WO2013121919A1 - Appareil de traitement de substrat et procédé de traitement de substrat - Google Patents

Appareil de traitement de substrat et procédé de traitement de substrat Download PDF

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Publication number
WO2013121919A1
WO2013121919A1 PCT/JP2013/052518 JP2013052518W WO2013121919A1 WO 2013121919 A1 WO2013121919 A1 WO 2013121919A1 JP 2013052518 W JP2013052518 W JP 2013052518W WO 2013121919 A1 WO2013121919 A1 WO 2013121919A1
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WO
WIPO (PCT)
Prior art keywords
substrate
substrates
substrate processing
light
transfer arm
Prior art date
Application number
PCT/JP2013/052518
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English (en)
Japanese (ja)
Inventor
俊一 飯室
寛樹 岡
儀秀 坂本
Original Assignee
東京エレクトロン株式会社
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Publication of WO2013121919A1 publication Critical patent/WO2013121919A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • the present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate such as a semiconductor wafer or a glass substrate for a flat panel display.
  • Some apparatuses for processing a substrate mount a substrate stored in a substrate standby unit on a transfer arm and transfer the substrate to a substrate processing unit that processes the substrate.
  • Some substrate processing apparatuses include a sensor that detects a substrate mounted on a transfer arm during substrate transfer.
  • a translucent window is provided on the upper and lower surfaces of a housing of a common transfer unit (handling station) of a substrate processing apparatus (plasma processing system), and a light emitting element and a light receiving device are provided outside the substrate processing unit.
  • a technique is disclosed in which durability of a sensor (light emitting element, light receiving element, lead wire, etc.) can be improved by providing a lead wire wired to the element and the light emitting element.
  • the substrate processing apparatus for example, is mounted on a transfer arm in a vertical arrangement so that a flat plate surface of one substrate faces a flat plate surface of another substrate, and transfers a plurality of substrates at a time.
  • the substrate processing apparatus needs to identify and detect a plurality of substrates mounted on the transfer arm for each substrate.
  • the present invention has been made under such circumstances, and in the case where a plurality of substrates are mounted on the transfer arm in a vertical arrangement, the substrate processing that can identify and detect individual substrates mounted on the transfer arm
  • An object is to provide an apparatus or a substrate processing method.
  • two substrates are mounted vertically and a transfer arm that transfers the two substrates and two substrates that are mounted on the transfer arm are detected.
  • a substrate processing apparatus having a plurality of sensors.
  • a substrate transporting step of transporting two substrates mounted vertically in a transport arm, and a substrate detection step of detecting the two substrates mounted on the transport arm A substrate processing method is provided.
  • the substrate processing apparatus or the substrate processing method according to the present invention when a plurality of substrates are mounted on the transfer arm in a vertical arrangement, the individual substrates mounted on the transfer arm can be specified and detected.
  • the substrate processing apparatus which concerns on embodiment of this invention, it is a figure explaining an example of operation
  • FIG. 1 shows a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention.
  • the substrate processing apparatus 100 includes a substrate standby unit 10 that can store a plurality of substrates vertically, a common transport unit 20 that can transport a plurality of substrates mounted vertically and simultaneously, And a substrate processing unit 30 that can place a plurality of substrates transferred from the common transfer unit 20 side by side.
  • the substrate processing apparatus 100 includes a substrate detection unit 40 that can detect a plurality of substrates at a time (simultaneously) when the substrates are transported.
  • vertical alignment means that a plurality of substantially flat substrates are arranged such that the flat surfaces of the substrates face each other (the flat surface of one substrate faces the flat surface of another substrate). Yes (the same applies in the following description). Further, the term “side by side” means that a plurality of substantially flat substrates are arranged on substantially the same plane (the same applies to the following description).
  • the substrate processing apparatus 100 mounts two selected substrates out of a plurality of substrates stored in the substrate standby unit 10 in a vertical arrangement on a transfer arm of a common transfer unit 20 to be described later.
  • the substrate is transported through the inside 20, and the substrates are placed side by side on a mounting table in a plurality of substrate processing chambers of a substrate processing unit 30 described later.
  • the substrate processing apparatus 100 processes the placed substrate by the substrate processing unit 30, and then mounts the processed two substrates vertically on the transfer arm and carries them out to the substrate standby unit 10.
  • the substrate processing apparatus 100 causes the substrate detection unit 40 to use the transfer arm to place the substrates one by one on the mounting table in the substrate processing chamber, to place the substrates on the transfer arm one by one, and For each substrate processing chamber of the processing unit 30, the individual substrates are identified and detected for the two substrates mounted on the transfer arm.
  • this embodiment demonstrates conveying two board
  • this invention is not limited to two board
  • the substrate standby unit 10 stores a plurality of substrates vertically.
  • the substrate standby unit 10 includes load ports 11a, 11b, and 11c, which are tables on which containers (11ac, 11bc, and 11cc in the figure) for storing a plurality of substrates are placed, and load ports ( 11a etc.) and the loader module 12 for receiving the substrate received from the container (11ac etc.) placed in the container processing unit 30 and delivering it to the container (11ac etc.), the substrate standby unit 10 and the common transport unit 20 It has a first load lock chamber 13A and a second load lock chamber 13B for temporarily holding a substrate for delivery.
  • the load port (11a, etc.) is a table on which a container (11ac, etc.) that stores a plurality of substrates is placed.
  • the load port (11a and the like) is arranged in parallel with the loader module 12.
  • the load port (11a, etc.) can accommodate a plurality of substrates placed in multiple stages at equal intervals in a container (11ac, etc.).
  • the inside of the container (11ac, etc.) placed in the load port (11a, etc.) can be a sealed structure filled with nitrogen gas or the like.
  • the shape and number of load ports are not limited to those shown in FIG.
  • the loader module 12 carries a substrate into a first load lock chamber 13A from a container (11ac, etc.) placed in a load port (11a, etc.).
  • the loader module 12 carries out the substrate from the second load lock chamber 13B to a container (11ac or the like).
  • the loader module 12 can use a rectangular housing in the present embodiment.
  • the loader module 12 can have a plurality of load ports (11a, etc.) arranged in parallel on one side surface constituting the long side of the rectangle.
  • the loader module 12 can include a substrate transfer mechanism (not shown) that is movable in the long side direction of the rectangle.
  • the first load lock chamber 13A temporarily transfers the substrate stored in a container (11ac, etc.) placed in a load port (11a, etc.) in an atmospheric pressure atmosphere to the substrate processing unit 30 in a vacuum atmosphere. It is something to hold.
  • the first load lock chamber 13A includes an upper stocker 14At and a lower stocker 14Ab on which substrates can be placed vertically.
  • the upper stocker 14At and the lower stocker 14Ab can be vertically stacked. Thereby, the upper stocker 14At or the like can support the substrates vertically.
  • the first load lock chamber 13A includes a module side gate valve 15Am for ensuring airtightness with respect to the loader module 12, and a common transfer portion side gate for ensuring airtightness with respect to the common transfer portion 20. And a valve 15Ac. Furthermore, the first load lock chamber 13A is connected to a gas introduction system and a gas exhaust system (not shown) by piping, and the pressure (atmosphere) in the chamber can be changed.
  • the common transport unit 20 carries a substrate to be processed from the substrate standby unit 10 to the substrate processing unit 30 and carries out the processed substrate from the substrate processing unit 30 to the substrate standby unit 10.
  • the common transfer unit 20 is a transfer arm (first transfer arm 24a and second transfer arm 25a shown in FIGS. 1 and 2A) that can move two substrates vertically (stacked). ), A turntable 21 that rotatably supports the transfer arm, a turntable 22 that mounts the turntable 21, and a guide rail 23a that guides the turntable 22 to be movable in the longitudinal direction of the common transfer unit 20. 23b.
  • the common transfer unit 20 is provided with a first load lock chamber 13A and a second load lock chamber 13B of the substrate standby unit 10 through gate valves (15Ac and 15Bc, and 33A to 33F), as will be described later.
  • the substrate processing unit 30 communicates with a plurality of substrate processing chambers (31A to 33F).
  • the common transport unit 20 mounts the two substrates vertically supported in the first load lock chamber 13A in the first transport arm 24a and transports them to the substrate processing chamber of the substrate processing unit 30.
  • the common transfer unit 20 mounts the two substrates processed in the substrate processing chamber in a vertical arrangement on the second transfer arm 25a, and carries it out to the second load lock chamber 13B.
  • the first transfer arm 24a and the second transfer arm 25a have a pick portion on which two substrates can be mounted.
  • FIG. 2A and 2B show examples of the first transfer arm 24a and the like.
  • FIG. 2A is a perspective view of the first transfer arm 24a and the like.
  • FIG. 2B is a side view of the pick portion (first upper pick 24pt and first lower pick 24pb) of the first transport arm 24a.
  • the configuration of the second transfer arm 25a is a plane-symmetric configuration with the plane including the configuration of the first transfer arm 24a and the rotation axis of the turntable 21 as the plane of symmetry, and the description thereof is omitted. .
  • the first transport arm 24a has a configuration in which a plurality of rectangular links (nodes) are rotatably connected by a plurality of joints (hereinafter referred to as an arm link mechanism). .
  • One end of the link mechanism of the first transport arm 24a is supported by the turntable 21 so as to be freely rotatable.
  • the first transfer arm 24a has a free end at the other end and a pick portion (24pt, 24pb) connected to the other end.
  • the pick portion has a configuration in which a first upper pick 24pt and a first lower pick 24pb having substantially the same shape are stacked apart by a predetermined distance Dp.
  • the pick section can mount one substrate on the upper surface of the first upper pick 24pt, and on the upper surface of the first lower pick 24pb (between the first upper pick 24pt and the first lower pick 24pb).
  • one board can be mounted.
  • the first transfer arm 24a and the like move the other end (hereinafter referred to as expansion / contraction operation) by rotation of one end and a link mechanism of the arm, thereby bringing the substrate mounted on the other end (pick portion) into a desired position. Can move. Further, since the first transfer arm 24a and the like can mount two substrates at a time, the substrate processing apparatus 100 supports four substrates simultaneously by the first transfer arm 24a and the second transfer arm 25a. be able to.
  • the turntable 21 supports the first transfer arm 24a and the like so as to be rotatable (hereinafter referred to as a rotation operation) with the vertical direction as a rotation axis.
  • the rotary mounting table 22 and the guide rails 23a and 23b move the mounted rotating table 21 in a predetermined direction (for example, the longitudinal direction) inside the common transport unit 20 (hereinafter referred to as a sliding operation).
  • a slide mechanism that can be
  • the substrate processing unit 30 processes a substrate placed in the substrate processing chamber.
  • the substrate processing unit 30 includes a plurality of substrate processing chambers (31A to 31F) arranged around the common transfer unit 20.
  • the substrate processing chambers (31A to 31F) communicate with the common transfer unit 20 via the common transfer unit side gate valves (33A to 33F).
  • the substrate processing chamber 31A and the like and the common transfer part 20 can be secured by closing the common transfer part side gate valve 33A and the like, and can be communicated by opening the common transfer part side gate valve 33A and the like.
  • the substrate processing unit 30 connects a gas introduction system (such as a gas supply source such as a processing gas and a purge gas) and a gas exhaust system (such as a vacuum pump, an exhaust control valve, and an exhaust pipe) (not shown) to the substrate processing chamber 31A and the like. ing.
  • a gas introduction system such as a gas supply source such as a processing gas and a purge gas
  • a gas exhaust system such as a vacuum pump, an exhaust control valve, and an exhaust pipe
  • the substrate processing chamber (31A to 31F) includes a first mounting table (32Aa to 32Fa) and a second mounting table (32Ab to 32Fb) on which two substrates can be mounted side by side.
  • the substrate processing chamber 31A and the like can process the surfaces of two substrates uniformly and simultaneously by placing the substrates side by side on the first mounting table 32Aa and the second mounting table 32Ab.
  • the substrate processing chamber 31A or the like can perform a film forming process (plasma CVD process or the like) or an etching process (dry etching process or the like) as a substrate process.
  • the substrate processing chamber 31A and the like can perform different processing for each substrate processing chamber. Note that the number of substrate processing chambers and the number of mounting tables on which the substrates in the substrate processing chamber can be mounted are not limited to those shown in FIG.
  • the substrate detection unit 40 detects a plurality of substrates at a time when the substrates are transported.
  • the substrate detection unit 40 includes sensors each including a light emitting unit and a light receiving unit, corresponding to each substrate processing chamber.
  • substrate detection part 40 can detect the two board
  • the configuration of the substrate detection unit 40 will be specifically described with reference to FIGS. 3A to 3C.
  • FIG. 3A to 3C show sensors arranged in a portion adjacent to the substrate processing chamber 31A (FIG. 1) of the common transport unit 20.
  • FIG. FIG. 3A is an example of a plan view illustrating an arrangement of two sensors (two light emitting units 41Ap and 42Ap).
  • FIG. 3B is an example of a cross-sectional view illustrating the arrangement of two sensors (light emitting unit 41Ap and light receiving unit 41An, and light emitting unit 42Ap and light receiving unit 42An).
  • FIG. 3C is another example of a cross-sectional view showing the arrangement of sensors (light emitting unit 41Ap and light receiving unit 41An).
  • the configurations of the sensors (41Bp to 41Fp and 41Bn to 41Fn, and 42Bp to 42Fp and 42Bn to 42Fn) disposed in the other substrate processing chambers 31B to 31F (FIG. 1) are the same as the configuration of the substrate processing chamber 31A. Therefore, explanation is omitted.
  • the substrate detection unit 40 is a first light emitting unit 41Ap and a first light receiving unit 41An, and a second light emitting unit 42Ap and a second light receiving unit as two sensors for detecting the substrate. 42An.
  • the first light emitting unit 41Ap and the second light emitting unit 42Ap are disposed on the upper outer surface of a portion of the housing 21Ah of the common transport unit 20 adjacent to the substrate processing chamber 31A.
  • the first light receiving unit 41An and the second light receiving unit 42An are disposed on the lower outer surface of the portion adjacent to the substrate processing chamber 31A of the housing 21Ah of the common transport unit 20 at a position facing the first light emitting unit 41Ap and the like. . That is, a pair (combination) of one light emitting unit and one light receiving unit constitutes one sensor.
  • the two sensors are mounted with a first sensor that detects only one of the two substrates mounted on the transfer arms 24a and 25a (FIG. 2A) and 2 mounted. It can be set as the 2nd sensor which detects only the other board
  • the first sensor is arranged to emit light to only one of the two substrates when the two substrates are mounted on the transfer arm (24a or the like).
  • the first light receiving unit 41An arranged to receive the light emitted by the first light emitting unit 41Ap when the first substrate is not mounted on the transfer arm (24a or the like).
  • the second sensor is a second light emitting element arranged so as to irradiate light only to the other of the two substrates when the two substrates are mounted on the transfer arm (24a or the like).
  • the portion 42Ap and the second light receiving portion 42An arranged to receive the light emitted by the second light emitting portion 42Ap when no other substrate is mounted on the transfer arm (24a or the like).
  • an incident angle (hereinafter referred to as an incident angle) of light transmitted through the light transmitting window 43p (FIG. 3B) with respect to the plane of the substrate is a predetermined incident. It arrange
  • the second light emitting unit 42Ap and the second light receiving unit 42An are arranged in a positional relationship with the first light emitting unit 41Ap and the first light receiving unit 41An with a predetermined separation distance Ls (FIG. 3B).
  • the predetermined incident angle ⁇ s and the predetermined separation distance Ls are the shape of the substrate to be detected (conveyed) (for example, the diameter in the case of a circular substrate), the separation distance between the substrate and the light emitting unit, and the mounted substrates. Or a distance corresponding to the distance between picks in the pick part (Dp in FIG. 2B).
  • the predetermined incident angle ⁇ s and the predetermined separation distance Ls can be values determined in advance by numerical calculation, experiment, or the like.
  • the first light emitting unit 41Ap is arranged to irradiate light to one substrate (for example, W1 in FIG.
  • the first light emitting unit 41Ap and the like irradiate light into the housing 21Ah through the light transmitting windows (43p, 43na, and 43nb) of the housing 21Ah. For this reason, even if the processing gas or the like flows from the substrate processing chamber 31A into the housing 21Ah, the first light emitting unit 41Ap or the like is not affected by the processing gas or the like. Etc. can be enhanced. In addition, since the first light emitting unit 41Ap and the like are provided with a power supply wiring outside the housing 21Ah, the power supply wiring can be prevented from being corroded by the processing gas or the like in the housing 21Ah.
  • the substrate detection unit 40 receives light emitted from the light emitting units (first light emitting unit 41Ap and second light emitting unit 42Ap) by the light receiving units (first light receiving unit 41An and second light receiving unit 42An). To do. At this time, the board
  • the substrate detection unit 40 mounts the substrate on the first lower pick 24pb. Judge that you are doing. Further, the substrate detection unit 40 reduces the intensity of the light Lt2 received by the second light receiving unit 42An to a predetermined value or less due to the presence of the substrate W2 on which the first upper pick 24pt of the first transport arm 24a is mounted. In this case, it can be determined that the first transfer arm 24a has the substrate mounted on the first upper pick 24pt.
  • the substrate detection unit 40 causes the first transfer arm 24a to place the substrate on the first upper pick 24pt. Judge that it is installed.
  • the predetermined value can be a value corresponding to the thickness and material of the substrate, and the specifications of the light emitting part and the light receiving part. Further, the predetermined value can be a value determined in advance by numerical calculation, experiment, or the like.
  • FIG. 3C shows a substrate detection unit 40 composed of one sensor as another example.
  • the substrate detection unit 40 can detect the substrate W1 and the substrate W2 using the light emitting unit 41Ap and the light receiving unit 41An as one sensor. Specifically, in the substrate detection unit 40, first, the first light emitting unit 41Ap and the first light receiving unit 41An increase the intensity of the light Lt1 by the substrate W1 on which the first lower pick 24pb of the first transfer arm 24a is mounted. If the intensity of the light Lt1 is less than or equal to a predetermined value, it is determined that the first transport arm has a substrate mounted on the first lower pick 24pb.
  • the substrate detection unit 40 places the substrate W1 on the substrate processing chamber 31A by the first transfer arm 24a
  • the substrate W2 mounted on the first transfer arm 24a has the same position as the substrate W1 detected first.
  • the substrate W2 is moved by the first transfer arm 24a so as to be in the position.
  • the substrate detection unit 40 detects the substrate W2 by the first light emitting unit 41Ap and the first light receiving unit 41An in the same manner as when the substrate W1 is detected.
  • the substrate W2 After detecting the substrate W1, the substrate W2 is moved in the horizontal direction (y direction in the figure), and the positional relationship between the first light emitting unit 41Ap and the substrate W2 is the same as that of the second light emitting unit 42Ap and the like in FIG. 3B.
  • the substrate W2 may be detected by moving the substrate W2 to a position that is similar to the positional relationship with W2.
  • FIG. 4A shows a state immediately before two substrates (W1 and W2) are carried into the substrate processing chamber 31A.
  • FIG. 4B shows that the first substrate W1 is mounted on the first mounting table 32Aa of the substrate processing chamber 31A by the first transport arm 24a.
  • FIG. 4C shows that the first substrate W1 is placed.
  • FIG. 4D shows that the second substrate W2 is placed on the second placement table 32Ab.
  • FIG. 4E shows that the second substrate W2 is placed.
  • the substrate processing apparatus 100 is supported in the first load lock chamber 13A by the first transfer arm 24a of the common transfer unit 20 when a substrate is loaded.
  • the two substrates are transported to the front of the substrate processing chamber 31A of the substrate processing unit 30.
  • the substrate processing apparatus 100 uses the substrate detection unit 40 to specify two substrates mounted on the first transfer arm 24a for each substrate and detect them at a time.
  • the method for detecting the substrate is the same as that shown in FIG.
  • the substrate processing apparatus 100 can stop or interrupt the substrate processing.
  • the substrate processing apparatus 100 can repeat the operation of transporting the substrate from the first load lock chamber 13A again. Therefore, the substrate processing apparatus 100 can avoid unnecessary substrate processing (substrate processing when no substrate is placed in the substrate processing chamber).
  • the substrate processing apparatus 100 is configured to place the substrate W1 held by the first lower pick 24pb (FIGS. 2A and 2B) of the two substrates on the first mounting table in the substrate processing chamber.
  • the first transfer arm 24a is extended, and the first lower pick 24pb of the transfer arm 24a is moved above the first mounting table 32Aa.
  • the substrate W1 held by the first lower pick 24pb is moved above the first mounting table 32Aa.
  • the substrate processing apparatus 100 places the substrate W1 on the first mounting table 32Aa and places the substrate W1 on the front side of the substrate processing chamber 31A (the position of the first transfer arm 24a in FIG. 4A). 1
  • the transfer arm 24a is retracted. Specifically, the substrate processing apparatus 100 lifts the substrate W1 with three pins provided in the first mounting table 32Aa, and separates the substrate W1 from the first lower pick 24pb (FIG. 2A) of the first transfer arm 24a. Thereafter, the substrate processing apparatus 100 retracts the first transfer arm 24a to a position in front of the substrate processing chamber 31A, and then lowers the pin supporting the substrate W1, thereby mounting the substrate W1 on the first mounting table 32Aa. To complete.
  • the substrate processing apparatus 100 can detect only the substrate W2 mounted on the retracted first transport arm 24a by the substrate detection unit 40 (FIG. 4A). Thereby, the substrate processing apparatus 100 can repeat the operation of placing the substrate W1 again when the first transfer arm 24a mounts two substrates (when the substrate W1 is detected).
  • the substrate processing apparatus 100 performs the same operation as in FIG. 4B, and the substrate W2 mounted on the first upper pick 24pt (FIG. 2A) is placed on the second mounting table 32Ab (FIG. 4A).
  • the substrate processing apparatus 100 performs the same operation as in FIG. 4C and detects that the substrate is not mounted on the first transfer arm 24a. Thereby, the substrate processing apparatus 100 can repeat the operation of placing the substrate W2 again when the first transport arm 24a mounts the substrate (when the substrate W2 is detected).
  • the substrate processing apparatus 100 can carry out the reverse procedure in the same manner as in FIGS. 4A to 4E and carry out the processed substrate. Specifically, the substrate processing apparatus 100 mounts two processed substrates on the second transfer arm 25a (FIG. 4A), and carries the substrates out to the second load lock chamber 13B shown in FIG. The substrate processing apparatus 100 can appropriately detect the substrate mounted on the second transport arm 25a when the substrate is transported by the substrate detection unit 40 (FIGS. 3A and 3B).
  • the substrate processing apparatus 100 transfers two substrates from the load lock chamber to the substrate processing chamber on one of the first transfer arm 24a and the second transfer arm 25a, and the first transfer arm 24a and the second transfer arm. Two substrates may be transferred from the substrate processing chamber to the load lock chamber on the other side of 25a.
  • the substrate processing apparatus 100 (1) one unloads two substrates from the first load lock chamber 13A or the second load lock chamber 13B, and (2) the other (before (1)). Two substrates (unloaded from the substrate processing chamber 31A etc. at that time) are loaded into the first load lock chamber 13A or the second load lock chamber 13B, and (3) both are in the vicinity of the load lock chamber (13A, 13B).
  • the substrate processing apparatus 100 can repeat the operations (1) to (6).
  • the substrate processing apparatus 100 can identify and temporarily detect the substrate mounted on the transport arm.
  • the substrate processing apparatus 100 specifies the substrate mounted on the transfer arm by the substrate detection unit 40, so that the operation of mounting the substrate on the transfer arm or the operation of placing the substrate by the transfer arm is correctly performed. Can be determined.
  • the number of light emitting units and light receiving units may be a number corresponding to the number of substrates transported at a time.
  • the number of sensors in the light emitting unit and the light receiving unit may be one or three or more. Further, when one sensor is used, a configuration may be adopted in which a plurality of mounted substrates can be sequentially detected by moving the position of the substrate in a stepwise manner.
  • the present invention has been described with reference to the substrate processing apparatus and the substrate processing method according to the embodiments.
  • the present invention is not limited thereto, and various modifications or changes can be made in light of the appended claims. It is possible.
  • Substrate processing apparatus 10 Substrate standby part 11a-11c: Load port 12: Loader module 13A: 1st load lock room, 13B: 2nd load lock room 14At: Upper stocker (for 1st load lock room 13A) ) 14Ab: Lower stocker (for first load lock chamber 13A) 14Bt: Upper stocker (for second load lock chamber 13B) 14Bb: Lower stocker (for second load lock chamber 13B) 15 Am: Module side gate valve (for the first load lock chamber 13A) 15Ac: Common transfer section side gate valve (for the first load lock chamber 13A) 15Bm: Module side gate valve (for second load lock chamber 13B) 15Bc: Common transfer section side gate valve (for second load lock chamber 13B) 20: Common transfer unit 21: Turntable 22: Rotation mounting table 23a, 23b: Guide rail 24a: First transfer arm 24pt and 24pb: First upper pick and first lower pick 25a: Second transfer arm 25pt and 25

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Abstract

L'invention concerne un appareil de traitement de substrat caractérisé en ce qu'il a : un bras de transport (24) dans lequel deux substrats (W1, W2) sont chargés verticalement en tandem et qui transporte les deux substrats (W1, W2) ; et deux capteurs (41An, 41Ap, 42An, 42Ap) pour détecter les deux substrats (W1, W2) chargés dans le bras de transport (24). L'invention concerne également un procédé de traitement de substrat.
PCT/JP2013/052518 2012-02-17 2013-02-04 Appareil de traitement de substrat et procédé de traitement de substrat WO2013121919A1 (fr)

Applications Claiming Priority (2)

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JP2012-033107 2012-02-17
JP2012033107A JP2013171871A (ja) 2012-02-17 2012-02-17 基板処理装置及び基板処理方法

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WO2013121919A1 true WO2013121919A1 (fr) 2013-08-22

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CN112786429A (zh) * 2016-07-14 2021-05-11 东京毅力科创株式会社 等离子体处理系统、搬送方法以及处理系统

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JP6670713B2 (ja) 2016-09-20 2020-03-25 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
JP6881010B2 (ja) 2017-05-11 2021-06-02 東京エレクトロン株式会社 真空処理装置
JP7137408B2 (ja) * 2017-09-29 2022-09-14 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
US11049740B1 (en) * 2019-12-05 2021-06-29 Applied Materials, Inc. Reconfigurable mainframe with replaceable interface plate

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JPH10107121A (ja) * 1996-09-26 1998-04-24 Kokusai Electric Co Ltd 基板処理装置、基板搬送機および基板搬送装置
JPH11214481A (ja) * 1998-01-20 1999-08-06 Kokusai Electric Co Ltd 固体デバイス製造装置
JP2009094530A (ja) * 1996-11-18 2009-04-30 Applied Materials Inc 超高スループット・ウェハ真空処理システム
JP2010045214A (ja) * 2008-08-13 2010-02-25 Dainippon Screen Mfg Co Ltd 基板搬送装置およびこれを備えた基板処理装置

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JPH10107121A (ja) * 1996-09-26 1998-04-24 Kokusai Electric Co Ltd 基板処理装置、基板搬送機および基板搬送装置
JP2009094530A (ja) * 1996-11-18 2009-04-30 Applied Materials Inc 超高スループット・ウェハ真空処理システム
JPH11214481A (ja) * 1998-01-20 1999-08-06 Kokusai Electric Co Ltd 固体デバイス製造装置
JP2010045214A (ja) * 2008-08-13 2010-02-25 Dainippon Screen Mfg Co Ltd 基板搬送装置およびこれを備えた基板処理装置

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Publication number Priority date Publication date Assignee Title
CN112786429A (zh) * 2016-07-14 2021-05-11 东京毅力科创株式会社 等离子体处理系统、搬送方法以及处理系统
CN112786429B (zh) * 2016-07-14 2024-04-09 东京毅力科创株式会社 等离子体处理系统、搬送方法以及处理系统

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