WO2013067909A1 - 触控面板、触控电极结构及其制作方法 - Google Patents

触控面板、触控电极结构及其制作方法 Download PDF

Info

Publication number
WO2013067909A1
WO2013067909A1 PCT/CN2012/084125 CN2012084125W WO2013067909A1 WO 2013067909 A1 WO2013067909 A1 WO 2013067909A1 CN 2012084125 W CN2012084125 W CN 2012084125W WO 2013067909 A1 WO2013067909 A1 WO 2013067909A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive layer
axial sensing
sensing lines
electrode structure
touch electrode
Prior art date
Application number
PCT/CN2012/084125
Other languages
English (en)
French (fr)
Inventor
江耀诚
Original Assignee
宸鸿科技(厦门)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宸鸿科技(厦门)有限公司 filed Critical 宸鸿科技(厦门)有限公司
Publication of WO2013067909A1 publication Critical patent/WO2013067909A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K17/962—Capacitive touch switches
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making

Definitions

  • the present invention relates to a touch technology, and more particularly to a touch electrode structure, a method for fabricating the same, and a touch panel for use thereof.
  • touch panels The application of touch panels has become more and more extensive. The most representative ones are smart phones and tablet computers. Most smart phones and tablet computers are equipped with touch panels, which can be easily operated by users and provided with keyboards. Different operational feelings.
  • the technology of the touch panel is mainly divided into a resistive touch panel, a capacitive touch panel, an acoustic wave touch panel, an optical touch panel and an electromagnetic touch panel.
  • the touch panel has a single-axis induction line or a biaxial induction line, wherein the single-axis induction line can be designed as a single axis to have X, Y.
  • Axis sensing positioning function while biaxial sensing lines have a plurality of X-axis sensing lines (X-Trace) and Y-axis sensing lines (Y-Trace), X and Y
  • X-Trace X-axis sensing lines
  • Y-Trace Y-axis sensing lines
  • the intersection of the axis sensing lines forms a matrix of sensing points.
  • the axial sensing lines can be made of a conductive film, and a flexible circuit is then respectively bonded to the output terminals of the axial sensing lines to transmit signals for each of the sensing lines.
  • the process removes the unnecessary portions on the conductive film according to the desired pattern, so that the formed two axial sensing lines and the two output terminals can be isolated from each other, thereby realizing the structure of the touch sensing.
  • the steps of the lithography process are cumbersome, such as exposure, development, etching, cleaning, etc., so it takes a long time to produce on the lithography process.
  • An object of the present invention is to provide a touch panel, a touch electrode structure, and a method of fabricating the same, which utilizes a simplified manufacturing process in a laser etching process to form an improved touch electrode structure, thereby reducing overall production time.
  • the embodiment of the invention provides a touch electrode structure, the touch electrode structure includes a plurality of first axial sensing lines and at least one first laser etching line.
  • the plurality of first axial sensing lines are formed by laser etching a first conductive layer, and each of the first axial sensing lines includes at least a first output end point, and the first laser An etch line is formed around the corresponding first output end point to form electrical insulation between the first output terminals.
  • each of the first axial sensing lines and the first laser etched lines have a wavelength between 200 nm and 300 nm. Laser light within the range is etched onto the first conductive layer.
  • the touch electrode structure may further include a plurality of second axial sensing lines and at least one second laser etching line, wherein each of the second axial sensing lines includes at least a second output end point, and the second lightning An etched etch line is formed around the corresponding second output end point.
  • each of the second axial sensing lines and the second laser etched line are at a wavelength Laser light in the range of 200 nm to 300 nm is formed by etching on the second conductive layer.
  • the first conductive layer and the second conductive layer are respectively located on different sides of the substrate.
  • each first The axial sensing line may include a plurality of first conductive units and a plurality of first bridge wires, the plurality of first conductive units are spaced apart from each other in a first axial direction, and the plurality of first bridge wires are respectively electrically Connecting the first axially adjacent two first conductive units.
  • each of the second axial sensing lines may also include a plurality of second conductive units and a plurality of second bridge wires.
  • the area between the adjacent first axial sensing lines and the adjacent first conductive unit may respectively define a configuration area, and the plurality of second conductive units are respectively disposed in the configuration area. And the plurality of second bridging wires are electrically connected to the second axially adjacent two second conductive units respectively across the first bridging wires.
  • Embodiments of the present invention provide a method for fabricating a touch electrode structure, including the steps of: laser etching a first conductive layer to form a plurality of first axial sensing lines, wherein each of the first axial sensing lines includes at least A first output endpoint.
  • the first conductive layer is laser etched to form at least one first laser etch line around the corresponding first output end point to form electrical insulation between the first output terminals.
  • the embodiment of the invention provides a touch panel, which comprises a substrate, a plurality of axial sensing lines and at least one laser etching line.
  • the plurality of axial sensing lines are formed by laser etching on a conductive layer on the same side of the substrate or a conductive layer on a different side, and each of the axial sensing lines includes at least one output end point, and Laser etch lines are formed around the corresponding output terminals to provide electrical isolation between the output terminals.
  • the touch panel and the touch electrode structure and the manufacturing method thereof are provided by a laser etching process, thereby improving production efficiency and reducing production cost.
  • the present invention produces a plurality of laser etch lines in close proximity to each other between each of the output terminals, thereby ensuring that no short circuits occur between each of the output terminals, and reducing the cost of removing a large area of the conductive layer by laser. time.
  • the embodiments of the present invention propose that the wavelength of the laser etch can generate appropriate laser energy, which can avoid the etch marks caused by the laser etching to damage the surface of the substrate.
  • FIG. 1 is a cross-sectional view of a double-sided conductive layer touch panel in accordance with an exemplary embodiment of the present invention.
  • FIG. 2A is a top plan view of a first conductive layer in accordance with an exemplary embodiment of the present invention.
  • Fig. 2B is a partial enlarged view of the A area of Fig. 2A.
  • 3A is a top plan view of a second conductive layer in accordance with an exemplary embodiment of the present invention.
  • Fig. 3B is a partial enlarged view of the B area of Fig. 3A.
  • FIG. 4 is a flow chart of a method of fabricating a touch electrode structure according to an exemplary embodiment of the invention.
  • FIG. 5A is a perspective view of a double-sided conductive layer touch panel according to still another embodiment of the present invention.
  • FIG. 5B is another perspective view of a double-sided conductive layer touch panel according to still another embodiment of the present invention.
  • 6A is a cross-sectional view of a single-layer conductive layer touch panel in accordance with an exemplary embodiment of the present invention.
  • 6B is a top plan view of a single-layer conductive layer touch panel in accordance with an exemplary embodiment of the present invention.
  • 6C is a perspective view of a single-layer conductive layer touch panel according to an exemplary embodiment of the invention.
  • the touch panel 1 includes a substrate 10 and a first conductive layer 12 , a second conductive layer 16 and a protective layer 18 .
  • the substrate 10 is made of a material having high light transmittance, and may be a flat or non-planar sheet.
  • the substrate 10 It may be formed of glass, plastic, mixed glass/plastic material or the like to become a glass thin plate or a flexible thin plate, which may be selected from the group consisting of polycarbonate (PC), polyester (PET), and polymethacrylic acid. Methyl ester (PMMA) or a material consisting of a cyclic olefin copolymer (COC).
  • the first conductive layer 12 is formed on the first surface 10a of the substrate 10, and the second conductive layer is formed on the second surface of the substrate 10. 10b, so that the first conductive layer 12 and the second conductive layer 16 are insulated from each other by the substrate 10.
  • the first conductive layer 12 and the second conductive layer 16 After the etching process, a patterned structure is formed to form a touch electrode structure of the touch panel 1 of the embodiment.
  • the patterned structure formed on the first conductive layer 12 includes M first axial sensing lines 12a and M first output terminals corresponding to the first axial sensing lines 12a. 124 , where M is a positive integer greater than one. More specifically, the etching process etches the first conductive layer 12 according to the desired electrode pattern to plan a first outer contour S1 of the patterned structure as a whole. And then remove portions of redundant block 126 to form the desired pattern.
  • the first conductive layer 12 can be, for example, indium tin oxide (ITO) or antimony tin oxide (ATO). The material is designed with a transparent conductive layer.
  • This embodiment is to form a patterned structure, for example, by a laser etching process, and the laser etching process should be selected from a wavelength of 200 nm to 300 nm. Laser light in the range.
  • the laser etching process etches the first conductive layer 12 with laser light having a wavelength of 266 nm, and the laser light is etched to a depth such that the first conductive layer 12 Completely cut off to prevent laser light from damaging the substrate 10 or other layers.
  • the M first axial sensing lines 12a in the patterned structure of the embodiment are arranged in parallel with each other, and each of the first axial sensing lines
  • the 12a may be in the shape of a straight strip or may be composed of a plurality of first conductive units 120 connected to each other.
  • the first conductive unit 120 has a square or diamond shape, and the first axially adjacent first conductive unit 120
  • the first bridge wires 122 can be electrically connected to each other such that each of the first axial sensing wires 12a It is a chain shape in which a plurality of squares or diamonds are connected.
  • a first output terminal 124 may be formed.
  • the present invention is not limited thereto, and the ends of each of the first axial sensing lines 12a may of course correspond to the first output end point 124, respectively.
  • the present embodiment further etches the first conductive layer on the outside of the first outer profile S1 by a laser etching process.
  • a laser etch line 20 This ensures that a laser etch line 20 is placed around each of the first output terminals 124 to avoid short circuits.
  • the present invention does not limit the laser etching line
  • the number of 20s and the spacing between the laser etch lines 20 will be apparent to those of ordinary skill in the art, as more laser etch lines 20 (i.e., the number of layers formed by the laser etch lines 20) The more the respective first output terminals 124 are effectively isolated and insulated from each other.
  • each of the laser etched lines 20 has a width of less than 150 ⁇ m, and the outer side of the first outer contour S1 has at least 7 adjacent laser etch lines 20 .
  • FIG. 3A is a top view of the second conductive layer and B of FIG. 3A according to an exemplary embodiment of the present invention.
  • the patterned structure formed by the laser etching process on the second conductive layer 16 includes P second axial sensing lines 16a.
  • the second conductive layer 16 may be, for example, indium tin oxide (ITO). Or a transparent conductive layer designed from the material of bismuth tin oxide (ATO).
  • the laser etching process should be selected from wavelengths between 200 nm and 300 nm. Laser light in the range.
  • the laser etching process is etched with a laser beam having a wavelength of 266 nm to cut the second conductive layer 16 completely, and the laser light is prevented from damaging the substrate. Or the first conductive layer 12 .
  • each P second axial sensing line 16a in the patterned structure of the second conductive layer 16 are arranged in parallel with each other, and each P The strip second axial sensing line 16a may be in the shape of a straight strip or may be composed of a plurality of second conductive units 160 connected to each other, the second conductive unit 160
  • the shape of the square or diamond shape, and the second axially adjacent second conductive units 160 may be electrically connected to each other by the second bridge wires 162 such that each of the second axial sensing lines 16a It is a chain shape in which a plurality of squares or diamonds are connected.
  • a second outer contour S2 of the patterned structure of the second conductive layer 16 On the outside, the embodiment further etches at least one laser etch line 22 by a laser etching process. Thereby ensuring that each of the second output terminals 164 is surrounded by a laser etch line 22 And avoid short circuit conditions.
  • the patterned structure of the first conductive layer 12 and the second conductive layer 16 is substantially the same, but the first axial sensing line 12a
  • the direction of extension of the second axial sensing line 16a is not the same.
  • the extending directions of the first axial sensing line 12a and the second axial sensing line 16a should be perpendicular to each other, that is, the first axial sensing line 12a can extend in the X-axis direction, and the second axial sensing line 16a can extend in the Y-axis direction.
  • first axial sensing line 12a and the second axial sensing line 16a may correspond to the redundant block 166 of the second conductive layer 16 in the case of a chain-shaped design formed by a square or diamond connection.
  • the second conductive unit 160 in the second axial sensing line 16a may correspond to the redundant block 126 of the first conductive layer 12.
  • M first output terminals 124 and the P second output terminals 164 are convex are also different, for example, M first output terminals 124 may be disposed at one end of the first axial sensing line 12a along the X-axis direction, and the P second output terminals 164 may be along Y The axial direction is provided at one end of the second axial sensing line 16a.
  • the protective layer 18 is further disposed on the first conductive layer 12 and used as the touch panel 1
  • the surface touched by the user is accepted to protect the film layer disposed below.
  • the material of the protective layer 18 may be selected from the group consisting of glass, acrylic, sapphire, and may be treated by strengthening, anti-glare, antibacterial, and the like.
  • FIG. 4 is a flow chart showing a method of fabricating a touch electrode structure according to an exemplary embodiment of the invention.
  • step S30 first The ITO is coated on the first surface 10a and the second surface 10b of the substrate 10 such that the first conductive layer 12 is formed on the first surface 10a and the second surface 10b of the substrate 10, respectively. And a second conductive layer 16 .
  • step S32 the first conductive layer 12 is laser etched according to the desired electrode pattern for planning a first outer contour S1 of the patterned structure on the first conductive layer 12. And further removing portions of the redundant block 126 to form a plurality of first axial sensing lines 12a. At least one end of each of the first axial sensing lines 12a includes a first output terminal 124.
  • the first conductive layer 12 is laser etched to form at least one laser etch line 20 at each of the first output terminals. 124 around.
  • a plurality of laser etch lines 20 in close proximity to each other may be formed, and the laser etch lines 20 are formed at each of the first output terminals 124.
  • it may be further extended outside the first outer contour S1 of the entire patterned structure.
  • the second conductive layer is laser etched according to the desired electrode pattern. 16 for planning a second outer contour S2 of the patterned structure on the second conductive layer 16, and further removing portions of the redundant block 166 to form a plurality of second axial sensing lines 16a . At least one end of each of the second axial sensing lines 16a includes a second output terminal 164. Further in step S38, the second conductive layer 16 is laser etched to form at least one laser etched line. 22 around each of the second output terminals 164.
  • a plurality of laser etch lines 22 that are in close proximity to each other may be formed, and the laser etched lines 22 In addition to being formed around each of the second output terminals 164, it may be further extended outside of the second outer contour S2 of the entire patterned structure.
  • the first axial sensing line 12a and the second axial sensing line 16a in the touch electrode structure It is used to transmit drive signals and sense signals, respectively, to achieve touch sensing.
  • a control unit of the touch panel electrically connects the first axial sensing line 12a and the second axial sensing line 16a through a flexible circuit. For providing a driving signal and receiving a sensing signal.
  • FIG. 3 is a perspective view and another perspective view showing a double-sided conductive layer touch panel according to still another embodiment of the present invention.
  • the touch panel 6 includes a flex circuit 60 and a flex circuit 62.
  • Flexible circuit 60 Correspondingly, the flexible circuit 62 can be electrically connected to the second output terminal 164 in the second axial direction.
  • the adjacent output terminals can be effectively isolated and insulated from each other, so the flexible circuit 60 is attached to the first a conductive layer 12 (or the flexible circuit 62 is attached to the second conductive layer 16), the majority of the pins on the flexible circuit 60 can more accurately correspond to the plurality of first output terminals 124 (or flexible circuits, respectively) Most of the pins on 62 can more accurately correspond to the plurality of second output terminals respectively 164) .
  • the touch panel of the present invention is more visible to the wiring needs, and further passes the output end point through the extended metal trace. It is electrically connected to the flexible circuit.
  • FIG. 6A, FIG. 6B and FIG. 6C are cross-sectional views, a top view, and a perspective view of a touch panel of a single-layer conductive layer according to an exemplary embodiment of the present invention. As shown, this embodiment demonstrates a single layer conductive layer structure.
  • the touch panel 7 includes a substrate 70 And a conductive layer 72 and an insulating layer 74 formed on the first surface 70a of the substrate 70.
  • the conductive layer 72 on the first surface 10a of the substrate 70 After the laser etching process, a plurality of first conductive units 720a, a plurality of first bridge wires 722a, a plurality of first output terminals 724a, and a plurality of second conductive units 720b may be formed. And a plurality of second output endpoints 724b. And, the plurality of first output endpoints 724a and the plurality of second output endpoints 724b The laser laser is further etched with a plurality of laser etch lines 80 in close proximity to each other such that the first output terminal 724a and the second output terminal 724b are insulated from each other.
  • the plurality of first conductive units 720a, the plurality of first bridge wires 722a, and the plurality of first output terminals The 724a can form a plurality of first axial sensing lines 72a.
  • the plurality of first axial sensing lines 72a are formed in a straight strip shape and arranged in parallel with each other, and the first conductive unit 720a therein It is a square or diamond shape.
  • Each of the first axially adjacent first conductive units 720a is further connected to each other through the first bridge wire 722a such that each of the first axial sensing lines 72a It is a chain shape in which a plurality of squares or diamonds are connected.
  • the end of each of the first axial sensing lines 72a is connected to a first output terminal 724a.
  • the plurality of second conductive units 720b and the plurality of second output terminals 724b can also pass through the plurality of second bridge wires
  • the connection of 722b forms a plurality of second axial sensing lines 72b.
  • the material of the second bridging wire 722b can be designed to use metal, ITO, ATO Equivalent conductive material.
  • the insulating layer 74 is partially disposed over the first bridging conductor 722a, and the second bridging conductor 722b is further laminated over the insulating layer 74 such that the insulating layer 74
  • the first bridge wire 722a and the second bridge wire 722b may be separated to insulate the first axial sensing line 72a from the second axial sensing line 72b.
  • the 722b bridges the second axially adjacent second conductive units 720b such that each of the second axial sensing lines 72b can be formed into a chain shape in which a plurality of square or diamond shapes are connected.
  • the adjacent first axial sensing lines 72a can be defined as a configuration area, respectively.
  • the plurality of second conductive units 720b are respectively disposed in the arrangement area, and further by the insulating layer 74.
  • the second bridge wire 722b is electrically connected to the second axially adjacent two second conductive units 720b across the first bridge wire 722a, thereby forming a second axial sensing line 72b in series.
  • the touch electrode structure and the manufacturing method thereof provided by the embodiments of the present invention are completely completed by a laser etching process, and the step of using a laser etching process is relatively simple compared to the yellow light etching.
  • the production time is shortened, and it is more suitable for the production of large-sized touch panels.
  • the laser etching process has no problem of material loss, and the equipment is also relatively simple, so the overall production cost is relatively low.
  • the laser etched lines of the present invention which are formed by laser etching at a plurality of strips adjacent to each output end point, in addition to the time required for further large-area laser etching, can simultaneously ensure each There is no short circuit between the output terminals.
  • the embodiments of the present invention propose that the wavelength of the laser etch can generate appropriate laser energy, which can avoid the etch marks caused by the laser etch to damage the surface of the substrate or other layers.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Position Input By Displaying (AREA)
  • Manufacture Of Switches (AREA)

Abstract

本发明提出一种触控面板、触控电极结构及其制作方法，所述触控电极结构包括复数条第一轴向感应线以及至少一条第一雷射蚀刻线。其中，所述复数条第一轴向感应线是在一第一导电层上透过雷射蚀刻所形成，并且每一条第一轴向感应线至少包含一第一输出端点，而所述第一雷射蚀刻线在该第一导电层上经雷射蚀刻形成于相对应的第一输出端点周围。藉此，本发明利用雷射蚀刻制程中简化的制造步骤形成改良的触控电极结构，以降低整体的生产时间。

Description

触控面板、触控电极结构及其制作方法 技术领域
本发明有关于一种触控技术，特别是有关于一种触控电极结构及其制作方法与其应用的触控面板。
背景技术
触控面板的应用已经愈来愈广泛，其中最具代表性的就是智能型手机以及平板计算机，大部分的智能型手机以及平板计算机都配备有触控面板，可以方便用户操作以及提供与键盘截然不同的操作感受。触控面板的技术主要分为电阻式触控面板、电容式触控面板、音波式触控面板、光学式触控面板与电磁式触控面板。
一般触控面板具有单轴向感应线或双轴向感应线，其中单轴向感应线可设计成单一轴向即可具备 X 、 Y 轴感应定位功能，而双轴向感应线则具有交错设置的多数条 X 轴感应线 (X-Trace) 与 Y 轴感应线 (Y-Trace) ，其 X 、 Y 轴感应线的交叉点会形成矩阵式的感测点。一般来说，轴向感应线可由导电薄膜制成，进而再将一挠性电路分别接合在所述轴向感应线的输出端点以传递每条感应线的信号。制程上是例如利用微影蚀刻 (Photolithography) 制程在导电薄膜上根据所需的图形来去除不要的部分，让所形成的两两轴向感应线之间及两两输出端点之间能彼此隔离，藉以实现触控感测的架构。
然而，微影蚀刻制程的步骤繁琐，如需进行曝光、显影、蚀刻、清洗等步骤，故会耗费很长的生产时间在微影蚀刻制程上。
发明内容
本发明的一目的在于提供一种触控面板、触控电极结构及其制作方法，其是利用雷射蚀刻制程中简化的制造步骤形成改良的触控电极结构，藉此降低整体的生产时间。
本发明实施例提供一种触控电极结构，所述触控电极结构包括复数条第一轴向感应线以及至少一条第一雷射蚀刻线。其中，所述复数条第一轴向感应线是透过雷射蚀刻一第一导电层所形成，并且每一条第一轴向感应线至少包含有第一输出端点，而所述第一雷射蚀刻线形成于相对应的第一输出端点周围，使所述第一输出端点之间形成电性绝缘。
在本发明一示范实施例中，每一条第一轴向感应线与第一雷射蚀刻线由波长在 200nm 至 300nm 范围内的雷射光线蚀刻于第一导电层上所形成。此外，触控电极结构更可包括复数条第二轴向感应线与至少一条第二雷射蚀刻线，其中每一条第二轴向感应线至少包含一第二输出端点，而所述第二雷射蚀刻线形成于相对应的第二输出端点周围。并且每一条第二轴向感应线与第二雷射蚀刻线由波长在 200nm 至 300nm 范围内的雷射光线蚀刻于第二导电层上所形成。其中所述的第一导电层及第二导电层分别位于基板的不同侧。
另外，在本发明的另一实施例中，当第一轴向感应线与第二轴向感应线是在基板的一侧的同一导电层上透过雷射蚀刻所形成时，每一条第一轴向感应线可包含复数个第一导电单元以及复数个第一桥接导线，所述复数个第一导电单元于第一轴向上彼此间隔设置，而所述复数个第一桥接导线分别电性连接第一轴向上相邻的两个第一导电单元。同样地，每一条第二轴向感应线也可包含复数个第二导电单元以及复数个第二桥接导线。其中，相邻的第一轴向感应线之间与相邻的第一导电单元之间的区域可分别定义出一配置区，而所述复数个第二导电单元分别设置于所述配置区中，且所述复数个第二桥接导线跨越所述第一桥接导线来分别电性连接第二轴向上相邻的两个第二导电单元。
本发明实施例提供一种触控电极结构的制作方法，包括下列步骤：雷射蚀刻一第一导电层，以形成复数条第一轴向感应线，其中每一条第一轴向感应线至少包含一第一输出端点。接着，雷射蚀刻第一导电层，以形成至少一条第一雷射蚀刻线于相对应的第一输出端点的周围，使所述第一输出端点之间形成电性绝缘。
本发明实施例提供一种触控面板，所述触控面板包括基板、复数条轴向感应线以及至少一雷射蚀刻线。其中，所述复数条轴向感应线是在基板的同一侧的导电层或不同侧的导电层上透过雷射蚀刻所形成，并且每一条轴向感应线至少包含有一输出端点，而所述雷射蚀刻线形成于相对应的输出端点周围，使所述的输出端点之间形成电性绝缘。
综上所述，本发明实施例所提供的触控面板、触控电极结构及其制作方法是透过雷射蚀刻制程来完成，藉以提高生产效能，并且降低生产成本。此外，本发明在每个输出端点之间产生多数条彼此紧邻的雷射蚀刻线，藉此确保每个输出端点之间没有短路的情况发生，并且降低以雷射去除大面积导电层所耗费的时间。再者，本发明实施例提出雷射蚀刻的波长可产生适当的雷射能量，可避免雷射蚀刻破坏基板表面而造成蚀刻痕迹。
为使能更进一步了解本发明的特征及技术内容，请参阅以下有关本发明的详细说明与附图，然而所附图式仅提供参考与说明用，并非用来对本发明加以限制者。
附图说明
图 1 绘示依据本发明一示范实施例的双面导电层触控面板的剖面图。
图 2A 绘示依据本发明一示范实施例的第一导电层的俯视图。
图 2B 绘示图 2A 的 A 区域的局部放大图。
图 3A 绘示依据本发明一示范实施例的第二导电层的俯视图。
图 3B 绘示图 3A 的 B 区域的局部放大图。
图 4 绘示依据本发明一示范实施例的触控电极结构的制作方法的流程图。
图 5A 绘示依据本发明再一实施例的双面导电层触控面板的立体视图。
图 5B 绘示依据本发明再一实施例的双面导电层触控面板的另一立体视图。
图 6A 绘示依据本发明一示范实施例的单层导电层触控面板的剖面图。
图 6B 绘示依据本发明一示范实施例的单层导电层触控面板的俯视图。
图 6C 绘示依据本发明一示范实施例的单层导电层触控面板的立体图。
具体实施方式
〔双面导电层的触控面板实施例〕
请参见图 1 ，图 1 是绘示依据本发明一示范实施例的双面导电层触控面板的剖面图。如图所示，本实施例示范了一种双面导电层结构。触控面板 1 包括基板 10 、第一导电层 12 、第二导电层 16 以及保护层 18 。其中，基板 10 是使用具有高透光率的材质制成，且可为一平面式或非平面式薄板。举例来说，基板 10 可由玻璃、塑料、混合玻璃 / 塑料材料等形成，成为一种玻璃薄板或可挠式薄板，所述可挠式薄板可由选自聚碳酸酯 (PC) 、聚脂 (PET) 、聚甲基丙烯酸甲酯 (PMMA) 或环烯烃共聚合物 (COC) 的材料所组成。
第一导电层 12 是形成于基板 10 的第一表面 10a 上，而第二导电层是形成于基板 10 的第二表面 10b ，使得第一导电层 12 与第二导电层 16 藉由基板 10 而相互绝缘。此外，第一导电层 12 及第二导电层 16 经过蚀刻制程后，可分别形成一图案化结构而架构出本实施例触控面板 1 的一触控电极结构。
请再一并参见图 2A 及图 2B ，分别是绘示依据本发明一示范实施例的第一导电层的俯视图及图 2A 的 A 区域的局部放大图。如图所示，第一导电层 12 上所形成的图案化结构包含 M 条第一轴向感应线 12a 以及对应第一轴向感应线 12a 的 M 个第一输出端点 124 ，其中 M 为大于 1 的正整数。更具体来讲，蚀刻制程是依据所需的电极图案来蚀刻第一导电层 12 ，以规划出所述图案化结构整体的一第一外轮廓 S1 ，并再去除冗余区块 126 的部分，以形成所需的图形。其中，第一导电层 12 可例如是采用铟锡氧化物 (ITO) 或锑锡氧化物 (ATO) 的材料所设计的透明导电层。
本实施例是例如以雷射蚀刻制程来形成图案化结构，而所述雷射蚀刻制程应选自波长在 200nm 至 300nm 范围内的雷射光线。较佳的是，所述雷射蚀刻制程是以波长为 266nm 的雷射光线蚀刻第一导电层 12 ，而雷射光线蚀刻的深度恰好可将第一导电层 12 完全截断，藉此避免雷射光线损伤基板 10 或是其他的膜层。
承接上述，本实施例图案化结构中的 M 条第一轴向感应线 12a 是彼此平行排列，而每一条第一轴向感应线 12a 可为直条形状，或者可由多数个彼此连接的第一导电单元 120 组成。所述第一导电单元 120 为方形或菱形的形状，而第一轴向上相邻的第一导电单元 120 可藉由第一桥接导线 122 彼此电性连接，使得每一条第一轴向感应线 12a 成为多数个方形或菱形连接而成的链条形状。此外，本实施例图式中虽然绘示每一条第一轴向感应线 12a 同一侧的端头可对应形成一个第一输出端点 124 ，本发明并不以此为限，每一条第一轴向感应线 12a 两侧的端头当然都可分别对应第一输出端点 124 。
此外，本实施例更进一步藉由雷射蚀刻制程来在第一外轮廓 S1 的外侧蚀刻第一导电层 12 以形成至少一条雷射蚀刻线 20 。藉以确保每一个第一输出端点 124 的周围皆围设有雷射蚀刻线 20 而避免短路的情况发生。在此，本发明并不限制雷射蚀刻线 20 的数量以及各雷射蚀刻线 20 之间的间距，所属技术领域具有通常知识者应可明了，若雷射蚀刻线 20 越多 ( 也就是雷射蚀刻线 20 所构成的层数越多 ) ，则各个第一输出端点 124 越可以有效地彼此隔离与绝缘。较佳的是，每一条雷射蚀刻线 20 的宽度小于 150 μ m ，而第一外轮廓 S1 的外侧具有至少 7 条紧邻的雷射蚀刻线 20 。
请再一并参见图 3A 与图 3B ，分别是绘示依据本发明一示范实施例的第二导电层的俯视图及图 3A 的 B 区域的局部放大图。如图所示，相同于第一导电层 12 的蚀刻制程方式，第二导电层 16 上经雷射蚀刻制程所形成的图案化结构包括 P 条第二轴向感应线 16a 以及对应第二轴向感应线 16a 的第二输出端点 164 ，其中 P 为大于 1 的正整数。此外，第二导电层 16 可例如是采用铟锡氧化物 (ITO) 或锑锡氧化物 (ATO) 的材料所设计的透明导电层。于实务上，所述雷射蚀刻制程应选自波长在 200nm 至 300nm 范围内的雷射光线。较佳的是，所述雷射蚀刻制程是以波长为 266nm 的雷射光线蚀刻的深度恰好可将第二导电层 16 完全截断，并且得以避免雷射光线损伤基板 10 或第一导电层 12 。
同样的，第二导电层 16 的图案化结构中的 P 条第二轴向感应线 16a 是彼此平行排列，而每一条 P 条第二轴向感应线 16a 可为直条形状，或者可由多数个彼此连接的第二导电单元 160 组成，所述第二导电单元 160 为方形或菱形的形状，而第二轴向上相邻的第二导电单元 160 可藉由第二桥接导线 162 彼此电性连接，使得每一条第二轴向感应线 16a 成为多数个方形或菱形连接而成的链条形状。
再者，在第二导电层 16 的图案化结构的一第二外轮廓 S2 的外侧，本实施例同样进一步藉由雷射蚀刻制程来蚀刻形成至少一雷射蚀刻线 22 。藉以确保每一个第二输出端点 164 的周围皆围设有雷射蚀刻线 22 而避免短路的情况发生。
由上述结构来看，第一导电层 12 与第二导电层 16 的图案化结构大致相同，惟所述第一轴向感应线 12a 与第二轴向感应线 16a 的延伸方向并不相同。于实务上，第一轴向感应线 12a 与第二轴向感应线 16a 的延伸方向应互相垂直，也就是说，第一轴向感应线 12a 可沿着 X 轴方向延伸，第二轴向感应线 16a 可沿着 Y 轴方向延伸。此外，若第一轴向感应线 12a 与第二轴向感应线 16a 皆是采用由方形或菱形连接而成的链条形状的设计的话，则第一轴向感应线 12a 中的第一导电单元 120 可对应于第二导电层 16 的冗余区块 166 ，而第二轴向感应线 16a 中的第二导电单元 160 可对应于第一导电层 12 的冗余区块 126 。
另一方面， M 个第一输出端点 124 与 P 个第二输出端点 164 凸出的方向亦不相同，举例来说，所述 M 个第一输出端点 124 可沿着 X 轴方向而设置于第一轴向感应线 12a 的一端，所述 P 个第二输出端点 164 可沿着 Y 轴方向而设置于第二轴向感应线 16a 的一端。
最后，保护层 18 是进一步设置于第一导电层 12 上，用来做为触控面板 1 接受使用者触碰的表面，以保护设置于下方的膜层。保护层 18 的材料可选自玻璃、丙烯酸、蓝宝石，并且可以是经过强化、抗眩、抗菌等处理。
为了让触控面板 1 的结构更清楚明了，以下请根据图 1 、图 2A 、图 2B 、图 3A 及图 3B 所示的架构搭配本发明触控电极结构的制作方法做更进一步地说明。
图 4 是绘示依据本发明一示范实施例的触控电极结构的制作方法的流程图。如图所示，于步骤 S30 中，首先将 ITO 涂布在基板 10 的第一表面 10a 及第二表面 10b 上，使得基板 10 的第一表面 10a 及第二表面 10b 上分别形成有第一导电层 12 及第二导电层 16 。接着在步骤 S32 中，依据所需的电极图案来雷射蚀刻第一导电层 12 ，用以在第一导电层 12 上规划出图案化结构的一第一外轮廓 S1 ，并进而去除冗余区块 126 的部分，以形成多条第一轴向感应线 12a 。其中，每一第一轴向感应线 12a 的至少一端是包含有一第一输出端点 124 。
接着在步骤 S34 中，以雷射蚀刻第一导电层 12 ，以形成至少一条雷射蚀刻线 20 于每个第一输出端点 124 周围。在一实施例中，可例如是形成彼此紧邻的多条雷射蚀刻线 20 ，并且所述的雷射蚀刻线 20 除了形成在每个第一输出端点 124 的周围之外，亦可进一步延伸形成于整个图案化结构的第一外轮廓 S1 的外侧。
当完成第一导电层 12 的图案化结构之后，进一步在步骤 S36 中，依据所需的电极图案来雷射蚀刻第二导电层 16 ，用以在第二导电层 16 上规划出图案化结构的一第二外轮廓 S2 ，并进而去除冗余区块 166 的部分，以形成多条第二轴向感应线 16a 。其中，每一第二轴向感应线 16a 的至少一端是包含有一第二输出端点 164 。进而在步骤 S38 中，以雷射蚀刻第二导电层 16 ，以形成至少一条雷射蚀刻线 22 于每个第二输出端点 164 周围。同样的，在一实施例中，可例如是形成彼此紧邻的多条雷射蚀刻线 22 ，并且所述的雷射蚀刻线 22 除了形成在每个第二输出端点 164 的周围之外，亦可进一步延伸形成于整个图案化结构的第二外轮廓 S2 的外侧。
〔挠性电路实施例〕
从实际设计来看，触控电极结构中的第一轴向感应线 12a 及第二轴向感应线 16a 是分别用来传输驱动信号及感测信号，藉以实现触碰感测的功能。而触控面板的一控制单元则是透过一挠性电路来电性连接第一轴向感应线 12a 及第二轴向感应线 16a ，以用来提供驱动信号及接收感测信号。
为了方便说明，以前述的双面导电层的触控面板实施例来加以说明。请一并参见图 5A 与图 5B ，分别是绘示依据本发明再一实施例的双面导电层触控面板的立体视图及另一立体视图。如图所示，触控面板 6 包含了挠性电路 60 与挠性电路 62 。挠性电路 60 可对应电性连接至第一轴向上的第一输出端点 124 ，而挠性电路 62 可对应电性连接至第二轴向上的第二输出端点 164 。
于实务上，由于本发明已经使用多条雷射蚀刻线来清除输出端点周围的导电层，使得相邻的输出端点之间可以有效地彼此隔离与绝缘，因此挠性电路 60 贴合连接在第一导电层 12( 或者挠性电路 62 贴合连接在第二导电层 16) 时，挠性电路 60 上的多数的脚位更可分别准确地对应到所述多个第一输出端点 124( 或者挠性电路 62 上的多数的脚位更可分别准确地对应到所述多个第二输出端点 164) 。当然，所属技术领域具有通常知识者应可明白的是，本发明的触控面板更可视布线需要，将输出端点进一步透过延伸布设的金属迹线 (metal trace) 来电性连接于挠性电路。
〔单层导电层的触控面板实施例〕
另外，本发明并不限制要应用于双面导电层的触控面板，请一并参见图 6A 、图 6B 以及图 6C ，分别是绘示依据本发明一示范实施例的单层导电层的触控面板的剖面图、俯视图及立体图。如图所示，本实施例示范了一种单层导电层结构。触控面板 7 包括基板 70 ，以及形成于基板 70 的第一表面 70a 上的导电层 72 与绝缘层 74 。在此，基板 70 的第一表面 10a 上的导电层 72 在经过雷射蚀刻制程后，可形成复数个第一导电单元 720a 、复数个第一桥接导线 722a 、复数个第一输出端点 724a 、复数个第二导电单元 720b 以及复数个第二输出端点 724b 。并且，所述复数个第一输出端点 724a 以及所述复数个第二输出端点 724b 的周围同样进一步雷射蚀刻有彼此紧邻的多数条雷射蚀刻线 80 ，使得所述第一输出端点 724a 及所述第二输出端点 724b 彼此之间得以相互绝缘。
本实施例中，所述复数个第一导电单元 720a 、复数条第一桥接导线 722a 、复数个第一输出端点 724a 可形成多条第一轴向感应线 72a 。而所形成的多条第一轴向感应线 72a 为直条形状并彼此平行排列，且其中的第一导电单元 720a 为方形或菱形的形状。每个第一轴向上相邻的第一导电单元 720a 之间更可透过第一桥接导线 722a 互相连接，使得每一条第一轴向感应线 72a 成为多数个方形或菱形连接而成的链条形状。此外，每一条第一轴向感应线 72a 一侧的端头对应连接一个第一输出端点 724a 。
另一方面，所述复数个第二导电单元 720b 以及复数个第二输出端点 724b 也可以透过复数条第二桥接导线 722b 的连接，而形成复数条第二轴向感应线 72b 。其中，第二桥接导线 722b 的材料在设计上可以采用金属、 ITO 、 ATO 等导电材料。详细来说，所述绝缘层 74 有部分设置在第一桥接导线 722a 之上，而第二桥接导线 722b 再层迭设置在绝缘层 74 之上，使得绝缘层 74 可分隔开第一桥接导线 722a 与第二桥接导线 722b ，进而使第一轴向感应线 72a 与第二轴向感应线 72b 得以形成绝缘。此外，藉由第二桥接导线 722b 跨接第二轴向上相邻的两个第二导电单元 720b ，使得每一条第二轴向感应线 72b 可成为多数个方形或菱形连接而成的链条形状。
在架构上，若从另一角度，将第一轴向感应线 72a 与第二轴向感应线 72b 分开来看的话，由于所述多条第一轴向感应线 72a 是彼此平行排列，并且所述复数个第一导电单元 720a 是彼此间隔设置，因此相邻的第一轴向感应线 72a 之间与相邻的第一导电单元 720a 之间的区域即可分别定义为一配置区。而所述复数个第二导电单元 720b 即是分别设置于配置区中，并进一步藉由绝缘层 74 的设置，让第二桥接导线 722b 跨越第一桥接导线 722a 而电性连接第二轴向上相邻的两个第二导电单元 720b ，藉以串接形成第二轴向感应线 72b 。
综上所述，本发明实施例所提供的触控电极结构及其制作方法得以完全透过雷射蚀刻制程来完成，相较于黄光蚀刻来说，使用雷射蚀刻制程的步骤较为简易，生产时间更为缩短，并且更可适用于大尺寸触控面板的制作，此外雷射蚀刻制程较不会有材料损耗上的问题，设备上也较为精简，故整体生产成本也相对较低。此外，本发明透过雷射蚀刻而在每个输出端点周围形成的多数条彼此紧邻的雷射蚀刻线，除了能进一步节省大面积雷射蚀刻所需耗费的时间之外，更可同时确保每个输出端点之间没有短路的情况发生。再者，本发明实施例提出雷射蚀刻的波长可产生适当的雷射能量，可避免雷射蚀刻破坏基板表面或其他膜层而造成蚀刻痕迹。
以上所述仅为本发明的较佳可行实施例，非因此局限本发明的权利要求的范围，故举凡运用本发明说明书及图式内容所为的等效技术变化，均包含于本发明的范围内。

Claims (20)

  1. 一种触控电极结构，其特征在于，包括：
    复数条第一轴向感应线，在一第一导电层上透过雷射蚀刻所形成，其中每一该些第一轴向感应线至少包含一第一输出端点；以及
    至少一条第一雷射蚀刻线，在该第一导电层上经雷射蚀刻形成于相对应的该第一输出端点周围，使该些第一输出端点之间形成电性绝缘。
  2. 如权利要求 1 所述的触控电极结构，其特征在于，该些第一轴向感应线及该第一雷射蚀刻线由波长在 200nm 至 300nm 范围内的雷射光线于该第一导电层蚀刻而成。
  3. 如权利要求 1 所述的触控电极结构，其特征在于，更包括：
    复数条第二轴向感应线，其中每一该些第二轴向感应线至少包含一第二输出端点；以及
    至少一条第二雷射蚀刻线，形成于相对应的该第二输出端点周围，使该些第二输出端点之间形成电性绝缘；
    其中，该些第一轴向感应线与该些第二轴向感应线电性绝缘。
  4. 如权利要求 3 所述的触控电极结构，其特征在于，该些第二轴向感应线及该第二雷射蚀刻线由波长在 200nm 至 300nm 范围内的雷射光线于一第二导电层蚀刻而成。
  5. 如权利要求 4 所述的触控电极结构，其特征在于，该第一导电层及该第二导电层位于一基板的不同侧。
  6. 如权利要求 3 所述的触控电极结构，其特征在于，每一该些第一轴向感应线包含：
    复数个第一导电单元，于第一轴向上彼此间隔设置；及
    复数个第一桥接导线，分别电性连接第一轴向上相邻的两个第一导电单元；
    其中，该些相邻的第一轴向感应线之间与该些相邻的第一导电单元之间的区域分别定义出一配置区。
  7. 如权利要求 6 所述的触控电极结构，其特征在于，每一该些第二轴向感应线包含：
    复数个第二导电单元，分别设置于该配置区；及
    复数个第二桥接导线，跨越该些第一桥接导线来分别电性连接第二轴向上相邻的两个第二导电单元。
  8. 如权利要求 7 所述的触控电极结构，其特征在于，进一步包含：
    复数个绝缘层，设置于该些第一桥接导线及该些第二桥接导线之间，使该些第一轴向感应线及该些第二轴向感应线电性绝缘。
  9. 如权利要求 7 所述的触控电极结构，其特征在于，该些第二导电单元由波长在 200nm 至 300nm 范围内的雷射光线蚀刻于该第一导电层而产生。
  10. 如权利要求 3 所述的触控电极结构，其特征在于，该些第一输出端点及该些第二输出端点分别电性连接一挠性电路。
  11. 一种触控电极结构的制作方法，其特征在于，步骤包括：
    雷射蚀刻一第一导电层，以形成复数条第一轴向感应线，其中每一该些第一轴向感应线至少包含一第一输出端点；及
    雷射蚀刻该第一导电层，以形成至少一条第一雷射蚀刻线于相对应的该第一输出端点的周围，使该些第一输出端点之间形成电性绝缘。
  12. 如权利要求 11 所述的触控电极结构的制作方法，其特征在于，该些第一轴向感应线及该第一雷射蚀刻线由波长在 200nm 至 300nm 范围内的雷射光线于该第一导电层蚀刻而成
  13. 如权利要求 11 所述的触控电极结构的制造方法，其特征在于，进一步包括：
    雷射蚀刻一第二导电层，以形成复数条第二轴向感应线，其中每一该些第二轴向感应线至少包含一第二输出端点；及
    雷射蚀刻该第二导电层，以形成至少一条第二雷射蚀刻线于相对应的该第二输出端点的周围，使该些第二输出端点之间形成电性绝缘；
    其中，该些第一轴向感应线及该些第二轴向感应线电性绝缘。
  14. 如权利要求 13 所述的触控电极结构的制造方法，其特征在于，该些第二轴向感应线及该第二雷射蚀刻线由波长在 200nm 至 300nm 范围内的雷射光线于该第二导电层蚀刻而成。
  15. 如权利要求 14 所述的触控电极结构的制造方法，其特征在于，该第一导电层及该第二导电层位于一基板的不同侧。
  16. 如权利要求 11 所述的触控电极结构的制作方法，其特征在于，每一该些第一轴向感应线包含：
    复数个第一导电单元，于第一轴向上彼此间隔设置；及
    复数个第一桥接导线，分别电性连接相邻的两个第一导电单元；
    其中，该些相邻的第一轴向感应线之间与该些相邻的第一导电单元之间的区域分别定义出一配置区。
  17. 如权利要求 16 所述的触控电极结构的制作方法，其特征在于，进一步包括：
    雷射蚀刻该第一导电层，以于该配置区形成复数个第二导电单元；以及
    于一第二轴向上设置复数个第二桥接导线，以跨越该些第一桥接导线而分别电性连接相邻的两个第二导电单元；
    其中，每一该第二轴向上，该些第二桥接导线连接该些第二导电单元形成一第二轴向感应线。
  18. 如权利要求 17 所述的触控电极结构的制作方法，其特征在于，该些第二导电单元由波长在 200nm 至 300nm 范围内的雷射光线蚀刻于该第一导电层而形成。
  19. 如权利要求 17 所述的触控电极结构的制作方法，其特征在于，进一步包括：
    设置一绝缘层于每一该些第一桥接导线及每一该些第二桥接导线之间，使该些第一轴向感应线及该些第二轴向感应线电性绝缘。
  20. 一种触控面板，其特征在于，包含：
    一基板；
    复数条轴向感应线，在该基板的同一侧的导电层或不同侧的导电层上透过雷射蚀刻所形成，其中每一轴向感应线至少包含一输出端点；以及
    至少一雷射蚀刻线，形成于相对应的该输出端点周围，使该些输出端点之间形成电性绝缘。
PCT/CN2012/084125 2011-11-09 2012-11-06 触控面板、触控电极结构及其制作方法 WO2013067909A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110379425.4 2011-11-09
CN201110379425.4A CN103105962B (zh) 2011-11-09 2011-11-09 触控面板、触控电极结构及其制作方法

Publications (1)

Publication Number Publication Date
WO2013067909A1 true WO2013067909A1 (zh) 2013-05-16

Family

ID=48288522

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2012/084125 WO2013067909A1 (zh) 2011-11-09 2012-11-06 触控面板、触控电极结构及其制作方法

Country Status (5)

Country Link
US (1) US9280222B2 (zh)
KR (1) KR101456637B1 (zh)
CN (1) CN103105962B (zh)
TW (1) TWI585623B (zh)
WO (1) WO2013067909A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104731422A (zh) * 2013-12-24 2015-06-24 昆山维信诺显示技术有限公司 电容屏触控面板及其间隙部分氧化铟锡薄膜的刻蚀方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101460027B1 (ko) * 2013-03-15 2014-11-12 지스마트 주식회사 패턴간의 간섭을 방지하는 패턴 안전장치
CN103927038B (zh) * 2013-06-09 2017-08-29 上海天马微电子有限公司 一种内嵌式触摸屏及其电压检测方法
CN103336560A (zh) * 2013-06-14 2013-10-02 业成光电（深圳）有限公司 具有曲面的保护盖及具有该保护盖的触摸面板
FR3013472B1 (fr) 2013-11-19 2016-07-08 Fogale Nanotech Dispositif accessoire couvrant pour un appareil portable electronique et/ou informatique, et appareil equipe d'un tel dispositif accessoire
US20150212609A1 (en) * 2014-01-28 2015-07-30 Apple Inc. Light block for transparent touch sensors
CN104007885B (zh) * 2014-05-29 2018-05-08 四川点燃科技有限公司 投射式电容触控白板的制造方法及该投射式电容触控白板
TWI566873B (zh) * 2014-09-24 2017-01-21 友達光電股份有限公司 形成具有溝槽之透明基材的方法以及形成元件基板的方法
CN105528101A (zh) * 2014-10-21 2016-04-27 宸鸿科技(厦门)有限公司 触控面板及其立体盖板结构
CN105589587B (zh) * 2014-10-21 2018-10-26 宸鸿科技(厦门)有限公司 透明复合基板与其制备方法及触控面板
CN104319141A (zh) * 2014-11-03 2015-01-28 广东美的厨房电器制造有限公司 触控按键组件和触控按键组件的生产方法
CN104820535A (zh) * 2015-05-27 2015-08-05 广东泰通科技股份有限公司 一种纯ito膜结构单层多点的电容式触摸屏制作工艺
KR20170058742A (ko) 2015-11-19 2017-05-29 현대자동차주식회사 터치 입력장치, 이를 포함하는 차량, 및 그 제조방법
CN108170313B (zh) * 2017-12-29 2020-12-08 业成科技（成都）有限公司 触控膜及其制作方法、触控面板及其电路板和穿戴设备
TWI692713B (zh) * 2019-04-15 2020-05-01 萬達光電科技股份有限公司 電容式觸控面板的製造方法及電容式觸控面板
TWI817150B (zh) * 2020-10-27 2023-10-01 達方電子股份有限公司 鍵盤複合電極模組及發光觸控鍵盤

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101546242A (zh) * 2008-03-26 2009-09-30 义隆电子股份有限公司 触控面板装置
CN101807133A (zh) * 2010-03-22 2010-08-18 牧东光电（苏州）有限公司 触控面板感应层的加工方法
WO2011048347A1 (en) * 2009-10-23 2011-04-28 M-Solv Limited Capacitive touch panels

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992013328A1 (en) * 1991-01-17 1992-08-06 Rgb Dynamics Capacitive touch screen
JP5218713B2 (ja) * 2000-07-28 2013-06-26 住友ベークライト株式会社 光学導波管を形成するためのポリマー組成物；それらから形成される光学導波管；およびそれを作製するための方法
JP3854822B2 (ja) * 2001-06-29 2006-12-06 リコーマイクロエレクトロニクス株式会社 ビーム加工方法及びその装置、並びにタッチパネル基板の製造方法
JP2005513741A (ja) * 2001-12-21 2005-05-12 アイファイア テクノロジー コーポレーション エレクトロルミネセンス表示装置の薄膜層をパターン形成するレーザ・アブレーション法
KR101303881B1 (ko) * 2006-08-03 2013-09-04 삼성디스플레이 주식회사 터치 스크린, 그 제조 방법 및 이를 구비하는 표시 장치
JP4332174B2 (ja) * 2006-12-01 2009-09-16 アルプス電気株式会社 入力装置及びその製造方法
US8026903B2 (en) * 2007-01-03 2011-09-27 Apple Inc. Double-sided touch sensitive panel and flex circuit bonding
TW200919140A (en) * 2007-10-23 2009-05-01 Tpk Touch Solutions Inc In-mould molding touch module and method for manufacturing the same
TWI361996B (en) * 2008-03-21 2012-04-11 Elan Microelectronics Corp Touch panel device
CN103699279B (zh) * 2008-11-06 2017-03-01 Uico公司 电容触摸屏及用于制作触摸屏的策略性几何形状隔离图案化方法
US8704779B2 (en) * 2008-12-26 2014-04-22 Atmel Corporation Multiple electrode touch sensitive device
US8518277B2 (en) * 2009-02-12 2013-08-27 Tpk Touch Solutions Inc. Plastic capacitive touch screen and method of manufacturing same
WO2010098199A1 (ja) * 2009-02-27 2010-09-02 ソニー株式会社 表示装置、タッチパネル、および電子機器
US20110001706A1 (en) * 2009-07-02 2011-01-06 Emery Sanford Electronic device touch screen display module
KR20120061865A (ko) 2009-08-06 2012-06-13 어플라이드 머티어리얼스, 인코포레이티드 향상된 수율을 갖는 박막 레이저 스크라이빙을 위한 방법들 및 관련 시스템들
GB2472613B (en) * 2009-08-11 2015-06-03 M Solv Ltd Capacitive touch panels
GB2472614B (en) * 2009-08-11 2014-11-19 M Solv Ltd Capacitive touch panels
TWI474377B (zh) * 2010-03-25 2015-02-21 Winsky Technology Ltd A method of patterning a substrate and a method of manufacturing a capacitive touch panel
CN102279678A (zh) * 2010-06-12 2011-12-14 宸鸿科技(厦门)有限公司 触控电路图形结构及制造方法、触控面板及触控显示屏
KR101064645B1 (ko) * 2010-06-14 2011-09-15 엘지이노텍 주식회사 패드부 오염을 방지할 수 있는 터치 패널의 제조 방법 및 그 방법으로 제조된 터치 패널
US9081427B2 (en) * 2010-07-16 2015-07-14 Atmel Corporation Position-sensing panel and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101546242A (zh) * 2008-03-26 2009-09-30 义隆电子股份有限公司 触控面板装置
WO2011048347A1 (en) * 2009-10-23 2011-04-28 M-Solv Limited Capacitive touch panels
CN101807133A (zh) * 2010-03-22 2010-08-18 牧东光电（苏州）有限公司 触控面板感应层的加工方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104731422A (zh) * 2013-12-24 2015-06-24 昆山维信诺显示技术有限公司 电容屏触控面板及其间隙部分氧化铟锡薄膜的刻蚀方法
US10379667B2 (en) 2013-12-24 2019-08-13 Kunshan Visionox Display Co., Ltd. Capacitive touchscreen panel and a method for etching an indium tin oxide film on a gap portion of a capacitive touchscreen panel

Also Published As

Publication number Publication date
TWI585623B (zh) 2017-06-01
TW201319885A (zh) 2013-05-16
KR101456637B1 (ko) 2014-11-04
US20140124347A1 (en) 2014-05-08
CN103105962B (zh) 2016-04-06
CN103105962A (zh) 2013-05-15
US9280222B2 (en) 2016-03-08
KR20130051408A (ko) 2013-05-20

Similar Documents

Publication Publication Date Title
WO2013067909A1 (zh) 触控面板、触控电极结构及其制作方法
JP7235510B2 (ja) タッチパネル及びその製造方法、タッチ表示装置
KR102017155B1 (ko) 터치스크린 패널 및 그의 제조방법
US20150085205A1 (en) Touch panel
KR20110000760A (ko) 정전용량방식의 터치 회로패턴 및 그 제작방법
KR20120049784A (ko) 터치 패널 장치
KR20140112894A (ko) 터치 스크린 패널 및 그 제조 방법
TW201516815A (zh) 電容式觸控面板及其製作方法
WO2013170684A1 (zh) 触控面板及其应用的触控显示设备
TWI402735B (zh) 觸控面板的結構及其製造方法
TWI585644B (zh) 觸控面板及其製作方法
WO2013170682A1 (zh) 触控面板及其制作方法
KR20130044144A (ko) 터치 감지 장치 및 그 제조 방법
US20150060253A1 (en) Decorative substrate and touch panel
KR20150139104A (ko) 터치 스크린 패널
TW201248478A (en) Layout structure of capacitive touch panel and manufacturing method thereof
TW201525567A (zh) 元件基板的製作方法
KR20150062528A (ko) 터치 패널 및 그의 제조 방법
KR20130061854A (ko) 터치 스크린 패널 및 그의 제조방법
KR20150052682A (ko) 터치 패널 및 이의 제조 방법
TWI585633B (zh) 觸控模組及其橋接結構的製造方法
WO2020063538A1 (zh) 触控面板、触控显示装置及触控面板制作方法
KR20140112892A (ko) 터치 스크린 패널 및 그 제조 방법
KR20130049014A (ko) 정전 용량 터치 패널 및 이의 제조 방법
KR20140100089A (ko) 터치 스크린 패널 및 그 제조 방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12846893

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12846893

Country of ref document: EP

Kind code of ref document: A1