WO2013154077A1 - Article présentant un motif fin sur sa surface, procédé de fabrication associé, article optique, procédé de fabrication associé et procédé pour la fabrication d'un moule de reproduction - Google Patents

Article présentant un motif fin sur sa surface, procédé de fabrication associé, article optique, procédé de fabrication associé et procédé pour la fabrication d'un moule de reproduction Download PDF

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Publication number
WO2013154077A1
WO2013154077A1 PCT/JP2013/060655 JP2013060655W WO2013154077A1 WO 2013154077 A1 WO2013154077 A1 WO 2013154077A1 JP 2013060655 W JP2013060655 W JP 2013060655W WO 2013154077 A1 WO2013154077 A1 WO 2013154077A1
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WIPO (PCT)
Prior art keywords
fine pattern
transfer material
mold
region
material film
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PCT/JP2013/060655
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English (en)
Japanese (ja)
Inventor
公介 高山
寛 坂本
海田　由里子
健太郎 石橋
水野　潤
庄子　習一
Original Assignee
旭硝子株式会社
学校法人早稲田大学
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Application filed by 旭硝子株式会社, 学校法人早稲田大学 filed Critical 旭硝子株式会社
Publication of WO2013154077A1 publication Critical patent/WO2013154077A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3058—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state comprising electrically conductive elements, e.g. wire grids, conductive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Definitions

  • the present invention relates to an article having a fine pattern on its surface and a method for producing the same, and an optical article, a method for producing the same, and a method for producing a replica mold.
  • a nanoimprint lithography method As a method for producing an optical article having a fine pattern on its surface (for example, a wire grid polarizing element having a line-and-space fine pattern, an antireflection member having a moth-eye structure, etc.), a nanoimprint lithography method has attracted attention.
  • a method for producing the optical article by the nanoimprint lithography method for example, the following method is known. Apply the coating composition on the surface of the substrate, irradiate the light in a state where the photocurable resin composition is sandwiched between the mold and the substrate having a reverse pattern of the target fine pattern on the surface, A method of forming a cured resin layer having a desired fine pattern on the surface of a substrate after separating the mold after curing the photocurable resin composition.
  • a mold used in the nanoimprint lithography method is usually produced by forming a fine reversal pattern on the surface of a silicon or quartz substrate by an electron beam drawing method.
  • the mold since the mold has the following problems, it is difficult to increase the area of the mold. -It takes a long time to form a fine reversal pattern on the surface of a quartz substrate by an electron beam drawing method. Since the apparatus used for the electron beam drawing method has a high running cost per unit time, the mold becomes considerably expensive when the area of the mold is increased.
  • a nanoimprint mold is also produced using a stepper exposure method or a multi-beam interference exposure method.
  • a stepper exposure method or a multi-beam interference exposure method it is possible to produce a mold having a large area at a lower cost than in the electron beam drawing method, but there is a drawback that it is difficult to produce a fine pattern sufficiently smaller than the wavelength of light.
  • methods for producing regular patterns of large areas by methods such as alumina anodization and self-organization methods have also been proposed, but these methods are very easy to produce (shape, size, arrangement, etc.). There is a problem that it is limited and lacks versatility.
  • a relatively large area is used by using a relatively small area master mold as in the following method.
  • a method for producing a replica mold is conceivable.
  • a reversal pattern of a relatively small area master mold is repeatedly transferred in parallel to a transfer material film (resist film) on the surface of a relatively large area substrate to form a continuous mask pattern, and the surface of the substrate A method of forming a continuous fine pattern.
  • the method (i) since the method (i) has the following problems, it is actually difficult to produce a replica mold having a relatively large area.
  • excess transfer material is pushed out to the periphery of the master mold, so that the periphery of the area where the reverse pattern of the master mold is transferred rises. Therefore, the master mold cannot be pressed against the transfer material film in the area adjacent to the area during the next transfer.
  • ⁇ When transferring, it is necessary to cure the transfer material film by irradiating light with the master mold pressed against the transfer material film, but light leaks around the area where the reverse pattern of the master mold is transferred. As a result, the transfer material film is cured.
  • the master mold cannot be pressed against the transfer material film in the area adjacent to the area during the next transfer. -When the master mold is pressed against the transfer material film, excess transfer material is pushed out to the periphery of the master mold, so it is pushed out to the area where the mask pattern is already formed adjacent to the area where the transfer is performed. The transfer material will flow and become contaminated.
  • Patent Document 1 As a method for solving this problem, the following method has been proposed (Patent Document 1). (Ii) a step of forming a transfer material film on the surface of the substrate, a step of repeatedly transferring the reverse pattern of the master mold to the transfer material film, a step of etching using the transfer material film as an etching mask, and removing the remaining transfer material film
  • the first step is to form a fine pattern having the same area as the reverse pattern of the master mold in the first cycle, and a fine pattern having the same area as the reverse pattern of the master mold in the second cycle.
  • a method of repeating the cycle twice so that the formed second regions are adjacent and alternately arranged see FIGS. 3 and 4 of Patent Document 1).
  • the plurality of first regions in which the fine pattern is formed in the first cycle can be separated from the second region in which the fine pattern is formed in the second cycle. it can.
  • the plurality of second regions in which the fine pattern is formed in the second cycle can be separated by the amount of the first region in which the fine pattern is formed in the first cycle. Accordingly, each problem in the method (i) is solved in each cycle of the method (ii).
  • the method (ii) has the following problems.
  • a part of the transfer material applied on the first region of the surface of the substrate flows into the concave portion of the fine pattern formed in the first region.
  • the thickness of the transfer material film existing thereon is reduced (see FIGS. 4 and 5 of Patent Document 1). Therefore, depending on the target etching depth, during the etching in the second cycle, the transfer material film existing on the first region is completely etched, and the fine pattern in the first region is further etched. Thus, a fine pattern having a desired shape may not be obtained. For this reason, the fine pattern of the first region becomes a defect, or the fine pattern varies between the first region and the second region.
  • the present invention includes a step of forming a transfer material film on the surface of a substrate, a step of transferring a mold reversal pattern to the transfer material film, a step of etching using the transfer material film as an etching mask, and removing the remaining transfer material film.
  • the fine pattern formed in the first cycle is etched in the second cycle. Provide a method that never happens.
  • the method for producing an article having a fine pattern on the surface of the present invention forms a fine pattern in each of the first region on the surface of the substrate and the second region at a position different from the first region.
  • a method for producing an article having a fine pattern on its surface (A) applying a coating composition containing a transfer material to the surface of the substrate to form a first transfer material film; (B) In the first region, the reversal pattern of the mold having the reversal pattern of the fine pattern on the surface is transferred to the first transfer material film, and the fine pattern is transferred to the first transfer material film.
  • r is the etching rate of the second transfer material film
  • H is the target etching depth in the second region
  • R is the etching rate of the substrate
  • t It is the thickness of the remaining film between the concave portion of the mask pattern and the base material in the second region.
  • the first region and the second region are preferably adjacent to each other.
  • the base material preferably includes a plurality of the first regions and a plurality of the second regions, and the first regions and the second regions are alternately arranged.
  • the coating composition and its coating amount in the step (a) are the same as the coating composition and its coating amount in the step (e), and the mold and the coating in the step (b)
  • the formation conditions of the mask pattern are the same as the formation conditions of the mold and the mask pattern in the step (f), and the etching conditions in the step (c) are the same as the etching conditions in the step (g). Preferably there is.
  • the article having the fine pattern of the present invention on the surface is produced by the method for producing an article having the fine pattern of the present invention on the surface.
  • the optical article manufacturing method of the present invention is a method of manufacturing an optical article having a fine pattern on its surface, the article having the fine pattern of the present invention on its surface, and a reverse pattern of the fine pattern of the optical article on its surface. It is used as a mold having, and the reverse pattern of the mold is transferred to the surface of a transparent substrate.
  • the manufacturing method of the optical article of this invention has the following process. (X) The process of apply
  • (Y) An article having the fine pattern on the surface is used as a mold having a reverse pattern of the fine pattern of the optical article on the surface, and the photocurable resin layer is sandwiched between the mold and the transparent substrate. The process of irradiating light in a state and curing the photocurable resin layer to form a cured resin layer.
  • the optical article of the present invention is manufactured by the method for manufacturing an optical article of the present invention (for example, a wire grid polarizing element, an antireflection member, etc.).
  • the method for producing a replica mold of the present invention is to manufacture a replica mold using the article having the fine pattern of the present invention on the surface as a master mold, or to further manufacture a replica mold using the replica mold as a master mold. It is characterized by.
  • the step of forming a transfer material film on the surface of the substrate, the step of transferring the reverse pattern of the mold to the transfer material film, and using the transfer material film as an etching mask In the method of manufacturing an article having a fine pattern on the surface by repeating the cycle twice, the step of performing etching and the step of removing the remaining transfer material film being performed twice, during the etching in the second cycle, The fine pattern formed in the first cycle is not etched.
  • the article having the fine pattern of the present invention on the surface has a relatively large fine pattern and few defects in the fine pattern and variations in shape.
  • an optical article can be produced in which the fine pattern has a relatively large area and the fine pattern has few defects and variations in shape.
  • the fine pattern has a relatively large area, and there are few defects in the fine pattern and variations in shape.
  • a replication mold can be manufactured in which a fine pattern has a relatively large area and there are few defects in the fine pattern and variations in shape.
  • FIG. 2 is a II-II sectional view of an article having the fine pattern of FIG. 1 on its surface.
  • FIG. 3 is a cross-sectional view for explaining steps (a) to (d) in the method for producing an article having a fine pattern on the surface according to the present invention.
  • FIG. 5 is a cross-sectional view for explaining steps (e) to (h) in the method for producing an article having a fine pattern on the surface thereof according to the present invention. It is sectional drawing of the base material which has the 2nd transcription
  • FIG. 5 is a cross-sectional view for explaining steps (x) to (z) in the method for producing an optical article of the present invention.
  • a fine pattern or inverted pattern refers to a shape composed of one or more protrusions and / or recesses having a minimum dimension of 1 nm to 100 ⁇ m among width, length and height (ie, depth).
  • the region refers to a region where a fine pattern obtained by inverting the reversal pattern for one mold is formed, that is, a region having substantially the same area as the reversal pattern of the mold.
  • the transfer material film is a film made of a transfer material (for example, a photocurable resin, a thermosetting resin, a thermoplastic resin, or the like), a film in which the transfer material in the film is chemically changed, or an original transfer material film.
  • the transfer material refers to a film that has changed physically (for example, its shape has changed). Therefore, when the transfer material is a curable resin, the transfer material film before and after transferring the fine pattern of the mold changes to a chemically different state due to curing, and before or after transferring the fine pattern of the mold or etched. Although the shape of the transfer material film before and after the change has changed, these are all called transfer material films. In addition, when the transfer material is a thermoplastic resin, the shape of the transfer material film before and after the transfer of the fine pattern of the mold or before and after the etching is changed, all of which are referred to as a transfer material film.
  • the (meth) acryloyloxy group refers to an acryloyloxy group or a methacryloyloxy group.
  • (Meth) acrylate refers to acrylate or methacrylate.
  • the fine pattern is formed in each of the first region on the surface of the substrate and the second region at a position different from the first region. It has been done.
  • FIG. 1 is a top view showing an example of an article having a fine pattern on its surface
  • FIG. 2 is a cross-sectional view taken along the line II-II in FIG.
  • the article 10 has a fine pattern 20 composed of a plurality of convex portions 22 and concave portions 24 between the convex portions 22 on the surface of the substrate 12.
  • a rectangular first region (I) in which a fine pattern 20 is formed in a first cycle described later and a rectangular second region in which a fine pattern 20 is formed in a second cycle described later. (II) are adjacent to each other and alternately arranged in the X direction and the Y direction.
  • base material examples include silicon (for example, single crystal silicon, polysilicon, amorphous silicon, etc.), quartz, glass, silicon nitride, aluminum nitride, silicon carbide, sapphire, lithium niobate, lithium tantalate, metal (for example, Aluminum, nickel, copper, etc.), metal oxides (eg, alumina, zinc oxide, magnesium oxide, etc.), and oxide and / or metal layers (eg, chromium, aluminum, nickel, molybdenum) on the surface of these substrates , Tantalum, tungsten, ITO, tin oxide, gold, silver, copper, platinum, titanium, etc.), and various resins.
  • silicon, quartz or glass is preferable when an article having a fine pattern to be obtained is used as a mold.
  • the base material may be surface-treated from the viewpoint of further improving the adhesion with a transfer material film described later.
  • Surface treatment includes primer coating treatment, ozone treatment, UV cleaning treatment, plasma treatment, corona treatment, flame treatment, itro treatment (a kind of treatment of Combustion Chemical Vapor Deposition developed by ITRO), SPM (Sulfuric Acid Hydrogen Peroxide) Mixture) and the like.
  • primer include silane coupling agents, alkoxysilanes, and silazanes.
  • a fine pattern is formed on the surface of the substrate.
  • the fine pattern is a pattern formed by transferring a reverse pattern on the surface of the mold to be described later.
  • the fine pattern is composed of a plurality of convex portions and concave portions between the convex portions.
  • Examples of the shape of the ridge include a straight line, a curved line, a bent shape, and the like as shown in the illustrated example. As shown in the illustrated example, a plurality of ridges may exist in parallel to form stripes. Examples of the cross-sectional shape of the ridge in the direction perpendicular to the longitudinal direction include a rectangle, a trapezoid, a triangle, and a semicircle as shown in the illustrated example. Examples of the shape of the protrusion include a triangular prism, a quadrangular prism, a hexagonal prism, a cylinder, a triangular pyramid, a quadrangular pyramid, a hexagonal pyramid, a cone, a hemisphere, and a polyhedron.
  • the width of the ridge is preferably 1 nm to 100 ⁇ m, more preferably 1 nm to 10 ⁇ m, and particularly preferably 10 nm to 500 nm.
  • the width of the ridge means the full width at half maximum in the cross section in the direction orthogonal to the longitudinal direction.
  • the width of the protrusion is preferably 1 nm to 100 ⁇ m, more preferably 1 nm to 10 ⁇ m, and particularly preferably 10 nm to 500 nm.
  • the width of the protrusion means the full width at half maximum in the cross section perpendicular to the longitudinal direction when the bottom surface is elongated, and when the bottom surface of the protrusion is not elongated, it passes through the center of gravity in the horizontal section at a position half the height of the protrusion. Means the minimum length of a line.
  • the height of the convex portion is preferably 1 nm to 100 ⁇ m, more preferably 1 nm to 10 ⁇ m, and even more preferably 10 nm to 500 nm.
  • the interval between adjacent convex portions is preferably 1 nm to 100 ⁇ m, more preferably 1 nm to 10 ⁇ m, and even more preferably 10 nm to 500 nm.
  • the interval between the adjacent convex portions means the distance from the starting end of the base of the cross section of the convex portion to the starting end of the base of the cross section of the adjacent convex portion.
  • Each dimension is an average of dimensions measured at three locations.
  • the minimum dimension of the convex portion is preferably 1 nm to 100 ⁇ m, more preferably 1 nm to 10 ⁇ m, and particularly preferably 10 nm to 500 nm.
  • the minimum dimension means the minimum dimension among the width, length, and height of the convex portion.
  • the minimum dimension of the recess is preferably 1 nm to 100 ⁇ m, more preferably 1 nm to 10 ⁇ m, and particularly preferably 10 nm to 500 nm.
  • the minimum dimension means the minimum dimension among the width, length and depth of the recess.
  • the first region is a region where a fine pattern is formed by steps (a) to (d) described later.
  • step (b) which will be described later, a reversal pattern for one mold is transferred to form a mask pattern.
  • step (c) a region in which a fine pattern corresponding to the mask pattern is formed by etching is designated as one region. Count as the first region. Therefore, in the step (b), when the reversal pattern of the mold is repeatedly transferred to the first transfer material film, the same number of first regions as the number of repetitions exists on the surface of the substrate.
  • the second region is a region where a fine pattern is formed by steps (e) to (h) described later.
  • step (f) described later a reversal pattern for one mold is transferred to form a mask pattern, and in step (g), a region where a fine pattern corresponding to the mask pattern is formed by etching Count as the second region. Therefore, in the step (f), when the reversal pattern of the mold is repeatedly transferred to the second transfer material film, the same number of second regions as the number of repetitions exists on the surface of the substrate.
  • the first region and the second region may be adjacent to each other or may be separated from each other.
  • the first region and the second region are preferably adjacent to each other from the point that the fine pattern can be enlarged and the area utilization efficiency can be increased.
  • the fine pattern of the first region and the fine pattern of the second region are continuous. That is, in the case of ridges and grooves, these extend without a break in the longitudinal direction and without shifting in the width direction, and in the case of protrusions or holes, it is preferable that these exist periodically and repeatedly.
  • the base material may have one each of the first region and the second region, and may have either one or a plurality of both.
  • the base material preferably has a plurality of first regions and a plurality of second regions from the viewpoint of efficiently increasing the area of the fine pattern.
  • the first region and the second region are not caused by the problem in the conventional method (i) described above. It is preferable that the lengths of the first region and the second region that are alternately arranged are as short as possible.
  • Articles having fine patterns on the surface obtained by the production method of the present invention can be used as molds, optical articles (for example, optical elements, antireflection members, etc.), biochips, microreactor chips, catalyst carriers, and the like. .
  • Articles having a fine pattern on the surface obtained by the production method of the present invention can be used as a mold for producing optical articles, semiconductor devices, recording media, etc. by the nanoimprint lithography method, and require a large-area mold. Suitable for the production of optical articles.
  • the method for producing an article having a fine pattern on the surface of the present invention comprises a first cycle comprising the following steps (a) to (d) and a second cycle comprising the following steps (e) to (h): It is the method which has.
  • etching is performed using the second transfer material film 16 on which the mask pattern 28 is formed as an etching mask, and the fine pattern 20 is formed in the second region (II) on the surface of the substrate 12.
  • Forming step. (H) A step of removing the second transfer material film 16 remaining on the surface of the substrate 12 as shown in FIG.
  • the transfer device is preferably a device provided with an XY movable stage for mechanically adjusting the transfer position.
  • the first transfer material film 14 is formed by applying a liquid coating composition containing a transfer material to the surface of the substrate 12 and drying it when the coating composition contains a solvent.
  • a coating method of the coating composition spin coating method, die coating method, dip coating method, ink jet method, potting method, roll coating method, casting method, bar coating method, spray coating method, blade coating method, gravure coating method Etc.
  • a spin coating method, a die coating method, a spray coating method or an ink jet method is preferable.
  • the drying temperature is preferably 60 ° C. or higher, and more preferably 80 ° C. or higher. If drying temperature is 60 degreeC or more, there exists an advantage which can remove a solvent in a short time.
  • the upper limit of the drying temperature is preferably 200 ° C. from the viewpoint of suppressing thermal decomposition of the coating composition.
  • the drying time is preferably 30 seconds to 5 minutes.
  • the thickness of the first transfer material film (here, when the coating composition contains a solvent, the thickness after drying), that is, the coating amount of the coating composition is the target etching depth. What is necessary is just to set suitably according to (that is, the depth of the recessed part of a fine pattern), the etching rate of a transfer material film, and the etching rate of a base material.
  • the substrate examples include those described above.
  • silicon, quartz or glass is preferable.
  • the transfer material is a photocurable resin
  • at least one of the base material and the mold is a material that transmits 40% or more of light having a wavelength at which the photopolymerization initiator of the coating composition acts.
  • the transfer material examples include a photocurable resin, a thermosetting resin, and a thermoplastic resin. From the viewpoint that the step (b) can be carried out efficiently, the transfer material is preferably a photocurable resin. In the following description, only the case where the transfer material is a photocurable resin is described, and the case where the transfer material is a thermosetting resin or a thermoplastic resin is omitted.
  • the coating composition contains a photocurable resin, and optionally contains a fluorine-containing surfactant, a photopolymerization initiator, a solvent, and other additives.
  • a compound having a (meth) acryloyloxy group is preferable from the viewpoint that the curing speed is high and the transparency of the cured product is high.
  • a compound having a (meth) acryloyloxy group hereinafter also referred to as a (meth) acrylate compound
  • a compound having 1 to 15 (meth) acryloyloxy groups per molecule is preferable.
  • the (meth) acrylate compound may be a relatively low molecular compound (hereinafter referred to as an acrylate monomer), and a relatively high molecular weight compound (hereinafter referred to as (meth) acrylate) having two or more repeating units. May be referred to as a system oligomer).
  • Examples of the (meth) acrylate compound include one or more (meth) acrylate monomers, one or more (meth) acrylate oligomers, one or more (meth) acrylate monomers (meth) And) one or more of acrylate oligomers.
  • the (meth) acrylate-based oligomer has a molecular structure (meta) having a molecular chain having two or more repeating units (for example, a polyurethane chain, a polyester chain, a polyether chain, a polycarbonate chain, etc.) and a (meth) acryloyloxy group. ) Acrylate oligomers, urethane bond and two or more (meth) acryloyl from the viewpoint of easy adjustment of the flexibility and surface hardness of the cured film and excellent adhesion to the substrate.
  • metal molecular structure having a molecular chain having two or more repeating units (for example, a polyurethane chain, a polyester chain, a polyether chain, a polycarbonate chain, etc.) and a (meth) acryloyloxy group.
  • a urethane (meth) acrylate oligomer having an oxy group is more preferable, and a urethane (meth) acrylate oligomer having a urethane bond and 6 to 15 (meth) acryloyloxy groups is more preferable.
  • the ratio of the solvent in the coating composition is preferably designed so as to obtain a target film thickness after drying, depending on the coating means used. Diluting with a solvent reduces the viscosity of the coating composition and makes it easier to apply a thin film, and evaporates the solvent after application to reduce the film thickness, which makes it easier to obtain a thin film. .
  • the coating composition preferably contains a fluorine-containing surfactant from the viewpoint of flatness of the transfer material film and releasability between the transfer material film and the mold.
  • a fluorine-containing surfactant a fluorine-containing surfactant having a fluorine content of 10 to 70% by mass is preferable, and a fluorine-containing surfactant having a fluorine content of 10 to 40% by mass is more preferable.
  • the fluorine-containing surfactant may be water-soluble or fat-soluble.
  • an anionic fluorine-containing surfactant an anionic fluorine-containing surfactant, a cationic fluorine-containing surfactant, an amphoteric fluorine-containing surfactant, or a nonionic fluorine-containing surfactant is preferable, and the compatibility in the coating composition From the viewpoint of dispersibility in the transfer material film, a nonionic fluorine-containing surfactant is more preferable.
  • the proportion of the fluorine-containing surfactant in the coating composition is preferably 0.05 to 5% by mass, based on 100% by mass of the component remaining as the cured resin in the coating composition, 1 to 5% by mass is more preferable.
  • the ratio of the fluorine-containing surfactant is 0.05% by mass or more, the flatness of the transfer material film and the releasability between the transfer material film and the mold are good. If the ratio of a fluorine-containing surfactant is 5 mass% or less, it will be easy to maintain the state of uniform mixing stably with the other component of the coating composition, and the influence on the resin pattern shape after hardening will also be suppressed.
  • the composition for coating contains a photoinitiator from a photocurable point of view.
  • photopolymerization initiators acetophenone photopolymerization initiator, benzoin photopolymerization initiator, benzophenone photopolymerization initiator, thioxanthone photopolymerization initiator, ⁇ -aminoketone photopolymerization initiator, ⁇ -hydroxyketone photopolymerization initiator Polymerization initiator, ⁇ -acyl oxime ester, benzyl- (o-ethoxycarbonyl) - ⁇ -monooxime, acyl phosphine oxide, glyoxy ester, 3-ketocoumarin, 2-ethylanthraquinone, camphorquinone, tetramethylthiuram sulfide, azo Examples thereof include bisisobutyronitrile, benzoyl peroxide, dialkyl peroxide, tert-butyl peroxypivalate and the
  • acetophenone photopolymerization initiator benzoin photopolymerization initiator, ⁇ - Aminoketone photopolymerization initiator
  • benzophenone photopolymerization initiator is preferred.
  • the proportion of the photopolymerization initiator in the coating composition is preferably 0.01 to 5.0% by mass, based on 100% by mass of the component remaining as the cured resin in the coating composition. More preferably, the content is 1 to 3.0% by mass. If the ratio of the photopolymerization initiator is 0.01% by mass or more, curing can be carried out with a small amount of light, and therefore the time required for the process can be shortened. If the ratio of a photoinitiator is 5.0 mass% or less, it will be easy to mix uniformly with the other component of the coating composition, and the fall of the intensity
  • the coating composition contains a solvent.
  • the solvent include esters, ketones, alcohols, cyclic ethers and the like.
  • the coating composition contains other additives such as photosensitizers, polymerization inhibitors, resins, metal oxide fine particles, carbon compounds, metal fine particles, and other organic compounds as long as the effects of the present invention are not impaired. May be included.
  • the mold 30 having a rectangular surface (the surface on which the reversal pattern 26 is formed) in contact with the first transfer material film 14 is pressed against the first transfer material film 14, thereby In a state where the first transfer material film 14 is sandwiched between the material 12, only the first transfer material film 14 sandwiched between the mold 30 and the substrate 12 is selectively irradiated with light, The first transfer material film 14 is cured. After the first transfer material film 14 is cured, the mold 30 is separated from the first transfer material film 14. In this way, the reverse pattern 26 of the mold 30 is transferred to the first transfer material film 14, and the mask pattern 28 corresponding to the fine pattern 20 is formed on the first transfer material film 14 in the first region (I). Form.
  • the step (b) is repeated for the number of first regions (I). Further, when the step (b) is repeatedly performed, the first region (I) and the second region (II) are adjacent to each other and the X direction and the Y direction are transferred to the next step (b). It is preferable to move the mold 30 or the substrate 12 in the plane direction (X direction or Y direction) and in parallel by the second region (II) so as to be alternately arranged in each direction. After the mask pattern 28 is formed on the first transfer material film 14 in all the first regions (I), the entire surface of the first transfer material film 14 is irradiated with light, and the regions other than the first region (I) The first transfer material film 14 is cured.
  • the pressure applied from the mold to the transfer material film is preferably 0.05 MPa or more, more preferably 0.3 MPa or more, and particularly preferably 2 MPa or more.
  • the pressure applied to the transfer material film from the mold is preferably 50 MPa or less from the viewpoint of the durability of the substrate and the mold.
  • the sandwiching of the transfer material film between the mold and the base material may be performed under atmospheric pressure or under reduced pressure.
  • a large-scale apparatus for depressurization is not required, the time for the process is shortened, and volatilization of components contained in the transfer material film is suppressed.
  • reduced pressure there is an advantage that the entrapment of bubbles at the time of pinching is suppressed and the photocurable resin is easily filled in the grooves and holes.
  • Examples of the light applied to the transfer material film include ultraviolet rays, visible rays, infrared rays, electron beams, and radiation.
  • Examples of ultraviolet light sources include germicidal lamps, ultraviolet fluorescent lamps, carbon arcs, xenon lamps, high pressure mercury lamps for copying, medium or high pressure mercury lamps, ultrahigh pressure mercury lamps, electrodeless lamps, metal halide lamps, natural light, and the like. Irradiation with light may be performed under normal pressure or under reduced pressure. Moreover, you may carry out in air and you may carry out in inert gas atmospheres, such as nitrogen atmosphere and a carbon dioxide atmosphere.
  • the mold material examples include a non-light-transmitting material and a light-transmitting material.
  • the non-translucent material include silicon, metal (for example, nickel, copper, stainless steel, titanium, etc.), SiC, mica, and the like.
  • the light-transmitting material include quartz, glass, and various resins (for example, polydimethylsiloxane, cyclic polyolefin, polycarbonate, polyethylene terephthalate, and transparent fluororesin).
  • At least one of the mold and the base material is a material that transmits 40% or more of light having a wavelength at which the photopolymerization initiator acts.
  • Etching is performed using the first transfer material film 14 on which the mask pattern 28 is formed as an etching mask to form the fine pattern 20 in the first region (I) on the surface of the substrate 12.
  • the etching method include known methods, and an etching method using a halogen-based gas is preferable.
  • the first transfer material film 14 remaining on the surface of the substrate 12 is removed.
  • the removal method include wet treatment with a stripping solution, dry treatment with oxygen plasma, vacuum ultraviolet rays, and the like, and heat treatment at a temperature that promotes thermal decomposition of the transfer material.
  • Process (e) Formation of second transfer material film
  • a liquid coating composition containing a transfer material is applied to the surface of the substrate 12 on which the fine pattern 20 is formed in the first region (I), and is dried when the coating composition contains a solvent.
  • the second transfer material film 16 is formed.
  • the step (e) may be performed in the same manner as the step (a), and the description of the same contents as the step (a) is omitted.
  • the thickness of the second transfer material film (the thickness after drying when the coating composition contains a solvent), that is, the coating amount of the coating composition is the target etching depth in the second region ( In other words, the depth of the concave portion of the fine pattern), the etching rate of the transfer material film, and the etching rate of the substrate may be set as appropriate.
  • the step (f) is repeated for the number of the second regions (II).
  • the first region (I) and the second region (II) are adjacent to each other and the X direction and the Y direction are transferred to the next step (f). It is preferable to move the mold 30 or the substrate 12 in the plane direction (X direction or Y direction) and in parallel by the first region (I) so as to be alternately arranged in each direction.
  • the entire surface of the second transfer material film 16 is irradiated with light, and the regions other than the second region (II)
  • the second transfer material film 16 is cured.
  • the position of the mold or the substrate is corrected so that the fine pattern in the first region and the fine pattern in the second region are continuous. Preferably it is done. Correction of the position of the mold or the substrate can be performed by a known method such as a correction method described in Patent Document 1.
  • Step (g) Etching is performed using the second transfer material film 16 on which the mask pattern 28 is formed as an etching mask to form the fine pattern 20 in the second region (II) on the surface of the substrate 12.
  • the step (g) may be performed in the same manner as the step (c), and the description of the same contents as the step (c) is omitted.
  • FIG. 5 is a cross-sectional view of the base material 12 having the second transfer material film 16 on which the mask pattern 28 is formed on the surface just before the step (g).
  • the thickness d of the second transfer material film 16 existing on the first region (I) on the surface of the substrate 12 is expressed by the following formula (1). It is necessary to be satisfied. r ⁇ (H / R) + t ⁇ d (1).
  • d is the thickness of the second transfer material film 16 existing on the first region (I) on the surface of the substrate 12, that is, the depressed portion from the top of the fine pattern 20 in the first region (I). It is the distance in the thickness direction to the bottom of 18.
  • r is the etching rate of the second transfer material film 16. In the case where the second transfer material film 16 is etched in advance with a thickness smaller than the thickness t of the remaining film by etching using oxygen gas, when etching using halogen gas is performed, halogen gas is used.
  • Etching rate in etching using H is the target etching depth in the second region (II), that is, the depth of the concave portion 24 of the fine pattern 20.
  • R is the etching rate of the substrate 12.
  • t is the thickness of the remaining film between the concave portion of the mask pattern 28 and the substrate 12 in the second region (II).
  • Equation (1) is the time required to etch the substrate 12 by the target etching depth H. Therefore, “r ⁇ (H / R)” in Equation (1) is the thickness of the second transfer material film 16 that is etched while the substrate 12 is being etched by the target etching depth H. Therefore, the thickness d is equal to the thickness of the second transfer material film 16 to be etched while the remaining film is being etched (equal to the thickness t), and the substrate 12 is etched by the target etching depth H. If the thickness is larger than the sum of the thickness (r ⁇ (H / R)) of the second transfer material film 16 that is etched during the process, the surface of the substrate 12 is obtained even at the end of the step (g).
  • the second transfer material film 16 remains on the first region (I). Therefore, the fine pattern 20 in the first region (I) is not etched in the step (g), and the fine pattern 20 having a desired shape is obtained also in the first region (I). As a result, defects in the fine pattern 20 in the first region (I) and variations in the fine pattern 20 between the first region (I) and the second region (II) are reduced.
  • the thickness d In order for the thickness d to satisfy the formula (1), for example, the following adjustment is performed. ( ⁇ ) The target etching depth H in the second region (II) is decreased. ( ⁇ ) The thickness d of the second transfer material film 16 existing on the first region (I) on the surface of the substrate 12 is increased. ( ⁇ ) Increase the resist selectivity (R / r). ( ⁇ ) Decrease the thickness t of the remaining film. ( ⁇ ) A preliminary experiment is performed to examine the coating amount of the coating composition having a thickness d satisfying the formula (1).
  • the amount of the coating composition flowing into the concave portion 24 of the fine pattern 20 in the first region (I) is reduced, and the thickness d can be increased.
  • the depth of the concave portion 24 of the fine pattern 20 in the first region (I) is decreased.
  • the aperture ratio of the fine pattern 20 in the first region (I) (the width of the concave portion 24 / (the width of the convex portion 22 + the width of the concave portion 24)) is reduced.
  • the remaining film thickness t can be reduced and the left side of the above formula (1) can be reduced.
  • (1) Reduce the coating amount of the coating composition.
  • (2) The pressure applied from the mold 30 to the second transfer material film 16 is increased.
  • (3) The depth of the concave portion of the reversal pattern 26 of the mold 30 is increased.
  • (4) The aperture ratio of the reversal pattern 26 of the mold 30 is increased. Since the thickness d is also reduced in the method (1), it is preferable to adjust the thickness t of the remaining film by the methods (2) to (4).
  • the following methods (1) to (3) are particularly effective among ( ⁇ ) to ( ⁇ ).
  • the coating composition and its coating amount in the step (a) are the same as the coating composition and its coating amount in the step (e), and the mold and the coating in the step (b)
  • the formation conditions of the mask pattern are the same as the formation conditions of the mold and the mask pattern in the step (f), and the etching conditions in the step (c) are the same as the etching conditions in the step (g). Preferably there is.
  • Step (h) After the etching, the second transfer material film 16 remaining on the surface of the substrate 12 is removed. Step (h) may be performed in the same manner as step (d), and the description of the same contents as step (d) will be omitted.
  • the step of forming the transfer material film on the surface of the substrate, the step of transferring the reversal pattern of the mold to the transfer material film, the transfer material film In the method of performing the etching using the etching mask and the step of removing the remaining transfer material film as one cycle and repeating the cycle twice (that is, the method having the steps (a) to (h) described above), the second time Of the second pattern existing on the fine pattern formed in the first cycle (that is, on the first region of the surface of the substrate) immediately before the etching of the cycle (that is, step (g) described above).
  • the second pattern is formed on the fine pattern formed in the first cycle even at the end of the second cycle etching. Copy material film remains. Therefore, the fine pattern formed in the first cycle is not etched during the etching in the second cycle.
  • an article having a fine pattern on the surface obtained by the production method of the present invention includes a step of forming a transfer material film on the surface of a substrate, a step of transferring a reverse pattern of a mold to the transfer material film, and etching the transfer material film. Since the process of etching as a mask and the process of removing the remaining transfer material film are defined as one cycle and the cycle is repeated twice (that is, the method having the steps (a) to (h) described above), A fine pattern has a relatively large area. Further, since the fine pattern formed in the first cycle is manufactured by a method in which the fine pattern formed in the first cycle is not etched during etching in the second cycle, there are few fine pattern defects and shape variations.
  • optical article of the present invention is manufactured by the optical article manufacturing method of the present invention described later.
  • the description of the same content as the article having the fine pattern of the present invention on the surface is omitted.
  • FIG. 6 is a cross-sectional view showing an example of an optical article.
  • the optical article 40 includes a transparent substrate 42 and a cured resin layer 44 formed on the surface of the transparent substrate 42, and the cured resin layer 44 has a fine pattern 50.
  • Examples of the material of the transparent substrate 42 include quartz, glass, metal oxide, various resins, and the like.
  • the transparent substrate 42 may be surface-treated from the viewpoint of further improving the adhesion with the cured resin layer 44.
  • the curable resin layer 44 is formed by applying a coating composition containing a photocurable resin (that is, a photocurable resin composition) to the surface of the transparent substrate 42 and curing the photocurable resin composition by light irradiation. It is a layer formed by this.
  • a photocurable resin that is, a photocurable resin composition
  • the cured resin layer 44 has a fine pattern 50 on the surface.
  • the fine pattern 50 is a pattern formed by transferring a reverse pattern on the surface of the mold to be described later.
  • the fine pattern 50 includes a plurality of convex portions 52 and concave portions 54 between the convex portions 52.
  • the convex part 52 As the convex part 52, the protruding item
  • the above-described optical article can obtain a fine pattern having a relatively large area, has few defects in the fine pattern and variations in shape, and can be preferably used as an optical component such as a wire grid polarizing element or an antireflection member. .
  • the method for producing an optical article of the present invention uses an article having the fine pattern of the present invention on the surface as a mold having a reverse pattern of the fine pattern of the optical article on the surface, and uses the reverse pattern of the mold on the surface of the transparent substrate. It is a method of transcription.
  • Examples of methods for transferring the mold reversal pattern to the surface of the transparent substrate include photo nanoimprint lithography using a photocurable resin as a transfer material, and thermal nanoimprint lithography using a thermosetting resin or thermoplastic resin as a transfer material. Can be mentioned.
  • the optical nanoimprint lithography method is preferable from the viewpoint that the reversal pattern of the mold can be efficiently transferred onto the surface of the transparent substrate. In the following description, only the case where the transfer method is an optical nanoimprint lithography method will be described, and the case where the transfer method is a thermal nanoimprint lithography method will be omitted.
  • Examples of the method for producing an optical article of the present invention include a method having the following steps (x) to (z).
  • (X) A step of forming a photocurable resin layer 46 by applying a coating composition containing a photocurable resin as a transfer material to the surface of the transparent substrate 42 as shown in FIG.
  • (Y) As shown in FIG. 7, light is irradiated in a state where a photocurable resin layer 46 is sandwiched between a mold 60 having a reverse pattern of the fine pattern 50 on the surface and a transparent substrate 42, A step of curing the photocurable resin layer 46 to form a cured resin layer 44.
  • (Z) A step of obtaining the optical article 40 by separating the mold 60 from the cured resin layer 44.
  • Step (x) may be performed in the same manner as step (a), and the description of the same contents as step (a) will be omitted. What is necessary is just to use the thing similar to the composition for coating in a process (a) as a composition for coating in this process.
  • Step (y) may be performed in the same manner as step (b), and the description of the same contents as step (b) is omitted.
  • the mold 60 the article 10 having the fine pattern of the present invention on the surface and the mold having the reverse pattern of the fine pattern 50 of the optical article 40 on the surface are used.
  • Examples of the method for separating the mold 60 from the cured resin layer 44 include a method in which both are fixed by vacuum suction and moved in a direction in which one is released, a method in which both are mechanically fixed and moved in a direction in which one is released. It is done. After separating the mold 60 from the cured resin layer 44, the cured resin layer 44 may be further cured. Examples of the curing method include heat treatment and light irradiation. By the manufacturing method including the steps (x) to (z) described above, an optical component such as a wire grid polarizing element or an antireflection member can be preferably manufactured.
  • An optical article obtained by the manufacturing method of the present invention is manufactured using an article having a fine pattern of the present invention on its surface as a mold, which has a relatively large fine pattern and few defects and variations in shape of the fine pattern. Therefore, the fine pattern has a relatively large area, and there are few defects and variations in the shape of the fine pattern.
  • the method for producing a replication mold of the present invention is a method for manufacturing a replication mold (that is, a child mold) using the article having the fine pattern of the present invention on the surface as a master mold.
  • the following method etc. are mentioned as a concrete manufacturing method of a replication mold.
  • the obtained replica mold may be used as a master mold to further manufacture a replica mold (that is, a grandchild mold).
  • the thickness of the transfer material film present on the flat surface of the substrate was measured using a tabletop film thickness measurement system (F20, manufactured by Filmetrics).
  • the thickness d of the second transfer material film existing on the first region on the surface of the substrate was determined as follows. For the peripheral edge of the depressed portion formed in the second transfer material film existing on the first region, the step amount is measured using a scanning probe microscope (SII Nanotechnology, L-trace, Nanoavi). went. The thickness d was determined by subtracting the step amount from the thickness of the second transfer material film present on the flat surface of the substrate.
  • a fine pattern of the obtained article was observed using a scanning probe microscope (manufactured by SII Nanotechnology, L-trace, Nanoavi) and evaluated according to the following criteria.
  • Example 1 (Process (a)) The prepared primer is dropped with a dropper onto the surface of a circular silicon substrate having a diameter of 4 inches (SUMCO Co., Ltd., thickness: 525 ⁇ m, ⁇ 1.0.0> surface, single-sided mirror wafer), and 4000 rpm using a spin coater. Then, spin coating was performed for 20 seconds, followed by heat treatment at 130 ° C. for 10 minutes on a hot plate. .
  • the coating composition is dropped onto the surface of the silicon substrate subjected to the primer treatment with a dropper, spin-coated at 3000 rpm for 20 seconds using a spin coater, and then heated at 70 ° C. for 2 minutes on a hot plate. Then, the solvent was removed from the coating film to form a first transfer material film. Table 1 shows the thickness of the first transfer material film.
  • a quartz mold having a fine pattern of line and space (pattern area size: 22 mm ⁇ 22 mm, line width: 60 nm, space groove width: 60 nm, and first transfer material film in the first region, (Pitch: 120 nm, groove depth: 120 nm, external size: 22 mm ⁇ 22 mm, thickness: 6.35 mm) using a nanoimprint apparatus (manufactured by Toshiba Machine Co., Ltd., ST50) at 25 ° C. under atmospheric pressure at 3 MPa. The pressure was pressed for 40 seconds so as to be in close contact, and the fine pattern area of the quartz mold was irradiated with ultraviolet rays (1000 mJ / cm 2 ) through the quartz mold in that state. Thereafter, the quartz mold was peeled off, and further, ultraviolet rays (1000 mJ / cm 2 ) were irradiated in a vacuum chamber to cure the entire transfer material, thereby obtaining a silicon substrate with a mask pattern.
  • a nanoimprint apparatus
  • the silicon substrate with a mask pattern was subjected to anisotropic etching by sequentially performing the following three steps using a dry etching apparatus.
  • the surface layer (thickness: 35 nm) of the first transfer material film was removed by O 2 etching.
  • the etching time is such that the transfer material film of the actually etched sample is peeled off, and the groove depth of the silicon substrate is measured with a scanning probe microscope so that the target etching depth H is achieved. It was adjusted.
  • Ashing was performed for an excessive amount of time using O 2 plasma, and the deposited film derived from the C 4 F 8 gas plasma adhered to the surface was removed.
  • Steps (g) to (h) Anisotropic etching was performed in the same manner as in step (c).
  • the target etching depth H is shown in Table 1.
  • the second transfer material film was peeled off to obtain an article having a fine pattern on the surface. The evaluation results are shown in Table 1.
  • Examples 2 to 8 Except for changing the target etching depth H in the step (c), the thickness of the second transfer material film in the step (e), and the target etching depth H in the step (g) as shown in Table 1, In the same manner as in Example 1, an article having a fine pattern on the surface was obtained. The evaluation results are shown in Table 1.
  • the method for producing an article having a fine pattern on the surface thereof according to the present invention includes a mold used for nanoimprint lithography, an optical article (for example, an optical element, an antireflection member, etc. Specifically, it has a line-and-space fine pattern. Wire grid polarizing element, antireflection member having moth-eye structure, etc.), biochip, microreactor chip, catalyst carrier and the like.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Polarising Elements (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Dans le présent procédé de fabrication d'un article présentant un motif fin sur sa surface, un cycle composé des étapes suivantes est répété deux fois : une étape dans laquelle un film de matériau de transfert est formé sur la surface d'un substrat; une étape dans laquelle un motif négatif sur un moule est transféré sur le film de matériau de transfert; une étape dans laquelle une gravure est réalisée en utilisant le film de matériau de transfert comme un masque de gravure; et une gravure dans laquelle le film de matériau de transfert restant est retiré. Dans ledit procédé, un motif fin formé dans le premier cycle n'est pas gravé pendant la gravure dans le second cycle. Immédiatement avant la gravure dans le second cycle, l'épaisseur (d) du film de matériau de transfert au dessus du motif fin formé dans le premier cycle remplit la condition r∙(H/R)+ t < d (dans laquelle r représente la vitesse de gravure du film de matériau de transfert, H représente la profondeur de gravure cible, R représente la vitesse de gravure du substrat et t représente l'épaisseur du film restant).
PCT/JP2013/060655 2012-04-09 2013-04-08 Article présentant un motif fin sur sa surface, procédé de fabrication associé, article optique, procédé de fabrication associé et procédé pour la fabrication d'un moule de reproduction WO2013154077A1 (fr)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6046860B2 (ja) * 2014-03-13 2016-12-21 富士フイルム株式会社 光学部品，赤外線カメラおよび光学部品の製造方法
CN106575605A (zh) * 2014-07-25 2017-04-19 综研化学株式会社 微细结构体的制造方法
CN113169045A (zh) * 2018-10-16 2021-07-23 Ｓｃｉｖａｘ株式会社 微细图案成形方法、压印用模具制造方法及压印用模具、以及光学设备
US11812238B2 (en) * 2018-05-04 2023-11-07 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Impedance matching device, transducer device and method of manufacturing an impedance matching device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007116972A1 (fr) * 2006-04-07 2007-10-18 Asahi Glass Company, Limited Polariseur a grille de fil et son procede de production
JP2008247022A (ja) * 2007-03-08 2008-10-16 Toshiba Mach Co Ltd 微細パターン形成方法、この微細パターン形成方法によって形成される型、この型を用いた転写方法および微細パターン形成方法
JP2009162965A (ja) * 2008-01-04 2009-07-23 Toshiba Corp 反射防止構造の形成方法および反射防止構造
JP2009177146A (ja) * 2007-12-26 2009-08-06 Canon Inc インプリントによる基板の加工方法
JP2009182075A (ja) * 2008-01-30 2009-08-13 Canon Inc インプリントによる構造体の製造方法
JP2011113631A (ja) * 2009-11-30 2011-06-09 Asahi Glass Co Ltd ワイヤグリッド型偏光子および光ヘッド装置
JP2011172917A (ja) * 2010-01-29 2011-09-08 Hoya Corp 液体保持部材、眼内観察用レンズおよびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007116972A1 (fr) * 2006-04-07 2007-10-18 Asahi Glass Company, Limited Polariseur a grille de fil et son procede de production
JP2008247022A (ja) * 2007-03-08 2008-10-16 Toshiba Mach Co Ltd 微細パターン形成方法、この微細パターン形成方法によって形成される型、この型を用いた転写方法および微細パターン形成方法
JP2009177146A (ja) * 2007-12-26 2009-08-06 Canon Inc インプリントによる基板の加工方法
JP2009162965A (ja) * 2008-01-04 2009-07-23 Toshiba Corp 反射防止構造の形成方法および反射防止構造
JP2009182075A (ja) * 2008-01-30 2009-08-13 Canon Inc インプリントによる構造体の製造方法
JP2011113631A (ja) * 2009-11-30 2011-06-09 Asahi Glass Co Ltd ワイヤグリッド型偏光子および光ヘッド装置
JP2011172917A (ja) * 2010-01-29 2011-09-08 Hoya Corp 液体保持部材、眼内観察用レンズおよびその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6046860B2 (ja) * 2014-03-13 2016-12-21 富士フイルム株式会社 光学部品，赤外線カメラおよび光学部品の製造方法
JPWO2015137197A1 (ja) * 2014-03-13 2017-04-06 富士フイルム株式会社 光学部品，赤外線カメラおよび光学部品の製造方法
CN106575605A (zh) * 2014-07-25 2017-04-19 综研化学株式会社 微细结构体的制造方法
EP3196924A4 (fr) * 2014-07-25 2018-01-10 Soken Chemical & Engineering Co., Ltd. Procédé de fabrication de corps structural microscopique
TWI663472B (zh) * 2014-07-25 2019-06-21 日商綜研化學股份有限公司 Manufacturing method of fine structure
US11812238B2 (en) * 2018-05-04 2023-11-07 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Impedance matching device, transducer device and method of manufacturing an impedance matching device
CN113169045A (zh) * 2018-10-16 2021-07-23 Ｓｃｉｖａｘ株式会社 微细图案成形方法、压印用模具制造方法及压印用模具、以及光学设备

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