WO2013128710A1 - Dispositif d'application de revêtement, dispositif et procédé de retenue de substrat - Google Patents

Dispositif d'application de revêtement, dispositif et procédé de retenue de substrat Download PDF

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Publication number
WO2013128710A1
WO2013128710A1 PCT/JP2012/077874 JP2012077874W WO2013128710A1 WO 2013128710 A1 WO2013128710 A1 WO 2013128710A1 JP 2012077874 W JP2012077874 W JP 2012077874W WO 2013128710 A1 WO2013128710 A1 WO 2013128710A1
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WIPO (PCT)
Prior art keywords
substrate
stage
edge
electronic paper
pressing
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Application number
PCT/JP2012/077874
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English (en)
Japanese (ja)
Inventor
隆史 田中
Original Assignee
大日本スクリーン製造株式会社
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Publication date
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Publication of WO2013128710A1 publication Critical patent/WO2013128710A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Definitions

  • the present invention relates to substrates for electronic paper, glass substrates for organic EL display devices, glass substrates for liquid crystal display devices, panel substrates for solar cells, glass substrates for PDP, glass substrates for photomasks, substrates for optical disks, etc.
  • the present invention relates to a coating apparatus for coating a coating liquid, and a substrate holding apparatus and a substrate holding method that can be suitably applied to the coating apparatus.
  • a coating apparatus for coating a substrate with a coating liquid is relatively in a horizontal direction with respect to a stage on which the substrate is placed and a surface of the substrate placed on the stage. And a slit nozzle that applies the coating liquid to the surface of the substrate by moving.
  • the flatness of the surface of the substrate greatly affects the coating accuracy. Therefore, a stone surface plate with a flatness of about several micrometers is used as the stage, and the substrate is placed on this stage. It is trying to hold it by adsorption.
  • JP 2011-47984 A Japanese Patent Laid-Open No. 2003-340787 JP 2004-235386 A
  • an electronic paper substrate has a configuration in which a support layer, an adhesive layer, and an electronic paper film are laminated in this order.
  • the size of the electronic paper film is slightly smaller than the size of the support layer, and the edge of the electronic paper film is disposed about 10 mm inside the edge of the support layer.
  • contact with the electronic paper film is forbidden.
  • the periphery of the support layer is on the electronic paper film side. Contact is allowed only to the part.
  • the substrate In addition to the electronic paper substrate, the substrate generally has a central portion as a non-contactable region and a peripheral portion as a contactable region.
  • the present invention has been made to solve the above-described problems, and an object thereof is to provide a coating apparatus, a substrate holding apparatus, and a substrate holding method capable of suitably holding a substrate on a stage.
  • a stage on which a substrate having a central portion as a non-contactable region and a peripheral portion as a contactable region is placed, and in a state close to the surface of the substrate placed on the stage.
  • a slit nozzle that applies a coating liquid to the surface of the substrate by moving in a horizontal direction relative to the substrate, and a peripheral portion of the substrate placed on the stage
  • a substrate holding mechanism that presses the substrate toward the stage, the substrate holding mechanism including an abutting member that positions the substrate by abutting against an edge of the substrate placed on the stage, and the contact on the surface of the substrate.
  • a pressing member that presses a region separated from the contact position between the contact member and the edge of the substrate toward the central portion of the substrate by a predetermined distance toward the stage.
  • the substrate holding mechanism is arranged in a plurality of recesses formed on the stage around the substrate placed on the stage. Established.
  • the substrate holding mechanism includes a support portion that supports the contact member and the pressing member, and the contact member is placed on the stage.
  • a horizontal movement mechanism that moves the support portion between a contact position that contacts the edge of the substrate and a retreat position in which the contact member retracts from the edge of the substrate placed on the stage;
  • the support member is moved between a pressing position where the pressing member presses the surface of the substrate placed on the stage and a separation position where the pressing member separates from the surface of the substrate placed on the stage.
  • a lifting mechanism that moves the support portion between a contact position that contacts the edge of the substrate and a retreat position in which the contact member retracts from the edge of the substrate placed on the stage.
  • the invention according to claim 4 is the invention according to claim 3, wherein after the pressing member is moved from the separation position to the pressing position by the elevating mechanism, the contact member is placed on the stage with respect to the pressing member.
  • a contact member moving mechanism for moving in a direction away from the edge of the placed substrate is provided.
  • the invention according to claim 5 is the invention according to claim 3, wherein after the hole formed in the stage and the abutting member abut against the edge of the substrate, the pressing member is Exhaust means for exhausting air from the hole before pressing the substrate is further provided.
  • the invention according to claim 6 is the invention according to any one of claims 1 to 5, wherein the substrate is for electronic paper in which a support layer, an adhesive layer, and an electronic paper film are laminated in this order. It is a substrate.
  • the invention according to claim 7 is a substrate holding device that presses a peripheral portion of a substrate having a central portion as a non-contactable region and a peripheral portion as a contactable region toward the stage, and is placed on the stage.
  • a contact member that positions the substrate by contacting the edge of the substrate and a contact position between the contact member and the edge of the substrate on the surface of the substrate by a predetermined distance toward the center of the substrate.
  • a pressing member that presses the region toward the stage, a support portion that supports the contact member and the pressing member, and the support portion. The support member is disposed on the stage on which the contact member is placed on the stage.
  • a horizontal movement mechanism that moves between a contact position that contacts the edge and a retreat position that retreats from an edge of the substrate placed on the stage, and the support portion, the pressing member is mounted on the stage. Press the surface of the placed substrate And pressure position, characterized in that a lifting mechanism for moving between a distant position away from the mounted surface of the substrate on the stage.
  • the invention according to claim 8 is a substrate holding method for sucking and holding on a stage a substrate having a central portion as an inaccessible region and a peripheral portion as a contactable region, wherein the substrate is placed on the stage.
  • the contact position between the contact member and the edge of the substrate on the surface of the substrate when the degree of vacuum of the hole formed near the edge of the substrate does not reach a certain value Away from the center of the board by a predetermined distance Characterized by comprising a pressing step of pressing toward the stage by the pressing member area.
  • the entire area of the substrate is brought into contact with the stage by pressing only the contactable area of the substrate with the pressing member without contacting the non-contactable area of the substrate. It can be held on the stage in a state.
  • the third aspect of the present invention it is possible to perform positioning and pressing of the substrate by simultaneously moving the contact member and the pressing member by the horizontal movement mechanism and the lifting mechanism.
  • the sixth aspect of the present invention it is possible to suitably hold the electronic paper substrate that is likely to be warped, with the central portion being a non-contactable region, on the stage.
  • the substrate can be sucked and held on the stage after the substrate is easily moved and positioned by the action of the gas ejected from the hole. Then, only the contactable area of the substrate is pressed by the pressing member without contacting the noncontactable area of the substrate, and the edge of the substrate can be sucked and held on the stage. At this time, since the substrate is pressed by the pressing member only when the edge of the substrate is not sucked and held by the stage due to the warp of the substrate, the sucking and holding work of the substrate can be performed efficiently.
  • FIG. 3 is a schematic diagram showing the relationship between holes 98 and 99 and suction grooves 91 and 92 formed on the surface of the stage 11.
  • FIG. It is a schematic diagram showing exhaust to the holes 98 and 99 and a gas supply system.
  • FIG. 1 is a perspective view of a coating apparatus according to the present invention.
  • FIG. 2 is a schematic side view of the coating apparatus according to the present invention.
  • a nozzle cleaning mechanism 31 and a pre-dispensing mechanism 34 which will be described later, are not shown.
  • FIG. 2 the carriage 14 and the like which will be described later are not shown.
  • this coating apparatus is for applying a coating solution to an electronic paper substrate 100 in which an electronic paper film and a support layer are bonded by an adhesive layer. That is, the electronic paper substrate 100 to which the coating solution is applied by this coating apparatus has a configuration in which a support layer, an adhesive layer, and an electronic paper film are laminated in this order. Such an electronic paper substrate 100 has a characteristic that warpage is likely to occur.
  • This coating apparatus includes a stage 11 for sucking and holding the electronic paper substrate 100.
  • a stone surface plate or the like whose flatness of the upper surface is about several micrometers is used.
  • a suction groove which will be described later, is formed on the surface of the stage 11.
  • the stage 11 is formed with eight recesses 12 for accommodating the substrate holding mechanisms 40 and 60 according to the present invention.
  • the electronic paper substrate 100 sucked and held on the stage 11 is pressed toward the stage 11 by the substrate holding mechanisms 40 and 60.
  • the stage 11 is provided with a plurality of lift pins (not shown) at appropriate intervals. The lift pins support the electronic paper substrate 100 from below and lift it above the surface of the stage 11 when the electronic paper substrate 100 is carried in and out.
  • a carriage 14 is provided above the stage 11 and extends substantially horizontally from both sides of the stage 11.
  • the carriage 14 includes a nozzle support portion 15 for supporting the slit nozzle 13 and a pair of left and right lifting mechanisms 16 for supporting both ends of the nozzle support portion 15.
  • a pair of running rails 17 extending in parallel to the substantially horizontal direction are disposed at both ends of the stage 11. These running rails 17 reciprocate the carriage 14 in the X direction shown in FIG. 1 by guiding both ends of the carriage 14.
  • a pair of linear motors 20 each provided with a stator 21 and a mover 22 are disposed on both sides of the stage 11 and the carriage 14 along the edges on both sides of the stage 11.
  • a pair of linear encoders 23 each having a scale portion and a detector are fixed to both sides of the stage 11 and the carriage 14. The linear encoder 23 detects the position of the carriage 14.
  • a nozzle cleaning mechanism 31 is disposed on the side of the stage 11.
  • the nozzle cleaning mechanism 31 includes a cleaning block 32 and a standby pod 33.
  • the slit nozzle 13 is cleaned by the nozzle cleaning mechanism 31 before or after the coating operation is performed.
  • a pre-dispensing mechanism 34 is disposed on the side of the stage 11.
  • the pre-dispensing mechanism 34 includes a pre-dispensing roller 36 in which a part thereof is immersed in the cleaning liquid stored in the storage tank 35 and a doctor blade 37.
  • the pre-dispensing roller 36 and the doctor blade 37 have a length equal to or longer than that of the slit nozzle 13 in the Y direction.
  • the pre-dispensing roller 36 is rotated by driving a motor (not shown).
  • FIG. 3 is a schematic diagram showing the relationship between the holes 98 and 99 and the suction grooves 91 and 92 formed on the surface of the stage 11.
  • FIG. 4 is a schematic view showing an exhaust and gas supply system to the holes 98 and 99.
  • a hole 99 is formed in the stage 11 at a position facing the vicinity of the center of the electronic paper substrate 100.
  • suction grooves 92 communicating with the hole 99 are formed in a number of rectangular shapes at positions facing the vicinity of the central portion of the electronic paper substrate 100 on the stage 11.
  • a hole 98 is formed in the stage 11 at a position facing the vicinity of the periphery of the electronic paper substrate 100.
  • suction grooves 91 communicating with the holes 98 are formed in a plurality of rectangular shapes so as to surround the suction grooves 92 at positions facing the vicinity of the periphery of the electronic paper substrate 100 on the stage 11. ing.
  • each hole 99 communicates with the chamber 94 shown in FIG.
  • the chamber 94 is connected to a nitrogen gas supply source (not shown) via a switching valve 96a.
  • the chamber 94 is connected to an exhaust means such as a vacuum pump (not shown) via a switching valve 96a and an on-off valve 97a.
  • a pressure gauge 95a is disposed between the chamber 94 and the switching valve 96a.
  • each hole 98 communicates with the chamber 93.
  • the chamber 93 is connected to a nitrogen gas supply source (not shown) via a switching valve 96b.
  • the chamber 93 is connected to an exhaust means such as a vacuum pump (not shown) via a switching valve 96b and an on-off valve 97b.
  • a pressure gauge 95b is disposed between the chamber 93 and the switching valve 96b.
  • the chamber 93 communicating with the hole 98 formed at a position facing the vicinity of the periphery of the electronic paper substrate 100 may be a single one having a shape surrounding the chamber 94, and is divided into a plurality of parts. It may be what was done.
  • FIG. 4 shows a case where the chamber 93 is divided into two parts.
  • the opening / closing valve 97a is first opened and the central portion of the electronic paper substrate 100 is sucked and held on the stage 11, and then the bag opening / closing valve 97b is opened to surround the electronic paper substrate 100. The part is sucked and held on the stage 11.
  • the degree of vacuum of the chambers 93 and 94 at this time that is, the degree of vacuum in the region between the electronic paper substrate 100 and the stage 11 is measured by pressure gauges 95a and 95b.
  • the electronic paper substrate 100 is suction-held on the stage 11.
  • the peripheral portion of the electronic paper substrate 100 is pressed toward the stage 11 by the substrate holding mechanisms 40 and 60 disposed in the eight recesses 12 as necessary.
  • the slit nozzle 13 is moved along the surface of the electronic paper substrate 100 by driving the linear motor 20 in a state where the slit nozzle 13 is brought close to the surface of the electronic paper substrate 100 adsorbed and held on the stage 11.
  • the coating liquid is supplied to the surface of the electronic paper substrate 100. Thereby, a thin film of the coating liquid is formed on the surface of the electronic paper substrate 100.
  • FIGS. 5, 6, 7, and 9 are side sectional views of the substrate holding mechanism 40.
  • 8 is a cross-sectional view taken along the line AA in FIG. 7
  • FIG. 10 is a cross-sectional view taken along the line AA in FIG.
  • the substrate holding mechanism 40 is for pressing the peripheral portion of the electronic paper substrate 100 in which the electronic paper film 101 and the support layer 102 are laminated via the adhesive layer toward the stage 11. Are disposed in each of the eight recesses 12 formed in each.
  • the substrate holding mechanism 40 is a roller-shaped member that is used to position the electronic paper substrate 100 by being in contact with the edge of the electronic paper substrate 100 and is rotatable about a vertical axis.
  • the contact member 41 which consists of is provided.
  • the substrate holding mechanism 40 is separated from the contact position between the contact member 41 on the surface of the electronic paper substrate 100 and the edge of the electronic paper substrate 100 by a predetermined distance from the center of the electronic paper substrate 100.
  • a pressing member 42 made of an O-ring wound around a rod-shaped member 47 is used to press the region thus pressed toward the stage 11.
  • the contact member 41 is supported by the first support portion 43. Further, the pressing member 42 is supported by the first support portion 43 via a rod-shaped member 47.
  • the first support portion 43 is configured to be slidable with respect to the pair of guide shafts 44 disposed on the second support portion 45. As shown in FIGS. 8 and 10, a spring 46 is disposed between the shaft 48 disposed on the second support portion 45 and the first support portion 43.
  • the distance between the contact position of the contact member 41 and the edge of the electronic paper substrate 100 and the pressing position of the surface of the electronic paper substrate 100 by the pressing member 42 is set to about 5 mm, for example. Yes. That is, the distance between the contact position of the contact member 41 and the edge of the electronic paper substrate 100 and the pressing position of the surface of the electronic paper substrate 100 by the pressing member 42 is the electronic paper for the electronic paper substrate 100. The distance is set to be smaller than the distance between the edge of the film 101 and the edge of the support layer 102.
  • the first support portion 43 is mounted on the stage 11 with a pressing position where the pressing member 42 presses the surface of the electronic paper substrate 100 placed on the stage 11 by an air slider 51 including an air cylinder and a guide member. It raises / lowers between the separated positions separated from the surface of the placed electronic paper substrate 100.
  • the air slider 51 includes a contact position where the contact member 41 contacts the edge of the electronic paper substrate 100 placed on the stage 11 by the air slider 52 fixed on the base 53, and the stage. 11 is moved between a retreat position and a retreat position where the electronic paper substrate 100 is retreated from an edge of the electronic paper substrate 100.
  • a contact member 54 that can change the position of its upper end by the action of the screw 55 is disposed on the base 53.
  • the substrate holding mechanism 40 enters a standby state shown in FIG. ing.
  • a pressing operation for pressing the peripheral edge of the electronic paper substrate 100 toward the stage 11 is started, first, the switching valves 96a and 96b and the on-off valves 97a and 97b shown in FIG. Nitrogen gas is ejected from the hole 98 and the hole 99 formed in the above. This facilitates the horizontal movement of the electronic paper substrate 100 on the stage 11.
  • the first support portion 43 and the second support portion 45 are raised together with the contact member 41 and the pressing member 42 by the action of the air slider 51.
  • the air slider 51 is moved in the direction close to the electronic paper substrate 100 placed on the stage 11 by the action of the air slider 52. Accordingly, the contact member 41 is in contact with the edge of the electronic paper substrate 100 from the retracted position retracted from the edge of the electronic paper substrate 100 together with the first and second support portions 43 and 45 and the like. Move to position. As the contact member 41 moves, the electronic paper substrate 100 is positioned on the stage 11.
  • the adsorption holding state of the electronic paper substrate 100 with respect to the stage 11 at this time can be confirmed by the measured values of the atmospheric pressure in the chambers 93 and 94 by the pressure gauges 95a and 95b.
  • the coating liquid is applied as it is. Start operation.
  • the vicinity thereof may not be attracted and held on the stage 11.
  • the atmospheric pressure in the chamber 93 corresponding to the peripheral portion of the electronic paper substrate 100 does not drop.
  • the pressure gauge 95 b detects such a state, the peripheral portion of the electronic paper substrate 100 is pressed toward the stage 11 by the pressing member 42 in the substrate holding mechanism 40.
  • the first support portion 43 and the second support portion 45 are moved down together with the contact member 41 and the pressing member 42 by the action of the air slider 51.
  • the pressing member 42 moves from a separation position separated from the surface of the electronic paper substrate 100 placed on the stage 11 to a pressing position that presses the surface of the electronic paper substrate 100 placed on the stage 11.
  • the entire surface of the electronic paper substrate 100 comes into contact with the stage 11, and the entire surface of the electronic paper substrate 100 is sucked and held on the stage 11.
  • the pressing force of the surface of the electronic paper substrate 100 by the pressing member 42 is maintained at a predetermined level by the action of the spring 46.
  • the magnitude of the pressing force at this time can be adjusted to an appropriate value by changing the height position of the contact member 54.
  • the contact position between the contact member 41 and the edge of the electronic paper substrate 100, and the surface of the electronic paper substrate 100 by the pressing member 42 is set to be smaller than the distance between the edge of the electronic paper film 101 in the electronic paper substrate 100 and the edge of the support layer 102 in the electronic paper substrate 100. It is possible to press only the support layer 102 that is the contactable area of the electronic paper substrate 100 with the pressing member 42 without contacting the electronic paper film 101 that is the non-contactable area.
  • the electronic paper substrate 100 is pressed by the pressing member 42 only when the edge of the electronic paper substrate 100 is not attracted and held by the stage 11 due to the warp of the electronic paper substrate 100. It is possible to efficiently perform the suction holding operation of the substrate 100.
  • FIG. 11 to 15 are explanatory views showing the operation of holding the electronic paper substrate 100 by the substrate holding mechanism 60 according to the second embodiment of the present invention.
  • FIG. 16 is a schematic plan view of the substrate holding mechanism 60.
  • symbol is attached
  • An abutting member moving mechanism including wedge-shaped members 61 and 62 for moving in a direction away from the edge of 100 is provided.
  • the pair of wedge-shaped members 61 and 62 are provided with inclined surfaces facing each other, and the inclined surfaces are in contact with each other.
  • the wedge-shaped member 61 is connected to the first support portion 43, and the wedge-shaped member 62 is connected to the second support portion 45. Further, the wedge-shaped members 61 and 62 are urged by the spring 63 through the first support portion 43 and the second support portion 45 in the direction in which the inclined surface always abuts.
  • the contact member 41 made of a roller-like member that can rotate around the vertical axis is disposed on a connecting member 64 connected to the wedge-shaped member 62.
  • the substrate holding mechanism 60 enters a standby state shown in FIG. ing.
  • the pressing operation for pressing the peripheral edge of the electronic paper substrate 100 toward the stage 11 is started, first, as in the case of the first embodiment described above, first, the switching valves 96a and 96b and the on-off valve 97a shown in FIG. , 97b is operated to blow out nitrogen gas from the hole 98 and hole 99 formed on the stage 11. This facilitates the horizontal movement of the electronic paper substrate 100 on the stage 11.
  • the first support portion 43 and the second support portion 45 are raised together with the contact member 41 and the pressing member 42 by the action of the air slider 51.
  • the air slider 51 is moved in the direction close to the electronic paper substrate 100 placed on the stage 11 by the action of the air slider 52. Accordingly, the contact member 41 is in contact with the edge of the electronic paper substrate 100 from the retracted position retracted from the edge of the electronic paper substrate 100 together with the first and second support portions 43 and 45 and the like. Move to position. As the contact member 41 moves, the electronic paper substrate 100 is positioned on the stage 11.
  • substrate 100 for electronic paper is confirmed by the measured value of the atmospheric pressure in the chambers 93 and 94 by the pressure gauges 95a and 95b.
  • the coating liquid coating operation is started as it is.
  • the atmospheric pressure in the chamber 93 corresponding to the peripheral portion of the electronic paper substrate 100 does not drop, the peripheral portion of the electronic paper substrate 100 is pressed toward the stage 11 by the pressing member 42 in the substrate holding mechanism 60. To do.
  • the first support portion 43 and the second support portion 45 are moved down together with the contact member 41 and the pressing member 42 by the action of the air slider 51.
  • the pressing member 42 moves from a separation position separated from the surface of the electronic paper substrate 100 placed on the stage 11 to a pressing position that presses the surface of the electronic paper substrate 100 placed on the stage 11.
  • the contact member 41 is disposed at a contact position that contacts the edge of the electronic paper substrate 100.
  • the contact position between the contact member 41 and the edge of the electronic paper substrate 100 and the pressing position of the surface of the electronic paper substrate 100 by the pressing member 42 are determined. Since the distance is set to be smaller than the distance between the edge of the electronic paper film 101 and the edge of the support layer 102 in the electronic paper substrate 100, it is a non-contactable area of the electronic paper substrate 100. Without contacting the electronic paper film 101, it is possible to press only the support layer 102 that is a contactable region of the electronic paper substrate 100 with the pressing member 42.

Abstract

Selon la présente invention, un mécanisme de retenue de substrat (40) est doté d'un élément de mise en contact (41) utilisé pour le positionnement d'un substrat (100) pour papier électronique par la mise en contact avec un bord externe du substrat (100) pour papier électronique. Ce mécanisme de retenue de substrat (40) est également doté d'un élément de pression (42) utilisé pour appuyer sur une région d'une surface du substrat (100) pour papier électronique vers un étage (11), la région étant située à une distance prédéfinie vers le centre du substrat (100) pour papier électronique à partir de la position de contact entre l'élément de mise en contact (41) et le bord externe du substrat (100) pour papier électronique.
PCT/JP2012/077874 2012-02-27 2012-10-29 Dispositif d'application de revêtement, dispositif et procédé de retenue de substrat WO2013128710A1 (fr)

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JP2012039637A JP5977042B2 (ja) 2012-02-27 2012-02-27 塗布装置、基板保持装置および基板保持方法
JP2012-039637 2012-02-27

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JP6516664B2 (ja) * 2015-12-16 2019-05-22 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置、塗布装置、基板保持方法
JP6809895B2 (ja) * 2016-12-20 2021-01-06 東京応化工業株式会社 塗布装置、及び塗布方法
JP6875357B2 (ja) 2018-11-29 2021-05-26 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置、基板処理装置および基板保持方法
JP6869279B2 (ja) * 2019-02-19 2021-05-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN111495688B (zh) * 2020-04-23 2021-03-26 绍兴市亚索新能源科技有限公司 一种用于光伏板装边框的涂胶装置

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