WO2012169104A1 - 電子機器、構造体、及び、ヒートシンク - Google Patents
電子機器、構造体、及び、ヒートシンク Download PDFInfo
- Publication number
- WO2012169104A1 WO2012169104A1 PCT/JP2012/002516 JP2012002516W WO2012169104A1 WO 2012169104 A1 WO2012169104 A1 WO 2012169104A1 JP 2012002516 W JP2012002516 W JP 2012002516W WO 2012169104 A1 WO2012169104 A1 WO 2012169104A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- conductor
- electronic circuit
- stub
- conductor via
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2005—Electromagnetic photonic bandgaps [EPB], or photonic bandgaps [PBG]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0236—Electromagnetic band-gap structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
Definitions
- the present invention relates to an electronic device, a structure, and a heat sink.
- Electronic circuits such as ICs and LSIs mounted on a substrate are highly integrated in order to realize high speed and high functionality, and thus consume a large current.
- a heat sink is often provided on the electronic circuit.
- the heat sink is made of, for example, metal, and efficiently dissipates heat generated in the electronic circuit to the atmosphere, thereby suppressing an increase in the temperature of the electronic circuit.
- radiation noise particularly strong electromagnetic radiation noise (hereinafter referred to as “radiation noise”) is radiated into the atmosphere when the high-frequency component of the electromagnetic wave generated in the electronic circuit is combined with the heat sink and the heat sink becomes resonant. There is a problem. Since radiation noise causes a reduction in the wireless performance of the device, a means for suppressing radiation noise is desired.
- Patent Document 1 describes an electromagnetic wave absorbing material that alleviates the influence of the above problem.
- the electromagnetic wave absorbing material 1 has a sheet-like shape, and includes a first layer 11 made of a composite magnetic material having a high relative permeability and a second layer made of a composite dielectric material having a high relative permittivity.
- the layer 12 is laminated.
- Patent Document 1 describes that according to the electromagnetic wave absorbing material 1, a sufficient electromagnetic wave countermeasure effect can be obtained even if the sheet is thinned. And since a sheet
- the electromagnetic wave absorption frequency should be adjusted by controlling the relative permeability by adjusting the blending ratio of the magnetic materials that make up the composite magnetic material and by controlling the relative permittivity by adjusting the blending ratio of the dielectric materials that make up the composite dielectric material. Is described.
- Patent Document 2 describes another method for solving the problem of radiation noise. That is, as shown in FIG. 25, by connecting the inner layer pattern 121 having the common potential and the heat sink 3, the inner layer pattern 121, the mounting pattern 13, the mounting stud 14, and the heat sink 3 can be made equipotential. It is said that a heat sink device capable of attenuating radiation noise by an electric shielding (shielding) effect can be obtained. Further, by making the pad diameter of the mounting pattern 13 and the diameter of the mounting stud 14 substantially the same, space saving is realized and a heat sink device suitable for high-density mounting is obtained.
- Patent Literature 1 and Patent Literature 2 have the following problems.
- the first problem is that in the case of the technique of Patent Document 1 in which an electromagnetic wave absorbing material is inserted between a heat sink and an electronic circuit, the problem that the electromagnetic wave absorbing material causes a decrease in the thermal contact between the heat sink and the electronic circuit is essentially a problem. It is not solved. In other words, even if the decrease in thermal contact can be reduced by reducing the thickness of the electromagnetic wave absorbing material, the electromagnetic wave absorbing material exists between the heat sink and the electronic circuit, so that the thermal caused by the electromagnetic wave absorbing material still remains. The loss of contact remains.
- the second problem is that a frequency having an electromagnetic wave suppression effect cannot be freely controlled.
- the application frequency can be controlled by controlling the blending ratio of the magnetic material and the blending ratio of the dielectric material constituting each layer.
- the blending ratio of the magnetic material and the blending ratio of the dielectric material are limited for the purpose of obtaining sufficient flexibility and an electromagnetic wave attenuation effect.
- the frequency that can be actually used is considered to be about 700 MHz to 900 MHz, and cannot cope with a high frequency band such as the GHz band used in wireless communication in recent years.
- Patent Document 2 space saving can be realized.
- the mounting stud 14 requires the mounting pattern 13 having through holes up to the inner layer, a mounting space is required up to the inner layer of the multilayer printed board 11.
- this is not desirable because there is a layer in which wirings are arranged at a high density in the signal layer of the inner layer of the substrate.
- An object of the present invention is to provide an electronic device including a substrate and a heat sink, which can suppress radiation noise of an arbitrary frequency without causing a decrease in thermal contact between the heat sink and the electronic circuit.
- a substrate a conductor plane provided on the inner layer or surface of the substrate, an electronic circuit mounted on the substrate, and an electronic circuit mounted on the upper surface of the electronic circuit, the electronic circuit in a plan view.
- a heat sink made of a conductive material that has a portion that does not overlap with the conductor plane, and is connected to the heat sink at a surface in contact with the electronic circuit of the heat sink and extends toward the conductor plane.
- an electronic device having a conductive via and a stub connected to the conductive via and extending opposite to the conductive plane.
- the heat sink attached to the inner layer or the upper surface of the electronic circuit mounted on the substrate having the conductor plane on the surface is attached to the region excluding the region in contact with the electronic circuit.
- the heat sink is attached to the upper surface of an electronic circuit mounted on an inner layer or a substrate having a conductor plane on the surface, excluding a region in contact with the electronic circuit on a surface in contact with the electronic circuit.
- a heat sink having the structure attached thereto is provided in the region.
- radiation noise may occur when the heat sink and the conductor plane become parallel plate waveguides and behave as a cavity resonator with an open end.
- the stub forms a microstrip line having a conductor plane as a return path, and operates as an open stub.
- the parallel plate waveguide is described by an inductance that is a series impedance part and a capacitance that is a parallel admittance part.
- the electronic apparatus of the present invention has a unit structure in which an open stub and an inductance by a conductor via are added in series as parallel admittance to a parallel plate waveguide.
- the unit structure includes a series impedance portion (inductance component of a parallel plate waveguide), a parallel admittance portion (“capacitance component of a parallel plate line”, and a component in which an inductance and an open stub of a conductor via are connected in series. "Is connected in parallel to each other). The amplitude of the electromagnetic wave propagating in such an equivalent circuit is attenuated as it travels in a frequency band where the parallel admittance portion becomes inductive.
- the structure behaves as an electromagnetic bandgap (EBG) structure at a frequency at which the parallel admittance portion becomes inductive.
- ECG electromagnetic bandgap
- an electronic device including a substrate and a heat sink, and an electronic device capable of suppressing radiation noise of an arbitrary frequency without causing a decrease in thermal contact between the heat sink and the substrate is realized.
- FIGS. 1 and 2 are cross-sectional views of the electronic apparatus according to the first embodiment of the present invention. 1 is a cross-sectional view taken along the line BB ′ in FIG. 2, and FIG. 2 is a cross-sectional view taken along the line AA ′ in FIG. Note that the x, y, and z axes are defined as shown in FIGS.
- the electronic device of the present embodiment includes a substrate 101, an electronic circuit 102, and a heat sink 103.
- An electronic circuit 102 such as an IC / LSI is mounted on a substrate 101, and a heat sink 103 is attached on the electronic circuit 102.
- the substrate 101 includes a conductor plane 104 made of, for example, copper, aluminum, or the like on the surface on which the electronic circuit 102 is mounted or on the inner layer.
- the conductor plane 104 is provided so as to face the heat sink 103.
- the conductor plane 104 is provided in parallel with the xy plane.
- the layer in the substrate 101 on which the conductor plane 104 is formed is not particularly limited.
- the conductor plane 104 can be formed near the surface layer of the substrate 101.
- the layer of the conductor plane 104 may be formed immediately below the resist layer formed on the surface of the substrate 101.
- the conductor plane 104 can be formed in a lower layer in the substrate 101 than in this example. That is, the conductor plane 104 layer may be formed in a lower layer than the signal line layer formed in the substrate 101.
- the laminated structure of the substrate 101 is not particularly limited, but it is preferable that a layer made of a conductive material such as a wiring is not located near the stub 106 described below.
- the heat sink 103 is made of a conductive material such as metal.
- the heat sink 103 has a portion that does not overlap the electronic circuit 102 in plan view, and the portion faces the conductor plane 104.
- a dielectric layer 107 (hereinafter referred to as “dielectric material”) is formed on at least a part of the region other than the region in contact with the electronic circuit 102.
- Layer 107 a dielectric layer (hereinafter referred to as “dielectric material”) is formed on at least a part of the region other than the region in contact with the electronic circuit 102.
- the dielectric layer 107 may be formed on the first surface via a conductive layer (not shown) made of copper or the like. In this way, the connection between the conductor via 105 and the heat sink 103 described below is sufficiently ensured.
- the shape of the first surface of the heat sink 103 is not particularly limited, and may be any shape such as a rectangle, other polygons, and a circle in addition to the square shown in FIG.
- At least one conductor via 105 connected to the heat sink 103 exists inside the dielectric layer 107.
- the conductor via 105 is connected to the heat sink 103 via the conductive layer. That is, the conductor via 105 is connected to the heat sink 103 on the surface that contacts the electronic circuit 102 of the heat sink 103.
- the conductor via 105 extends toward the conductor plane 104. Note that one end of the conductor via 105 does not contact the conductor plane 104.
- At least one stub 106 is formed on the surface of the dielectric layer 107 opposite to the surface in contact with the heat sink 103 (the lower surface in FIG. 1) or inside the dielectric layer 107 so as to face the conductor plane 104. Is formed.
- the stub 106 is made of a conductive material, is connected to the conductor via 105 via one end side, and extends opposite to the conductor plane 104.
- the stub 106 shown in FIG. 2 is connected to the conductor via 105 through one end and extends linearly in parallel with the xy plane.
- the shape of the stub 106 is not limited to a linear shape, and any shape can be selected within a range that does not affect the essential effects of the present embodiment described below.
- a spiral shape as shown in FIG. 3, a meander shape as shown in FIG. 4, or other shapes may be used.
- the planar shapes of the plurality of stubs 106 may all be the same, or different ones may be mixed. Even if it does in this way, the essential effect of this embodiment demonstrated below is not affected.
- the degree of freedom of arrangement of the stubs 106 is increased, it is possible to arrange more stubs 106 regardless of the shape and size of the area where the stubs 106 are arranged.
- the electronic component 110 is present on the surface of the substrate 101, and the electronic component 110 has reached the height at which the stub 106 is disposed, which hinders the placement of the stub 106. Even in such a case, the stub 106 can be arranged avoiding such an electronic component 110.
- the electronic apparatus of the present embodiment includes a stub 106, a conductor via 105 connected to the stub 106, a partial region including a region facing the stub 106 of the conductor plane 104, and a heat sink. At least one unit structure 109 having a partial region including a region facing the stub 106 of 103 is provided. In the case where the electronic apparatus has a plurality of unit structures 109, the unit structures 109 may be repeatedly (eg, periodically) arranged with a certain regularity, but are not limited to such an arrangement.
- a region through which the first surface passes when the first surface is moved parallel to the z-axis direction to the conductor plane 104 is referred to as a region (i) 108 (see FIG. 1).
- FIG. 6 shows a part of the cross-sectional view along CC ′ in FIG. 2 (in the vicinity of the unit structure 109).
- h / w is set to 1 or less. Is preferred.
- FIG. 7 shows an example of a graph in which the h / w dependency of the electromagnetic bandgap frequency band is plotted based on an equivalent circuit.
- the frequency band that behaves as an electromagnetic bandgap structure becomes wider. That is, radiation noise can be suppressed in a wide frequency band by designing so that h / w becomes a small value.
- FIG. 8 is a cross-sectional view showing an example of the manufacturing process of the present embodiment.
- a dielectric layer 107 (dielectric substrate) having copper foils 111 and 112 formed on both sides is prepared.
- the copper foil 111 and 112 and the through-hole which penetrates the dielectric material layer 107 are formed, and copper is plated inside the said through-hole, and it is a conductor via.
- the state shown in (c) is obtained.
- the conductor via 105 is connected to the copper foils 111 and 112.
- the stub 106 is formed by forming a desired pattern on the copper foil 112 by etching.
- the copper foil 111, the stub 106, and a partial region of the dielectric layer 107 are hollowed out to obtain the state (d).
- the structure shown in (d) is attached to the bottom surface of the heat sink 103. The attachment is performed using a conductive adhesive, tape, or the like, so that the connection between the conductor via 105 and the heat sink 103 via the copper foil 111 is ensured.
- the substrate 101 includes a conductor plane 104 on the surface on which the electronic circuit 102 is mounted or an inner layer, and the electronic circuit 102 is mounted at a predetermined position.
- FIG. 9 shows an equivalent circuit diagram of a unit structure included in the electronic device of the present embodiment.
- the first surface of the heat sink 103 and the conductor plane 104 provided on the substrate 101 form a parallel plate waveguide.
- the stub 106 forms a microstrip line with the conductor plane 104 as a return path, and functions as an open stub.
- the series impedance and parallel admittance of the equivalent circuit are expressed by the following equations (1) and (2), respectively.
- (beta) contained in Formula (2) is represented by Formula (3).
- the propagation of the electric field component of the electromagnetic wave in the one-dimensional transmission line is expressed by the following equation (4) except for the time-dependent factor, where the traveling direction of the electromagnetic wave is the x-axis direction.
- ⁇ included in Expression (4) is expressed by Expression (5).
- E one-dimensional transmission line of an electromagnetic wave electric field component
- E 0 amplitude of an electromagnetic wave electric field component of the one-dimensional transmission line
- gamma propagation constant in the one-dimensional transmission line
- Equation (4) becomes an electric field that attenuates as it proceeds in the x-axis positive direction. It can be seen that has a characteristic as an electromagnetic band gap. That is, this structure behaves as an electromagnetic bandgap structure in a frequency band where Equation (2) is inductive. In the electromagnetic bandgap structure, propagation of electromagnetic waves is prohibited, so that the electromagnetic bandgap structure can be used for suppressing the resonance phenomenon. This can be used to suppress radiation noise from the heat sink 103.
- the frequency band having the electromagnetic bandgap structure can be adjusted by adjusting the stub length of the stub 106 constituting the parallel admittance part. That is, by adjusting the stub length, it is possible to control the frequency band in which this structure behaves as an electromagnetic band gap structure.
- FIG. 10 shows a graph comparing the amount of radiated noise by analyzing the electronic device of the present embodiment and the electronic device of the comparative example by electromagnetic field analysis.
- “Comparative example 1” has the same configuration as that of the electronic apparatus of the present embodiment, except that the unit structure of the present embodiment is not included.
- “Comparative example 2” has the same configuration as that of the electronic apparatus of the present embodiment, except that the dielectric layer 107, the conductor via 105, and the stub 106 of the present embodiment are not included.
- the amount of radiation noise from the electronic apparatus of the present embodiment is Comparative Example 1. It can be seen that the amount of radiation noise from the electronic devices 2 and 2 is smaller. That is, according to the electronic apparatus of this embodiment, it can be seen that the amount of radiation noise can be reduced.
- the propagation of electromagnetic waves in the region (i) 108 can be suppressed.
- the heat dissipation performance of the heat sink 103 is not essentially hindered.
- the frequency having the radiation noise suppressing effect can be adjusted by adjusting the length of the stub 106. For this reason, it is applicable to radiation noise suppression of an arbitrary frequency.
- 11 and 12 are plan views showing the relationship between the stub and the conductor via of the present embodiment.
- one stub 106 is connected to one conductor via 105 (see FIGS. 2 to 5).
- two stubs 106 and 106 ' can be connected to one conductor via 105 (see FIG. 11).
- three stubs 106, 106 ′ and 106 ′′ can be connected to one conductor via 105 (see FIG. 12).
- four or more stubs can be connected to one conductor via 105.
- the planar shape of each stub is not particularly limited, and any shape can be selected.
- the electronic device of the present embodiment includes a plurality of conductor vias 105
- the number of stubs connected to each conductor via 105 may be the same or different numbers may be mixed.
- a plurality of stubs connected to one conductor via 105 may have different lengths (stub lengths). For example, all the lengths of the plurality of stubs connected to one conductor via 105 may be different. In addition, all the lengths of a plurality of stubs connected to one conductor via 105 can be made the same.
- Such a method of manufacturing an electronic device according to the present embodiment can be realized in the same manner as in the first embodiment. That is, the pattern when etching the copper foil 112 to form the stub from the state shown in FIG. 8C is changed according to the present embodiment, and the other steps are the same as in the first embodiment.
- the electronic device of this embodiment can be manufactured.
- the unit structure 109 of the present embodiment includes a conductor via 105, one or more stubs connected to the conductor via 105, a partial region including a region facing the one or more stubs of the conductor plane 104, a heat sink 103 including a partial region including a region facing the one or more stubs.
- FIG. 13 shows an equivalent circuit diagram of a unit structure in which two stubs 106 and 106 ′ are connected to one conductor via 105 as shown in FIG.
- FIG. 14 shows an equivalent circuit diagram of a unit structure 109 in which three stubs 106, 106 ′ and 106 ′′ are connected to one conductor via 105 as shown in FIG.
- the frequency band in which the structure of this embodiment behaves as an electromagnetic bandgap structure can be adjusted by the stub length of the stub.
- a plurality of stubs having different lengths can be provided in the unit structure 109. In such a case, it behaves as an electromagnetic bandgap structure in the frequency band corresponding to each stub length.
- the frequency band of radiation noise that can suppress propagation by such a unit structure 109 is a frequency band that includes all frequency bands corresponding to each stub length. That is, according to the present embodiment, the frequency band of radiation noise that can suppress propagation is widened.
- the frequency band of radiation noise that can suppress propagation may be a continuous range (eg, 1 GHz to 5 GHz) or an intermittent range (eg, 1 GHz to 5 GHz). In some cases, 2.5 GHz and 3.5 GHz to 5 GHz.
- these stubs have the effect of widening the electromagnetic band gap corresponding to the stub length. That is, radiation noise can be suppressed in a wider frequency band.
- FIG. 15 is a cross-sectional view in which a part of the electronic device of the present embodiment is extracted.
- a space filled with air is formed in a space between the substrate 101 having the conductor plane 104 and the dielectric layer 107 in which the conductor via 105 and the stub 106 are formed. Existed (see FIG. 1).
- part or all of the gap is filled with the dielectric layer 113.
- the conductor plane 104 and the stub 106 are obtained.
- a dielectric material having fluidity may be poured into the gaps between the two and then solidified.
- the thickness of the dielectric layer 107 in which the copper foils 111 and 112 are formed on both surfaces shown in FIG. 8A is made equal to the thickness of the electronic circuit 102, so that FIG.
- the gap may be designed to be eliminated (see FIG. 16).
- a step corresponding to the thickness of the stub 106 is formed between the stub 106 formed by patterning the copper foil 112 and a region where the stub 106 is not formed. A slight gap remains in the vicinity of the step.
- the conductor plane 104 is formed inside the substrate 101, and a dielectric layer that is a part of the substrate 101 exists between the conductor plane 104 and the stub 106. Become. That is, the conductor plane 104 and the stub 106 do not contact each other.
- Equation (3) the frequency dependence of the input impedance of the open stub formed by the stub increases as the effective relative dielectric constant of the open stub increases. That is, by using a material having a high relative dielectric constant (eg, dielectric ceramics for LTCC (Low Temperature Ceramics)) as the material used for the dielectric layer 113 shown in FIG. 15, the stub length l is not increased. It is possible to lower the frequency band that behaves as an electromagnetic bandgap structure.
- a material having a high relative dielectric constant eg, dielectric ceramics for LTCC (Low Temperature Ceramics)
- the effective dielectric constant of the open stub becomes larger than the dielectric constant of the vacuum due to the reduction of the volume occupied by the air gap.
- the unit structure shown in the first and second embodiments can be reduced in size. As a result, the number of unit structures that can be arranged per unit area can be increased.
- the fourth embodiment of the present invention will be described below with reference to the drawings.
- the present embodiment is different from the first to third embodiments in that a plurality of types of unit structures 109 having different frequency bands of radiation noise that can suppress propagation are arranged. Since other configurations are the same as those of the first, second, or third embodiment, description thereof is omitted here.
- FIGS. 17 and 18 are cross-sectional views of the electronic apparatus of the present embodiment, and correspond to FIG. 2 used in the description of the first embodiment.
- the unit structure 109 is simply shown as a square.
- the second unit structure 109 ′ is arranged in a donut shape so as to surround the electronic circuit 102
- the first unit structure 109 is arranged in a donut shape so as to surround the electronic circuit 102 on the outer periphery thereof. Has been placed.
- the first unit structure 109 and the second unit structure 109 ′ are different in the frequency band of radiation noise that can suppress propagation.
- means for making the length of the stub 106 included in the first unit structure 109 different from the length of the stub 106 included in the second unit structure 109 ′ may be considered.
- means for making the number of stubs 106 included in each unit structure different is also conceivable. Note that “the frequency bands of radiation noise that can suppress propagation are different” means that they do not completely match, and some frequency bands may overlap.
- the first unit structures 109 and the second unit structures 109 ′ are alternately arranged in a row in a donut shape so as to surround the electronic circuit 102.
- the number of various unit structures to be arranged is not particularly limited, and one or a plurality of unit structures can be arranged. Furthermore, the number of unit structures to be arranged may be different for each type. Further, the unit structures may be regularly arranged as shown in FIGS. 17 and 18, or the unit structures may be randomly arranged so as not to have regularity.
- the manufacturing method of the electronic device of the present embodiment can be realized according to the manufacturing method described in the first to third embodiments.
- the frequency band in which the structure of this embodiment behaves as an electromagnetic bandgap structure can be adjusted by the stub length of the stub. That is, for example, when the stub lengths of a plurality of types of unit structures included in the electronic device of the present embodiment are different for each unit structure, each unit structure has an electromagnetic band gap characteristic corresponding to each stub length. . Further, when the number of stubs included in each unit structure is different, each unit structure has respective electromagnetic band gap characteristics corresponding to the number and length of each stub.
- the electronic apparatus of the present embodiment having a plurality of types of unit structures having different electromagnetic band gap characteristics, it is possible to realize the electromagnetic band gap characteristics covering a wide frequency band as a whole of the plurality of types of unit structures. it can. As a result, radiation noise can be suppressed in a wide frequency band.
- the frequency band of radiation noise that can suppress propagation may be a continuous range (eg, 1 GHz to 5 GHz) or an intermittent range (eg, 1 GHz to 5 GHz). In some cases, 2.5 GHz and 3.5 GHz to 5 GHz.
- FIG. 19 is a cross-sectional view of the electronic apparatus of the present embodiment, and corresponds to FIG. 2 used in the description of the first embodiment.
- a plurality of unit structures 109 having conductor vias 105 are provided in the region (ii) 114, and the plurality of unit structures 109 are arranged with the following relationship. That is, when any one of the plurality of unit structures 109 having the conductor via 105 in the region (ii) 114 is selected, the distance from the conductor via 105 of the unit structure 109 is less than ⁇ / 2, preferably ⁇ / Within four, at least one conductor via 105 included in another unit structure 109 is located.
- the conductor via 105 is located in the region (ii) 114.
- a unit structure 109 that does not have the conductor via 105 may be included in the region (ii) 114.
- FIG. 20 shows another example of the electronic device of the present embodiment.
- the electronic device has the same configuration as that described with reference to FIG.
- the manufacturing method of the electronic device of the present embodiment can be realized in the same manner as in the first to fourth embodiments.
- the unit structure having the conductor via 105 in the region (ii) 114 can suppress the ⁇ / 4 resonance in which the conductor via 105 is a short-circuited end and the end of the heat sink 103 is an open end.
- the positional relationship of the plurality of unit structures having the conductor vias 105 in the region (ii) 114 is arranged such that the other conductor vias 105 are arranged within a distance of less than ⁇ / 2, preferably within ⁇ / 4 from one conductor via 105.
- the resonance that causes the electromagnetic wave having the wavelength ⁇ to be radiated in the vicinity of the end of the heat sink 103 can be suppressed, so that a large radiation noise suppressing effect can be obtained.
- the frequency of the electromagnetic wave for which a radiation noise suppression effect is desired is a design matter, and for example, the 2.4 GHz band and / or the 5 GHz band can be considered.
- FIG. 21 is a cross-sectional view of the electronic apparatus of the present embodiment, and corresponds to FIG. 2 used in the description of the first embodiment.
- the length of the line segment connecting any two points on the outer periphery of the first surface of the heat sink 103 is ⁇ A bottom surface that is less than / 2.
- the length of the diagonal line is less than ⁇ / 2.
- the diameter of the said circle is less than (lambda) / 2.
- the electronic device of this embodiment has only one unit structure.
- the method for manufacturing an electronic device according to the present embodiment can be realized in the same manner as in the first to fifth embodiments.
- the unit structure provided in the heat sink 103 of the present embodiment operates so as to suppress the ⁇ / 4 resonance in which the conductor via 105 is always a short-circuited end and the end of the heat sink 103 is an open end. Therefore, the radiation noise suppression effect can be realized with only one unit structure.
- the seventh embodiment of the present invention will be described below with reference to the drawings.
- the configuration of the unit structure 109 is different from those of the first to sixth embodiments.
- Other configurations are the same as those in the first, second, third, fourth, fifth, or sixth embodiment, and thus description thereof is omitted here.
- FIG. 22 is a cross-sectional view of the electronic apparatus of the present embodiment, and shows a part necessary for the description of the present embodiment.
- the unit structure 109 of this embodiment is different from the first to sixth embodiments in that an island-shaped conductor 115 is formed instead of the stub 106.
- Other configurations of the unit structure 109 are the same as those in the first to sixth embodiments.
- the island-shaped conductor 115 is connected to the conductor via 105 and faces the conductor plane 104 and the heat sink 103.
- the planar shape of the island-shaped conductor 115 is not particularly limited, and may be any shape other than a square, a rectangle, another quadrangle, and a circle. In addition, when it has the some island-like conductor 115, those plane shapes may all be the same, and different plane shapes may be mixed.
- the manufacturing method of the electronic device of the present embodiment can be realized in the same manner as in the first to sixth embodiments.
- FIG. 23 shows an equivalent circuit diagram of the unit structure of the present embodiment.
- the first surface of the heat sink 103 and the conductor plane 104 provided on the substrate 101 form a parallel plate waveguide.
- the island-shaped conductor 115 forms a parallel plate capacitance with the conductor plane 104.
- the series impedance and parallel admittance of the equivalent circuit are expressed by the following equations (6) and (7), respectively.
- the frequency behaves as an electromagnetic band gap structure at a frequency where equation (7) is inductive (Im [Y] ⁇ 0). That is, according to the unit structure of the present embodiment, the frequency band that behaves as an electromagnetic bandgap structure is adjusted by adjusting the size of the island-shaped conductor 115 and / or the length of the conductor via 105, etc. It can be adjusted by adjusting Lvia and Cpatch.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
以下、本発明の第1の実施の形態について図面を参照して説明する。
ω: 角周波数
Lppw: 平行平板導波路インダクタンス
Cppw: 平行平板導波路キャパシタンス
Zos: オープンスタブ特性インピーダンス
β: オープンスタブの位相定数
l: オープンスタブのスタブ長
Lvia: 導体ビアインダクタンス
εeff: オープンスタブの実効比誘電率
ε0: 真空中の誘電率
μ0: 真空中の透磁率
Z: 伝送線路の直列インピーダンス
Y: 伝送線路の並列アドミタンス
E0: 一次元伝送線路の電磁波の電場成分の振幅
γ: 一次元伝送線路中の伝搬定数
以下、本発明の第2の実施の形態について図面を参照して説明する。本実施形態は、スタブと導体ビアとの関係が第1の実施形態と異なる。その他の構成は第1の実施形態と同様であるので、ここでの説明は省略する。
以下、本発明の第3の実施の形態について図面を参照して説明する。本実施形態は、導体プレーン104を備えた基板101と、導体ビア105及びスタブ106が形成された誘電体層107とで挟まれた空間における構成が、第1及び第2の実施形態と異なる。その他の構成は第1又は第2の実施形態と同様であるので、ここでの説明は省略する。
以下、本発明の第4の実施の形態について図面を参照して説明する。本実施形態は、伝搬を抑制できる放射ノイズの周波数帯が異なる複数種類の単位構造109が配置されている点で、第1乃至第3の実施形態と異なる。その他の構成は第1、第2又は第3の実施形態と同様であるので、ここでの説明は省略する。
以下、本発明の第5の実施の形態について図面を参照して説明する。本実施形態は、単位構造109の配置方法が、第1乃至第4の実施形態と異なる。その他の構成は第1、第2、第3又は第4の実施形態と同様であるので、ここでの説明は省略する。
以下、本発明の第6の実施形態について図面を参照して説明する。本実施形態は、ヒートシンク103の構造、及び、単位構造109の配置の仕方が、第1乃至第5の実施形態と異なる。その他の構成は第1、第2、第3、第4又は第5の実施形態と同様であるので、ここでの説明は省略する。
以下、本発明の第7の実施形態について図面を参照して説明する。本実施形態は、単位構造109の構成が、第1乃至第6の実施形態と異なる。その他の構成は第1、第2、第3、第4、第5又は第6の実施形態と同様であるので、ここでの説明は省略する。
ω: 角周波数
Lppw: 平行平板導波路インダクタンス
Cppw: 平行平板導波路キャパシタンス
Zos: オープンスタブ特性インピーダンス
Lvia: 導体ビアインダクタンス
Cpatch: 島状導体と導体プレーン間のキャパシタンス
Z: 伝送線路の直列インピーダンス
Y: 伝送線路の並列アドミタンス
Claims (13)
- 基板と、
前記基板の内層、または、表面に設けられた導体プレーンと、
前記基板に実装された電子回路と、
前記電子回路の上面に取り付けられ、平面視で前記電子回路と重ならない部分を有し、前記導体プレーンと対峙する、導電性の材料で構成されたヒートシンクと、
前記ヒートシンクの前記電子回路と接する面で前記ヒートシンクと接続するとともに、前記導体プレーンに向かって延伸する導体ビアと、
前記導体ビアと接続し、前記導体プレーンと対峙して延伸するスタブと
を有する電子機器。 - 請求項1に記載の電子機器において、
前記ヒートシンクの前記電子回路と接する面上であって、前記電子回路と接する領域を除く領域に形成された誘電体層を有し、
前記導体ビアは、前記誘電体層の内部に形成され、
前記スタブは、前記誘電体層の内部又は表面に形成される電子機器。 - 請求項1または2に記載の電子機器において、
1つの前記導体ビアに、当該導体ビアを起点として延伸する複数の前記スタブが接続している電子機器。 - 請求項1から3のいずれか1項に記載の電子機器において、
前記導体ビアは複数設けられ、
第1の前記導体ビアと接続する第1の前記スタブの長さと、第2の前記導体ビアと接続する第2の前記スタブの長さは異なる電子機器。 - 請求項1から4のいずれか1項に記載の電子機器において、
放射ノイズを抑制したい電磁波の周波数に対する波長をλとした場合、
平面視で、前記ヒートシンクの外縁部からの距離がλ/4未満である前記導体ビアを複数有し、
平面視で、第1の前記導体ビアからλ/2未満の距離に、前記ヒートシンクの外縁部からの距離がλ/4未満である他の前記導体ビアが存在する電子機器。 - 請求項5に記載の電子機器において、
前記放射ノイズを抑制したい電磁波の周波数は、2.4GHz帯及び/又は5GHz帯である電子機器。 - 内層、または、表面に導体プレーンを有する基板に実装された電子回路の上面に取り付けられるヒートシンクの前記電子回路と接する面における前記電子回路と接する領域を除く領域に取り付けられる構造体であって、
前記ヒートシンクに取り付けられた状態で、前記ヒートシンクの前記電子回路と接する面で前記ヒートシンクと接続する導体ビアと、
前記導体ビアと接続し、前記ヒートシンクが前記基板に実装された前記電子回路の上面に取り付けられた状態で、前記導体プレーンと対峙するように延伸しているスタブと、
を有する構造体。 - 請求項7に記載の構造体において、
誘電体層をさらに有し、
前記導体ビアは、前記誘電体層の内部に設けられ、
前記スタブは、前記誘電体層の内部又は表面に設けられている構造体。 - 請求項7または8に記載の構造体において、
1つの前記導体ビアに、当該導体ビアを起点として延伸する複数の前記スタブが接続している構造体。 - 請求項7から9のいずれか1項に記載の構造体において、
前記導体ビアは複数設けられており、
第1の前記導体ビアと接続する第1の前記スタブの長さと、第2の前記導体ビアと接続する第2の前記スタブの長さは異なる構造体。 - 請求項7から10のいずれか1項に記載の構造体において、
放射ノイズを抑制したい電磁波の周波数に対する波長をλとした場合、
前記ヒートシンクに取り付けられた状態における平面視で、
前記ヒートシンクの外縁部からの距離がλ/4未満となる前記導体ビアを複数有し、
第1の前記導体ビアからλ/2未満の距離に、前記ヒートシンクの外縁部からの距離がλ/4未満である他の前記導体ビアが存在する構造体。 - 請求項11に記載の構造体において、
前記放射ノイズを抑制したい電磁波の周波数は、2.4GHz帯及び/又は5GHz帯である構造体。 - 内層、または、表面に導体プレーンを有する基板に実装された電子回路の上面に取り付けられるヒートシンクであって、
前記電子回路と接する面における前記電子回路と接する領域を除く領域に、請求項7から12のいずれか1項に記載の構造体が取り付けられたヒートシンク。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013519352A JP5821954B2 (ja) | 2011-06-10 | 2012-04-11 | 電子機器、構造体、及び、ヒートシンク |
US14/124,664 US9629282B2 (en) | 2011-06-10 | 2012-04-11 | Electronic device, structure, and heat sink |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011130358 | 2011-06-10 | ||
JP2011-130358 | 2011-06-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012169104A1 true WO2012169104A1 (ja) | 2012-12-13 |
Family
ID=47295697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/002516 WO2012169104A1 (ja) | 2011-06-10 | 2012-04-11 | 電子機器、構造体、及び、ヒートシンク |
Country Status (3)
Country | Link |
---|---|
US (1) | US9629282B2 (ja) |
JP (1) | JP5821954B2 (ja) |
WO (1) | WO2012169104A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014069658A1 (ja) * | 2012-11-05 | 2014-05-08 | 株式会社デンソー | 高周波モジュール |
JP2016039743A (ja) * | 2014-08-11 | 2016-03-22 | 日産自動車株式会社 | 電源装置 |
JP2018137329A (ja) * | 2017-02-22 | 2018-08-30 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
WO2024142337A1 (ja) * | 2022-12-27 | 2024-07-04 | 日立Astemo株式会社 | 電子制御装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10122074B2 (en) * | 2014-11-19 | 2018-11-06 | Panasonic Intellectual Property Management Co., Ltd. | Antenna device using EBG structure, wireless communication device, and radar device |
JP6582717B2 (ja) | 2015-08-18 | 2019-10-02 | 富士電機株式会社 | 電子電気機器 |
DE102018107094B4 (de) * | 2018-03-26 | 2021-04-15 | Infineon Technologies Austria Ag | Multi-Package-Oberseitenkühlung und Verfahren zu deren Herstellung |
CN111587037B (zh) * | 2020-05-13 | 2022-10-28 | 江苏富联通讯技术有限公司 | 一种设置有散热结构的5g通信滤波器模块及其装配方法 |
CN113966070B (zh) * | 2021-10-20 | 2022-04-26 | 深圳市嘉海辉电子科技有限公司 | 一种基于ai封装识别系统的电子元件制造用封装结构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009100168A (ja) * | 2007-10-16 | 2009-05-07 | Mitsubishi Electric Corp | 送受信モジュール |
JP2009283768A (ja) * | 2008-05-23 | 2009-12-03 | Yokogawa Electric Corp | 冷却シールド装置 |
JP2011040742A (ja) * | 2009-08-06 | 2011-02-24 | Internatl Business Mach Corp <Ibm> | 周期的パターンを有するベースプレート構造を含むヒートシンク、ならびに関連する装置および方法(周期的パターンを有するベースプレート構造を含むヒートシンク) |
WO2011070736A1 (ja) * | 2009-12-08 | 2011-06-16 | 日本電気株式会社 | ノイズ抑制テープ |
JP2011124503A (ja) * | 2009-12-14 | 2011-06-23 | Nec Corp | 電子装置及びノイズ抑制方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69401040T2 (de) * | 1993-07-12 | 1997-06-05 | Nippon Electric Co | Gehäusestruktur für Mikrowellenschaltung |
JP4859028B2 (ja) | 2006-02-20 | 2012-01-18 | 北川工業株式会社 | 電磁波対策シート、電磁波対策シートの製造方法、および電子部品の電磁波対策構造 |
JP2007258385A (ja) | 2006-03-23 | 2007-10-04 | Yokogawa Electric Corp | ヒートシンク装置 |
WO2008035540A1 (en) * | 2006-09-19 | 2008-03-27 | Nec Corporation | Apparatus with electronic device mounted therein and method for suppressing resonance of the apparatus |
JP5380919B2 (ja) * | 2008-06-24 | 2014-01-08 | 日本電気株式会社 | 導波路構造およびプリント配線板 |
JP5241358B2 (ja) * | 2008-07-11 | 2013-07-17 | キヤノン株式会社 | プリント基板設計支援プログラム、プリント基板設計支援方法及びプリント基板設計支援装置 |
-
2012
- 2012-04-11 JP JP2013519352A patent/JP5821954B2/ja active Active
- 2012-04-11 WO PCT/JP2012/002516 patent/WO2012169104A1/ja active Application Filing
- 2012-04-11 US US14/124,664 patent/US9629282B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009100168A (ja) * | 2007-10-16 | 2009-05-07 | Mitsubishi Electric Corp | 送受信モジュール |
JP2009283768A (ja) * | 2008-05-23 | 2009-12-03 | Yokogawa Electric Corp | 冷却シールド装置 |
JP2011040742A (ja) * | 2009-08-06 | 2011-02-24 | Internatl Business Mach Corp <Ibm> | 周期的パターンを有するベースプレート構造を含むヒートシンク、ならびに関連する装置および方法(周期的パターンを有するベースプレート構造を含むヒートシンク) |
WO2011070736A1 (ja) * | 2009-12-08 | 2011-06-16 | 日本電気株式会社 | ノイズ抑制テープ |
JP2011124503A (ja) * | 2009-12-14 | 2011-06-23 | Nec Corp | 電子装置及びノイズ抑制方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014069658A1 (ja) * | 2012-11-05 | 2014-05-08 | 株式会社デンソー | 高周波モジュール |
US9445535B2 (en) | 2012-11-05 | 2016-09-13 | Denso Corporation | High-frequency module |
JP2016039743A (ja) * | 2014-08-11 | 2016-03-22 | 日産自動車株式会社 | 電源装置 |
JP2018137329A (ja) * | 2017-02-22 | 2018-08-30 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
WO2024142337A1 (ja) * | 2022-12-27 | 2024-07-04 | 日立Astemo株式会社 | 電子制御装置 |
Also Published As
Publication number | Publication date |
---|---|
US9629282B2 (en) | 2017-04-18 |
US20140098499A1 (en) | 2014-04-10 |
JPWO2012169104A1 (ja) | 2015-02-23 |
JP5821954B2 (ja) | 2015-11-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5821954B2 (ja) | 電子機器、構造体、及び、ヒートシンク | |
US8779874B2 (en) | Waveguide structure and printed-circuit board | |
US8004369B2 (en) | Arrangement structure of electromagnetic band-gap for suppressing noise and improving signal integrity | |
US8159413B2 (en) | Double-stacked EBG structure | |
US20050104678A1 (en) | System and method for noise mitigation in high speed printed circuit boards using electromagnetic bandgap structures | |
US9468089B2 (en) | EBG structure, semiconductor device, and circuit board | |
US8330048B2 (en) | Electromagnetic bandgap structure and printed circuit board having the same | |
JP2010532590A (ja) | メタマテリアルを用いた伝送線路の設計方法 | |
JPWO2011111313A1 (ja) | 電子装置、配線基板およびノイズ遮蔽方法 | |
JP5761184B2 (ja) | 配線基板及び電子装置 | |
US8253025B2 (en) | Printed circuit board having electromagnetic bandgap structure | |
US8558120B2 (en) | Multilayer board for suppressing unwanted electromagnetic waves and noise | |
US11309615B2 (en) | Dual slot common mode noise filter | |
JP6123802B2 (ja) | 構造体及び配線基板 | |
JP5353042B2 (ja) | プリント配線基板 | |
JP6176242B2 (ja) | Ebg特性を有する導波路構造 | |
WO2014136595A1 (ja) | 構造体、配線基板及び電子装置 | |
JP5673552B2 (ja) | 電子機器 | |
JP2008270363A (ja) | 高周波パッケージ | |
JPWO2008010445A1 (ja) | 多層プリント回路基板 | |
KR20120019634A (ko) | 광대역 노이즈를 억제하는 전자기 밴드갭 구조 | |
WO2013018257A1 (ja) | 配線基板 | |
Wu et al. | Systematic design of bandstop power distribution network using resonant vias |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12796742 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2013519352 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14124664 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12796742 Country of ref document: EP Kind code of ref document: A1 |