WO2012172901A1 - 蛍光体含有シート、それを用いたled発光装置およびその製造方法 - Google Patents
蛍光体含有シート、それを用いたled発光装置およびその製造方法 Download PDFInfo
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- WO2012172901A1 WO2012172901A1 PCT/JP2012/062251 JP2012062251W WO2012172901A1 WO 2012172901 A1 WO2012172901 A1 WO 2012172901A1 JP 2012062251 W JP2012062251 W JP 2012062251W WO 2012172901 A1 WO2012172901 A1 WO 2012172901A1
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- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K2003/026—Phosphorus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Definitions
- the present invention relates to a sheet-like fluorescent material for converting the emission wavelength of an LED chip.
- LEDs Light-emitting diodes
- LCDs liquid crystal displays
- car headlights etc.
- the market is rapidly expanding not only in the automotive field but also for general lighting.
- the emission spectrum of an LED depends on the semiconductor material forming the LED chip, its emission color is limited. Therefore, in order to obtain white light for LCD backlight or general illumination using LEDs, it is necessary to arrange phosphors suitable for each chip on the LED chip and convert the emission wavelength.
- a method of installing a yellow phosphor on an LED chip that emits blue light a method of installing red and green phosphors on an LED chip that emits blue light, and red, green, and blue on an LED chip that emits ultraviolet light
- a method of installing a phosphor is proposed.
- the method of installing a yellow phosphor on a blue LED and the method of installing red and green phosphors on a blue LED are currently most widely adopted in terms of the luminous efficiency and cost of the LED chip. .
- the method of attaching the phosphor sheet to the LED chip is a better method for stabilizing the color and brightness than using the liquid phosphor resin as described above, but includes the problem of difficulty in processing. Yes. There is a possibility that the cutting process for dividing the phosphor sheet into the size of the LED chip may be complicated, and the part corresponding to the electrode part etc. on the LED chip needs to be drilled in advance. is there. Therefore, it is important to develop a phosphor sheet material having excellent processability.
- Patent Document 1 discloses a method in which a sheet material in which a phosphor is dispersed in an uncured silicone resin is molded, and after being applied, is thermally cured to obtain strong adhesion.
- the method disclosed here it is difficult to obtain adhesiveness when the resin main component contained in the phosphor sheet is a cured silicone resin, the phosphor sheet before pasting is in an uncured state, It is semi-solid or soft solid, and it is very difficult to perform cutting and drilling with high accuracy.
- Patent Document 3 discloses a composite sheet in which an inorganic phosphor plate and an adhesive layer are laminated, and it is disclosed that the inorganic phosphor plate can be cut by dicing. The machinability at is unknown.
- a phosphor sheet having excellent workability before pasting and excellent adhesiveness during pasting has not been obtained. It is an object of the present invention to provide a phosphor sheet that achieves such characteristics.
- the present invention is a phosphor-containing sheet having a storage elastic modulus at 25 ° C. of 0.1 MPa or more and a storage elastic modulus at 100 ° C. of less than 0.1 MPa, wherein the resin main component of the phosphor-containing sheet is A phosphor-containing sheet, which is a cross-linked product obtained by hydrosilylation reaction of a cross-linkable silicone composition including at least the following compositions (A) to (D): (A) Average unit formula: (R 1 2 SiO 2/2 ) a (R 1 SiO 3/2 ) b (R 2 O 1/2 ) c (Wherein R 1 is a phenyl group, an alkyl or cycloalkyl group having 1 to 6 carbon atoms, or an alkenyl group having 2 to 6 carbon atoms, provided that 65 to 75 mol% of R 1 is phenyl.
- R 1 is an alkenyl group
- R 2 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- R 3 is an alkenyl group, and m is an integer of 5 to 50.
- R 4 Represented by the formula ⁇ 5 to 15 parts by weight per 100 parts by weight of component (A) ⁇
- C) General formula: (HR 4 2 SiO) 2 SiR 4 2 (In the formula, R 4 is a phenyl group, or an alkyl group or cycloalkyl group having 1 to 6 carbon atoms, provided that 30 to 70 mol% of R 4 is phenyl.) ⁇ Amount such that the molar ratio of silicon-bonded hydrogen atoms in this component to the total of alkenyl groups in component (A) and component (B) is 0.5 to 2 ⁇ , and ( D) Hydrosilylation reaction catalyst ⁇ Amount sufficient to promote hydrosilylation reaction between alkenyl group in component (A), component (B) and silicon-bonded hydrogen atom in component (C) ⁇
- a crosslinkable silicone composition comprising at least
- the phosphor-containing resin layer since the phosphor-containing resin layer has a high storage elastic modulus near room temperature, it is excellent in mechanical workability such as cutting and punching. Moreover, since it has a low storage elastic modulus at high temperature, it has excellent adhesiveness by being attached to the LED element at high temperature.
- the 1st example of the LED light-emitting device manufacturing process by the resin laminated sheet of this invention The 2nd example of the LED light-emitting device manufacturing process by the resin lamination sheet of this invention. The 3rd example of the LED light-emitting device manufacturing process by the resin laminated sheet of this invention.
- silicone resins and epoxy resins are preferably used mainly from the viewpoint of transparency. Furthermore, a silicone resin is particularly preferably used from the viewpoint of heat resistance.
- curable silicone rubber is preferable. Either one liquid type or two liquid type (three liquid type) liquid structure may be used. Cured silicone rubbers include dealcohol-free, deoxime-type, deacetate-type, and dehydroxylamine-type types that cause a condensation reaction with moisture in the air or a catalyst, but a type that causes a hydrosilylation reaction with a catalyst.
- the addition reaction type is preferred. In particular, the addition reaction type silicone rubber is more preferable in that it has no by-product accompanying the curing reaction, has a small curing shrinkage, and can easily be cured by heating.
- the addition reaction type silicone rubber is formed by a hydrosilylation reaction between a compound containing an alkenyl group bonded to a silicon atom and a compound having a hydrogen atom bonded to a silicon atom.
- a silicone resin which is a crosslinked product obtained by hydrosilylation reaction of a crosslinkable silicone composition (hereinafter referred to as “the present composition”) having the following compositions (A) to (D): The following characteristics can be obtained.
- R 3 is an alkenyl group, and m is an integer of 5 to 50.
- R 4 Represented by the formula ⁇ 5 to 15 parts by weight per 100 parts by weight of component (A) ⁇
- C) General formula: (HR 4 2 SiO) 2 SiR 4 2 (In the formula, R 4 is a phenyl group, or an alkyl group or cycloalkyl group having 1 to 6 carbon atoms, provided that 30 to 70 mol% of R 4 is phenyl.) ⁇ Amount such that the molar ratio of silicon-bonded hydrogen atoms in this component to the total of alkenyl groups in component (A) and component (B) is 0.5 to 2 ⁇ , and ( D) Hydrosilylation reaction catalyst ⁇ Amount sufficient to promote hydrosilylation reaction between alkenyl group in component (A), component (B) and silicon-bonded hydrogen atom in component (C) ⁇
- a crosslinkable silicone composition comprising at least the following is preferably used.
- Silicone resins useful in practicing the present invention are of the above composition.
- the values of a, b, and c are within a range in which the obtained crosslinked product has sufficient hardness at room temperature and softening at high temperature is sufficient for carrying out the present invention. It has been established.
- the resulting crosslinked product is insufficiently softened at a high temperature. The resulting crosslinked product loses its transparency, and its mechanical strength also decreases.
- at least one R 3 is an alkenyl group.
- m is an integer in the range of 5 to 50, and this is a range in which handling workability is maintained while maintaining the mechanical strength of the resulting crosslinked product.
- the content of the component (B) is in the range of 5 to 15 parts by weight with respect to 100 parts by weight of the component (A). This is a range for obtaining sufficient softening of the resulting crosslinked product at high temperatures.
- R 4 is a phenyl group, or an alkyl group or cycloalkyl group having 1 to 6 carbon atoms.
- alkyl group for R 4 include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a heptyl group.
- cycloalkyl group for R 4 include a cyclopentyl group and a cycloheptyl group.
- the phenyl group content is in the range of 30 to 70 mol%. This is a range in which the obtained crosslinked product can be sufficiently softened at a high temperature and can maintain transparency and mechanical strength.
- component (C) is such that the molar ratio of silicon-bonded hydrogen atoms in this component is 0.5 with respect to the total of alkenyl groups in component (A) and component (B).
- ⁇ 2 This is the range in which sufficient hardness at room temperature of the obtained crosslinked product can be obtained.
- the component (D) is a hydrosilylation catalyst for promoting the hydrosilylation reaction between the alkenyl group in the components (A) and (B) and the silicon atom-bonded hydrogen atom in the component (C).
- the component (D) include platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts, and platinum-based catalysts are preferred because they can significantly accelerate the curing of the composition.
- platinum-based catalyst include platinum fine powder, chloroplatinic acid, alcohol solution of chloroplatinic acid, platinum-alkenylsiloxane complex, platinum-olefin complex, and platinum-carbonyl complex, particularly platinum-alkenylsiloxane complex. It is preferable.
- alkenylsiloxane examples include 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, Examples thereof include alkenyl siloxanes in which part of the methyl groups of these alkenyl siloxanes are substituted with ethyl groups, phenyl groups, and the like, and alkenyl siloxanes in which the vinyl groups of these alkenyl siloxanes are substituted with allyl groups, hexenyl groups, and the like.
- 1,3-divinyl-1,1,3,3-toteramethyldisiloxane is preferred because the stability of the platinum-alkenylsiloxane complex is good. Further, since the stability of the platinum-alkenylsiloxane complex can be improved, 1,3-divinyl-1,1,3,3-tetramethyldisiloxane and 1,3-diallyl-1,1 are added to this complex.
- the content of the component (D) is sufficient to promote the hydrosilylation reaction between the alkenyl group in the components (A) and (B) and the silicon atom-bonded hydrogen atom in the component (C).
- the amount of the metal atom in the component is preferably in the range of 0.01 to 500 ppm by mass unit, and more preferably 0.01 to 500 ppm. It is preferably in the range of ⁇ 100 ppm, and particularly preferably in the range of 0.01 to 50 ppm. This is a range in which the resulting composition is sufficiently crosslinked and does not cause problems such as coloring.
- the composition comprises at least the above components (A) to (D), but as other optional components, ethynylhexanol, 2-methyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyne Alkyne alcohols such as 3-ol and 2-phenyl-3-butyn-2-ol; enyne compounds such as 3-methyl-3-penten-1-yne and 3,5-dimethyl-3-hexen-1-in 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane; Further, a reaction inhibitor such as benzotriazole may be contained.
- the content of the reaction inhibitor is not limited, but is preferably in the range of 1 to 5,000 ppm with respect to the weight of the composition. By adjusting the content of the reaction inhibitor, it is possible to adjust the storage elastic modulus
- the phosphor-containing sheet of the present invention may also be added with a dispersing agent or leveling agent for stabilizing the coating film as an additive, and an adhesion aid such as a silane coupling agent as a sheet surface modifier.
- a dispersing agent or leveling agent for stabilizing the coating film as an additive
- an adhesion aid such as a silane coupling agent as a sheet surface modifier.
- alumina fine particles, silica fine particles, silicone fine particles and the like as the phosphor sedimentation inhibitor.
- the storage elastic modulus of the phosphor sheet in which the phosphor is dispersed in these resins is 0.1 MPa or more at 25 ° C. and less than 0.1 MPa at 100 ° C. More desirably, it is 0.3 MPa or more at 25 ° C., more desirably 0.5 MPa or more, further desirably 0.7 MPa or more, and particularly desirably 1.0 MPa or more. More desirably, it is less than 0.07 MPa at 100 ° C., more desirably less than 0.05 MPa, further desirably less than 0.03 MPa, and particularly desirably less than 0.01 MPa.
- the storage elastic modulus mentioned here is a storage elastic modulus when dynamic viscoelasticity measurement is performed.
- Dynamic viscoelasticity means that when shear strain is applied to a material at a sinusoidal frequency, the shear stress that appears when a steady state is reached is divided into a component (elastic component) whose strain and phase match, and the strain and phase are
- This is a technique for analyzing the dynamic mechanical properties of a material by decomposing it into components (viscous components) delayed by 90 °.
- G ′ what is obtained by dividing the stress component whose phase matches the shear strain by the shear strain is the storage elastic modulus G ′, which represents the deformation and tracking of the material against the dynamic strain at each temperature. It is closely related to processability and adhesion.
- the phosphor sheet according to the present invention has a storage elastic modulus of 0.1 MPa or more at 25 ° C., so that rapid shear stress such as punching by die punching at room temperature (25 ° C.) or cutting by a blade body. When such processing is performed, the sheet is perforated or cut without deformation around the processed portion, so that the processability with high dimensional accuracy is obtained.
- the upper limit of the storage elastic modulus at room temperature is not particularly limited for the purpose of the present invention, but is preferably 1 GPa or less in view of the necessity of reducing the stress strain after being attached to the LED element. Further, since the storage elastic modulus at 100 ° C.
- the phosphor sheet quickly deforms and follows the shape of the surface of the LED chip when heated and pasted at 60 ° C. to 250 ° C. High adhesion can be obtained.
- the phosphor sheet is capable of obtaining a storage modulus of less than 0.1 MPa at 100 ° C., the storage modulus decreases as the temperature is increased from room temperature. However, in order to obtain practical adhesiveness, 60 ° C. or higher is preferable.
- the storage elastic modulus further decreases and the sticking property is improved.
- the resin usually has thermal expansion and thermal contraction. And thermal decomposition problems are likely to occur.
- a preferable heat bonding temperature is 60 ° C. to 250 ° C.
- the lower limit of the storage elastic modulus at 100 ° C. is not particularly limited for the purpose of the present invention, but if the fluidity is too high at the time of heating and pasting on the LED element, the shape processed by cutting or punching before pasting Therefore, it is desirable that the pressure be 0.001 MPa or more.
- the resin contained therein may be in an uncured or semi-cured state. Then, it is preferable that resin contained is a thing after hardening. If the resin is in an uncured or semi-cured state, the curing reaction proceeds at room temperature during storage of the phosphor sheet, and the storage elastic modulus may be out of the proper range. In order to prevent this, it is desirable that the resin is completely cured, or has been cured to such an extent that the storage elastic modulus does not change for a long period of about one month when stored at room temperature.
- the phosphor absorbs blue light, violet light, or ultraviolet light emitted from the LED chip, converts the wavelength, and has a wavelength different from that of the LED chip having wavelengths in the red, orange, yellow, green, and blue regions. It emits light. Thereby, a part of the light emitted from the LED chip and a part of the light emitted from the phosphor are mixed to obtain a multicolor LED including white.
- the phosphors as described above include various phosphors such as a phosphor emitting green, a phosphor emitting blue, a phosphor emitting yellow, and a phosphor emitting red.
- Specific phosphors used in the present invention include known phosphors such as organic phosphors, inorganic phosphors, fluorescent pigments, and fluorescent dyes.
- organic phosphors include allylsulfoamide / melamine formaldehyde co-condensed dyes and perylene phosphors.
- Perylene phosphors are preferably used because they can be used for a long period of time.
- Examples of the fluorescent material that is particularly preferably used in the present invention include inorganic phosphors. The inorganic phosphor used in the present invention is described below.
- Examples of phosphors that emit green light include SrAl 2 O 4 : Eu, Y 2 SiO 5 : Ce, Tb, MgAl 11 O 19 : Ce, Tb, Sr 7 Al 12 O 25 : Eu, (Mg, Ca, Sr , At least one of Ba) and Ga 2 S 4 : Eu.
- Examples of phosphors that emit blue light include Sr 5 (PO 4 ) 3 Cl: Eu, (SrCaBa) 5 (PO 4 ) 3 Cl: Eu, (BaCa) 5 (PO 4 ) 3 Cl: Eu, (Mg, 2 B 5 O 9 Cl: Eu, Mn, (Mg, Ca, Sr, Ba, at least one) (PO 4 ) 6 Cl 2 : Eu, Mn, etc. .
- yttrium / aluminum oxide phosphors As phosphors emitting green to yellow, at least cerium-activated yttrium / aluminum oxide phosphors, at least cerium-enriched yttrium / gadolinium / aluminum oxide phosphors, at least cerium-activated yttrium / aluminum There are garnet oxide phosphors and at least cerium activated yttrium gallium aluminum oxide phosphors (so-called YAG phosphors). Specifically, Ln 3 M 5 O 12 : R (Ln is at least one selected from Y, Gd, and La. M includes at least one of Al and Ca. R is a lanthanoid series.
- R is at least one selected from Ce, Tb, Pr, Sm, Eu, Dy, Ho
- Ce, Tb, Pr, Sm, Eu, Dy, Ho 0 ⁇ Rx ⁇ 0.5, 0 ⁇ y ⁇ 0.5
- Examples of phosphors that emit red light include Y 2 O 2 S: Eu, La 2 O 2 S: Eu, Y 2 O 3 : Eu, and Gd 2 O 2 S: Eu.
- YAG-based phosphors YAG-based phosphors, TAG-based phosphors, and silicate-based phosphors are preferably used in terms of luminous efficiency and luminance.
- known phosphors can be used according to the intended use and the intended emission color.
- the particle size of the phosphor is not particularly limited, but preferably has a D50 of 0.05 ⁇ m or more, more preferably 3 ⁇ m or more. Further, those having a D50 of 30 ⁇ m or less are preferred, and those having a D50 of 20 ⁇ m or less are more preferred.
- D50 refers to the particle size when the accumulated amount from the small particle size side is 50% in the volume-based particle size distribution obtained by measurement by the laser diffraction / scattering particle size distribution measurement method. When D50 is in the above range, the dispersibility of the phosphor in the phosphor sheet is good, and stable light emission is obtained.
- the phosphor content is preferably 53% by weight or more of the entire phosphor sheet, more preferably 57% by weight or more, and even more preferably 60% by weight.
- the upper limit of the phosphor content is not particularly specified, but is preferably 95% by weight or less of the entire phosphor sheet and 90% by weight or less from the viewpoint that a phosphor sheet excellent in workability can be easily produced. More preferably, it is more preferably 85% by weight or less, and particularly preferably 80% by weight or less.
- the phosphor sheet of the present invention is particularly preferably used for LED surface coating, as will be described in detail later.
- the LED light-emitting device which shows the outstanding performance can be obtained because content of the fluorescent substance in a fluorescent substance sheet is the said range.
- the film thickness of the phosphor sheet of the present invention is determined from the phosphor content and desired optical characteristics. Since the phosphor content is limited from the viewpoint of workability as described above, the film thickness is preferably 10 ⁇ m or more. Moreover, since the phosphor sheet of the present invention has a large phosphor content, it is excellent in light resistance even when the film thickness is large. On the other hand, from the viewpoint of improving the optical properties and heat resistance of the phosphor sheet, the thickness of the phosphor sheet is preferably 1000 ⁇ m or less, more preferably 200 ⁇ m or less, and even more preferably 100 ⁇ m or less. . By setting the phosphor sheet to a film thickness of 1000 ⁇ m or less, light absorption and light scattering by the binder resin can be proposed, so that the phosphor sheet is optically excellent.
- the film thickness of the phosphor sheet in the present invention is a film thickness (average film thickness) measured based on the method A of measuring thickness by mechanical scanning in JIS K7130 (1999) plastic-film and sheet-thickness measurement method. ).
- Heat resistance indicates resistance to heat generated in the LED chip.
- the heat resistance can be evaluated by comparing the luminance when the LED emits light at room temperature and when the LED emits light at a high temperature, and measuring how much the luminance at the high temperature decreases.
- the LED is in an environment where a large amount of heat is generated in a small space, and particularly in the case of a high power LED, heat generation is significant. Due to such heat generation, the temperature of the phosphor increases, and the luminance of the LED decreases. Therefore, it is important how efficiently the generated heat is radiated.
- seat excellent in heat resistance can be obtained by making a sheet
- the variation in sheet thickness is preferably within ⁇ 5%, more preferably within ⁇ 3%.
- the film thickness variation referred to here is a thickness measurement method based on the thickness measurement method A by mechanical scanning in JIS K7130 (1999) plastic-film and sheet-thickness measurement method, and is shown below. Calculated by the formula.
- Film thickness variation B (%) ⁇ (maximum film thickness deviation value * ⁇ average film thickness) / average film thickness ⁇ ⁇ 100 *
- the maximum film thickness deviation value the one with the larger difference from the average film thickness is selected from the maximum value or the minimum value.
- a method for producing the phosphor sheet of the present invention will be described.
- the following is an example and the preparation method of a fluorescent substance sheet is not limited to this.
- sheet-preparing phosphor-dispersed silicone resin a solution in which a phosphor is dispersed in a resin (hereinafter referred to as “sheet-preparing phosphor-dispersed silicone resin”) is prepared as a coating solution for forming a phosphor sheet.
- sheet-preparing phosphor-dispersed silicone resin is prepared as a coating solution for forming a phosphor sheet.
- the phosphor-dispersed silicone resin for preparing a sheet can be obtained by mixing a phosphor and a resin.
- an addition reaction type silicone resin when a compound containing an alkenyl group bonded to a silicon atom and a compound having a hydrogen atom bonded to a silicon atom are mixed, the curing reaction may start even at room temperature. It is also possible to extend the pot life by blending a hydrosilylation reaction retarder such as a compound with the phosphor-dispersed silicone resin for sheet preparation. It is also possible to mix dispersion additives and leveling agents for stabilizing the coating film as additives, and adhesion aids such as silane coupling agents as sheet surface modifiers into the phosphor-dispersed silicone resin for sheet preparation. It is. It is also possible to mix alumina fine particles, silica fine particles, silicone fine particles and the like as the phosphor sedimentation inhibitor with the phosphor-dispersed silicone resin for sheet preparation.
- a solvent can be added to form a solution.
- a solvent will not be specifically limited if the viscosity of resin of a fluid state can be adjusted.
- toluene, methyl ethyl ketone, methyl isobutyl ketone, hexane, acetone, terpineol and the like can be mentioned.
- the mixture is homogeneously mixed and dispersed with a homogenizer, a revolving stirrer, a three-roller, a ball mill, a planetary ball mill, a bead mill, etc.
- a phosphor-dispersed silicone resin is obtained. Defoaming is preferably carried out under vacuum or reduced pressure conditions after mixing or dispersing.
- a phosphor-dispersed silicone resin for creating a sheet is applied on a substrate and dried.
- Application is reverse roll coater, blade coater, slit die coater, direct gravure coater, offset gravure coater, reverse roll coater, blade coater, kiss coater, natural roll coater, air knife coater, roll blade coater, varibar roll blade coater, toe.
- a stream coater, rod coater, wire bar coater, applicator, dip coater, curtain coater, spin coater, knife coater or the like can be used.
- the phosphor sheet of the present invention can also be produced by using a printing method such as screen printing, gravure printing, or lithographic printing. When using a printing method, screen printing is particularly preferably used.
- the sheet can be dried using a general heating device such as a hot air dryer or an infrared dryer.
- a general heating device such as a hot air dryer or an infrared dryer is used.
- the heat curing conditions are usually 40 to 250 ° C. for 1 minute to 5 hours, preferably 100 ° C. to 200 ° C. for 2 minutes to 3 hours.
- a known metal, film, glass, ceramic, paper or the like can be used without particular limitation.
- metal plates and foils such as aluminum (including aluminum alloys), zinc, copper, iron, cellulose acetate, polyethylene terephthalate (PET), polyethylene, polyester, polyamide, polyimide, polyphenylene sulfide, polystyrene, polypropylene, polycarbonate
- a film of plastic such as polyvinyl acetal or aramid, a paper laminated with the plastic, or a paper coated with the plastic, a paper laminated or vapor-deposited with the metal, or a plastic film laminated or vapor-deposited with the metal. Can be mentioned.
- the surface may be subjected to plating treatment or ceramic treatment such as chromium or nickel.
- a base material is a flexible film form from the adhesiveness at the time of sticking a fluorescent substance containing resin sheet to an LED element.
- a film having a high strength is preferred so that there is no fear of breakage when handling a film-like substrate.
- Resin films are preferred in terms of their required characteristics and economy, and among these, PET films are preferred in terms of economy and handleability.
- a polyimide film is preferable in terms of heat resistance.
- the surface of the base material may be subjected to a mold release treatment in advance for ease of peeling of the sheet.
- the thickness of the substrate is not particularly limited, but the lower limit is preferably 40 ⁇ m or more, more preferably 60 ⁇ m or more. Moreover, as an upper limit, 5000 micrometers or less are preferable and 3000 micrometers or less are more preferable.
- the phosphor sheet of the present invention is attached to an LED element as a wavelength conversion layer and used as a light emitting device.
- the heating temperature is preferably 60 ° C. or higher and 250 ° C. or lower, and more preferably 60 ° C. or higher and 150 ° C. or lower.
- the position accuracy of pasting is important. In order to increase the accuracy of pasting, it is more preferable to paste at 150 ° C. or lower. Furthermore, in order to improve the reliability of the LED light emitting device according to the present invention, it is preferable that there is no stress strain between the phosphor sheet and the LED element. Therefore, the pasting temperature is preferably around the operating temperature of the LED light emitting device, preferably within ⁇ 20 ° C. of the operating temperature. The LED light emitting device rises in temperature from 80 ° C. to 130 ° C. when lit. Therefore, the pasting temperature is desirably 60 ° C. or higher and 150 ° C. or lower in order to bring the operating temperature and the pasting temperature closer. Therefore, the characteristics of the phosphor sheet designed to sufficiently reduce the storage elastic modulus at 100 ° C. are important.
- any existing apparatus can be used as long as it can be heated and pressurized at a desired temperature.
- the wafer dicing and phosphor sheet are pasted together on the wafer on which the LED elements before dicing are fabricated.
- a flip chip bonder can be used.
- affixing the wafer-level LED elements at once it is affixed with a thermocompression bonding tool or the like having a heating portion of about 100 mm square.
- the phosphor sheet is thermally fused to the LED element at a high temperature
- the phosphor sheet is allowed to cool to room temperature and the substrate is peeled off.
- the phosphor sheet after being allowed to cool to room temperature after heat sealing can be easily peeled off from the substrate while firmly adhering to the LED element. It becomes possible.
- the method for cutting the phosphor sheet will be described. Before attaching the phosphor sheet to the LED element, cut it into individual pieces in advance and attach it to the individual LED element, and attach the phosphor sheet to the wafer-level LED element and simultaneously dice the wafer. Then, there is a method of cutting the phosphor sheet. In the case of cutting in advance before sticking, the uniformly formed phosphor sheet is processed into a predetermined shape by laser processing or cutting with a blade and divided. Since processing with a laser gives high energy, it is very difficult to avoid scorching of the resin and deterioration of the phosphor, and cutting with a blade is desirable.
- the storage elastic modulus of the phosphor sheet at 25 ° C. is 0.1 MPa or more.
- a cutting method with a blade there are a method of pushing and cutting a simple blade and a method of cutting with a rotary blade, both of which can be suitably used.
- an apparatus for cutting with a rotary blade an apparatus used for cutting (dicing) a semiconductor substrate called a dicer into individual chips can be suitably used. If the dicer is used, the width of the dividing line can be precisely controlled by the thickness of the rotary blade and the condition setting, so that higher processing accuracy can be obtained than when cutting with a simple cutting tool.
- FIG. 1 shows an example of individualization, LED element application, and dicing steps when the phosphor sheet is divided into individual substrates.
- the process of FIG. 1 includes a step of cutting the phosphor sheet into individual pieces, and a step of heating the phosphor-containing sheet cut into the individual pieces and attaching them to the LED elements.
- FIG. 1A shows a state in which the phosphor sheet 1 of the present invention laminated with the base material 2 is fixed to the temporarily fixing sheet 3.
- both the phosphor sheet 1 and the base material 2 are separated, they are fixed to the temporarily fixing sheet 3 so as to be easy to handle.
- the phosphor sheet 1 and the substrate 2 are cut into individual pieces.
- the separated phosphor sheet 1 and base material 2 are aligned on the LED element 4 mounted on the mounting substrate 5 and heated as shown in (d). Crimp with a crimping tool.
- the substrate is allowed to cool to room temperature, and the substrate 2 is peeled off as shown in (e).
- FIG. 2 shows an example of individualization, LED element application, and dicing steps when the phosphor sheet is separated into individual pieces while the base material is continuous.
- the process of FIG. 2 also includes a process of cutting the phosphor sheet into individual pieces, and a process of heating the phosphor-containing sheet cut into the individual pieces and attaching them to the LED elements.
- the base material 2 is not separated.
- the substrate 2 is not cut at all, but may be partially cut as long as the substrate 2 is continuous.
- the individualized phosphor sheet 1 is aligned with the wafer 7 on the surface of which the LED elements before dicing are formed.
- the wafer 7 having the phosphor sheet 1 and the LED element before dicing formed on the surface thereof is crimped by a thermocompression bonding tool.
- the substrate is allowed to cool to room temperature, the substrate 2 is peeled off as shown in (e), the wafer is diced into individual pieces, and the LED elements with phosphor sheets separated into individual pieces as shown in (f) Get.
- the phosphor sheet When the phosphor sheet is heat-sealed to the wafer-level LED elements before dicing, the phosphor sheet can be cut together with the dicing of the LED element wafer after pasting.
- the dicing of the wafer is performed by the above-mentioned dicer, and the conditions such as the number of rotations and the cutting speed when cutting are optimized for the conditions for cutting the semiconductor wafer. Therefore, the conditions are optimal for cutting the phosphor sheet. Although it is difficult to do, it can cut suitably by using a phosphor sheet having a high elastic modulus at 25 ° C. as in the present invention.
- FIG. 3 shows an example of a process in the case where dicing is performed after the phosphor sheet and the wafer are bonded together. The process of FIG.
- the phosphor sheet 1 of the present invention is not cut in advance, and the wafer 7 on which the LED element before dicing is formed on the surface of the phosphor sheet 1 as shown in FIG. Position it so that it faces.
- the wafer 7 on which the phosphor sheet 1 and the LED element before dicing are formed on the surface is crimped by a thermocompression bonding tool. At this time, it is preferable to perform the pressure bonding step under vacuum or under reduced pressure so that air is not caught between the phosphor sheet 1 and the LED element 4.
- the wafer After the pressure bonding, it is allowed to cool to room temperature. After the substrate 2 is peeled off as shown in (c), the wafer is diced, and at the same time, the phosphor sheet 1 is cut into individual pieces, as shown in (d). An LED element with a phosphor sheet is obtained.
- the phosphor sheet of the present invention when the phosphor sheet of the present invention is attached to an LED element having an electrode on the upper surface, the phosphor sheet is removed to remove the phosphor sheet on the electrode portion. It is desirable to perform perforation processing (form a through hole) in that portion in advance before pasting.
- perforation processing form a through hole
- known methods such as laser processing and die punching can be suitably used for drilling, laser processing causes burning of the resin and deterioration of the phosphor, so punching with a die is more desirable.
- punching punching cannot be performed after the phosphor sheet is attached to the LED element. Therefore, it is essential to perform punching before attaching the phosphor sheet.
- Punching with a mold can open a hole of any shape or size depending on the electrode shape of the LED element to be attached. Any size and shape of the hole can be formed by designing the mold, but the electrode joint portion on the LED element inside and outside the 1 mm square is preferably 500 ⁇ m or less so as not to reduce the area of the light emitting surface.
- the hole is formed with a size of 500 ⁇ m or less in accordance with its size.
- an electrode for performing wire bonding or the like needs to have a certain size and is at least about 50 ⁇ m. Therefore, the hole is about 50 ⁇ m in accordance with the size.
- the size of the hole is too larger than the electrode, the light emitting surface is exposed, light leakage occurs, and the color characteristics of the LED light emitting device deteriorate.
- the wire touches at the time of wire bonding resulting in poor bonding. Therefore, in the drilling process, it is necessary to process a small hole of 50 ⁇ m or more and 500 ⁇ m or less with high accuracy within ⁇ 10%, and in order to improve the punching accuracy, the storage modulus of the phosphor sheet at 25 ° C. Is very important to be 0.1 MPa or more.
- an affixing device having an optical alignment (alignment) mechanism is required. At this time, it is difficult to align the phosphor sheet and the LED element in terms of work, and in practice, the alignment is often performed in a state where the phosphor sheet and the LED element are lightly contacted. At this time, if the phosphor sheet has adhesiveness, it is very difficult to move it in contact with the LED element. If the phosphor sheet of the present invention is aligned at room temperature, the phosphor sheet is not sticky, so that it is easy to align the phosphor sheet and the LED element in light contact.
- the illuminating device using the LED element to which the phosphor sheet obtained by the present invention is attached has a fluorescence processed accurately compared with the conventional liquid phosphor-containing resin dispensing and a method using a known phosphor sheet. Since the body sheet is provided on the LED element, a certain phosphor is present on the LED, and the unevenness of color and brightness is extremely reduced. In the dispensing method, it is difficult to form a constant film thickness because the liquid resin is supplied and the shape is determined by the surface tension.
- the film thickness of the phosphor sheet can be made thinner.
- the film thickness is 10 to 1000 ⁇ m on the LED element, and the film thickness at the center and at the midpoint of the line drawn from the center to any point on the light emitting surface end.
- a product provided with a phosphor-containing layer having a thickness difference within ⁇ 5%, more preferably within ⁇ 3% at the center is manufactured.
- the center point on the LED element means that since the LED element light emitting surface is rectangular, the center of the line segment drawn from the center to the end of the light emitting surface is the center and end part.
- the middle point of In the present invention the film thickness difference between the arbitrary intermediate point and the center point can be kept within ⁇ 5%. More preferably, it can be within ⁇ 3%.
- ⁇ Silicone resin> Ingredients for compounding silicone resin Resin main component (MeViSiO 2/2 ) 0.25 (Ph 2 SiO 2/2 ) 0.3 (PhSiO 3/2 ) 0.45 (HO 1/2 ) 0.03 (average composition, (A) Applicable) Hardness modifier ViMe 2 SiO (MePhSiO) 17.5 SiMe 2 Vi (average composition, corresponding to component (B)) Crosslinking agent (HMe 2 SiO) 2 SiPh 2 (corresponds to component (C).) * However, Me: methyl group, Vi: vinyl group, Ph: phenyl group Reaction inhibitor 1-ethynylhexanol Platinum catalyst Platinum (1,3-divinyl-1,1,3,3-tetramethyldisiloxane) complex 1,3 -Divinyl-1,1,3,3-tetramethyldisiloxane solution Platinum content 5% by weight Silicone resins 1 and 2 used in the examples were prepared so as to correspond to the “
- Silicone resin 1 Resin main component 75 parts by weight, hardness adjusting agent 10 parts by weight, cross-linking agent 25 parts by weight, Reaction inhibitor 0.025 parts by weight, platinum catalyst 0.01 parts by weight, silicone resin 2 Resin main component 75 parts by weight, hardness adjusting agent 10 parts by weight, cross-linking agent 25 parts by weight, 0.05 parts by weight of reaction inhibitor, 0.01 parts by weight of platinum catalyst, silicone resin 3 X-32-2528 (Shin-Etsu Chemical) ⁇ Silicone resin 4 KER6075 (Shin-Etsu Chemical).
- Measuring device Viscoelasticity measuring device ARES-G2 (TA Instruments) Geometry: Parallel disk type (15mm) Strain: 1% Angular frequency: 1 Hz Temperature range: 25 ° C to 140 ° C Temperature increase rate: 5 ° C./min Measurement atmosphere: In air.
- the phosphor sheet resin solution was coated with a “serapeel” BLK (manufactured by Toray Film Processing Co., Ltd.) using a slit die coater to form a film having a thickness of 100 ⁇ m. This operation was performed for each of the silicone resins 1 to 4.
- Film formation temperature is 1 hour at 120 ° C for silicones 1, 2 and 4. Since silicone 3 is a silicone adhesive used in a semi-cured state, it was heated at 120 ° C. for 10 minutes.
- Table 1 shows the storage elastic modulus at room temperature (25 ° C.), 100 ° C., and 140 ° C. of each sheet (containing 70 wt% phosphor).
- Adhesion test> After the phosphor sheet laminated on the base material is attached to the LED element at 100 ° C. and pressed for a predetermined time, it is returned to room temperature, and when the base material is peeled off, all the phosphor sheet adheres to the LED element and is on the base material. The minimum time that does not remain is defined as the bonding possible time. Adhesiveness is good if the phosphor sheet adheres to the LED element within 1 minute with a thermocompression bonding time and does not remain on the substrate. In the case where a part remains on the base material even after being adhered to the substrate, it was regarded as poor adhesion.
- Example 1 Using a 300 ml polyethylene container, 30% by weight of silicone resin 1 and “NYAG-02” as a phosphor (manufactured by Intematix: Ce-doped YAG phosphor, specific gravity: 4.8 g / cm 3 , D50: 7 ⁇ m) was mixed in a proportion of 70% by weight.
- holes having a diameter of 200 ⁇ m were punched into the phosphor sheet with a die punching device (manufactured by UHT). Ten diameters of the punched holes were inspected with a microscope equipped with a length measuring device, and the average value of the dimensions was determined. As a result, as shown in Table 2, holes almost as designed were obtained.
- the phosphor sheet was separated into 1 mm square ⁇ 10000 pieces using a cutting device (GCUT manufactured by UHT). The phosphor sheet and the substrate were cut together and completely separated. The cut surface had a good shape with no burrs or chips, and no reattachment of the cut portion occurred. 100 pieces were arbitrarily selected from the 10000 pieces, and the number of those having good cutting locations was selected, and the cutting processability was evaluated.
- the phosphor sheet cut into 1 mm square was arranged so that the phosphor sheet surface was in contact with the chip surface of the substrate on which the blue LED chip was mounted.
- a die bonding device manufactured by Toray Engineering
- the hole of the phosphor sheet and the surface electrode of the LED chip are aligned and pressed and bonded with a heating head at 100 ° C. from the base material side. 10 seconds.
- the substrate was peeled off, the phosphor sheet was completely adhered on the blue LED, and the phosphor sheet could be removed cleanly without any phosphor sheet remaining, Adhesion was good.
- Example 2 A phosphor sheet was obtained in the same manner as in Example 1 except that the silicone resin 2 was used instead of the silicone resin 1.
- the silicone resin 2 was used instead of the silicone resin 1.
- holes having a diameter of 200 ⁇ m were punched into the phosphor sheet and separated into 1 mm squares. Both the drilling workability and the cutting workability were as good as in Example 1.
- the phosphor sheet cut into 1 mm square was attached to the LED element in the same manner as in Example 1, the adherable time was 5 seconds. Further, the LED lighting test and the phosphor sheet thickness were evaluated in the same manner as in Example 1, and the results are shown in Table 2.
- Example 3 A phosphor sheet was obtained in the same manner as in Example 1 except that the silicone resin 2 was used instead of the silicone resin 1.
- the phosphor sheet was separated into 1 mm square pieces using a cutting device (GCUT manufactured by UHT). At this time, while the phosphor sheet was completely separated, the base material was half-cut and processed into a continuous state. The cut surface of the phosphor sheet had a good shape with no burrs or chips, and no reattachment of the cut portion occurred.
- the blue LED element wafer was diced with a dicing device (manufactured by DISCO), and the surface electrodes of the LED chips separated into pieces were wire-bonded, and then bonded without problems through the holes that were previously processed into the phosphor sheet. did it.
- Ten LED with the same phosphor sheet sealed with a transparent resin were prepared, connected to a DC power source and turned on, and it was confirmed that all 10 were turned on.
- Ten correlated color temperatures (CCT) were measured with a color illuminometer (Konica Minolta CL200A), and the difference between the maximum value and the minimum value was evaluated.
- the phosphor sheet thickness was evaluated in the same manner as in Example 1, and the results are shown in Table 2.
- Example 4 Using silicone resin 1, a phosphor sheet was obtained in the same manner as in Example 1. When holes having a diameter of 200 ⁇ m were punched out in the phosphor sheet in the same manner as in Example 1, the drilling workability was good. A 100 mm square phosphor sheet was placed so that the phosphor sheet surface was in contact with the surface of a 4-inch wafer that was not diced into individual pieces and on which the blue LED elements were formed. When the hole of the phosphor sheet and the surface electrode of the LED chip were aligned and pressed with a heating plate at 100 ° C. from the base material side, the adherable time was 10 seconds. After returning the sample pressure-bonded for 10 seconds to room temperature and then peeling off the base material, the phosphor sheet adheres completely to the blue LED and can be peeled off cleanly without any phosphor sheet remaining on the base material. The adhesiveness was good.
- the wafer of the blue LED element was diced from the back surface (the surface opposite to the surface on which the phosphor sheet was attached) with a dicing apparatus (manufactured by DISCO).
- the cut surface had a good shape with no burrs or chips, and no reattachment of the cut portion occurred.
- Comparative Example 1 Fabricate a phosphor-containing silicone resin for sheet preparation using silicone resin 2 instead of silicone resin 1 and apply it as a base material on “Therapyl” BLK (manufactured by Toray Film Processing Co., Ltd.) at 120 ° C. for 10 minutes. Heating and drying were performed to obtain a phosphor sheet having a thickness of 90 ⁇ m and a square of 100 mm.
- the silicone resin 2 had a low elasticity at room temperature and was sticky, so that it adhered to the mold. The average diameter of the holes was significantly smaller than the design.
- the phosphor sheets were separated into pieces in the same manner as in Example 1, but about half of them were reattached and could not be separated.
- Example 2 Using only the phosphor sheet that could be singulated without any problem, the same die bonding apparatus as in Example 1 was used to perform thermocompression bonding at 100 ° C. for 10 seconds on the blue LED element, the substrate was peeled off, and 150 ° C. for 30 minutes. Was heat-cured. When the substrate was peeled off after returning to room temperature, the phosphor sheet was completely adhered onto the blue LED, and the phosphor sheet could be removed cleanly without any phosphor sheet remaining on the substrate, and the adhesion was good. It was. When the surface electrode of the LED chip was wire-bonded, the size of the holes processed in the phosphor sheet in advance was small, and some wire bonders were in contact.
- Example 2 A phosphor sheet was obtained in the same manner as in Example 1 using the silicone resin 4 instead of the silicone resin 1.
- holes having a diameter of 200 ⁇ m were punched into the phosphor sheet and separated into 1 mm squares.
- the drilling workability and cutting workability were good results as in Example 1.
- the phosphor sheet cut into 1 mm square is placed so that the phosphor sheet surface is in contact with the chip surface of the substrate on which the blue LED chip is mounted, and the phosphor sheet is made using a die bonding apparatus (manufactured by Toray Engineering).
- the hole and the surface electrode of the LED chip were aligned and pressed from the base film side with a heating head at 100 ° C. for 1 minute. After returning to room temperature, the base film was peeled off.
- the phosphor sheet was incompletely bonded to the blue LED, and peeled off from the LED element together with the base film, and evaluation as an LED element was impossible.
- Example 3 A phosphor sheet was obtained in the same manner as in Example 1 using the silicone resin 4 instead of the silicone resin 1.
- a silicone resin 3 not containing a phosphor is applied on it with a slit die coater, heated at 120 ° C. for 10 minutes and dried to form a 10 ⁇ m thick adhesive layer on a 90 ⁇ m thick phosphor sheet.
- a phosphor sheet of the type was obtained.
- Example 2 Using only the phosphor sheet that could be singulated without any problem, the same die bonding apparatus as in Example 1 was used, and a blue LED element was subjected to thermocompression bonding at 100 ° C. for 10 seconds, the base film was peeled off, and 150 ° C. for 30 minutes. Was heat-cured. When the base film was peeled off after returning to room temperature, the phosphor sheet was completely adhered onto the blue LED, and the phosphor sheet could be removed cleanly without any phosphor sheet remaining on the base film. When the surface electrode of the LED chip was wire-bonded, the silicone resin 3 partially protruded into the holes that had been processed into the phosphor sheet in advance, and the wire bonder contacted.
- a certain amount of phosphor resin was dispensed on the chip surface of the substrate on which the blue LED chip was mounted and wire-bonded, and was cured by heating at 150 ° C. for 1 hour.
- Ten LEDs sealed with a phosphor-containing resin were prepared, connected to a DC power source and turned on, and it was confirmed that all 10 LEDs were turned on.
- the correlated color temperature (CCT) of all 10 samples was measured with a color illuminometer (Konica Minolta CL200A), and the difference between the maximum value and the minimum value was evaluated as the color temperature variation.
- the results are shown in Table 2. Since the dispensed phosphor-containing resin is formed in a dome shape, the film thickness difference between the center point and the center point-end middle point is very large.
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Abstract
Description
(A)平均単位式:
(R1 2SiO2/2)a(R1SiO3/2)b(R2O1/2)c
(式中、R1はフェニル基、炭素原子数1~6のアルキル基もしくはシクロアルキル基、または炭素原子数2~6のアルケニル基であり、ただし、R1の65~75モル%はフェニルであり、R1の10~20モル%はアルケニル基であり、R2は水素原子または炭素原子数1~6のアルキル基であり、a、b、およびcは、0.5≦a≦0.6、0.4≦b≦0.5、0≦c≦0.1、かつa+b=1を満たす数である。)
で表されるオルガノポリシロキサン、
(B)一般式:
R3 3SiO(R3 2SiO)mSiR3 3
(式中、R3はフェニル基、炭素原子数1~6のアルキル基もしくはシクロアルキル基、または炭素原子数2~6のアルケニル基であり、ただし、R3の40~70モル%はフェニルであり、R3の少なくとも1個はアルケニル基であり、mは5~50の整数である。)
で表されるオルガノポリシロキサン{(A)成分100重量部に対して5~15重量部}
(C)一般式:
(HR4 2SiO)2SiR4 2
(式中、R4はフェニル基、または炭素原子数1~6のアルキル基もしくはシクロアルキル基であり、ただし、R4の30~70モル%はフェニルである。)
で表されるオルガノトリシロキサン{(A)成分中と(B)成分中のアルケニル基の合計に対する本成分中のケイ素原子結合水素原子のモル比が0.5~2となる量}、および
(D)ヒドロシリル化反応用触媒{(A)成分と(B)成分中のアルケニル基と(C)成分中のケイ素原子結合水素原子とのヒドロシリル化反応を促進するに十分な量}
から少なくともなる架橋性シリコーン組成物。
(R1 2SiO2/2)a(R1SiO3/2)b(R2O1/2)c
(式中、R1はフェニル基、炭素原子数1~6のアルキル基もしくはシクロアルキル基、または炭素原子数2~6のアルケニル基であり、ただし、R1の65~75モル%はフェニルであり、R1の10~20モル%はアルケニル基であり、R2は水素原子または炭素原子数1~6のアルキル基であり、a、b、およびcは、0.5≦a≦0.6、0.4≦b≦0.5、0≦c≦0.1、かつa+b=1を満たす数である。)
で表されるオルガノポリシロキサン、
(B)一般式:
R3 3SiO(R3 2SiO)mSiR3 3
(式中、R3はフェニル基、炭素原子数1~6のアルキル基もしくはシクロアルキル基、または炭素原子数2~6のアルケニル基であり、ただし、R3の40~70モル%はフェニルであり、R3の少なくとも1個はアルケニル基であり、mは5~50の整数である。)
で表されるオルガノポリシロキサン{(A)成分100重量部に対して5~15重量部}
(C)一般式:
(HR4 2SiO)2SiR4 2
(式中、R4はフェニル基、または炭素原子数1~6のアルキル基もしくはシクロアルキル基であり、ただし、R4の30~70モル%はフェニルである。)
で表されるオルガノトリシロキサン{(A)成分中と(B)成分中のアルケニル基の合計に対する本成分中のケイ素原子結合水素原子のモル比が0.5~2となる量}、および
(D)ヒドロシリル化反応用触媒{(A)成分と(B)成分中のアルケニル基と(C)成分中のケイ素原子結合水素原子とのヒドロシリル化反応を促進するに十分な量}
から少なくともなる架橋性シリコーン組成物が好ましく用いられる。
*最大膜厚ズレ値は膜厚の最大値または最小値のうち平均膜厚との差が大きい方を選択する。
シリコーン樹脂を配合するための成分
樹脂主成分 (MeViSiO2/2)0.25(Ph2SiO2/2)0.3(PhSiO3/2)0.45(HO1/2)0.03 (平均組成、(A)成分に該当する。)
硬度調整剤 ViMe2SiO(MePhSiO)17.5SiMe2Vi (平均組成、(B)成分に該当する。)
架橋剤 (HMe2SiO)2SiPh2 ((C)成分に該当する。)
※ただしMe:メチル基、Vi:ビニル基、Ph:フェニル基
反応抑制剤 1-エチニルヘキサノール
白金触媒 白金(1,3-ジビニル-1,1,3,3-テトラメチルジシロキサン)錯体 1,3-ジビニル-1,1,3,3-テトラメチルジシロキサン溶液
白金含有量5重量%
実施例に用いたシリコーン樹脂1および2は、上記のシリコーン樹脂を配合するための成分を配合して本明細書における「本組成物」に該当するように作製し、シリコーン樹脂3及び4は市販品を利用した。
・シリコーン樹脂1
樹脂主成分75重量部、硬度調整剤10重量部、架橋剤25重量部、
反応抑制剤0.025重量部、白金触媒0.01重量部
・シリコーン樹脂2
樹脂主成分75重量部、硬度調整剤10重量部、架橋剤25重量部、
反応抑制剤0.05重量部、白金触媒0.01重量部
・シリコーン樹脂3
X-32-2528(信越化学工業)
・シリコーン樹脂4
KER6075(信越化学工業)。
測定装置 :粘弾性測定装置ARES-G2(TAインスツルメンツ製)
ジオメトリー:平行円板型(15mm)
ひずみ :1%
角周波数 :1Hz
温度範囲 :25℃~140℃
昇温速度 :5℃/分
測定雰囲気 :大気中。
シリコーン樹脂1~4それぞれを30重量部、蛍光体“NYAG-02”(Intematix社製:CeドープのYAG系蛍光体、比重:4.8g/cm3、D50:7μm)を70重量部で混合した蛍光体シート用樹脂液を、“セラピール”BLK(東レフィルム加工株式会社製)を基材として、スリットダイコーターで塗布して厚さ100μmの膜を成膜した。この作業をシリコーン樹脂1~4のそれぞれについて行った。成膜温度はシリコーン1,2,4は120℃で1時間。シリコーン3は、半硬化状態で使用するシリコーン接着剤であるので120℃で10分加熱した。
基材に積層した蛍光体シートを、LED素子に100℃で貼り付けて所定の時間圧着後に、室温に戻し、基材を剥がしたとき、蛍光体シートが全てLED素子に接着して基材上に残らない最小の時間を接着可能時間とした。加熱圧着時間が1分以内で蛍光体シートが全てLED素子に接着して基材上に残らないものを接着性良好とし、1分以上加熱圧着してもLED素子上に接着しないかあるいは部分的に接着しても一部が基材上に残るような場合は、接着性不良とした。
容積300mlのポリエチレン製容器を用いて、シリコーン樹脂1を30重量%、蛍光体として“NYAG-02”(Intematix社製:CeドープのYAG系蛍光体、比重:4.8g/cm3、D50:7μm)を70重量%の比率で混合した。
シリコーン樹脂1の代わりにシリコーン樹脂2を用いて実施例1と同様にして蛍光体シートを得た。実施例1と同様にして蛍光体シートに直径200μmの孔を打ち抜き、1mm角に個片化した。孔開け加工性、切断加工性はいずれも実施例1と同様に良好であった。実施例1と同様にして1mm角にカットした蛍光体シートをLED素子へ貼り付けたところ、接着可能時間は5秒であった。また、実施例1と同様にしてLED点灯試験および蛍光体シート膜厚の評価を行い、結果を表2に示した。
シリコーン樹脂1の代わりにシリコーン樹脂2を用いて実施例1と同様にして蛍光体シートを得た。実施例1と同様にして蛍光体シートに直径200μmの孔を打ち抜いたところ、孔開け加工性は良好であった。次に、蛍光体シートをカッティング装置(UHT社製GCUT)により1mm角に個片化した。このときに、蛍光体シートは完全に個片化しながら、基材はハーフカットとし、連続したままの状態に加工した。蛍光体シートの切断面はバリや欠けが無い良好な形状であり、切断箇所の再付着なども発生しなかった。
シリコーン樹脂1を用いて実施例1と同様にして蛍光体シートを得た。実施例1と同様にして蛍光体シートに直径200μmの孔を打ち抜いたところ、孔開け加工性は良好であった。100mm角の蛍光体シートを、個片にダイシングしていない、青色LED素子が表面に形成された4インチウェハ表面に蛍光体シート面が接触するように配置した。蛍光体シートの孔とLEDチップの表面電極を位置合わせして、基材側から100℃の加熱プレートで圧着したところ、接着可能時間は10秒であった。10秒間圧着させた試料を室温に戻した後、基材を剥がしたところ、蛍光体シートは青色LED上に完全に接着し、基材には蛍光体シートが全く残ること無くきれいに剥がすことができ、接着性は良好であった。
シリコーン樹脂1の代わりにシリコーン樹脂2を用いて、シート作成用蛍光体含有シリコーン樹脂を作製し、基材として“セラピール”BLK(東レフィルム加工株式会社製)上に塗布し、120℃で10分加熱、乾燥して膜厚90μm、100mm角の蛍光体シートを得た。実施例1と同様にして蛍光体シートに直径200μmの孔を打ち抜いたところ、シリコーン樹脂2の室温での弾性率が低すぎて粘着性を有するために金型に付着し、これにより加工後の孔の直径平均値は設計に対して大幅に小さくなった。実施例1と同様にして蛍光体シートを個片化したが、約半数が再付着して切り離すことができなかった。
シリコーン樹脂1の代わりにシリコーン樹脂4を用いて実施例1と同様に蛍光体シートを得た。実施例1と同様にして蛍光体シートに直径200μmの孔を打ち抜き、1mm角に個片化した。孔開け加工性、切断加工性は、実施例1と同様に良好な結果であった。1mm角にカットした蛍光体シートを、青色LEDチップが実装された基板のチップ表面に蛍光体シート面が接触するように配置し、ダイボンディング装置(東レエンジニアリング製)を用いて、蛍光体シートの孔とLEDチップの表面電極を位置合わせして、ベースフィルム側から100℃の加熱ヘッドで1分圧着させた。室温に戻した後、ベースフィルムを剥がしたところ、蛍光体シートは青色LEDとの接着が不完全で、ベースフィルムと共にLED素子上から剥がれてしまい、LED素子としての評価は不可能であった。
シリコーン樹脂1の代わりにシリコーン樹脂4を用いて実施例1と同様に蛍光体シートを得た。その上に蛍光体を含まないシリコーン樹脂3をスリットダイコーターで塗布し、120℃で10分加熱、乾燥し、膜厚90μmの蛍光体シートの上に、膜厚10μmの接着層を形成した積層型の蛍光体シートを得た。
容積300mlのポリエチレン製容器を用いて、シリコーン樹脂1を90重量%、蛍光体として“NYAG-02”(Intematix社製:CeドープのYAG系蛍光体、比重:4.8g/cm3、D50:7μm)を10重量%の比率で混合した。
2 基材
3 仮固定シート
4 LED素子
5 実装基板
6 加熱圧着ツール
7 LED素子を表面に形成したウェハ
Claims (11)
- 25℃での貯蔵弾性率が0.1MPa以上であり、100℃での貯蔵弾性率が0.1MPa未満である蛍光体含有シートであって、蛍光体含有シートの樹脂主成分が少なくとも下記の(A)~(D)の組成を含む架橋性シリコーン組成物をヒドロシリル化反応してなる架橋物であることを特徴とする蛍光体含有シート。
(A)平均単位式:
(R1 2SiO2/2)a(R1SiO3/2)b(R2O1/2)c
(式中、R1はフェニル基、炭素原子数1~6のアルキル基もしくはシクロアルキル基、または炭素原子数2~6のアルケニル基であり、ただし、R1の65~75モル%はフェニルであり、R1の10~20モル%はアルケニル基であり、R2は水素原子または炭素原子数1~6のアルキル基であり、a、b、およびcは、0.5≦a≦0.6、0.4≦b≦0.5、0≦c≦0.1、かつa+b=1を満たす数である。)
で表されるオルガノポリシロキサン、
(B)一般式:
R3 3SiO(R3 2SiO)mSiR3 3
(式中、R3はフェニル基、炭素原子数1~6のアルキル基もしくはシクロアルキル基、または炭素原子数2~6のアルケニル基であり、ただし、R3の40~70モル%はフェニルであり、R3の少なくとも1個はアルケニル基であり、mは5~50の整数である。)
で表されるオルガノポリシロキサン{(A)成分100重量部に対して5~15重量部}
(C)一般式:
(HR4 2SiO)2SiR4 2
(式中、R4はフェニル基、または炭素原子数1~6のアルキル基もしくはシクロアルキル基であり、ただし、R4の30~70モル%はフェニルである。)
で表されるオルガノトリシロキサン{(A)成分中と(B)成分中のアルケニル基の合計に対する本成分中のケイ素原子結合水素原子のモル比が0.5~2となる量}、および
(D)ヒドロシリル化反応用触媒{(A)成分と(B)成分中のアルケニル基と(C)成分中のケイ素原子結合水素原子とのヒドロシリル化反応を促進するに十分な量}
から少なくともなる架橋性シリコーン組成物。 - 蛍光体含有率が53重量%以上である請求項1記載の蛍光体含有シート。
- LED素子の波長変換層として用いられる請求項1または2記載の蛍光体含有シート。
- 貫通孔が形成されている請求項1~3のいずれかに記載の蛍光体含有シート。
- 請求項1~4のいずれかに記載の蛍光体含有シートを、LED素子が表面に形成された半導体ウェハに積層した積層体。
- 請求項1~4のいずれかに記載の蛍光体含有シートを用いて得られる発光装置であって、LED素子上に、膜厚10~1000μmであって、中心における膜厚と、中心から発光面端部の任意の点に引いた線分の中点での膜厚の差が、前記中心における膜厚±5%以内である蛍光体含有層が設けられた発光装置。
- 少なくとも、LED素子の発光面に、請求項1~4のいずれかに記載の蛍光体含有シートを加熱して貼り付ける工程を含むことを特徴とする発光装置の製造方法。
- 前記LED素子の発光面に前記蛍光体含有シートを貼り付ける温度が60℃以上250℃以下であることを特徴とする請求項7に記載の発光装置の製造方法。
- 請求項1~4のいずれかに記載の蛍光体含有シートを個片に切断する工程をさらに含み、前記LED素子の発光面に前記蛍光体含有シートを加熱して貼り付ける工程が、前記個片に切断された蛍光体含有シートを加熱してLED素子に貼り付ける工程である請求項7または8記載の発光装置の製造方法。
- 前記LED素子の発光面に前記蛍光体含有シートを加熱して貼り付ける工程が、複数のLED素子に前記蛍光体含有シートを加熱して一括して貼り付ける工程であり、さらに前記蛍光体含有シートの切断と前記LED素子のダイシングを一括して行う工程を含む請求項7または8記載の発光装置の製造方法。
- 請求項1~4のいずれかに記載の蛍光体含有シートをLED素子に貼り付ける前に、前記蛍光体含有シートに孔開け加工を施すことを特徴とする請求項7~10のいずれかに記載の発光装置の製造方法。
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EP2757603A1 (en) * | 2013-01-21 | 2014-07-23 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
US8928020B2 (en) | 2013-01-21 | 2015-01-06 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
US9431583B2 (en) | 2014-01-13 | 2016-08-30 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device |
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Also Published As
Publication number | Publication date |
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EP2610314B1 (en) | 2016-06-22 |
JP2013001791A (ja) | 2013-01-07 |
JP5287935B2 (ja) | 2013-09-11 |
CN103154146A (zh) | 2013-06-12 |
MY166515A (en) | 2018-07-05 |
US20140210338A1 (en) | 2014-07-31 |
EP2610314A4 (en) | 2014-09-17 |
TW201301582A (zh) | 2013-01-01 |
US8946983B2 (en) | 2015-02-03 |
EP2610314A1 (en) | 2013-07-03 |
SG191709A1 (en) | 2013-09-30 |
TWI536614B (zh) | 2016-06-01 |
CN103154146B (zh) | 2014-12-03 |
KR101330593B1 (ko) | 2013-11-18 |
KR20130079496A (ko) | 2013-07-10 |
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