JPWO2013065540A1 - 圧力センサ装置 - Google Patents
圧力センサ装置 Download PDFInfo
- Publication number
- JPWO2013065540A1 JPWO2013065540A1 JP2013541723A JP2013541723A JPWO2013065540A1 JP WO2013065540 A1 JPWO2013065540 A1 JP WO2013065540A1 JP 2013541723 A JP2013541723 A JP 2013541723A JP 2013541723 A JP2013541723 A JP 2013541723A JP WO2013065540 A1 JPWO2013065540 A1 JP WO2013065540A1
- Authority
- JP
- Japan
- Prior art keywords
- pressure sensor
- lid
- sensor device
- housing
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 238000001514 detection method Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
各図に示す圧力センサ装置に関しては、Y方向が左右方向であり、Y1方向が左方向でY2方向が右方向、X方向が前後方向であり、X1方向が前方向でX2方向が後方向である。また、X方向とY方向の双方に直交する方向が上下方向(Z方向;高さ方向)であり、Z1方向が上方向でZ2方向が下方向である。なお、各図面は、見やすくするために寸法を適宜異ならせて図示されている。
図11は、第2の実施形態である圧力センサ装置の平面略図である。図12は、第2の実施形態の図11に示すD−D線に沿って切断し矢印方向から視る断面略図である。図13は、第2の実施形態の図11に示すC−C線に沿って切断し矢印方向から視る断面略図である。図14は、図11に示す第2の実施形態である圧力センサ装置の蓋体を透視して視る平面略図である。
図15は、第3の実施形態である圧力センサ装置の平面略図である。図16は、図15に示す第3の実施形態である圧力センサ装置の蓋体を透視して視る平面略図である。図17は、第3の実施形態の図15に示すE−E線に沿って切断し矢印方向から視る断面略図である。
図18は、第4の実施形態である圧力センサ装置の平面略図である。図19は、第4の実施形態の蓋体を透視して視る平面略図である。図20は、第4の実施形態である図18に示すF−F線に沿って切断し矢印方向から視る断面略図である。
2 蓋体
3 ハウジング
4 開口部
5 圧力センサ
6 ダイヤフラム
7 間隙
8 キャビティ
9、23 熱硬化性樹脂
10 段差面
11 制御回路チップ
Claims (5)
- 外部の圧力を検知する圧力センサと、
前記圧力センサを収納するハウジングと、
前記ハウジングに固定される蓋体と、
前記外部の圧力を導入する圧力導入部と、
を有し、
前記圧力導入部が、前記蓋体と前記ハウジングとが固定された状態で、前記蓋体と前記ハウジングとの間に形成される間隙であることを特徴とする圧力センサ装置。 - 前記ハウジングが、前記圧力センサが固着される底壁と、前記底壁の周縁に立設される側壁と、前記側壁の上面に囲まれて形成される開口部と、を有して構成され、
前記蓋体が前記開口部に覆設されてなり、前記蓋体の周縁に前記間隙が形成されることを特徴とする請求項1に記載の圧力センサ装置。 - 前記蓋体が表裏面及び側面を有して構成され、前記表裏面の一方の面が外方に面してなり、前記蓋体の前記側面と前記側壁の内周面との間に前記間隙が貫設されてなることを特徴とする請求項2に記載の圧力センサ装置。
- 前記蓋体が表裏面及び側面を有して構成され、前記表裏面の一方の面が外方に面してなり、前記表裏面の他方の面と前記側壁の上面との間に前記間隙が貫設されてなることを特徴とする請求項2に記載の圧力センサ装置。
- 前記表裏面の一方の面が平坦であることを特徴とする請求項3または請求項4に記載の圧力センサ装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013541723A JP5756181B2 (ja) | 2011-11-04 | 2012-10-24 | 圧力センサ装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011242532 | 2011-11-04 | ||
JP2011242532 | 2011-11-04 | ||
PCT/JP2012/077426 WO2013065540A1 (ja) | 2011-11-04 | 2012-10-24 | 圧力センサ装置 |
JP2013541723A JP5756181B2 (ja) | 2011-11-04 | 2012-10-24 | 圧力センサ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013065540A1 true JPWO2013065540A1 (ja) | 2015-04-02 |
JP5756181B2 JP5756181B2 (ja) | 2015-07-29 |
Family
ID=48191894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013541723A Active JP5756181B2 (ja) | 2011-11-04 | 2012-10-24 | 圧力センサ装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5756181B2 (ja) |
WO (1) | WO2013065540A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014085289A (ja) * | 2012-10-26 | 2014-05-12 | Murata Mfg Co Ltd | 半導体圧力センサ |
US20160297671A1 (en) * | 2015-04-13 | 2016-10-13 | Epcos Ag | MEMS Sensor Component |
JP6737675B2 (ja) * | 2016-09-27 | 2020-08-12 | 京セラ株式会社 | 圧力検知素子搭載用パッケージ、圧力検知装置および電子モジュール |
JP6863266B2 (ja) * | 2017-12-20 | 2021-04-21 | オムロン株式会社 | 圧力センサおよび圧力センサを備えた移動装置 |
WO2024075462A1 (ja) * | 2022-10-03 | 2024-04-11 | ローム株式会社 | 圧力センサ |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004301553A (ja) * | 2003-03-28 | 2004-10-28 | Denso Corp | 圧力検出装置 |
JP2008026080A (ja) * | 2006-07-19 | 2008-02-07 | Matsushita Electric Works Ltd | 圧力センサ |
JP2010281569A (ja) * | 2007-09-25 | 2010-12-16 | Alps Electric Co Ltd | 圧力センサ用パッケージ |
-
2012
- 2012-10-24 WO PCT/JP2012/077426 patent/WO2013065540A1/ja active Application Filing
- 2012-10-24 JP JP2013541723A patent/JP5756181B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004301553A (ja) * | 2003-03-28 | 2004-10-28 | Denso Corp | 圧力検出装置 |
JP2008026080A (ja) * | 2006-07-19 | 2008-02-07 | Matsushita Electric Works Ltd | 圧力センサ |
JP2010281569A (ja) * | 2007-09-25 | 2010-12-16 | Alps Electric Co Ltd | 圧力センサ用パッケージ |
Also Published As
Publication number | Publication date |
---|---|
WO2013065540A1 (ja) | 2013-05-10 |
JP5756181B2 (ja) | 2015-07-29 |
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