benzene polyphenol type photoresists and calixarene-based photoresists, and through different degrees of protection of their reactive hydroxyl groups (such as tert-butyloxycarbonyl or adamantyl protection), It can be combined with photoacid generators, crosslinkers, photoresist solvents and other additives to obtain positive or negative photoresists with different properties.
  • Another object of the present invention is to provide a method for producing the above molecular glass.
  • the molecular glass containing the bisphenol A skeleton structure provided by the invention has two types of benzene polyphenol type and calixarene type, and the structural formulas thereof are as follows: (I) and (I I ):
  • the alkyl group represents a linear or branched alkyl group having 1 to 8 carbon atoms, for example, a methyl group, an ethyl group, a propyl group, a butyl group, an isobutyl group, a t-butyl group or the like.
  • the benzene polyphenol type and calixarene type molecular glasses (I) and (II) of the present invention are prepared by modifying a bisphenol A skeleton structure by a Suzuk i coupling reaction, and introducing a polyhydroxy group into the structure of the prepared compound. And with different levels of protection through protecting groups.
  • X is independently selected from the group consisting of H, d- 8 alkyl, -COOd- 8 R independent
  • R 3 is optionally d- 8 alkyl
  • R is selected as d- 8 alkyl
  • Z is a halogen (preferably chlorine)
  • a cup-type aromatic molecular glass having different degrees of protection that is, a compound of the formula ( ⁇ )
  • step (i) or step (1) is preferably carried out in the presence of a carbonic acid clock, preferably using acetone as a solvent, and the reaction temperature is preferably from 50 to 60.
  • C the time is preferably 10 ⁇ 15h, wherein the ratio of the general formula (III) tetrabromobisphenol A (or formula (IV)) to the halogen or acid diester (ZY or S0 2 (0-Y) 2 ) A molar ratio of 1:3 is preferred.
  • the step (ii) or the step (2) described above is preferably carried out under the catalytic conditions of tetrakis(triphenylphosphine)palladium.
  • a base such as a solution of carbonic acid 4
  • the solvent is preferably dioxane-water
  • the reaction temperature is preferably 90 to 110 ° C
  • the time is preferably 12 to 36 h
  • the molar ratio of the feed to the phenylboronic acid derivative is preferably 1:6 (or 1:1.5).
  • step (iii) or step (3) it is preferred to carry out the dealkylation reaction using boron tribromide or hydrogen bromide, and the solvent used for the reaction is preferably dichloromethane or acetic acid, and the reaction is preferably carried out at room temperature.
  • the reaction time is preferably 6 to 24 hours.
  • step (iv) or step (4) is preferably carried out at room temperature under the catalysis of 4 or 4-dimethylaminopyridine (DMAP), the reaction time is preferably 2-12 h, and the reaction solvent is preferably tetrahydrofuran or acetone, and the product is preferably Purification by column chromatography on ethyl acetate / petroleum ether over silica gel.
  • DMAP 4-dimethylaminopyridine
  • the molecular glass (I) or (II) in the present invention wherein the unprotected molecular glass of the hydroxyl group (ie, the fluorenyl hydroxyl group in the structure) can be used as a negative photoresist, and the hydroxy-protected molecular glass can be used as a positive lithography.
  • the molecular glass protected by hydroxyl groups can be used as a positive or negative photoresist.
  • the present invention further provides a negative photoresist composition
  • a negative photoresist composition comprising a hydroxy group unprotected or partially protected molecular glass (I) or (II) which can be used as a negative photoresist, and a photoacid generator, a crosslinking agent , photoresist solvent.
  • the above-mentioned molecularly unprotected or partially protected molecular glass (I) or (II) which can be used as a negative photoresist means that at least one of -0 and R in the general formula (I) or (II) is - 0H.
  • the negative photoresist composition preferably contains 0.1% to 10% by mass of the general formula (I) or (II), 0.01% to 1% by mass of the crosslinking agent, 0.01% to 1 % (mass ratio) of photoacid generator.
  • the present invention further provides a positive photoresist composition
  • a positive photoresist composition comprising a hydroxyl-protected or partially protected molecular glass (I) or (II) which can be used as a positive photoresist, and a photoacid generator, a photoresist Solvent.
  • the above-mentioned hydroxy-protected or partially protected molecular glass (I) or II) which can be used as a positive photoresist means that at least one of -0- and R in the formula (I) or (II) is -Od — 8- alkyl, - OCOOd— 8
  • the positive resist composition preferably contains 1% to 10% by mass of a photoacid generator of the formula (I) or (II) and 0.01% to 1% by mass.
  • the photoacid generator includes an ionic or nonionic type such as triphenylsulfonium trifluoromethanesulfonate, bis(4-tert-butylphenyl)iodonium p-toluene hydrochloride, and N-hydroxynaphthoic acid.
  • An amine trifluoromethanesulfonate or the like the crosslinking agent includes tetramethylglycoluril, 2,4-dihydroxymethyl-6-methylphenol (2,4-DMMP), and the like;
  • Solvents include propylene glycol methyl ether acetate (PGMEA), ethyl lactate, ethylene glycol monomethyl ether, cyclohexanone Wait.
  • the above positive or negative photoresist composition may also include other additives such as sensitizers, surfactants, dyes, stabilizers and the like.
  • Spin coating is performed to obtain a photoresist coating.
  • the molecular glass of the present invention is a stereo-asymmetric amorphous small molecule compound which can be dissolved in an organic solvent commonly used for photoresists. It has a high melting point and a glass transition temperature (melting point higher than 100 °C), which can meet the requirements of lithography, and the film structure does not change during high temperature baking.
  • the photoresist composition of the present invention can be prepared to obtain a uniform film in which molecular glass as a matrix component is not precipitated.
  • the film prepared from the photoresist composition of the present invention has good resolution, photosensitivity, adhesion, and is easy to store, and the photoresist of the present invention can obtain a lithographic pattern of 5 Onm or less.
  • the photoresist prepared by the present invention can be used in modern lithography processes such as 248 nm lithography, 193 nm lithography, extreme ultraviolet (EUV) lithography, nanoimprint lithography (NIL) and electron beam lithography (EBL). Especially suitable for use in extreme ultraviolet (EUV) lithography processes.
  • EUV extreme ultraviolet
  • NIL nanoimprint lithography
  • EBL electron beam lithography
  • Fig. 1 is a thermogravimetric analysis chart of the molecular glass (1-1) prepared in Example 4.
  • Fig. 2 is a thermogravimetric analysis diagram of the molecular glass (1-2) prepared in Example 7.
  • Figure 3-4 is an electron micrograph of a lithographic pattern obtained by using a double grating in Example 12.
  • Fig. 5 is an electron micrograph of a lithographic pattern obtained by using four gratings in the embodiment 12.
  • Example 1 In order to further illustrate the teachings of the present invention, the following series of specific embodiments are given, but the present invention is not limited by these specific embodiments, and any modifications to the present invention by those skilled in the art will achieve similar results. Modifications are also included in the present invention.
  • Example 1
  • the reaction system was added to a 10 OmL 2N NaOH solution, the aqueous layer was separated, acidified with 5N hydrochloric acid, and then extracted three times with 100 mL of ethyl acetate, and the organic layer was dried over anhydrous magnesium sulfate and then filtered.
  • the white crystals were 5.36 g, and the yield was 89.8%.
  • Figure 3-4 shows an electron micrograph of a lithography pattern obtained by using a double grating. The exposure period is 140 nm, and a photoresist trench of about 30 nm can be obtained.
  • Figure 5 shows the An electron micrograph of a lithographic pattern obtained by four gratings. As can be seen from the lithographic pattern shown in the above electron micrograph, the photoresist of the present invention has a good resolution and contrast while having a line edge roughness of 4 ⁇ .
  • Negative photoresist formulation design 20mg molecular glass I-2C, 5mg tetramethoxymethyl glycoluril crosslinker, 1mg triphenylsulfonium trifluoromethanesulfonate dissolved in lmL PGMEA to form a negative Photoresist, spin-coated on a hydrophilic and hydrophobic silicon wafer (500 ⁇ 1000rpm, 0 ⁇ 30s; 1000 ⁇ 2000rpm, 0 ⁇ 30s;

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

本发明公开了一系列基于双酚A为主体结构的分子玻璃光刻胶(I和II)及其制备。将该分子玻璃光刻胶与光酸产生剂、交联剂、光刻胶溶剂和其他添加剂复配成正性或负性光刻胶,在硅片上通过旋涂法可制得厚度均匀的光刻胶涂层。该光刻胶配方可用于248nm光刻、193nm光刻、极紫外光刻、纳米压印光刻及电子束光刻等现代光刻技术中,尤其适合使用于极紫外(EUV)光刻工艺中。

Description

含双酚 A骨架结构的分子玻璃光刻胶及其制备方法和应用 技术领域
本发明涉及一系列含双酚 A骨架结构的分子玻璃光刻胶以及该类化合物的 制备方法及其在光刻技术中的应用, 尤其是在极紫外光刻技术中的应用。 背景技术
现代半导体工业要求集成电路的尺寸越来越小, 集成度越来越高, 并按照 摩尔定律向前发展, 其内在驱动力即是光刻技术的不断深入发展。 自 20世纪 80 年代开始, 光刻技术经历了从 I线( 365nm )到深紫外(DUV, 248nm和 193nm ), 以及下一代最引人注目的极紫外(EUV, 13. 5nm )光刻技术的发展, 而相应的光 刻胶体系也将发生变化。
193nm光刻所使用的光刻胶主要是聚合物体系, 而随着光刻技术对分辨率、 灵敏度和线边缘粗糙度等要求不断提高, 193nm光刻已很难满足。 与此同时, 极 紫外光刻技术由于使用只有 13. 5nm的光源, 能够达到 32nm和 22nm节点, 甚至 可以更低的技术节点, 这就使得 EUV光刻在未来的光刻领域中将会扮演十分重 要的角色。 由于 EUV 光刻具有不同于其他光刻技术的特点, 与之对应的光刻胶 材料也将具备更加严格的要求。 EUV光刻胶需要有低吸光率, 高透明度, 高抗蚀 刻性, 高分辨率(小于 22nm ), 高灵敏度, 低曝光剂量(小于 10mJ/cm2 ), 高环 境稳定性, 低产气作用和低的线边缘粗糙度 (小于 1. 5nm )等。 所以原有的聚合 物体系因分子量大且不均一已不能满足 EUV光刻的要求, 这样新型光刻胶的研 发就显得非常重要。
分子玻璃是一种具有较高玻璃化转变温度(TJ 的小分子有机化合物, 集 聚合物与小分子的优点于一身, 分子量小且单分散, 又呈现无定形态, 有很高 的热稳定性, 且具有高分子化合物所特有的玻璃化转变过程, 是一类理想的光 刻胶材料。 由于分子玻璃光刻胶所具备的优良性能, 不仅可以用在传统的 248nm 和 193nm光刻技术中, 更将可能成为下一代光刻技术(如 EUV光刻, 纳米压印 光刻以及电子束光刻等) 的首选主体化合物材料。 比较常见的分子玻璃光刻胶有苯多酚型光刻胶和杯芳烃类光刻胶, 并通过 对其活性羟基基团的不同程度的保护 (如特丁氧羰基或金刚烷基保护), 并与光 酸产生剂、 交联剂、 光刻胶溶剂及其他添加剂复配可以获得不同性质的正性或 负性光刻胶。
发明内容
本发明的目的在于提供一系列含双酚 A骨架结构的分子玻璃。
本发明的另一目的在于提供上述分子玻璃的制备方法。
本发明的又一目的在于提供上述分子玻璃在极紫外光刻工艺中的应用。 本发明提供的含双酚 A骨架结构的分子玻璃有苯多酚型和杯芳烃型两类, 其结构通式分别如( I )和( I I ):
Figure imgf000004_0001
所述的烷基代表碳原子数为 1-8 的直链或支链烷基, 例如, 甲基、 乙基、 丙基、 丁基、 异丁基、 叔丁基等。
本发明的苯多酚型和杯芳烃型分子玻璃( I )和( I I ) 的制备方法是利用 Suzuk i偶联反应对双酚 A骨架结构进行修饰 , 在所制备化合物结构上引入多羟 基基团, 并通过保护基团进行不同程度的保护。
分子玻璃( I )和( I I ) 的合成途径分别如下:
Figure imgf000005_0001
其中 X独立的选自 H、 d— 8烷基、 -COOd— 8 R独立
的选自 H、 -0H、 -Od— 8烷基、 -OCOOd— 8烷基、
Figure imgf000005_0002
、 ; ^独立的 选自 H、 -OC 烷基; Y独立的选自 d—8烷基;
本发明通式( I ) 的合成方法如下:
( i )将通式( III ) 四溴双酚 A与 Z-Y或 S02(0-Y)2反应, 其中 Y为 d— 8烷 基(例如甲基), Z为卤素(例如碘 ), 生成化合物 ( I-A ); ( ii )化合物 ( I-A)与
Figure imgf000006_0001
反应生成化合物( I-B); 其中 独立的 选自 H或 -Od— 8烷基;
( iii )化合物 ( I-B )发生去烷基化反应生成通式( I )化合物, 其中, R 独立的选自 H或 -OH, X为 H;
( iv )上述步骤 ( iii )中得到的通式 ( I )化 (C00R3)20或者 R4Z
反应, 其中 R3任选为 d-8烷基, R 壬选为 d-8烷基、
Figure imgf000006_0002
、 , Z为卤 素(优选氯), 生成不同程度保护的苯朌型分子玻璃, 即通式(I )化合物。 本发明通式(Π ) 的合成方法如下:
( 1 )将通式( IV )二溴双酚 A或其衍生物与 Z-Y或 S02 (0-Y) 2反应, 其中 d—8烷基(例如甲基), Z为卤素(例如碘), 生成化合物(II-A);
( 2 )化合物 ( Π-Α )与
Figure imgf000006_0003
反应生成化合物 ( Π-Β ), 其中 独立的选自 H或 -OC 烷基;
( 3 )化合物( Π-Β )发生去烷基化反应生成通式( II )化合物, 其中, R 独立的选自 H或 -OH, X为 H;
( 4 )上述步骤( 3 ) 中得到的通式( II )化合 (C00R3)20或者 R4Z
反应, 其中 R3任选为 d-8烷基, R 壬选为 d-8烷基、
Figure imgf000006_0004
、 , Z为卤 素(优选氯), 得到不同程度保护的杯芳烃型分子玻璃, 即通式(Π )化合物。
上述所述步骤( i )或步骤( 1 )优选在碳酸钟存在下反应, 优选用丙酮作 溶剂, 反应温度优选为 50~60。C, 时间优选为 10~15h, 其中通式(III )四溴双 酚 A (或通式( IV ) )与卤烷或 酸二酯 ( Z-Y或 S02 (0-Y) 2 ) 的投料比优选摩尔 比 1: 3。
上述所述步骤( i i )或步骤( 2 )优选在四(三苯基膦)钯催化条件下反应 , 优选在碱的存在下, 如碳酸 4甲溶液, 溶剂优选为二氧六环 -水, 反应温度优选为 90~110°C, 时间优选为 12~36h, 其中化合物( I-A) (或化合物( Π-Α))与苯硼 酸衍生物的投料摩尔比优选为 1: 6 (或 1: 1.5 )。
上述所述步骤( iii )或步骤( 3 ) 中, 优选使用三溴化硼或溴化氢进行去 烷基化反应, 反应所使用的溶剂优选为二氯甲烷或醋酸, 反应优选在室温下进 行, 反应时间优选为 6~24h。
上述所述步骤( iv )或步骤( 4 )优选在碳酸 4甲或 4-二甲氨基吡啶( DMAP ) 催化下室温进行, 反应时间优选为 2-12h, 反应溶剂优选为四氢呋喃或丙酮, 产 物优选经乙酸乙酯 /石油醚过硅胶柱色谱进行纯化。
本发明中的分子玻璃( I )或( II ), 其中羟基(即结构中的朌羟基) 未保 护的分子玻璃可作为负性光刻胶使用, 羟基全保护的分子玻璃可作为正性光刻 胶使用, 羟基部分保护的分子玻璃可作为正性或负性光刻胶使用。
本发明进一步提供一种负性光刻胶组合物, 包括可作为负性光刻胶使用的 羟基未保护或部分保护的分子玻璃 (I )或 (II ), 以及光酸产生剂、 交联剂、 光刻胶溶剂。 上述可作为负性光刻胶使用的羟基未保护或部分保护的分子玻璃 ( I )或( II ), 是指通式( I )或( II ) 中 -0-X和 R中至少一个为 -0H。 所述负 性光刻胶组合物, 优选含有 0.1%~10% (质量比)的通式( I )或( II ), 0.01%~1% (质量比) 的交联剂, 0.01%~1% (质量比) 的光酸产生剂。
本发明进一步提供一种正性光刻胶组合物, 包括可作为正性光刻胶使用的 羟基全保护或部分保护的分子玻璃 (I )或 (II ), 以及光酸产生剂、 光刻胶溶 剂。 上述可作为正性光刻胶使用的羟基全保护或部分保护的分子玻璃 (I )或 II ), 是指通式 ( I )或 ( II ) 中 -0-X和 R中至少一个为 -Od— 8烷基、 - OCOOd— 8
Figure imgf000007_0001
所述正性光刻胶组合物, 优选含有 1%~10% (质 量比) 的通式( I )或( II ), 0.01%~1% (质量比) 的光酸产生剂。
所述光酸产生剂包括离子型或非离子型,如三苯基锍三氟甲磺酸盐、二( 4- 叔丁基苯基)碘鎿对甲苯横酸盐、 N-羟基萘酰亚胺三氟甲磺酸盐等; 所述交联 剂包括四甲 甲基甘脲、 2, 4-二羟甲基-6-甲基苯酚(2, 4-DMMP)等; 所述光 刻胶溶剂包括丙二醇甲醚醋酸酯 (PGMEA)、 乳酸乙酯、 乙二醇单甲醚、 环己酮 等。
上述正性或负性光刻胶组合物还可以包括其他添加剂, 如增感剂、 表面活 性剂、 染料、 稳定剂等。 进行旋涂, 即得到光刻胶涂层。
本发明的分子玻璃是立体不对称的无定形小分子化合物, 可以在光刻胶常 用的有机溶剂中溶解。 其具有较高的熔点和玻璃化转变温度(熔点均高于 100 °C ), 能够满足光刻技术要求, 在高温烘烤中薄膜结构无变化。 本发明的光刻胶 组合物可以制备得到均匀的薄膜, 在制膜过程中, 作为基体成分的分子玻璃不 析出。 由本发明的光刻胶组合物制备得到的薄膜具有良好的分辨率、 光敏性、 粘附性, 且易于保存, 本发明的光刻胶可以得到 5 Onm以下的光刻图案。
本发明制备的光刻胶可以用于 248nm光刻、 193nm光刻、 极紫外( EUV )光 刻、 纳米压印光刻 (NIL )和电子束光刻 (EBL )等现代光刻工艺中。 尤其适合 使用于极紫外(EUV )光刻工艺中。
附图说明
图 1为实施例 4制备的分子玻璃 ( 1-1 ) 的热重分析图。
图 2为实施例 7制备的分子玻璃 ( 1-2 ) 的热重分析图。
图 3-4为实施例 12采用双光栅千涉得到的光刻图案的电镜照片。
图 5为实施例 12采用四光栅千涉得到的光刻图案的电镜照片。
具体实施方式
为了进一步说明本发明的指导思想,给出下列系列具体实施例,但本发明并 不受这些具体实施例的限制, 任何了解该领域的技术人员对本发明的些许改动 将可以达到类似的结果, 这些改动也包含在本发明之中。 实施例 1
制备双甲基化四溴双酚 A ( I-1A )
Figure imgf000009_0001
将 5. 44g四溴双酚 A ( l Ommo l )和 2. 76g碳酸钾 ( 20mmo l )力口入到 150mL 三口瓶中,再加入 50mL丙酮溶剂和 4. 26g碘甲烷( 30mmol ),氩气保护下 50~60°C 回流反应 10~15h。 反应结束后旋蒸出丙酮溶剂, 并用 50mL水洗涤, 再用 50mL 二氯甲烷萃取三次, 合并有机层, 用无水疏酸镁千燥后过滤旋蒸得粗产物, 并 用乙酸乙酯 /石油醚过硅胶柱色谱, 得到白色固体粉末 5. 56g, 产率为 96. 2%。 EI-MS (C17H1602Br4) , m/z: 572. 'H-NMR (400MHz , CDC13) δ 7. 30 (s, 4H) , 3. 89 (s, 6H) , 1. 60 (s, 6H)。 实施例 2
制备 2, 2-二(4-甲 |L&-3, 5-二 苯基)苯基)丙烷( I-1B )
Figure imgf000009_0002
将 5· 78g双甲基化四溴双朌 A ( l Ommol ), 9. 12g 4-甲氧基苯硼酸( 60mmol ) 和 0· 58g四 (三苯基膦)钯加入到 250mL三口瓶中, 再加入 75mL 2M碳酸钾溶 液和 75mL二氧六环溶剂,氩气保护下在 90~100。C下反应 48h。反应结束后分层, 有机层旋蒸出二氧六环溶剂, 用 l OOmL蒸馏水洗涤, 并用 l OOmL二氯甲烷萃取 三次; 水层用 50mL二氯甲烷萃取三次。 合并所有的有机层, 用无水疏酸镁千燥 后过滤旋蒸得粗产物, 用二氯甲烷做洗脱剂过硅胶柱色谱, 得到白色固体粉末 4. 68g, 产率为 68. 7%。 MALDI-T0F (C45H 4406) , m/z: 680. 5。 'H-NMR (400MHz, CDC13) δ 7. 51 (d, J=5. 40Hz, 8H) , 7. 20 (s, 4H) , 6. 95 (d, J=5. 39Hz, 8H) , 3. 85 (s, 12H) , 3. 16 (s, 6H) , 1. 76 (s, 6H)。 实施例 3
制备 2, 2-二(4-羟基 -3, 5-二 (对羟基苯基)苯基)丙烷( I-1C )
Figure imgf000010_0001
将 6.81g 2,2-二(4-甲 |L&-3, 5-二 (对甲 苯基)苯基)丙烷(lOmmol) 和 lOOmL二氯甲烷加入到 250mL三口瓶中, 在 -78°C氩气保护下加入 25. Og三溴 化硼(lOOmmol), 恢复至室温反应 12h。 反应结束后, 将反应体系加入到 10 OmL 2N NaOH溶液中, 分出水层, 用 5N盐酸酸化, 再用 lOOmL乙酸乙酯萃取三次, 合并有机层用无水疏酸镁千燥后过滤旋蒸得白色晶体 5.36g, 产率为 89.8%。 MALDI- TOF (C39H 3206) , m/z: 596.5。 'H-NMR (400MHz, DMSO) δ 9.39 (s, 4H) , 7.71 (s, 2H), 7.28 (d, J=5.25Hz, 8H) , 6.97 (s, 4H) , 6.78 (d, J=5.25Hz, 8H) , 1.65 (s, 6H)。 实施例 4
制备 Boc全保护的 2, 2-二 4-羟基 -3, 5-二 (对羟基苯基)苯基)丙烷( 1-1 )
Figure imgf000010_0002
将 5· 97g 2, 2-二(4-羟基 -3, 5-二(对羟基苯基)苯基)丙烷( lOmmol ), 21.8g 二碳酸二叔丁酯( lOOmmol )和 0· 30g 4-二甲氨基吡啶( DMAP )加入到 25 OmL三 口瓶中, 再加入 10 OmL四氢呋喃溶剂, 氩气保护下室温反应 12h。 反应结束后旋 蒸出四氢呋喃溶剂, 剩余的混合物用 lOOmL饱和食盐水洗涤, 并用 lOOmL二氯 甲烷萃取三次, 合并有机层用无水疏酸镁千燥, 过滤, 旋蒸得粗产物。 再用乙 酸乙酯 /石油醚做洗脱剂过硅胶柱色谱, 得到白色固体 5.23g, 产率为 43.7%。 MALDI-TOF (C69H8„018) , [M+Na] +: 1219.6。 'H-NMR (400MHz, CDC13) δ 7.44 (d, J=5.35Hz, 8H), 7.25 (s, 4H) , 7.19 (d, J=5.35Hz, 8H) , 1.74 (s, 6H) , 1.56 (s, 36H), 1.13(s, 18H)。 元素分析: C, 69.21%; H, 6.73%, 实测: C, 68.57%; H, 6.72%。 1-1的热失重分析图如附图 1, 其分解温度为 170~175° (:。 实施例 5
制备 2, 2-二(4-甲 |L&-3, 5-二(3 4-二甲 苯基)苯基)丙烷( I-2B )
Figure imgf000011_0001
将 5.72g 双甲基化四溴双酚 A ( lOmmol ) , 10.92g 3, 4-二甲氧基苯硼酸 ( 60mmol )和 0· 58g四(三苯基膦)钯加入到 250mL三口瓶中, 再加入 75mL 2M 碳酸钾溶液和 75mL二氧六环溶剂, 氩气保护下在 90~100。C下反应 48h。 反应结 束后分层, 有机层旋蒸出二氧六环溶剂, 用 lOOmL蒸馏水洗涤, 并用 lOOmL氯 仿萃取三次; 水层用 50mL氯仿萃取三次。 合并所有的有机层, 用无水硫酸镁千 燥后过滤旋蒸得粗产物, 用乙酸乙酯 /石油醚做洗脱剂过硅胶柱色谱, 得到白色 固体粉末 5.94g,产率为 74. Sy^MALDI-TOFO^l^Oj, m/z: 800. l H-NMR (400MHz: CDC13) δ 7.23 (s, 4H), 7.15 (d, J=l.13Hz, 4H) , 7.08 (m, 4H) , 6.93 (d, J=5.2Hz, 4H), 3.92 (s, 12H), 3.89 (s, 12H), 3.22 (s, 6H) , 1.78 (s, 6H)。 实施例 6
制备 2, 2-二(4-羟基 -3, 5-二 3, 4-二羟基苯基)苯基)丙烷( I-2C )
Figure imgf000011_0002
将 8.01g 2, 2-二(4-甲 |L&-3, 5-二(3, 4-二甲 苯基)苯基)丙烷
( lOmmol )和 lOOmL二氯甲烷加入到 250mL三口瓶中, 在 -78°C氩气保护下加入 37.5g三溴化硼(150mmol) , 恢复至室温反应 12h。 反应结束后, 将反应体系 加入到 lOOmL 4N NaOH溶液中, 分出水层, 用 5N盐酸酸化, 再用 lOOmL乙酸乙 酯萃取三次, 合并有机层用无水硫酸镁千燥后过滤旋蒸得白色晶体 6.24g, 产率 为 94.4%。 MALDI-TOF (C39H3201(1) , m/z: 660.2。 'H-NMR (400MHz, acetone) δ 7.91 (s, 4H), 7.86 (s, 4H) , 7.12 (s, 4H) , 7.02 (s, 4H) , 6.84 (m, 8H) , 6.70 (s, 2H), 1.73 (s, 6H)。 实施例 7
制备 Boc全保护的 2, 2-二(4-羟基 -3, 5-二(3, 4-二羟基苯基)苯基)丙烷 ( 1-2 )
Figure imgf000012_0001
将 6· 61g 2, 2-二(4-羟基 -3, 5-二(3, 4-二羟基苯基)苯基)丙烷( l Ommol ) , 32. 7g 二碳酸二叔丁酯 ( 150mmol )和 0· 45g 4-二甲氨基吡啶( DMAP )加入到 250mL三口瓶中, 再加入 10 OmL四氢呋喃溶剂, 氩气保护下室温反应 12h。 反应 结束后旋蒸出四氢呋喃溶剂,剩余的混合物用 l OOmL饱和食盐水洗涤,并用 l OOmL 二氯甲烷萃取三次, 合并有机层用无水疏酸镁千燥, 过滤, 旋蒸得粗产物。 再 用乙酸乙酯 /石油醚做洗脱剂过硅胶柱色谱,得到白色固体 7. 83g,产率为 47. 1%。 'H-NMR (400MHz, DMS0) δ 7. 43 (s, 4Η) , 7. 41 (s, 4Η) , 7. 39 (d, J=l. 12Hz, 4H) , 7. 35 (m, 4H) , 1. 85 (s, 6H) , 1. 48 (s, 36H) , 1. 47 (s, 36H) , 1. 11 (s, 18H)。 元素分析(C89H11203。) : C, 64. 32%; H, 6. 79%, 实测: C, 64. 42%; H, 6. 91%。 1-2的热失重分析图如附图 2所示, 其分解温度为 160 165° (:。 实施例 8
制备 2, 2-二(4-甲 |L&-3- ) 丙烷(I I-1A )
Figure imgf000012_0002
将 3. 86g 2, 2-二 ( 4-羟基 -3-溴苯基)丙烷 ( l Ommol , 由文献 Tetrahedron Let ters , 1997, 38 (27) , 4865-4868·合成得到)和 2· 76g碳酸钟( 20mmo l )加 入到 150mL三口瓶中, 再加入 50mL丙酮溶剂和 4. 26g碘甲烷( 30mmol ), 氩气 保护下 50~60°C回流反应 15h。 反应结束后旋蒸出丙酮溶剂, 并用 50mL水洗涤, 再用 50mL二氯甲烷萃取三次, 合并有机层, 用无水疏酸镁千燥后过滤旋蒸得粗 产物, 并用乙酸乙酯 /石油醚过硅胶柱色谱, 得到白色固体粉末 3. 75g, 产率为 90·6%。 EI-MS (C17H1802Br2) , m/z: 414。 实施例 9
制备 ( II- IB)
Figure imgf000013_0001
将 4.14g 实施例 8中合成的 (II-1A) ( lOmmol ) , 2.94g 5-甲氧基 -1, 3- 苯二硼酸( l5mmol )和 0· 20g四 (三苯基膦)钯加入到 250mL三口瓶中, 再加 入 50mL 2M碳酸钾溶液和 lOOmL二氧六环溶剂, 氩气保护下在 80~100°C下反应 48~72h。 反应结束后分层, 有机层旋蒸出二氧六环溶剂, 用 lOOmL蒸馏水洗涤, 并用 lOOmL氯仿萃取三次; 水层用 50mL氯仿萃取三次。 合并所有的有机层, 用 无水硫酸镁千燥后过滤旋蒸得粗产物, 用乙酸乙酯 /石油醚做洗脱剂过硅胶柱色 谱, 得到白色固体粉末 1.80g, 产率为 49.4%。 MALDI-TOF (C48H4806) , m/z: 720.8。 实施例 10
制备(
Figure imgf000013_0002
将 7.21g 实施例 9中合成的 ( II-1B) ( lOmmol )和 lOOmL二氯甲烷加入 到 250mL三口瓶中, 在 -78°C氩气保护下加入 25.0g三溴化硼(lOOmmol) , 恢 复至室温反应 12h。 反应结束后, 将反应体系加入到 lOOmL 4N NaOH溶液中, 分 出水层, 用 5N盐酸酸化, 再用 lOOmL乙酸乙酯萃取三次, 合并有机层用无水疏 酸镁千燥后过滤旋蒸得白色晶体 5.64g,产率为 88.5%。MALDI-T0F (C42H3606) , m/z: 636.5。 实施例 11
制备 (II- 1)
Figure imgf000014_0001
将 6. 37g 实施例 10中合成的 (I I-IC ) (lOmmol) , 21. 8g 二碳酸二叔丁酯 ( l OOmmol )和 0. 30g 4-二甲氨基吡啶( DMAP )加入到 250mL三口瓶中, 再加入 lOOmL四氢呋喃溶剂, 氩气保护下室温反应 12h。 反应结束后旋蒸出四氢呋喃溶 剂, 剩余的混合物用 l OOmL饱和食盐水洗涤, 并用 lOOmL二氯甲烷萃取三次, 合并有机层用无水硫酸镁千燥, 过滤, 旋蒸得粗产物。 再用乙酸乙酯 /石油醚做 洗脱剂过硅胶柱色谱,得到白色固体 5. 48g,产率为 44. 3%。 MALDI-TOF (C72H84012) , m/z: 1237. 4。 实施例 12
正性光刻胶配方的设计: 将 20mg 分子玻璃 1-2 , lmg三苯基锍三氟甲磺酸 盐溶于 lmL PGMEA中复配成正性光刻胶, 在处理后硅片上旋涂 ( 500~1000rpm,
0~30s; 1000- 2000rpm, 0~30s; 2000~3000rpm, 0~30s ) 30~100nm的薄膜, 成膜性能良好, 所得薄膜厚度均匀, 在 EUV光刻实验中可以得到很好的光刻图 案。 如图 3-5所示, 其中, 图 3-4为采用双光栅千涉得到的光刻图案的电镜照 片, 其曝光周期为 140nm, 可以得到约 30nm的光刻胶沟槽, 图 5为采用四光栅 千涉得到的光刻图案的电镜照片。 从上述电子显微镜照片显示的光刻图案中可 以看出, 本发明的光刻胶具有艮好的分辨率和对比度, 同时具有 4艮低的线边缘 粗糙度。 实施例 13
负性光刻胶配方的设计: 将 20mg分子玻璃 I-2C, 5mg四甲氧基甲基甘脲交 联剂, lmg三苯基锍三氟甲磺酸盐溶于 lmL PGMEA中复配成负性光刻胶, 在经亲 水疏水处理后的硅片上旋涂( 500~1000rpm, 0~30s; 1000~2000rpm, 0~30s;
2000~3000rpm, 0~30s ) 30~100nm的薄膜, 成膜性能良好, 所得薄膜厚度均匀。

Claims

权利 要求
1. 通式(I )或(II ) 化合物,
其中 X独立
Figure imgf000015_0001
的选自 H、 d— 8烷基、 -COOd— 8烷基、 ; R独 立的选自 H、 -0H、 -Od— 8烷基、 -OCOOd— 8烷基、
Figure imgf000015_0002
2. 一 如权利要求 1所述的通式( I )化合物的方法, 其步骤如下:
Figure imgf000015_0003
其中 X、 R如权利要求 1中所定义; 独立的选自 H、 -OC 烷基; Y独立的选自
Ci-8坑>¾
( i )将通式( III ) 四溴双酚 A与 Z-Y或 S02 (0-Y)2反应, 其中 Y为 d— 8烷 基, Z为卤素, 生成化合物(I-A); ( ii )化合物 ( I-A)与
Figure imgf000016_0001
反应生成化合物( I-B); 其中 独立的 选自 H或 -Od— 8烷基;
( iii )化合物 ( I-B )发生去烷基化反应生成通式( I )化合物, 其中, R 独立的选自 H或 -OH, X为 H;
( iv )上述步骤 ( iii )中得到的通式 ( I )化 (C00R3) 20或者 R4Z
反应, 其中 R3任选为 d-8烷基, R4任选为 d-8烷基、
Figure imgf000016_0002
, Z为卤 素, 生成不同程度保护的苯朌型分子玻璃, 即通式(I )化合物。
3. 一 如权利要求 1 述的通式( II )化合物的方法, 其步骤如下
Figure imgf000016_0003
其中 X、 R如权利要求 1中所定义; 独立的选自 H、 -OC 烷基; Y独立的选自
Ci-8坑>¾
( 1 )将通式(IV )二溴双酚 A或其衍生物与 Z-Y或 S02 (0-Y) 2反应, 其中 Y为(\— 8烷基, Z为卤素, 生成化合物(II-A );
( 2 )化合物 ( Π-Α )与
Figure imgf000016_0004
反应生成化合物 ( Π-Β ), 其中 独立的选自 Η或 -OC 烷基;
( 3 )化合物( Π-Β )发生去烷基化反应生成通式( II )化合物, 其中, R 独立的选自 H或 -OH, X为 H;
( 4 )上述步骤( 3 ) 中得到的通式( I I )化合 (C00R3) 20或者 R4Z
反应, 其中 R3任选为 d-8烷基, R 壬选为 d-8烷基、
Figure imgf000017_0001
、 , Z为卤 素, 得到不同程度保护的杯芳烃型分子玻璃, 即通式(I I )化合物。
4. 如权利要求 1所述的化合物的用途, 其中朌羟基未保护的化合物可用于负性 光刻胶; 酚羟基全保护的化合物可用于正性光刻胶; 酚羟基部分保护的化合 物可用于正性或负性光刻胶。
5. 一种负性光刻胶组合物, 包括如权利要求 1中所述的可作为负性光刻胶使用 的酚羟基未保护或部分保护的通式( I )或( I I )化合物, 以及光酸产生剂、 交联剂、 光刻胶溶剂。
6. 如权利要求 5所述的负性光刻胶组合物,其特征为:含有 0. 1%~10% (质量比) 的通式( I )或( I I ) , 0. 01%~1% (质量比)的交联剂, 0· 01%~1% (质量比) 的光酸产生剂。
7. 一种正性光刻胶组合物, 包括如权利要求 1中所述的可作为正性光刻胶使用 的酚羟基全保护或部分保护的通式( I )或( I I )化合物, 以及光酸产生剂、 光刻胶溶剂, 优选含有 1%~10% (质量比) 的通式( I )或( I I ) , 优选含有
0. 01%~1% (质量比) 的光酸产生剂。
8. 如权利要求 5-7中任一项所述的光刻胶组合物, 其特征为, 光酸产生剂包括 离子型或非离子型, 如三苯基锍三氟甲磺酸盐、 二( 4-叔丁基苯基)碘鎿对 甲苯横酸盐、 N-羟基萘酰亚胺三氟甲磺酸盐等; 交联剂包括四甲氧基甲基甘 脲、 2, 4-二羟甲基 -6-甲基苯酚 ( 2, 4-DMMP )等; 光刻胶溶剂包括丙二醇甲 醚醋酸酯(PGMEA ) 、 乳酸乙酯、 乙二醇单甲醚、 环己酮等。
9. 一种光刻胶涂层, 其特征为, 将如权利要求 5-8中任一项所述的正性或负性 光刻胶组合物通过匀胶机在疏水处理后的硅片上进行旋涂。
10.权利要求 1所述的化合物或权利要求 5-8中任一项所述的光刻胶组合物的用 途, 其特征在于: 用于 248nm光刻、 193nm光刻、 极紫外光刻、 纳米压印光 刻或电子束光刻等现代光刻技术中, 尤其适合使用于极紫外( EUV )光刻工 艺中。
PCT/CN2012/075707 2012-03-16 2012-05-18 含双酚a骨架结构的分子玻璃光刻胶及其制备方法和应用 WO2013134997A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014561253A JP5977842B2 (ja) 2012-03-16 2012-05-18 ビスフェノールa骨格構造含有の分子性ガラスフォトレジスト及びその製造方法並びに応用
US14/385,238 US9454076B2 (en) 2012-03-16 2012-05-18 Molecular glass photoresists containing bisphenol a framework and method for preparing the same and use thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210070735 2012-03-16
CN201210070735.2 2012-03-16

Publications (1)

Publication Number Publication Date
WO2013134997A1 true WO2013134997A1 (zh) 2013-09-19

Family

ID=49130147

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2012/075707 WO2013134997A1 (zh) 2012-03-16 2012-05-18 含双酚a骨架结构的分子玻璃光刻胶及其制备方法和应用

Country Status (4)

Country Link
US (1) US9454076B2 (zh)
JP (1) JP5977842B2 (zh)
CN (1) CN103304385B (zh)
WO (1) WO2013134997A1 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015137486A1 (ja) * 2014-03-13 2015-09-17 三菱瓦斯化学株式会社 化合物、樹脂、リソグラフィー用下層膜形成材料、リソグラフィー用下層膜、パターン形成方法、及び化合物又は樹脂の精製方法
WO2016129679A1 (ja) * 2015-02-12 2016-08-18 三菱瓦斯化学株式会社 化合物、樹脂、リソグラフィー用下層膜形成材料、リソグラフィー用下層膜形成用組成物、リソグラフィー用下層膜、レジストパターン形成方法、回路パターン形成方法及び化合物又は樹脂の精製方法
EP3118684A4 (en) * 2014-03-13 2017-11-29 Mitsubishi Gas Chemical Company, Inc. Resist composition and method for forming resist pattern
US10642156B2 (en) 2015-03-30 2020-05-05 Mitsubishi Gas Chemical Company, Inc. Resist base material, resist composition and method for forming resist pattern
US10747112B2 (en) 2015-03-30 2020-08-18 Mitsubishi Gas Chemical Company, Inc. Compound, resin, and purification method thereof, material for forming underlayer film for lithography, composition for forming underlayer film, and underlayer film, as well as resist pattern forming method and circuit pattern forming method
WO2022032945A1 (zh) * 2020-08-11 2022-02-17 中国科学院化学研究所 一种双酚a衍生物及其制备方法和在光刻中的应用

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10745372B2 (en) 2014-12-25 2020-08-18 Mitsubishi Gas Chemical Company, Inc. Compound, resin, material for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and purification method
CN107407874A (zh) * 2015-03-30 2017-11-28 三菱瓦斯化学株式会社 辐射敏感组合物、非晶膜和抗蚀图案形成方法
KR102562846B1 (ko) 2015-03-31 2023-08-02 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 레지스트 조성물, 레지스트패턴 형성방법, 및 이것에 이용하는 폴리페놀 화합물
EP3279727B1 (en) 2015-03-31 2021-06-09 Mitsubishi Gas Chemical Company, Inc. Compound, resist composition, and method for forming resist pattern using it
CN107533288B (zh) * 2015-05-28 2021-10-19 英特尔公司 用于解耦合光致抗蚀剂的扩散和溶解性切换机制的手段
CN104914672B (zh) * 2015-06-11 2020-08-21 中国科学院化学研究所 基于含多羟基结构分子玻璃的底部抗反射组合物及其应用
WO2017038643A1 (ja) 2015-08-31 2017-03-09 三菱瓦斯化学株式会社 リソグラフィー用下層膜形成材料、リソグラフィー用下層膜形成用組成物、リソグラフィー用下層膜及びその製造方法、並びにレジストパターン形成方法
JP6919838B2 (ja) 2015-08-31 2021-08-18 三菱瓦斯化学株式会社 リソグラフィー用下層膜形成材料、リソグラフィー用下層膜形成用組成物、リソグラフィー用下層膜及びその製造方法、パターン形成方法、樹脂、並びに精製方法
CN108137478B (zh) * 2015-09-10 2021-09-28 三菱瓦斯化学株式会社 化合物、其组合物、纯化方法以及抗蚀图案形成方法、非晶膜的制造方法
KR102465065B1 (ko) * 2015-09-29 2022-11-09 프라이요그, 엘엘씨 금속 조성물 및 이의 제조 방법
KR102619528B1 (ko) 2015-12-09 2023-12-29 삼성전자주식회사 포토레지스트 조성물, 패턴 형성 방법 및 반도체 장치의 제조 방법
US11130724B2 (en) 2015-12-25 2021-09-28 Mitsubishi Gas Chemical Company, Inc. Compound, resin, composition, resist pattern formation method, and circuit pattern formation method
CN108084028B (zh) * 2016-11-23 2020-05-26 中国科学院化学研究所 含双酚a骨架结构的分子玻璃光刻胶的制备方法
CN108147983B (zh) * 2016-12-05 2020-01-31 中国科学院化学研究所 一类硫鎓盐键合苯多酚型分子玻璃光刻胶及其制备方法和应用
CN109305955B (zh) * 2017-07-26 2020-12-22 深圳前海广宇天骥科技有限公司 含四苯基噻酚结构的分子玻璃光刻胶的制备方法
CN110032040B (zh) * 2018-01-12 2020-09-22 中国科学院化学研究所 化学放大胶组合物及其在紫外光刻的应用
CN112142769B (zh) * 2019-06-27 2022-02-01 中国科学院理化技术研究所 含硅多苯基单分子树脂及其光刻胶组合物
CN111153774B (zh) * 2020-01-16 2022-11-11 江苏理工学院 一种同时合成四溴双酚a单甲基醚和二甲基醚的制备方法
CN111302979A (zh) * 2020-03-04 2020-06-19 苏州瑞红电子化学品有限公司 一种单组份分子玻璃及其制备方法和应用
CN114114840A (zh) * 2021-11-26 2022-03-01 山东大学 一种基于单宁酸的正性光刻材料及其制备方法、光刻胶体系及在制备微纳电路中的应用
WO2024087158A1 (zh) * 2022-10-28 2024-05-02 中国科学院化学研究所 含硅高抗刻蚀分子玻璃光刻胶化合物及其制备方法和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5561183A (en) * 1995-08-14 1996-10-01 Sam Yang Co., Ltd. Preparation method of antibacterial and deodorant polyester for fiber
JP2002201262A (ja) * 2000-12-28 2002-07-19 Mitsui Chemicals Inc ポリカーボネート樹脂、及びそれを含んで構成される光学部品
JP2010129292A (ja) * 2008-11-26 2010-06-10 Kaneka Corp 高分子電解質、高分子電解質膜、およびその利用

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6363629A (ja) * 1986-09-02 1988-03-22 Idemitsu Petrochem Co Ltd 2,2−ビス(4’−ヒドロキシフエニル)プロパンの製造方法
JP2009108152A (ja) * 2007-10-29 2009-05-21 Sumitomo Chemical Co Ltd 重合性化合物および光学フィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5561183A (en) * 1995-08-14 1996-10-01 Sam Yang Co., Ltd. Preparation method of antibacterial and deodorant polyester for fiber
JP2002201262A (ja) * 2000-12-28 2002-07-19 Mitsui Chemicals Inc ポリカーボネート樹脂、及びそれを含んで構成される光学部品
JP2010129292A (ja) * 2008-11-26 2010-06-10 Kaneka Corp 高分子電解質、高分子電解質膜、およびその利用

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
WANG, Z.Y. ET AL.: "Synthesis of 2,6-Diphenyl-4,4'-(1-methylethylidene)bisphenol and 2,2',6,6'-Tetraphenyl-4,4'-(1-methylethylidene)bisphenol.", SYNTHESIS, no. 6, 1989, pages 471 - 472 *

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10294183B2 (en) 2014-03-13 2019-05-21 Mitsubishi Gas Chemical Company, Inc. Compound, resin, material for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying the compound or resin
KR102318654B1 (ko) * 2014-03-13 2021-10-28 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 화합물, 수지, 리소그래피용 하층막 형성재료, 리소그래피용 하층막, 패턴 형성방법, 및 화합물 또는 수지의 정제방법
KR20160134682A (ko) * 2014-03-13 2016-11-23 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 화합물, 수지, 리소그래피용 하층막 형성재료, 리소그래피용 하층막, 패턴 형성방법, 및 화합물 또는 수지의 정제방법
JPWO2015137486A1 (ja) * 2014-03-13 2017-04-06 三菱瓦斯化学株式会社 化合物、樹脂、リソグラフィー用下層膜形成材料、リソグラフィー用下層膜、パターン形成方法、及び化合物又は樹脂の精製方法
US10303055B2 (en) 2014-03-13 2019-05-28 Mitsubishi Gas Chemical Company, Inc. Resist composition and method for forming resist pattern
EP3118684A4 (en) * 2014-03-13 2017-11-29 Mitsubishi Gas Chemical Company, Inc. Resist composition and method for forming resist pattern
WO2015137486A1 (ja) * 2014-03-13 2015-09-17 三菱瓦斯化学株式会社 化合物、樹脂、リソグラフィー用下層膜形成材料、リソグラフィー用下層膜、パターン形成方法、及び化合物又は樹脂の精製方法
EP3257835A4 (en) * 2015-02-12 2018-10-03 Mitsubishi Gas Chemical Company, Inc. Compound, resin, lithography underlayer film forming material, lithography underlayer film forming composition, lithography underlayer film, method for forming resist pattern, method for forming circuit pattern, and method for purifying compound or resin
JPWO2016129679A1 (ja) * 2015-02-12 2017-11-24 三菱瓦斯化学株式会社 化合物、樹脂、リソグラフィー用下層膜形成材料、リソグラフィー用下層膜形成用組成物、リソグラフィー用下層膜、レジストパターン形成方法、回路パターン形成方法及び化合物又は樹脂の精製方法
WO2016129679A1 (ja) * 2015-02-12 2016-08-18 三菱瓦斯化学株式会社 化合物、樹脂、リソグラフィー用下層膜形成材料、リソグラフィー用下層膜形成用組成物、リソグラフィー用下層膜、レジストパターン形成方法、回路パターン形成方法及び化合物又は樹脂の精製方法
US10642156B2 (en) 2015-03-30 2020-05-05 Mitsubishi Gas Chemical Company, Inc. Resist base material, resist composition and method for forming resist pattern
US10747112B2 (en) 2015-03-30 2020-08-18 Mitsubishi Gas Chemical Company, Inc. Compound, resin, and purification method thereof, material for forming underlayer film for lithography, composition for forming underlayer film, and underlayer film, as well as resist pattern forming method and circuit pattern forming method
WO2022032945A1 (zh) * 2020-08-11 2022-02-17 中国科学院化学研究所 一种双酚a衍生物及其制备方法和在光刻中的应用
CN114075155A (zh) * 2020-08-11 2022-02-22 中国科学院化学研究所 一种双酚a衍生物及其制备方法和在光刻中的应用
CN114075155B (zh) * 2020-08-11 2023-08-01 中国科学院化学研究所 一种双酚a衍生物及其制备方法和在光刻中的应用

Also Published As

Publication number Publication date
US9454076B2 (en) 2016-09-27
CN103304385B (zh) 2015-04-15
JP2015514691A (ja) 2015-05-21
US20150037735A1 (en) 2015-02-05
JP5977842B2 (ja) 2016-08-24
CN103304385A (zh) 2013-09-18

Similar Documents

Publication Publication Date Title
WO2013134997A1 (zh) 含双酚a骨架结构的分子玻璃光刻胶及其制备方法和应用
TWI312908B (en) Resist composition, process for producing resist pattern, and compound
US6492441B2 (en) Anti reflective coating polymers and the preparation method thereof
TWI263861B (en) Resist material and pattern forming method
TW200918502A (en) Cyclic compound, photoresist base material and photoresist composition
TW201121932A (en) Cyclic compound, fabricating method thereof, radiation-sensitive composition, and forming method of resist pattern
EP1444550A2 (en) Polycarbocyclic derivatives for modification of resist, optical and etch resistance properties
TW201013333A (en) Resist processing method
TW200946500A (en) Cyclic compound, photoresist base, photoresist composition, microfabrication process, and semiconductor device
TW200905398A (en) Photoresist base material and photoresist composition containing the same
Shirai et al. i-Line sensitive photoacid generators for UV curing
TW200927725A (en) Photosensitive compound and photoresist composition including the same
JP2005053832A (ja) フラーレン誘導体およびフラーレン複合化レジスト
CN108341748B (zh) 一种基于1,4二取代柱[5]芳烃衍生物的单分子树脂、正性光刻胶及其应用
WO2020259126A1 (zh) 含硅多苯基单分子树脂及其光刻胶组合物
TW201925410A (zh) 光酸產生劑、抗蝕劑組合物、以及使用該抗蝕劑組合物的設備的製造方法
CN113200858B (zh) 基于三蝶烯衍生物单分子树脂的合成、正性光刻胶及其在光刻中的应用
De Silva et al. Hydroxyphenylbenzene derivatives as glass forming molecules for high resolution photoresists
TW200918501A (en) Compounds and radiation-sensitive compositions
CN108314785B (zh) 八苯基取代笼形倍半硅氧烷衍生物分子玻璃及其应用
CN107266319B (zh) 树枝状多苯基取代金刚烷衍生物单分子树脂、正性光刻胶组合物和负性光刻胶组合物
US9290435B2 (en) Molecular glass of spirofluorene derivative, preparation method thereof and use thereof in photo-etching
CN112830944B (zh) 基于二茂金属化合物的光刻胶及其制备方法和应用
CN117865866B (zh) 基于三蝶烯的多硫鎓盐单分子树脂光刻胶及其制备方法
Echigo et al. Development of new phenylcalix [4] resorcinarene: its application to positive-tone molecular resist for EB and EUV lithography

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12871214

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 14385238

Country of ref document: US

ENP Entry into the national phase

Ref document number: 2014561253

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12871214

Country of ref document: EP

Kind code of ref document: A1