WO2012176608A1 - 積層体の製造方法 - Google Patents

積層体の製造方法 Download PDF

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Publication number
WO2012176608A1
WO2012176608A1 PCT/JP2012/064325 JP2012064325W WO2012176608A1 WO 2012176608 A1 WO2012176608 A1 WO 2012176608A1 JP 2012064325 W JP2012064325 W JP 2012064325W WO 2012176608 A1 WO2012176608 A1 WO 2012176608A1
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WO
WIPO (PCT)
Prior art keywords
substrate
resin layer
grinding
support plate
laminate
Prior art date
Application number
PCT/JP2012/064325
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
明 我妻
Original Assignee
旭硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to JP2013521516A priority Critical patent/JP5907168B2/ja
Priority to CN201280030458.0A priority patent/CN103619536B/zh
Priority to KR1020137033984A priority patent/KR101895098B1/ko
Publication of WO2012176608A1 publication Critical patent/WO2012176608A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/204—Plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED

Definitions

  • the present invention relates to a method for manufacturing a laminate.
  • LCDs liquid crystal displays
  • PDPs plasma displays
  • OLEDs organic EL displays
  • other display panels solar cells
  • thin film secondary batteries are required to be thinner and lighter. Thinning of substrates used in devices is progressing. If the rigidity of the substrate is reduced by thinning, the handling property of the substrate is deteriorated. In addition, if the thickness of the substrate changes due to the thin plate, it becomes difficult to manufacture an electronic device using existing equipment.
  • a reinforcing plate is attached to the substrate to form a laminate block, a predetermined functional layer (for example, a conductive layer) is formed on the substrate of the laminate block, and then the reinforcing plate is peeled from the substrate of the laminate block.
  • a method has been proposed (see, for example, Patent Document 1). According to this method, the handling property of the substrate can be ensured, and a thin electronic device using existing equipment can be manufactured.
  • the reinforcing plate has a resin layer that is detachably bonded to the substrate and a support plate that supports the substrate via the resin layer.
  • the resin layer is formed by applying a fluid resin composition on a support plate and curing it.
  • the resin composition is, for example, a silicone resin composition, which includes a linear polyorganosiloxane having a vinyl group and a methyl hydrogen polysiloxane having a hydrosilyl group, and is heat-cured in the presence of a platinum catalyst.
  • the A resin layer made of a cured product of this resin composition is excellent in heat resistance and easy peelability.
  • FIG. 6 is a side view of a conventional laminate block.
  • the stacked body block 111 includes a substrate 112 and a reinforcing plate 113 that reinforces the substrate 112.
  • the reinforcing plate 113 includes a resin layer 114 that is detachably coupled to the substrate 112 and a support plate 115 that supports the substrate 112 via the resin layer 114.
  • the side edges of the laminate block 111 are chamfered.
  • FIG. 7 is a plan view showing a method of chamfering the side edge of the laminate block shown in FIG.
  • FIG. 8 is a side view showing a method of chamfering the side edge portion of the laminate block shown in FIG.
  • the side edge 111a of the laminated body block 111 is ground with the grindstone 121.
  • the grindstone 121 is a disk-shaped rotary grindstone, and a grinding groove 122 (FIG. 8) is formed on the outer peripheral surface 121 a over the entire circumference.
  • the grindstone 121 is rotated in the circumferential direction of the grindstone 121 (X direction in FIG. 7) while the wall surface 122a of the grinding groove 122 and the side edge 111a of the laminate block 111 are in contact with each other.
  • the side edge 111a of the laminated body block 111 is ground to the same shape as the grinding groove 122 by being relatively moved (Y direction in FIG. 7).
  • the wall surface 122a which is a grinding surface is in perpendicular contact with the interface 116 between the resin layer 114 and the substrate 112 and the interface 117 between the resin layer 114 and the support plate 115.
  • at least one corner of the substrate 112 and the support plate 115 may be missing in the vicinity of at least one of the interface 116 and the interface 117.
  • microcracks 118 are generated on the side surfaces of the laminated body block 111 by the abrasive grains contained in the wall surface 122a, and the microcracks 118 reach at least one of the interface 116 and the interface 117. As shown in FIG. 8, the microcracks 118 tend to extend obliquely with respect to the wall surface 122a.
  • FIG. 9 is a side view of the laminate obtained by chamfering the side edges of the laminate block shown in FIG.
  • the state of the laminated body block before grinding is shown by a two-dot chain line.
  • the laminate 131 obtained by grinding the side edge portion 111a of the laminate block 111 includes a substrate 132 and a reinforcing plate 133.
  • the reinforcing plate 133 includes a resin layer 134 and a support plate. 135.
  • a recess 139 is formed on the side surface of the laminated body 131 by the microcracks 118 (FIG. 8) generated during grinding.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a method of manufacturing a laminate that can reduce the occurrence of chipping due to grinding.
  • the present invention provides: A laminate block side having a substrate and a reinforcing plate that reinforces the substrate, the reinforcing plate releasably coupled to the substrate, and a support plate that supports the substrate through the resin layer A method for producing a laminate, which obtains a laminate by chamfering an edge, A grinding step of grinding a side edge of the laminate block with a grindstone, wherein the grinding surface of the grindstone is an interface between the resin layer and the substrate, and the resin layer and the support plate.
  • abuts diagonally with respect to an interface with is provided.
  • FIG. 1 is a side view of a laminate block used in a laminate production method according to an embodiment of the present invention.
  • FIG. 2 is a plan view showing a method for manufacturing a laminate according to an embodiment of the present invention.
  • FIG. 3 is a side view showing a method for manufacturing a laminate according to an embodiment of the present invention.
  • FIG. 4 is a side view of a laminate obtained by the laminate production method according to an embodiment of the present invention.
  • FIG. 5A is a side view (1) illustrating an example of a relationship between an angle formed by a wall surface that is a grinding surface and an interface and an offset amount.
  • FIG. 5B is a side view (2) illustrating an example of a relationship between an angle formed by a wall surface serving as a grinding surface and an interface and an offset amount.
  • FIG. 5A is a side view (1) illustrating an example of a relationship between an angle formed by a wall surface that is a grinding surface and an interface and an offset amount.
  • FIG. 5B is a side view
  • FIG. 5C is a side view (3) illustrating an example of a relationship between an angle formed by a wall surface serving as a grinding surface and an interface and an offset amount.
  • FIG. 6 is a side view of a conventional laminate block.
  • FIG. 7 is a plan view showing a method of chamfering the side edge of the laminate block shown in FIG.
  • FIG. 8 is a side view showing a method of chamfering the side edge portion of the laminate block shown in FIG.
  • FIG. 9 is a side view of the laminate obtained by chamfering the side edges of the laminate block shown in FIG.
  • FIG. 1 is a side view of a laminate block used in a laminate production method according to an embodiment of the present invention.
  • the laminate block 11 includes a substrate 12 and a reinforcing plate 13 that reinforces the substrate 12.
  • the reinforcing plate 13 includes a resin layer 14 that is detachably coupled to the substrate 12 and a support plate 15 that supports the substrate 12 via the resin layer 14.
  • the side surface of the substrate 12, the side surface of the resin layer 14, and the side surface of the support plate 15 are flush with each other.
  • the laminated body block 11 is used for manufacturing a product having the substrate 12 as a part of the product structure after being processed by a processing method described later.
  • the reinforcing plate 13 is peeled off from the substrate 12 during the product manufacturing process and does not become a part of the product structure.
  • Examples of the product include electronic devices such as a display panel, a solar battery, and a thin film secondary battery.
  • the laminated body block 11 manufactures an electronic device using a processing facility for processing a conventional substrate (a substrate not reinforced by a reinforcing plate), the laminate block 11 may have substantially the same thickness as the conventional substrate.
  • the manufacturing process of the current electronic device is designed to process a substrate having a thickness of 0.5 mm, and the sum of the thickness of the substrate 12 and the thickness of the resin layer 14 is 0.1 mm, The thickness of the support plate 15 is 0.4 mm.
  • the substrate 12 is a substrate for an electronic device.
  • a predetermined functional layer for example, a conductive layer
  • the type of functional layer is selected according to the type of electronic device, and a plurality of functional layers may be sequentially stacked on the substrate 12.
  • the type of the substrate 12 is not particularly limited, and examples thereof include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.
  • a glass substrate is preferable. This is because the glass substrate is excellent in chemical resistance and moisture permeability resistance and has a small linear expansion coefficient. When the linear expansion coefficient is large, the manufacturing process of the electronic device often involves heat treatment, and various inconveniences are likely to occur. For example, if the substrate 12 on which a TFT (thin film transistor) is formed is cooled under heating, the positional displacement of the TFT may be excessive due to thermal contraction of the substrate 12.
  • TFT thin film transistor
  • the glass substrate is obtained by melting a glass raw material and molding the molten glass into a plate shape.
  • a molding method may be a general one, and for example, a float method, a fusion method, a slot down draw method, a full call method, a rubber method, or the like is used.
  • a glass substrate having a particularly small thickness can be obtained by heating a glass once formed into a plate shape to a moldable temperature and stretching it by means of stretching or the like to make it thin (redraw method).
  • the glass of the glass substrate is not particularly limited, and examples thereof include non-alkali glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly composed of silicon oxide.
  • oxide-based glass a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.
  • the glass of the glass substrate glass suitable for the type of electronic device and its manufacturing process is preferably adopted.
  • the glass substrate for liquid crystal displays consists of glass (alkali-free glass) which does not contain an alkali metal component substantially.
  • the glass of the glass substrate is appropriately selected based on the type of electronic device to be applied and its manufacturing process.
  • the resin of the resin substrate may be a crystalline resin or an amorphous resin, and is not particularly limited.
  • the crystalline resin examples include thermoplastic resins such as polyamide, polyacetal, polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, or syndiotactic polystyrene.
  • Thermosetting resins include polyphenylene sulfide and polyether ether. Examples include ketones, liquid crystal polymers, fluororesins, and polyether nitriles.
  • non-crystalline resin examples include thermoplastic resins such as polycarbonate, modified polyphenylene ether, polycyclohexene, and polynorbornene-based resins.
  • Thermosetting resins include polysulfone, polyethersulfone, polyarylate, and polyamideimide. , Polyetherimide, or thermoplastic polyimide.
  • an amorphous thermoplastic resin is particularly preferable.
  • the thickness of the substrate 12 is set according to the type of the substrate 12.
  • a glass substrate it is preferably 0.7 mm or less, more preferably 0.3 mm or less, and still more preferably 0.1 mm or less for reducing the weight and thickness of the electronic device. If it exceeds 0.7 mm, the glass substrate cannot be reduced in thickness and / or reduced in weight. In the case of 0.3 mm or less, it is possible to give good flexibility to the glass substrate. In the case of 0.1 mm or less, the glass substrate can be wound into a roll. Further, the thickness of the glass substrate is preferably 0.03 mm or more for reasons such as easy manufacture of the glass substrate and easy handling of the glass substrate.
  • the close contact means to be detachable.
  • detachable bonding means that the substrate 12 can be peeled from the resin layer 14 without peeling the support plate 15 from the resin layer 14 when the substrate 12 is peeled from the resin layer 14. That is, it means that the bonding force between the support plate 15 and the resin layer 14 is larger than the bonding force between the substrate 12 and the resin layer 14.
  • the resin layer 14 is formed so that the bonding force with the support plate 15 is relatively higher than the bonding force with the substrate 12 (details of the forming method will be described later). Thereby, it is possible to prevent the laminate block 11 from being peeled at an unintended position (between the resin layer 14 and the support plate 15) when the peeling operation is performed.
  • the initial peel strength between the resin layer 14 and the substrate 12 is set according to the manufacturing process of the electronic device.
  • the lower limit of the initial peel strength is 0.3 N / 25 mm, preferably 0 in the following peel test.
  • the upper limit of the initial peel strength is 10 N / 25 mm, preferably 5 N / 25 mm.
  • “initial peel strength” refers to the peel strength immediately after production of the laminate block 11 and refers to the peel strength measured at room temperature.
  • the initial peel strength is 0.3 N / 25 mm or more, unintended separation can be sufficiently limited.
  • the initial peel strength is 10 N / 25 mm or less, it is easy to peel the resin layer 14 from the substrate 12 when the positional relationship between the resin layer 14 and the substrate 12 is corrected.
  • the peel test is represented by the following measurement method.
  • the center portion of the protruding support plate (25 ⁇ 25 mm in width) Push up vertically using a digital force gauge and measure peel strength.
  • the peel strength after heating between the resin layer 14 and the substrate 12 depends on the manufacturing process of the electronic device, but is preferably 8.5 N / 25 mm or less in the peel test, for example, 7.8 N / 25 mm or less is more preferable, and 4.5 N / 25 mm or less is further preferable.
  • the “peel strength after heating” refers to the peel strength measured at room temperature after the resin layer 14 is heated at 350 ° C. (corresponding to the formation temperature of the amorphous silicon layer constituting the thin film transistor).
  • the peel strength after heating is 0.3 N / 25 mm or more, unintended separation can be sufficiently limited. On the other hand, when the peel strength after heating is 10 N / 25 mm or less, it becomes easy to peel the resin layer 14 from the substrate 12.
  • the resin of the resin layer 14 is not particularly limited.
  • examples of the resin of the resin layer 14 include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a silicone resin, and a polyimide silicone resin.
  • resins can be mixed and used. Of these, silicone resins and polyimide silicone resins are preferred from the viewpoints of heat resistance and peelability.
  • the thickness of the resin layer 14 is not particularly limited, but is preferably 1 to 50 ⁇ m, more preferably 5 to 30 ⁇ m, and still more preferably 7 to 20 ⁇ m.
  • the thickness of the resin layer 14 is 50 ⁇ m or less, it is economical because the formation time of the resin layer 14 can be shortened and the resin of the resin layer 14 is not used more than necessary.
  • the resin layer 14 may be composed of two or more layers.
  • the thickness of the resin layer means the total thickness of all the resin layers.
  • the kind of resin forming each layer may be different.
  • the support plate 15 supports and reinforces the substrate 12 through the resin layer 14.
  • the support plate 15 prevents the substrate 12 from being deformed, scratched or broken in the manufacturing process of the electronic device.
  • the type of the support plate 15 is not particularly limited, and for example, a glass plate, a ceramic plate, a resin plate, a semiconductor plate, a metal plate, a glass / resin composite plate, or the like is used.
  • the type of the support plate 15 is selected according to the type of the electronic device, the type of the substrate 12, and the like. If the type is the same as the substrate 12, the difference in thermal expansion between the support plate 15 and the substrate 12 is small. Can be suppressed.
  • the difference (absolute value) in the average linear expansion coefficient between the support plate 15 and the substrate 12 is appropriately set according to the outer shape of the substrate 12 and the like, but is preferably 35 ⁇ 10 ⁇ 7 / ° C. or less, for example.
  • the “average linear expansion coefficient” refers to an average linear expansion coefficient (JIS R 3102: 1995) in a temperature range of 50 to 300 ° C.
  • the thickness of the support plate 15 is not particularly limited, and is preferably 0.7 mm or less in order to adapt the laminate block 11 to existing processing equipment.
  • the thickness of the support plate 15 is preferably 0.4 mm or more in order to reinforce the substrate 12.
  • the support plate 15 may be thicker than the substrate 12 or thinner.
  • a resin composition having fluidity is applied on a support plate 15 and cured to form a resin layer 14, and then a substrate 12 is placed on the resin layer 14.
  • a resin composition having fluidity is applied onto a predetermined substrate and cured to form a resin layer 14, and then the resin layer 14 is peeled off from the predetermined substrate.
  • a method of sandwiching and pressing between the substrate 12 and the support plate 15 (3) a method of forming the resin layer 14 by sandwiching the resin composition between the substrate 12 and the support plate 15, and the like. There is.
  • the bond strength between the support plate 15 and the resin layer 14 is the bond strength between the resin layer 14 and the substrate 12. More likely to be higher.
  • the method (2) is effective when the bonding strength of the resin layer 14 after pressure bonding is low with respect to the substrate 12 and high with respect to the support plate 15.
  • the surface of the substrate 12 or the support plate 15 may be surface-treated to make a difference in the bonding strength after the pressure bonding with the resin layer 14.
  • the method (3) is effective when the bonding strength of the resin composition after curing is low with respect to the substrate 12 and high with respect to the support plate 15.
  • the surface of the substrate 12 or the support plate 15 may be surface-treated to make a difference in the bonding strength after curing of the resin composition.
  • the type of the resin composition is not particularly limited.
  • the resin composition is classified into a condensation reaction type, an addition reaction type, an ultraviolet curable type, and an electron beam curable type depending on the curing mechanism, and any of them can be used.
  • the addition reaction type is preferable. This is because the curing reaction is easy, the degree of peelability is good when the resin layer 14 is formed, and the heat resistance is also high.
  • the resin composition is classified into a solvent type, an emulsion type, and a solventless type depending on the form, and any of them can be used.
  • a solventless type is preferable.
  • productivity and environmental characteristics are excellent.
  • bubbles do not easily remain in the resin layer 14 because the resin layer 14 does not include a solvent that causes foaming during curing when the resin layer 14 is formed, that is, heat curing, ultraviolet curing, or electron beam curing. It is.
  • silicone resin composition there is one containing a linear polyorganosiloxane having a vinyl group and a methyl hydrogen polysiloxane having a hydrosilyl group.
  • This silicone resin composition is heated and cured in the presence of a platinum catalyst to form a silicone resin layer.
  • Examples of the coating method of the resin composition include a spray coating method, a die coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, a screen printing method, and a gravure coating method. These coating methods are appropriately selected according to the type of the resin composition.
  • the coating amount of the resin composition is appropriately selected according to the type of the resin composition.
  • it is preferably 1 to 100 g / m 2 , more preferably 5 to 20 g / m 2 .
  • the curing conditions for the resin composition are appropriately selected according to the type of the resin composition.
  • the temperature heated in the atmosphere is It is 50 ° C to 250 ° C, preferably 100 ° C to 200 ° C.
  • the reaction time is 5 to 60 minutes, preferably 10 to 30 minutes. If the curing conditions of the resin composition are within the above reaction time range and reaction temperature range, the oxidative decomposition of the silicone resin does not occur at the same time, a low molecular weight silicone component is not generated, and the silicone migration property does not increase.
  • the crimping is performed in a clean environment.
  • a roll type, a press type, and the like as a method of pressure bonding.
  • the atmosphere in which the pressure bonding is performed may be an atmospheric pressure atmosphere, but is preferably a reduced-pressure atmosphere in order to suppress mixing of bubbles.
  • the temperature at which the pressure bonding is performed may be higher than room temperature, but is preferably room temperature in order to prevent deterioration of the resin layer 14.
  • FIG. 2 is a plan view showing a method for manufacturing a laminate according to an embodiment of the present invention.
  • FIG. 3 is a side view showing a method for manufacturing a laminate according to an embodiment of the present invention.
  • FIG. 4 is a side view of a laminate obtained by the laminate production method according to an embodiment of the present invention.
  • the state of the laminated body block before a process is shown with a dashed-two dotted line.
  • the manufacturing method of a laminated body is a method of obtaining a laminated body by chamfering the side edge part 11a of the laminated body block 11 in order to improve impact resistance.
  • the side edge part 11a of the laminated body block 11 may be processed into, for example, a rounded shape.
  • the cross-sectional shape after processing is, for example, an arc-shaped part, an elliptical arc-shaped part, or a parabola. It may be a curved surface shape including a shaped portion.
  • the processed cross-sectional shape of the side edge portion 11a of the laminate block 11 may be a polygonal shape.
  • the manufacturing method of a laminated body has the process of grinding the side edge part 11a of the laminated body block 11 with the grindstone 21.
  • the grindstone 21 is a rotating grindstone formed in a disc shape, and a grinding groove 22 (FIG. 3) is formed on the outer peripheral surface 21 a of the grindstone 21 over the entire circumference.
  • the wall surface 22 a of the grinding groove 22 is a grinding surface, and the cross-sectional shape after processing of the side edge portion 11 a of the laminate block 11 is the same as the cross-sectional shape of the grinding groove 22.
  • the shape of the grindstone 21 is not limited to a disk shape, and may be a cylindrical shape.
  • the grinding groove 22 is formed, for example, so as to become deeper from the both ends 22b and 22c in the width direction of the grinding groove 22 toward the inside in the width direction of the grinding groove 22.
  • the grinding groove 22 is formed so as to become deeper from the both ends 22b and 22c in the width direction toward the center 22d in the width direction of the grinding groove 22.
  • the wall surface 22a of the grinding groove 22 includes, for example, a bottom surface 22a-1 having an arcuate cross section and two side surfaces 22a-2 and 22a-3 extending from both end edges of the bottom surface 22a-1 to the outer peripheral surface 21a.
  • the two side surfaces 22a-2 and 22a-3 are smoothly connected to the bottom surface 22a-1.
  • the grindstone 21 rotates in the circumferential direction of the grindstone 21 (X direction in FIG. 2) in a state where the wall surface 22a of the grind groove 22 and the side edge portion 11a of the laminated body block 11 are in contact with each other.
  • the side edge part 11a of the laminated body block 11 is ground.
  • the substrate 12, the resin layer 14 and the support plate 15 shown in FIG. 1 have the side edges 12a, 14a and 15a shown in FIG. 3 cut away, respectively, and the substrate 32, the resin layer 34 and the support plate shown in FIG. 35. Therefore, the laminated body 31 obtained by chamfering the side edge portion 11a of the laminated body block 11 shown in FIG.
  • the reinforcing plate 33 includes a resin layer 34 that is detachably coupled to the substrate 32 and a support plate 35 that supports the substrate 32 via the resin layer 34.
  • the stacking direction of the laminate block 11 and the rotation axis direction of the grindstone 21 are arranged substantially in parallel, and the grindstone 21 is relatively aligned along the circumferential direction of the side edge portion 11a of the laminate block 11. (Y direction in FIG. 2). Therefore, the side edge part 11a of the laminated body block 11 is ground over the perimeter of a circumferential direction. Only a part in the circumferential direction of the side edge portion 11a may be ground.
  • the grindstone 21 side may move, the laminated body block 11 side may move, and both sides may move.
  • the interface 16 between the resin layer 14 and the substrate 12 and the interface 17 between the resin layer 14 and the support plate 15 are the deepest part of the grinding groove 22 (in this embodiment, the center part 22d in the width direction).
  • the grinding groove 22 is offset in the width direction. Therefore, the interfaces 16 and 17 are in contact with the wall surface 22a that is the grinding surface of the grindstone 21, not diagonally but obliquely. Note that the interfaces 16 and 17 are offset to one side in the width direction of the grinding groove 22 with respect to the deepest portion of the grinding groove 22.
  • microcracks when microcracks are generated on the side surfaces of the laminate block 11 by the abrasive grains contained in the wall surfaces 22a, the microcracks tend to extend obliquely with respect to the wall surfaces 22a.
  • the microcracks are prevented from extending obliquely from the side surface of the laminate block 11 toward the interfaces 16 and 17. be able to. Therefore, the occurrence of chipping of at least one corner of the substrate 12 and the support plate 15 due to grinding can be reduced, and the laminate 31 having almost no depression on the side surface can be obtained. This effect is significant when at least one of the substrate 12 and the support plate 15 is made of a brittle material. Examples of the brittle material include glass, ceramics, and metal silicon.
  • the grindstone 21 of this embodiment has the grinding groove
  • the outer peripheral surface 21a of the grindstone 21 is a grinding surface, Comprising: The rotating shaft of the grindstone 21 Are in contact with the interfaces 16 and 17 obliquely.
  • the deepest portion of the grinding groove 22 (in the present embodiment, the central portion 22d in the width direction) is brought into contact with the side edge portion 15a of the support plate 15 as shown in FIG. Therefore, after grinding, as shown in FIG. 4, the support plate 35 protrudes outward from the substrate 32, so that damage to the product substrate 32 can be reduced.
  • the interfaces 16 and 17 are brought into contact with the bottom surface 22a-1 having an arcuate cross section as shown in FIG. Therefore, by adjusting the amount of the offset before grinding, the angle formed by the wall surface 22a that is the grinding surface and the interfaces 16 and 17 can be adjusted.
  • FIG. 5A to 5C are side views showing an example of the relationship between the angle formed by the wall surface that is the grinding surface and the interface and the offset amount, and FIG. 5A is a side view when the offset amount is small, and FIG. Is a side view when the offset amount is medium, and FIG. 5C is a side view when the offset amount is large.
  • T1 represents the thickness of the substrate 12, and T2 represents the thickness of the support plate 15. Since the thickness of the resin layer 14 is negligibly small compared to the thickness of the substrate 12 and the thickness of the support plate 15, the substrate 12 and the support plate 15 are bonded to each other without the resin layer 14 interposed therebetween. He said. Incidentally, the calculation result (relationship between ⁇ and D) described later hardly varies depending on the presence or absence of the resin layer 14.
  • ⁇ represents an angle formed by the bonding surface 18 (corresponding to the interfaces 16 and 17) between the substrate 12 and the support plate 15 and the wall surface 22a of the grinding groove 22 on the substrate 12 side.
  • D represents the offset amount of the bonding surface 18 with respect to the deepest portion of the grinding groove 22 (in the present embodiment, the center portion 22d in the width direction).
  • R represents the radius of curvature of the bottom surface 22a-1.
  • D is stepped to 0.05 mm (FIG. 5A), 0.15 mm (FIG. 5B), and 0.25 mm (FIG. 5C).
  • ⁇ decreases stepwise to 81.9 ° (FIG. 5A), 65.1 ° (FIG. 5B), and 45.4 ° (FIG. 5C).
  • the bottom surface 22a-1 of the grinding groove 22 is formed in a circular arc shape.
  • the wall surface 22a of the grinding groove 22 may be formed in a circular arc shape as a whole.
  • the position of the arc-shaped portion is not particularly limited.
  • the laminate block 11 may be subjected to a step of cutting the laminate block 11 into a predetermined dimension before the grinding step.
  • the method of manufacturing the electronic device includes a forming step of forming a predetermined functional layer (for example, a conductive layer) in at least a part of the region of the laminate 31 on the substrate 32, and a substrate 32 on which the predetermined functional layer is formed. And a peeling step for peeling the reinforcing plate 33.
  • the laminated body 31 may be used for the process of grind
  • a method for forming the predetermined functional layer on the substrate 32 for example, a photolithography method, an etching method, an evaporation method, or the like is used.
  • a coating solution such as a resist solution is used to pattern the functional layer.
  • the laminated body 31 of the present embodiment can reduce the occurrence of chipping of at least one corner of the substrate 12 and the support plate 15 due to grinding. Therefore, it is easy to remove the coating liquid adhering to the side surface of the laminate 31 when the coating liquid is applied on the substrate 32. Therefore, it is possible to prevent the residue of the coating liquid from becoming a dust generation source in a process involving heat treatment in the manufacturing process of the electronic device, and the yield of the electronic device can be improved.
  • the peeling step as a method of peeling the reinforcing plate 33 from the substrate 32, for example, a razor or the like is inserted between the resin layer 34 constituting the reinforcing plate 33 and the substrate 32 to create a gap, and then the substrate 32 side. And a method of pulling apart the support plate 35 side.
  • the method for manufacturing an electronic device may further include a step of laminating another functional layer on the functional layer non-formed region or the functional layer already formed in the substrate 32 after the peeling step.
  • an electronic device is assembled using two sets of laminates 31 each having a predetermined functional layer, and then the reinforcing plates 33 are peeled off from the substrates 32 of the two sets of laminates 31. It may be a method to do.
  • the manufacturing method of a liquid crystal display includes, for example, a TFT substrate manufacturing process in which a thin film transistor (TFT) or the like is formed on a stacked substrate, and a color filter (CF) on a separate stacked substrate. ) And the like to form a CF substrate.
  • the manufacturing method of a liquid crystal display has the assembly process which seals a liquid crystal material between a TFT substrate and CF substrate, and the peeling process which peels a reinforcement board from the board
  • a photolithography method or an etching method is used as a method of forming the TFT or CF.
  • a resist solution is used as a coating solution in order to form a pattern of TFT, CF, or the like.
  • the substrate surface of the laminate may be cleaned before the TFT substrate manufacturing process or the CF substrate manufacturing process.
  • a cleaning method known dry cleaning or wet cleaning is used.
  • a liquid crystal material is injected between the TFT substrate and the CF substrate.
  • a method for injecting the liquid crystal material there is a reduced pressure injection method or a dropping injection method.
  • a TFT substrate and a CF substrate are bonded together via a sealing material and a spacer material, and a large panel is manufactured.
  • a large panel is manufactured and cut into a plurality of cells so that the TFT and the CF are arranged to face each other.
  • the inside of each cell is set to a reduced-pressure atmosphere, and after the liquid crystal material is injected into each cell from the injection hole provided on the side surface of each cell, the injection hole is sealed.
  • a polarizing plate is attached to each cell, and a backlight or the like is assembled to manufacture a liquid crystal display.
  • a liquid crystal material is dropped on one of the TFT formation surface of the TFT substrate and the CF formation surface of the CF substrate, and then the TFT substrate and the CF substrate are connected via a seal material and a spacer material. Are bonded together to produce a large panel. At this time, a large panel is manufactured so that the TFT and the CF are arranged to face each other. Thereafter, the large panel is cut into a plurality of cells. Subsequently, a polarizing plate is attached to the cell, and a backlight or the like is assembled to manufacture a liquid crystal display.
  • the peeling process may be performed after the TFT substrate manufacturing process or the CF substrate manufacturing process and before the assembling process, or may be performed during the assembling process.
  • the peeling process may be performed in the middle of the assembly process by the reduced pressure injection method, it may be performed after the large panel is manufactured and before the large panel is cut into a plurality of cells. It may be performed after sealing and before attaching a polarizing plate to each cell.
  • the peeling process when the peeling process is performed in the middle of the assembly process by the appropriate injection method, it may be performed after the large panel is manufactured and before the large panel is cut into a plurality of cells. May be performed after cutting the substrate into a plurality of cells and before attaching the polarizing plate to each cell.
  • the manufacturing method of an organic EL display is, for example, an organic EL element forming step of forming an organic EL element on a laminated substrate, and a substrate on which the organic EL element is formed and a counter substrate are bonded together. And a peeling step of peeling the reinforcing plate from the substrate of the laminate.
  • organic EL element forming step for example, a photolithography method or a vapor deposition method is used as a method for forming the organic EL element. Further, a resist solution is used as a coating solution in order to form a pattern of the organic EL element.
  • An organic EL element consists of a transparent electrode layer, a positive hole transport layer, a light emitting layer, an electron carrying layer etc., for example.
  • the substrate surface of the laminate may be cleaned as necessary.
  • a cleaning method known dry cleaning or wet cleaning is used.
  • the substrate on which the organic EL element is formed is cut into a plurality of cells, and an opposing substrate is bonded to each cell, whereby an organic EL display is manufactured.
  • the peeling step may be performed, for example, after the organic EL element forming step and before the bonding step, or may be performed during or after the bonding step.
  • the solar cell manufacturing method includes, for example, a solar cell element forming step of forming a solar cell element on a laminate substrate, and a peeling step of peeling the reinforcing plate from the laminate substrate.
  • a photolithography method or a vapor deposition method is used as a method for forming the solar cell element.
  • a resist solution is used as a coating solution in order to pattern the solar cell element.
  • a solar cell element consists of a transparent electrode layer, a semiconductor layer, etc., for example.
  • the peeling step is performed, for example, after the solar cell element forming step.
  • Laminated body block 12 Substrate 13 Reinforcement plate 14 Resin layer 15 Support plate 16 Interface between resin layer and substrate 17 Interface between resin layer and support plate 21 Grinding wheel 21a Outer peripheral surface 22 Grinding groove 22a Wall surface 22a-1 Bottom surface 22a-2 Side surface 22a- 3 side 22d deepest part 31 laminated body

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
PCT/JP2012/064325 2011-06-23 2012-06-01 積層体の製造方法 WO2012176608A1 (ja)

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JP2013521516A JP5907168B2 (ja) 2011-06-23 2012-06-01 積層体の製造方法、および積層体
CN201280030458.0A CN103619536B (zh) 2011-06-23 2012-06-01 层叠体的制造方法
KR1020137033984A KR101895098B1 (ko) 2011-06-23 2012-06-01 적층체의 제조 방법

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014092015A1 (ja) * 2012-12-13 2014-06-19 旭硝子株式会社 電子デバイスの製造方法およびガラス積層体の製造方法
WO2018092688A1 (ja) * 2016-11-15 2018-05-24 旭硝子株式会社 積層基板および電子デバイスの製造方法
FR3139135A1 (fr) * 2022-08-31 2024-03-01 Saint-Gobain Glass France Feuille de verre usinée et procédé d’usinage associé

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108673356B (zh) * 2018-04-19 2020-10-02 武汉华星光电半导体显示技术有限公司 一种磨轮结构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598553U (zh) * 1978-12-27 1980-07-09
JPS62113614A (ja) * 1985-11-14 1987-05-25 Asahi Glass Co Ltd 自動車用窓硝子の加工方法
JP2003200336A (ja) * 2001-12-27 2003-07-15 Optrex Corp 液晶表示パネルの面取り方法
JP2004281550A (ja) * 2003-03-13 2004-10-07 Dowa Mining Co Ltd 半導体ウエハおよびその面取り加工方法
JP2009184172A (ja) * 2008-02-05 2009-08-20 Asahi Glass Co Ltd ガラス積層体、支持体付き表示装置用パネル、およびそれらの製造方法
JP2010105141A (ja) * 2008-10-31 2010-05-13 Naoetsu Electronics Co Ltd 半導体接合ウエーハの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62214939A (ja) * 1986-03-15 1987-09-21 Matsushita Electric Works Ltd 積層板の製法
JPH0320028A (ja) * 1989-06-16 1991-01-29 Matsushita Electron Corp 半導体素子の断面形成方法
JP3999217B2 (ja) * 1996-05-23 2007-10-31 大日本印刷株式会社 紙容器用積層材の製造方法及びこの方法により得られた紙容器用積層材を使用して作製された紙容器
JP2007214256A (ja) * 2006-02-08 2007-08-23 Toshiba Ceramics Co Ltd Ｓｏｉウェーハ
JP2007281067A (ja) * 2006-04-04 2007-10-25 Nitto Denko Corp 半導体装置の製造方法、及びそれに用いる半導体ウェハ加工用の粘着シート
JP4930161B2 (ja) 2006-05-08 2012-05-16 旭硝子株式会社 薄板ガラス積層体、薄板ガラス積層体を用いた表示装置の製造方法および、支持ガラス基板
KR20090006824A (ko) * 2006-05-08 2009-01-15 아사히 가라스 가부시키가이샤 박판 유리 적층체, 박판 유리 적층체를 이용한 표시 장치의제조 방법 및 지지 유리 기판
JP4894910B2 (ja) * 2009-01-15 2012-03-14 株式会社デンソー 半導体装置の製造方法及び半導体装置並びにその半導体装置を内蔵する多層基板
KR101707056B1 (ko) * 2009-03-10 2017-02-15 니폰 덴키 가라스 가부시키가이샤 유리 기판 및 그 제조 방법
KR101723254B1 (ko) * 2009-09-08 2017-04-04 도요보 가부시키가이샤 유리/수지 적층체 및 그것을 사용한 전자 디바이스

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598553U (zh) * 1978-12-27 1980-07-09
JPS62113614A (ja) * 1985-11-14 1987-05-25 Asahi Glass Co Ltd 自動車用窓硝子の加工方法
JP2003200336A (ja) * 2001-12-27 2003-07-15 Optrex Corp 液晶表示パネルの面取り方法
JP2004281550A (ja) * 2003-03-13 2004-10-07 Dowa Mining Co Ltd 半導体ウエハおよびその面取り加工方法
JP2009184172A (ja) * 2008-02-05 2009-08-20 Asahi Glass Co Ltd ガラス積層体、支持体付き表示装置用パネル、およびそれらの製造方法
JP2010105141A (ja) * 2008-10-31 2010-05-13 Naoetsu Electronics Co Ltd 半導体接合ウエーハの製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014092015A1 (ja) * 2012-12-13 2014-06-19 旭硝子株式会社 電子デバイスの製造方法およびガラス積層体の製造方法
WO2018092688A1 (ja) * 2016-11-15 2018-05-24 旭硝子株式会社 積層基板および電子デバイスの製造方法
JPWO2018092688A1 (ja) * 2016-11-15 2019-10-17 Ａｇｃ株式会社 積層基板および電子デバイスの製造方法
JP7070425B2 (ja) 2016-11-15 2022-05-18 Ａｇｃ株式会社 積層基板および電子デバイスの製造方法
FR3139135A1 (fr) * 2022-08-31 2024-03-01 Saint-Gobain Glass France Feuille de verre usinée et procédé d’usinage associé

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KR20140031328A (ko) 2014-03-12
KR101895098B1 (ko) 2018-09-04
CN103619536B (zh) 2016-06-01
JPWO2012176608A1 (ja) 2015-02-23
CN103619536A (zh) 2014-03-05
TWI555642B (zh) 2016-11-01
TW201307079A (zh) 2013-02-16

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