WO2012121143A1 - Procédé de fabrication d'un produit photodurci - Google Patents

Procédé de fabrication d'un produit photodurci Download PDF

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Publication number
WO2012121143A1
WO2012121143A1 PCT/JP2012/055369 JP2012055369W WO2012121143A1 WO 2012121143 A1 WO2012121143 A1 WO 2012121143A1 JP 2012055369 W JP2012055369 W JP 2012055369W WO 2012121143 A1 WO2012121143 A1 WO 2012121143A1
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WO
WIPO (PCT)
Prior art keywords
mold
photocurable composition
photocured product
substrate
composition layer
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Application number
PCT/JP2012/055369
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English (en)
Japanese (ja)
Inventor
中川　勝
義隆 月館
武司 大幸
三宅　弘人
Original Assignee
東洋合成工業株式会社
国立大学法人東北大学
株式会社ダイセル
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Application filed by 東洋合成工業株式会社, 国立大学法人東北大学, 株式会社ダイセル filed Critical 東洋合成工業株式会社
Publication of WO2012121143A1 publication Critical patent/WO2012121143A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

Definitions

  • the present invention relates to a method for producing a photocured product by photoimprinting.
  • Photoimprint is a process in which a photocurable composition layer formed by applying a photocurable composition to a substrate and a mold having a concavo-convex pattern are brought into contact with each other to form the photocurable composition layer on the concavo-convex pattern of the mold. Filling and exposing the photocurable composition layer to a photocured product, and then releasing the mold from the photocured product to obtain a photocured product to which the concavo-convex pattern has been transferred. Since a transferred photocured product can be easily produced, it is a technology that has been attracting attention in recent years (see Patent Document 1).
  • the photocured product may be peeled off from the substrate without releasing the mold from the photocured product during the mold release step of releasing the mold from the photocured product.
  • the photocured product does not peel from the substrate, a part of the photocured product adheres to the mold, and there is a problem that a photocured product having a desired uneven pattern cannot be obtained. In particular, when the mold is used repeatedly, this problem is remarkable.
  • the present invention is a method for producing a photocured product by photoimprinting, and can produce a photocured product that can be favorably repeatedly performed by releasing a mold from the photocured product. It is an object to provide a method.
  • the present inventors have found that the adhesion per unit area of the test body obtained by exposing and curing the photocurable composition for imprinting to a member having the same surface as the mold is obtained. And 15 mN / mm 2 or less, it was found that the above problems can be solved, and the present invention has been completed.
  • the method for producing a photocured product of the present invention includes a molding step of sandwiching and molding a photocurable composition layer formed of a photocurable composition for imprinting between a substrate and a mold on which an uneven pattern is formed, A photocuring step of exposing the photocurable composition layer to a photocured product, and a mold releasing step of releasing the mold from the photocured product.
  • Adhesive force per unit area of a test specimen exposed and cured to a member having the same surface as the mold is 15 mN / mm 2 or less.
  • the adhesive force per unit area of a test body that has been cured by exposing the photocurable composition for imprinting to the member having the same surface as the mold is 15 mN / mm 2 or less
  • the mold release process for releasing the mold from the photocured product can be performed repeatedly, and the mold is not released from the photocured product and the photocured product is peeled off from the substrate. Although it does not peel, the problem that a part of photocured material adheres to a mold can be prevented. And it can be judged whether a mold release process can be performed favorable only by simple operation of measuring the adhesive force of the test body which exposed and hardened the photocurable composition for imprint to be used.
  • FIG. 1 is a cross-sectional view showing an example of a method for producing a photocured product of the present invention
  • FIG. 2 is a diagram showing a schematic configuration of an apparatus for measuring adhesive force
  • FIG. 3 is an outline of a method for measuring adhesive force
  • FIG. 4 is a diagram illustrating an example of a measurement result of adhesion force.
  • the method for producing a photocured product of the present invention includes a molding step in which a photocurable composition layer 2 formed of a photocurable composition for imprints is sandwiched between a substrate 1 and a mold 3 on which an uneven pattern is formed.
  • the adhesive composition has an adhesion per unit area of 15 mN / mm 2 or less to a member having the same surface as the mold 3 of the test body obtained by exposing and curing the photocurable composition.
  • a photocurable composition layer 2 is formed on a substrate 1 by applying a photocurable composition for photoimprinting onto the substrate 1.
  • a photocurable composition for photoimprinting onto the substrate 1.
  • the photocurable composition is applied on the substrate 1, but the photocurable composition may be applied to the mold 3.
  • the substrate 1 may be any substrate as long as the photocurable composition layer 2 can be provided.
  • the substrate 1 may be a substrate used in normal optical imprinting.
  • Specific examples include transparent inorganic substrates such as glass, silica glass, quartz, and sapphire, transparent synthetic resin substrates such as polycarbonate, polyethylene terephthalate (PET), and triacetyl cellulose, semiconductor substrates such as silicon wafers, GaAs, InAs, Examples thereof include compound semiconductors such as GaN, metals, metal oxides, and the like.
  • substrate 1 may be pre-processed for the improvement of the adhesiveness with the photocurable composition layer 2, the application
  • Specific examples of the pretreatment include wet surface cleaning, surface modification by plasma and ozone cleaning, treatment with an adhesion improver such as a silane coupling agent, and the like.
  • the mold 3 may have a desired uneven pattern on the surface.
  • the material of the mold 3 include quartz glass, synthetic quartz glass, silica glass, and ultraviolet rays used for normal light imprints such as synthetic resins such as transparent Teflon (registered trademark) resin, cycloolefin polymer, and silicone rubber. In addition to those exhibiting transparency, it is also possible to exhibit transparency to other active energy rays such as metals and metal oxides such as silicon, silicon carbide, silicon oxide, and nickel.
  • the appearance of the mold 3 may be the same as that of the mold 3 used in normal optical imprinting. For example, the appearance may be a rectangular parallelepiped shape or a roll shape.
  • the uneven pattern formed on the surface of the mold 3 may be the same as the uneven pattern formed on the surface of the mold used in normal optical imprinting, but is not limited thereto. Not a thing. For example, it is good also as the mold 3 which formed the recessed part by forming the hollow in the surface of the material of a mold, and the part which protruded relatively to the surface side becomes a convex part in this case. Moreover, it is good also as the mold 3 which formed the convex part by providing a permite
  • each concave portion of the concave / convex pattern may be a square, a rectangle, a half moon, or a shape similar to these shapes.
  • the surface of the mold 3 may be subjected to a mold release treatment.
  • a known release treatment agent such as a perfluoro- or hydrocarbon-based polymer compound, an alkoxysilane compound or a trichlorosilane compound, diamond-like carbon, or the like is used by a gas phase method or a liquid phase method. Can be done.
  • the photocurable composition for imprints that forms the photocurable composition layer 2 contains a curable monomer that is a compound that has a polymerizable group and reacts and cures upon exposure to ultraviolet rays, active energy rays, and the like. Any of a photo cation curing type that is cured by cationic polymerization by exposure, a radical curing type that is cured by radical polymerization by exposure, and a combination type thereof may be used.
  • curable monomer cationic curable monomer
  • a compound having a functional group exhibiting photocationic polymerization properties such as an epoxy group, a vinyl group, and an oxetanyl group.
  • curable monomer which can be used for the radical curable type photocurable composition for imprints
  • (meth) acrylic acid ester, styrene compound, acrylic silane compound, polyfunctional monomer, etc. Is mentioned.
  • the photocurable composition for imprints may contain an active energy ray cationic polymerization initiator.
  • the active energy ray cationic polymerization initiator can be used without particular limitation as long as it generates an acid upon irradiation with a known active energy ray.
  • sulfonium salt, iodonium salt, phosphonium salt, pyridinium salt and the like can be used. Can be mentioned.
  • the photocurable composition for imprints may contain an active energy ray radical polymerization initiator.
  • the active energy ray radical polymerization initiator include known and commonly used active energy ray radical polymerization initiators such as benzoin / benzoin alkyl ethers, acetophenones, anthraquinones, thioxanthones, ketals, benzophenones, and xanthones. And can be used in combination with known and commonly used sensitizers.
  • the photocurable composition for imprints may contain other additives.
  • Other additives include solvents, antioxidants, UV absorbers, light stabilizers, silane coupling agents, coating surface improvers, adhesion reducing agents, thermal polymerization inhibitors, leveling agents, surfactants, and storage stability.
  • the viscosity of the photocurable composition for imprints is preferably 1 mPa ⁇ s to 10 Pa ⁇ s, more preferably 5 mPa ⁇ s to 5 Pa ⁇ s, and particularly preferably 5 mPa ⁇ s to 3000 mPa ⁇ s. This is because the pattern of the mold 3 can be easily filled with the photocurable composition for imprints.
  • the adhesive force per unit area with respect to the member which has the same surface as the mold 3 of the test body which exposed and hardened this photocurable composition for imprints is 15 mN / mm ⁇ 2 > or less. is there.
  • the adhesion force per unit area of the test body thus exposed and cured to a member having the same surface as the mold 3 is 15 mN / mm 2 or less.
  • the photocured product 4 does not peel from the substrate 1 without being released, and the photocured product 4 does not peel from the substrate 1, but a part of the photocured product adheres to the mold. There is nothing. And if the conventional mold 3 is used repeatedly, that is, if the mold release process is performed a plurality of times, the adhesion between the mold 3 and the photocured product 4 may increase, or a part of the photocured product 4 may adhere to the mold 3. However, according to the method for producing a photocured material of the present invention, for example, even when the mold 3 is used 1000 times or more, a part of the photocured material 4 adheres to the mold 3. Therefore, the problem that a photocured product having a desired uneven pattern cannot be obtained does not occur.
  • the adhesive force per unit area is 15 mN / mm 2 or less, the stress applied to the mold 3 in the mold release process is extremely small, and therefore the mold 3 is not broken.
  • the magnitude of such an adhesive force is assumed to be determined by the surface state of the mold 3 and the photocurable composition, but the factor is not clear.
  • There has never been an imprint method that stipulates the magnitude of such an adhesive force and there is a finding that the release process can be made extremely good by setting the adhesive force per unit area to 15 mN / mm 2 or less. Obtained for the first time by the present inventors. And, it is possible to make the mold release process easy by a simple method of measuring the adhesive force of the test specimen that has been exposed and cured by using the photocurable composition for imprint to be used with the following predetermined apparatus. it can.
  • the apparatus for measuring the adhesive force is “a photomechanical resin peeling property mechanical evaluation apparatus” (manufactured by Shimadzu Corporation). As shown in FIG. 2, which is a diagram showing a schematic configuration, this apparatus has a stage 11 on which a substrate 21 is mounted and is rotatable, and is provided directly on the substrate 21 on the rotated stage 11 and has the same surface as the mold 3. A holder 14 having a holder 13 that can hold and lift the member (lens) 12 having light and a light irradiation means for exposing the surface of the substrate 21 through the member 12.
  • This light irradiating means is provided at a vertical direction of 45 ° that irradiates the surface of the substrate 21 placed on the stage 11 by reflecting the light emitted from the light source 15 and the light emitted from the light source 15 and transmitting the member 12. It consists of a mirror 16.
  • a load cell (not shown) is connected to the member 12 so that the force applied when the member 12 is moved in the vertical direction can be measured.
  • the member 12 having the same surface as the mold 3 is a lens having the same shape as that of the mold 3 in the case where a member that is not subjected to the release treatment is used as the mold 3. Is used, the surface of a member having the above shape and made of the same material as that of the mold 3 is subjected to the same release treatment as that of the mold 3.
  • FIG. 3 is a diagram showing an outline of a method for measuring the adhesion force
  • an imprint photocurable composition is prepared, and a predetermined amount of imprint is applied on the substrate 21 placed on the stage 11.
  • the photocurable composition 22 is dropped using, for example, a micropipette (FIGS. 3A and 3B).
  • the stage 11 is rotated so that the dripped photocurable composition 22 for imprint is positioned on the lower side in the vertical direction of the member 12 held by the holder 13 (FIG. 3C).
  • the holder 13 is lowered so that the distance between the member 12 and the substrate 21 becomes a predetermined value, and the member 12 is brought into contact with the photocurable composition 22 for imprinting (FIG. 3D).
  • the holder 13 is further lowered so that the member 12 and the holder 13 do not come into contact with each other (FIG. 3E).
  • light is irradiated from the light source 15 to cure the photocurable composition 22 for imprinting, thereby forming a test body 23 (FIG. 3F).
  • the holder 13 is raised at a predetermined speed (FIG. 3G), and the specimen 23 is peeled from the member 12 (FIG. 3H).
  • the value obtained by dividing the force (adhesion force) F measured by the load cell when the member 12 is peeled from the test body 23 by the contact area between the test body 23 and the member 12 is the adhesion force per unit area.
  • An example of the measurement result of the adhesive force is shown in FIG.
  • the test body 23 peels from the board
  • the test body 23 cannot be peeled from the member 12, and adhesive force cannot be measured. Therefore, the regulation that the adhesive force per unit area is 15 mN / mm 2 or less also stipulates that the test body 23 is not peeled from the substrate 1.
  • the method for forming the photocurable composition layer 2 on the substrate 1 or the mold 3 using the photocurable composition for imprints is not particularly limited.
  • application or dropping of the photocurable composition specifically, examples of the coating include spin coating, roll coating, dip coating, gravure coating, die coating, curtain coating, inkjet coating, and dispenser coating.
  • the photocurable composition layer 2 is sandwiched between the substrate 1 and the mold 3 and molded (molding process).
  • the substrate 1 may be pressed against the mold 3, the mold 3 may be pressed against the substrate 1, or both the substrate 1 and the mold 3 may be pressed.
  • the force for pressing the substrate 1 and the mold 3 can be set to about 0.01 to 100 MPa, for example.
  • the pressing force is preferably as small as possible within the range of pressing.
  • pressing by the weight of the mold 3 or the substrate 1 may be performed without applying force. In this way, by pressing the mold 3 against the substrate 1, the uneven pattern of the mold 3 is filled with the photocurable composition layer 2 to be molded.
  • the photocurable composition layer 2 and the mold 3 both horizontal and contact the photocurable composition layer 2 and the mold 3, but if the obtained pattern does not interfere with the pattern, keep it horizontal. It is not necessary to limit to.
  • a conventional optical imprint apparatus can be used.
  • the photocurable composition layer 2 is exposed and cured in a state in which the uneven pattern of the mold 3 is filled with the photocurable composition layer 2 and formed into a photocured product. 4 (photocuring step).
  • the light source used for exposure should just be what can irradiate the light of the wavelength which the photocurable composition layer 2 hardens
  • Examples of light sources include low pressure mercury lamps, high pressure mercury lamps, ultra high pressure mercury lamps, metal halide lamps, xenon lamps, carbon arcs, mercury xenon lamps, excimer lasers such as XeCl, KrF and ArF, ultraviolet or visible light lasers, and ultraviolet light. Or visible light LED etc. are mentioned.
  • the irradiation amount of light may be an amount that can cure the photocurable composition layer 2.
  • light is irradiated to the photocurable composition layer 2 from the side of the member which is substantially transparent with respect to the light irradiated among the substrate 1 and the mold 3.
  • transferred can be obtained by releasing the mold 3 from the photocured material 4 (mold release process).
  • the adhesive force per unit area is 15 mN / mm 2 or less, this mold release step can be performed satisfactorily, and the mold 3 and the photocured product 4 are not cured but photocured.
  • the article 4 does not peel off from the substrate 1, and the photocured product 4 does not peel off from the substrate 1, but part of the photocured product does not adhere to the mold.
  • the photocured product 4 having a concavo-convex pattern obtained by accurately transferring the concavo-convex pattern of the mold 3 can be formed.
  • Examples 1 to 11 and Comparative Examples 1 and 2 are photo-curing type photocurable compositions for imprints. As shown in Table 2, Examples 12 to 21 and Comparative Examples are used. Reference numerals 3 to 6 are radical curable photocurable compositions for imprinting.
  • the quartz lens was washed for 15 minutes using an ultraviolet (UV) / ozone cleaner (manufactured by Sen Special Light Source Co., Ltd., PL16-110). Then, it was immersed in a perfluoroether type release agent (Optool HD-1100Z, manufactured by Daikin Industries) for 1 minute. After that, it was pulled up and left at 60 ° C. for 1 hour, washed with a solvent (manufactured by Daikin Industries, OPTOOL HD-ZV), dried by blowing nitrogen gas, and subjected to a release treatment with a release agent. A lens was produced and used as member 12.
  • UV ultraviolet
  • OPTOOL HD-ZV perfluoroether type release agent
  • the photocurable composition for imprinting is exposed and cured using a “photocurable resin peeling property mechanics evaluation apparatus” (manufactured by Shimadzu Corporation) in which the member 12 produced above is placed on the holder 13.
  • the adhesion force per unit area of the test body 23 was measured.
  • the adhesion force measurement was performed 10 times, and the average value of the adhesion force per unit area obtained from the 6th time to the 10th time was obtained by exposing the photocurable composition for imprinting to be cured per unit area. Adhesive strength was assumed.
  • the photocurable composition for imprints is dropped on a 6-inch silicon wafer with a micropipette, the stage 11 is rotated, and the photocurable composition for imprints is the member 12. It was arranged just below. Next, the lowermost surface of the holder 13 was adjusted to a height of 0.500 mm from the surface of the silicon wafer and held for 30 seconds. Then, the adhesive force measurement was started and the holder 13 started to descend.
  • ultraviolet light having a wavelength of 350 nm or more emitted from an ultraviolet light source (mercury xenon lamp, manufactured by Mitsunaga Electric Manufacturing Co., Ltd., Supercure 203S) is irradiated with light.
  • the test body 23 was produced by irradiating with an amount of 0.65 J / cm 2 (ultraviolet intensity 65 mW / cm 2 at a measurement wavelength of 364 nm, irradiation time 10 seconds) to cure the photocurable composition for imprinting.
  • the holder 13 starts to rise at a speed of 0.60 mm / second, the force applied to the load cell is measured at intervals of 10 milliseconds, and the maximum force (adhesion force) when the member 12 peels from the test body 23. F was measured.
  • These operations are repeated 10 times, and the diameters of the contact surfaces between the test body 23 and the member 12 are measured in the 6th to 10th measurements, the average value is obtained, and the contact surface between the member 12 and the test body 23 is measured. Diameter (mm).
  • the contact area (mm 2 ) between the member 12 and the test body 23 was calculated from the diameter of the contact surface between the member 12 and the test body 23.
  • a photocured product 4 was produced by a photoimprinting method using an imprinting apparatus (NM-O801, manufactured by Myeongchang Kiko Co., Ltd.). Specifically, the photocurable composition for imprinting was spin-coated on a 6-inch silicon wafer similar to that used in the measurement of the adhesive force to form the photocurable composition layer 2. . Next, a 10 mm square quartz mold in which line and space, hole, and pillar patterns having a depth range of 350 nm and 350 nm to 10 ⁇ m (micrometer) are formed in the same manner as the quartz lens described above is formed. NTT-AT Co., Ltd.
  • NIM-PH350 NIM-PH350
  • a mold area of 100 mm 2 is subjected to a force of 100 N (pressing force 1 MPa), and an ultraviolet light source (mercury xenon lamp, UV curing at a wavelength of 350 nm or more emitted from Super Naga 203 (manufactured by Mitsunaga Electric Mfg. Co., Ltd.) with a light irradiation amount of 0.2 J / cm 2 (intensity of 10 mW / cm 2 at a measurement wavelength of 365 nm, irradiation time of 20 seconds) and photocuring.
  • the composition layer 2 was cured.
  • the photocured material 4 was produced by releasing the mold 3.
  • the operation of producing the photocured product 4 by this photoimprinting was performed 1000 times, and the photocured product 4 did not adhere to the mold 3 and the photocured product 4 was not peeled off from the silicon wafer in 1000 times. If the photocured product 4 adheres to the mold 3 once or more, or the photocured product 4 is peeled off from the silicon wafer, it is judged as “x”, and the mold release process is performed. evaluated. The results are shown in Tables 1 and 2.
  • the adhesion force per unit area is 15 mN / mm 2 or less, the stress applied to the mold 3 is substantially reduced in the mold release process, and therefore, the mold 3 is less likely to be broken and transferred by normal optical imprinting. Even if it is the mold 3 which has any uneven

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Polymerisation Methods In General (AREA)
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Abstract

L'invention concerne un procédé qui comporte une étape de moulage par prise en sandwich d'une composition photodurcissable, formée par une composition photodurcissable pour impression, entre un substrat et un moule dans lequel un motif concavo-convexe est formé, une étape de photodurcissage consistant à exposer la couche de composition photodurcissable pour fabriquer un produit photodurci, et une étape de démoulage consistant à démouler le produit photodurci du moule, la force d'adhérence par unité de surface, par rapport à un élément ayant la même surface extérieure que le moule, d'un échantillon obtenu par exposition et durcissement de la composition photodurcissable pour impression étant de pas plus 15 mN/mm2.
PCT/JP2012/055369 2011-03-10 2012-03-02 Procédé de fabrication d'un produit photodurci WO2012121143A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011053601A JP2014103135A (ja) 2011-03-10 2011-03-10 光硬化物の製造方法
JP2011-053601 2011-03-10

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WO2012121143A1 true WO2012121143A1 (fr) 2012-09-13

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023086606A1 (fr) * 2021-11-14 2023-05-19 Clark Daniel S Système et procédé de moulage, d'impression et de coulage au-dessous de zéro

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015115128A1 (fr) * 2014-01-29 2015-08-06 株式会社ダイセル Composition photodurcissable pour la nano-impression et procédé de formation de motif ultrafin faisant appel à la composition

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007523249A (ja) * 2004-02-23 2007-08-16 モレキュラー・インプリンツ・インコーポレーテッド インプリントリソグラフィ用の材料
JP2008246876A (ja) * 2007-03-30 2008-10-16 Tokyo Ohka Kogyo Co Ltd ナノインプリント用の膜形成組成物、並びに構造体の製造方法及び構造体
JP2008246729A (ja) * 2007-03-29 2008-10-16 Sumitomo Heavy Ind Ltd 成形装置及びそれによる成形方法
JP2008296441A (ja) * 2007-05-31 2008-12-11 Asahi Kasei Electronics Co Ltd インプリント用感光性樹脂積層体
JP2009191172A (ja) * 2008-02-14 2009-08-27 Daicel Chem Ind Ltd ナノインプリント用硬化性樹脂組成物
JP2010076333A (ja) * 2008-09-26 2010-04-08 Asahi Kasei E-Materials Corp 成形体、並びに成形体の製造方法、及び成形体を転写した転写体の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007523249A (ja) * 2004-02-23 2007-08-16 モレキュラー・インプリンツ・インコーポレーテッド インプリントリソグラフィ用の材料
JP2008246729A (ja) * 2007-03-29 2008-10-16 Sumitomo Heavy Ind Ltd 成形装置及びそれによる成形方法
JP2008246876A (ja) * 2007-03-30 2008-10-16 Tokyo Ohka Kogyo Co Ltd ナノインプリント用の膜形成組成物、並びに構造体の製造方法及び構造体
JP2008296441A (ja) * 2007-05-31 2008-12-11 Asahi Kasei Electronics Co Ltd インプリント用感光性樹脂積層体
JP2009191172A (ja) * 2008-02-14 2009-08-27 Daicel Chem Ind Ltd ナノインプリント用硬化性樹脂組成物
JP2010076333A (ja) * 2008-09-26 2010-04-08 Asahi Kasei E-Materials Corp 成形体、並びに成形体の製造方法、及び成形体を転写した転写体の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023086606A1 (fr) * 2021-11-14 2023-05-19 Clark Daniel S Système et procédé de moulage, d'impression et de coulage au-dessous de zéro

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