WO2013099922A1 - Dispositif d'irradiation laser, dispositif de fabrication de corps lié à un élément optique, procédé d'irradiation laser et procédé de fabrication de corps lié à un élément optique - Google Patents

Dispositif d'irradiation laser, dispositif de fabrication de corps lié à un élément optique, procédé d'irradiation laser et procédé de fabrication de corps lié à un élément optique Download PDF

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Publication number
WO2013099922A1
WO2013099922A1 PCT/JP2012/083606 JP2012083606W WO2013099922A1 WO 2013099922 A1 WO2013099922 A1 WO 2013099922A1 JP 2012083606 W JP2012083606 W JP 2012083606W WO 2013099922 A1 WO2013099922 A1 WO 2013099922A1
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WIPO (PCT)
Prior art keywords
optical member
bonding
sheet
optical
irradiation
Prior art date
Application number
PCT/JP2012/083606
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English (en)
Japanese (ja)
Inventor
力也 松本
幹士 藤井
Original Assignee
住友化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友化学株式会社 filed Critical 住友化学株式会社
Priority to CN201280064549.6A priority Critical patent/CN104023898B/zh
Priority to KR1020147016406A priority patent/KR101572402B1/ko
Publication of WO2013099922A1 publication Critical patent/WO2013099922A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane

Definitions

  • the present invention relates to a laser beam irradiation apparatus, an optical member bonding body manufacturing apparatus, a laser beam irradiation method, and an optical member bonding body manufacturing method.
  • This application claims priority based on Japanese Patent Application No. 2011-284650 for which it applied on December 27, 2011, and uses the content here.
  • the nozzle method is a method in which the laser light source is fixed and the irradiation target is moved on an XY table, or the irradiation target is fixed and the laser light source is moved.
  • the scanning speed becomes slow at the corners of the rectangle, and the corners may swell or wave due to thermal deformation.
  • the scanner method is a method in which laser light is biaxially scanned with a galvanometer mirror or the like.
  • the range that can be scanned with a galvanometer mirror or the like is very narrow, high-precision processing cannot be performed over a wide range.
  • An object of the present invention is to provide a laser light irradiation apparatus and a laser light irradiation method capable of accurately irradiating laser light over a wide range, and an optical member pasting using such a laser light irradiation apparatus and laser light irradiation method. It is providing the manufacturing method of a united manufacturing apparatus and an optical member bonding body.
  • the laser light irradiation apparatus is a laser light irradiation apparatus that irradiates an irradiation object with laser light, a table having a holding surface that holds the irradiation object, and a parallel to the holding surface.
  • a scanner capable of two-axis scanning with laser light in a plane; and a moving device capable of relatively moving the table and the scanner.
  • the scanner includes a laser beam oscillator that oscillates the laser beam, and a plane parallel to the holding surface that emits the laser beam oscillated by the laser beam oscillator. It is preferable that a scanning element capable of two-axis scanning and a condensing lens that condenses the laser light emitted from the scanning element toward the irradiation target.
  • the manufacturing apparatus of the optical member bonding body of the 2nd aspect of this invention is a manufacturing apparatus of the optical member bonding body formed by bonding an optical member to an optical display component, Comprising: Display of the said optical display component on the said optical display component A bonding apparatus that forms a bonding sheet by laminating an optical member sheet that is larger than the area, and a facing part of the optical member sheet that faces the display area and a surplus part that is located outside the facing part are separated.
  • the optical member bonding body including the optical member overlapping the optical display component and the optical display component from the bonding sheet by cutting out the optical member having a size corresponding to the display area from the optical member sheet.
  • the laser beam irradiation method of the third aspect of the present invention is a laser beam irradiation method for irradiating an irradiation object with laser light, holding the irradiation object on a holding surface of a table (first step), While the table and the scanner are relatively moved, the irradiation object is irradiated with laser light that has been biaxially scanned in a plane parallel to the holding surface from the scanner (second step).
  • the manufacturing method of the optical member bonding body of the 4th aspect of this invention is a manufacturing method of the optical member bonding body formed by bonding an optical member to an optical display component, Comprising: Display of the said optical display component on the said optical display component An optical member sheet that is larger than the region is bonded to form a bonding sheet (first step), an opposing portion of the optical member sheet that faces the display region, and a surplus portion that is positioned outside the opposing portion; The optical member including the optical member overlapping the optical display component and the optical display component from the bonding sheet by cutting out the optical member having a size corresponding to the display area from the optical member sheet The bonded body is cut out, and the optical member sheet that is the irradiation object is cut with laser light using the laser light irradiation method of the third aspect described above (second step).
  • the laser beam irradiation apparatus which can irradiate a laser beam accurately over a wide range, the manufacturing apparatus of an optical member bonding body, the laser beam irradiation method, and the manufacturing method of an optical member bonding body. it can.
  • FIG. 8 is a cross-sectional view taken along the line AA of FIG. It is sectional drawing which shows the double-sided bonding panel which passed through the manufacturing apparatus of the optical member bonding body of this invention. It is sectional drawing which shows the cut end formed with the laser of the optical member sheet
  • the width direction of the optical display component is the X direction
  • the direction orthogonal to the X direction is the Y direction, X direction, and Y direction.
  • the direction orthogonal to the Z direction is taken as the Z direction.
  • the production system of an optical display device is illustrated as a manufacturing apparatus of an optical member bonding body, and the film bonding system which comprises a part of production system is demonstrated.
  • FIG. 1 shows a schematic configuration of a film bonding system 1 (a manufacturing apparatus for an optical member bonding body) of the present embodiment.
  • the film bonding system 1 bonds a film-shaped optical member such as a polarizing film, a retardation film, and a brightness enhancement film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.
  • the film bonding system 1 manufactures an optical member bonding body including the optical display component and the optical member.
  • a liquid crystal panel P is used as the optical display component.
  • Each part of the film bonding system 1 is comprehensively controlled by a control device 20 as an electronic control device.
  • the film bonding system 1 sequentially performs a predetermined process on the liquid crystal panel P while transporting the liquid crystal panel P from the start position to the end position of the bonding process using, for example, a driving roller conveyor 5.
  • the liquid crystal panel P is conveyed on the roller conveyor 5 with its front and back surfaces being horizontal.
  • the left side ( ⁇ Y direction side) is the upstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the upstream side of the panel transport), and the right side in FIG. , Referred to as the panel conveyance downstream side).
  • the liquid crystal panel P has a rectangular shape in a plan view, and a display region P4 having an outer shape along the outer peripheral edge is formed inside the outer peripheral edge by a predetermined width.
  • the liquid crystal panel P is transported in a direction in which the short side of the display area P4 is substantially along the transport direction on the upstream side of the panel transport with respect to the second alignment device 14 to be described later, and the panel transport downstream of the second alignment device 14.
  • the display area P4 is transported in a direction substantially along the transport direction.
  • the first optical member F11 (optical member), the second optical member F12 (optical member), and the third optical member F13 (optical member) respectively cut out from the sheet) are appropriately bonded.
  • the first optical member F ⁇ b> 11 and the third optical member F ⁇ b> 13 as polarizing films are bonded to both surfaces located on the backlight side and the display surface side of the liquid crystal panel P, respectively.
  • a second optical member F12 as a brightness enhancement film is further bonded to the first optical member F11.
  • the film bonding system 1 conveys the liquid crystal panel P from the upstream process to the panel conveyance upstream side of the roller conveyor 5.
  • the film bonding system 1 includes a first alignment device 11, a first bonding device 12 (bonding device), a first cutting device 13, a second alignment device 14, and a second bonding device 15 (bonding).
  • Device a second cutting device 16 (scanner), a third alignment device 17, a third bonding device 18 (bonding device), and a third cutting device 19 (scanner).
  • the first alignment device 11 holds the liquid crystal panel P and freely conveys it in the vertical direction (Z direction) and the horizontal direction (XY direction).
  • the first alignment apparatus 11 has a pair of cameras that image the upstream and downstream ends of the liquid crystal panel P, for example.
  • the imaging data of the camera is sent to the control device 20.
  • the control device 20 operates the first alignment device 11 based on the imaging data and the inspection data in the optical axis direction stored in advance.
  • the second alignment device 14 and the third alignment device 17 have the camera, and use image data of the camera for alignment.
  • the first alignment device 11 performs alignment of the liquid crystal panel P with respect to the first bonding device 12 under the control of the control device 20.
  • the liquid crystal panel P is positioned in a horizontal direction (X direction) (hereinafter referred to as a component width direction) orthogonal to the transport direction (Y direction), and a turning direction (hereinafter referred to as Z axis). Positioning in the swivel direction). In this state, the liquid crystal panel P is introduced into the bonding position of the first bonding apparatus 12.
  • the 1st bonding apparatus 12 is provided in the panel conveyance downstream rather than the 1st alignment apparatus 11.
  • FIG. The 1st bonding apparatus 12 bonds the upper surface (backlight side) of liquid crystal panel P conveyed below the lower surface of the elongate 1st optical member sheet
  • the 1st bonding apparatus 12 is provided with the conveying apparatus 12a and the pinching roll 12b.
  • the conveying device 12a conveys the first optical member sheet F1 along the longitudinal direction while unwinding the first optical member sheet F1 from the first raw roll R1 around which the first optical member sheet F1 is wound.
  • the pinching roll 12b bonds the upper surface of the liquid crystal panel P conveyed by the roller conveyor 5 to the lower surface of the first optical member sheet F1 conveyed by the conveying device 12a.
  • the transport device 12a includes a holding unit 12c and a collection unit 12d.
  • the holding portion 12c holds the first original fabric roll R1 around which the first optical member sheet F1 is wound, and feeds the first optical member sheet F1 along its longitudinal direction.
  • the collection unit 12d collects the protection film pf which is overlapped on the upper surface of the first optical member sheet F1 and is fed out together with the first optical member sheet F1, on the downstream side of the panel transfer of the first bonding apparatus 12.
  • the conveying device 12a is a bonding position in the first bonding device 12, so that the bonding surface of the first optical member sheet F1 on which the first optical member sheet F1 and the liquid crystal panel P are bonded faces downward. A conveyance path for the first optical member sheet F1 is set.
  • the pinching roll 12b has a pair of laminating rollers that are arranged with their axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the first bonding device 12.
  • the liquid crystal panel P and the first optical member sheet F1 are overlapped and introduced into the gap.
  • the liquid crystal panel P and the first optical member sheet F1 are sent out to the downstream side of the panel conveyance while being pressed between the bonding rollers. Thereby, the 1st bonding sheet
  • 1st cutting device 13 is located in the panel conveyance downstream rather than collection part 12d.
  • the 2nd alignment apparatus 14 is provided in the panel conveyance downstream rather than the 1st bonding apparatus 12 and the 1st cutting device 13.
  • FIG. The second alignment device 14 holds, for example, the first single-sided bonding panel P11 on the roller conveyor 5 and turns 90 ° around the vertical axis.
  • the 1st single-sided bonding panel P11 currently conveyed substantially parallel to the short side of the display area P4 changes direction so that it may be conveyed substantially parallel to the long side of the display area P4.
  • the said turning is made
  • the second alignment device 14 performs the same alignment as the first alignment device 11. That is, the second alignment device 14 is based on the inspection data in the optical axis direction stored in the control device 20 and the imaging data of the camera C, and the component width direction of the first single-sided bonding panel P11 with respect to the second bonding device 15. And positioning in the turning direction. In this state, the first single-sided bonding panel P ⁇ b> 11 is introduced into the bonding position of the second bonding device 15.
  • the 2nd bonding apparatus 15 is provided in the panel conveyance downstream rather than the 2nd alignment apparatus 14.
  • FIG. The 2nd bonding apparatus 15 is the upper surface (of liquid crystal panel P of the 1st single-sided bonding panel P11 conveyed below that with respect to the lower surface of the elongate 2nd optical member sheet
  • the 2nd bonding apparatus 15 is provided with the conveying apparatus 15a and the pinching roll 15b.
  • the conveying device 15a conveys the second optical member sheet F2 along the longitudinal direction while unwinding the second optical member sheet F2 from the second original roll R2 around which the second optical member sheet F2 is wound.
  • the pinching roll 15b bonds the upper surface of the 1st single-sided bonding panel P11 which the roller conveyor 5 conveys to the lower surface of the 2nd optical member sheet
  • the transport device 15a includes a holding unit 15c and a collection unit 15d.
  • the holding portion 15c holds the second original roll R2 around which the second optical member sheet F2 is wound, and feeds the second optical member sheet F2 along its longitudinal direction.
  • the collection unit 15d collects an excess portion of the second optical member sheet F2 that has passed through the second cutting device 16.
  • the conveying apparatus 15a is the bonding position in the 2nd bonding apparatus 15, and the bonding surface of the 2nd optical member sheet
  • the conveyance path of the second optical member sheet F2 is set so as to face.
  • the pinching roll 15b has a pair of laminating rollers arranged with their axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the second bonding device 15.
  • the first single-sided bonding panel P11 and the second optical member sheet F2 are overlapped and introduced into the gap. These 1st single-sided bonding panels P11 and the 2nd optical member sheet
  • seat F2 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers.
  • the 2nd cutting device 16 is located in the panel conveyance downstream rather than the pinching roll 15b.
  • the 2nd cutting device 16 cut
  • the second cutting device 16 moves the second optical member sheet F2 and the sheet piece F1S of the first optical member sheet F1 along the outer peripheral edge of the display region P4 (in this embodiment, along the outer peripheral edge of the liquid crystal panel P). Cut endlessly.
  • the accuracy in the optical axis direction of the optical member sheets F1 and F2 is increased, and the opticalness between the optical member sheets F1 and F2 is increased.
  • the axial displacement is eliminated, and the cutting with the first cutting device 13 is simplified.
  • this invention is not restricted to embodiment mentioned above.
  • the present invention can be applied even when only the second optical member sheet F2 is cut.
  • only the second optical member sheet F2 can be cut after the second optical member sheet F2 is bonded to the first single-sided bonding panel P11 in a larger size. According to this method, the pasting accuracy at the time of pasting the 2nd optical member sheet F2 on the 1st single side pasting panel P11 becomes unnecessary, and it also becomes possible to cut a picture frame.
  • a second single-sided bonding panel P12 (optical member) in which the first optical member F11 and the second optical member F12 are overlapped and bonded to the upper surface of the liquid crystal panel P.
  • a bonding body and a 2nd optical member bonding body) are formed.
  • seat F1, F2 which the opposing part (each optical member F11, F12) of 2nd single-sided bonding panel P12 and the display area P4 is cut off, and remains in frame shape.
  • a plurality of surplus portions of the second optical member sheet F2 are connected in a ladder shape, and the surplus portions are wound around the recovery portion 15d together with the surplus portions of the first optical member sheet F1.
  • the “part facing the display region P4” is a region having a size not less than the size of the display region P4 and not more than the size of the outer shape of the liquid crystal panel P, and functions such as an electrical component mounting portion. Indicates the area that avoids the part.
  • the surplus portions are laser-cut along the outer peripheral edge of the liquid crystal panel P on the three sides excluding the functional portion in the rectangular liquid crystal panel P in plan view.
  • the surplus portion is laser-cut at a position where it appropriately enters the display region P4 side from the outer peripheral edge of the liquid crystal panel P.
  • the third alignment device 17 is provided on the downstream side of the panel conveyance with respect to the second bonding device 15 and the second cutting device 16.
  • the third alignment device 17 inverts the front and back surfaces of the second single-sided bonding panel P12 with the backlight side of the liquid crystal panel P as the upper surface so that the display surface side of the liquid crystal panel P is the upper surface, and the first Alignment similar to the alignment device 11 and the second alignment device 14 is performed. That is, the 3rd alignment apparatus 17 is based on the inspection data of the optical axis direction memorize
  • the 3rd bonding apparatus 18 is provided in the panel conveyance downstream rather than the 3rd alignment apparatus 17.
  • FIG. The 3rd bonding apparatus 18 is the upper surface of 2nd single-sided bonding panel P12 conveyed below with respect to the lower surface of the elongate 3rd optical member sheet
  • the 3rd bonding apparatus 18 is provided with the conveying apparatus 18a and the pinching roll 18b.
  • the conveyance device 18a conveys the third optical member sheet F3 along the longitudinal direction while unwinding the third optical member sheet F3 from the third original roll R3 around which the third optical member sheet F3 is wound.
  • the pinching roll 18b bonds the upper surface of the 2nd single-sided bonding panel P12 which the roller conveyor 5 conveys to the lower surface of the 3rd optical member sheet
  • the transport device 18a includes a holding unit 18c and a collection unit 18d.
  • the holding portion 18c holds the third original fabric roll R3 around which the third optical member sheet F3 is wound, and feeds the third optical member sheet F3 along its longitudinal direction.
  • the collection unit 18d collects an excess portion of the third optical member sheet F3 that has passed through the third cutting device 19 positioned on the downstream side of the panel conveyance with respect to the pinching roll 18b.
  • the conveying apparatus 18a is the bonding position in the 3rd bonding apparatus 18, and the bonding surface of the 3rd optical member sheet
  • a conveyance path of the third optical member sheet F3 is set so as to face.
  • the pinching roll 18b has a pair of laminating rollers arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the third bonding device 18. In the gap, the second single-sided bonding panel P12 and the third optical member sheet F3 are overlapped and introduced. These 2nd single-sided bonding panels P12 and the 3rd optical member sheet
  • seat F3 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers.
  • 3rd cutting device 19 is located in the panel conveyance downstream rather than pinching roll 18b, and cuts 3rd optical member sheet F3.
  • the third cutting device 19 is a laser beam irradiation device similar to the second cutting device 16 (see FIGS. 2 and 3).
  • the third cutting device 19 cuts the third optical member sheet F3 endlessly along the outer peripheral edge of the display region P4 (for example, along the outer peripheral edge of the liquid crystal panel P).
  • the double-sided bonding panel P13 (the optical member bonding body, the 2nd optical) by which the 3rd optical member F13 was bonded to the upper surface of the 2nd single-sided bonding panel P12 by the cutting
  • disconnection of the 3rd cutting device 19 is shown.
  • Member bonding body is formed.
  • the double-sided bonding panel P13 is inspected for defects (bonding failure, etc.) through a defect inspection device (not shown) and then conveyed to the downstream process for other processing.
  • the liquid crystal panel P includes, for example, a rectangular first substrate P1 made of, for example, a TFT substrate, a second substrate P2 having the same rectangular shape disposed opposite to the first substrate P1, and a first substrate.
  • a liquid crystal layer P3 sealed between P1 and the second substrate P2 is included.
  • hatching of each layer in the cross-sectional view may be omitted.
  • the first substrate P1 has the three sides of the outer periphery of the first substrate P1 along the corresponding three sides of the second substrate P2, and the remaining one side of the outer periphery is the second substrate. It protrudes outside the corresponding side of P2. As a result, an electrical component mounting portion P5 that projects outward from the second substrate P2 is provided on the one side of the first substrate P1.
  • the second cutting device 16 detects the outer peripheral edge of the display area P4 with a detection unit such as a camera 16a, and the first and second optical elements along the outer peripheral edge of the display area P4.
  • the member sheets F1 and F2 are cut.
  • the third cutting device 19 similarly cuts the third optical member sheet F3 along the outer peripheral edge and the like of the display region P4 while detecting the outer peripheral edge of the display region P4 with a detection unit such as a camera 19a.
  • a frame portion G having a predetermined width for arranging a sealant or the like for bonding the first substrate P1 and the second substrate P2 is provided, and each cutting device 16, 19 is within the width of the frame portion G. Laser cutting is performed.
  • the cut end t of the optical member sheet FX may be swollen or wavy due to thermal deformation. For this reason, when the optical member sheet FX after laser cutting is bonded to the optical display component PX, poor bonding such as air mixing and distortion is likely to occur in the optical member sheet FX.
  • the cut end t of the optical member sheet FX is the glass surface of the liquid crystal panel P. Therefore, the cut end t of the optical member sheet FX is not swollen or undulated, and the bonding failure cannot occur because it is after bonding to the liquid crystal panel P.
  • the deflection width (tolerance) of the cutting line formed by the laser processing machine is smaller than the deflection width of the cutting line formed by the cutting blade. Therefore, in this embodiment, the optical member sheet FX is cut using the cutting blade. Compared to the case, the width of the frame portion G can be reduced, and the liquid crystal panel P can be reduced in size and / or the display area P4 can be increased in size. Such an optical member sheet is effective for application to a high-function mobile device that requires an enlargement of the display screen while the size of the housing is limited, such as a recent smartphone or tablet terminal.
  • the optical member sheet FX is cut into a sheet piece aligned with the display region P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and their relative bonding Since the positional dimensional tolerances overlap, it is difficult to reduce the width of the frame portion G of the liquid crystal panel P (it is difficult to enlarge the display area).
  • the optical member sheet FX is bonded to the liquid crystal panel P and then cut in accordance with the display region P4, only the runout tolerance of the cutting line needs to be considered, and the width tolerance of the frame portion G can be reduced. ( ⁇ 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).
  • the cutting force is not input to the liquid crystal panel P, and it becomes difficult for cracks and chips to occur at the edge of the substrate of the liquid crystal panel P, such as a heat cycle.
  • the durability against is improved.
  • the energy per unit length of laser irradiation is preferably determined in consideration of the thickness and configuration of the liquid crystal panel P and the optical member sheet FX.
  • the optical member sheet FX when the optical member sheet FX is cut with a laser, it is preferable to perform laser irradiation within an energy range of 0.01 to 0.11 (J / mm) per unit length. If the energy per unit length is too large in laser irradiation, the optical member sheet FX may be damaged when the optical member sheet FX is cut with a laser. However, it is possible to prevent the optical member sheet FX from being damaged by performing laser irradiation within an energy range of 0.01 to 0.11 (J / mm) per unit length.
  • a laser cut start point pt1 is set on the extension of one long side of the display area P4, and this First, the cutting of the one long side is started from the starting point pt1.
  • the end point pt2 of the laser cut is set at a position where the laser goes around the display area P4 and reaches the extension of the short side on the start point side of the display area P4.
  • the start point pt1 and the end point pt2 are set so as to be able to withstand the tension when the optical member sheet FX is wound, leaving a predetermined connection allowance in the surplus portion of the optical member sheet FX.
  • the control device 20 of the present embodiment is configured to include a computer system.
  • This computer system includes an arithmetic processing unit 20a such as a CPU and a storage unit 20b such as a memory or a hard disk.
  • the control device 20 of the present embodiment includes an interface capable of executing communication with a device external to the computer system.
  • An input device that can input an input signal may be connected to the control device 20.
  • the input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from a device external to the computer system.
  • the control device 20 may include a display device such as a liquid crystal display that indicates the operation status of each part of the film bonding system 1, or may be connected to the display device.
  • An operating system (OS) that controls the computer system is installed in the storage unit 20b of the control device 20.
  • the storage unit 20b of the control device 20 causes the arithmetic processing unit 20a to control each unit of the film bonding system 1, thereby causing the respective units of the film bonding system 1 to perform processing for accurately conveying the polarizing film F.
  • the program is recorded.
  • Various types of information including programs recorded in the storage unit 20b can be read by the arithmetic processing unit 20a of the control device 20.
  • the control device 20 may include a logic circuit such as an ASIC that executes various processes required for controlling each part of the film bonding system 1.
  • the storage unit 20b is a concept including a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), an external storage device such as a hard disk, a CD-ROM reader, and a disk-type storage medium. Functionally, the storage unit 20b stores program software describing a control procedure for the operation of the moving device 32 and the operations of the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 (scanning element). Area, storage area for storing the irradiation position in the optical member sheet FX for realizing the desired locus shown in FIG. 3 as coordinate data, and the amount of movement of the second cutting device 16 in each direction of XYZ in FIG. Is set, and other various storage areas are set.
  • FIG. 2 is a perspective view showing an example of a laser beam irradiation device 30 used as a cutting portion (cutting device) of the optical member sheet.
  • the laser light irradiation device 30 includes a table 31, a scanner as the second cutting device 16, a moving device 32, and a control device 33.
  • the laser beam irradiation device 30 is a device for irradiating the optical member sheet FX with laser light and cutting the optical member sheet FX into optical members FS having a predetermined size.
  • a scanner as the second cutting device 16 will be described. However, the scanner can be applied as the third cutting device 19.
  • the table 31 has a holding surface 31a for holding the optical member sheet FX (irradiation target).
  • the second cutting device 16 emits laser light to the optical member sheet FX in order to cut the optical member sheet FX held on the table 31.
  • the second cutting device 16 is capable of biaxial scanning with laser light in a plane parallel to the holding surface 31a of the table 31 (in the XY plane). That is, the second cutting device 16 can be moved relative to the table 31 independently in the X direction and the Y direction, thereby moving the second cutting device 16 to an arbitrary position on the table 31, It is possible to irradiate the laser beam with high accuracy to an arbitrary position of the optical member sheet FX held on the table 31.
  • the moving device 32 can relatively move the table 31 and the second cutting device 16.
  • the moving device 32 moves the table 31 and the second cutting device 16 in a first direction V1 (X direction) parallel to the holding surface 31a, and a second direction parallel to the holding surface 31a and orthogonal to the first direction V1.
  • V2 (Y direction) is relatively moved in the third direction V3 (Z direction) which is the normal direction of the holding surface 31a.
  • the moving device 32 moves only the second cutting device 16 without moving the table 31.
  • the second cutting device 16 is provided with a slider mechanism (not shown) that allows the second cutting device 16 to move in each direction of XYZ.
  • the moving device 32 operates the linear motor built in the slider mechanism to move the second cutting device 16 in each direction of XYZ.
  • the linear motor that is pulse-driven in the slider mechanism can finely control the rotation angle of the output shaft by the pulse signal supplied to the linear motor. Therefore, the position in each direction of XYZ of the 2nd cutting device 16 supported by the slider mechanism can be controlled with high precision.
  • the position control of the second cutting device 16 is not limited to position control using a pulse motor, and can be realized by feedback control using a servo motor or any other control method.
  • the method of relative movement by the moving device is not limited to the above-described embodiment.
  • the table 31 and the second cutting device 16 are moved relative to each other by moving only the table 31 without moving the second cutting device 16 or by moving both the table 31 and the second cutting device 16. Even in this case, the present invention can be applied.
  • FIG. 3 is a perspective view showing the internal configuration of the second cutting device (scanner) 16 in the laser beam irradiation device 30.
  • illustration of the moving device 32 and the control device 33 is omitted for the sake of convenience.
  • the second cutting device 16 includes a laser beam oscillator 160, a first irradiation position adjusting device 161, a second irradiation position adjusting device 162, and a condenser lens 163.
  • the laser beam oscillator 160 is a member that oscillates the laser beam L.
  • the laser oscillator 160 may be a CO 2 laser oscillator (carbon dioxide laser oscillator), a UV laser oscillator, a semiconductor laser oscillator, a YAG laser oscillator, an excimer laser oscillator, or the like.
  • an oscillator can be used, a specific configuration is not particularly limited.
  • the CO 2 laser light oscillator is more preferable because it can oscillate laser light at a high output suitable for, for example, cutting processing of a polarizing film.
  • the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 constitute a scanning element capable of biaxially scanning the laser beam oscillated by the laser beam oscillator 160 in a plane parallel to the holding surface 31a. .
  • a galvano scanner is used as the first irradiation position adjustment device 161 and the second irradiation position adjustment device 162 .
  • the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are arranged in this order on the optical path of the laser light between the laser light oscillator 160 and the condenser lens 163.
  • the scanning element is not limited to a galvano scanner, and a gimbal can be used.
  • the first irradiation position adjusting device 161 includes a mirror 161a and an actuator 161b that adjusts the installation angle of the mirror 161a.
  • the actuator 161b has a rotation shaft 161c parallel to the Z direction.
  • the rotating shaft 161c is connected to the mirror 161a.
  • the actuator 161b rotates the mirror 161a around the Z axis based on the control of the control device 33.
  • the second irradiation position adjusting device 162 includes a mirror 162a and an actuator 162b that adjusts the installation angle of the mirror 162a.
  • the actuator 162b has a rotation shaft 162c parallel to the Y direction.
  • the rotating shaft 162c is connected to the mirror 162a.
  • the actuator 162b rotates the mirror 162a around the Y axis based on the control of the control device 33.
  • the laser beam L oscillated by the laser beam oscillator 160 is applied to the optical member sheet FX held on the table 31 via the mirror 161a, the mirror 162a, and the condenser lens 163.
  • the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are laser beams irradiated toward the optical member sheet FX held on the table 31 from the laser beam oscillator 160 based on the control of the control device 33. Adjust the irradiation position.
  • Actuators 161b and 162b rotate the mirrors 161a and 162a based on the control of the control device 33 to adjust the optical path of the laser light L irradiated toward the optical member sheet FX.
  • the optical path of the laser beam L is changed from the state indicated by the solid line in FIG. 3 to the state indicated by the one-dot chain line or the state indicated by the two-dot difference line.
  • the laser light L oscillated by the laser light oscillator 160 is condensed at the condensing point Qa. .
  • the laser beam L oscillated by the laser beam oscillator 160 is displaced by a predetermined amount from the condensing point Qa.
  • the light is condensed on the condensing point Qb.
  • the laser beam L oscillated by the laser beam oscillator 160 is a predetermined amount from the condensing point Qa. It is condensed on the displaced condensing point Qc.
  • the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are focused on the optical member sheet FX held on the table 31 by the focusing lens 163 based on the control of the control device 33.
  • the condensing point position (Qa, Qb, Qc) of the laser beam L to be adjusted is adjusted.
  • the condensing lens 163 is disposed at the tip of the second cutting device 16 (the portion facing the optical member sheet FX).
  • the condensing lens 163 condenses the laser light L, which is oscillated from the laser light oscillator 160 and whose optical path is adjusted by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162, at a predetermined position of the optical member sheet FX. To do.
  • the condenser lens 163 an f ⁇ lens is used as the condenser lens 163. Accordingly, the laser beam L indicated by the solid line, the one-dot chain line, and the two-dot chain line input in parallel to the condenser lens 163 from the mirror 162a can be condensed in parallel to the optical member sheet FX.
  • the control device 33 moves the moving device 32, the first irradiation position adjusting device 161, the first irradiation position so that the laser beam L emitted from the second cutting device 16 draws a desired locus on the optical member sheet FX held on the table 31. 2
  • the irradiation position adjusting device 162 is controlled.
  • FIG. 12 is a flowchart showing an embodiment of the laser beam irradiation method of the present invention.
  • the laser light irradiation method of this embodiment is a cutting method for cutting the optical member sheet FX into optical members FS of a predetermined size using the laser light irradiation device 30 shown in FIG.
  • the first step of holding the optical member sheet FX on the holding surface 31a of the table 31, and the table 31 and the second cutting device 16 are held from the second cutting device 16 while being relatively moved.
  • the table 31 and the second cutting device 16 are held so that the laser beam emitted from the second cutting device 16 draws a desired locus on the optical member sheet FX held on the table 31.
  • the irradiation position of the laser beam to be adjusted is adjusted.
  • an operation until the optical member sheet FX is cut into an optical member FS having a predetermined size using the laser beam irradiation device 30 will be described.
  • an original fabric roll for example, first original fabric roll R1 of an optical member sheet (for example, first optical member sheet F1) to be used is loaded into the holding portion 12c.
  • the operator makes initial settings using the operation panel or the like (step S1 shown in FIG. 12). For example, the cutting size, thickness, supply speed, laser light output and depth of focus, feeding speed of the holding unit 12c, transport speed of the roller conveyor 5, and the like are set by the initial setting.
  • the roller conveyor 5 starts conveying the liquid crystal panel P based on the control of the control device 20 (step S2 shown in FIG. 12).
  • the alignment by the first alignment device 11 is performed based on the control of the control device 20, the first bonding sheet F ⁇ b> 21 is formed by the first bonding device 12, and the first cutting device 13.
  • the 1st single-sided bonding panel P11 by is formed, alignment by the 2nd alignment apparatus 14 is performed, and formation of the 2nd bonding sheet
  • the liquid crystal panel P is stopped at a predetermined position (step S3 shown in FIG. 12).
  • the liquid crystal panel P is held on the holding surface 31 a of the table 31 based on the control of the control device 20.
  • the optical member sheet FX held on the table 31 is irradiated with laser light to cut out an optical member of a predetermined size from the optical member sheet (step S4 shown in FIG. 12).
  • the control device 33 draws a desired locus on the optical member sheet FX held by the table 31 based on the control of the control device 20 so that the laser light emitted from the second cutting device 16 is drawn on the table 31.
  • the moving device 32, the first irradiation position adjusting device 161, and the second irradiation position adjusting device 162 are controlled.
  • FIG. 13 is a diagram showing a control method for scanning laser light in a rectangular shape on the optical member sheet FX.
  • symbol Tr is a target laser beam movement locus (desired locus; hereinafter, referred to as laser beam movement locus).
  • Reference numeral Tr ⁇ b> 1 indicates a trajectory (hereinafter sometimes referred to as a light source movement trajectory) obtained by projecting a movement trajectory due to relative movement between the table 31 and the second cutting device 16 onto the optical member sheet FX.
  • the light source movement trajectory Tr1 has a shape in which four corners of the laser movement trajectory Tr having a rectangular shape are curved, the symbol SA1 is a straight section other than the corner, and the symbol SA2 is a bent section of the corner.
  • Reference numeral Tr2 indicates that the irradiation position of the laser beam is orthogonal to the light source movement locus Tr1 by the first irradiation position adjustment device 161 and the second irradiation position adjustment device 162 when the second cutting device 16 is relatively moving on the light source movement locus Tr1. It shows a curve (hereinafter sometimes referred to as an adjustment curve) that indicates how much the direction is shifted (adjusted).
  • the deviation amount (adjustment amount) of the laser irradiation position is indicated by the distance between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction orthogonal to the light source movement locus Tr1.
  • the light source movement trajectory Tr1 depicts a substantially rectangular movement trajectory with curved corners.
  • the light source movement trajectory Tr1 and the laser beam movement trajectory Tr are substantially the same, and the shapes of both are different only in a narrow corner area.
  • the moving speed of the second cutting device 16 becomes slow at the corners of the rectangle, and the corners may swell or wave due to the heat of the laser beam. Therefore, in FIG. 13, the corner of the light source movement locus Tr1 is curved so that the moving speed of the second cutting device 16 is substantially constant over the entire light source movement locus Tr1.
  • the cut shape when the conventional nozzle method is used, when the laser beam is caused to travel in a curved shape, the cut shape also becomes a curved shape. In addition, when the laser beam travels in a rectangular shape, the cut shape becomes a rectangular shape, but the corner portion is swollen or waved due to thermal deformation.
  • the control device 33 sets the laser light irradiation position to the first irradiation position because the light source movement locus Tr1 and the laser light movement locus Tr coincide with each other. Without adjusting by the adjusting device 161 and the second irradiation position adjusting device 162, the optical member sheet is irradiated with laser light as it is from the second cutting device 16. On the other hand, when the second cutting device 16 is moving in the bending section SA2, the light source movement trajectory Tr1 and the laser light movement trajectory Tr do not coincide with each other, so the first irradiation position adjustment device 161 and the second irradiation position adjustment device 162.
  • the irradiation position of the laser beam is controlled so that the irradiation position of the laser beam is arranged on the laser beam movement locus Tr.
  • the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 make the irradiation position of the laser beam orthogonal to the light source movement locus Tr1.
  • the distance W1 is shifted to N1.
  • the distance W1 is the same as the distance W2 between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction N1 orthogonal to the light source movement locus Tr1.
  • the light source movement trajectory Tr1 is arranged inside the laser light movement trajectory Tr, but the irradiation position of the laser light is outside the laser light movement trajectory Tr by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162. Therefore, these deviations cancel each other, and the irradiation position of the laser beam is arranged on the laser beam irradiation locus Tr.
  • a desired locus Tr is drawn on the optical member sheet FX held on the table 31 by the control of the control device 33.
  • the moving device 32 and the irradiation position adjusting devices 161 and 162 are controlled.
  • the laser light irradiation section to be adjusted by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 is only the narrow bending section SA2.
  • the laser beam is scanned on the optical member sheet FX by the movement of the second cutting device 16 by the moving device 32.
  • laser beam scanning is mainly performed by the moving device 32, and only the region where the laser beam irradiation position cannot be accurately controlled by the moving device 32 is adjusted by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162. is doing. Therefore, the irradiation position of the laser beam can be accurately controlled in a wide range as compared with the case where the laser beam is scanned only by the moving device 32 or only the second cutting device 16 (scanner).
  • the optical axis direction changes according to the positions of the optical member sheets F1, F2, and F3.
  • the liquid crystal panel P can be aligned and bonded in accordance with this optical axis direction.
  • the size corresponding to the display area P4 is obtained.
  • the optical members F11, F12, and F13 can be formed on the surface of the liquid crystal panel P. Accordingly, the optical members F11, F12, and F13 can be accurately provided up to the display area P4, and the frame portion G positioned outside the display area P4 is narrowed to enlarge the display area and downsize the device. Can do.
  • seat F1, F2, F3 is conveyed so that the bonding surface by the side of the adhesion layer may face downward at the bonding position with optical display component PX. Scratches on the bonding surface of F3, adhesion of foreign matters, and the like can be suppressed, and occurrence of bonding failure can be suppressed.
  • the production system of the optical display device includes the third alignment device 17 that reverses the front surface and the back surface of the second single-sided bonding panel P12 conveyed on the roller conveyor 5, so that the optical display component PX
  • the optical member sheet FX can be easily bonded from above to both the front and back surfaces.
  • the configuration in which the optical member sheet is cut is described as an example of the configuration for performing the predetermined processing by irradiating the irradiation target with the laser beam.
  • the present invention is applied to the above-described embodiment. Not exclusively.
  • dividing the optical member sheet into at least two parts it is also possible to make a cut through the optical member sheet or to form a groove (cut) with a predetermined depth in the optical member sheet.
  • cutting (cutting off) an end of the optical member sheet, half cutting, marking processing, and the like are included.
  • the drawing trajectory of the laser light emitted from the laser light irradiation device may be a triangular shape in plan view, or may be a polygonal shape that is a pentagon or more in plan view.
  • the present invention is not limited to such a shape, and may be a star shape in plan view or a geometric shape in plan view. The present invention can also be applied to such a drawing trajectory.
  • the present invention can be applied to a single wafer bonding method. Further, the present invention can be applied even when a chip-shaped sheet is bonded. For example, it is possible to cut only the optical member after an optical member such as a polarizing film is bonded to an optical display component such as a liquid crystal panel. According to this method, the bonding accuracy when the optical member is bonded to the optical display component becomes unnecessary, and the frame can be cut.
  • SYMBOLS 1 Film bonding system (manufacturing apparatus of an optical member bonding body), 12 ... 1st bonding apparatus (bonding apparatus), 15 ... 2nd bonding apparatus (bonding apparatus), 16 2nd cutting apparatus (scanner) , 18 ... third bonding device (bonding device), 19 ... third cutting device (scanner), 30 ... laser light irradiation device, 31 ... table, 32 ... moving device, 33 ... control device, 160 ...
  • laser light oscillation 161 First irradiation position adjusting device (scanning element), 162: Second irradiation position adjusting device (scanning element), 163: Condensing lens, P: Liquid crystal panel (optical display component), P4: Display area, F1 ... first optical member sheet (optical member sheet), F2 ... second optical member sheet (optical member sheet), F3 ... third optical member sheet (optical member sheet), F11 ... first optical member (optical member), F12 ... Second optical member (optical member) F13 ... 3rd optical member (optical member), F21 ... 1st bonding sheet (bonding sheet), F22 ... 2nd bonding sheet (bonding sheet), F23 ...

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)

Abstract

La présente invention porte sur un dispositif d'irradiation laser pour irradier un objet à irradier avec un laser, qui contient une table ayant une surface de maintien maintenant l'objet à irradier, un scanner apte à balayer de façon biaxiale le laser dans un plan parallèle à une surface de maintien, et un dispositif de déplacement apte à déplacer la table et le scanner l'un par rapport à l'autre.
PCT/JP2012/083606 2011-12-27 2012-12-26 Dispositif d'irradiation laser, dispositif de fabrication de corps lié à un élément optique, procédé d'irradiation laser et procédé de fabrication de corps lié à un élément optique WO2013099922A1 (fr)

Priority Applications (2)

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CN201280064549.6A CN104023898B (zh) 2011-12-27 2012-12-26 激光照射装置、光学构件贴合体的制造装置、激光照射方法以及光学构件贴合体的制造方法
KR1020147016406A KR101572402B1 (ko) 2011-12-27 2012-12-26 레이저 광 조사 장치, 광학 부재 접합체의 제조 장치, 레이저 광 조사 방법 및 광학 부재 접합체의 제조 방법

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TWI523721B (zh) 2016-03-01
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