WO2008010330A1 - moule de transfert, procédé de fabrication d'UN moule de transfert, et procédé de fabrication de produit transféré à l'aide du moule de transfert - Google Patents

moule de transfert, procédé de fabrication d'UN moule de transfert, et procédé de fabrication de produit transféré à l'aide du moule de transfert Download PDF

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Publication number
WO2008010330A1
WO2008010330A1 PCT/JP2007/055680 JP2007055680W WO2008010330A1 WO 2008010330 A1 WO2008010330 A1 WO 2008010330A1 JP 2007055680 W JP2007055680 W JP 2007055680W WO 2008010330 A1 WO2008010330 A1 WO 2008010330A1
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WIPO (PCT)
Prior art keywords
transfer mold
mold
transfer
producing
coating layer
Prior art date
Application number
PCT/JP2007/055680
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English (en)
Japanese (ja)
Inventor
Katsuhide Shimmo
Original Assignee
Nippon Sheet Glass Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Sheet Glass Company, Limited filed Critical Nippon Sheet Glass Company, Limited
Publication of WO2008010330A1 publication Critical patent/WO2008010330A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/565—Consisting of shell-like structures supported by backing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B05D1/42—Distributing applied liquids or other fluent materials by members moving relatively to surface by non-rotary members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C2033/0005—Moulds or cores; Details thereof or accessories therefor with transparent parts, e.g. permitting visual inspection of the interior of the cavity

Definitions

  • the present invention relates to a transfer mold excellent in light transmittance and fracture resistance, a method for producing the same, and a method for producing a transfer product using the transfer mold.
  • Nanoimprint technology is one of the conventional methods for forming a fine uneven pattern on a substrate.
  • Nanoimprint technology is a further development of imprint technology that originated in the production of record boards.
  • a thermoplastic resin is used in order to transfer and mold fine shapes on the order of submicron power on the substrate.
  • This is a technology in which a cured resin is applied to a base material such as a silicon substrate, and then a mold is pressed to transfer the shape of the mold.
  • the power that makes the wavelength of light the limit of microfabrication is possible.
  • nanoimprint technology even finer nano-level processing is possible, so miniaturization of integrated circuits and integration are promoted. This is an important technology. Also, when considering industrial use, reducing manufacturing costs and shortening manufacturing time is an important issue because it directly leads to cost reduction of products.
  • a transfer mold for nanoimprint technology for example, as shown in FIG. 1, a method of transferring a surface shape by an electron beam lithography method, a lithography technology or a dry etching technology, an electron beam lithography method, etc.
  • a method of forming a Ni electroplating mold as a reversal transfer mold see, for example, JP-A-2006-130841.
  • the base material used for the transfer mold is usually a single brittle material such as silicon or quartz. In many cases, it is relatively thin (for example, about 0.5 mm for a Si substrate). If foreign matter enters between the transfer mold and the transfer material, the foreign matter is likely to be caught and easily cracked.
  • the transfer mold has a single brittle material force, there is no anti-reflection function for light. Therefore, a photocuring resin is used as the transfer mold and the back side force light of the transfer mold is illuminated. When irradiated, the light is reflected off the surface, resulting in low light transmission of the material and loss of light.
  • the electron beam drawing method is a method of forming a pattern one by one, it takes a long time for manufacturing.
  • the method described in Japanese Patent Application Laid-Open No. 2006-130841 is based on the fact that Ni does not transmit light, so the back surface force of the mold does not reach the transfer material even when irradiated with light. Suitable when using hardened resin.
  • the Ni electroplating type is thin (for example, about 2 mm) and has a problem that sufficient transfer accuracy cannot be obtained because it is warped easily.
  • the method described in Japanese Patent Application Laid-Open No. 2006-88517 is also a method for forming fine irregularities on a single plastic substrate, and thus has the above-mentioned problems due to a single material.
  • JP-A-6-114334 discloses a coating film using a sol-gel solution that can be hydrolyzed and polycondensed on a substrate and an organic resin mold having a Z or fine uneven pattern. Then, the substrate and the mold are bonded and pressed to form a coating film having a concave / convex pattern of the mold, and then the mold is released from the film body, and the film body is heated to transfer the fine pattern. Techniques to do this are disclosed. However, this transferred material is used for the manufacture of optical components such as spacer substrates for liquid crystal display cells, diffraction gratings, and imaging elements, and it can be used as a transfer mold for nanoimprinting. It is not intended.
  • the gist of the present invention is as follows.
  • a first base material made of a light-transmitting material, and predetermined fine irregularities formed on the first base material by a sol-gel method and made of a light-transmitting material having a lower refractive index than the first base material A transfer mold having a multilayer structure with a first surface coating layer having a mold surface provided with a shape.
  • the first surface coating layer is made of RSi (OC H), RSi (OCH), and RSiCl (R is a functional group).
  • the transfer mold according to any one of the above (1) to (5) which is formed using a sol liquid mainly composed of at least one kind of compound and an acid aqueous solution.
  • the first surface coating layer is at least represented by Si (OC H), Si (OCH 3), and SiCl.
  • a step of applying a predetermined sol solution onto the first base material made of a light-transmitting material, and heating and holding the original mold in a pressed state to cure the gel layer, thereby predetermined micro unevenness A method for producing a transfer mold, comprising a step of forming a first surface coating layer having a mold surface provided with a shape.
  • the predetermined sol solution is represented by RSi (OC H), RSi (OCH), and RSiCl (R is a functional group).
  • the predetermined sol solution is represented by at least 1 represented by Si (OC H), Si (OCH 3), and SiCl.
  • a transfer product in which the fine uneven shape of the mold surface of the surface coating layer is transferred is manufactured.
  • a predetermined resin is applied onto the second substrate, and light is irradiated from the back side of the mold surface of the transfer mold in a state where the transfer mold is pressed against the applied resin.
  • To form a second surface covering layer by curing the resin, and then releasing the mold.
  • the second base material has the same light-transmitting material force as the first base material
  • the second surface coating layer has the same light-transmitting material force as the first surface coating layer.
  • a transfer product in which the fine uneven shape of the mold surface of the surface coating layer is transferred is manufactured.
  • the fourth substrate is made of a glass material, and the third surface coating layer is made of a thermoplastic resin.
  • the present invention by forming a multilayer structure using the sol-gel method, it is possible to provide a transfer mold excellent in light transmittance and fracture resistance, particularly a transfer mold suitable for nanoimprinting. .
  • FIG. 1 is a diagram showing a conventional original plate manufacturing process.
  • FIG. 2 is a flowchart showing the main steps of a method for manufacturing a transfer mold according to the present invention.
  • FIGS. 2 (a) to (c) show the steps of the method for producing a transfer mold according to the present invention.
  • 1 is a transfer mold
  • 2 is a substrate
  • 3 is a first surface coating layer
  • 4 is a mold surface
  • 5 is a prototype (reverse transfer mold).
  • the transfer mold 1 of the present invention is constituted by a covering structure of a first base 2 and a first surface covering layer 3.
  • the present inventor has intensively studied to improve high permeability and fracture resistance in a transfer mold.
  • the first substrate 2 made of a translucent material and the first substrate 2 are formed on the first substrate 2 by a sol-gel method.
  • Light transmissivity is much better when it is composed of a multilayer structure with the first surface covering layer 3 having a mold surface to which a predetermined fine uneven shape is imparted.
  • the presence of the first surface coating layer 3 also improves the fracture resistance.
  • the transfer mold of the present invention is specifically formed by a sol-gel method on a first base material made of a light-transmitting material and a light-transmitting material having a lower refractive index than the first base material. It is made of a material and has a multilayer structure with a first surface coating layer having a mold surface provided with a predetermined fine uneven shape.
  • the first substrate 2 is preferably a crystalline material, an amorphous material, or a crystallized glass material.
  • the crystalline material include silicon
  • examples of the amorphous material include quartz, soda lime glass, and polysilicate glass.
  • Examples of the crystallized glass material include a crystal component of ⁇ 8-quartz solid solution.
  • Examples thereof include crystallized glass materials containing crystal or ⁇ 8-cryptite solid solution as a main crystal component.
  • main means that this component is contained in an amount of 50% by mass or more.
  • V so-called zero-expansion glass such as Zerodur (registered trademark) and Taliaceram (registered trademark) which are crystallized glass materials.
  • the first surface coating layer 3 is formed of at least one of RSi (OC H), RSi (OCH), and RSiCl.
  • a sol liquid mainly composed of a compound and an aqueous acid solution.
  • R is a functional group selected from the group of H, CH, CH, and CH.
  • Acid aqueous solution mainly composed of H, CH, CH, and CH.
  • Karo water decomposition It is indispensable for Karo water decomposition, and it is selected from the group power of HC1, HSO, HCOOH, CHCOOH, and HNOO.
  • polyethylene glycol and Z or alcohol in the sol solution.
  • Polyethylene glycol preferably has a molecular weight of 400 to 2000. If the molecular weight is less than 400, the film hardness may be too high to be molded, and if it exceeds 2000, the film may be cured.
  • Alcohol is ethanol, methanol and isopropyl alcohol
  • the alcohol content in the sol solution is 10 to 40 parts by mass. If the amount is less than 10 parts by mass, uniform stirring of the liquid becomes difficult, and if it exceeds 40 parts by mass, a sufficient coating thickness cannot be obtained!
  • the first surface coating layer 3 is represented by a small amount represented by Si (OC H), Si (OCH) and SiCl.
  • the content of polyethylene glycol is more preferably 5 to 20% by mass. If it is less than 5% by mass, the film hardness may be too high to be molded, and if it exceeds 20% by mass, the sol solution may be difficult to cure.
  • the molecular weight of polyethylene glycol is preferably 400-2000. If the molecular weight is less than 400, the film hardness may be too high to be molded, and if it exceeds 2000, the sol solution may be cured. Moreover, it is preferable to contain alcohol in a sol liquid.
  • the alcohol mainly contains a liquid selected from the group consisting of ethanol, methanol, and isopropyl alcohol because the alcohol remains in the gel film at the time of molding and bubble defects do not occur.
  • the alcohol content in the sol solution is preferably 10 to 40 parts by mass. If it is less than 10 parts by mass, it is difficult to uniformly stir the sol solution, and if it exceeds 40 parts by mass, a sufficient coating thickness of the surface coating layer may not be obtained.
  • the refractive index of the translucent material constituting the first surface coating layer is set to be lower than that of the first substrate. Specifically, it is preferable to set the refractive index of the first surface coating layer to 1.40 to L 56, and to increase the difference between these refractive indexes.
  • the refractive index is about 4.2, so a sufficient difference in refractive index from the covering layer can be obtained.
  • the fine uneven shape of the mold surface specifically means an uneven shape of 10 to 1 OOOnm.
  • the transfer mold 1 preferably further has a release layer on the first surface coating layer.
  • hydrophobic substituent is selected from the group of CH, C H, and C H, this substituent is releasable.
  • a predetermined sol solution is formed on the first substrate 2 made of a light-transmitting material. And a first surface coating layer 3 having a mold surface 4 to which a predetermined fine uneven shape is imparted by heating and holding the original mold (reverse transfer mold) in a pressed state to cure the gel layer. Forming a process.
  • the heating temperature is preferably 50 to 150 ° C. If the heating temperature is less than 50 ° C., curing takes a long time, and if it exceeds 150 ° C., bubbles are likely to be generated.
  • the holding time is preferably 0.05 to 2 hours.
  • the gel layer is cured by water condensation. Thereafter, the cured gel layer is baked to remove organic substances remaining in the film, whereby the transfer mold of the present invention can be produced.
  • the transfer mold according to the present invention has high light transmittance and is stable even at high temperatures, various kinds of materials such as a photocurable resin and a thermosetting resin can be obtained by irradiating light from the back side of the transfer mold. By changing the material, it is possible to produce a transfer product in which fine irregularities on the mold surface are transferred. In addition, it is possible to replicate a high-priced prototype produced by an electron beam drawing method or the like using a transfer mold produced by this production method. Furthermore, since the transfer mold of the present invention has a multilayer structure, it has high rigidity and is less likely to break than a single material transfer mold even when repeated transfer is performed.
  • a resin having physical properties that is cured by irradiating light such as ultraviolet rays is applied onto the second substrate, and this application is performed.
  • the second surface coating layer is formed by curing the resin by applying predetermined light to the back surface of the mold surface of the transfer mold while the transfer mold is pressed against the resin. After that, by releasing the mold, a transfer product in which fine irregularities are transferred to the mold surface of the surface coating layer is produced.
  • a method for producing a second transfer product using the transfer mold is provided on a third base material, preferably a third base material having a plastic material force that has a property of softening when irradiated with light.
  • the back side of the mold surface of the transfer mold is irradiated with the transfer mold pressed against the surface of the third substrate to soften the surface of the mold, and the uneven surface of the mold surface of the transfer mold is softened.
  • a fine uneven shape was transferred to the surface of the third substrate. Produces a transcript.
  • the third transfer product production method using the transfer mold is as follows. First, a group of PMMA, polycarbonate, acrylic resin, polyimide and polyamide is selected on the fourth base material. Then, the transfer mold is pressed against the applied resin and heated to a softening point or higher, and then cooled to a temperature lower than the softening point to cure the resin to obtain a third surface. A covering layer is formed. Thereafter, by releasing the mold, a transfer product in which a fine uneven shape is transferred to the mold surface of the surface coating layer is produced. The softening point depends on the physical properties of the selected resin.
  • the transfer product thus manufactured is a transfer product in which the mold surface of the transfer mold is accurately transferred.
  • a reversal transfer mold which is an expensive prototype manufactured by an electron beam drawing method or the like, is manufactured. This is advantageous in that it can be done.
  • a grooved substrate prepared by an electron beam drawing method was used as a prototype (reversal transfer mold).
  • the main component was 0. 5 mol of Si (OC H), 0.1 M acid aqueous solution was 0.3 mol, and the molecular weight was 600.
  • a sol solution containing 0. 05 mol of ethylene glycol and 0.25 mol of ethanol was applied to a stone substrate.
  • the gel film was cured by holding the prototype against this quartz substrate for 2 hours at 60 ° C.
  • the cured gel film was baked at 500 ° C. to remove organic substances remaining in the film, thereby obtaining a transfer mold. After the mold surface of the obtained transfer mold was subjected to release treatment, the performance as a nanoimprint transfer mold was examined.
  • an ultraviolet curable resin was applied to a substrate, and the transfer mold was pressed to irradiate ultraviolet rays from the back side of the mold surface. After that, it was confirmed by AFM (Atomic Force Microscope) evaluation that the fine concavo-convex shape of the transfer mold was transferred to the ultraviolet curable resin by releasing the mold.
  • AFM Anatomic Force Microscope
  • the substrate was scratched by applying a substrate to a part of the surface of the transfer mold, but the mold was not removed even after repeated transfer and release tests 30 times. It was confirmed by AFM evaluation that there was no problem with the transferred fine concavo-convex structure. When the scratches were confirmed in detail, it was found by SEM (scanning electron microscope) evaluation that scratches were found only on the surface coating layer of the transfer mold, but the scratches reached the substrate.
  • the transfer mold of the present invention can easily form fine irregularities of a highly rigid inorganic material on a base material, and it is difficult to crack even if scratches occur due to a two-layer coating layer structure. Since ultraviolet rays are transmitted, optical nanoimprinting and thermal nanoimprinting can be easily performed by using this as a transfer mold, and it has become clear that optical elements having fine irregularities can be provided at low cost.
  • a grooved substrate prepared by an electron beam drawing method is used as a prototype (reverse transfer mold).
  • the main component is O. 5 mol of Si (OC H), 0.1 M acid aqueous solution is 0.3 mol, and the molecular weight is 400.
  • a sol solution containing 0. 05 mol of ethylene glycol and 0.25 mol of ethanol was applied to a silicon substrate.
  • the gel film was cured by holding the prototype against this silicon substrate for 2 hours at 60 ° C.
  • the cured gel film was baked at 500 ° C., and organic substances remaining in the film were removed to obtain a transfer mold for resin transfer. After the mold surface of the obtained transfer mold was subjected to release treatment, the performance as a nanoimprint transfer mold was examined.
  • the obtained transfer mold transmits infrared rays. While this mold is bonded to a plastic substrate, the back side force of the mold surface is irradiated with a CO laser.
  • a grooved substrate prepared by an electron beam drawing method was used as a prototype (reversal transfer mold).
  • the main component was 0. 5 mol CH 2 Si (OC H), 0.1 M acid aqueous solution 0.2 mol, and ethano
  • a sol solution containing 0.5 mol of O. mol was applied onto a soda lime glass substrate.
  • the gel film was cured by holding at 60 ° C. for 2 hours with the prototype pressed against the soda-lime glass substrate. Further, after firing at 300 ° C., a grooved substrate obtained by releasing the cured gel film from the original mold was fired to obtain a transfer mold for resin transfer.
  • the PMMA coated on the glass substrate was heated to the softening point to pressurize the mold, then cooled, and released at a temperature below the softening point. As a result, a transcript was obtained. As a result of AFM evaluation of this transcript, it was confirmed that the original microstructure was transferred!
  • the substrate was applied to the surface coating layer of the transfer mold so as to be scratched.
  • the transfer mold was not broken even after repeated transfer and mold release.
  • the sol-gel film of the surface coating layer had scratches, but it did not reach the base material, but was proved by evaluation by force EM.
  • the transfer mold of the present invention can be used as a transfer mold for thermal nanoimprint because the fine uneven structure of the surface is maintained even at the soft spot of the resin. It was.
  • a resist is applied on quartz, and a fine groove pattern is formed on the quartz substrate by dry etching using the resist in which the fine groove pattern is formed by electron beam drawing or development as a mask. It was. PMMA coated on the substrate is heated and softened, and the transfer mold is pressed against it. The temperature is lowered to below the soft spot, and then the mold is released, and the mold surface shape of the transfer mold is reduced. Transferred to fat. When repeated transfer and release were performed in the same way, the corner of the substrate was accidentally hit by the transfer mold and scratched. After that, repeated transfer and release experiments were conducted, and the transfer mold was damaged during the third release.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

La présente invention concerne la production simple et à peu de frais, par exemple, d'un moule de transfert présentant une excellente transmission de la lumière et une excellente résistance aux fractures, particulièrement un moule de transfert convenant à la nano-impression. Le moule de transfert possède une structure multicouche contenant un premier matériau de base constitué d'un matériau transparent à la lumière et une première couche de revêtement de surface disposée sur le premier matériau de base. La première couche de revêtement de surface s'obtient grâce à un procédé sol-gel, est formée d'un matériau transparent à la lumière doté d'un indice de réfraction inférieur à celui du premier matériau de base, et possède une surface de moule comprenant de fines parties concaves et convexes prédéterminées. Le procédé de fabrication d'un moule de transfert comprend l'étape de revêtement d'un liquide sol prédéterminé sur un premier matériau de base constitué d'un matériau transparent à la lumière et l'étape consistant à élaborer une première couche de revêtement de surface en chauffant et maintenant l'ensemble dans un état permettant de comprimer un moule d'origine contre l'ensemble pour durcir la couche de gel et ainsi produire la première surface de moule de revêtement de surface possédant une surface de moule avec de fines parties concaves et convexes.
PCT/JP2007/055680 2006-07-21 2007-03-20 moule de transfert, procédé de fabrication d'UN moule de transfert, et procédé de fabrication de produit transféré à l'aide du moule de transfert WO2008010330A1 (fr)

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JP2006-199900 2006-07-21
JP2006199900A JP2009233855A (ja) 2006-07-21 2006-07-21 転写用型およびその製造方法ならびに転写用型を用いた転写物の製造方法

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Cited By (3)

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WO2015011980A1 (fr) * 2013-07-26 2015-01-29 Ｊｘ日鉱日石エネルギー株式会社 Procédé de fabrication d'un substrat présentant une structure texturée
CN105027259A (zh) * 2013-03-06 2015-11-04 吉坤日矿日石能源株式会社 具有凹凸构造的构件的制造方法以及通过该制造方法制造出的具有凹凸构造的构件
CN115432946A (zh) * 2022-08-30 2022-12-06 维达力实业(深圳)有限公司 Ag效果微晶玻璃制备模具、微晶玻璃及其制备方法

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JP5836852B2 (ja) * 2012-03-12 2015-12-24 株式会社北熱 金型部品の製造方法
JP5940940B2 (ja) 2012-08-31 2016-06-29 東芝機械株式会社 転写装置および転写方法

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JP2004358559A (ja) * 2003-06-02 2004-12-24 Ricoh Opt Ind Co Ltd 微細表面構造をもつ物品の製造方法、並びに金型及びその製造方法
JP2005050614A (ja) * 2003-07-31 2005-02-24 Three M Innovative Properties Co 微細構造体複製用母型及びその製造方法
JP2006130841A (ja) * 2004-11-08 2006-05-25 Matsushita Electric Ind Co Ltd 反射防止構造体を備えた部材の製造方法

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JPS62102445A (ja) * 1985-10-28 1987-05-12 Nippon Sheet Glass Co Ltd 光デイスク基板の製造方法
JPH0283227A (ja) * 1988-09-21 1990-03-23 Seiko Epson Corp 成形方法
JPH06114334A (ja) * 1992-10-05 1994-04-26 Nippon Sheet Glass Co Ltd 基板上に微細な凹凸パターンを形成する方法
JP2002240057A (ja) * 2001-02-21 2002-08-28 Nippon Sheet Glass Co Ltd 複合光学素子の製造方法
JP2002338304A (ja) * 2001-02-28 2002-11-27 Nippon Sheet Glass Co Ltd 所定表面形状を有する物品の製造方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105027259A (zh) * 2013-03-06 2015-11-04 吉坤日矿日石能源株式会社 具有凹凸构造的构件的制造方法以及通过该制造方法制造出的具有凹凸构造的构件
WO2015011980A1 (fr) * 2013-07-26 2015-01-29 Ｊｘ日鉱日石エネルギー株式会社 Procédé de fabrication d'un substrat présentant une structure texturée
JPWO2015011980A1 (ja) * 2013-07-26 2017-03-02 Ｊｘエネルギー株式会社 凹凸構造を有する基板の製造方法
AU2014294412B2 (en) * 2013-07-26 2017-08-03 Jx Nippon Oil & Energy Corporation Method for manufacturing substrate having textured structure
CN115432946A (zh) * 2022-08-30 2022-12-06 维达力实业(深圳)有限公司 Ag效果微晶玻璃制备模具、微晶玻璃及其制备方法
CN115432946B (zh) * 2022-08-30 2024-06-07 维达力实业(深圳)有限公司 Ag效果微晶玻璃制备模具、微晶玻璃及其制备方法

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