WO2012124547A1 - Procédé et dispositif pour fabriquer un fil de scie - Google Patents

Procédé et dispositif pour fabriquer un fil de scie Download PDF

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Publication number
WO2012124547A1
WO2012124547A1 PCT/JP2012/055695 JP2012055695W WO2012124547A1 WO 2012124547 A1 WO2012124547 A1 WO 2012124547A1 JP 2012055695 W JP2012055695 W JP 2012055695W WO 2012124547 A1 WO2012124547 A1 WO 2012124547A1
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WO
WIPO (PCT)
Prior art keywords
wire
plating solution
abrasive grains
plating
amount
Prior art date
Application number
PCT/JP2012/055695
Other languages
English (en)
Japanese (ja)
Inventor
厚志 沖村
崇 中西
長嗣 西口
昌彦 岩倉
寛司 酒井
Original Assignee
株式会社中村超硬
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011056547A external-priority patent/JP5691689B2/ja
Priority claimed from JP2011103587A external-priority patent/JP5765048B2/ja
Application filed by 株式会社中村超硬 filed Critical 株式会社中村超硬
Priority to CN201280018545.4A priority Critical patent/CN103561912B/zh
Priority to KR1020137026840A priority patent/KR101902754B1/ko
Priority to US14/004,981 priority patent/US20140026493A1/en
Publication of WO2012124547A1 publication Critical patent/WO2012124547A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Definitions

  • the present invention relates to a method and an apparatus for manufacturing a fixed abrasive saw wire used in a slicing process of various electronic materials represented by a single crystal of silicon.
  • the fixed abrasive saw wire used in the slicing process of various electronic materials is made by fixing abrasive grains such as diamond and CBN around the outer periphery of the wire.
  • the resin bond method has a short life because the holding power of the abrasive grains by the resin is weak. Although the electrodeposition method has a long life, it has defects such as poor production efficiency (slow production speed and takes up space).
  • the amount of abrasive grains contained in the plating solution should be as high as possible, increasing the wire traveling speed and providing an auxiliary electrode to maintain the current density.
  • the abrasive grains are efficiently attached by passing the wire in the same direction as the flow in the flow of the plating solution in which the abrasive grains are dispersed (see Patent Document 2). ).
  • the object of the present invention is to suppress variation in the amount of abrasive grains adhering to the outer surface of the wire, even with a highly efficient wire delivery form such as densification of abrasive grains, It is another object of the present invention to provide a method and an apparatus for manufacturing a fixed-abrasive saw wire that can achieve uniform distribution of grain adhesion and further improve productivity and production cost.
  • the present invention provides a method for producing a fixed abrasive type saw wire in which a wire is passed through a plating solution containing abrasive grains and the abrasive grains are fixed to the outer periphery thereof by electroplating.
  • the amount of abrasive grains adhering to the outer surface of the wire through which the plating solution has passed is calculated, and the current value flowing through the wire in the plating solution is increased or decreased based on the calculated amount of abrasive particles.
  • a saw wire manufacturing method is provided, wherein the variation in the amount of abrasive grains adhering to the outer surface of the wire is controlled to fall within a predetermined range.
  • the wire is further passed through a plating solution containing no abrasive grains, and the outer surface is electroplated. It is preferable to form a second plating layer.
  • the thickness of the first plating layer for attaching abrasive grains to the outer surface of the wire is made thinner than the thickness of the second plating layer.
  • the outer surface of the wire through which the plating solution has been passed is imaged with a camera, and the amount of the abrasive grains is calculated based on the captured image information.
  • the wire is provided a plurality of times between a rotating roller outside the plating solution that is arranged outside the plating solution and supplied with current by a current supply means, and a rotating roller inside the solution arranged inside the plating solution. It is preferable to bridge and reciprocate the plating solution a plurality of times.
  • At least two of the wires are stretched between rotating rollers in the plating solution.
  • the present invention is a fixed abrasive type saw wire manufacturing apparatus in which a wire is passed through a plating solution containing abrasive grains, and the abrasive grains are fixed to the outer periphery thereof by electroplating.
  • a plating tank in which the contained plating solution is stored, wire sending means for passing a wire through the plating solution, current supply means for supplying a current to the wire and the plating solution, and a wire through which the plating solution is passed
  • the current supply means flows through the wire in the plating solution.
  • a saw wire manufacturing apparatus comprising current value control means for controlling the variation of the amount of abrasive grains adhering to the outer surface of the wire to be within a predetermined range by increasing or decreasing the current value. It was also constructed.
  • the abrasive grain amount calculating means includes a camera that images the outer surface of the wire through which the plating solution has passed, and an arithmetic means that calculates the amount of the abrasive grains based on image information captured by the camera. Is preferred.
  • a rotation roller outside the liquid that is arranged outside the plating solution and is supplied with current by the current supply means and a rotation roller inside the solution arranged inside the plating solution, the rotation outside the solution It is preferable that the wire is bridged a plurality of times between a roller and a rotating roller in the liquid so as to reciprocate the plating liquid a plurality of times.
  • abrasive grains particularly abrasive grains coated with a conductive metal film
  • the Coulomb force is increased to the outer surface of the wire.
  • the Coulomb force becomes smaller and it becomes difficult to adhere to the outer surface of the wire, so that variation in the amount of abrasive particles adhering to the outer surface of the wire can be adjusted, and within a predetermined range Can be controlled to fit in.
  • the present invention dares to increase / decrease the current value and solve the problem that has not been sought in the past such as uniform distribution of the abrasive grains, but the plating layer avoids variations in thickness and properties. I can't.
  • the wire is further passed through a plating solution containing no abrasive grains, and electroplating is performed.
  • the second plating layer is formed on the outer surface, the influence of the above-described variation of the first plating layer can be relatively reduced by the second plating layer as a whole, and the quality of the plating layer can be reduced. Can be maintained. Thereby, it is possible to more reliably fix the abrasive grains to the wire.
  • Such a structure is, for example, for the purpose of temporarily fixing the abrasive grains to the wire, and for the purpose of securely fixing the abrasive grains after passing the wire through a plating solution containing the abrasive grains, plating that does not contain abrasive grains. This is effective when a wire is passed through the liquid.
  • the thickness of the first plating layer affected by the variation is configured to be thinner than the thickness of the second plating layer, the relative influence thereof is further reduced, and the high-quality plating layer as a whole. Is obtained.
  • the outer surface of the wire through which the plating solution has passed is imaged with a camera, and the amount of the abrasive grains is calculated based on the captured image information, so the amount of abrasive grains adhering to the outer surface of the wire is accurately determined. Can be calculated.
  • the wire is provided a plurality of times between a rotating roller outside the plating solution that is arranged outside the plating solution and supplied with current by a current supply means, and a rotating roller inside the solution arranged inside the plating solution. Since it is bridged and reciprocated inside and outside of the plating solution a plurality of times, the wire rotates from the current supply means to the outside in each state where the wire reciprocates between the rotation roller outside the solution and the rotation roller inside the solution. Since current is supplied via a roller, the current density can be maintained without excessively increasing the amount of current, and the immersion surface area can be dramatically increased, thus significantly increasing the production speed. Can be made.
  • the stress applied to the wire is dispersed, and more stable wire travel is possible.
  • the traveling speed of the wire can be increased, the production speed can be further improved by appropriately adjusting the number of reciprocations.
  • the guide groove that guides the wire a plurality of times in the roller circumferential direction is provided on the outer peripheral surface of the outer rotating roller and / or the inner rotating roller, the running stability of the wire is further improved.
  • the travel speed can be further increased to improve the production speed.
  • the plating solution is stirred by the stirring means disposed in the plating solution, it is possible to improve the dispersibility of the abrasive grains present in the plating solution and to make the adhesion of the abrasive grains to the wire surface uniform. .
  • the saw wire manufacturing apparatus 1 of the present invention allows the wire W to pass through the plating solution M1 containing the abrasive grains D, and fixes (electrodeposits) the abrasive grains D to the outer periphery thereof by electroplating.
  • a device for manufacturing a fixed abrasive saw wire a plating tank 16A in which a plating solution M1 containing abrasive particles D is stored, a wire sending means 2 for allowing the wire W to pass through the plating solution M1, a wire W and a plating solution Current supply means 3 for supplying current to M1, abrasive quantity calculation means 4 for calculating the amount of abrasive grains D adhering to the outer surface of the wire W through which the plating solution M1 has passed, and calculated abrasive grains Current value control means 5 for controlling the variation of the amount of abrasive grains adhering to the outer surface of the wire to be within a predetermined range by increasing / decreasing the value of the current flowing through the wire W in the plating solution M1 by the current supply means 3 based on the amount of current. And a little The phrase also has a.
  • FIG. 1 is an explanatory diagram showing the overall configuration of a saw wire manufacturing apparatus 1 according to the present invention.
  • the alkaline tank 11 for alkaline degreasing the wire
  • the water washing tank 12 for washing with water
  • the acid tank for pickling in order along the traveling direction of the wire 6.
  • a washing tank 14 for washing with water a first plating tank 16A for temporarily adhering abrasive grains to the outer periphery of the wire, a second plating tank 16B for forming a second plating layer on the outer surface, a washing tank 17, winding A take-up machine 18 is arranged.
  • the saw wire thus obtained is used for various applications.
  • the composition of the plating solution containing the abrasive grains of the first plating tank 16A is not particularly limited, and those having a general component composition used when the abrasive grains are fixed by electroplating can be employed. Examples include those containing a nickel-containing organic acid, a nickel-containing inorganic acid, and the like, but are not limited thereto. Moreover, you may add a brightener, a pH buffering agent, etc. suitably. Regarding the composition of the plating solution in the second plating tank 16B, a conventionally known one can be used, and it is preferable to use the same main component as the plating solution in the first plating tank 16A.
  • abrasive grains contained in the plating solution include, but are not limited to, superabrasive grains such as diamond and CBN.
  • the grain size of the abrasive grains is not particularly limited as long as it can be used as a saw wire, but for example, it is preferably 5 to 100 ⁇ m for diamond abrasive grains.
  • a metal film is coated on the surface of the abrasive grains.
  • the wire W is not particularly limited, and metal, non-metal, and various types can be used. As the metal, tungsten wire, piano wire, die steel having a tempering temperature of 400 ° C. or higher, high speed steel, stainless steel, and the like can be used as in the past.
  • nonmetal carbon fiber, aramid fiber, alumina fiber, boron fiber, silicon carbide fiber, or the like can be used. Moreover, when using a nonmetallic thing, it is good to give the general plating process for providing electroconductivity to the surface.
  • the second plating tank is omitted and the first plating tank is omitted.
  • the plating may be completed only in the bath.
  • the structure, arrangement, selection, and combination of the other tanks are not limited to this example, and it is possible to widely adopt the form of a conventionally known saw wire manufacturing apparatus that fixes abrasive grains by electroplating. it can.
  • the first plating tank 16 ⁇ / b> A is provided with a rotating roller 20 outside the liquid and a rotating roller 21 within the liquid, and the wire W supplied through the washing tank 14 is supplied with these plating solutions.
  • a plurality of times are stretched between the inner and outer rotating rollers 20 and 21 and reciprocated a plurality of times inside and outside the plating solution M1, whereby the abrasive grains D adhere to the outer periphery of the wire W, and then the second plating tank 16B.
  • the wire W spirally winds the two rotating rollers 20 and 21 (the two rotating rollers 20 and 21 are arranged inside the spiral formed by the wire W. ), And reciprocates a plurality of times inside and outside the plating solution M1.
  • These rotating rollers 20, 21 function as the wire delivery means 2 together with the delivery machine 10 and the winder 18.
  • the rotary rollers 20 and 21 are arranged so that the axial directions thereof are parallel to each other and parallel to the plating solution M1 liquid surface. Further, in the plating solution, an anode 31 is disposed in parallel with the reciprocating wire W together with the stirring blade 22 for stirring the plating solution M1.
  • a power feeding device 30 is connected to each of the rotating roller 20 and the anode 31, and current is also supplied to the wire W through the outer peripheral surface of the rotating roller 20.
  • each loop of the wire W that reciprocates between the rotary rollers 20 and 21 serves as a cathode, and the abrasive grains D adhere to the outer periphery of the wire W in the vicinity of the anode 31 via a plating film. That is, the rotating roller 20 functions as the current supply unit 3 together with the power feeding device 30 and the anode 31.
  • the wire W is spirally wound around the two rotating rollers 20 and 21 inside and outside the plating solution M1, but the wire W is formed between the rotating roller 20 and the rotating roller 21. It may be bridged across the space, that is, by drawing a character “8”. Moreover, you may provide three or more rotation rollers which hang the wire W.
  • the rotating roller 20 that functions as the current supply means 3 is entirely made of a conductive material in order to be electrically connected to the wire W, or a conductive material is disposed on the outer peripheral portion that contacts the wire W. Examples of the conductive material include metals and conductive polymers.
  • FIG. 7 shows a modification of the arrangement of the rotating rollers.
  • two or more rotating rollers 21a and 21b in the liquid are arranged inside the plating liquid.
  • the stress applied to the wire W is dispersed, and more stable wire travel is possible.
  • one rotating roller 20 outside the liquid is arranged outside the plating solution M1 containing abrasive grains, and two rotating rollers 21a and 21b in one solution are arranged inside the plating solution M1.
  • the rotary roller 20 outside the liquid is arranged so that the rotation axis center thereof is positioned on a perpendicular bisector of a line connecting the rotation axis centers of the two rotation rollers 21a and 21b in the liquid. .
  • Each rotating roller has an axis parallel to each other and parallel to the plating solution surface.
  • the wire W runs between the rotating roller 20 outside the liquid and the rotating rollers 21a and 21b in the liquid a plurality of times so as to reciprocate a plurality of times inside and outside the plating solution M1. More specifically, it is wound so as to reciprocate a plurality of times inside and outside the plating solution M1 with each rotating roller being inside so that three rotating rollers are arranged inside the spiral formed by the wire W.
  • the traveling stability of the wire W is improved. As a result, the traveling speed of the wire can be increased. By doing so, the production speed can be further improved.
  • the number of rotating rollers in the liquid may be three, and the arrangement viewed from the side surface may be arranged at each vertex of a square such as a rhombus, or may be increased as necessary.
  • the traveling of the wire is first reciprocated once between the rotating roller 20 outside the liquid and one rotating roller 21 a in the liquid, and then rotated outside the liquid. It is also preferable to sequentially repeat one reciprocation between the roller 20 and the other rotating roller 21b in the liquid.
  • the wire W runs alternately with the rotating rollers 21a / 21b inside the plating solution M1
  • the contact opportunity between the wire and the abrasive grains is improved, and the electrodeposition efficiency of the abrasive grains is improved.
  • FIG. 5 shows another modification of the arrangement of the rotating rollers, in which two outer rotating rollers 20a and 20b and one inner rotating roller 21 are arranged. Also in the case of this example, by disposing two external rotating rollers outside the plating solution M1, the stress applied to the running wire W is dispersed, and more stable wire running is possible. From the viewpoint of increasing the amount of current loaded on the wire W and maintaining the current density, it is preferable that the current is supplied to both the rotating rollers 20a and 20b outside the liquid, but it is also possible to supply only one of them. it can.
  • the guide groove 7 for guiding the wire is provided on the outer peripheral surface of the rotating roller 20 outside the liquid or the rotating roller 21 in the liquid.
  • the guide groove 7 include, but are not limited to, a spiral groove-like concave portion and a plurality of link-like concave portions formed in the axial direction.
  • the abrasive grain amount calculation means 4 is obtained by the camera 40 that images the outer surface of the wire W that is running out of the first plating tank 16 ⁇ / b> A and the camera 40. It is comprised from the control computer 6 which calculates the quantity of the abrasive grain D adhering to the wire W outer surface based on image information.
  • the control computer 6 is connected to the camera 40 and the power supply device 30, and functions as the abrasive grain amount calculating means 4 that calculates the abrasive grain amount based on the image information received from the camera 40 and is calculated at the same time.
  • a control signal for increasing or decreasing the current value flowing through the wire W traveling through the first plating tank 16A is transmitted to the power feeding device 30, and the first plating tank 16A adheres to the outer surface of the wire. It also functions as current value control means 5 that controls the variation in the amount of abrasive grains within a predetermined range.
  • the position of the camera 40 is between the first plating tank 16A and the second plating tank 16B, between the second plating tank 16B and the water washing tank 17, between the water washing tank 17 and the winder 18, and
  • One plating tank 16A can be provided at an appropriate position, and the number is not limited to one.
  • a plurality of images can be provided at predetermined intervals along the wire W so that a plurality of images can be efficiently obtained. Also good.
  • the control computer 6 includes a processing device 60 and storage means 61, and the power supply device 30 and the camera 40 are connected to the processing device 60.
  • the processing device 60 is mainly configured by a CPU such as a microprocessor, and has a storage unit including a RAM and a ROM (not shown), and stores programs and processing data for defining procedures of various processing operations.
  • the processing device 60 functionally includes an image information acquisition processing unit 60a that stores image information received from the camera 40 in the image information storage unit 61a of the storage unit 61, and image information stored in the image information storage unit 61a.
  • Abrasive grain amount calculation processing unit 60b that calculates the amount of abrasive grains based on it, and determines whether the abrasive grain amount calculated by the abrasive grain amount calculation processing unit 60b is within a predetermined range set in advance. It includes at least a determination processing unit 60c and a current value control processing unit 60d that generates a control signal for increasing or decreasing the current value according to the determination result of the determination processing unit 60c and transmits the signal to the power feeding device 30. These functions are realized by the above program.
  • the storage unit 61 includes a hard disk and the like inside and outside the control computer 6 and includes at least an image information storage unit 61a that stores acquired image information.
  • the storage means 61 includes a case of storing in a temporary storage area in addition to the hard disk or the like.
  • the image information acquisition processing unit 60a may continuously acquire continuous image data for a short time from the camera 40, or may acquire a predetermined number of continuous image data for a short time every predetermined time. One image data may be acquired every predetermined time, or another acquisition form may be used.
  • FIG. 4A is a schematic view showing a region 62 imaged by the camera 40 with respect to the wire W to which the abrasive grains D are attached via the first plating layer m1, and FIGS. d) shows an example of image information acquired by the image information acquisition processing unit 60 a and stored in the image information storage unit 61 a of the storage unit 61.
  • the abrasive grain amount calculation processing unit 60b calculates the abrasive grain quantity as a numerical value such as the abrasive grain quantity and the area ratio based on the image information stored in the image information storage unit 61a.
  • the number and area ratio can be calculated by recognizing the abrasive grains contained in the entire image information or in a predetermined region, and the number or area ratio can be calculated as shown in FIG. It is also possible to recognize the number of the protruding parts as abrasive grains and to calculate the number thereof. In this example, as shown in FIGS.
  • the number or area ratio of the abrasive grains obtained from each piece of image information is added up for a plurality of pieces of image information, and this sum or average value is used as the abrasive grains. It is also calculated as a quantity.
  • the plurality of pieces of image information (a) to (c) are recognized as the outer shape recognition data for identifying the portion protruding above the predetermined height as shown in (a ′) to (c ′). May be calculated as the amount of abrasive grains.
  • the determination processing unit 60c determines whether the amount of abrasive grains calculated by the abrasive grain amount calculation processing unit 60b, for example, the total value of the number of abrasive grains is within a predetermined numerical range set in advance. As a result of the determination by the determination processing unit 60c, for example, when the total value exceeds the upper limit value of the numerical range, an amount by which the current value control processing unit 60d decreases the current value according to the magnitude of the exceeded value. A control signal that is calculated based on a predetermined formula and is decreased is generated and transmitted to the power supply apparatus 30.
  • the amount of increase in the current value is calculated based on the magnitude of the lower value based on a predetermined formula, and a control signal to be increased is generated to generate the power supply device 30. Send to.
  • it may be determined in advance as a constant increase / decrease amount.
  • the second plating tank 16B has substantially the same configuration as that of the first plating tank 16A except that the plating liquid M2 does not contain abrasive grains.
  • the second plating tank 16B has two rotating rollers 20 and 21 inside and outside the plating liquid M2.
  • the wire W is reciprocated a plurality of times, and current is supplied to the rotating roller 20 outside the liquid and the anode inside the liquid.
  • a second plating layer is formed on the outer surface by electroplating with respect to the wire supplied from the first plating tank 16A and having the abrasive particles attached to the outer surface via the first plating layer. Two-step plating is performed.
  • the second plating layer is thicker than the first plating layer, and in order to form a plating layer having a uniform thickness as much as possible, the supplied current value is preferably constant, and the current density is kept constant, so that the The entire plating thickness can be made uniform.
  • the thickness of the first plating layer is adjusted to be 30% or less of the total plating thickness including the second plating layer.
  • both the first plating tank 16A and the second plating tank 16B are configured to reciprocate by laying wires between the rotating rollers 20 and 21 inside and outside the liquid several times. Only one side may have such a configuration, and the other may have a general configuration in which a conventionally known wire is not reciprocated. That is, it is possible to increase the production efficiency by using the first plating tank 16A as the general form and the second plating tank 16B as the reciprocating travel, and vice versa.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention vise à pourvoir à un procédé et un dispositif pour fabriquer un fil de scie à grains abrasifs fixes, le procédé et le dispositif étant conçus de telle sorte que, même si l'on utilise un procédé d'avance de fil de haute efficacité, dans lequel la densité de grains abrasifs est élevée et où le fil est mis en mouvement alternatif, on évite la variation de la quantité de grains abrasifs qui adhèrent à la surface extérieure du fil pour rendre uniforme la distribution de l'adhésif des grains abrasifs. A cet effet, la présente invention comprend : une cuve de revêtement (16A) dans laquelle est contenu un liquide de revêtement (M1) contenant des grains abrasifs (D) ; un moyen débiteur de fil (2) servant à faire passer un fil (W) à travers le liquide de revêtement (M1) ; un moyen d'amenée de courant électrique (3) servant à amener un courant électrique au fil (W) et au liquide de revêtement (M1) ; un moyen de calcul de quantité de grains abrasifs (4) servant à calculer la quantité des grains abrasifs (D) qui adhèrent à la surface extérieure du fil (W) qui a traversé le liquide de revêtement (M) ; et un moyen de réglage de valeur de courant électrique (5) servant à réaliser un réglage de telle sorte qu'une variation de la quantité des grains abrasifs qui adhèrent à la surface extérieure du fil (W) se trouve dans un intervalle prédéterminé, le réglage par le moyen de réglage de valeur de courant électrique (5) étant exécuté par accroissement et décroissance, sur la base de la quantité calculée de grains abrasifs, de la valeur du courant électrique qu'on fait passer dans le fil (W) à l'intérieur du liquide de revêtement (M1) par le moyen d'amenée de courant électrique (3).
PCT/JP2012/055695 2011-03-15 2012-03-06 Procédé et dispositif pour fabriquer un fil de scie WO2012124547A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201280018545.4A CN103561912B (zh) 2011-03-15 2012-03-06 锯线的制造方法和制造装置
KR1020137026840A KR101902754B1 (ko) 2011-03-15 2012-03-06 소와이어의 제조방법 및 제조장치
US14/004,981 US20140026493A1 (en) 2011-03-15 2012-03-06 Method and device for manufacturing saw wire

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011-056547 2011-03-15
JP2011056547A JP5691689B2 (ja) 2011-03-15 2011-03-15 ワイヤーソーの製造方法および製造装置
JP2011-103587 2011-05-06
JP2011103587A JP5765048B2 (ja) 2011-05-06 2011-05-06 ソーワイヤーの製造方法および製造装置

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WO2012124547A1 true WO2012124547A1 (fr) 2012-09-20

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US (1) US20140026493A1 (fr)
KR (1) KR101902754B1 (fr)
CN (1) CN103561912B (fr)
TW (1) TWI590897B (fr)
WO (1) WO2012124547A1 (fr)

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CN107435161A (zh) * 2016-05-26 2017-12-05 苏州合亨机械科技有限公司 一种金刚石线锯生产线

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JP6322797B2 (ja) * 2014-03-31 2018-05-16 山形県 高速電着ワイヤー製造方法およびその製造装置
CN103921359B (zh) * 2014-04-17 2015-07-29 江苏中博钻石科技有限公司 上砂装置
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