WO2016146343A1 - Procédé pour produire un fil de scie à abrasif fixe comprenant une couche de fixation en alliage métallique et fil résultant de ce dernier - Google Patents

Procédé pour produire un fil de scie à abrasif fixe comprenant une couche de fixation en alliage métallique et fil résultant de ce dernier Download PDF

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Publication number
WO2016146343A1
WO2016146343A1 PCT/EP2016/053626 EP2016053626W WO2016146343A1 WO 2016146343 A1 WO2016146343 A1 WO 2016146343A1 EP 2016053626 W EP2016053626 W EP 2016053626W WO 2016146343 A1 WO2016146343 A1 WO 2016146343A1
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WO
WIPO (PCT)
Prior art keywords
metal
wire
layer
bonding
fixation
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Application number
PCT/EP2016/053626
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English (en)
Inventor
Steven LANGEROCK
Filiep VANHEE
Luc Hofman
Original Assignee
Nv Bekaert Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nv Bekaert Sa filed Critical Nv Bekaert Sa
Priority to JP2017548002A priority Critical patent/JP6698682B2/ja
Priority to CN201680015477.4A priority patent/CN107427943B/zh
Publication of WO2016146343A1 publication Critical patent/WO2016146343A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition

Definitions

  • the invention relates to a method to produce a fixed abrasive saw wire and the fixed abrasive saw wire resulting from the method.
  • the fixed abrasive saw wire can be used for the cutting of hard and brittle materials such as sapphire, silicon, gallium arsenide, quartz, silicon carbide, natural or manmade stone or similar materials.
  • the bonding layer can be an organic resin bonding layer (US 6070570) or it can be a metallic bonding layer.
  • Metallic bonding layers can be applied by brazing or soldering (WO 99/46077) or by means of electroless or electrolytic deposition (an early bird being DE 916 143).
  • the current application concerns the latter type of fixed abrasive saw wire i.e. the holding of the abrasive particles in an electrolytically deposited metal layer.
  • the electrolytic co-deposition of the abrasive particles in the bonding layer is a challenge.
  • the abrasive particles mostly man-made diamond grit - are electrically inert, the particles do not coat in the process. Therefore the abrasive particles are first covered with a conductive layer such as electroless Ni-P or Co-P (GB 1 198479) or a semi-conductive layer like TiC or SiC (US7704127).
  • the conductive layer need not be closed around the abrasive particle (JP2010036298A, JP20101201 16A2).
  • the particles are provisionally fixed to the substrate wire. Preferably, this is done in a single layer of particles without particles sticking together in clusters. This fixation is too weak to make the wire fit for sawing but needs to be strong enough to at least temporarily keep the particles to the wire during the... b. ...second 'bonding step' wherein the particles are bonded in position by further electrolytic deposition of a metal 'bonding layer'. The bonding layer keeps the abrasive particles in place.
  • fixation step is by means of electrolytic co- deposition plating.
  • the first problem leads to unwanted, large protrusions that generate saw marks during use.
  • the second problem leads to a decrease of abrasive particles deposition rate as the particles become electrically inert due to the dissolution of the conductive coating over time. Consequently the particles lose their ability to be fixed to the substrate wire and the particle coverage on the wire diminishes over time.
  • TW2013/25780 describes a fixed abrasive saw wire comprises an 'empty plating layer 2' i.e. a plating layer that does not have diamond abrasive in it. Further the 'thick layer' is an electrodeposited layer of composition of about 70 wt% Ni and 30 wt% Co. The empty plating layer and thick layer share the same overall composition. There is no indication that the diamond particles are pre-coated. Addition of cobalt to a nickel layer is known to improve wear resistance and reduce friction.
  • KR101222061 B1 addresses the problem of dressing by partially coating the diamonds with nickel or cobalt or other metal by means of sputtering (i.e. the metal coating is free of phosphorous or boron) and thereafter fix them electrolytically to a metal wire.
  • 'Dressing' is the action of preparing the saw wire for use by freeing the tips of the diamonds of deposited metal so that they start cutting from the first stroke.
  • the diamonds are first fixed with a metal 'attached plating layer 220' that is further electrolytically thickened by a 'fastening plating layer'.
  • KR20090026490A and KR20090026498A describe the
  • the process comprises the steps of cleaning the wire ('washing tub 120'), putting a copper or nickel strike layer on top of it (in bath '130') followed by the co-deposition of diamond and nickel in bath '140', further followed by thickening up the nickel layer in bath '150' to intensify the coherence of the diamonds, and ending with the deposition of a cobalt layer (bath '160') to reduce the friction between the wire and the piece sawn and to increase the wear resistance of the wire.
  • a cobalt layer bath '160'
  • WO 201 1/042931 A1 describes a method to produce and the resulting fixed abrasive saw wire wherein the problem of dissolution of the metal pre-coating of the abrasive particle and the concomitant loss of particle deposition over time is solved by coating the outer surface of the particles with a metal that has a lower ionization tendency than silver.
  • WO 2014/184457A1 describes an abrasive sawing wire wherein the abrasive particles are held in nickel-cobalt layers that are
  • a first object of the invention is therefore to provide a method to produce a fixed abrasive saw wire.
  • the method solves the problems of clustering and loss of particle deposition over the lifetime of the deposition baths.
  • a further object is to provide a fixed abrasive saw wire that is substantially free of abrasive particle clusters.
  • abrasive saw wire is provided. The steps are as follows:
  • abrasive particles that are at least partly covered with an alloy coating of a first metal with phosphorous or boron.
  • the final wire is continuously wound on a wire carrier.
  • the invention discriminates itself from the prior art in that the fixation bath further comprises activating metal ions that are different from the first metal ion.
  • the activating metal ion co-deposits in the metal fixation layer and on the abrasive particles.
  • the metallic substrate wire can be a stainless steel filament.
  • Stainless steel contains at least 12% Cr by weight and a substantial amount of nickel. More preferred stainless steel compositions are austenitic stainless steels as they can be drawn to fine diameters. Examples are AISI 302, AISI 301 , AISI 304 and AISI 314.
  • the substrate wire can be a high tensile, far drawn, plain
  • a plain carbon steel has a minimum carbon content of 0.65%, a manganese content ranging from 0.40% to 0.70%, a silicon content ranging from 0.15% to 0.30%, a maximum sulphur content of 0.03%, a maximum phosphorus content of 0.30%, all percentages being percentages by weight.
  • a plain carbon steel has a minimum carbon content of 0.65%, a manganese content ranging from 0.40% to 0.70%, a silicon content ranging from 0.15% to 0.30%, a maximum sulphur content of 0.03%, a maximum phosphorus content of 0.30%, all percentages being percentages by weight.
  • copper, nickel and / or chromium There are only traces of copper, nickel and / or chromium.
  • the metallic substrate wire is made of a steel core and is coated with a metal coating.
  • metal coatings are brass (copper zinc alloy), copper, silver, aluminium, zinc, cobalt or nickel.
  • Particularly preferred are thicker metal coatings of alloys that have a higher electrical conductivity than stainless steel or plain steel such as copper, silver, aluminium, zinc or cobalt.
  • a thick, better conductive metal coating makes the current flow where it is needed during deposition: at the mantle of the wire.
  • coatings of the first metal or of the activating metal or alloys of both metals in order to have a compatible grain growth with the fixation layer.
  • the cross section of the wire maybe polygonal - that offers a better
  • the diameter, inclusive the metal coating if present, of the elongated metallic wire is between 60 and 300 ⁇ , even more preferred between 60 and 120 ⁇ , for example between 60 and 100 ⁇ . Typical sizes are 120, 1 10, 100, 90, 80 or 70 pm.
  • the abrasive particles can be superabrasive particles such as diamond (natural or artificial), cubic boron nitride or mixtures thereof.
  • particles such as tungsten carbide (WC), silicon carbide (SiC), aluminium oxide (AI2O3) or silicon nitride (Si3N ) can be used: although they are softer, they are considerably cheaper than diamond. Most preferred is man-made diamond. For cutting sapphire the use of uncrushed diamonds having a cubo-octahedral shape has been found to be beneficial.
  • the size of the abrasive particles depends on the intended use and the diameter of the wire. With the size of the abrasive particles is meant the size excluding any coating provided on the particles i.e. the bare particle.
  • wire diameters between 80 m to 120 m are general used. The particles then have sizes between 6 to 12 pm, or 8 to 16 pm for the 80 pm wire diameter up to 12 to 15 pm for the 120 pm wire diameter.
  • a somewhat larger wire diameter of between 120 ⁇ to 180 ⁇ is used and the particles have then sizes between 15 to 25 ⁇ for lower diameter wires up to 35 to 45 ⁇ for the higher wire sizes.
  • the limits indicate the 5% and 95% size limits of the cumulative size
  • abrasive particles 90% of the abrasive particles have then a size between the mentioned limits. With the median size of the abrasive particles is meant that size wherein 50% of the particles have a lower size and 50% have a higher size. Size measurements are performed according ANSI B74.20-2004 by the 'Low Angle Laser Light Scattering'.
  • the abrasive particles are at least partly covered with an alloy coating of a first metal with boron or phosphorous as intentional alloying elements.
  • the presence of boron or phosphorous makes the coating amorphous and helps to resist the dissolution of the alloy coating in the electrolyte.
  • the first metal is either nickel or cobalt. Most preferred is nickel.
  • electroless coating of the particles and in particular diamond particles with Ni-B, Ni-P, Co-P, Co-B is well-known and for example described in GB 1 198479.
  • the initial average thickness of the alloy coating is between 20 to 800 nm, or between 50 to 200 nm. In general lower average coating thicknesses centred around about 100 nm are preferred.
  • the average thickness of the coating is derived by double weighing wherein the mass of coating is divided to the mass of the uncoated abrasive particles. Assuming the particles to be spheroidal with a diameter equal to their measured size and taking into account the relative density of the abrasive particle and the alloy coating allows to derive an average thickness.
  • the mass percentage of phosphorous or boron in the total mass of the coating is larger than 6.5 % but smaller than 14%.
  • the abrasive particles are floating or are made to float in a fixation bath that comprises an electrolyte with ions of the first metal. Generally this will be an acidic bath comprising sulphate of the first metal, chloride of the first metal or sulphamate of the first metal or mixtures thereof, possibly complemented with boric acid as cathodic buffer or organic or inorganic brighteners.
  • the mass of the first metal alloy coating on the abrasive particles gradually tends to zero with the time period the abrasive particles reside in the electrolyte of the fixation bath.
  • the abrasive particles are 'at least partly covered' with the alloy coating of a first metal with boron or phosphorous.
  • particles are completely covered with the alloy coating, which is the case in their initial state.
  • the alloy coating does not uniformly diminish in thickness: certain parts of the alloy coating will dissolve earlier than other parts, thereby unveiling the surface of the abrasive particles.
  • the particle has the potentiality to be attached electrolytically to the metallic substrate wire, although this potentiality gradually weakens as the alloy coating
  • the state of coverage of any active abrasive particle will be between 100% and just above 0%.
  • the activating metal improves the electrophoretic action of the abrasive particles by adsorbing preferentially on the partially coated abrasive particles.
  • the activating metal becomes effective.
  • the inventors conjecture that the activating metal ions adsorb to the freed surface and thereby maintain and improve the electrophoretic particle activity. As long as the particle is fully covered, the activating metal does not help, as the particle is already active anyhow.
  • the inventors also conjecture that as a consequence of the adsorption of the positively charged activating metal ions to the abrasive particles the abrasive particles tend to repel one another in the fixation bath. In this way the activating metal also prevents agglomeration of particles prior to deposition and therefore prevents clustering.
  • the concentration of the activating metal ions in the fixation bath must not be high. Already when 0.5% of the total amount of metal ions in the bath are activating metal ions a positive effect can be observed.
  • the dilution by dissolving first metal ions from the abrasive particles will diminish that concentration during use. Practically, no more than 50% of all metal ions in the fixation bath need to be activating metal ions. Even lower concentrations of the activating metal in the fixation bath as for example between 0.5 to 30% or 0.5 to 20% or even 0.5 to 10% show equally good activating behaviour of the abrasive particles.
  • the activating metal ion preferentially binds to the metallic substrate wire and also to the partly covered abrasive particle, the ratio of activating metal atoms on the total metal atoms of the metal fixation layer will be higher in the fixation layer than in the bath itself. The consumption of the activating metal is therefore significantly higher than the consumption of the first metal in the bath.
  • the amount of abrasive particles that adhere to the surface of the intermediate or final wire is controlled by changing the concentration of the activating metal ion in the fixation bath.
  • the activating metal ions are consumed faster than the first metal ions in the bath and as the response of the abrasive particles to the presence of the activating metal ions is relatively fast, the amount of adhering particles can be steered within a reasonable time frame by increasing or decreasing the addition rate of the activating metal ions to the fixation electrolyte bath.
  • the amount of abrasive particles at the surface of the intermediate or final wire can be measured by using sophisticated optical monitoring
  • the intermediate wire is coated at high efficiency with a metal bonding layer that is deposited from one or more electrolytic baths containing ions of one or more bonding metals. Distinct bonding metal ions may be present in each one of the baths. Alternatively ions of more than one bonding metal may be present in a single or more baths.
  • the bonding layer is thicker than the fixation layer and effectively bonds the particles 'in situ'. The bonding layer cannot become too thick as then the abrasive particles are then fully immersed in the bonding layer and do not protrude out of the surface. On the other hand if the bonding layer is too thin, it will not sufficiently hold the particle.
  • the wire After deposition of the bonding layer the wire is final and is wound on a customer spool for further use.
  • not one of the bonding metal ion types in the one or more baths for depositing the bonding layer is of the activating metal ion type.
  • the one or more bonding metal ions are ions of the first metal, without any intentional presence of boron or phosphorous.
  • first metal and first metal ion atoms and ions of nickel are preferred.
  • an activating metal one out of the group comprising cobalt, iron, manganese and tin is preferred. They all induce an increased activity of the partly covered abrasive particles. Most preferred is cobalt.
  • a fixed abrasive saw wire that is the outcome of the above described process.
  • the fixed abrasive saw wire comprises a metallic substrate wire and abrasive particles.
  • the abrasive particles are at least partly covered with an alloy coating of a first metal with phosphorous or boron.
  • the particles are held to the substrate wire by means of fixation layer and a bonding layer on top of the fixation layer.
  • the fixation layer comprises at least the first metal and covers the abrasive particles and the substrate wire.
  • the fixation layer is on its turn covered with a bonding layer of bonding metal or bonding metal alloy. Both the fixation layer and the bonding layer are
  • Characteristic about the wire is that the fixation layer contains, comprises an activating metal that differs from the first metal.
  • the types of the metallic substrate wire and the types of abrasive particles are as described in the explanation on the method.
  • the at least partial coating of the abrasive particles with a first metal alloy with boron or phosphorous is preferably deposited by electroless deposition.
  • the inventors consider the presence of the phosphorous and boron to be advantageous to the working of the invention as phosphorous and boron are also constituents of the electrolytic baths.
  • the first metal alloy coating with phosphorous and boron is amorphous. This to prevent any interference with magnetic fields and/or magnetic dipole interaction between particles (that could pair up and thereby form clusters).
  • the presence of a magnetic phase can readily be ascertained by bringing the alloy coated abrasive particles in contact with a magnet: if particles are attracted, they are magnetic.
  • the bonding metal or bonding metal alloy is substantially free of the activating metal.
  • the bonding metal or metal bonding alloy is the same element as the first metal. Most preferred is if the bonding metal is nickel.
  • the activating metal is one out of the group consisting of cobalt, iron, manganese and tin. These metals have been found particularly useful as additions to the fixation baths as they re-activate partly covered abrasive particles and thereby extend the useful life of the abrasive particles in the bath. As a consequence this activating metal can be found back into the fixation layer. The presence of the activating metal in the fixation baths results in an improved product in that there are less clusters on the surface resulting in a better sawing quality with less saw marks.
  • the concentration of the activating metal in the fixation layer can be any concentration of the activating metal in the fixation layer.
  • the total thickness of the bonding layer and fixation layer' or - 'total layer thickness' in short - is meant the thickness in radial direction as can be measured on a cross section of the saw wire in a circumferential region that is free of abrasives particles.
  • the total thickness of the bonding layer and fixation layer is related to the median size of the abrasive particles.
  • the total layer thickness is between 25% to 75% of the median size of the abrasive particles, more preferably between 25% and 50% of the median size of the particle, such as between 25% to 33% of the median size of the particles. So for example for particles with median size of 9 ⁇ the total layer thickness is best between 2.25 to 6.75 ⁇ , for particles with median size 12 ⁇ the total layer thickness is best between 3 ⁇ and 9 ⁇ .
  • the fixation layer is much thinner than the bonding layer and its thickness related to the total thickness of fixation and bonding layer is less than 40 %, for example less than 30% such as less than 20%, or even less than 10%.
  • the fixation layer is at least 1 % of the total thickness of the fixation and bonding layer as otherwise the particles are not adequately held.
  • the fixation layer is meant that layer wherein a minimal amount of 1 % or more by weight of the activating metal can be discerned in an Energy Dispersive X-ray spectroscope coupled to a scanning electron microscope (EDX-SEM).
  • the activating metal is concentrated close to the metallic substrate wire. More than 70% of all the activating metal atoms in the fixation and bonding layer are present close to the metallic substrate in the 30% of the total layer thickness of the fixation layer and bonding layer. Even more than 80% of all the activating metal atoms in the fixation and bonding layer may be present close to the metallic substrate in 20% of the total layer thickness of the fixation and bonding layer. Again this can be ascertained by making an EDX-SEM scan on a cross section of the saw wire.
  • the activating metal is also present around the abrasive particles. As the activating metal adsorbs to the partially coated abrasive particle it is incorporated close to the abrasive particle that is held in the fixation and bonding layer. The activating metal can also be detected in an EDX-SEM scan.
  • the thickness of the fixation layer will be between 0.2 and 2.0 ⁇ , for example between 0.3 and 2.0 ⁇ or 0.3 to 1 .5 ⁇ or 0.3 to 1 ⁇ .
  • Figure 1 shows the implementation of the method
  • Figure 2 shows the concentration measured by EDX-SEM of
  • Nickel Figure 2b;
  • Figure 3 shows the cumulative distribution of the activating metal (Co) and the first metal (Ni) throughout the coating.
  • Figure 1 shows how the method is implemented. The installation
  • the resulting wire 104 is the elongated metallic substrate wire that is the starting product for the method.
  • the steel wire is a 120 ⁇ plain carbon (0.80 wt% carbon) steel wire with a tensile strength of about 3950 N/mm 2 coated with brass. Prior to deposition of abrasive particles, the wire is coated with a 700 nm layer of nickel to have a compatible surface in the fixation bath.
  • fixation bath 1 10 that comprises:
  • the abrasive particles are crushed and size selected man-made diamond grit of a size range 12 to 15 ⁇ . They are coated with a nickel phosphorous coating wherein the ratio coating to diamond weight was 18% by weight. The concentration of phosphorous in the nickel alloy coating was 10 wt% taken to the total of the coating. The concentration of the diamond particles in the fixation bath correlates with the amount of particles one wants to deposit on the wire.
  • the abrasive particles are floating or are made to float in an electrolyte that predominantly contains metal ions of the first metal this case nickel.
  • a typical mix of nickel deposition bath is:
  • Ni sulfamate Ni(S0 3 NH 2 ) 2 -4H 2 0) 440 g/l
  • the surface of this intermediate wire is dotted with diamond particles that only very lightly adhere to the surface.
  • the wire and abrasive particles are conformably coated with a thicker layer of bonding metal or bonding metal alloy.
  • nickel is used to this end. The number of baths, current densities, concentrations etc... are known to the skilled person and are used to tune the thickness of the bonding layer.
  • Figure 2 the elemental distribution obtained by EDX-SEM technique illustrate where the active metal actually arrives in a cross section of the wire.
  • Figure 2a is a SEM picture of the area of interest.
  • Figure 2b shows the distribution of nickel in a cross section through a diamond particle 204 and the substrate wire 202. The nickel layer 204 completely and conformably encloses the diamond particle.
  • Figure 2c shows the distribution of phosphorous that is only found in the vicinity of the diamond particle. The coating is less than 1 ⁇ thin.
  • Figure 2d shows the
  • the activating metal cobalt is predominantly present in a thin surface layer less than 1 ⁇ thick on the surface of the wire. Outside that an even thinner layer of cobalt is discernible on the surface of the abrasive particle. It is this layer that activates the abrasive particle and improves the active life of the abrasive particle.
  • FIG 3 illustrates that most of the cobalt - the activating metal - deposits in the close vicinity of the metallic substrate wire.
  • the 'relative cumulative counts (RCC)' are detected along a line perpendicular to the surface of the substrate wire.
  • the number of counts is proportional to the amount of cobalt atoms detected.
  • the distance to the substrate wire is indicated with T (in ⁇ ).
  • the cumulative sum is taken outwardly starting from the surface of the substrate wire and afterward divided by the total number of counts and expressed in a percentage.
  • the amount of nickel counts is cumulatively expressed in the same graph (the dashed line).
  • the diamond deposition goes through a strong active peak where a lot of diamond is deposited followed by a strong decrease in deposition efficiency to zero as the coating on the abrasive particles is corroded away. This leads to a difficult to control diamond deposition with clusters and uneven deposition of diamond particles over the length of the wire.
  • the deposition starts also with an active peak put the fall off is much longer and decreases slower than in the prior art process. As a result the deposition of diamond over length is much more uniform and less clusters are observed.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention concerne un procédé pour produire un fil de scie à abrasif fixe (104) par déposition électrolytique de particules abrasives pré-revêtues d'un premier métal sur un fil de substrat allongé (104, 202). Le procédé est spécifique en ce que, dans le bain de fixation initiale (110) des particules abrasives, des ions métalliques d'activation différents du premier métal sont ajoutés. Les ions métalliques d'activation se déposent avec des premiers ions métalliques dans une couche de fixation sur le fil de substrat métallique (104, 202) et améliorent l'activité de particules abrasives qui ne sont que partiellement revêtues. Ensuite, une couche de liaison est déposée à partir d'un bain de déposition (108), cette dernière étant exempte de couches de liaison métalliques ajoutées. Le fil résultant (104) a plus de 70 % de tout le métal d'activation présent à proximité du fil de substrat métallique (104, 202) à l'intérieur d'une largeur de 30 % de l'épaisseur totale de la couche de fixation et de liaison.
PCT/EP2016/053626 2015-03-13 2016-02-22 Procédé pour produire un fil de scie à abrasif fixe comprenant une couche de fixation en alliage métallique et fil résultant de ce dernier WO2016146343A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017548002A JP6698682B2 (ja) 2015-03-13 2016-02-22 金属合金固定層を有する固定砥粒ソーワイヤーの製造方法及びそれにより得られるワイヤー
CN201680015477.4A CN107427943B (zh) 2015-03-13 2016-02-22 具有金属合金固定层的固结研磨锯丝的制造方法和所制造的锯丝

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EP15158993 2015-03-13
EP15158993.4 2015-03-13

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