WO2013114955A1 - Bande de protection thermiquement détachable permettant un glissement - Google Patents

Bande de protection thermiquement détachable permettant un glissement Download PDF

Info

Publication number
WO2013114955A1
WO2013114955A1 PCT/JP2013/050738 JP2013050738W WO2013114955A1 WO 2013114955 A1 WO2013114955 A1 WO 2013114955A1 JP 2013050738 W JP2013050738 W JP 2013050738W WO 2013114955 A1 WO2013114955 A1 WO 2013114955A1
Authority
WO
WIPO (PCT)
Prior art keywords
protective tape
heat
sliding
substrate
adhesive layer
Prior art date
Application number
PCT/JP2013/050738
Other languages
English (en)
Japanese (ja)
Inventor
村田秋桐
飯田博之
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012017112A external-priority patent/JP2013155295A/ja
Priority claimed from JP2012262010A external-priority patent/JP2013177549A/ja
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Publication of WO2013114955A1 publication Critical patent/WO2013114955A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate

Definitions

  • the present invention relates to a sliding protective tape used for a product conveying process guide, a material charging hopper, and the like.
  • an adhesive tape using a fluororesin film such as polytetrafluoroethylene (referred to as “PTFE”) as a base material is widely known (for example, see Patent Document 1), and many are marketed.
  • PTFE polytetrafluoroethylene
  • These adhesive tapes have many excellent properties such as electrical properties, heat resistance, chemical resistance, low friction (low friction on the back of the substrate), and non-adhesive (non-adhesion on the back of the substrate).
  • a material (slidable material) that moves on the adherend while simultaneously protecting the adherend by utilizing the low friction property of the back surface of the substrate. It is used as a sliding member such as a sliding protective tape for sliding.
  • the object of the present invention is to provide excellent slidability (characteristics that allow the material and product to slide) without being peeled off from the adherend during use, and to be peeled off during replacement work after use. It is an object of the present invention to provide a heat-peelable sliding protective tape that can be easily peeled off from an adherend simply by heating.
  • the substrate has a base material and a heat-expandable pressure-sensitive adhesive layer containing a heat-expandable microsphere on one surface of the base material.
  • a protective tape that uses the above substrate as a substrate made of a fluororesin film (especially a polytetrafluoroethylene film) and exhibits excellent slidability without peeling from the adherend during use.
  • the present inventors have found that they can be easily peeled off from the adherend during replacement work after use, and have completed the present invention.
  • the expansion start temperature of the thermally expandable pressure-sensitive adhesive layer is set to 80 ° C. or higher, and the coefficient of dynamic friction with respect to a 10 mm ⁇ steel ball on the back surface of the substrate is 0.25 or lower. It was found that the Shore hardness of the substrate is preferably D70 or less.
  • the present invention is a protective tape for sliding, comprising a substrate and a thermally expandable adhesive layer containing thermally expandable microspheres on one surface side of the substrate, wherein the substrate is a fluorine
  • a heat-peelable sliding protective tape which is a substrate made of a resin film.
  • the heat-peelable sliding protective tape is provided, wherein the expansion start temperature of the thermally expandable adhesive layer is 80 ° C. or higher.
  • the heat-peelable sliding protective tape having a rubbery organic elastic layer between the base material and the thermally expandable adhesive layer is provided.
  • the heat-peelable sliding protective tape is provided, wherein the rubbery organic elastic layer is an adhesive layer formed of an adhesive substance.
  • the heat-peeling type sliding protective tape is provided, wherein the base material is a base material made of a polytetrafluoroethylene film.
  • the above-mentioned heat-peelable sliding protective tape having a dynamic friction coefficient (based on ASTM D1894, steel ball of 10 mm ⁇ ) on the back of the substrate is 0.25 or less.
  • the above-mentioned heat-peelable sliding protective tape is provided, wherein the substrate has a Shore hardness (according to ASTM D1706) of D70 or less.
  • heat-peelable sliding protective tape which is a sliding protective tape for attaching industrial or household equipment or components.
  • the present invention provides industrial or household equipment or parts that are adhered and protected by the heat-peelable sliding protective tape.
  • the heat-peelable sliding protective tape of the present invention has the above-described configuration, it is not peeled off from the adherend during use, and the product or material slide in the guide for the process of transporting the product, the material feeding hopper, etc. It can be used for moving applications and for protecting adherends such as guides and hoppers, and after use, it can be easily removed from the adherend with almost no adhesive residue by heating during peeling work to replace the tape. Since it can peel, workability
  • the heat-peelable sliding protective tape of the present invention (sometimes simply referred to as “protective tape”) protects the adherend and simultaneously moves on the adherend (referred to as “slidable material”). And a thermal expansion containing a base material (base material layer) and one or more layers of thermally expandable microspheres on one surface side of the base material. It is an adhesive tape having at least an adhesive layer. Moreover, the protective tape of this invention may have a rubber-like organic elastic layer further between the said base material and the said heat-expandable adhesive layer as needed.
  • the term “tape” includes a sheet-like material, that is, a “sheet”.
  • FIG. 1 is a schematic sectional view showing an example of the protective tape of the present invention.
  • the protective tape of the present invention shown in FIG. 1 has a heat-expandable pressure-sensitive adhesive layer 3 on one surface of a substrate 1, and further has a surface of the heat-expandable pressure-sensitive adhesive layer 3 (the surface opposite to the substrate 1 side).
  • FIG. 2 is a schematic sectional view showing another example of the protective tape of the present invention.
  • the protective tape of the present invention shown in FIG. 2 has a rubber-like organic elastic layer 2 on one surface of a substrate 1, and the surface of the rubber-like organic elastic layer 2 (the surface opposite to the substrate 1 side).
  • a protective tape (adhesive tape) having a thermally expandable pressure-sensitive adhesive layer 3 and further having a separator 4 on the surface of the heat-expandable pressure-sensitive adhesive layer 3 (surface opposite to the rubbery organic elastic layer 2 side).
  • the protective tape of this invention does not necessarily need to have a separator,
  • excluding the separator 4 from the protective tape shown in FIG. 1, FIG. 2 may be sufficient.
  • the protective tape of the present invention does not have a separator, for example, the surface of the thermally expandable pressure-sensitive adhesive layer is in contact with the surface of the base material in the protective tape (sometimes referred to as “back surface of base material”). It may be protected by being wound into a roll.
  • the base material (1 in FIGS. 1 and 2) in the protective tape of the present invention is a base material (support body) such as a thermally expandable adhesive layer, and the base material is a base material made of a fluororesin film. is there.
  • the said fluororesin film is a film formed from the fluororesin in which a fluorine atom is contained in molecular structure. Although content of the fluororesin in the said fluororesin film (100 weight%) is not specifically limited, 50 weight% or more is preferable, More preferably, it is 70 weight% or more.
  • the fluororesin film may have a single layer form or a multilayer (multi-layer) form.
  • the form of the “fluororesin film” includes a sheet form.
  • the base material may be the fluororesin film, or may be a laminate of the fluororesin film and other layers (for example, a film, a sheet, etc.) as long as the effects of the present invention are not impaired. .
  • the “base material” does not include a separator that is peeled off when the adhesive sheet is used (attached).
  • the base material (particularly, the fluororesin film) is not particularly limited, but from the viewpoint of sliding performance such as base material slipperiness (a property that the material to be slid slides on the surface of the base material), at least one surface of 10 mm ⁇
  • the coefficient of dynamic friction for steel balls is preferably 0.25 or less, more preferably 0.15 or less.
  • the protective tape having the base material having a dynamic friction coefficient of 0.25 or less as the back surface of the base material has a high slidability on the back surface of the base material and tends to be excellent in the slidability of the sliding material.
  • the dynamic friction coefficient can be measured under the conditions of, for example, a load of 200 gf and a sliding speed of 150 mm / min according to ASTM D1894, with a steel ball having a diameter of 10 mm as a friction target.
  • the Shore hardness of the substrate is not particularly limited, but is preferably D70 or less, more preferably D65 or less, from the viewpoint of shock absorption when the sliding material comes into contact. If the Shore hardness of the base material exceeds D70, the risk that the adherend of the protective tape and / or the sliding material will be damaged or damaged when the sliding material comes into contact with the substrate becomes high.
  • the Shore hardness can be measured according to ASTM D1706.
  • the elongation rate (referred to as “elongation rate (machine direction)”) of the substrate (particularly the fluororesin film) in the machine direction is not particularly limited, but is preferably 20% or more, more preferably 150%. That's it.
  • the upper limit of the elongation (machine direction) is not particularly limited, but is preferably 1000% from the viewpoint of suppressing sagging due to its own weight and improving the workability of attaching to the adherend and the workability of peeling. Preferably it is about 800%.
  • the elongation rate (machine direction) of the substrate is measured under the conditions of, for example, test piece type 5, test speed 300 mm / min, temperature 23 ⁇ 2 ° C., and relative humidity 50 ⁇ 5% in accordance with JIS K7127. can do.
  • the elongation rate (referred to as “elongation rate (width direction)”) in the width direction of the substrate (particularly, the fluororesin film) is not particularly limited, but is preferably 20% or more, more preferably 150%. That's it.
  • the upper limit of the elongation percentage (width direction) is not particularly limited, but is preferably 1000% from the viewpoint of suppressing sagging due to its own weight and improving the workability of attaching to the adherend and the workability of peeling. Preferably it is about 800%.
  • the elongation rate (width direction) of the said base material is measured on the conditions of the test piece type 5, test speed 300mm / min, temperature 23 ⁇ 2 degreeC, and relative humidity 50 ⁇ 5% based on JISK7127, for example. can do.
  • a film formed of a fluororesin (a resin containing at least a fluorine atom as a constituent atom) can be used.
  • a fluororesin a resin containing at least a fluorine atom as a constituent atom
  • a fluororesin film in the base material a film formed of a fluororesin (a resin containing at least a fluorine atom as a constituent atom)
  • a film formed of a fluororesin a resin containing at least a fluorine atom as a constituent atom
  • a PTFE film is preferable from the viewpoint of various physical properties (for example, dynamic friction coefficient, Shore hardness, elongation rate, etc.), but is not limited thereto.
  • the thickness of the substrate is not particularly limited, and the range that does not impair the workability of attaching to the adherend, the protection of the adherend and the sliding material, the workability of peeling off, and the like.
  • 10 ⁇ m to 1 mm is preferable, and 20 to 300 ⁇ m is more preferable.
  • the base material (particularly, the fluororesin film) can be produced by a known or conventional method, and is not particularly limited, but particularly from the viewpoint of producing (forming a film) a base material having a thickness in the above range.
  • Examples thereof include a compression molding cutting method, a dipping method, a paste extrusion method, and a melt extrusion method.
  • chromic acid is used on the surface of the base material (particularly the fluororesin film) on the side where the heat-expandable adhesive layer or the rubber-like organic elastic layer is provided in order to improve adhesion and retention with adjacent layers. It is preferable to perform chemical or physical easy adhesion treatment such as treatment, ozone exposure, flame exposure, high piezoelectric impact exposure, ionizing radiation treatment, surface easy adhesion treatment with an alkali metal ammonium solution, and the like. When such a treatment is not applied, the adjacent thermally expandable adhesive layer or rubber-like organic elastic layer is detached from the substrate when the adhesive tape (protective tape) is peeled off from the adherend when it is peeled off by heating. As a result, problems such as adhesive residue may be induced.
  • the heat-expandable pressure-sensitive adhesive layer in the protective tape of the present invention contains heat-expandable microspheres (microcapsules) so that the protective tape adhered to the adherend can be easily removed from the adherend by heat treatment. To do.
  • the heat-expandable pressure-sensitive adhesive layer (foamed and / or expanded) is obtained by heating the heat-expandable pressure-sensitive adhesive layer at any time and foaming and / or expanding the heat-expandable microspheres in the heat-expandable pressure-sensitive adhesive layer.
  • the adhesion area between the post-expansion treatment and the adherend is reduced, and as a result, the protective tape can be easily peeled off.
  • a foaming agent that is not microencapsulated is used instead of the heat-expandable microspheres, good peelability (heat peelability) cannot be stably exhibited.
  • the heat-expandable microsphere examples include a microsphere in which a substance that is easily gasified and exhibits thermal expandability, such as isobutane, propane, and pentane, is encapsulated in an elastic shell.
  • the shell is often formed of a material that is softened (melted) by heat or destroyed by thermal expansion.
  • the material that forms the shell include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, Examples thereof include polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone and the like.
  • the thermally expandable microspheres can be produced by a conventional method such as a coacervation method or an interfacial polymerization method.
  • thermally expandable microspheres examples include “Matsumoto Microsphere” (trade name, manufactured by Matsumoto Yushi Seiyaku Co., Ltd.), “Daifoam” (trade name, manufactured by Dainichi Seika Kogyo Co., Ltd.), etc. Commercial products can also be used.
  • the expansion start temperature (foam start temperature) of the thermally expandable microsphere is not particularly limited, but is preferably 80 ° C. or higher (eg, 80 to 250 ° C.), more preferably 90 ° C. or higher.
  • the expansion start temperature is less than 80 ° C., for example, the thermally expandable pressure-sensitive adhesive layer may expand due to frictional heat generated when the protective tape comes into contact with the sliding material, and may partially peel off.
  • it becomes difficult to use in a process of heating and using the sliding material for example, a heating cleaning process of empty bottles, a hopper charging process of heating material, etc.).
  • expansion start temperature of thermally expandable microspheres refers to the expansion method (load) using thermally expandable microspheres using a thermal analyzer (“TMA / SS6100”, manufactured by SII Nanotechnology Co., Ltd.). : 0.1 N, probe: 3 mm ⁇ , temperature increase rate: 5 ° C./min), the temperature at which the expansion of the thermally expandable microspheres started.
  • the maximum expansion temperature of the thermally expandable microsphere is not particularly limited, but is preferably 90 ° C. or higher (for example, 90 to 300 ° C.), more preferably 100 ° C. or higher.
  • the thermally expandable pressure-sensitive adhesive layer may expand due to frictional heat generated when the protective tape comes into contact with the sliding material, and may partially peel off.
  • it becomes difficult to use in a process of heating and using the sliding material for example, a heating cleaning process of empty bottles, a hopper charging process of heating material, etc.).
  • the “maximum expansion temperature” refers to a thermal expansion device (“TMA / SS6100”, manufactured by SII Nanotechnology Co., Ltd.), and an expansion method (load: 0.1 N, probe) : Temperature at which the expansion of the thermally expandable microspheres is maximized when measured at 3 mm ⁇ and the heating rate of 5 ° C./min. When heated to a temperature higher than the maximum expansion temperature, the heat-expandable microspheres shrink and the expansion rate decreases as a whole.
  • the average particle size (before expansion) of the thermally expandable microspheres is not particularly limited, but is preferably about 1 to 50 ⁇ m from the viewpoint of dispersibility and thin layer formation.
  • thermally expandable microspheres are preferably 2 times or more, more preferably 7 times or more, and still more preferably from the viewpoint of lowering the adhesive strength of the thermally expandable pressure-sensitive adhesive layer by heat treatment. Thermally expandable microspheres that do not rupture until 10 times or more are preferred.
  • the content (blending amount) of the heat-expandable microspheres can be determined as appropriate according to the expansion ratio of the heat-expandable pressure-sensitive adhesive layer, the ability to reduce the adhesive force, and the like.
  • the amount is preferably 1 to 150 parts by weight, more preferably 10 to 130 parts by weight, and still more preferably 25 to 100 parts by weight with respect to 100 parts by weight of the base polymer.
  • the heat-expandable pressure-sensitive adhesive layer is formed of a composition (pressure-sensitive adhesive composition) containing the heat-expandable microspheres and a pressure-sensitive substance.
  • the adhesive substance can express adhesiveness (adhesive properties) with respect to the thermally expandable adhesive layer, and allows the expansion and / or expansion of the thermally expandable microspheres upon heating, Sometimes, those that do not restrain the expansion and / or expansion of thermally expandable microspheres as much as possible can be preferably used.
  • Specific examples of the adhesive substance include rubber adhesives, acrylic adhesives, vinyl alkyl ether adhesives, silicone adhesives, polyester adhesives, polyamide adhesives, and urethane adhesives.
  • Styrene-diene block copolymer-based pressure-sensitive adhesives known pressure-sensitive adhesives such as pressure-sensitive adhesives having improved creep properties by blending a heat-meltable resin having a melting point of about 200 ° C. or lower (for example, Japanese Patent Laid-Open No. 56-61468)
  • pressure-sensitive adhesives described in JP-A No. 61-174857, JP-A No. 63-17981 and JP-A No. 56-13040 can be used.
  • the pressure-sensitive adhesive may be a blend of appropriate additives such as a crosslinking agent, a tackifier, a plasticizer, a filler, and an anti-aging agent.
  • the adhesive substance for example, a rubber-based adhesive having a base polymer of natural rubber or various synthetic rubbers; methyl group, ethyl group, propyl group, butyl group, pentyl group (amyl group) , Hexyl, heptyl, 2-ethylhexyl, isooctyl, isodecyl, dodecyl, lauryl, tridecyl, pentadecyl, hexadecyl, heptadecyl, octadecyl, nonadecyl, eicosyl, etc.
  • the base polymer is an acrylic polymer (or acrylic copolymer) obtained by polymerizing one or more of esters ((meth) acrylic acid alkyl esters) such as acrylic acid and methacrylic acid having the following alkyl groups: Examples include acrylic adhesives. Note that “(meth) acryl” means “acryl” and / or “methacryl” (one or both of “acryl” and “methacryl”).
  • the acrylic polymer may be, for example, acrylic acid, methacrylic acid, for the purpose of modifying the cohesive force, heat resistance, crosslinkability, etc. of the heat-expandable adhesive layer, if necessary.
  • Carboxyl group-containing monomers such as carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid and crotonic acid; acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride; hydroxyethyl (meth) acrylate, Hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, hydroxyhexyl (meth) acrylate, hydroxyoctyl (meth) acrylate, hydroxydecyl (meth) acrylate, hydroxylauryl (meth) acrylate, (4 -Hydroxymethylcyclohexyl) -methyl Hydroxy
  • (meth) acrylic acid alkyl Amino monomers such as methoxyethyl (meth) acrylate and 2-ethoxyethyl (meth) acrylate; N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, N- Maleimide monomers such as phenylmaleimide; N-methylitaconimide, N-ethylitaconimide, N-butylitaconimide, N-octylitaconimide, N-2-ethylhexylitaconimide, N-cyclohexitaconimide, N-laurylitacon Itaconic imide monomers such as imide; N- (meth) acryloyloxymethylene succinimide, N- (meth) acryloyl-6-oxyhexamethylenesuccinimide, N- (meth) acryloy
  • the base polymer constituting the adhesive substance is particularly from room temperature (for example, 25 ° C.) from the viewpoint of the balance between moderate adhesive strength before heat treatment and lowering of adhesive strength after heat treatment.
  • Those having a dynamic elastic modulus at 150 ° C. in the range of 50,000 to 10 million dyn / cm 2 are preferred.
  • the dynamic elastic modulus can be measured by, for example, dynamic viscoelasticity measurement.
  • a base polymer layer having a thickness of about 2.5 to 3.5 mm is formed and manufactured by Rheometric Scientific, Inc.
  • AWS Advanced Rheometric Expansion System
  • the pressure-sensitive adhesive composition for forming the heat-expandable pressure-sensitive adhesive layer includes a crosslinking agent (for example, an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a polyurethane-based adhesive).
  • a crosslinking agent for example, an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a polyurethane-based adhesive.
  • tackifiers for example, rosin derivative resins, polyterpene resins, petroleum resins, oil-soluble phenol resins, etc.
  • plasticizers for example, rosin derivative resins, polyterpene resins, petroleum resins, oil-soluble phenol resins, etc.
  • fillers for anti-aging agents, and other suitable additives may be blended. .
  • the heat-expandable pressure-sensitive adhesive layer is prepared by preparing a pressure-sensitive adhesive composition by mixing the above-mentioned heat-expandable microspheres and pressure-sensitive substances using a solvent as necessary.
  • a method of applying on a substrate (or a rubber-like organic elastic layer) or a thermally expandable adhesive layer formed on a separator according to the method is transferred onto the substrate (or a rubber-like organic elastic layer). It can implement by appropriate systems, such as a system.
  • the thickness of the heat-expandable pressure-sensitive adhesive layer (before heat treatment) is not particularly limited, but is preferably 300 ⁇ m or less, more preferably 100 ⁇ m or less. When the thickness is too thick (for example, exceeding 300 ⁇ m), the adhesive layer that easily adheres to the adherend tends to be generated due to cohesive failure of the thermally expandable adhesive layer (after the heat treatment) during peeling after the heat treatment. On the other hand, if the thickness of the heat-expandable pressure-sensitive adhesive layer is too thin, the degree of deformation of the heat-expandable pressure-sensitive adhesive layer by heat treatment is small, the adhesive force is difficult to decrease, or the particle diameter of the heat-expandable microspheres to be included is reduced. It becomes necessary to make it too small. From this point, the thickness of the thermally expandable pressure-sensitive adhesive layer is not particularly limited, but is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, and further preferably 15 ⁇ m or more.
  • the expansion start temperature of the thermally expandable pressure-sensitive adhesive layer is not particularly limited, but is preferably 80 ° C. or higher (eg, 80 to 250 ° C.), more preferably 90 ° C. or higher.
  • the expansion start temperature is less than 80 ° C., for example, the thermally expandable pressure-sensitive adhesive layer may expand due to frictional heat generated when the protective tape comes into contact with the sliding material, and may partially peel off.
  • it becomes difficult to use in a process of heating and using the sliding material for example, a heating cleaning process of empty bottles, a hopper charging process of heating material, etc.).
  • expansion start temperature of the thermally expandable adhesive layer refers to the expansion method (load) using a thermal analyzer (“TMA / SS6100”, manufactured by SII Nanotechnology Co., Ltd.). : 0.1 N, probe: 3 mm ⁇ , temperature increase rate: 5 ° C./min), the temperature at which the surface of the thermally expandable adhesive layer (glue surface) started to expand.
  • the thermally expandable pressure-sensitive adhesive layer may have a single layer form or a multilayer (multi-layer) form.
  • the rubber-like organic elastic layer disposed between the base material and the thermally expandable pressure-sensitive adhesive layer adheres to the surface when the protective tape is adhered to the adherend as necessary.
  • the rubbery organic elastic layer is not particularly limited, but natural rubber, synthetic rubber, or rubber having a Shore hardness (according to ASTM D1706) of preferably D50 or less (more preferably D40 or less) due to the above-described function and the like. It is preferable to form with the synthetic resin which has elasticity.
  • Examples of the synthetic rubber as a constituent material for forming the rubbery organic elastic layer include synthetic rubbers such as nitrile synthetic rubber, diene synthetic rubber, and acrylic synthetic rubber.
  • Examples of the synthetic resin (synthetic resin having rubber elasticity) as the constituent material include thermoplastic elastomers such as polyolefin-based thermoplastic elastomers and polyester-based thermoplastic elastomers, ethylene-vinyl acetate copolymers, polyurethane, polybutadiene, and soft Examples thereof include synthetic resins having rubber elasticity such as polyvinyl chloride.
  • the rubbery organic elastic layer may be an adhesive layer formed of an adhesive substance.
  • the thickness of the rubbery organic elastic layer is not particularly limited, but is preferably 500 ⁇ m or less, more preferably 3 to 300 ⁇ m, still more preferably 5 to 150 ⁇ m. If the thickness of the rubbery organic elastic layer is too thick, the expansion deformation may be excessively relaxed during the thermal expansion of the thermally expandable pressure-sensitive adhesive layer, and the heat peelability may be reduced. On the other hand, if the thickness is too thin, the adherence to the uneven surface of the adherend may be reduced, and sufficient adhesive force may not be obtained.
  • the rubber-like organic elastic layer is formed by, for example, a method in which the above-mentioned constituent material is applied onto a substrate; a method in which a rubber-like organic elastic layer is formed on a separator in accordance with this and transferred onto the substrate. It can be carried out by an appropriate method such as a method of adhering a film or the like made of the above-mentioned constituent material to a substrate.
  • the rubber-like organic elastic layer in the present invention may be formed of an adhesive substance mainly composed of natural rubber, synthetic rubber, or a synthetic resin having rubber elasticity, and may be natural rubber, synthetic rubber, rubber elasticity. It may be formed of a foamed film or the like whose main component (main component) is a synthetic resin having.
  • the rubbery organic elastic layer may have a single layer form or a multilayer (multi-layer) form.
  • the protective tape of the present invention may have a separator.
  • a separator a known or conventional separator can be used, and is not particularly limited.
  • plastic or paper whose surface is coated with a release agent such as a silicone resin, a long-chain alkyl acrylate resin, or a fluorine resin.
  • a separator made of a non-polar polymer such as polyethylene or polypropylene can be used.
  • the protective tape of the present invention may have a layer (for example, an undercoat layer or an intermediate layer) other than the base material, the thermally expandable adhesive layer, the rubbery organic elastic layer, and the separator.
  • a layer for example, an undercoat layer or an intermediate layer
  • the dynamic friction coefficient with respect to the 10 mm ⁇ steel ball on the back of the base material in the protective tape of the present invention is not particularly limited, but is preferably 0.25 or less, more preferably 0.15 or less.
  • the dynamic friction coefficient can be measured under the conditions of, for example, a load of 200 gf and a sliding speed of 150 mm / min in accordance with ASTM D1894 with a steel ball of 10 mm ⁇ as a friction target.
  • FIG. 3 is an explanatory view showing an example of the usage state of the protective tape of the present invention (for example, the protective tape shown in FIGS. 1 and 2), wherein (a) is a perspective view and (b) is a cross-sectional view.
  • 5 shows the protective tape (heat-peeling type sliding protective tape) of the present invention
  • 6 shows a hopper (material input hopper).
  • the protective tape 5 is affixed to the inner surface of the hopper 6 (the surface in contact with the charged material), so that the material charged into the hopper 6 is placed inside the hopper (the base of the protective tape 5). The material can be slid effectively on the back surface of the material, and the effect of improving the material charging efficiency can be obtained.
  • the inner surface of the hopper 6 by protecting the inner surface of the hopper 6 with the protective tape 5, it is possible to prevent the inner surface of the hopper 6 from being scratched (abrasion scratches) (for example, a scratch caused by a collision of the material to be charged). The Moreover, when the damage of the material thrown into the hopper 6 is not desirable, such damage of the material is also prevented.
  • the conditions for the heat treatment (heat debonding treatment) when peeling the protective tape of the present invention are the surface state of the adherend (for example, the hopper 6 shown in FIG. 3), the heat resistance, and the heat in the heat-expandable adhesive layer.
  • the heat resistance of a protective tape (adhesive tape), etc. as conditions of general heat processing in this invention, for example, temperature 350 degrees C or less, processing time (Heating time) 30 minutes or less is preferable, more preferably a temperature of 90 to 300 ° C., a processing time of 1 to 90 seconds (hot plate, hot air dryer, etc.) or 5 to 15 minutes (hot air dryer, etc.).
  • the heat-expandable microspheres in the heat-expandable pressure-sensitive adhesive layer expand and / or foam and the heat-expandable pressure-sensitive adhesive layer expands and deforms, and usually the adhesive strength is reduced or lost.
  • the heat treatment can be performed at an appropriate stage depending on the purpose of use.
  • examples of the heat treatment method include a hot air heating method, a hot plate contact method, an infrared heating method, etc., and the thermally expandable adhesive layer can be uniformly foamed or expanded, and the adherend is There is no particular limitation as long as it does not contaminate or break.
  • the protective tape of the present invention is not particularly limited, but is adhered to an industrial or household device or component, and is adhered and protected by a heat-peelable sliding protective tape, or an industrial or household device or Can be a part.
  • industrial use or household use include, for example, automobiles and appliances, and are not particularly limited, but among them, automobiles are preferable. That is, specific examples of the above-mentioned industrial or household devices or parts include, for example, OA devices (printers, copiers, etc.), refrigerators, automobiles, and the like; components used in the above devices. .
  • the protective tape of the present invention can be used for the purpose of permanently adhering the adherend, but for the purpose of improving the slidability, the protective tape for sliding on industrial or household equipment or parts.
  • it can be peeled off from the adherend at any time (protective tape) for replacement (replacement to a new one due to wear of the protective tape (replacement) use, etc.) or the adherend from which the tape has been peeled off
  • Use for recycling use for paper passing in OA equipment (printers, copiers, etc.), make paper slippery, make each part of household appliances (sliding part of drawer in refrigerator, etc.) slippery
  • It can be preferably used for the purpose of protecting each part (vehicle window frame material, etc.) for preventing abnormal noise such as squeaking noise and chatter noise of automobile parts.
  • Specific examples of such applications include, for example, sliding protection of a material loading hopper as shown in FIG. 3 and protection of a transport device in a product transport process (for
  • the above-mentioned industrial or household equipment or parts can be produced by applying the protective tape of the present invention.
  • Example 1 100 parts by weight of an acrylic copolymer (copolymer of 50 parts by weight of 2-ethylhexyl acrylate, 50 parts by weight of ethyl acrylate, 5 parts by weight of methyl methacrylate, and 3 parts by weight of hydroxyethyl acrylate) and polyurethane-based cross-linking
  • a pressure-sensitive adhesive containing 2 parts by weight of the agent
  • a thermally expandable microsphere A (“Matsumoto Microsphere F-30D”, manufactured by Matsumoto Yushi Seiyaku Co., Ltd., expansion start temperature 80 ° C.
  • a pressure-sensitive adhesive composition (toluene solution) comprising 30 parts by weight of a maximum expansion temperature of 100 to 120 ° C.
  • the pressure-sensitive adhesive composition is applied on the sputter-treated surface of a 100 ⁇ m-thick single-sided sputter-treated PTFE film (“No. 901W-UL” manufactured by Nitto Denko Corporation) produced by a compression molding cutting method. It applied so that the thickness after drying might be set to 50 micrometers, and it was made to dry and the heat-expandable adhesion layer (adhesion layer) was formed. Thereafter, a silicone release treatment PET separator (“MRF38”, manufactured by Mitsubishi Resin Co., Ltd.) was further bonded to the surface of the thermally expandable adhesive layer to obtain a protective tape (heat-peelable sliding protective tape). .
  • MRF38 silicone release treatment PET separator
  • Example 2 100 parts by weight of an acrylic copolymer (copolymer of 40 parts by weight of 2-ethylhexyl acrylate, 60 parts by weight of ethyl acrylate, and 3 parts by weight of hydroxyethyl acrylate) and 1 part by weight of a polyurethane-based crosslinking agent
  • An adhesive toluene solution
  • the pressure-sensitive adhesive was applied on a separator (“MRF38”, manufactured by Mitsubishi Resin Co., Ltd.) so that the thickness after drying was 15 ⁇ m, and dried to form a rubbery organic elastic layer. Thereafter, the rubber-like organic elastic layer was bonded to a 100 ⁇ m-thick single-sided easy-adhesion treated PTFE film (“No.
  • the pressure-sensitive adhesive composition is applied on a separator (“MRF38”, manufactured by Mitsubishi Plastics Co., Ltd.) so that the thickness after drying is 35 ⁇ m, and dried to form a thermally expandable pressure-sensitive adhesive layer (pressure-sensitive adhesive layer). did. Thereafter, the surface of the heat-expandable pressure-sensitive adhesive layer was bonded to the rubber-like organic elastic layer side of the PTFE film to which the rubber-like organic elastic layer was transferred to obtain a protective tape (heat-peelable sliding protective tape).
  • MRF38 manufactured by Mitsubishi Plastics Co., Ltd.
  • Example 3 Sputter etching was performed on one side of a 100 ⁇ m thick PFA film (manufactured by Asahi Glass Co., Ltd.) under the conditions of Ar gas, atmospheric pressure 2.666 Pa, 30 Wsec / cm 2 .
  • 100 parts by weight of a commercially available addition reaction type silicone adhesive (“SD-4560”, manufactured by Toray Dow Corning Co., Ltd.) is added to thermally expandable microspheres C (“Matsumoto Microsphere F-100D”, Matsumoto Yushi Seiyaku Co., Ltd.).
  • SD-4560 a commercially available addition reaction type silicone adhesive
  • thermally expandable microspheres C (“Matsumoto Microsphere F-100D”, Matsumoto Yushi Seiyaku Co., Ltd.).
  • expansion start temperature 125 ° C. maximum expansion temperature 170-180 ° C.
  • a pressure-sensitive adhesive composition (toluene solution) was prepared by blending parts (solid content ratio).
  • the pressure-sensitive adhesive composition was applied to the sputter-etched surface of the PFA film obtained above so that the thickness after drying was 75 ⁇ m and dried to form a heat-expandable pressure-sensitive adhesive layer (pressure-sensitive adhesive layer).
  • a separator (“PET75_1SS-4A”, manufactured by Nipper Co., Ltd.) was bonded to the surface of the thermally expandable pressure-sensitive adhesive layer to obtain a protective tape (heat-peelable sliding protective tape).
  • Example 4 Thermally expandable microspheres D (“Matsumoto Microsphere F-230D”, Matsumoto Yushi Seiyaku Co., Ltd.) are added to 100 parts by weight of a commercially available addition-reactive silicone adhesive (“SD-4560”, manufactured by Toray Dow Corning). , Expansion start temperature 185 ° C., maximum expansion temperature 210-230 ° C.) 30 parts by weight (solid content ratio), and platinum catalyst (“SRX-212”, manufactured by Toray Dow Corning) 1.5 parts by weight (solid content) A pressure-sensitive adhesive composition (toluene solution) was prepared. On the sputter-treated surface of a 100 ⁇ m-thick single-sided sputter-treated PTFE film (“No.
  • the thickness after drying is 75 ⁇ m. It was applied and dried to form a thermally expandable adhesive layer (adhesive layer). Thereafter, a separator (“PET75_1SS-4A”, manufactured by Nipper Co., Ltd.) was bonded to the surface of the thermally expandable pressure-sensitive adhesive layer to obtain a protective tape (heat-peelable sliding protective tape).
  • a separator (“PET75_1SS-4A”, manufactured by Nipper Co., Ltd.) was bonded to the surface of the thermally expandable pressure-sensitive adhesive layer to obtain a protective tape (heat-peelable sliding protective tape).
  • Comparative Example 1 A protective tape was obtained in the same manner as in Example 1 except that no thermally expandable microsphere (thermally expandable microsphere A) was added.
  • Comparative Example 2 A protective tape was obtained according to Example 2 except that a PET film having a thickness of 100 ⁇ m (“Lumirror S10”, manufactured by Toray Industries, Inc.) was used as the substrate.
  • a PET film having a thickness of 100 ⁇ m (“Lumirror S10”, manufactured by Toray Industries, Inc.) was used as the substrate.
  • Adhesive strength before and after heating Adhesive strength was measured with respect to the stainless steel plate before heating on the adhesive layer surface side of each protective tape (20 mm width) obtained in Examples and Comparative Examples (based on JIS Z0237-2000, (Tensile speed: 300 mm / min, peeling angle: 180 °). Moreover, after heating on the heating conditions shown in Table 1 in the state which bonded each protective tape (20 mm width) obtained by the Example and the comparative example to the stainless steel plate, the adhesive force with respect to a stainless steel plate (adhesive strength after a heating) Measurement was performed (in accordance with JIS Z0237-2000, tensile speed: 300 mm / min, peeling angle: 180 °).
  • the adhesive force could be almost lost by heating with an industrial dryer and could be easily peeled off from the hopper, but was obtained in Comparative Example 1.
  • the protective tape did not lose its adhesive strength even after heating, and it took a long time for the peeling work.
  • the heat-peelable sliding protective tape of the present invention does not peel off from the adherend during use, and is used for sliding the product and material in a guide for the process of transporting the product, a material feeding hopper, etc.
  • the tape can be used for protection of adherends such as hoppers, and can be easily peeled off from the adherend with almost no adhesive residue by heating during use when peeling the tape to replace it. Workability at the time of exchanging (peeling) can be remarkably improved.
  • Base material 2 Rubber-like organic elastic layer 3: Thermally expandable adhesive layer 4: Separator 5: Heat-peelable sliding protective tape 6: Hopper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention se rapporte à une bande de protection thermiquement détachable permettant un glissement, qui présente d'excellentes propriétés de glissement sans se détacher, lors de l'utilisation, de la surface sur laquelle elle est collée. De plus, elle peut être facilement retirée de la surface sur laquelle elle est collée, par simple application de chaleur, lors du retrait de la bande après utilisation au cours d'une opération d'échange ou analogue. Cette bande de protection thermiquement détachable permettant un glissement est caractérisée en ce qu'elle présente: un substrat et une couche adhésive à dilatation thermique contenant des microsphères thermiquement dilatables et positionnée sur une surface du substrat; et en ce que le substrat comprend un film de résine de fluor.
PCT/JP2013/050738 2012-01-30 2013-01-17 Bande de protection thermiquement détachable permettant un glissement WO2013114955A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2012017130 2012-01-30
JP2012017112A JP2013155295A (ja) 2012-01-30 2012-01-30 伸長性加熱剥離型粘着シート
JP2012-017130 2012-01-30
JP2012-017112 2012-01-30
JP2012-262010 2012-11-30
JP2012262010A JP2013177549A (ja) 2012-01-30 2012-11-30 加熱剥離型摺動用保護テープ

Publications (1)

Publication Number Publication Date
WO2013114955A1 true WO2013114955A1 (fr) 2013-08-08

Family

ID=48904998

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2013/050739 WO2013114956A1 (fr) 2012-01-30 2013-01-17 Feuille adhésive étirable, thermiquement détachable
PCT/JP2013/050738 WO2013114955A1 (fr) 2012-01-30 2013-01-17 Bande de protection thermiquement détachable permettant un glissement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/050739 WO2013114956A1 (fr) 2012-01-30 2013-01-17 Feuille adhésive étirable, thermiquement détachable

Country Status (1)

Country Link
WO (2) WO2013114956A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108140732A (zh) * 2015-07-29 2018-06-08 汉高知识产权控股有限责任公司 含阻挡膜的制品及其用于3d tsv封装体用预施加底部填充膜的用途

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105492557B (zh) * 2013-08-29 2018-11-02 三井化学东赛璐株式会社 粘接膜和半导体装置的制造方法
JP6761116B2 (ja) * 2017-03-31 2020-09-23 リンテック株式会社 半導体装置の製造方法及び粘着シート
KR102656756B1 (ko) * 2021-09-02 2024-04-12 가부시키가이샤 데라오카 세이사쿠쇼 열박리형 점착 테이프

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61180142U (fr) * 1985-04-26 1986-11-10
JPS6339976A (ja) * 1986-08-04 1988-02-20 Mitsubishi Heavy Ind Ltd 穴内周面に対する樹脂摺動剤のライニング方法
JPH11302614A (ja) * 1998-04-23 1999-11-02 Nitto Denko Corp 加熱剥離型粘着シート
JP2001131507A (ja) * 1999-11-08 2001-05-15 Nitto Denko Corp 加熱剥離型粘着シート
JP2001288426A (ja) * 2000-04-06 2001-10-16 Kansai Paint Co Ltd 粘着性テープ
JP2003138231A (ja) * 2001-10-30 2003-05-14 Daikin Ind Ltd フッ素樹脂不織布貼付用テープまたはシート
JP2006152146A (ja) * 2004-11-30 2006-06-15 Hitachi Chem Co Ltd 感圧型接着シートおよび接着シートを用いた被着体の加工方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10335836A (ja) * 1997-05-29 1998-12-18 Hitachi Chem Co Ltd Ｉｖｈ付多層配線板製造用粘着フィルム
JP4540150B2 (ja) * 1998-09-30 2010-09-08 日東電工株式会社 熱剥離型粘着シート
JP4316253B2 (ja) * 2003-02-18 2009-08-19 リンテック株式会社 ウエハダイシング・接着用シートおよび半導体装置の製造方法
JP2005023286A (ja) * 2003-07-04 2005-01-27 Nitto Denko Corp 通気性熱剥離型粘着シート
JP4868708B2 (ja) * 2004-03-05 2012-02-01 日東電工株式会社 レーザーダイシング・ダイボンド用粘着シート及びこれを用いた半導体装置の製造方法
JP2009272478A (ja) * 2008-05-08 2009-11-19 Sharp Corp 半導体チップおよびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61180142U (fr) * 1985-04-26 1986-11-10
JPS6339976A (ja) * 1986-08-04 1988-02-20 Mitsubishi Heavy Ind Ltd 穴内周面に対する樹脂摺動剤のライニング方法
JPH11302614A (ja) * 1998-04-23 1999-11-02 Nitto Denko Corp 加熱剥離型粘着シート
JP2001131507A (ja) * 1999-11-08 2001-05-15 Nitto Denko Corp 加熱剥離型粘着シート
JP2001288426A (ja) * 2000-04-06 2001-10-16 Kansai Paint Co Ltd 粘着性テープ
JP2003138231A (ja) * 2001-10-30 2003-05-14 Daikin Ind Ltd フッ素樹脂不織布貼付用テープまたはシート
JP2006152146A (ja) * 2004-11-30 2006-06-15 Hitachi Chem Co Ltd 感圧型接着シートおよび接着シートを用いた被着体の加工方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108140732A (zh) * 2015-07-29 2018-06-08 汉高知识产权控股有限责任公司 含阻挡膜的制品及其用于3d tsv封装体用预施加底部填充膜的用途
EP3329525A4 (fr) * 2015-07-29 2019-01-30 Henkel IP & Holding GmbH Format contenant un film barrière et son utilisation pour film de remplissage sous-jacent pré-appliqué pour emballages tsv 3d
US11203181B2 (en) 2015-07-29 2021-12-21 Henkel Ag & Co. Kgaa Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages
CN108140732B (zh) * 2015-07-29 2021-12-21 汉高知识产权控股有限责任公司 含阻挡膜的制品及其用于3d tsv封装体用预施加底部填充膜的用途

Also Published As

Publication number Publication date
WO2013114956A1 (fr) 2013-08-08

Similar Documents

Publication Publication Date Title
JP3853247B2 (ja) 電子部品用加熱剥離型粘着シートおよび電子部品の加工方法並びに電子部品
JP4588021B2 (ja) 加熱剥離型粘着シートおよび該加熱剥離型粘着シートを用いた被着体の加工方法
KR102070823B1 (ko) 양면 점착 테이프 또는 시트, 및 피착체의 가공 방법
JP3810911B2 (ja) 加熱剥離型粘着シート
TWI303656B (en) Heat-peelable double-faced pressure-sensitive adhesive sheet, method of processing adherend
JP5921927B2 (ja) 加熱剥離型粘着シート
KR20140018220A (ko) 양면 점착 테이프 또는 시트, 및 피착체의 가공 방법
KR101492371B1 (ko) 열박리형 점착 테이프 및 전자 부품의 절단 방법
WO2010004703A1 (fr) Procédé de fabrication de panneau électroluminescent organique
JP4651805B2 (ja) 加熱剥離型粘着シート
JP2000248240A (ja) 加熱剥離型粘着シート
JP2001131507A (ja) 加熱剥離型粘着シート
JP2013155295A (ja) 伸長性加熱剥離型粘着シート
JP2013147541A (ja) 粘着剤用ポリマー、粘着剤組成物及び熱剥離性粘着シート
JP2009035635A (ja) 非汚染性熱剥離型粘着シート
JP2006152308A (ja) 電子部品の切断方法
WO2013114955A1 (fr) Bande de protection thermiquement détachable permettant un glissement
JP2005314708A (ja) 加熱剥離型粘着シート
JP2005200505A (ja) 加熱剥離型粘着シートおよび被着体の加工方法
JP2007238789A (ja) 加熱剥離型粘着シート及びチップ部品の製造方法
JP5132064B2 (ja) 加熱剥離性粘着シート
JP2005101628A (ja) 電子部品用加熱剥離型粘着シートおよび電子部品の加工方法並びに電子部品
JP5057678B2 (ja) 熱剥離型粘着シート
JP2005255829A (ja) 加熱剥離型粘着シートおよび被着体の加工方法
JP3804805B2 (ja) 加熱剥離型粘着シート

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13743861

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13743861

Country of ref document: EP

Kind code of ref document: A1