WO2013073872A1 - 고속 금속박 제조용 수평 전주 장치 및 제조방법 - Google Patents
고속 금속박 제조용 수평 전주 장치 및 제조방법 Download PDFInfo
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- WO2013073872A1 WO2013073872A1 PCT/KR2012/009684 KR2012009684W WO2013073872A1 WO 2013073872 A1 WO2013073872 A1 WO 2013073872A1 KR 2012009684 W KR2012009684 W KR 2012009684W WO 2013073872 A1 WO2013073872 A1 WO 2013073872A1
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- electrolyte
- mother plate
- metal foil
- base plate
- electrode
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
Definitions
- the present invention relates to a manufacturing method and apparatus for producing a metal foil at high speed, and more particularly, to a manufacturing method capable of continuously manufacturing a metal foil by using electorforming and a manufacturing apparatus used for producing the metal foil.
- copper foil is manufactured by a rolling method for producing a thin film by rolling using a slab manufactured through steelmaking, steelmaking, and continuous casting, or a rolling method using a drum cell. This method is mainly used.
- a metal foil having a thickness of several mm is produced by reheating a slab and performing a hot rolling, and a thin sheet produced by such hot rolling is formed by additional cold rolling.
- Ultra-thin thickness of 100 micrometers or less can be manufactured.
- a method of manufacturing a metal thin plate by such a method is disclosed in US Pat. No. 4,948,434.
- the manufacturing process is complicated, which causes a lot of energy and time in the process. Difficult to maintain, thickness variation occurs, surface roughness is not constant, and problems such as edge cracks are generated, resulting in high production cost and difficulty in producing a wide metal foil. There was this.
- Korean Patent Laid-Open Publication No. 1999-0064747 and Korean Patent Laid-Open Publication No. 2004-0099972 propose a method for manufacturing a metal sheet using the electroforming method and an apparatus for manufacturing a metal sheet using the electroforming method.
- the method of manufacturing the metal foil by the electroforming method has an advantage of simplifying the process since the metal foil can be produced through a simple process.
- the patent documents propose a metal foil production method using a drum cell.
- the metal foil is manufactured by the electroforming method using such a drum cell, it is important to manage the surface of the drum in order to produce a thin film having a uniform thickness and a constant surface roughness. There is a problem and it is difficult to continuously manage the drum surface.
- the area of the drum surface immersed in the electrolyte determines the electrodeposition rate, so the production speed is limited according to the size of the drum used in the pole, and the cost of providing a huge drum is expensive. Has the disadvantage of following the limitation of replacement.
- the electrolyte flow rate in order to increase the production rate, the electrolyte flow rate must be increased between the positive electrode and the negative electrode, but since the shape between the positive electrode and the negative electrode has a curvature, the electrolyte flow rate gradually decreases.
- the present invention is to provide a method and apparatus that can improve the productivity of the metal foil by applying a horizontal cell to produce the metal foil by the electroforming method.
- a metal foil manufacturing method and apparatus using an electroforming method which can improve the productivity and reduce the manufacturing cost by forming an electrodeposition layer on the upper and lower surfaces of the mother plate at the same time supplying the electrolyte solution at high speed To provide.
- the present invention relates to a horizontal pole apparatus, wherein the horizontal pole apparatus includes: a mother plate feeding means for continuously horizontally feeding a flexible and conductive mother plate provided as a cathode electrode in one direction; Conductor for supplying current to the mother plate while transferring the mother plate in contact with the widthwise edge portion of the mother plate, an anode electrode spaced apart from one side or both sides of the mother plate, a horizontal passage formed by the mother plate and the anode electrode A horizontal cell including an electrolyte supply device supplying an electrolyte solution containing ions, and a current supply device supplying current to the conductor roll and the anode electrode for electrolytic deposition of metal ions on one or both surfaces of the mother plate; And peeling means for separating the metal foil electrodeposited on one or both surfaces of the mother plate from the conductive mother plate.
- a mother plate feeding means for continuously horizontally feeding a flexible and conductive mother plate provided as a cathode electrode in one direction
- Conductor for supplying current to the mother plate while transferring
- the electrolyte supply apparatus may include an electrolyte supply nozzle supplying an electrolyte solution to one or both surfaces of the mother plate, and the electrolyte supply nozzle may supply the electrolyte solution in the same direction, opposite directions, or both directions of the traveling direction of the mother plate.
- a plurality of horizontal cells may be installed in series along the mother plate traveling direction.
- the apparatus may further include heat treatment means for heat-treating the metal foil electrodeposited on the mother plate by induction heating, atmosphere heating, or direct heating.
- the peeling means may be a plurality of rollers to impart a shear stress difference between the conductive mother plate and the metal foil.
- the horizontal cell may be provided with an edge mask to prevent electrolytic precipitation of metal ions at the edge of the width direction of the mother plate.
- the anode electrode may have a structure in which the thickness decreases from the center portion to the edge with respect to the width direction of the mother plate.
- the anode electrode may use a divided electrode divided into a plurality of in the width direction of the mother plate, the split electrode may have a different electrode size for each electrode.
- the split electrodes are preferably supplied with a different size of current for each electrode.
- the anode electrode may use a split electrode divided into a plurality of directions in the advancing direction of the mother plate, and the split electrode may have a different electrode size for each electrode.
- the split electrodes may be supplied with a current having a different magnitude for each electrode.
- the electrolyte supply nozzle may be inclined or curved to supply the electrolyte in the direction in which the electrolyte flows.
- the electrolyte supply pipe may be separated at least the end portion to supply the electrolyte solution in the forward and reverse directions with respect to the moving direction of the conductive mother plate, the end portion preferably has a De Laval nozzle cross section.
- the present invention relates to a metal foil manufacturing method, provided with a cathode electrode, the electrolyte supply step of supplying an electrolyte solution containing a metal ion on the surface of the flexible and conductive mother plate horizontally supplied in one direction; An electrodeposition step in which metal ions of the electrolyte are electrolytically deposited on one or both surfaces of the mother plate by the action of an anode electrode and the mother plate spaced apart from one or both sides of the mother plate to form an electrodeposition layer on the mother plate; And a peeling step of peeling the electrodeposited layer from the mother plate.
- the said mother board is formed with the oxide film in one surface or both surfaces.
- the method of the present invention may further comprise the step of heat-treating the peeled metal foil at 300 ⁇ 600 °C.
- the electrolyte may be supplied in the same direction and in the opposite direction to the moving direction of the mother plate through a horizontal passage formed by the mother plate and the anode electrode.
- the electrolytes supplied to both sides of the mother plate may be different from each other.
- the method of the present invention may further include a second electrolyte supply step and a second electrodeposition step before the peeling step, the electrolyte solution supplied in the second electrolyte solution supply step may be different from the electrolyte solution of the electrolyte supply step.
- the metal foil of a multilayered structure can be obtained.
- a metal foil can be manufactured at high speed.
- the present invention it is possible to control the thickness of the metal foil through a continuous process, or to produce a metal foil of a multi-layer structure.
- the present invention while supplying the electrolyte at high speed structurally prevents the vibration of the mother plate to uniformize the flow field of the electrolyte can lead to stable electrolytic precipitation, and even composition, uniform surface And it is possible to produce a metal foil of excellent quality having a uniform thickness.
- the horizontal pole apparatus By the horizontal pole apparatus according to the embodiment of the present invention, it is possible to produce a metal foil having a uniform composition, a uniform surface and a uniform thickness in the width direction at high speed.
- the horizontal pole device according to an embodiment of the present invention, it is possible to structurally prevent the non-uniform current density formed in the width direction to obtain a metal foil of excellent quality, and at the same time improve the productivity.
- the current density can also be controlled in the advancing direction of the mother plate, so that an overall electrodeposition layer can be formed.
- FIG. 1 is a view schematically showing the configuration of a metal foil manufacturing apparatus according to an embodiment of the present invention.
- FIG. 2 is a view schematically showing the configuration of a metal foil manufacturing apparatus according to another embodiment of the present invention.
- FIG 3 is a view illustrating an anode electrode according to an embodiment of the present invention, which is divided into the width of the mother plate and schematically illustrates an example of a split electrode having a reduced thickness in the edge direction at the center.
- FIG. 4 is a view schematically showing an anode electrode divided in the advancing direction of the mother plate according to one embodiment of the present invention.
- FIG. 5 is a view schematically showing a horizontal cell having an inclined electrolyte supply nozzle in accordance with an embodiment of the present invention.
- FIG. 6 is a schematic view of a horizontal cell having a curved electrolyte supply nozzle in accordance with another embodiment of the present invention.
- FIG. 7 is a view schematically showing a cross-sectional shape of the DeLaval nozzle formed at the end of the electrolyte supply pipe according to another embodiment of the present invention.
- FIG. 8 is a diagram illustrating an example of a horizontal pole apparatus in which a plurality of horizontal cells are arranged in series according to another embodiment of the present invention.
- FIG. 9 is a horizontal pole device including a horizontal cell having an anode electrode provided with an electrode having a reduced electrode thickness from the center to the edge in the width direction of the base plate of FIG. 3, and a drum type pole device including a conventional drum cell.
- Example 10 is a view schematically showing the electrolyte supply nozzle end structure used in Example 2, (a) shows a vertical nozzle, (b) and (c) is a curved nozzle according to a more preferred embodiment of the present invention Indicates.
- FIG. 11 is a view showing a streamline of an electrolyte flow field when an electrolyte is supplied in a laminar flow through each electrolyte supply nozzle of FIG. 10 according to Example 2.
- FIG. 11 is a view showing a streamline of an electrolyte flow field when an electrolyte is supplied in a laminar flow through each electrolyte supply nozzle of FIG. 10 according to Example 2.
- FIG. 12 is a view showing a streamline of an electrolyte flow field when the electrolyte is supplied in turbulent flow through each electrolyte supply pipe of FIG. 10 according to Example 2.
- FIG. 12 is a view showing a streamline of an electrolyte flow field when the electrolyte is supplied in turbulent flow through each electrolyte supply pipe of FIG. 10 according to Example 2.
- the present invention provides a horizontal cell pole apparatus and a method of obtaining a metal foil by electrodepositing a metal on a base plate supplied horizontally to the pole apparatus.
- FIGS. 1 and 2 are schematic device diagrams each showing an example of a horizontal pole apparatus according to an embodiment of the present invention.
- the horizontal pole apparatus 100 of the present invention includes a mother plate feeding device 10, a horizontal cell 30, an electrolyte supply device and a metal foil separator.
- the mother plate 11 is supplied into the pole cell 30 by the mother plate supply device 10.
- the base plate 11 may be supplied intermittently, as well as the base plate 11 of a constant size may be supplied continuously.
- the base plate 11 is not necessarily limited to this, it is possible to supply the base plate 11 wound in the coil form into the horizontal cell 30, furthermore, such a base plate When all 11 are supplied, the other base plate 11 wound in the form of a coil can be continuously supplied after the previously supplied base plate 11.
- each terminal joined can also be processed to a suitable shape.
- the electrodeposition layer electrodeposited on the base plate 11 is transferred to the surface roughness of the base plate 11 as it is, the base plate 11 may have a constant surface roughness as necessary.
- Such constant surface roughness can be provided by polishing the surface of the base plate 11. Therefore, it is possible to include polishing means for imparting appropriate surface roughness to the base plate 11. In this way, when the roughness is applied to the surface of the base plate 11, the metal foil 50 obtained by electrodeposition has the same surface roughness as that of the base plate even with respect to the metal foil 50 obtained by transferring the surface roughness formed on the base plate 11 as it is. It can be given.
- any suitable mechanical, chemical or mechanical chemical polishing means known in the art can be applied.
- mechanical polishing such as polishing, chemical polishing, such as etching, mechanical chemical polishing, such as the CMP method mainly used in a semiconductor process, etc. are mentioned.
- the quality of the metal foil 50 tends to be largely influenced by the surface roughness.
- the electrodeposition layer electrodeposited on the base plate 11 transfers the surface roughness of the base plate 11, but at the site where the surface roughness of the obtained metal foil 50 is poor, an electrical short occurs, causing the surface roughness of the base plate 11 to be removed. It may damage, and may cause the unevenness and surface defect of an electrodeposition layer.
- the surface roughness with respect to the base plate 11 can be appropriately adjusted depending on the use of the metal foil 50 obtained, and is not particularly limited, but, for example, when used as a substrate material of the display device
- the surface of the base plate 11 can be polished so that the surface roughness of 40 nm or less is normally used when using it for the use of the substrate material of 4 nm or less of a solar cell.
- the horizontal pole device 100 of the present invention may include a pre-washing device.
- the cleaning of the surface of the base plate 11 may use an acid solution such as diluted hydrochloric acid or sulfuric acid and water.
- a drying device may be further included to dry the washed base plate 11. Drying may be performed by adding air at high pressure or by applying a hot gas, or may be performed by heating the base plate 11.
- the base plate 11 that can be used in forming the metal foil 50 by the electroforming of the present invention can be used without particular limitation as long as it is flexible and has conductivity.
- stainless steel, titanium, or the like can be applied.
- the present invention is to obtain the metal foil 50, when the metal foil 50 formed by electrodeposition on the base plate 11 has a rigid bond with the base plate 11, the metal foil 50 is the base plate 11 Since it is not easy to isolate
- the horizontal pole apparatus 100 is separated from the base plate 11 supply device 10 and includes a horizontal cell 30 for electrodepositing metal on the base plate 11.
- the mother plate 11 is supplied into the pole cell 30 continuously and in a constant direction.
- the 'electrode cell 30' is a unit cell in which an electrolyte is supplied onto the mother plate 11 so that metal ions are electrodeposited on the surface of the mother plate 11 by an electrolytic precipitation reaction to form an electrodeposition layer of metal.
- Constant direction means that after the mother plate 11 is supplied into the pole cell 30, the direction of movement of the mother plate 11 does not change until it exits at least the horizontal cell 30. It means.
- the moving direction of the base plate 11 may be referred to as 'horizontal direction' or simply 'horizontal' in some cases, and further, the base plate 11 advances the electroplating cell 30 in the horizontal direction, and thus the electrolyte solution.
- the pole cell 30 is also referred to as a 'horizontal cell 30' in order to show that the metal ions therein are electrolytically deposited on the base plate 11.
- the horizontal cells 30 are spaced apart from the substrate rolls 31 and 31 ′, which serve to transfer the mother plate 11 and the cathode power, and the mother plate 11 at regular intervals, A current supply for supplying a current having a (-) charge and a (+) charge to the anode electrode 32, the conductor rolls 31 and 31 ', and the anode electrode 32 disposed on one or both sides of 11), respectively.
- Apparatus 33 and electrolyte supply device for receiving an electrolyte for the electrolytic reaction.
- the conductor rolls 31 and 31 ' function as a conveying means for transferring the mother plate 11 into the horizontal cell 30 and discharging it from the horizontal cell 30, and at the same time, the mother plate 11 and the current supply device.
- an electrolytic precipitation reaction is performed such that metal ions are deposited on the base plate 11 by an electrolytic reaction between the anode electrode 32 and the base plate 11.
- the base plate 11 since the base plate 11 uses a flexible conductive base plate 11, a slump phenomenon may occur due to its own weight when passing through the horizontal cell 30, in which case the base plate 11 is used. Since the distance between the anode electrode 32 and the change may cause a current density difference, the metal foil 50 having a uniform thickness may not be obtained. Therefore, in order to prevent the base plate 11 from sagging, the rotational speeds of the inlet-side conductor roll 31 and the outlet-side conductor roll 31 'can be varied. That is, the rotational speed of the outlet conductor roll 31 'is higher than the rotational speed of the inlet conductor roll 31 to prevent sagging due to the weight of the mother plate 11.
- the anode electrode 32 is spaced apart from the base plate 11 passing through the horizontal cell 30 at regular intervals.
- the anode electrode 32 and the mother plate 11 is spaced apart from each other to provide a flow path through which an electrolyte is supplied and distributed therebetween.
- the electrolyte supplied on the base plate 11 should be supplied in a uniform amount with respect to the width direction of the base plate 11 to achieve uniform current density, and furthermore, to obtain a metal foil 50 having a uniform thickness. have.
- the electrolyte when the electrolyte is supplied from the electrolyte supply pipe 35 onto the mother plate 11, the electrolyte may be concentrated at the edge portion of the mother plate 11 in the width direction, thereby failing to form a uniform current density in the width direction. In this case, a non-uniform metal foil 50 in the width direction may be obtained, which may lead to product defects. Therefore, it is preferable to have a uniform current density in the width direction of the base plate 11. For this purpose, by forming a mask or the like in the edge region, it is possible to suppress the formation of an electrodeposition layer having a non-uniform thickness due to the overcurrent density.
- the anode electrode 32 may use an electrode having a structure in which the thickness of the electrode decreases from the center portion to the edge direction with respect to the width direction of the base plate 11.
- the thickness of the anode electrode 32 is configured to decrease toward the edge as described above, the gap with the base plate 11 functioning as the cathode increases as the edge direction increases, thereby offsetting an increase in current density due to concentration of the electrolyte. Therefore, the amount of electrodeposition electrodeposited on the base plate 11 can be controlled.
- the thickness of the electrode continuously decreases from the center to the edge with respect to the width direction of the base plate 11, but has a curvature anode electrode 32a (curvature anode electrode 32a). May be). At this time, the curvature anode electrode 32a does not have to have a constant curvature as a whole.
- the concentration of the electrolyte is concentrated at the edges so that the current density can be eliminated, so that the metal precipitates between the base plate 11 as the cathode electrode and the anode electrode. And the composition can be kept uniform, and therefore, surface defects of the metal foil 50 generated due to the nonuniformity of the current density in the width direction can be prevented.
- a divided anode electrode 32a (also referred to simply as a "width direction divided anode electrode") may be used in which the anode electrode 32 is divided into a plurality of in the width direction.
- the division electrodes may have the same division widths or may be different from each other. In this case, sizes of all divided electrodes are not to be different from each other, and only some electrodes may be differently set as necessary.
- FIG. 2 an anode electrode divided in the width direction while having a curvature is illustrated as an example, but is not limited thereto.
- the anode electrode may have only a curvature and may be an electrode divided in the width direction without having a curvature.
- the current supplied to each of the divided anode electrodes 32a can be individually controlled, so that more accurate current density can be achieved. That is, by controlling the magnitude of the current supplied from the current supply device 33 to the divided anode electrode 32a individually according to the electrodeposition amount in the width direction, the electrodeposition amount of the metal electrolytically deposited on the mother plate 11 is determined. It can adjust uniformly with respect to the width direction of, and the metal foil 50 which has a uniform thickness can be obtained.
- the anode electrode 32 of the present invention may be a divided anode electrode 32b (also referred to simply as a 'mold plate traveling direction divided anode electrode') divided in the longitudinal direction, that is, the traveling direction of the mother plate 11,
- the anode electrode 32a whose thickness varies in the width direction may be the mother plate traveling direction split anode electrode 32b.
- the mother plate traveling direction split anode electrode 32b may be configured to have different sizes of the divided electrodes, and may supply different amounts of current for each split electrode. have.
- the initially electrodeposited metal component acts as an electrodeposition nucleus for subsequent electrodeposition, and can continuously and stably obtain rapid electrodeposition performance while passing through the horizontal cell 30. Further, even when the electrolyte is supplied at a high speed, the phenomenon that the electrodeposition layer is peeled off and dropped off can be suppressed.
- the electrodeposition speed is influenced by the relative speed between the electrolyte and the moving speed of the mother plate (11). That is, in the present invention, the electrolyte may be supplied to flow in the same direction or in the opposite direction to the traveling direction of the base plate 11, or may be supplied to flow in both directions. At this time, in the region in which the electrolyte is supplied in the reverse direction to the traveling direction of the base plate 11, the contact time of the electrolyte solution with the base plate 11 is relatively short, so that electrodeposition performance may decrease, as described above. According to this, the anode electrode 32 is divided into a divided electrode, and a current amount is set differently for each of the divided electrodes and supplied.
- the contact time between the mother plate 11 and the electrolyte is relatively long, so that a faster electrodeposition rate can be obtained, but due to the decrease in the concentration of metal ions in the electrolyte, Compared with the previous electrodeposition amount, the electrodeposition amount may be lowered. Therefore, the electrode electrode 32 is divided according to the advancing direction of the base plate 11, and the electrodeposition speed can be improved by supplying a different amount of current for each divided electrode.
- the anode electrode 32 is configured to reduce the thickness of the electrode from the center portion to the edge direction with respect to the width direction of the base plate 11 as needed, and furthermore to implement the widthwise divided electrode and the longitudinal split electrode at the same time It may be.
- the current density can be individually controlled in the plurality of regions of the anode electrode 32, so that the metal foil 50 having a more uniform thickness can be obtained.
- an electrolytic reaction occurs by electrolytic precipitation of metal ions in the electrolytic solution on the base plate 11 by the action of the base plate 11 serving as the cathode electrode, and when the electrolyte solution is supplied at a high speed, the mother plate ( 11) It is possible to increase the electrodeposition rate of metal ions to the surface.
- the shape of the mother plate provided as the cathode has a curvature in the drum shape, so that the flow path of the electrolyte also forms a curvature, which causes a decrease in the electrodeposition speed due to the gradually slowing the flow rate of the electrolyte. Moreover, there exists a problem that the thickness of the metal foil obtained becomes nonuniform.
- the horizontal cell 30 has a flow path formed horizontally, so that the electrolyte can be supplied at high speed without a phenomenon that the flow rate of the electrolyte is reduced, thereby electrodeposition of metal ions. You can increase the speed.
- the supply rate of the electrolyte may be supplied at a maximum of 5,000 by Reynolds number (Re), and the relative speed may be appropriately increased or decreased depending on the progress speed of the mother plate 11.
- the electrolyte may be supplied at a flow rate of laminar flow (flow of fluid supplied in a straight line without shaking the water, having straightness), and after forming a stable electrodeposition reaction, high-speed turbulence (water stem) Can be supplied at a flow rate of the fluid).
- the electrodeposition layer may come off and electrodeposition may fail. If the electrodeposition layer grows to several micro levels, the adhesion may be improved by the stress generated in the electrodeposition layer, thereby enabling the use of a high speed flow field. It is. On the other hand, it is preferable to set the fluid supply velocity region to be limited when using a high velocity flow field below the flow velocity beyond the surface tension between the electrodeposition layer and the base plate (11).
- the electrolyte is supplied at a flow rate that exceeds the surface tension between the electrodeposition layer and the base plate 11
- the shear stress between the flow field and the electrodeposition layer due to the supply of the electrolyte exceeds the surface tension between the electrodeposition layer and the base plate 11. It may cause peeling of the electrodeposition layer.
- the current supply device 33 supplies (-) current and (+) current to the conductive rolls 31 and 31 'and the anode electrode 32, respectively. As applicable to the present invention, a detailed description thereof will be omitted.
- the electrolytic solution may be supplied to one side of the base plate 11 supplied into the horizontal cell 30 to electrolytically deposit metal only on one side of the base plate 11 to obtain the metal foil 50.
- the production speed of the metal foil 50 can be increased by electrolytically depositing metal on both sides of the mother plate 11 by supplying the electrolyte solution to both surfaces of 11).
- the electrolyte is supplied to one or both sides of the base plate 11 through the electrolyte supply nozzle 37, and to the base plate 11 and the anode electrode 32.
- the metal ions are deposited on the surface of the substrate 11 by electrolytic deposition by the substrate 11 and the anode 32 serving as the cathode electrode, thereby forming an electrodeposition layer.
- the electrolyte supply device includes an electrolyte storage tank 40 for storing and containing the electrolyte solution and an electrolyte supply nozzle 37 for supplying the electrolyte solution to the surface of the base plate 11, and the electrolyte solution stored in the electrolyte storage tank 40 It is moved to the electrolyte supply nozzle 37 through the electrolyte supply pipe 35 and is supplied on the mother plate 11 in the horizontal cell 30.
- the electrolyte supply nozzle 37 may be installed to supply the electrolyte to only one surface of the mother plate 11, or may be installed on both sides of the electrolyte supply to both surfaces of the mother plate 11.
- the electrolyte supply nozzle 37 supplies the electrolyte at high speed through the horizontal passage formed by the mother plate 11 and the anode electrode 32. At this time, the electrolyte may flow in the same direction or in the opposite direction to the traveling direction of the base plate 11, as well as the same direction (forward direction) as the traveling direction of the base plate 11 around the electrolyte supply nozzle 37 and The electrolyte may be supplied such that the electrolyte flows in the opposite direction (reverse direction).
- the effect of electrodepositing substantially twice can be obtained. That is, the electrolyte supplied in the opposite direction can obtain the effect of primary electrodeposition, in which a relatively small amount of short time for the electrolyte to contact the mother plate 11 is electrodeposited due to the difference in relative speed with the mother plate 11, and the same.
- the supply in the direction it is possible to obtain the effect of the secondary electrodeposition, in which the electrolytic solution contacts the mother plate 11 for a longer time and is electrodeposited in a relatively larger amount than the primary electrodeposition.
- the electrolyte supply pipe 35 of the present invention may be divided so as to be supplied in the forward and reverse directions with respect to the traveling direction of the base plate 11.
- the electrolyte supply pipe 35 of the present invention may be divided so as to be supplied in the forward and reverse directions with respect to the traveling direction of the base plate 11.
- the electrolyte supply pipe 35 is preferably an inclined electrolyte supply nozzle 37a having a distal end inclined in the forward and reverse directions with respect to the traveling direction of the base plate 11. More preferably, as shown in FIG. 6, the electrolyte supply pipe 35 is bent in the forward and reverse directions with respect to the advancing direction of the base plate 11 so as to supply the electrolyte solution between the base plate 11 and the anode electrode 32.
- a curved electrolyte supply nozzle 37b can be formed.
- the metal foil 50 which has a uniform composition, a uniform surface, and a uniform thickness can be obtained by this.
- the vibration of the base plate 11 may be generated due to the pressure difference supplied from the upper and lower portions of the base plate 11, causing uneven electrodeposition.
- Such a problem can be further suppressed by forming the electrolyte supply nozzle 37b and supplying the electrolyte in the horizontal direction.
- the electrolyte supply pipe 35 may be provided with a dispenser 38 at the end thereof.
- the dispenser 38 may uniformly distribute the electrolyte solution supplied to the surface of the base plate 11 through the electrolyte supply pipe 35 in the width direction of the base plate 11. Even if the electrolyte is supplied to the flow path of the electrolyte formed by the anode electrode 32 and the mother plate 11 through the electrolyte supply pipe 35, the flow rates of the electrolyte supplied in the width direction of the mother plate 11 and the electrolyte supplied to the center part are different. And the flow rate difference. In this case, it may be difficult to ensure uniformity of the electrodeposition layer due to the difference in current density at the edge and the center of the base plate 11, and thus the electrolyte may be uniformly supplied to the entire base plate 11 through the dispenser 38. .
- the dispenser 38 preferably has a cross-sectional shape, such as a DeLaval nozzle, as shown in FIG. Since the dispenser 38 has the shape of a DeLaval nozzle, the electrolyte supplied through the electrolyte supply pipe 35 can be uniformly supplied in the width direction of the mother plate 11 and without decreasing the flow length of the electrolyte.
- the dispenser 38 may be provided at the end of the bent electrolyte supply nozzle 37b formed at the end of the electrolyte supply pipe 35 in the embodiment.
- the electrolyte supply nozzle 37a, the curved electrolyte supply nozzle 37b, the dispenser 38, or a combination thereof inclined at the end of the electrolyte supply pipe 35 All or part of the effect can be achieved. Furthermore, when the electrolyte is supplied vertically, uneven electrodeposition that may occur up to the point where the unstable flow field of the electrolyte is stabilized can be further suppressed, and the thickness of the finally obtained metal foil 50 can be made more uniform.
- the electrolyte supply pipe 35 of the present invention may include a honeycomb 36 therein.
- a honeycomb 36 By including such a honeycomb 36, the electrolyte supplied to the surface of the mother plate 11 through the electrolyte supply pipe 35 can be induced to form a laminar flow.
- vortices of the electrolyte may be formed on the surface of the base plate 11, thereby minimizing the phenomenon of unstable flow field.
- vibration of the mother plate 11 generated when the electrolyte collides with the surface of the mother plate 11 can be suppressed, so that an effect of suppressing uneven electrodeposition can also be obtained.
- the electrodeposition process through the horizontal cell 30 may be continuously performed a plurality of times by installing a plurality of horizontal cells 30 and 130 in series as shown in FIG. 8.
- the electrodeposition process through the horizontal cells 30 and 130 is performed a plurality of times, the electrodeposition is performed in each of the horizontal cells 30 and 130, thereby increasing the thickness of the metal foil 50. Therefore, the thickness of the metal foil 50 can be controlled as needed, and even if the mother plate 11 is supplied at a higher speed, the metal foil 50 having a desired thickness can be obtained, thereby improving productivity.
- the first horizontal cell 30 and the second horizontal cell 130 are installed, the metal is electrodeposited on the base plate 11 in the first horizontal cell 30, and in the second horizontal cell 130.
- the metal foil 50 is formed by supplying the same electrolyte solution as the first horizontal cell 30 and further electrodepositing the electrodeposition layer on the electrodeposition layer 15 on which the electrodeposition layer is formed to form the mother plate 15 'having the desired electrodeposition layer. Can be obtained.
- different electrolyte solutions may be supplied and electrodeposited for each of the horizontal cells 30 and 130, thereby obtaining a metal foil 50 having a plurality of layers, thereby providing various functions to the metal foil 50.
- the first electrode cell 15 is disposed on the base plate 11 by installing the first horizontal cell 30 and the second horizontal cell 130, and supplying the first electrolyte solution from the first horizontal cell 30.
- the second electrodeposition layer 15 ′ may be electrodeposited on the first electrodeposition layer by supplying a second electrolyte solution different from the first horizontal cell 30 to the second horizontal cell 30.
- the metal ion contained in the electrolyte is not particularly limited as long as it can be poled, and examples thereof include Cu, Fe, Ni, Zn, Cr, Co, Ag, Pd, Al, Sn, or an alloy thereof.
- the electrolyte storage tank 40 includes an electrolyte heater 41 for heating the electrolyte, an electrolyte filter 42 for removing impurities such as sludge contained in the electrolyte, and an electrolyte pump for supplying the electrolyte to the horizontal cell 30. (43) and the like can be further included.
- the electrolyte used for electrodeposition can be recovered to the electrolyte storage tank 40 as needed.
- the electrolyte collection pipe 45 may be provided.
- the recovered electrolyte solution will be lowered to the concentration required for electrodeposition of the metal ion concentration in the electrolyte storage tank 40 because the metal ions are consumed in electrodeposition, it can be adjusted to a predetermined concentration by replenishing the metal ions as appropriate.
- the base plate 11 in which the electrodeposition layer is formed as described above is discharged from the horizontal cell 30 through the outlet-side conductor roll 31 '.
- emitted from the horizontal cell 30 can obtain the metal foil 50 by isolate
- the metal foil 50 electrodeposited on one side or both sides of the base plate 11 can be separated at the same time or given a time difference.
- the metal foil 50 and the mother foil winding device 55 and the mother plate winding device 72 may be included.
- it can be wound up to a cylindrical winder.
- the winding amount of each of the winding device (55, 72) it can be wound in an appropriate amount, cut and wound to another winding machine.
- the cutting may include a metal foil cutting device 54 and the mother plate cutting device 71 as needed, in the case of the base plate 11 is more preferably cut at the adhesive site.
- the horizontal pole device 100 is discharged from the horizontal cell 30 as needed before or after separating the metal foil 50 or after the metal foil 50 as necessary after separation
- a processing device can be installed.
- Examples of such a post-treatment apparatus include a post-cleaning apparatus 52, a drying apparatus (not shown), a heat treatment apparatus 53, and the like.
- the electrolytic solution may remain on the surface of the metal foil 50 electrodeposited on the mother plate 11, it is preferable to wash the surface of the metal foil 50.
- it may be provided with a post-cleaning device 52 for removing the electrolyte and foreign matter that may be present on the surface of the metal foil 50 using an acidic solution and water.
- a flexible brush or the like may be used to effectively remove the residual electrolyte. Such washing may be performed in a state in which an electrodeposition layer is formed by electrodeposition of metal on the base plate 11, but may be washed after separating the metal foil 50 from the base plate 11.
- the metal foil 50 may be dried.
- the metal foil 50 formed by the electric pole has a nanostructure, and may be appropriately heat-treated to secure a target microstructure with respect to the obtained metal foil 50.
- the metal foil 50 formed by the electric pole has a variety of work process temperatures depending on the intended use. For example, in the case of the metal foil 50 such as Fe, abnormal grain growth occurs at 300 to 600 ° C., so that the nanoparticles of the metal foil 50 are formed. Structural microstructures can lead to changes in microstructured tissue. The change in the microstructure due to the growth of the abnormal crystal grains may cause a defect in the product during the process of manufacturing the target product by applying the metal foil 50. For example, when an electronic circuit or the like is formed in the metal foil 50, it may cause peeling or disconnection of the circuit during a high temperature process.
- the metal foil 50 obtained in the temperature range causing abnormal grain growth is used, the metal foil 50 is heat-treated in advance and changed into a microstructure of the microstructure in advance so that the microstructure changes during the process. It is desirable to prevent.
- a heat treatment apparatus 53 may be included as necessary.
- the heat treatment as described above may vary depending on the target microstructure, but is not particularly limited, but heat treatment is preferably performed at a temperature of 300 to 600 ° C.
- an inert gas atmosphere such as nitrogen and argon, and the heat treatment method may be induction heating, direct heating, or contact heating.
- anode electrode horizontal anode electrode
- a curvature anode electrode but not a split electrode
- the equipment was used to simulate the conditions of supplying an electrolyte solution between the mother plate and the anode electrode.
- the current density distribution in the width direction of the mother plate was measured and shown in FIG. 9.
- the position is the position in the width direction of the base plate with respect to the electrolyte supply pipe, and shows the result for the half width of the base plate.
- the current density at the edge 500mm point tends to decrease by 35% compared to the current density of the horizontal anode electrode, and it can be seen that the interval showing the uniform distribution is increased.
- FIGS. 11 and 12 Streamlines of the electrolyte flow field according to the simulation are shown in FIGS. 11 and 12, respectively.
- the electrolyte solution is 0.15 m when the electrolyte supply pipe having the structure of FIG. After the flow, the flow field was stabilized, whereas in the case of using the bent electrolyte supply nozzle as shown in FIG. 10 (b), the flow field was stabilized after about 0.05 m as shown in FIG. 12 (b). In the case of using the curved electrolyte supply nozzle as shown in (c), it can be seen that the flow field is stabilized while the electrolyte flows about 0.05 m as shown in FIG. 12 (c).
- the use of a spray nozzle having a curvature according to the embodiment of the present invention can quickly stabilize the flow field as compared with the case of having a vertical electrolyte supply pipe structure. It can be seen that, furthermore, it can be expected that the area for obtaining uniform electrodeposition also increases.
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
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Abstract
Description
Claims (24)
- 캐소드 전극으로 제공되는 가요성이고 전도성인 모판을 일 방향으로 연속적으로 수평 공급하는 모판 공급수단;상기 모판의 폭 방향 에지부와 접촉하여 모판을 이송시키면서 모판에 전류를 공급하는 컨덕트롤, 상기 모판의 일면 또는 양면에 이격되어 설치된 애노드 전극, 상기 모판과 상기 애노드 전극이 형성하는 수평 통로로 금속이온을 포함하는 전해액을 공급하는 전해액 공급 장치, 및 상기 모판의 일면 또는 양면에 금속이온의 전해 석출을 위해 상기 컨덕트 롤 및 상기 애노드 전극에 전류를 공급하는 전류공급장치를 포함하는 수평 셀; 및상기 모판의 일면 또는 양면에 전착된 금속박을 상기 전도성 모판으로부터 분리하는 박리수단을 포함하는 수평 전주장치.
- 제1 항에 있어서, 상기 전해액 공급장치는 상기 모판의 일면 또는 양면에 전해액을 공급하는 전해액 공급 노즐을 포함하되, 상기 전해액 공급 노즐은 모판의 진행방향과 동일한 방향, 반대방향 또는 양 방향으로 전해액을 공급하는 수평 전주장치.
- 제1 항에 있어서, 상기 수평 셀은 모판 진행방향을 따라 직렬로 복수 개 설치된 수평 전주장치.
- 제1 항에 있어서, 상기 모판 상에 전착된 금속박을 유도 가열, 분위기 가열 또는 직접 가열에 의해 열처리하는 열처리 수단을 더 포함하는 수평 전주장치.
- 제1 항에 있어서, 상기 박리수단은 전도성 모판과 금속박의 전단응력 차를 부여하는 다수의 롤러인 수평 전주장치.
- 제1 항에 있어서, 상기 애노드 전극은 상기 모판의 폭 방향에 대하여 중심부에서 가장자리를 향해 두께가 감소하는 구조를 갖는 것인 수평 전주장치.
- 제1 항에 있어서, 상기 수평 셀은 모판의 폭 방향 가장자리에 금속 이온의 전해석출을 방지하기 위한 에지 마스크가 설치되어 있는 수평 전주장치.
- 제1 항에 있어서, 상기 애노드 전극은 모판의 폭 방향으로 복수로 분할된 분할전극인 수평 전주장치.
- 제8 항에 있어서, 상기 분할전극은 각 전극별로 전극의 크기가 상이한 것인 수평 전주장치.
- 제9 항에 있어서, 상기 분할전극은 각 전극별로 상이한 크기의 전류가 공급되는 것인 수평 전주장치.
- 제1 항에 있어서, 상기 애노드 전극은 모판의 진행 방향으로 복수로 분할된 분할전극인 것을 특징으로 하는 수평 전주장치.
- 제11 항에 있어서, 상기 분할전극은 각 전극별로 전극의 크기가 상이한 것인 수평 전주장치.
- 제 12항에 있어서, 상기 분할전극은 각 전극별로 상이한 크기의 전류가 공급되는 것인 수평 전주장치.
- 제3 항에 있어서, 상기 전해액 공급 노즐은 전해액이 유동하는 방향으로 전해액을 공급하도록 경사지거나 굴곡되어 있는 수평 전주장치.
- 제14 항에 있어서, 상기 전해액 공급관은 전도성 모판의 이동방향에 대하여 순방향 및 역방향으로 전해액을 공급하도록 적어도 말단부가 분리되어 있는 것인 수평 전주장치.
- 제 14항에 있어서, 상기 말단부는 드라발(de Laval) 노즐 형상의 단면을 갖는 것인 수평 전주장치.
- 캐소드 전극으로 제공되며, 일 방향으로 수평 공급되는 가요성이고 전도성인 모판의 표면에 금속이온을 포함하는 전해액을 공급하는 전해액 공급 단계;상기 모판의 일면 또는 양면에 이격되어 설치된 애노드 전극과 상기 모판의 작용에 의해 상기 전해액의 금속 이온이 상기 모판의 일면 또는 양면에 전해 석출되어 상기 모판 상에 전착층이 형성되는 전착단계; 및상기 전착층을 상기 모판으로부터 박리하는 박리단계를 포함하는 금속박 제조방법.
- 제17 항에 있어서, 상기 모판은 일면 또는 양면에 산화 피막이 형성되어 있는 금속박 제조방법.
- 제17 항에 있어서, 상기 박리된 금속박을 300~600℃에서 열처리하는 단계를 더 포함하는 금속박 제조방법.
- 제17 항에 있어서, 상기 전해액은 모판과 애노드 전극에 의해 형성되는 수평 통로를 통하여 모판의 이동방향과 동일한 방향 및 반대방향으로 공급되는 금속박 제조방법.
- 제17 항에 있어서, 상기 모판의 양면에 공급되는 전해액은 서로 상이한 것인 금속박 제조방법.
- 제17 항에 있어서, 상기 박리단계 전에 제2 전해액 공급단계 및 제2 전착단계를 더 포함하는 금속박 제조방법.
- 제22 항에 있어서, 상기 제2 전해액 공급단계에서 공급되는 전해액은 전해액 공급단계의 전해액과 상이한 것인 금속박 제조방법.
- 제 23항에 있어서, 상기 금속박은 다층 구조의 금속박인 금속박 제조방법.
Priority Applications (4)
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JP2014542239A JP5789723B2 (ja) | 2011-11-15 | 2012-11-15 | 高速金属箔製造用水平電鋳装置及び製造方法 |
US14/357,810 US20140360882A1 (en) | 2011-11-15 | 2012-11-15 | High speed horizontal electroforming apparatus for manufacturing metal foil and method for manufacturing metal foil |
EP12850267.1A EP2781625A4 (en) | 2011-11-15 | 2012-11-15 | HORIZONTAL HIGH-SPEED ELECTRIC FORMING DEVICE FOR PRODUCING A METAL FOIL AND METHOD FOR PRODUCING THE METAL FOIL |
CN201280056248.9A CN103930599A (zh) | 2011-11-15 | 2012-11-15 | 用于制造金属箔的高速水平电铸设备及制造方法 |
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KR1020110118667A KR101325337B1 (ko) | 2011-11-15 | 2011-11-15 | 수평 전주장치 |
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KR1020110118665A KR101325366B1 (ko) | 2011-11-15 | 2011-11-15 | 수평 전주장치 |
KR1020110118664A KR101325359B1 (ko) | 2011-11-15 | 2011-11-15 | 고속 금속박 제조방법 및 장치 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220152693A1 (en) * | 2019-08-30 | 2022-05-19 | Applied Materials, Inc. | Deposition of reactive metals with protection layer for high volume manufacturing |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107208293B (zh) | 2015-09-05 | 2019-03-01 | 株式会社Uacj | 电解铝箔的制造方法 |
JP6694578B2 (ja) * | 2015-12-21 | 2020-05-20 | 日立金属株式会社 | アルミニウム箔の製造方法およびアルミニウム箔製造用陰極ドラム |
IL266910B (en) * | 2019-05-27 | 2020-11-30 | Addionics Il Ltd | 3D structures are produced electrochemically for electrodes in batteries |
CN114657608B (zh) * | 2022-04-14 | 2023-06-30 | 江西铜博科技股份有限公司 | 一种轻型电极铜箔生产装置 |
CN114835206B (zh) * | 2022-05-12 | 2023-08-25 | 中国科学院生态环境研究中心 | 一种用于缓解电絮凝中极板钝化的极板排布方法及应用 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4948434A (en) | 1988-04-01 | 1990-08-14 | Nkk Corporation | Method for manufacturing Ni-Fe alloy sheet having excellent DC magnetic property and excellent AC magnetic property |
JPH0673595A (ja) * | 1992-08-26 | 1994-03-15 | Nkk Corp | 連続電気めっき装置 |
KR19990064747A (ko) | 1999-05-06 | 1999-08-05 | 이종구 | Ni-Fe 합금 박판 제조방법 및 그 장치 |
JP2000109993A (ja) * | 1998-08-03 | 2000-04-18 | Sumitomo Special Metals Co Ltd | 金属箔、金属箔片の製造装置および製造方法 |
KR100428576B1 (ko) * | 1999-12-24 | 2004-04-28 | 주식회사 포스코 | 스트립의 도금편차를 해소하는 불용성 아노드 |
KR20040099972A (ko) | 2003-05-21 | 2004-12-02 | 김종권 | 전주 도금을 이용한 금속 박판 제조 장치 |
KR20100049357A (ko) * | 2008-11-03 | 2010-05-12 | 주식회사 포스코 | 수평셀의 도금용액의 유량을 증가시키는 이물질 여과용 스트레이너 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1760028A (en) * | 1924-12-01 | 1930-05-27 | Gen Motors Res Corp | Process of producing metal sheets by electrodeposition |
US2369748A (en) * | 1942-03-30 | 1945-02-20 | John S Nachtman | Method of brightening electroplated coatings |
US2865795A (en) * | 1951-10-30 | 1958-12-23 | Gen Electric | Insulated electrical conductor and method of making the same |
US3468783A (en) * | 1965-03-08 | 1969-09-23 | Republic Steel Corp | Electroplating apparatus |
US3855083A (en) * | 1973-06-13 | 1974-12-17 | United States Steel Corp | Method for the uniform electroplating of sheet and strip |
FR2390517A1 (fr) * | 1977-05-10 | 1978-12-08 | Coppertron Sa | Installation pour l'electro-production de cuivre en feuilles destinees a etre appliquees en particulier sur des materiaux dielectriques |
AU540287B2 (en) * | 1982-02-10 | 1984-11-08 | Nippon Steel Corporation | Continuous electrolytic treatment of metal strip using horizontal electrodes |
DE3432821A1 (de) * | 1983-09-07 | 1985-03-21 | Mitsubishi Jukogyo K.K., Tokio/Tokyo | Verfahren und vorrichtung zur kontinuierlichen galvanischen legierungsabscheidung |
JPS6417890A (en) * | 1987-07-13 | 1989-01-20 | Kawasaki Steel Co | Method for controlling electroplating amount |
JPH01222084A (ja) * | 1988-02-29 | 1989-09-05 | Nisshin Steel Co Ltd | 金属箔の連続的製造方法 |
JPH0660433B2 (ja) * | 1989-03-02 | 1994-08-10 | 日本鋼管株式会社 | 亜鉛系合金電気めつき鋼板の製造方法 |
JPH0318168U (ko) * | 1989-06-29 | 1991-02-22 | ||
DE4430652C2 (de) * | 1994-08-29 | 1997-01-30 | Metallglanz Gmbh | Galvanisches Verfahren und Vorrichtung zur Durchführung des Verfahrens sowie dessen Verwendung zum galvanischen oder chemischen Behandeln, insbesondere zum kontinuierlichen Aufbringen metallischer Schichten auf einen Körper |
JPH08236120A (ja) * | 1995-03-01 | 1996-09-13 | Furukawa Electric Co Ltd:The | 多孔質電解金属箔の製造方法、その電解金属箔を用いた二次電池用電極 |
JPH09272994A (ja) * | 1996-04-05 | 1997-10-21 | Furukawa Electric Co Ltd:The | ファインパターン用電解銅箔 |
CN1189544A (zh) * | 1997-01-30 | 1998-08-05 | 天津市有色金属研究所 | 在导电性多孔网带上进行连续电沉积的方法和设备 |
JP2001316887A (ja) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | メッキ処理装置 |
WO2002047139A2 (en) * | 2000-12-04 | 2002-06-13 | Ebara Corporation | Methode of forming a copper film on a substrate |
JP2003247100A (ja) * | 2002-02-25 | 2003-09-05 | Kobe Steel Ltd | 帯状金属板の連続電気めっき方法 |
JP3753114B2 (ja) * | 2002-08-26 | 2006-03-08 | Jfeスチール株式会社 | 電気めっき用電極及びそれを用いた金属帯の電気めっき方法 |
JP2004277834A (ja) * | 2003-03-17 | 2004-10-07 | Sumitomo Metal Mining Co Ltd | Au・Sn合金箔の製造方法 |
JP3935858B2 (ja) * | 2003-04-18 | 2007-06-27 | 新日本製鐵株式会社 | 連続式電気めっき設備のエッジマスク装置 |
JP4805300B2 (ja) * | 2008-03-31 | 2011-11-02 | 古河電気工業株式会社 | 回路基板積層用キャリア付きFe−Ni合金箔の製造方法、回路基板積層用キャリア付き複合箔の製造方法、キャリア付き合金箔、キャリア付き複合箔、金属張板、プリント配線板及びプリント配線積層板 |
JP2011127172A (ja) * | 2009-12-17 | 2011-06-30 | Nitto Denko Corp | めっき装置および配線回路基板の製造方法 |
JP2011225923A (ja) * | 2010-04-16 | 2011-11-10 | Nippon Steel Engineering Co Ltd | 水平型流体支持めっき装置 |
CN202007276U (zh) * | 2011-03-18 | 2011-10-12 | 湖北中一科技有限公司 | 一种生箔机 |
-
2012
- 2012-11-15 CN CN201280056248.9A patent/CN103930599A/zh active Pending
- 2012-11-15 WO PCT/KR2012/009684 patent/WO2013073872A1/ko active Application Filing
- 2012-11-15 US US14/357,810 patent/US20140360882A1/en not_active Abandoned
- 2012-11-15 JP JP2014542239A patent/JP5789723B2/ja not_active Expired - Fee Related
- 2012-11-15 EP EP12850267.1A patent/EP2781625A4/en not_active Withdrawn
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4948434A (en) | 1988-04-01 | 1990-08-14 | Nkk Corporation | Method for manufacturing Ni-Fe alloy sheet having excellent DC magnetic property and excellent AC magnetic property |
JPH0673595A (ja) * | 1992-08-26 | 1994-03-15 | Nkk Corp | 連続電気めっき装置 |
JP2000109993A (ja) * | 1998-08-03 | 2000-04-18 | Sumitomo Special Metals Co Ltd | 金属箔、金属箔片の製造装置および製造方法 |
KR19990064747A (ko) | 1999-05-06 | 1999-08-05 | 이종구 | Ni-Fe 합금 박판 제조방법 및 그 장치 |
KR100428576B1 (ko) * | 1999-12-24 | 2004-04-28 | 주식회사 포스코 | 스트립의 도금편차를 해소하는 불용성 아노드 |
KR20040099972A (ko) | 2003-05-21 | 2004-12-02 | 김종권 | 전주 도금을 이용한 금속 박판 제조 장치 |
KR20100049357A (ko) * | 2008-11-03 | 2010-05-12 | 주식회사 포스코 | 수평셀의 도금용액의 유량을 증가시키는 이물질 여과용 스트레이너 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2781625A4 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220152693A1 (en) * | 2019-08-30 | 2022-05-19 | Applied Materials, Inc. | Deposition of reactive metals with protection layer for high volume manufacturing |
US11833580B2 (en) * | 2019-08-30 | 2023-12-05 | Applied Materials, Inc. | Deposition of reactive metals with protection layer for high volume manufacturing |
Also Published As
Publication number | Publication date |
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EP2781625A1 (en) | 2014-09-24 |
CN103930599A (zh) | 2014-07-16 |
EP2781625A4 (en) | 2015-09-02 |
JP2015503027A (ja) | 2015-01-29 |
JP5789723B2 (ja) | 2015-10-07 |
US20140360882A1 (en) | 2014-12-11 |
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