201238690 六、發明說明： 【發明所屬之技術領域】 本發明係關於以矽單結晶等爲代表之各種電子材料的 切片步驟等所使用之固定磨粒式鋸條之製造方法及製造裝 置。 _ 【先前技術】 各種電子材料的切片步驟所使用之固定磨粒式鋸條， 是在鋸條的外周固著鑽石、CBN等的磨粒，作爲鑽石的固 著法，樹脂結合法、藉由電鍍讓磨粒固著之電附著法是已 知的。樹脂結合法，由於樹脂所形成之磨粒保持力較弱， 其壽命較短。電附著法雖然壽命較長，但存在著生產效率 差（生產速度慢、佔空間）等的缺點》 爲了提昇電附著法的生產性，讓鍍液中所含的磨粒量 儘量增多而具有高密度，將鋸條的行走速度加快並設置輔 助電極以維持電流密度已被提出（例如參照專利文獻1 ) 。此外，作爲其他方法，在分散有磨粒之鍍液流中，朝向 與該液流相同方向讓鋸條通過而使磨粒高效率地附著已被 提出（參照專利文獻2 )。 然而，當鍍液中的磨粒變得高密度化時，雖能提高生 產速度、降低成本等而讓生產效率顯著地提昇，但鋸條外 表面所附著的磨粒量，受到鍍液中之磨粒分散程度、電鍍 效率等的影響而發生很大的偏差，會形成高密度附著的部 位和低密度附著的部位等，要在鋸條外表面穩定地讓磨粒 -5- 201238690 均一地附著分布很困難。 再者，電鍍的析出量會受到浸漬表面積、電流密度、 浸漬時間的影響，爲了縮短浸漬時間而提高生產性，必須 讓浸漬表面積或電流密度儘量增加。然而，若將電流値增 大而使電流密度增加，鋸條會發熱而使斷線的可能性變高 ，又若將浸漬表面積增加，電流密度有降低的傾向，而且 必須將鍍槽加大，而有鍍液量增加之生產成本上的問題。 在上述專利文獻1也是，爲了確保浸漬表面積而必須將鍍 液收容在大鍍槽內，且有別於主電極必須另外設置輔助電 極，因此在生產性和生產成本方面都有進一步改善的餘地 〇 [專利文獻1]日本特開2006-55952號公報 [專利文獻2]日本特開2006-110703號公報 【發明內容】 有鑑於上述問題點，本發明的目的是爲了提供一種固 定磨粒式鋸條之製造方法及製造裝置，即使採用將磨粒高 密度化等之高效率的鋸條送出形態，仍能抑制鋸條外表面 所附著之磨粒量的偏差，可謀求磨粒的附著分布之均一化 ，且能進一步改善生產性和生產成本。 爲了解決前述課題，本發明所提供之鋸條之製造方法 ，是在含有磨粒之鍍液中讓鋸條通過，而在其外周藉由電 鍍讓磨粒固著之固定磨粒式鋸條之製造方法，其特徵在於 :算出通過前述鍍液後之鋸條外表面所附著的磨粒量，根 ⑧ -6- 201238690 據所算出的磨粒量，讓流過前述鍍液中的鋸條之電流値增 減而將前述鋸條外表面所附著的磨粒量之偏差控制在既定 範圍內。 在此較佳爲，在藉由前述電鍍而形成在外表面透過第 1鍍層附著有磨粒之鋸條後，進一步讓該鋸條通過不含磨 粒之鍍液，藉由電鏟在外表面形成第2鑛層。 更佳爲，在前述鋸條的外表面讓磨粒附著之前述第1 鍍層的厚度，是比前述第2鍍層的厚度更薄。 此外較佳爲，將通過前述鍍液後之鋸條的外表面利用 攝影機拍攝，根據該拍攝的影像資訊算出前述磨粒量。 此外較佳爲，在配置於鍍液外部且藉由電流供應手段 供應電流之液外的旋轉輥子、和配置於前述鍍液內部之液 內的旋轉輥子之間，將前述鋸條架設複數次而使其在前述 鍍液的內外往復複數次。 更佳爲，前述鋸條是架設在配置於前述鍍液內之至少 2個前述液內的旋轉輥子上。 更佳爲，在前述液外的旋轉輥子及/或前述液內的旋 轉輥子之外周表面上設置：沿輥子圓周方向將前述鋸條進 行複數次導引之導引溝槽。 此外較佳爲，藉由配置於前述鍍液內之攪拌手段來攪 拌鍍液。 此外，本發明所提供的鋸條之製造裝置，是在含有磨 粒之鍍液中讓鋸條通過，而在其外周藉由電鍍讓磨粒固著 之固定磨粒式鋸條之製造裝置；其特徵在於，係具備：鍍 201238690 槽，用來貯存含有前述磨粒的鍍液；鋸條送出手段，在該 鍍液內讓鋸條通過；電流供應手段，用來對前述鋸條和前 述鍍液供應電流；磨粒量算出手段，用來算出通過前述鍍 液後之鋸條外表面所附著的磨粒量；以及電流値控制手段 ，是根據前述磨粒量算出手段所算出的磨粒量讓前述電流 供應手段所供應之流過鍍液中的鋸條之電流値增減，而將 前述鋸條外表面所附著的磨粒量之偏差控制在既定範圍內 〇 在此較佳爲，前述磨粒量算出手段係包含：用來拍攝 通過前述鍍液後之鋸條的外表面之攝影機、以及根據該攝 影機所拍攝的影像資訊算出前述磨粒量之運算手段。 此外較佳爲具備：配置於鍍液外部且藉由前述電流供 應手段供應電流之液外的旋轉輥子、以及配置於前述鍍液 內部之液內的旋轉輥子；在前述液外的旋轉輥子和前述液 內的旋轉輥子之間將前述鋸條架設複數次而使其在前述鍍 液的內外往復複數次。 依據以上之本發明，讓磨粒、特別是被覆有導電性金 屬膜之磨粒在鍍液中帶電，若將電流値增大庫侖力會變大 而促進其在鋸條外表面上的附著，相反地若將電流値減少 庫侖力會變小而變得不容易附著於鋸條外表面，藉由可調 整鋸條外表面所附著之磨粒量的偏差，而將其控制在既定 範圍內。亦即，即使因磨粒的高密度化或鋸條的往復行走 等而使鍍液中的磨粒分散程度、電鍍效率等變差，仍能抑 制鋸條外表面所附著的磨粒量之偏差，而謀求磨粒的附著 -8- ⑧ 201238690 分布之均一化。 此外，如此般讓電流値增減，因此會引起鍍層厚度、 性質的偏差，基於電鍍一般的技術常識是無法想像的。本 發明刻意讓電流値增減，以解決讓磨粒的附著分布均一化 這種以往未要求的課題，關於其鑛層，必然會發生厚度、 性質的偏差。然而，讓電流値增減而在鋸條外表面透過第 1鍍層使磨粒附著之後，進一步讓該鋸條通過含有磨粒的 鍍液，藉由電鍍在外表面形成第2鍍層，因此利用該該第 2鍍層，能使第1鍍層之上述偏差的影響就鍍層整體而言 相對地變小，而能維持鍍層的品質。藉此，能使鋸條上之 磨粒固著變得更確實。這樣的構造，例如基於將磨粒暫時 固定於鋸條的目的，在含有磨粒之鍍液中讓鋸條通過後， 基於將磨粒確實地固著之目的，在不含磨粒之鍍液中讓鋸 條通過的情況是有效的。 特別是，讓會受到偏差的影響之第1鍍層的厚度比前 述第2鍍層的厚度更薄，可進一步縮小其相對的影響度， 就整體而言可獲得高品質的鍍層。 此外，將通過鍍液後之鋸條外表面利用攝影機拍攝， 根據該拍攝的影像資訊算出前述磨粒量，因此可正確地算 出鋸條外表面所附著的磨粒量。 此外，在配置於鑛液外部且藉由電流供應手段供應電 流之液外的旋轉輥子、和配置於前述鍍液內部之液內的旋 轉輥子之間，將前述鋸條架設複數次而使其在前述鍍液的 內外往復複數次，因此鋸條在液外的旋轉輥子和液內的旋 201238690 轉輥子之間每1往復的狀態下可從電流供應手段透過液外 的旋轉輥子供應電流，不致造成電流量過度增加而能維持 電流密度，而且能夠讓浸漬表面積大幅增加’因此能讓生 產速度顯著地增加。例如以僅在1根鋸條的鍍液浸漬部分 兩端設置1對電極所負荷的電流値爲基準的話，與其相同 電流値的電流可負荷於在旋轉輥子間並列配置之各鋸條列 ，而變成可負荷其往復次數2倍的電流値。此外，由於將 鋸條架設在旋轉輥子間而使其往復複數次，不須將主電極 和輔助電極分開設置，可將鍍液（鍍槽）的容量大幅縮小 。因此可確保生產空間，並能大幅減少鍍液的使用量，而 能使生產成本大幅減少。 此外，由於鋸條架設在配置於鍍液內之至少2個前述 液內的旋轉輥子上，能使鋸條所負荷的應力分散，而能更 穩定地讓鋸條行走。結果，能使鋸條行走速度變快，藉由 將往復次數等適當地調整，能使生產速度進一步提高。 此外，由於在液外的旋轉輥子及/或液內的旋轉輥子 之外周表面上，設有沿著輥子圓周方向將前述鋸條進行複 數次導引之導引溝槽，能使鋸條的行走穩定性更爲提昇， 使行走速度更快而謀求生產速度的提高。 此外’藉由配置於鍍液內之攪拌手段將鍍液攪拌，能 讓存在於鍍液內之磨粒的分散性提昇，而能謀求鋸條表面 上之磨粒附著的均一化。 【實施方式】 ⑧ -10- 201238690 接著，根據圖式詳細地說明本發明的實施方式。 本發明之鋸條製造裝置1，如第2圖所示般，是在含 有磨粒D之鍍液Ml內讓鋸條W通過，在其外周藉由電鍍 讓磨粒D固著（電附著）之固定磨粒式鋸條之製造裝置， 係至少具備：貯存含有磨粒D的鍍液Ml之鍍槽16A、在 鍍液Ml內讓鋸條W通過之鋸條送出手段2、對鋸條W和 鍍液Μ 1供應電流之電流供應手段3、算出通過鍍液Μ 1後 之鋸條W外表面所附著的磨粒D量之磨粒量算出手段4、 以及根據所算出的磨粒量讓藉由電流供應手段3流過鍍液 Μ :1中的鋸條W之電流値增減而將鋸條外表面所附著之磨 粒量的偏差控制在既定範圍內之電流値控制手段5。 第1圖係顯示本發明的鋸條製造裝置1之整體構造的 說明圖。在本例，從送出鋸條W之送出機10起，沿著鋸 條6行走方向依序配置有：用來將鋸條實施鹼脫脂之鹼槽 11、實施水洗之水洗槽12、實施酸洗之酸槽13、實施水 洗之水洗槽14、讓磨粒暫時附著於鋸條外周之第1鍍槽 16Α、進一步在外表面形成第2鍍層之第2鍍槽16Β、水 洗槽1 7、捲取機1 8。如此般獲得的鋸條可供各種用途使 用。 作爲第1鍍槽1 6 Α之含有磨粒的鍍液組成，沒有特別 的限定，可採用讓磨粒藉由電鍍固著時所使用之一般的成 分組成。例如含有含鎳有機酸、含鎳無機酸等的組成，但 並不限定於此等。此外，亦可適當地添加光澤劑、pH緩 衝劑等。關於第2鍍槽1 6B的鍍液組成也是，可使用以往 -11 - 201238690 公知者，較佳爲採用與第1鍍槽16A的鍍液相同的主成分 〇 鍍液所含的磨粒，例如爲鑽石、CBN等的超磨粒，但 並不限定於此等。關於磨粒的粒徑也是，只要是可作爲鋸 條使用的程度即可，沒有特別的限定，例如鑽石磨粒的話 可爲5〜100 μπι。在磨粒表面被覆金屬膜。又鋸條W並沒 有特別的限定，可使用金屬、非金屬、各種材質。作爲金 屬，以以往同樣的可使用鎢鋸條、鋼琴線、回火溫度 4 00 °C以上之模具鋼、高速工具鋼、不鏽鋼等。作爲非金 屬，可使用碳纖維、芳族聚醯胺纖維、氧化鋁纖維、硼纖 維、碳化矽纖維等。此外，在使用非金屬性材質的情況， 爲了對表面賦予導電性可實施一般的電鍍處理。 在本例，如第1圖所示般是採用藉由第1鍍槽16A和 第2鍍槽16B進行2段電鍍的構造，但將第2鍍槽省略而 僅在第1鍍槽完成電鍍當然也可以。又關於其他各槽的構 造、配置、選擇、組合也是，並不限定於本例，也能廣泛 地採用藉由電鍍讓磨粒固定之以往公知之鋸條製造裝置的 形態。此外，在本例，如以下所說明般’作爲第1、第2 鍍槽1 6 A，1 6 B之鋸條送出及電流供應的形態，雖是例示在 液內外的旋轉輥子間將鋸條架設複數次而使其往復行走的 形態，但採用該形態以外之以往公知的形態當然也可以。 在第1鍍槽16A，如第2圖及第6圖所示般配置液外 的旋轉輥子20和液內的旋轉輥子2 1 ’通過水洗槽1 4供應 之鋸條W在該等鍍液內外的旋轉輥子20、21間架設複數 -12- 201238690 次’而在鍍液Ml的內外往復行走複數次，藉此在鋸條W 外周讓磨粒D附著後，供應給第2鍍槽16 B。在本例，如 第6圖所示般鋸條W是呈螺旋狀捲繞在2個旋轉輥子20 '21(在鋸條W所形成之螺旋的內側配置2個旋轉輥子 2〇、21) ’而在鍍液Ml的內外往復行走複數次。該等的 旋轉輥子20、21，是和送出機1〇、捲取機18 —起發揮上 述据條送出手段2的作用。 各旋轉輥子20、21是配置成軸方向互相平行且與鍍 液Ml液面平行。又在鍍液內配置用來攪拌鏟液M1之攪 拌葉片22，且將陽極31配設成與上述往復行走的鋸條W 平行。旋轉輥子20和陽極3 1分別連接於供電裝置30，通 過旋轉輥子2 0的外周面也能對鋸條W供應電流。在本例 ’往復於旋轉輥子20、2 1間之鋸條W的各環路（1 〇0p ) 成爲陰極，在陽極31附近而在鋸條W的外周部透過鍍膜 讓磨粒D附著。亦即旋轉輥子20是和供電裝置30、陽極 3 1 —起發揮上述電流供應手段3的作用。 又在本例，對於鍍液Ml內外之2個旋轉輥子20、21 ，雖是將鋸條W呈螺旋狀捲繞而進行行走，但將鋸條W 以橫越旋轉輥子20和旋轉輥子2 1間、亦即呈「8」字形 的方式進行架設亦可。此外，用來架設鋸條W之旋轉輥 子設有3個以上亦可。具備電流供應手段3的作用之旋轉 輥子20，爲了與鋸條W形成電氣導通，其整體可採用導 電性材料，或在與鋸條W接觸的外周部分配置導電性材 料。作爲導電性材料，可列舉金屬、導電性高分子等。 -13- 201238690 第7圖係顯示旋轉輥子的配置之變形例 在鍍液的內部配置2個以上的液內的旋轉軺 藉此能使鋸條W所負荷的應力分散，而能 條行走。在本例，是在含有磨粒之鍍液Μ 1 個液外的旋轉輥子20，在鍍液Μ1的內部配 旋轉輥子2 1 a、2 1 b，從側面觀察，液外的旋 配置成，使其旋轉軸中心位於液內的 2 2 1 a，2 1 b之旋轉軸中心的連結線之中垂線上。 各旋轉輥子，是配置成使彼此的軸平行 平行。鋸條W是在液外的旋轉輥子20和液 21 a，2 lb間架設複數次而在鍍液Ml的內外 次。更具體的說，鋸條W是捲繞成：在鋸傾 螺旋的內側配置3個旋轉輥子，能以各旋轉 的方式在鍍液Ml的內外往復複數次。在本 至少2個液內的旋轉輥子21 a，2 lb，可提昇隹 穩定性，結果能使鋸條的行走速度加快，藉 等適當地調整，能使生產速度進一步提高。 旋轉輥子設定成3個，從側面觀察是配置成 的各頂點，能夠按照需要而適當地增加。 在此之鋸條的行走較佳爲，如第8圖及 ，先在液外的旋轉輥子20和液內的其中一 21a間往復1次，接著在液外的旋轉輥子20 的旋轉輥子21 b間往復1次，而依序反覆進 條W在鍍液Μ 1內部在旋轉輥子2 1 a/2 1 b交 。在本例，是 ϊ 子 21a，21b。 更穩定地讓鋸 的外部配置1 置2個液內的 :轉輥子20是 個旋轉輥子 且與鍍液液面 內的旋轉輥子 往復行走複數 备W所形成之 輥子位於內側 例，由於使用 居條W的行走 由將往復次數 也能將液內的 菱形等四角形 第9圖所示般 方的旋轉輥子 和液內另一方 行。如此使鋸 互地行走，可 -14- 201238690 增加鋸條和磨粒的接觸機會，而提高磨粒的電附著效率。 第5圖係旋轉輥子的配置之其他變形例，是配置2個 液外的旋轉輥子20a，20b和1個液內的旋轉輥子21之例 子。在本例的情況也是，藉由在鍍液Μ1的外部配置2個 液外的旋轉輥子，能使行走中的鋸條W所負荷之應力分 散，能更穩定地讓鋸條行走。基於讓鋸條W所負荷的電 流量增加並維持電流密度的觀點，較佳爲對液外的旋轉輥 子20a,2 0b雙方都供應電流，但僅對任一方供應亦可。 基於鋸條的行走穩定性、電流供應穩定性的觀點，較 佳爲如第11圖所示般在液外的旋轉輥子20、液內的旋轉 輥子21之外周表面上設置用來導引鋸條之導引溝槽7。導 引溝槽7，例如爲呈螺旋狀連續的凹部所構成者，或是沿 軸方向形成有複數個環狀的凹部而構成者等，但並不限定 於其等。 磨粒量算出手段4，如第2圖及第6圖所示般係具備 :用來拍攝從第1鍍槽16A離開之行走中的鋸條W外表 面之攝影機40、以及根據該攝影機40所獲得的影像資訊 算出鋸條W外表面所附著的磨粒D量之控制電腦6。控制 電腦6，是分別連接到上述攝影機40和供電裝置3 0，以 發揮根據來自攝影機40的影像資訊算出磨粒量之磨粒量 算出手段4的功能’同時也發揮電流値控制手段5的功能 ，亦即根據所算出的磨粒量，對於供電裝置3 0發送控制 信號（讓流過在第1鍍槽16 A行走的鋸條W之電流値增 減），而將藉由第1鍍槽1 6 A附著於据條外表面的磨粒量 -15- 201238690 的偏差控制在既定範圍內。 又攝影機40的位置，可設置在第1鍍槽16A和第2 鍍槽16B間、第2鍍槽16B和水洗槽1 7間、水洗槽1 7和 捲取機18間、第1鍍槽16A內部等之適當位置，其數目 不限於一個，例如可沿著鋸條W隔著既定間隔設置複數 個以高效率地獲得複數個影像。 控制電腦6，如第3圖所示般係具備處理裝置60和記 憶手段61，處理裝置60是連接到上述供電裝置30及攝影 機40。處理裝置60,其主體是由微電腦等的CPU所構成 ，具有未圖示之RAM、ROM所構成的記憶部，以儲存用 來規定各種處理動作的順序之程式、處理資料。 處理裝置60，功能上至少具備：將來自攝影機40的 影像資訊儲存於記憶手段61的影像資訊記憶部6 1 a之影 像資訊取得處理部60a、根據前述影像資訊記憶部6 1 a所 儲存的影像資訊算出磨粒量之磨粒量算出處理部60b、判 定前述磨粒量算出處理部60b所算出之磨粒量是否位於事 先設定的既定範圍內之判定處理部60c、以及按照前述判 定處理部60c的判定結果生成讓電流値增減之控制信號並 將該信號發送給供電裝置3 0之電流値控制處理部6 0 d，這 些功能是利用上述程式來實現。又記憶手段6 1，是由控制 電腦6內外的硬碟等，至少具備用來儲存所取得的影像資 訊之影像資訊記憶部6 1 a。作爲該等記憶手段6 1，除了上 述硬碟等以外’當然也包含保存於暫時記億區域的情形。 影像資訊取得處理部60a，可將來自攝影機40之短時 -16- ⑧ 201238690 間連續的影像資料持續取得，亦可將短時間連續 數的影像資料隔既定時間取得，也能隔既定時間 影像資料，或是採用其他取得形態。第4 ( a )圖 對於透過第1鍍層ml附著有磨粒D之鋸條W，: 所拍攝的區域62之槪略圖；第4(b)〜（d)圖 :藉由影像資訊取得處理部60a取得而儲存於記‘ 的影像資訊記億部6 1 a之影像資訊的例子。 磨粒量算出處理部60b，是根據影像資訊記 所儲存的影像資訊，算出作爲磨粒量之磨粒數量 等的數値。該數量、面積比，可辨識影像資訊的 定區域所含之磨粒而算出其數量、面積比，也能i 所示般，辨識外形上突出既定高度以上的部分視 算出其數量，也能採用其他同樣能反映所附著的 數値。在本例，如第4(b)〜（d)圖所示般，對 影像資訊，是將從各影像資訊獲得之前述磨粒數 加總，以該加總値或平均値當作磨粒量算出。當 述第5圖般，將複數個影像資訊（a )〜（C )轉 )〜（c’）般之辨識突出既定高度以上的部分之 資料後，以該部分的數量之加總値或平均値當作 出亦可。 判定處理部60c判定：在前述磨粒量算出處 所算出的磨粒量、例如磨粒數的加總値是否位於 的既定數値範圍內。判定處理部60c判定的結果 述加總値超過前述數値範圍之上限値的情況，電 之既定張 取得一個 係顯示， 懾影機40 分別顯示 億手段61 憶部6 1 a 、面積比 全體或既 如第5圖 爲磨粒而 磨粒量之 於複數個 或面積比 然，如上 換成（a ’ 外形辨識 磨粒量算 理部60b 事先設定 ，例如前 流値控制 -17- 201238690 處理部60d對應於該超出値大小根據事先設定的式子算出 電流値應減少的量，生成減少用的控制信號而發送給供電 裝置3 0。相反地低於下限値的情況，對應於該不足値的大 小根據事先設定的式子算出電流値應增加的量，生成增加 用的控制信號而發送給供電裝置30 »不是像這樣根據式子 算出電流値的增減量，而是事先設定成一定的增減量亦可 〇 第2鍍槽16B，除了在鍍液M2不含磨粒以外，是具 有與上述第1鍍槽16A大致同樣的構造，對於鍍液M2內 外的2個旋轉輥子20、21讓鋸條W往復行走複數次，對 液外的旋轉輥子20和液內的陽極供應電流。而且，對於 從第1鍍槽16A供應之在外表面透過第1鍍層附著有磨粒 的鋸條，進一步進行藉由電鍍在外表面形成第2鍍層之2 段電鍍。但爲了使第2鍍層比第1鍍層更厚且形成厚度儘 量均一的鍍層，所供應的電流値宜爲一定，以將電流密度 保持一定而謀求鋸條全體的鍍層厚度之均一化。較佳爲調 整成使第1鍍層的厚度成爲包含第2鍍層之全鑛層厚度之 3 0 %以下。 如此般，在本例中，關於第1鍍槽16A，第2鍍槽 16B雙方，都是採用在液內外的旋轉輥子20、21間將鋸 條架設複數次而使其往復行走的形態，但僅任一方採用此 形態’另一方則是像以往公知那樣採用不讓鋸條往復行走 的一般形態亦可。亦即，第1鍍槽1 6 A採用前述一般形態 ’第2鍍槽1 6B採用前述往復行走的形態以謀求生產效率 -18- ⑧ 201238690 化亦可，相反的也是可以的。 以上是針對本發明的實施方式做說明，但本發明並不 限定於該等實施例，在不脫離本發明要旨的範圍內當然能 以各種形態來實施。 【圖式簡單說明】 第1圖係顯示本發明的代表實施方式之鋸條製造裝置 的整體構造之說明圖。 第2圖係顯示該鋸條製造裝置的主要部分的構造之說 明圖。 第3圖係顯示構成該鋸條製造裝置之控制電腦的方塊 圖。 第4(a)圖係顯示對於附著有磨粒的鋸條之攝影機拍 攝區域的說明圖；第4(b)〜（d)圖係顯示所取得的影像 資訊例之說明圖。 第5(a) ~(c) 、（ a’）〜（c’）圖係顯示將影像資 訊轉換成外形辨識資料的樣子之說明圖。 第6圖係顯示本發明的代表實施方式之鋸條製造裝置 的主要部分的構造之說明圖。 第7圖係示意地顯示旋轉輥子的配置形態的變形例之 側視圖。 第8圖係示意地顯示旋轉輥子的配置形態之其他變形 例之側視圖。 第9圖係該變形例的立體圖。 -19- 201238690 第1 〇圖係示意地顯示旋轉輥子的配置形態之再其他 變形例之側視圖。 第1 1圖係顯示旋轉輥子之說明圖。 【主要元件符號說明】 1 :製造裝置 2 :鋸條送出手段 3 :電流供應手段 4 :磨粒量算出手段 5 :電流値控制手段 6 :控制電腦 7 :導引溝槽 10 :送出機 1 1 :驗槽 1 2 :水洗槽 13 :酸槽 1 4 :水洗槽 16Α :第1鍍槽 16Β :第2鍍槽 1 7 :水洗槽 18 :捲取機 20、 20a，20b :旋轉輥子 21、 21a，21b :旋轉輥子 22 :攪拌葉片 -20 201238690 3 0 :供電裝置 31 :陽極 40 :攝影機 60 :處理裝置 6〇a :影像資訊取得處理部 60b :磨粒量算出處理部 60c :判定處理部 6 0 d :電流値控制處理部 6 1 :記憶手段 6 1 a :影像資訊記憶部 62 :區域 D :磨粒 Μ 1 :鎞液 M2 :鍍液 W :鋸條 m 1 :鍍層 -21 -[Technical Field] The present invention relates to a method and a manufacturing apparatus for a fixed abrasive grain saw blade used for a slicing step of various electronic materials typified by a single crystal or the like. _ [Prior Art] The fixed abrasive blade used in the slicing step of various electronic materials is to fix the diamond, CBN, etc. on the outer periphery of the saw blade, as a method of fixing the diamond, resin bonding method, and plating Electrical attachment methods for abrasive grain fixation are known. In the resin bonding method, the life of the abrasive grains formed by the resin is weak, and the life thereof is short. Although the electric attachment method has a long life, it has disadvantages such as poor production efficiency (slow production speed and space occupation). In order to improve the productivity of the electro-adhesion method, the amount of abrasive grains contained in the plating solution is increased as much as possible. The density, the speed at which the saw blade travels faster, and the provision of the auxiliary electrode to maintain the current density have been proposed (for example, refer to Patent Document 1). Further, as another method, in the plating liquid in which the abrasive grains are dispersed, the saw blade is passed in the same direction as the liquid flow, and the abrasive grains are efficiently attached (see Patent Document 2). However, when the abrasive grains in the plating solution become high in density, the production efficiency can be remarkably improved by increasing the production speed, reducing the cost, etc., but the amount of abrasive grains attached to the outer surface of the saw blade is affected by the grinding in the plating solution. There is a large variation in the degree of particle dispersion, plating efficiency, etc., and a high-density adhering portion and a low-density adhering portion are formed, and the abrasive grain-5-201238690 is uniformly attached to the outer surface of the saw blade. difficult. Further, the amount of precipitation of electroplating is affected by the surface area to be impregnated, the current density, and the immersion time. In order to shorten the immersion time and improve productivity, it is necessary to increase the impregnation surface area or current density as much as possible. However, if the current 値 is increased and the current density is increased, the saw blade will generate heat and the possibility of wire breakage will become high. If the surface area of the immersion is increased, the current density tends to decrease, and the plating tank must be enlarged. There is a problem in the production cost of an increase in the amount of plating liquid. In the above Patent Document 1, in order to secure the surface area to be immersed, it is necessary to store the plating solution in the large plating tank, and the auxiliary electrode must be separately provided separately from the main electrode, so that there is room for further improvement in productivity and production cost. [Patent Document 1] JP-A-2006-55952 [Patent Document 2] JP-A-2006-110703 SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a fixed abrasive blade saw blade. In the manufacturing method and the manufacturing apparatus, even if the saw blade is fed in a highly efficient manner such as increasing the density of the abrasive grains, the variation in the amount of abrasive grains adhering to the outer surface of the saw blade can be suppressed, and the adhesion distribution of the abrasive grains can be uniformized. Can further improve productivity and production costs. In order to solve the above problems, the method for producing a saw blade according to the present invention is a method for manufacturing a fixed abrasive grain saw blade in which a saw blade is passed through a plating solution containing abrasive grains, and an abrasive grain is fixed by plating on the outer periphery thereof. The method is characterized in that the amount of abrasive grains adhering to the outer surface of the saw blade after the plating solution is calculated, and the root amount of the saw blade flowing through the plating solution is increased or decreased according to the calculated amount of abrasive grains 8-6-201238690. The deviation of the amount of abrasive grains attached to the outer surface of the saw blade is controlled within a predetermined range. Here, it is preferable that the saw blade having the abrasive grains adhered to the outer surface of the first plating layer is formed by the plating, and the saw blade is further passed through the plating liquid containing no abrasive grains to form the second ore on the outer surface by the electric shovel. Floor. More preferably, the thickness of the first plating layer to which the abrasive grains adhere to the outer surface of the saw blade is thinner than the thickness of the second plating layer. Further preferably, the outer surface of the saw blade after the plating solution is imaged by a camera, and the amount of the abrasive grains is calculated based on the captured image information. Further, it is preferable that the saw blade is stacked a plurality of times between the rotating roller disposed outside the plating solution and supplied by the current supply means, and the rotating roller disposed in the liquid inside the plating solution. It is reciprocated several times inside and outside of the aforementioned plating solution. More preferably, the saw blade is mounted on a rotating roller disposed in at least two of the liquids in the plating solution. More preferably, the outer peripheral surface of the rotary roller and/or the rotary roller in the liquid are provided with guide grooves for guiding the saw blade in the circumferential direction of the roller. Further, it is preferable that the plating solution is stirred by a stirring means disposed in the plating solution. Further, the apparatus for manufacturing a saw blade according to the present invention is a manufacturing apparatus for a fixed abrasive-grained saw blade which passes a saw blade in a plating liquid containing abrasive grains and which fixes abrasive grains by electroplating on the outer periphery thereof; The system has: a 201238690 groove for storing a plating solution containing the abrasive grains; a saw blade sending means for passing the saw blade in the plating solution; and a current supply means for supplying current to the saw blade and the plating solution; The amount calculation means for calculating the amount of abrasive grains adhering to the outer surface of the saw blade after the plating solution; and the current enthalpy control means for supplying the current supply means based on the amount of abrasive grains calculated by the abrasive grain amount calculation means The current flowing through the saw blade in the plating solution is increased or decreased, and the deviation of the amount of abrasive grains attached to the outer surface of the saw blade is controlled within a predetermined range. Preferably, the abrasive particle amount calculating means includes: A camera that captures the outer surface of the saw blade after the plating solution, and a calculation means for calculating the amount of the abrasive grains based on the image information captured by the camera. Further, it is preferable to further include: a rotating roller disposed outside the plating solution and supplied with a current by the current supply means, and a rotating roller disposed in the liquid inside the plating solution; a rotating roller outside the liquid and the aforementioned The saw blade is erected between the rotating rollers in the liquid several times to be reciprocated plural times inside and outside the plating solution. According to the above invention, the abrasive grains, particularly the abrasive grains coated with the conductive metal film, are charged in the plating solution, and if the current enthalpy is increased, the Coulomb force is increased to promote adhesion on the outer surface of the saw blade. If the current enthalpy is reduced, the Coulomb force will become small and it will not easily adhere to the outer surface of the saw blade. By adjusting the deviation of the amount of abrasive grains attached to the outer surface of the saw blade, it can be controlled within a predetermined range. In other words, even if the degree of dispersion of the abrasive grains in the plating solution, the plating efficiency, and the like are deteriorated due to the high density of the abrasive grains or the reciprocating running of the saw blade, the deviation of the amount of abrasive grains adhering to the outer surface of the saw blade can be suppressed. Seeking adhesion of abrasive grains -8-8 201238690 Distribution uniformity. In addition, the current 値 is increased or decreased as a result, which causes variations in the thickness and properties of the plating layer, and the common technical knowledge based on plating is unimaginable. The present invention deliberately increases or decreases the current enthalpy to solve the problem of uniformizing the adhesion distribution of the abrasive grains. This has not been required in the past, and variations in thickness and properties are inevitably caused in the ore layer. However, after the current 値 is increased or decreased, and the abrasive grains are adhered to the outer surface of the saw blade through the first plating layer, the saw blade is further passed through the plating solution containing the abrasive grains to form the second plating layer on the outer surface by electroplating. Therefore, the second coating layer is used. In the plating layer, the influence of the above-described variation of the first plating layer can be relatively small as a whole of the plating layer, and the quality of the plating layer can be maintained. Thereby, the abrasive grains on the saw blade can be fixed more reliably. Such a structure is based, for example, on the purpose of temporarily fixing the abrasive grains to the saw blade, and allowing the saw blade to pass through the plating liquid containing the abrasive grains, and allowing the abrasive grains to be firmly fixed in the plating liquid containing no abrasive particles. The case where the saw blade passes is effective. In particular, the thickness of the first plating layer which is affected by the deviation is made thinner than the thickness of the second plating layer described above, and the relative influence degree can be further reduced, and a high-quality plating layer can be obtained as a whole. Further, the outer surface of the saw blade after the plating solution is photographed by a camera, and the amount of the abrasive grains is calculated based on the captured image information, so that the amount of abrasive grains attached to the outer surface of the saw blade can be accurately calculated. Further, the saw blade is placed between the rotating roller disposed outside the molten metal and supplied by the current supply means, and the rotating roller disposed in the liquid inside the plating solution, and the saw blade is stacked a plurality of times to be The inside and outside of the plating solution are reciprocated a plurality of times, so that the saw blade can supply current from the current supply means through the rotating roller outside the liquid in the state of reciprocating between the rotating roller outside the liquid and the rotating screw in the liquid 201238690 rotating roller, so as not to cause the current amount. Excessive increase can maintain current density, and can greatly increase the impregnation surface area', thus allowing a significant increase in production speed. For example, when the current 负荷 of one pair of electrodes is provided at both ends of the plating liquid immersed portion of one saw blade as a reference, the current of the same current 可 can be loaded on each of the saw blade rows arranged side by side between the rotating rollers, and becomes Loads twice the current 値 of the number of reciprocations. Further, since the saw blade is placed between the rotating rollers to be reciprocated a plurality of times, the main electrode and the auxiliary electrode are not separately provided, and the capacity of the plating solution (plating tank) can be greatly reduced. Therefore, the production space can be ensured, and the amount of the plating solution can be drastically reduced, and the production cost can be drastically reduced. Further, since the saw blade is placed on the rotating roller disposed in at least two of the liquids in the plating liquid, the stress applied by the saw blade can be dispersed, and the saw blade can be more stably traveled. As a result, the saw blade can be made to travel faster, and the production speed can be further improved by appropriately adjusting the number of reciprocations and the like. Further, since the outer peripheral surface of the rotating roller outside the liquid and/or the rotating roller in the liquid is provided with a guiding groove for guiding the saw blade in the circumferential direction of the roller for a plurality of times, the running stability of the saw blade can be improved. It is more improved, making walking faster and increasing production speed. Further, by stirring the plating solution by the stirring means disposed in the plating solution, the dispersibility of the abrasive grains present in the plating solution can be improved, and the uniformity of the adhesion of the abrasive grains on the surface of the saw blade can be achieved. [Embodiment] 8 -10- 201238690 Next, an embodiment of the present invention will be described in detail based on the drawings. In the saw blade manufacturing apparatus 1 of the present invention, as shown in Fig. 2, the saw blade W is passed through the plating liquid M1 containing the abrasive grains D, and the abrasive grains D are fixed (electrically attached) by plating on the outer periphery thereof. The apparatus for manufacturing an abrasive-grained saw blade has at least: a plating tank 16A for storing the plating liquid M1 containing the abrasive grains D, a saw blade feeding means 2 for passing the saw blade W in the plating liquid M1, and a supply of the saw blade W and the plating liquid Μ 1 The electric current supply means 3 calculates the abrasive grain amount calculating means 4 for the amount of the abrasive grains D adhering to the outer surface of the saw blade W after the plating liquid Μ 1, and flows the current supply means 3 based on the calculated amount of the abrasive grains. The plating solution Μ: The current 値 of the saw blade W in 1 is increased or decreased, and the deviation of the amount of abrasive grains attached to the outer surface of the saw blade is controlled within a predetermined range of the current 値 control means 5. Fig. 1 is an explanatory view showing the entire structure of a saw blade manufacturing apparatus 1 of the present invention. In this example, from the feeder 10 for feeding the saw blade W, the alkali tank 11 for performing alkaline degreasing of the saw blade, the water washing tank 12 for performing water washing, and the acid tank for pickling are disposed in this order along the traveling direction of the saw blade 6. 13. The water washing tank 14 is subjected to washing, the abrasive grains are temporarily attached to the first plating tank 16 of the outer periphery of the saw blade, and the second plating tank 16 of the second plating layer, the water washing tank 17 and the coiler 18 are further formed on the outer surface. The saw blade thus obtained can be used for various purposes. The composition of the plating solution containing the abrasive grains in the first plating tank is not particularly limited, and a general composition of the abrasive grains used for plating and fixing can be employed. For example, it contains a composition containing a nickel-containing organic acid, a nickel-containing inorganic acid, or the like, but is not limited thereto. Further, a glossing agent, a pH buffering agent or the like may be added as appropriate. The plating solution composition of the second plating tank 1 6B is also known from the prior art, and it is preferable to use the abrasive grains contained in the main component bismuth plating solution which is the same as the plating solution of the first plating tank 16A, for example. It is a superabrasive grain such as a diamond or a CBN, but is not limited thereto. The particle size of the abrasive grains is not particularly limited as long as it can be used as a saw blade, and for example, diamond abrasive grains may be 5 to 100 μm. The surface of the abrasive grain is coated with a metal film. Further, the saw blade W is not particularly limited, and metal, non-metal, and various materials can be used. As the metal, a tungsten saw blade, a piano wire, a die steel having a tempering temperature of 400 ° C or higher, a high-speed tool steel, a stainless steel, or the like can be used. As the non-metal, carbon fiber, aromatic polyamide fiber, alumina fiber, boron fiber, strontium carbide fiber or the like can be used. Further, in the case of using a non-metallic material, a general plating treatment can be performed in order to impart conductivity to the surface. In this example, as shown in Fig. 1, the first plating tank 16A and the second plating tank 16B are used for the two-stage plating. However, the second plating tank is omitted and the plating is completed only in the first plating tank. Also. Further, the configuration, arrangement, selection, and combination of the other grooves are not limited to this example, and a conventionally known blade manufacturing apparatus for fixing abrasive grains by electroplating can be widely used. In the present embodiment, as described below, the saw blade is sent out and the current is supplied as the first and second plating tanks 1 6 A, 16 B, and the saw blade is erected between the rotating rollers inside and outside the liquid. In the case of reciprocating walking, the conventionally known form other than this form may be used. In the first plating tank 16A, as shown in Figs. 2 and 6, the rotary roller 20 outside the liquid and the rotary roller 2 1 ' in the liquid are supplied to the saw blade W supplied through the washing tank 14 in the inside and outside of the plating solution. A plurality of -12-201238690 times are set between the rotating rollers 20 and 21, and the inside and outside of the plating liquid M1 are reciprocated a plurality of times, whereby the abrasive grains D are attached to the outer periphery of the saw blade W, and then supplied to the second plating tank 16B. In this example, as shown in Fig. 6, the saw blade W is spirally wound around two rotating rollers 20'21 (two rotating rollers 2〇, 21 are disposed inside the spiral formed by the saw blade W). The inside and outside of the plating solution M1 are reciprocated a plurality of times. These rotating rollers 20 and 21 function as the above-described strip feeding means 2 together with the feeder 1 and the winding machine 18. Each of the rotating rollers 20, 21 is disposed such that the axial directions are parallel to each other and parallel to the liquid surface of the plating liquid M1. Further, the stirring blade 22 for stirring the shovel M1 is disposed in the plating solution, and the anode 31 is disposed in parallel with the reciprocating saw blade W. The rotating roller 20 and the anode 3 1 are respectively connected to the power supply device 30, and the saw blade W can be supplied with electric current by rotating the outer peripheral surface of the roller 20. In this example, each of the loops (1 〇0p) of the saw blade W that reciprocates between the rotating rollers 20 and 21 serves as a cathode, and the coating film is transmitted through the plating film on the outer peripheral portion of the saw blade W in the vicinity of the anode 31. That is, the rotating roller 20 functions as the current supply means 3 together with the power supply device 30 and the anode 3 1 . Further, in this example, the two rotating rolls 20 and 21 inside and outside the plating solution M1 are spirally wound and traveled, but the saw blade W is traversed between the rotating roller 20 and the rotating roller 2, It can also be erected in the form of an "8" shape. Further, three or more rotating rollers for erecting the saw blade W may be provided. The rotary roller 20 having the action of the current supply means 3 may be provided with a conductive material as a whole or in order to be electrically connected to the saw blade W, or a conductive material may be disposed on the outer peripheral portion in contact with the saw blade W. Examples of the conductive material include a metal, a conductive polymer, and the like. -13- 201238690 Fig. 7 shows a modification of the arrangement of the rotating rolls. Two or more liquid rotations are placed inside the plating solution, whereby the stress applied by the saw blade W can be dispersed and the energy can be traveled. In this example, the rotary roller 20 is provided outside the plating solution containing the abrasive grains, and the rotary roller 2 1 a and 2 1 b are disposed inside the plating solution 1 and viewed from the side. The center of the rotation axis is located on the vertical line of the connecting line at the center of the rotation axis of 2 2 1 a, 2 1 b in the liquid. Each of the rotating rollers is arranged such that the axes of the two are parallel to each other. The saw blade W is placed between the rotating roller 20 outside the liquid and the liquid 21a, 2 lb in the inside and outside of the plating solution M1. More specifically, the saw blade W is wound so that three rotating rollers are disposed inside the sawing spiral, and can be reciprocated plural times inside and outside the plating solution M1 in each rotation. The rotating rollers 21 a, 2 lb in the at least two liquids can improve the stability of the crucible, and as a result, the traveling speed of the saw blade can be increased, and the production speed can be further improved by appropriately adjusting. The number of the rotating rollers is set to three, and the vertexes are arranged as viewed from the side, and can be appropriately increased as needed. The walking of the saw blade here is preferably as shown in Fig. 8 and first between the rotating roller 20 outside the liquid and one of the liquid 21a in the liquid, and then between the rotating rollers 21b of the rotating roller 20 outside the liquid. Reciprocating once, and sequentially feeding the strip W in the inside of the plating bath 1 at the rotating roller 2 1 a / 2 1 b. In this case, it is the dice 21a, 21b. It is more stable to allow the external arrangement of the saw to be placed in two liquids: the rotating roller 20 is a rotating roller and is reciprocatingly traveling with the rotating roller in the liquid surface of the plating liquid, and the roller formed by the plurality of preparations is located inside, due to the use of the living strip W The walking is performed by rotating the roller as shown in Fig. 9 and the other side of the liquid in a square shape such as a rhombus in the liquid. In this way, the saws can walk on each other, and -14- 201238690 can increase the contact chance of the saw blade and the abrasive grains, and improve the electrical adhesion efficiency of the abrasive grains. Fig. 5 is a view showing another modification of the arrangement of the rotating rolls, which is an example in which two rotating rolls 20a, 20b outside the liquid and one rotating roll 21 in one liquid are disposed. Also in the case of this example, by arranging two rotating rolls outside the plating bath 1 to dissipate the stress applied by the saw blade W during walking, the saw blade can be more stably traveled. From the viewpoint of increasing the electric current load applied by the saw blade W and maintaining the current density, it is preferable to supply current to both of the rotary rollers 20a and 20b outside the liquid, but it may be supplied to only one of them. From the viewpoint of the stability of the saw blade and the stability of the current supply, it is preferable to provide a guide for guiding the saw blade on the outer peripheral surface of the rotary roller 20 outside the liquid and the rotary roller 21 in the liquid as shown in FIG. Lead groove 7. The guide groove 7 is, for example, a spiral-shaped continuous concave portion or a plurality of annular concave portions formed in the axial direction, but is not limited thereto. The abrasive grain amount calculation means 4 includes a camera 40 for photographing the outer surface of the saw blade W that is traveling away from the first plating tank 16A, as shown in FIGS. 2 and 6, and a camera 40 according to the camera 40. The image information is used to calculate the amount of abrasive particles D attached to the outer surface of the saw blade W. The control computer 6 is connected to the camera 40 and the power supply device 30, respectively, to function as a means for calculating the amount of abrasive grains calculated based on the image information from the camera 40, and also functions as the current control means 5. That is, according to the calculated amount of abrasive grains, a control signal is sent to the power supply device 30 (the current flowing through the saw blade W traveling in the first plating tank 16A is increased or decreased), and the first plating tank 1 is used. The deviation of 6 A adhering to the outer surface of the strip is -15-201238690 and the deviation is controlled within the established range. Further, the position of the camera 40 can be set between the first plating tank 16A and the second plating tank 16B, between the second plating tank 16B and the washing tank 17, the between the washing tank 17 and the coiler 18, and the first plating tank 16A. The number of appropriate positions of the interior or the like is not limited to one. For example, a plurality of images can be efficiently obtained by setting a plurality of images along the saw blade W at predetermined intervals. The control computer 6 is provided with a processing device 60 and a memory means 61 as shown in Fig. 3, and the processing device 60 is connected to the power supply device 30 and the camera 40. The processing device 60 is mainly composed of a CPU such as a microcomputer, and has a memory unit including a RAM and a ROM (not shown), and stores programs and processing data for specifying the order of various processing operations. The processing device 60 is functionally provided with at least a video information acquisition processing unit 60a that stores image information from the camera 40 in the video information storage unit 61a of the memory unit 61, and an image stored by the video information storage unit 61a. The abrasive grain amount calculation processing unit 60b that calculates the amount of abrasive grains is determined by the determination processing unit 60c that determines whether or not the amount of abrasive grains calculated by the abrasive grain amount calculation processing unit 60b is within a predetermined range set in advance, and the determination processing unit 60c. As a result of the determination, a control signal for increasing or decreasing the current is generated and transmitted to the current/control processing unit 60d of the power supply device 30. These functions are realized by the above-described program. Further, the memory means 6 1 is a hard disk or the like which controls the inside and outside of the computer 6, and at least has an image information storage unit 61a for storing the acquired image information. As the memory means 61, except for the above-described hard disk or the like, of course, the case where it is stored in the temporary area is included. The video information acquisition processing unit 60a can continuously acquire image data from the short time of the camera 40 between 16 and 8 201238690, and can also acquire short-time continuous image data at a predetermined time, and can also separate the image data at a predetermined time. Or use other forms of acquisition. Fig. 4(a) is a schematic view of the saw blade W to which the abrasive grain D is adhered through the first plating layer, : a thumbnail of the captured region 62; and Figs. 4(b) to (d): the image information obtaining processing portion 60a An example of the image information that was acquired and stored in the video information of the record. The abrasive amount calculation processing unit 60b calculates the number of abrasive grains or the like as the amount of abrasive grains based on the image information stored in the image information. The number and the area ratio can be used to identify the number of the abrasive grains contained in the predetermined area of the image information, and the ratio of the area to the area can be determined as shown in the figure. Others can also reflect the number of attachments attached. In this example, as shown in Figures 4(b) to (d), for the image information, the number of the abrasive grains obtained from each image information is added up, and the total or average 値 is used as the abrasive grain. The amount is calculated. As shown in Fig. 5, after a plurality of image information (a) to (C) are transferred to (c'), the data of the portion above the predetermined height is recognized, and the total number or average of the number of the portions is added. You can also make it. The determination processing unit 60c determines whether or not the amount of abrasive grains calculated in the calculation of the amount of abrasive grains, for example, whether or not the total amount of abrasive grains is located within a predetermined range. When the result of the determination by the determination processing unit 60c is greater than the upper limit 値 of the range of the number, the predetermined one of the electric sheets is displayed, and the video camera 40 displays the unit 61, the area 6 1 a , the area ratio, or As shown in Fig. 5, the amount of abrasive grains is in the plural or the area ratio, and is replaced by the above (a' shape identification abrasive grain amount calculation unit 60b is set in advance, for example, front flow control -17-201238690 processing unit 60d, corresponding to the excess 値 size, calculates an amount by which the current 値 should be reduced according to a predetermined formula, generates a control signal for reduction, and transmits it to the power supply device 30. Conversely, when the value is lower than the lower limit 値, corresponding to the insufficient 値The size is calculated based on a predetermined equation, and the amount of increase in current 値 is calculated, and a control signal for increase is generated and transmitted to the power supply device 30. Instead of calculating the increase or decrease of the current 根据 according to the equation, a certain increase or decrease is set in advance. The second plating tank 16B may have substantially the same structure as the first plating tank 16A except that the plating liquid M2 does not contain abrasive grains, and two rotating rolls 2 inside and outside the plating liquid M2. 0, 21, the saw blade W is reciprocated for a plurality of times, and the current is supplied to the rotating roller 20 outside the liquid and the anode in the liquid. Further, the saw blade which is supplied from the first plating tank 16A and has the abrasive grains adhered to the first plating layer on the outer surface is Further, two-stage plating in which the second plating layer is formed on the outer surface by electroplating is further performed. However, in order to make the second plating layer thicker than the first plating layer and to form a plating layer having as uniform thickness as possible, the current supplied should be constant to maintain the current density. It is preferable to uniformize the thickness of the plating layer of the entire saw blade. It is preferable to adjust the thickness of the first plating layer to 30% or less of the thickness of the entire ore layer including the second plating layer. Thus, in this example, regarding the first Both the plating tank 16A and the second plating tank 16B are formed by arranging the saw blade a plurality of times between the rotating rollers 20 and 21 inside and outside the liquid to reciprocate. However, only one of them is used in this form. Conventionally, it is also known to adopt a general form in which the saw blade does not reciprocate. That is, the first plating tank 16 6A adopts the above-described general configuration. The second plating tank 16B adopts the above-described reciprocating mode to achieve production efficiency -18- The present invention is not limited to the embodiments of the present invention, and can be implemented in various forms without departing from the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an explanatory view showing an overall structure of a saw blade manufacturing apparatus according to a representative embodiment of the present invention. Fig. 2 is an explanatory view showing a structure of a main part of the saw blade manufacturing apparatus. A block diagram showing a control computer constituting the saw blade manufacturing apparatus. Fig. 4(a) is an explanatory view showing a photographing area of a camera attached to a saw blade to which abrasive grains are attached; and Figs. 4(b) to (d) are showing An illustration of the obtained image information example. The fifth (a) to (c), (a') to (c') diagrams show an illustration of how image information is converted into shape identification data. Fig. 6 is an explanatory view showing the configuration of a main portion of a saw blade manufacturing apparatus of a representative embodiment of the present invention. Fig. 7 is a side view schematically showing a modification of the arrangement form of the rotating roller. Fig. 8 is a side view schematically showing another modification of the arrangement form of the rotating roller. Fig. 9 is a perspective view of the modification. -19- 201238690 The first drawing shows a side view showing still another modification of the arrangement form of the rotating roller. Fig. 1 is an explanatory view showing a rotating roller. [Description of main component symbols] 1 : Manufacturing apparatus 2 : Saw blade feeding means 3 : Current supply means 4 : Abrasive grain amount calculation means 5 : Current 値 control means 6 : Control computer 7 : Guide groove 10 : Feeder 1 1 : Inspection tank 1 2: Washing tank 13: Acid tank 1 4: Washing tank 16Α: 1st plating tank 16Β: 2nd plating tank 1 7: Washing tank 18: Coiler 20, 20a, 20b: Rotating rolls 21, 21a, 21b: Rotating roller 22: agitating blade -20 201238690 3 0 : power supply device 31 : anode 40 : camera 60 : processing device 6 〇 a : video information acquisition processing unit 60 b : abrasive grain amount calculation processing unit 60 c : determination processing unit 60 d : Current 値 control processing unit 6 1 : Memory means 6 1 a : Image information memory unit 62 : Area D : Abrasive Μ 1 : Sputum M2 : Plating solution W : Saw blade m 1 : Plating layer - 21