WO2012137754A1 - 異方性導電フィルム、接合体の製造方法、及び接合体 - Google Patents

異方性導電フィルム、接合体の製造方法、及び接合体 Download PDF

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Publication number
WO2012137754A1
WO2012137754A1 PCT/JP2012/059031 JP2012059031W WO2012137754A1 WO 2012137754 A1 WO2012137754 A1 WO 2012137754A1 JP 2012059031 W JP2012059031 W JP 2012059031W WO 2012137754 A1 WO2012137754 A1 WO 2012137754A1
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Prior art keywords
anisotropic conductive
conductive film
particle
containing layer
layer
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PCT/JP2012/059031
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English (en)
French (fr)
Japanese (ja)
Inventor
裕樹 大関
怜司 塚尾
朋之 石松
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ソニーケミカル＆インフォメーションデバイス株式会社
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Application filed by ソニーケミカル＆インフォメーションデバイス株式会社 filed Critical ソニーケミカル＆インフォメーションデバイス株式会社
Priority to CN201280002227.9A priority Critical patent/CN103069656B/zh
Priority to KR1020127029200A priority patent/KR101453179B1/ko
Publication of WO2012137754A1 publication Critical patent/WO2012137754A1/ja
Priority to HK13108543.0A priority patent/HK1181554A1/xx

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Definitions

  • the present invention uses an anisotropic conductive film capable of electrically and mechanically connecting electronic components such as an IC chip and a liquid crystal panel (LCD panel) in a liquid crystal display (LCD), and the anisotropic conductive film.
  • the present invention relates to a method for manufacturing a bonded body, and a bonded body obtained by the manufacturing method.
  • a tape-shaped connection material for example, anisotropic conductive film (ACF)
  • ACF anisotropic conductive film
  • This anisotropic conductive film can be used for various purposes including connecting a terminal of a flexible printed circuit board (FPC) or an IC chip to an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel. These terminals are used for bonding and electrically connecting the terminals.
  • FPC flexible printed circuit board
  • ITO Indium Tin Oxide
  • anisotropic conductive film a film having a two-layer structure of a layer (ACF) in which conductive particles are dispersed and a layer (NCF; Non Conductive Film) in which conductive particles are not dispersed has been proposed.
  • ACF a layer in which conductive particles are dispersed
  • NCF Non Conductive Film
  • the terminals of electronic components such as IC chips enter the layer not containing conductive particles, and the conductive particles are sandwiched between the layers in which the conductive particles are dispersed. Electrically connected. For this reason, the number of conductive particles flowing between the terminals of the electronic component is reduced, and even if the amount of conductive particles is smaller than that of the single-layer structure, the proportion of conductive particles on the connection terminals (particle trapping) Rate) can be expected to improve.
  • the first layer has at least a film-forming resin and a thermosetting resin, and the glass of the film-forming resin in the first layer.
  • the transition point is 80 ° C. or higher
  • the second layer has at least a film-forming resin and a curing agent
  • the glass transition point of the film-forming resin in the second layer is ⁇ 20 ° C. to 65 ° C.
  • An anisotropic conductive film has been proposed (see Patent Document 1).
  • an anisotropic conductive film having a two-layer structure in which the conductive particle-containing layer does not contain a curing agent and the insulating adhesive layer contains a curing agent has been studied. Yes.
  • this proposed technique has a problem in that the particle trapping rate is not sufficient because the conductive particles flow for a long time during pressure bonding.
  • the epoxy resin (A) includes two layers of a first adhesive layer containing an epoxy resin (A) and an epoxy resin curing agent, and a second adhesive layer containing an epoxy resin (B), and the epoxy resin (A) is an epoxy resin.
  • B An anisotropic conductive film has been proposed that has a longer gel time and does not contain an epoxy resin curing agent in the second adhesive layer or has a smaller amount of mixture than the first adhesive layer. (See Patent Document 2). However, this proposed technique has a problem that the connection resistance increases because sufficient curing does not occur in the short-time pressure bonding.
  • an anisotropic conductive film having a two-layer structure an anisotropic conductive film that has an excellent particle trapping rate and a sufficiently low connection resistance can be obtained even after a short time pressure bonding, and a bonded body using the anisotropic conductive film.
  • the present invention provides an anisotropic conductive film that has an excellent particle capture rate and that can provide a sufficiently low connection resistance even in a short time, and a method for manufacturing a joined body using the anisotropic conductive film, and the manufacturing method. It aims at providing the joined_body
  • Means for solving the problems are as follows. That is, ⁇ 1> An anisotropic conductive film for anisotropically conductively connecting a terminal of a substrate and a terminal of an electronic component, An insulating adhesive layer containing an acrylic resin; Having conductive particles, an acrylic resin, and a conductive particle-containing layer containing a polymerization initiator, Of the insulating adhesive layer and the conductive particle-containing layer, only the conductive particle-containing layer contains the polymerization initiator. ⁇ 2> The anisotropic conductive film according to ⁇ 1>, wherein the polymerization initiator is an organic peroxide.
  • ⁇ 3> The anisotropic conductive film according to ⁇ 2>, wherein the organic peroxide has a one-minute half-life temperature of 90.0 ° C. to 154.0 ° C. ⁇ 4> From ⁇ 2> to ⁇ 3>, wherein the content of the organic peroxide in the conductive particle-containing layer is 3% by mass to 8% by mass with respect to the resin component in the conductive particle-containing layer. It is an anisotropic conductive film in any one.
  • ⁇ 5> The anisotropic conductive film according to any one of ⁇ 1> to ⁇ 4> is provided on a terminal of the substrate, and the conductive particle-containing layer of the anisotropic conductive film is in contact with the terminal of the substrate.
  • Pasting process to paste A placing step of placing an electronic component on the anisotropic conductive film; A heating and pressing step of heating and pressing the electronic component with a heating and pressing member, A method for manufacturing a joined body, wherein the terminals of the substrate and the terminals of the electronic component are anisotropically conductively connected.
  • the anisotropic conductive film that solves the above-mentioned problems and can achieve the above-described object, has an excellent particle capture rate, and can obtain a sufficiently low connection resistance even in a short time,
  • zygote obtained by this manufacturing method can be provided.
  • FIG. 1 is a schematic view of an example of the anisotropic conductive film of the present invention.
  • FIG. 2A is a schematic view for explaining an example of a method for producing a joined body according to the present invention.
  • FIG. 2B is a schematic diagram for explaining an example of a method for producing a joined body according to the present invention.
  • FIG. 2C is a schematic view for explaining an example of a method for producing a joined body according to the present invention.
  • the anisotropic conductive film of this invention has an insulating contact bonding layer and an electroconductive particle content layer at least, and also has another member as needed. Only the conductive particle-containing layer of the insulating adhesive layer and the conductive particle-containing layer contains a polymerization initiator.
  • the anisotropic conductive film is an anisotropic conductive film that connects a terminal of a substrate and a terminal of an electronic component in an anisotropic conductive connection.
  • the two-layer structure which consists of the said insulating contact bonding layer and the said electroconductive particle content layer is preferable.
  • the insulating adhesive layer contains at least an acrylic resin, and further contains other components as necessary. However, the insulating adhesive layer does not contain a polymerization initiator.
  • an acrylic compound, liquid acrylate etc. are illustrated, Specifically, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate , Phosphate group-containing acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethyloltricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diaacryloxypropane, 2 , 2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tri Black decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, epoxy
  • the said acrylate the methacrylate can also be used. These may be used individually by 1 type and may use 2 or more types together. There is no restriction
  • a phenoxy resin an epoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide
  • examples thereof include resins and polyolefin resins.
  • the film forming resin may be used alone or in combination of two or more.
  • phenoxy resin is particularly preferable from the viewpoints of film formability, processability, and connection reliability.
  • the said phenoxy resin is resin synthesize
  • the silane coupling agent is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include an epoxy silane coupling agent, an acrylic silane coupling agent, a thiol silane coupling agent, and an amine silane. A coupling agent etc. are mentioned. There is no restriction
  • the average thickness of the insulating adhesive layer is not particularly limited and may be appropriately selected in relation to the thickness of the conductive particle-containing layer described later, but is preferably 5 ⁇ m to 25 ⁇ m, more preferably 8 ⁇ m to 20 ⁇ m. .
  • the average thickness is less than 5 ⁇ m, the resin filling rate between the terminals may be reduced, and when it exceeds 25 ⁇ m, connection failure may be caused.
  • the said average thickness is an average value at the time of measuring the thickness of five places of the said insulating contact bonding layers arbitrarily.
  • the conductive particle-containing layer contains at least conductive particles, an acrylic resin, and a polymerization initiator, and further contains other components as necessary.
  • -Conductive particles There is no restriction
  • the metal-coated resin particles include particles in which the surface of the resin core is coated with any metal of nickel, copper, gold, and palladium. Similarly, particles having gold or palladium on the outermost surface may be used. Furthermore, you may use what gave the insulating film with the metal protrusion and organic substance on the surface.
  • the coating method of the metal to the said resin core According to the objective, it can select suitably, For example, an electroless-plating method, sputtering method, etc. are mentioned.
  • the material for the resin core is not particularly limited and may be appropriately selected depending on the intended purpose.
  • Examples thereof include styrene-divinylbenzene copolymer, benzoguanamine resin, cross-linked polystyrene resin, acrylic resin, and styrene-silica composite resin. Is mentioned. There is no restriction
  • the polymerization initiator is not particularly limited as long as it can polymerize the acrylic resin, and can be appropriately selected according to the purpose.
  • the polymerization initiator generates free radicals by heat or light. Is preferred.
  • the polymerization initiator that generates free radicals by heat or light is preferably an organic peroxide, and has a half-life temperature of 90.0 ° C. to 154.0 ° C. for 1 minute from the viewpoint of better connection resistance and particle capture rate. Some organic peroxides are more preferred. In order to perform bonding in 10 seconds or less, it is preferable that the half-life temperature for 1 minute is 154.0 ° C. or less. If the 1-minute half-life temperature is less than 90.0 ° C., storage may be difficult.
  • Examples of the polymerization initiator that generates free radicals by heat include organic peroxides and azo compounds.
  • organic peroxide include benzoyl peroxide, tertiary butyl peroxide, di-2-ethylhexyl peroxydicarbonate, dilauroyl peroxide, 1,1-di (t-butylperoxy) cyclohexane, and the like. Is mentioned.
  • Examples of the azo compound include 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile), 2,2′-azobis (2,4-dimethylvaleronitrile) (V-65), 2 2,2′-azobisisobutyronitrile (AIBN), 2,2′-azobis (2-methylbutyronitrile), 1,1-azobis (cyclohexane-1-carbonitrile), 2,2′-azobis [ 2-methyl-N- [1,1-bis (hydroxymethyl) -2-hydroxyethyl] propionamide], dimethyl 2,2′-azobis (2-methoxypropionate) and the like. These may be used individually by 1 type and may use 2 or more types together.
  • Examples of the polymerization initiator that generates a free radical by light include alkylphenone, benzoin, benzophenone, dicarbonyl compound, thioxanthone, acylphosphine oxide, and derivatives thereof. These may be used individually by 1 type and may use 2 or more types together. There is no restriction
  • the resin component refers to a component excluding the conductive particles in the conductive particle-containing layer, and examples thereof include organic materials such as the acrylic resin, the polymerization initiator, a film-forming resin described later, and a silane coupling agent. Ingredients.
  • the average thickness of the conductive particle-containing layer is not particularly limited and can be appropriately selected depending on the average particle diameter of the conductive particles and the thickness of the insulating adhesive layer, and is 2 ⁇ m to 10 ⁇ m. 4 ⁇ m to 10 ⁇ m is more preferable. When the average thickness is less than 2 ⁇ m, the conductive particles may not be sufficiently filled between the terminals of the substrate and the terminals of the electronic component, and when it exceeds 10 ⁇ m, connection failure may be caused. Moreover, it is preferable that the average thickness of the said electroconductive particle content layer is thinner than the average thickness of the said insulating contact bonding layer from the point that a particle capture rate is more excellent.
  • the said average thickness is an average value at the time of measuring the thickness of five places of the said electroconductive particle content layer arbitrarily.
  • the substrate is not particularly limited as long as it is a substrate having terminals, which is an object of anisotropic conductive connection using the anisotropic conductive film, and can be appropriately selected according to the purpose. , ITO glass substrate, flexible substrate, rigid substrate and the like. There is no restriction
  • the electronic component is not particularly limited as long as the electronic component is an object of anisotropic conductive connection using the anisotropic conductive film, and can be appropriately selected according to the purpose.
  • a chip, a TAB tape, a liquid crystal panel, etc. are mentioned.
  • Examples of the IC chip include a liquid crystal screen control IC chip in a flat panel display (FPD).
  • the anisotropic conductive film of the present invention does not contain a polymerization initiator in the insulating adhesive layer, in the anisotropic conductive connection, when the electronic component placed on the anisotropic conductive film is pushed in The insulating adhesive layer flows efficiently in a short time. Then, the insulating adhesive layer flows between the terminals of the electronic component, and the number of conductive particles flowing between the terminals of the electronic component decreases. As a result, the number of conductive particles in contact with the terminal is increased, and the particle capture rate is improved.
  • the insulating adhesive layer does not contain a polymerization initiator, the insulating adhesive layer is not cured even when heated and pressed at a low speed, and the conductive particles in the conductive particle-containing layer are not cured. It can be pushed in sufficiently and a sufficient connection resistance can be obtained. Furthermore, since the number of conductive particles flowing between the terminals of the electronic component is reduced, it is possible to cope with fine pitch (narrow pitch) anisotropic conductive connection.
  • the manufacturing method of the joined body of the present invention includes at least a pasting step, a placing step, and a heating and pressing step, and further includes other steps as necessary.
  • the bonded body is manufactured by anisotropically connecting the terminal of the substrate and the terminal of the electronic component.
  • the joined body of the present invention is produced by the method for producing a joined body of the present invention.
  • the sticking step is not particularly limited as long as it is a step of sticking the anisotropic conductive film on the terminal of the substrate so that the conductive particle-containing layer of the anisotropic conductive film is in contact with the terminal of the substrate. It can be appropriately selected depending on the purpose. There is no restriction
  • the anisotropic conductive film is the anisotropic conductive film of the present invention.
  • the placing step is not particularly limited as long as it is a step of placing an electronic component on the anisotropic conductive film, and can be appropriately selected according to the purpose.
  • the electronic component is placed on the insulating adhesive layer of the anisotropic conductive film. At this time, anisotropic conductive connection is not performed.
  • the heating and pressing step is not particularly limited as long as it is a step of heating and pressing the electronic component with a heating and pressing member, and can be appropriately selected according to the purpose.
  • the heating and pressing member include a pressing member having a heating mechanism.
  • the pressing member having the heating mechanism include a heat tool.
  • the heating temperature is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 140 ° C. to 200 ° C.
  • the pressing pressure is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 0.1 MPa to 10 MPa.
  • the heating and pressing time is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include 0.5 seconds to 120 seconds.
  • the terminal of the substrate and the terminal of the electronic component can be anisotropically conductively connected, and a joined body can be manufactured.
  • FIG. 1 is a schematic view of an example of the anisotropic conductive film of the present invention.
  • the anisotropic conductive film 1 includes a conductive particle-containing layer 2 and an insulating adhesive layer 3, and the conductive particle-containing layer 2 contains conductive particles 4.
  • 2A to 2C are schematic views for explaining an example of a method for producing a joined body according to the present invention.
  • an anisotropic conductive film is affixed on the substrate 5 having terminals 6 so that the conductive particle-containing layer 2 of the anisotropic conductive film is in contact with the terminals 6 (FIG. 2A).
  • the electronic component 8 having the terminals 7 is placed on the insulating adhesive layer 3 of the attached anisotropic conductive film.
  • the substrate 5 and the electronic component 8 are not yet anisotropically conductively connected (FIG. 2B).
  • the substrate 5 and the electronic component 8 are anisotropically conductively connected by heating and pressing the electronic component 8 from above the electronic component 8 with a heat pressing member (not shown) (FIG. 2C).
  • a heat pressing member not shown
  • the insulating adhesive layer 3 flows between the terminals 7 of the electronic component 8, and the number of conductive particles 4 flowing between the terminals 7 of the electronic component 8 decreases.
  • the number of the conductive particles 4 between the terminals 6 and 7 is increased, and a bonded body with an improved particle capture rate can be manufactured.
  • the insulating adhesive layer 3 does not contain a polymerization initiator, the insulating adhesive layer 3 is not cured even when heating and pressing are performed at a low speed, and the conductive particles 4 of the conductive particle-containing layer 2 are not cured. Can be pushed in sufficiently, and a sufficient connection resistance can be obtained. Further, the number of the conductive particles 4 flowing between the terminals of the electronic component 8 is reduced, so that a joined body having a fine pitch (narrow pitch) can be manufactured.
  • Example 1 ⁇ Production of anisotropic conductive film> -Preparation of conductive particle-containing layer- 60 parts by mass of a phenoxy resin (product name: YP50, manufactured by Nippon Steel Chemical Co., Ltd.), 35 parts by mass of an acrylic resin (product name: EB-600, manufactured by Daicel Cytec), a silane coupling agent (product name: KBM-503, Adhesion composed of 2 parts by mass of Shin-Etsu Chemical Co., Ltd.) and 1 part by mass of a polymerization initiator (product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation)
  • Conductive particles product name: AUL704, manufactured by Sekisui Chemical Co., Ltd.
  • the dispersed compound was applied onto the release-treated PET so that the average thickness after drying was 8 ⁇ m, thereby
  • a phenoxy resin product name: YP70, manufactured by Nippon Steel Chemical Co., Ltd.
  • an acrylic resin product name: EB-600, manufactured by Daicel Cytec
  • a silane coupling agent product name: KBM-503
  • a composition composed of 2 parts by mass manufactured by Shin-Etsu Chemical Co., Ltd.
  • the conductive particle-containing layer and the insulating adhesive layer obtained above were laminated at a roll temperature of 45 ° C. using a roll laminator to obtain an anisotropic conductive film.
  • connection resistance When a current of 1 mA is passed by a four-terminal method using a digital multimeter (product number: digital multimeter 7555, manufactured by Yokogawa Electric Corporation) for a joined body produced by the following “normal evaluation” or “indentation evaluation” The connection resistance was measured.
  • anisotropic conductive connection To make anisotropic conductive connection. Specifically, the anisotropic conductive film produced in Example 1 was slit to a width of 1.5 mm, and attached to the ITO coating glass so that the conductive particle-containing layer was in contact with the ITO coating glass.
  • a heat tool having a width of 1.5 mm and a buffer material (Teflon (registered trademark) having a thickness of 100 ⁇ m) is used for pressure bonding conditions of 180 ° C., 3.5 MPa, 6 seconds (tool speed)
  • An anisotropic conductive connection was performed at 10 mm / sec and a stage temperature of 40 ° C. to prepare a joined body.
  • the particle capture rate was measured by the following method. (1) First, the number of conductive particles in the conductive particle-containing layer before pressure bonding between the COF and the ITO coating glass was counted using a microscope. (2) Next, the COF and the ITO coating glass were pressure-bonded under the same conditions as in the normal evaluation, and then the number of the conductive particles captured on the terminals was counted using a microscope. At this time, only the conductive particles that are clearly determined to be involved in the conduction are counted, and only the conductive particles existing at the end of the terminal or a part thereof protrudes from the terminal. The number of conductive particles and conductive particles that are not sufficiently crushed are not counted. (3) Then, the ratio of the number of the conductive particles per unit area of the terminal before and after pressure bonding between the COF and the ITO coating glass, which was obtained by the above (1) and (2), was calculated. This ratio was defined as the particle capture rate.
  • Example 2 ⁇ Production of anisotropic conductive film>
  • the polymerization initiator product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation
  • the polymerization initiator product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation
  • an anisotropic conductive film was obtained. Evaluation similar to Example 1 was performed. The results are shown in Table 1-1.
  • Example 3 ⁇ Production of anisotropic conductive film>
  • the polymerization initiator product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation
  • the polymerization initiator product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation
  • an anisotropic conductive film was obtained. Evaluation similar to Example 1 was performed. The results are shown in Table 1-1.
  • Example 4 Provide of anisotropic conductive film>
  • the polymerization initiator of the conductive particle-containing layer was replaced with Perroyl L (Dilauroyl peroxide, manufactured by NOF Corporation), and the amount of the polymerization initiator was changed to 4 parts by mass.
  • an anisotropic conductive film was obtained. Evaluation similar to Example 1 was performed. The results are shown in Table 1-1.
  • Example 5 ⁇ Production of anisotropic conductive film>
  • the anisotropic conductive property was changed in the same manner as in Example 4 except that the polymerization initiator for the conductive particle-containing layer was changed to peroyl OPP (di-2-ethylhexyl peroxydicarbonate, manufactured by NOF Corporation). A film was obtained. Evaluation similar to Example 1 was performed. The results are shown in Table 1-2.
  • Example 6 ⁇ Production of anisotropic conductive film>
  • the polymerization initiator product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation
  • the polymerization initiator product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation
  • an anisotropic conductive film was obtained. Evaluation similar to Example 1 was performed. The results are shown in Table 1-2.
  • Example 7 ⁇ Production of anisotropic conductive film> An anisotropic conductive film was obtained in the same manner as in Example 1, except that the acrylic resin of the insulating adhesive layer was replaced with an acrylic resin (product name: U-4HA, manufactured by Shin-Nakamura Chemical Co., Ltd.). It was. Evaluation similar to Example 1 was performed. The results are shown in Table 1-2.
  • Example 8 ⁇ Production of anisotropic conductive film>
  • an anisotropic conductive film was prepared in the same manner as in Example 1 except that the acrylic resin of the conductive particle-containing layer was replaced with an acrylic resin (product name: U-4HA, manufactured by Shin-Nakamura Chemical Co., Ltd.). Obtained. Evaluation similar to Example 1 was performed. The results are shown in Table 1-2.
  • insulating adhesive layer 60 parts by mass of a phenoxy resin (product name: YP70, manufactured by Nippon Steel Chemical Co., Ltd.), 35 parts by mass of an acrylic resin (product name: EB-600, manufactured by Daicel Cytec), a silane coupling agent (product name: KBM-503, 2 parts by mass of Shin-Etsu Chemical Co., Ltd.) and 2 parts by mass of a polymerization initiator (product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation)
  • a polymerization initiator product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation
  • the conductive particle-containing layer and the insulating adhesive layer obtained above were laminated at a roll temperature of 45 ° C. using a roll laminator to obtain an anisotropic conductive film. Evaluation similar to Example 1 was performed. The results are shown in Table 1-3.
  • Comparative Example 2 ⁇ Production of anisotropic conductive film>
  • the polymerization initiator product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation
  • the polymerization initiator product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation
  • an anisotropic conductive film was obtained. Evaluation similar to Example 1 was performed. The results are shown in Table 1-3.
  • Comparative Example 3 ⁇ Production of anisotropic conductive film>
  • a polymerization initiator product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation
  • An anisotropic conductive film was obtained in the same manner as in Example 1 except that the agent was replaced with the agent (product name: perloyl L, dilauroyl peroxide, manufactured by NOF Corporation). Evaluation similar to Example 1 was performed. The results are shown in Table 1-3.
  • Comparative Example 4 ⁇ Production of anisotropic conductive film>
  • the conductive particle-containing layer does not contain a polymerization initiator, and the insulating adhesive layer polymerization initiator (product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane , Manufactured by NOF Corporation) was replaced with 4 parts by mass, and an anisotropic conductive film was obtained in the same manner as in Comparative Example 1. Evaluation similar to Example 1 was performed. The results are shown in Table 1-3.
  • insulating adhesive layer- 50 parts by mass of a phenoxy resin product name: YP70, manufactured by Nippon Steel Chemical Co., Ltd.
  • 20 parts by mass of an epoxy resin product name: EP-828, manufactured by Mitsubishi Chemical Corporation
  • a silane coupling agent product name: KBM-503, Shin-Etsu
  • a compound composed of 2 parts by mass of Chemical Industries Co., Ltd. was applied onto the peeled PET so that the average thickness after drying was 16 ⁇ m, and an insulating adhesive layer was produced.
  • the conductive particle-containing layer and the insulating adhesive layer obtained above were laminated at a roll temperature of 45 ° C. using a roll laminator to obtain an anisotropic conductive film. Evaluation similar to Example 1 was performed. The results are shown in Table 1-3.
  • the 1-minute half-life temperature (° C.) of each polymerization initiator is as follows. (A): 90.6 ° C., paroyl OPP (B): 116.4 ° C., Parroyl L (C): 153.8 ° C., perhexa C
  • the anisotropic conductive film of the present invention has a result that the connection resistance is sufficiently low and the particle trapping rate is excellent in both the normal evaluation and the indentation evaluation in which indentation is performed at a low speed. there were.
  • the content of the polymerization initiator was 3% by mass to 8% by mass
  • both the connection resistance and the particle trapping rate were more excellent.
  • both the connection resistance and the particle trapping rate were particularly excellent.
  • Example 6 in which the content of the polymerization initiator exceeds 8% by mass, the connection resistance at the time of indentation was slightly higher than those in Examples 2 to 4.
  • Comparative Examples 1 to 3 which contain a polymerization initiator in both the insulating adhesive layer and the conductive particle-containing layer, the fluidity of the insulating adhesive layer at the time of pressure bonding is low, and the particle trapping rate is lower than in the examples. As a result.
  • Comparative Example 3 the connection resistance during pressing was high.
  • Comparative Example 4 containing the polymerization initiator only in the insulating adhesive layer does not contain the polymerization initiator in the conductive particle-containing layer, so that the conductive particles flow at the time of pressure bonding, resulting in a low particle capture rate. It was.
  • Comparative Example 5 in which the binder is an epoxy resin, sufficient curing was not obtained in the short-time pressure bonding, resulting in a high connection resistance and a low particle capture rate.
  • the anisotropic conductive film of the present invention is suitable for anisotropic conductive connection between a substrate and an electronic component because it has an excellent particle trapping rate and a sufficiently low connection resistance can be obtained even for a short time.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
PCT/JP2012/059031 2011-04-06 2012-04-03 異方性導電フィルム、接合体の製造方法、及び接合体 WO2012137754A1 (ja)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015133211A1 (ja) * 2014-03-06 2015-09-11 デクセリアルズ株式会社 接続構造体、接続構造体の製造方法、及び回路接続材料
KR20210088023A (ko) * 2015-01-13 2021-07-13 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름
TWI781710B (zh) * 2014-10-28 2022-10-21 日商迪睿合股份有限公司 異向性導電膜、其製造方法及連接構造體

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6086104B2 (ja) * 2013-07-31 2017-03-01 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
TWI664783B (zh) * 2014-03-31 2019-07-01 日商迪睿合股份有限公司 異向性導電膜、其製造方法、連接構造體、及連接構造體之製造方法
JP6431723B2 (ja) * 2014-08-18 2018-11-28 デクセリアルズ株式会社 接続構造体の製造方法、及び異方性導電接着フィルム
JP6510846B2 (ja) * 2015-03-24 2019-05-08 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
KR102363322B1 (ko) * 2016-02-22 2022-02-15 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
JP6776609B2 (ja) * 2016-02-22 2020-10-28 デクセリアルズ株式会社 異方性導電フィルム
TWI755470B (zh) * 2018-01-16 2022-02-21 優顯科技股份有限公司 導電薄膜、光電半導體裝置及其製造方法
WO2022067506A1 (zh) * 2020-09-29 2022-04-07 重庆康佳光电技术研究院有限公司 显示面板及其制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10273628A (ja) * 1997-03-28 1998-10-13 Hitachi Chem Co Ltd フィルム状接着剤及び回路板の製造法
JP2005197032A (ja) * 2004-01-05 2005-07-21 Asahi Kasei Electronics Co Ltd 異方導電性フィルム
JP2007182062A (ja) * 2006-01-04 2007-07-19 Ls Cable Ltd 多層異方性導電フィルム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100584222B1 (ko) * 1999-03-09 2006-05-26 주식회사 새 한 이방성 도전필름의 제조방법
JP4880533B2 (ja) * 2007-07-03 2012-02-22 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電膜及びその製造方法、並びに接合体
JP5823117B2 (ja) * 2010-11-16 2015-11-25 デクセリアルズ株式会社 異方性導電フィルム、接合体、及び接合体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10273628A (ja) * 1997-03-28 1998-10-13 Hitachi Chem Co Ltd フィルム状接着剤及び回路板の製造法
JP2005197032A (ja) * 2004-01-05 2005-07-21 Asahi Kasei Electronics Co Ltd 異方導電性フィルム
JP2007182062A (ja) * 2006-01-04 2007-07-19 Ls Cable Ltd 多層異方性導電フィルム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015133211A1 (ja) * 2014-03-06 2015-09-11 デクセリアルズ株式会社 接続構造体、接続構造体の製造方法、及び回路接続材料
JP2015170694A (ja) * 2014-03-06 2015-09-28 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
TWI781710B (zh) * 2014-10-28 2022-10-21 日商迪睿合股份有限公司 異向性導電膜、其製造方法及連接構造體
KR20210088023A (ko) * 2015-01-13 2021-07-13 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름
KR102542797B1 (ko) 2015-01-13 2023-06-14 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름

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