WO2013065540A1 - Appareil de détection de pression - Google Patents

Appareil de détection de pression Download PDF

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Publication number
WO2013065540A1
WO2013065540A1 PCT/JP2012/077426 JP2012077426W WO2013065540A1 WO 2013065540 A1 WO2013065540 A1 WO 2013065540A1 JP 2012077426 W JP2012077426 W JP 2012077426W WO 2013065540 A1 WO2013065540 A1 WO 2013065540A1
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WO
WIPO (PCT)
Prior art keywords
pressure sensor
lid
housing
sensor device
gap
Prior art date
Application number
PCT/JP2012/077426
Other languages
English (en)
Japanese (ja)
Inventor
尚信 大川
弘 石田
秀樹 上村
靖之 服部
貴志 西水
康博 須田
Original Assignee
アルプス電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Priority to JP2013541723A priority Critical patent/JP5756181B2/ja
Publication of WO2013065540A1 publication Critical patent/WO2013065540A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Definitions

  • the present invention relates to a pressure sensor device, and more particularly to the structure of a housing for housing a pressure sensor.
  • the pressure sensor device includes a strain gauge method in which the diaphragm is bent by an external pressure and this bending changes the electric resistance of a piezoresistive element or the like provided on the diaphragm, or the capacitance between the movable electrode and the fixed electrode formed of the diaphragm. There is an electrostatic capacitance system to be changed. And these pressure sensor devices are mounted and used for apparatuses, such as a mobile telephone and a wristwatch.
  • a cavity 712 having a circular concave shape in plan view is formed in the device housing 711, and a sensor chip (pressure sensor) 721 is installed on the bottom surface 712 a of the cavity 712. Ru.
  • a diaphragm (not shown) is formed as a sensitive part, which is bent according to the external pressure.
  • the cavity 712 is closed by a sensor protection lid 741.
  • a pressure introducing port 742 for introducing an external pressure into the cavity 712 is provided at a central portion of the sensor protection lid 741, and the external pressure acts on the diaphragm via the pressure introducing port 742.
  • the sensor protection lid 741 is fitted in and adhered to the device housing 711.
  • the microphone chip 810 pressure sensor
  • the recess 811 is covered by a lid 814.
  • An acoustic hole 812 is formed in the lid 814 substantially at the center of the position corresponding to the recess 811.
  • the recess 811 communicates with the outside through the acoustic hole 812. It is done.
  • a diaphragm electrode that vibrates according to pressure fluctuation such as sound and a fixed electrode are disposed to face each other, and a capacitance change due to the vibration of the diaphragm electrode is detected.
  • the pressure sensor device disclosed in Patent Document 1 is provided with a pressure introduction port 742 penetrating at the center of the sensor protection lid 741. Further, in the pressure sensor device disclosed in Patent Document 2, as shown in FIG. 23, an acoustic hole 812 (pressure introduction port) is formed in the lid 814 in a penetrating state. For this reason, the pressure introducing port 742 in the lid 741 for sensor protection and the manufacturing cost for forming the acoustic hole 812 in the lid 814 are required.
  • the acoustic hole 812 communicating with the outside is a lid facing the recess 811 It can only be formed in the area of the body 814, ie only part of the pressure sensor device. Therefore, when the pressure sensor 810 is downsized and the recess 811 is downsized, it is necessary to reduce the planar size of the acoustic hole 812. When the planar size of the acoustic hole 812 is reduced, the responsiveness to external pressure is degraded. Therefore, the pressure sensor device disclosed in Patent Document 2 is difficult to miniaturize.
  • the plane size of the lid 814 needs to be sufficiently larger than the total plane size of the acoustic hole 812 and the suction port.
  • the position adjustment between the suction port and the lid 814 needs to be performed precisely. This goes against the miniaturization of the pressure sensor device and the simplicity of component mounting.
  • the planar size of the suction port When the suction port completely covers the acoustic hole 812, if the planar size of the lid 814 is reduced to miniaturize the pressure sensor device, the planar size of the suction port also needs to be reduced. When the planar size of the suction port is reduced, the planar size of the acoustic hole 812 also needs to be reduced. However, it is difficult to align the suction port with a small plane size to the small acoustic hole 812 with a small plane size, which makes it difficult to reduce the plane size of the pressure sensor device, that is, to make the pressure sensor device smaller. ing.
  • the object of the present invention has been made in consideration of such problems, and provides a pressure sensor device that is easy to mount components and has a short conveyance time for component mounting, low cost, and excellent miniaturization. It is.
  • the pressure sensor device comprises a pressure sensor for detecting an external pressure, a housing for housing the pressure sensor, a lid fixed to the housing, and a pressure introducing unit for introducing the external pressure.
  • the pressure introducing portion may be a gap formed between the lid and the housing in a state where the lid and the housing are fixed.
  • the manufacturing cost can be reduced.
  • the pressure introducing portion is provided by the gap formed between the lid and the housing, the planar size of the pressure sensor device can be reduced. Therefore, the pressure sensor device can be easily miniaturized. Also, with the miniaturization, the cost of materials and the like will be reduced.
  • the acoustic hole (pressure introducing portion) which is largely opened in the lid is not formed, it is necessary to precisely adjust the positional relationship between the lid and the suction port of the suction nozzle which picks up at the time of component mounting of the pressure sensor device Makes it easy to mount components when mounting a pressure sensor device.
  • the size of the lid in plan view may be larger than the suction port of the suction nozzle to be picked up, and the planar size of the lid may be reduced compared to the conventional case where acoustic holes are formed in the lid. It is possible. Therefore, the pressure sensor device can be easily miniaturized.
  • the present invention since no acoustic hole is formed in the lid, a sufficient adsorptive force can be obtained by evacuating a small space which is the internal volume of the adsorption nozzle. Therefore, since the adsorption time at the time of mounting a pressure sensor apparatus can be shortened compared with before, it is possible to shorten the conveyance time at the time of component mounting. Moreover, processing cost etc. become low cost because conveyance time becomes short.
  • the housing is configured to have a bottom wall to which the pressure sensor is fixed, a side wall standing around the periphery of the bottom wall, and an opening formed to be surrounded by an upper surface of the side wall. It is preferable that the lid be provided so as to cover the opening, and the gap be formed at the periphery of the lid.
  • the gap can be formed between the lid and the housing, and is formed at the periphery of the lid. Therefore, a pressure sensor device that detects the external pressure through the gap is possible.
  • the lid is configured to have front and back surfaces and side surfaces, one surface of the front and back surfaces is facing outward, and the gap is formed between the side surface of the lid and an inner circumferential surface of the side wall. Is preferably provided.
  • the penetration length of the gap can be shortened by reducing the thickness of the lid.
  • the gap can be obtained that penetrates linearly between the side surface and the inner circumferential surface of the side wall. Therefore, a pressure sensor device with high responsiveness to the external pressure is possible.
  • the lid is configured to have front and back surfaces and side surfaces, one surface of the front and back surfaces faces outward, and the gap is between the other surface of the front and back surfaces and the upper surface of the side wall. It is preferable to be provided through.
  • the lid can be widely spread to the outer periphery of the side wall in plan view. Therefore, it is an advantageous structure in position adjustment of the lid and the suction nozzle at the time of component mounting of the pressure sensor device. Therefore, it is excellent in the allowance which can make small the planar size of a pressure sensor device, and makes miniaturization of a pressure sensor device easy.
  • one of the front and back surfaces is flat.
  • the suction port of the suction nozzle that picks up when mounting components of the pressure sensor device sucks a flat surface, and stable and reliable suction can be performed. Therefore, stable component mounting without component dropping etc. is enabled.
  • FIG. 2 is a schematic cross-sectional view taken along the line AA of the pressure sensor device 1 shown in FIG. 1 and viewed from the arrow direction.
  • FIG. 2 is a schematic cross-sectional view taken along the line BB of the pressure sensor device 1 shown in FIG. 1 and viewed from the arrow direction.
  • FIG. 2 is a schematic plan view of the lid of the pressure sensor device 1 shown in FIG. It is the schematic explaining the manufacturing method of 1st Embodiment.
  • It is a plane schematic diagram of the 1st modification to a 1st embodiment. It is plane schematic drawing which sees through and looks at a lid of the 1st modification.
  • FIG. 11 is a schematic cross-sectional view taken along the line DD shown in FIG. 10 of the second embodiment and viewed from the arrow direction.
  • FIG. 11 is a schematic cross-sectional view of the second embodiment taken along the line CC shown in FIG. 10 and viewed in the arrow direction.
  • FIG. 11 is a schematic plan view seen through the lid of the pressure sensor device according to the second embodiment shown in FIG. 10.
  • FIG. 15 is a schematic cross-sectional view taken along the line E-E shown in FIG. 14 of the third embodiment and viewed from the arrow direction.
  • FIG. 18 is a schematic cross-sectional view taken along the line FF shown in FIG. 17 of the fourth embodiment and viewed from the arrow direction. It is a modification of a 4th embodiment.
  • It is the cross-sectional schematic of the pressure sensor apparatus in the prior art disclosed by patent document 1.
  • FIG. It is the cross-sectional schematic of the pressure sensor apparatus in the prior art disclosed by patent document 2.
  • the Y direction is the left direction
  • the Y1 direction is the left direction
  • the Y2 direction is the right direction
  • the X direction is the front and back direction
  • the X1 direction is the front direction and the X2 direction is the rear direction.
  • a direction perpendicular to both the X direction and the Y direction is the vertical direction (Z direction; height direction)
  • the Z1 direction is the upper direction
  • the Z2 direction is the lower direction.
  • the pressure sensor device 1 in the first embodiment is used by being mounted on a portable device such as a mobile phone, a watch, a video camera, and the like. There is a demand for downsizing and thinning of the pressure sensor device 1 mounted on the portable device due to the demand for high performance and thinning of the portable device.
  • FIG. 1 is a schematic plan view of the pressure sensor device 1 in the first embodiment.
  • FIG. 2 is a schematic cross-sectional view taken along the line AA of the pressure sensor device 1 shown in FIG. 1 and viewed from the arrow direction.
  • FIG. 3 is a schematic cross-sectional view taken along the line BB of the pressure sensor device 1 shown in FIG. 1 and viewed from the arrow direction.
  • the housing 3 is erected on the periphery of the bottom wall 3a, and a side wall 3b is formed surrounding the bottom wall 3a. Then, an opening 4 for housing the pressure sensor 5 is formed so as to be surrounded by the bottom wall 3 a and the side wall 3 b of the housing 3.
  • the lid 2 is provided so as to cover the opening 4, and as shown in FIGS. 1 and 3, the gap 7 is between the side surface 2 b and the side wall 3 b located at the front and back (X1-X2 direction) edge of the lid 2. It penetrates between inner skin 3e.
  • the side surface 2b of the lid 2 and the inner peripheral surface 3e of the housing 3 are formed flush with each other, and are disposed parallel to each other with a predetermined gap so as to face each other. .
  • the pressure sensor device 1 is configured to be housed in the housing 3 by the pressure sensor 5 being fixed to the upper surface 3c of the bottom wall 3a of the housing 3 having a concave shape. ing.
  • An external pressure is introduced via this gap 7 into a cavity 8 provided hollow in the pressure sensor device 1. Further, on the upper surface of the pressure sensor 5 provided in the cavity 8, a diaphragm 6 is formed as a sensitive part, which is bent according to the external pressure. Therefore, the diaphragm 6 bends in response to the external pressure introduced through the gap 7, and the electric resistance of a piezoresistive element (not shown) provided on the diaphragm 6 changes in response to the bending. And the external pressure is detected from the change of this electrical resistance.
  • the pressure sensor of this embodiment is a strain gauge system such as a piezoresistive element, but is not limited to this. It is also possible to use an electrostatic capacitance system in which a movable electrode formed of a diaphragm and a fixed electrode are opposed to form a capacitor and external pressure is detected.
  • the change in electrical resistance is output from the pad electrode of the pressure sensor 5 to the housing electrode provided on the top surface 3 c of the bottom wall 3 a of the housing 3 through the bonding wire. Then, the change in the electrical resistance is output to the portable device through the housing electrode.
  • the pressure sensor 5, the bonding wire, and the housing electrode are covered and protected by a flexible and low elastic resin. Thus, the external pressure acts on the diaphragm 6 through this soft and low elastic resin.
  • the pressure sensor 5, the bonding wire, and the housing electrode are covered and protected by a flexible and low elastic resin, but the invention is not limited thereto. It is also possible that it is not covered with a soft, low elasticity resin.
  • the upper surface 2 a of the lid 2 facing outward is formed flat.
  • the lid 2 is attached by being fixed to the housing 3 by the thermosetting resin 9.
  • protrusions 2c and 2d are provided which project to the left and right (in the Y1-Y2 direction) of the lid 2. Then, on the left and right (Y1-Y2 direction) of the upper portion of the side wall 3b of the housing 3, notches 3f and 3g in which the protrusions 2c and 2d are mounted are provided. Then, as shown in FIG. 4 which is a schematic plan view seen through the lid 2, a step is provided on the left and right inner peripheral surfaces 3 e of the housing 3 at the same height as the bottoms of the notches 3 f and 3 g. Stepped surfaces 10a and 10b are formed from the surfaces formed by the steps and the bottom surfaces of the notches 3f and 3g. However, in FIG. 2, FIG. 3, and FIG. 4, the pad electrode, the housing electrode, the bonding wire and the like are not illustrated.
  • thermosetting resin 9 is applied to the step surfaces 10a and 10b, the lid 2 is placed thereon, and the thermosetting resin 9 is cured to thereby fix the lid 2 to the housing 3 and adhere. It will be set up. At this time, the protrusions 2c and 2d are mounted on the notches 3f and 3g, whereby the position adjustment of the lid 2 and the housing 3 is performed.
  • the housing 3 has a width of about 1 to 3 mm in the left-right direction (Y1-Y2 direction) and a width of about 1 to 3 mm in the front-rear direction (X1-X2 direction).
  • the height of) is about 0.3 to 1 mm.
  • the thickness of the lid 2 in the vertical direction (Z1-Z2 direction) is about 0.1 to 0.3 mm.
  • the width of the gap 7 in the front-rear direction (X1-X2 direction) is about 0.1 to 0.3 mm, and the width of the gap 7 in the left-right direction (Y1-Y2 direction) is about 1 to 3 mm.
  • the width of the gap 7 in the front-rear direction (X1-X2 direction) is the distance between the space in the front-rear direction (X1-X2 direction) of the inner peripheral surface 3e of the housing 3 and the width in the front-rear direction (X1-X2 direction) of the lid 2 It consists of a difference. Therefore, by setting the dimensional tolerance between the housing 3 and the lid 2 appropriately, the width in the front-rear direction (X1-X2 direction) of the gap 7 can be made to a desired value.
  • a pressure introducing port 742 is formed in the sensor protection lid 741.
  • an acoustic hole 812 is formed in the lid 814 in order to introduce an external pressure.
  • the gap 7 for introducing the external pressure is formed by appropriately setting the dimensional tolerance between the housing 3 and the lid 2. Therefore, in the present embodiment, since the processing cost for forming the hole (the pressure introduction port 742 or the acoustic hole 812) penetrating in the lid 2 is not required, the manufacturing cost of the present embodiment is reduced compared to the prior art. be able to.
  • the external pressure is introduced into the cavity 8 through the gap 7 and is detected as the diaphragm 6 bends. Therefore, in order to detect the external pressure with good responsiveness, it is preferable that the area facing the outside of the gap 7 be large.
  • the gap 7 has a rectangular shape in a plan view, and is provided at two peripheral edges in the front-rear direction (X1-X2 direction) of the lid 2, and when calculated using the above values, the total area is 0.1 It is about 1 mm 2 .
  • a pressure introduction port 742 penetrating in the central portion of the sensor protection lid 741 is provided.
  • the pressure inlet 742 is a circle which is a radius of 1 ⁇ 5 of the width dimension of the housing 3 and calculated using the above values
  • the area of the pressure inlet 742 is about 0.12 to 1.1 mm 2 It is.
  • the total area of the gap 7 corresponds to the area of the circular pressure inlet 742 having a radius of 1 ⁇ 5 of the width dimension of the housing 3.
  • the width in the longitudinal direction of the gap 7 can be made as large as the width dimension of the housing 3, so the shorter width is about 0.1 to 0.3 mm Even if it is small, it is possible to increase the total area facing the outside of the gap 7.
  • pressure is introduced via a pressure inlet 742 formed at the center of the sensor protection lid 741, as shown in FIG.
  • the sensor protection cover 741 is fitted in and fixed to the device housing 711.
  • pressure is introduced through a gap 7 which is a gap between the housing 3 and the lid 2 formed by the dimensional tolerance between the housing 3 and the lid 2.
  • the pressure sensor device disclosed in Patent Document 1 in order to fit the sensor protection lid 741 into the device housing 711 and fix it, the dimension between the sensor protection lid 741 and the device housing 711 is used. It is necessary to set tolerances. Due to this dimensional tolerance, a gap is generated between the sensor protection lid 741 and the device housing 711. Therefore, the pressure sensor device disclosed in Patent Document 1 has a gap formed between the sensor protection lid 741 and the device housing 711 and a pressure introduction port 742. Note that an adhesive is embedded and fixed in a gap generated between the sensor protection lid 741 and the device housing 711.
  • the pressure introduction of the pressure sensor device 1 of the present embodiment is performed only by the gap 7 which is the gap between the housing 3 and the lid 2 formed by the dimensional tolerance between the housing 3 and the lid 2. Therefore, compared with the pressure sensor device disclosed in Patent Document 1, the pressure sensor device 1 of the present embodiment can reduce the planar size, and is excellent in miniaturization.
  • FIG. 10 shows a schematic plan view of a third modification to the first embodiment. In the present embodiment, only the pressure sensor 5 is installed in the cavity 8, but in the third modification, the pressure sensor 5 and the control circuit chip 11 are installed in the cavity 8.
  • the control circuit chip 815 is embedded in the mold resin body 813, the acoustic hole 812 communicating with the outside is only in the region of the lid 814 facing the recess 811. That is, it can be formed only in a part of the pressure sensor device.
  • the width of the gap 7 in the longitudinal direction is equal to the inner diameter of the cavity 8 which is a hollow state in which the control circuit chip 11 and the pressure sensor 5 are accommodated, It can be set to about the width dimension.
  • the third modified example of the present embodiment since the width in the longitudinal direction of the gap 7 can be set to about the width dimension of the pressure sensor device, even if the pressure sensor 5 is miniaturized, Patent Document 2 The planar size of the gap 7 does not decrease compared to the prior art. Therefore, the third modified example of the present embodiment has a large margin for the miniaturization of the pressure sensor device as compared with the prior art disclosed in Patent Document 2.
  • the area of the acoustic hole 812 facing the outside is preferably large.
  • Component mounting is generally performed by a chip mounter.
  • a component pressure sensor device 1 supplied from a supply device is adsorbed by a suction nozzle, picked up, transported to a predetermined position, and mounted on a mounting substrate.
  • the suction nozzle In order for the suction nozzle to be able to perform stable suction, the area of the suction port of the suction nozzle needs to be large, and the suction surface of the component is flat, and the suction position adjustment margin allows the component suction Preferably, the surface to be treated is large.
  • the volume at which the adsorption nozzle exhausts the gas for adsorption be small.
  • the pressure sensor device disclosed in Patent Document 2 has an acoustic hole 812 penetrating the lid 814
  • the pressure introduction of the pressure sensor device 1 of the present embodiment has a dimensional tolerance between the housing 3 and the lid 2
  • the pressure sensor device 1 is excellent in miniaturization.
  • the lid 2 does not have a through hole such as the acoustic hole 812 disclosed in Patent Document 2, the suction position of the suction nozzle is restricted within the lid 2. Since the position of the suction nozzle can be easily adjusted, the component mounting of the pressure sensor device 1 can be simplified as compared with the prior art.
  • the suction nozzle does not have a suction nozzle when suctioning the pressure sensor device 1. If a small volume consisting of the surface of the lid 2 is exhausted, adsorption is possible, and the conveyance time of component mounting of the pressure sensor device 1 is shortened as compared with the prior art.
  • the upper surface 2 a of the lid 2 facing outward is formed flat. Therefore, since the flat upper surface 2a is adsorbed, a sufficient adsorption power can be stably obtained by the adsorption nozzle.
  • a pressure sensor device that is easy to mount components, has a short conveyance time for component mounting, is low in cost, and is excellent in miniaturization.
  • FIG. 5 is a schematic view for explaining the manufacturing method of the first embodiment. Below, FIG. 5 demonstrates the manufacturing method of the pressure sensor apparatus 1 of this embodiment.
  • a housing substrate 20 in which a plurality of housings 3 arranged at a constant pitch and a lead frame are integrated is manufactured by insert molding.
  • a plurality of lead terminals 21 are integrally formed in each housing 3.
  • one end of each lead terminal 21 is in the cavity 8 of the housing 3 and constitutes each housing electrode 21 a on the upper surface 3 c of the bottom wall 3 a.
  • thermosetting resin 23 is applied to a predetermined area of the upper surface 3c of the bottom wall 3a of each housing 3 by a dispenser 22 of an application device.
  • the pressure sensor 5 is placed at the position where the thermosetting resin 23 is applied, and heating is performed for 30 minutes to 2 hours at a temperature of 100 ° C. to 250 ° C.
  • the curable resin 23 is cured to fix the pressure sensor 5 on the upper surface 3c.
  • each pad electrode (not shown) provided on the upper surface of the pressure sensor 5 and each housing electrode 21a provided on the upper surface 3c of the bottom wall 3a of the housing 3 It is electrically connected by the bonding wire 24.
  • the liquid thermosetting resin 9 is applied to the step surfaces 10a and 10b provided on the side wall 3b of each housing 3 by a dispenser 25.
  • the potting resin 27 in liquid form is dropped onto the pressure sensor 5, the bonding wire 24 and the like from the opening 4 which is formed in the upper portion of the housing 3 by being surrounded by the side wall 3 b by the dispenser 26.
  • the lid 2 is placed on the step surfaces 10a and 10b of the respective housings 3 so that predetermined portions overlap each other.
  • thermosetting resin 9 is cured, and the lid 2 is fixedly attached to the step surfaces 10a and 10b.
  • the liquid potting resin 27 is changed to a flexible and low elastic resin, covers the pressure sensor 5, the bonding wire 24 and the like, and protects them.
  • the lead terminals 21 (housing substrate 20) are cut by a slicing apparatus or the like to be singulated and a plurality of pressure sensor devices 1 Is produced.
  • the potting resin is preferably a compound mainly composed of an epoxy resin, a melamine resin, a polyimide resin, a silicone resin, a urethane resin, a polyester resin, or a fluorine-based resin.
  • it is a compound which uses as a main material either an epoxy resin which is especially excellent in water resistance, or a melamine resin as a thermosetting resin. It is also possible to use compounds based on any of other phenol resins and polyester resins.
  • each lid 2 does not have a pressure introduction port. That is, there is a margin to increase the area of the suction port of the suction nozzle and a margin to reduce the planar size of each lid 2, and it is possible to provide stable component mounting of each lid 2 without component falling etc.
  • the component mounting of each lid 2 is simplified. As a result, the pressure sensor device 1 is excellent in miniaturization.
  • the lid 7 covers the opening 4 which has a rectangular shape in a plan view, and the gap 7 has two peripheral edges in the front and back (X1-X2 direction) of the lid 2. It is provided.
  • the gap 7 need not be limited to this, and a first modification of the present embodiment is shown in FIGS. 6 and 7.
  • FIG. 6 is a schematic plan view of a first modification to the first embodiment.
  • FIG. 7 is a schematic plan view seen through the lid of the first modification.
  • the gap 7 extends from the two front and rear (X1-X2 direction) peripheral edges of the lid 2 to the two left and right (Y1-Y2 direction) peripheral edges of the lid 2. Is configured.
  • the lid 2 is placed on the step surfaces 10 a and 10 b formed on the side wall 3 b of the housing 3, and is fixed to the housing 3 by a thermosetting resin.
  • the gap 7 is provided to penetrate between the side surface of the lid 2 and the inner peripheral surface of the side wall 3b.
  • the area (in plan view) of the gap 7 can be increased, so that a pressure sensor device that can detect external pressure with good response is possible.
  • FIG. 8 is a schematic plan view of a second modification to the first embodiment.
  • FIG. 9 is a schematic plan view seen through the lid of the second modified example.
  • the gaps 7 are provided at the two front and rear (X1-X2 direction) peripheral edges of the lid 2.
  • the length in the left-right direction (Y1-Y2 direction) of the gap 7 is shorter than that in the first embodiment.
  • the gap 7 is provided so as to penetrate between the side surface of the lid 2 and the inner peripheral surface of the side wall 3b.
  • the area (plan view) of the step surfaces 10a and 10b can be increased. Further, the lid 2 is placed on the step surfaces 10a and 10b, and is fixed to the housing 3 by a thermosetting resin. Therefore, since the area to which the lid 2 and the housing 3 are adhered can be increased, the lid 2 is firmly fixed to the housing 3.
  • gap 7 was provided in two to four peripheral edges of lid 2, it is not limited to this.
  • the pressure sensor device of the present embodiment is rectangular in plan view, it is not limited thereto.
  • a polygon, a circle, an ellipse, etc. are also possible by planar view.
  • the gap 7 can be provided along the periphery of the shape.
  • FIG. 11 is a schematic plan view of a pressure sensor device according to a second embodiment.
  • FIG. 12 is a schematic cross-sectional view taken along the line DD shown in FIG. 11 of the second embodiment and viewed from the arrow direction.
  • FIG. 13 is a schematic cross-sectional view taken along the line CC shown in FIG. 11 of the second embodiment and viewed from the arrow direction.
  • FIG. 14 is a schematic plan view seen through the lid of the pressure sensor device according to the second embodiment shown in FIG.
  • the gaps 7 are provided at the two front and rear (X1-X2 direction) peripheral edges of the lid 2.
  • the cross-sectional shape of the gap 7 is L-shaped as shown in FIG.
  • a step 10c (including a hatched area and a hatched area) is formed on the side wall 3b in a circulating manner.
  • an L-shaped notch 30 is formed on the side wall 3b by the step 10c.
  • the gap 7 having an L-shaped cross section is formed from the side surface and the lower surface of the lid 2 and the L-shaped notch 30.
  • the gap 7 on the lower surface side of the lid 2 is formed with a film thickness of the thermosetting resin 9 that fixes the lid 2 and the housing 3.
  • the thermosetting resin 9 is applied, for example, on the left and right (Y1-Y2 direction) two portions of the step 10c, which is the hatched area shown in FIG. 14, around the notches 3f and 3g. Provided.
  • the gap 7 on the lower surface side of the lid 2 is formed to have a film thickness of the thermosetting resin 9, but is not limited to this.
  • the step may be formed so that the hatched area of the step 10c is higher than the non-hatched area of the step 10c.
  • the gaps 7 are provided at the two peripheral edges in the front and rear (in the X1-X2 direction) of the lid 2.
  • a pressure introduction port 742 is provided directly above the sensor chip 721.
  • the acoustic hole 812 is provided almost immediately above the microphone chip 810. Therefore, when the external pressure changes with a large fluctuation range or suddenly changes, in the prior art, the impact generated by such external pressure change is concentrated and applied to the diaphragm which is the sensitive part and broken. was there.
  • the gap 7 is dispersed in the two front and rear (X1-X2 direction) peripheries of the lid 2 and is provided in an elongated shape. Therefore, the impact generated by the external pressure change as described above is suppressed and transmitted to the diaphragm 6 which is the sensitive part.
  • the L-shape of the gap 7 further suppresses the impact, and the damage of the diaphragm 6, which is the sensitive portion, is suppressed.
  • a pressure sensor device may be used in a tire pressure monitoring system that monitors tire pressure or abnormality thereof, so-called TPMS (Tire Pressure Monitoring System). At that time, the impact caused by the tire being punctured may be propagated, and damage such as a crack or a crack may occur in the diaphragm 6.
  • TPMS Transire Pressure Monitoring System
  • the L-shaped gap 7 prevents the entry of foreign matter into the cavity 8 in which the pressure sensor 5 is accommodated from the outside due to the L-shape with respect to the linear gap 7 of the first embodiment. It will come out.
  • FIG. 15 is a schematic plan view of a pressure sensor device according to a third embodiment.
  • FIG. 16 is a schematic plan view seen through the lid of the pressure sensor device according to the third embodiment shown in FIG.
  • FIG. 17 is a schematic cross-sectional view taken along the line EE shown in FIG. 15 of the third embodiment and viewed from the arrow direction.
  • thermosetting resin 9 is applied to the shaded area which is the upper surface of the side wall 3b, and the lid 2 is fixed to the housing 3 and attached.
  • the gap 7 is formed on the two peripheral edges in the front and rear (in the X1-X2 direction) as a gap between the lower surface of the lid 2 and the upper surface of the side wall 3b.
  • the gap 7 is formed to have a film thickness of the thermosetting resin 9, but the present invention is not limited to this.
  • the upper surface of the side wall 3b may be provided with a step so that the upper surface of the side wall 3b is higher than the non-hatched region.
  • the gap 7 is not formed on the upper surface of the pressure sensor device, and the lid 2 covers the region including the upper surface of the side wall 3b of the pressure sensor device. .
  • This is a structure which can ensure large area which a suction nozzle adsorbs
  • FIG. 18 is a schematic plan view of a pressure sensor device according to a fourth embodiment.
  • FIG. 19 is a schematic plan view of the lid of the fourth embodiment as seen through.
  • FIG. 20 is a schematic cross-sectional view taken along the line FF shown in FIG. 18 according to the fourth embodiment and viewed from the arrow direction.
  • thermosetting resin 9 is applied to the hatched area which is the upper surface of the side wall 3b, and the lid 2 is fixed to the housing 3 and attached.
  • the gap 7 is located in the left and right (Y1-Y2 direction) located on the side of the rectangular cavity 8 formed by the side surface of the lid 2 at the two front and rear (X1-X2 direction) peripheral edges.
  • the side 3h extending in the Y1-Y2 direction and located on the side of the rectangular cavity 8 formed by the upper surface of the side wall 3b.
  • a pressure introducing port 742 is formed in the sensor protection cover 741, and an acoustic hole 812 is formed in the cover 814, respectively.
  • the distance separating the pressure inlet 742 and the acoustic hole 812 from each other is the thickness of the sensor protection lid 741 and the lid 814, respectively.
  • the gap 7 according to the present embodiment is a gap formed by the side 2 f and the side 3 h, the distance separating the gap 7 from the outside is shorter than the distance separating from the outside of the prior art. Is possible.
  • the distance between the outside of the gap 7 and the cavity 8 can be set very narrow, so that the change in the external pressure is propagated to the diaphragm 6 serving as the sensitive part while the time delay is suppressed.
  • the structure of the present embodiment is suitable for applications where external pressure is required to be detected without time delay, particularly in the acoustic field.
  • FIG. 21 shows a modification of the fourth embodiment.
  • FIG. 21 is a schematic cross-sectional view taken along the line FF shown in FIG. 18 of the fourth embodiment and viewed from the arrow direction.
  • the lid 2 has the flange 2 e outside the gap 7.
  • the distance between the lower surface of the flange portion 2e and the upper surface of the side wall 3b is set to a sufficient distance so that the propagation of the external pressure is not delayed at this point.
  • the lid 2 covers up to a region including the upper surface of the side wall 3 b of the pressure sensor device.
  • This is the structure which can ensure large area which a suction nozzle adsorbs
  • FIG. 19 the pad electrode, the housing electrode, the bonding wire and the like are not shown.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

La présente invention concerne un appareil de détection de pression dont la taille et les coûts de fabrication sont réduits et dont les composants sont montés d'une manière simple et présentent un temps de transfert raccourci. L'appareil de détection de pression (1) selon l'invention comprend un capteur de pression (5) qui détecte une pression externe, un logement (3) qui contient le capteur de pression (5), un corps de couvercle (2) fixé au logement (3), et un orifice d'introduction de pression permettant l'entrée d'une pression externe. L'orifice d'introduction de pression est un espace (7) formé entre le corps de couvercle (2) et le logement (3) quand le corps de couvercle (2) et le logement (3) sont fixés l'un à l'autre.
PCT/JP2012/077426 2011-11-04 2012-10-24 Appareil de détection de pression WO2013065540A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013541723A JP5756181B2 (ja) 2011-11-04 2012-10-24 圧力センサ装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-242532 2011-11-04
JP2011242532 2011-11-04

Publications (1)

Publication Number Publication Date
WO2013065540A1 true WO2013065540A1 (fr) 2013-05-10

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JP (1) JP5756181B2 (fr)
WO (1) WO2013065540A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014085289A (ja) * 2012-10-26 2014-05-12 Murata Mfg Co Ltd 半導体圧力センサ
JP2018054369A (ja) * 2016-09-27 2018-04-05 京セラ株式会社 圧力検知素子搭載用パッケージ、圧力検知装置および電子モジュール
JP2018517572A (ja) * 2015-04-13 2018-07-05 Tdk株式会社 Ｍｅｍｓセンサ部品
JP2019109197A (ja) * 2017-12-20 2019-07-04 オムロン株式会社 圧力センサおよび圧力センサを備えた移動装置
WO2024075462A1 (fr) * 2022-10-03 2024-04-11 ローム株式会社 Capteur de pression

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004301553A (ja) * 2003-03-28 2004-10-28 Denso Corp 圧力検出装置
JP2008026080A (ja) * 2006-07-19 2008-02-07 Matsushita Electric Works Ltd 圧力センサ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010281569A (ja) * 2007-09-25 2010-12-16 Alps Electric Co Ltd 圧力センサ用パッケージ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004301553A (ja) * 2003-03-28 2004-10-28 Denso Corp 圧力検出装置
JP2008026080A (ja) * 2006-07-19 2008-02-07 Matsushita Electric Works Ltd 圧力センサ

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014085289A (ja) * 2012-10-26 2014-05-12 Murata Mfg Co Ltd 半導体圧力センサ
JP2018517572A (ja) * 2015-04-13 2018-07-05 Tdk株式会社 Ｍｅｍｓセンサ部品
JP2018054369A (ja) * 2016-09-27 2018-04-05 京セラ株式会社 圧力検知素子搭載用パッケージ、圧力検知装置および電子モジュール
JP2019109197A (ja) * 2017-12-20 2019-07-04 オムロン株式会社 圧力センサおよび圧力センサを備えた移動装置
WO2024075462A1 (fr) * 2022-10-03 2024-04-11 ローム株式会社 Capteur de pression

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JPWO2013065540A1 (ja) 2015-04-02

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