WO2012105441A1 - 太陽電池用基板の作製方法および太陽電池 - Google Patents
太陽電池用基板の作製方法および太陽電池 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 122
- 238000000034 method Methods 0.000 title claims abstract description 100
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 86
- 239000010703 silicon Substances 0.000 claims abstract description 86
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 84
- 238000005530 etching Methods 0.000 claims abstract description 42
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- 238000004519 manufacturing process Methods 0.000 claims abstract description 21
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 14
- 238000004381 surface treatment Methods 0.000 claims abstract description 11
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 8
- 239000006061 abrasive grain Substances 0.000 claims description 16
- 229910003460 diamond Inorganic materials 0.000 claims description 10
- 239000010432 diamond Substances 0.000 claims description 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000004070 electrodeposition Methods 0.000 claims description 4
- 238000002310 reflectometry Methods 0.000 abstract description 12
- 238000007796 conventional method Methods 0.000 abstract description 6
- 239000000243 solution Substances 0.000 description 31
- 230000015572 biosynthetic process Effects 0.000 description 7
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
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- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
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- 239000002131 composite material Substances 0.000 description 2
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- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
Definitions
- the present invention relates to a method for producing a texture structure of a silicon substrate for producing a crystalline silicon solar cell, and a solar cell using the substrate.
- Non-Patent Document 1 Increasing the solar cell efficiency by making the surface of the substrate concavo-convex structure (texture structure), reducing the light reflectance on the surface of the solar cell, and increasing the optical path length in the substrate A method of effectively confining the generated light in the substrate (optical confinement) is widely used. In this case, it is not necessary to form a texture structure on both sides of the silicon substrate from the viewpoint of improving efficiency. Rather, it is desirable that the texture structure is formed only on one surface of the substrate, and the other surface is a mirror surface having a higher reflectance than the surface on which the texture structure is formed (Non-Patent Document 1).
- the crystalline silicon substrate that is generally used for crystalline silicon solar cells is manufactured by a method of slicing a silicon ingot with a multi-wire saw using a cutting fluid containing abrasive grains and a piano wire (free abrasive grain method). ing.
- the silicon substrate in the as-sliced state produced by this loose abrasive method has random irregularities and damage layers on the surface.
- Non-patent Document 2 discloses a method for forming a texture structure on a substrate surface while removing a damaged layer from an as-sliced polycrystalline silicon substrate using an isotropic etching solution containing hydrofluoric acid and nitric acid.
- a texture structure is formed on both sides of the silicon substrate.
- a substrate sliced by the free abrasive grain method has the above-mentioned random unevenness and damage layer, so that a texture due to the solution is easily formed on both surfaces of the silicon substrate.
- the surface on which the reflectance is desired to be increased it was necessary to perform etching again using an etching solution different from the etching solution for texture formation.
- Patent Document 1 discloses a method of using plasma instead of a solution.
- this method has a problem that the cost becomes high because a vacuum apparatus must be used.
- Patent Document 2 Japanese Patent Application Laid-Open No. 2005-340643
- a damaged layer is formed on the entire surface of a silicon substrate (see FIG. 2 of Patent Document 2) by wire slicing or sand blasting, and this substrate is washed with an acid solution and washed with water.
- a manufacturing method in which a texture structure is formed by sequentially immersing in an alkaline solution is disclosed.
- this document does not discuss the reflectivity of the as-sliced silicon substrate and the reflectivity of the textured silicon substrate surface and back surface.
- an ingot is sliced by a multi-wire saw using a fixed abrasive wire (diamond wire) in which diamond abrasive grains are fixed to a piano wire by electrodeposition, resin, metal or a composite thereof.
- a method (fixed abrasive grain method) has been studied (Non-Patent Document 3). Compared with the free abrasive grain system, this system has the characteristics that the amount of wire used is small, the slicing speed is twice or more, and a cooling liquid that does not contain abrasive grains is used, so that there is less problem of waste liquid treatment. Therefore, the slice cost can be reduced by using this method. For this reason, the ingot slicing method using the fixed abrasive method is expected as a next-generation slicing technique.
- the present invention has been made in view of such circumstances, and in a simpler method than the conventional method, one surface has a texture structure, and the other surface is more than the surface having the texture structure.
- Another object of the present invention is to provide a technique for manufacturing a silicon substrate effective for light confinement having a highly reflective surface.
- the inventors of the present application have found that the ingot slicing method by the fixed abrasive method reflects the surface of the silicon substrate in an as-sliced state sliced by the slicing method by appropriately selecting the slicing conditions. It has been found that it has the characteristic that the rate can be made higher.
- the inventors of the present application found that the surface of the as-sliced silicon substrate sliced by the fixed abrasive method was not exposed to the surface by etching with a solution compared to the surface of the as-sliced silicon substrate sliced by the free abrasive grain method. It has been found that it has a feature that it is difficult to form a texture structure. The inventors of the present invention have reached the present invention by finding these characteristics.
- the present invention has the following configuration.
- the method for producing a semiconductor substrate of the present invention includes a sandblasting step of performing a surface treatment by a sandblasting process on a first surface of an as-sliced silicon substrate produced by slicing a silicon ingot, and the sandblasting step. And performing a surface treatment on the silicon substrate with an etching solution containing at least one of hydrofluoric acid and nitric acid.
- the first surface is subjected to a surface treatment by sandblasting, and therefore has a texture structure compared to the surface opposite to the first surface.
- a damage layer having a surface shape suitable for formation can be uniformly included in the surface.
- the more the damage layer having a certain depth having a surface shape suitable for the formation of the texture structure is uniformly present in the surface the more easily the texture structure is formed on the surface.
- the surface treatment with the etching solution is performed on the silicon substrate having a surface with different ease of forming such a texture structure.
- a 1st surface and the surface of the other side are distinguished by utilizing the difference in the ease of formation of the texture structure in a 1st surface and the surface of the other side.
- the texture structure can be formed only on the first surface by the surface treatment with the etching solution. Therefore, according to the method for manufacturing a semiconductor substrate of the present invention, one surface has a texture structure and the other surface has a reflectance higher than that of the surface having the texture structure in a simpler method than the conventional method. It is possible to provide a technique for manufacturing a silicon substrate effective for optical confinement having a high surface.
- a method for manufacturing a semiconductor substrate according to the present invention includes slicing a silicon ingot so that the first surface and the second surface opposite to the first surface are the second surface. And a slice step of producing a silicon substrate having a reflectance of 28% or more and 36% or less with respect to a wavelength of light in the range of 600 nm to 800 nm, wherein the silicon substrate in the as-sliced state includes the slice You may produce by a process.
- the reflectivity of 28% or more and 36% or less is a relatively high reflectivity among the reflectivities of the conventional as-sliced silicon substrate surface.
- the reflectance of the first surface and the reflectance of the second surface in the as-sliced state can be further increased.
- the surface of the as-sliced silicon substrate sliced by the fixed abrasive method has a texture structure on the surface when etched with a solution compared to the surface of the as-sliced silicon substrate sliced by the free abrasive method. It is difficult to form.
- the ease of forming the texture structure on the first surface and the second surface can be made more remarkable. Therefore, in the step of performing the surface treatment with the etching solution, a texture structure can be easily formed only on the first surface.
- the first surface and the second surface may be simultaneously surface-treated with the etching solution.
- a texture structure is more easily formed on the first surface than on the second surface. Therefore, even if the first surface and the second surface are simultaneously surface-treated with the etching solution as in the above configuration, it is possible to form a texture structure only on the first surface.
- etching is possible without distinguishing between the first surface and the second surface, so that one surface has a texture structure in a simpler method than the conventional method,
- the other surface can provide a technique for producing a silicon substrate effective for optical confinement having a surface having a higher reflectance than the surface having the texture structure.
- the silicon ingot may be polycrystalline silicon.
- the silicon substrate can be produced by a simpler method than before, a solar cell can be produced by a simpler method than before.
- the effect of light confinement and the effect of BSF can be increased, and a more efficient crystalline silicon solar cell can be manufactured even in the same process.
- one surface has a texture structure and the other surface is effective for light confinement having a surface having a higher reflectivity than the surface having the texture structure in a simpler manner than the conventional method.
- a technique for manufacturing a silicon substrate can be provided.
- a photograph showing a surface state of a silicon substrate sliced by a fixed abrasive method The photograph which shows the surface state of the silicon substrate sliced by the loose abrasive method. The figure which compared the surface reflectance of the silicon substrate sliced by the fixed abrasive method, and the surface reflectance of the silicon substrate sliced by the free abrasive method. The photograph which shows the surface state of the surface which performed the sandblasting process of the silicon substrate sliced with the fixed abrasive method. The photograph which shows the 1st surface (texture surface) of the silicon substrate obtained by the Example of this invention. The photograph which shows the 2nd surface of the silicon substrate obtained by the Example of this invention. The figure which compared the surface reflectance of the 1st surface (texture surface) of the silicon substrate obtained by the Example of this invention with the surface reflectance of the 2nd surface of the silicon substrate obtained by the Example of this invention .
- this embodiment an embodiment of a method for producing a silicon substrate for a solar cell according to one aspect of the present invention (hereinafter also referred to as “this embodiment”) will be described.
- a silicon ingot is sliced using a multi-wire saw using a fixed abrasive wire (diamond wire) to produce an as-sliced silicon substrate (hereinafter, the silicon substrate is also simply referred to as “substrate”).
- the fixed abrasive wire uses diamond abrasive grains fixed to the metal wire by electrodeposition, resin, metal, or a composite method thereof.
- the silicon ingot used in this embodiment is a polycrystalline silicon ingot, but may be a single crystal silicon ingot.
- the surface of the silicon substrate in the sliced as-sliced state is required to have as high a light reflectance as possible (hereinafter also referred to as “surface reflectance”).
- the reflectance of the silicon substrate in the sliced as-sliced state is 28% or more and 36% or less, preferably 30% or more for both wavelengths of light of all wavelengths from 600 nm to 800 nm. It is calculated
- the maximum value of the reflectance of the single-crystal silicon substrate having a mirror surface in the wavelength range of 600 nm to 800 nm is about 36% (Phys. Rev., Vol. 120, p. 37 (1960)). . Since the maximum value of the reflectance of the silicon substrate in the mirror state in the wavelength range of 600 nm to 800 nm is 36%, the upper limit value of the surface reflectance of the silicon substrate according to this embodiment is 36%.
- the slicing conditions with the fixed abrasive wire to bring the reflectance of the silicon substrate within the above range depend on factors such as the wire diameter of the fixed abrasive wire, the abrasive particle diameter of the diamond abrasive grain, and the slicing speed. For this reason, the operator needs to examine beforehand the slicing conditions that satisfy the above-described requirement of the surface reflectance by experiments or the like. For example, when a fixed abrasive wire is used to slice a silicon ingot so that the as-sliced silicon substrate has a thickness of about 100 ⁇ m to 200 ⁇ m and a size of 156 mm square, the wire diameter of the fixed abrasive wire is 90 ⁇ m. It is desirable that the diamond abrasive grains have a grain size of 5 to 30 ⁇ m and a slice speed of about 0.2 mm / min to 1.5 mm / min.
- sandblasting conditions type of abrasive, size of abrasive, pressure for spraying abrasive
- the sandblasting conditions must be uniform in the depth direction and in the surface so that etching can be performed uniformly in the surface in the next etching process. Don't worry.
- the type of abrasive is silicon carbide (SiC), alumina oxide, emery, garnet.
- the size of the abrasive is desirably the size of the abrasive having a particle size number of 400 to 3000.
- the pressure for spraying the abrasive is preferably 0.2 to 0.6 MPa.
- a method of sandblasting in addition to a method in which an abrasive is sprayed with a gas such as air or nitrogen, a method in which an abrasive and water are mixed and sprayed may be used. Note that the surface subjected to the sandblast treatment corresponds to the first surface of the present invention.
- the desired silicon substrate can be obtained by etching the silicon substrate with a solution containing at least one of hydrofluoric acid and nitric acid.
- the surface subjected to the sandblasting treatment includes a damage layer having a surface shape suitable for texture formation more uniformly in the surface than the surface not subjected to the sandblasting treatment.
- the more a damage layer having a certain depth and having a surface shape suitable for texture formation is uniformly present in the surface the more easily the texture structure is formed on the surface. Therefore, in the etching process using a solution, a texture structure is more easily formed on the surface subjected to the sandblasting process than on the surface not subjected to the sandblasting process.
- this texture structure By utilizing the ease with which this texture structure is formed, it is possible to form a texture structure on the surface that has been sandblasted and not to form a texture structure on the other surface that has not been sandblasted. That is, it is possible to manufacture a silicon substrate effective for light confinement, in which one surface has a texture structure and the other surface has a surface having a higher reflectance than the surface having the texture structure.
- the surface of the as-sliced silicon substrate sliced by the fixed abrasive method is less likely to form a damage layer than the surface of the as-sliced silicon substrate sliced by the free abrasive method. Therefore, when the fixed abrasive method is used rather than the free abrasive method, the texture structure is less likely to be formed by etching with the solution on the surface that has not been subjected to the sandblast treatment. Therefore, the fixed abrasive method is effective for clarifying the difference in the ease of forming the texture structure in the etching with the solution.
- the silicon substrate may be immersed in an etching solution, or the silicon substrate may be etched by spraying an etching solution with a shower or the like.
- etching of a silicon substrate there is a method in which the temperature of a solution containing hydrofluoric acid and nitric acid is maintained in a range of 5 ° C. to 30 ° C., the substrate is immersed therein, and then washed with water. Depending on conditions, a black-brown porous layer may be formed on the surface of the silicon substrate during the etching process. In this case, it is necessary to remove the porous layer by immersing the silicon substrate in an alkaline solution such as a sodium hydroxide solution of several percent (for example, 1% to 3%) after washing with water. Etching may be performed with a solution in which an additive that does not cause a porous layer is added to the solution containing hydrofluoric acid and nitric acid.
- an alkaline solution such as a sodium hydroxide solution of several percent (for example, 1% to 3%)
- one surface has a texture structure and the other surface has a higher reflectance than the surface having the texture structure.
- a silicon substrate having a high surface and effective for optical confinement can be manufactured. Therefore, in the silicon substrate manufacturing method according to the present embodiment, the etching process may be performed once and may not be performed a plurality of times. Therefore, the optical confinement having the above-described structure is simpler and less expensive than the conventional one. An effective silicon substrate can be produced.
- a polycrystalline silicon ingot was sliced with a multi-wire saw using a fixed abrasive wire (diamond wire).
- the wire at this time was obtained by fixing diamond abrasive grains to a metal wire with a resin bond, and the wire diameter was about 150 ⁇ m.
- the slice speed was 0.5 mm / min.
- the sliced polycrystalline silicon substrate had a thickness of about 200 ⁇ m.
- FIG. 1A shows a surface photograph of an as-sliced polycrystalline silicon substrate sliced by a fixed abrasive method using a fixed abrasive wire.
- FIG. 1B shows a surface photograph of the as-sliced polycrystalline silicon substrate sliced by the free abrasive grain method. From FIG. 1A and FIG. 1B, it can be seen that the surface shape of the silicon substrate varies greatly depending on the slice method.
- FIG. 2 shows the reflectivity of these as-sliced silicon substrates. This measurement was performed using an integrating sphere with a spectrophotometer (Hitachi spectrophotometer U4000).
- the reflectance of the substrate surface sliced by the fixed abrasive method is in the range of 32 to 34% and the reflectance of the substrate surface sliced by the free abrasive method is 26 to 27% with respect to the light wavelength ranging from 600 nm to 800 nm. It is a range. Therefore, the reflectivity of the substrate sliced by the fixed abrasive method is higher than that of the substrate sliced by the free abrasive method, reflecting its surface shape. From this, it was shown that the fixed abrasive method can produce a silicon substrate having a higher reflectance than the substrate surface sliced by the free abrasive method under appropriate slicing conditions.
- FIG. 3 shows the state of the surface of the substrate after sandblasting.
- sandblasting was performed by spraying abrasive with air using Pneumatic Blaster (registered trademark) SG-4 (Fuji Seisakusho).
- the type of abrasive used was Fuji Random WA (manufactured by Fuji Seisakusho)
- the size of the abrasive used was one with a particle size number of 1000 (average particle size 11 ⁇ m)
- the pressure at which the abrasive was sprayed was 0.3 MPa Met.
- the sandblast treatment eliminated the streak-like pattern peculiar to the substrate sliced by the fixed abrasive method, and a uniform damage layer was formed on the surface.
- FIG. 4A shows a surface photograph of a surface (hereinafter referred to as “first surface”) after the etching process is performed on the surface subjected to the sandblasting process.
- FIG. 4B shows a surface photograph of a surface (hereinafter referred to as “second surface”) after the etching process is performed on the surface that has not been subjected to the sandblasting process.
- FIG. 5 shows the reflectance of the first surface and the second surface of the silicon substrate.
- the first surface has a low reflectance over a wide wavelength range, and the reflectance with respect to light having a wavelength in the range of 600 nm to 800 nm is in the range of 24 to 26%.
- the reflectance of the second surface is lower than that of the as-sliced surface before the etching process, but the reflectance is about 3.5% higher in absolute value than the first surface. .
- one surface has a texture structure and the other surface has the texture structure by one etching process. It was possible to obtain a silicon substrate effective for optical confinement having a surface with a higher reflectivity than the surface having.
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Abstract
Description
Claims (6)
- シリコンインゴットをスライスすることにより作製されたアズスライス状態のシリコン基板の第一の面に対して、サンドブラスト処理による表面処理を行うサンドブラスト工程と、
前記サンドブラスト工程の後に、前記シリコン基板に対して、フッ酸、硝酸のいずれか1つ以上を含むエッチング溶液による表面処理を行う工程と、
を含むことを特徴とする半導体基板の作製方法。 - シリコンインゴットをスライスすることで、前記第一の面と、前記第一の面の反対側の面である第二の面とが、600nmから800nmの範囲の光の波長に対して、28%以上36%以下の反射率を有するシリコン基板を作製するスライス工程を更に含み、
前記アズスライス状態のシリコン基板は、前記スライス工程により作製されることを特徴とする請求項1に記載の半導体基板の作製方法。 - 前記スライス工程が、電着、レジン、メタルまたはそれらの複合による方法によってダイヤモンド砥粒を金属ワイヤー表面に固着させた固定砥粒方式のワイヤーを用いたスライス工程であることを特徴とする請求項2に記載の半導体基板の作製方法。
- 前記エッチング溶液による表面処理を行う工程では、前記第一の面と前記第二の面とが前記エッチング溶液により同時に表面処理が行われることを特徴とする請求項2または3に記載の半導体基板の作製方法。
- 前記シリコンインゴットが多結晶シリコンであることを特徴とする請求項1から4のいずれか1項に記載の半導体基板の作製方法。
- 請求項1から5のいずれか1項に記載の半導体基板の作製方法により作製された半導体基板を用いて作製された太陽電池。
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CN103361738A (zh) * | 2012-03-29 | 2013-10-23 | 无锡尚德太阳能电力有限公司 | 一种多晶硅太阳电池及太阳电池多晶硅片制绒方法 |
CN104218122B (zh) * | 2014-08-28 | 2016-08-17 | 奥特斯维能源(太仓)有限公司 | 一种降低金刚线切割的多晶硅反射率的制绒方法 |
CN105047764A (zh) * | 2015-09-01 | 2015-11-11 | 浙江晶科能源有限公司 | 一种硅片的制绒方法 |
CN105932078B (zh) * | 2016-01-15 | 2017-08-01 | 北京创世捷能机器人有限公司 | 一种金刚线切割的多晶硅片的制绒方法 |
CN107971933B (zh) * | 2016-10-21 | 2020-05-01 | 乐山新天源太阳能科技有限公司 | 一种多晶硅片表面金刚线切割损伤层的去除方法 |
CN106409983A (zh) * | 2016-11-30 | 2017-02-15 | 浙江晶科能源有限公司 | 一种金刚线切片的制绒方法 |
DE102017203977A1 (de) | 2017-03-10 | 2018-09-13 | Gebr. Schmid Gmbh | Verfahren zur Herstellung texturierter Wafer und Aufrausprühstrahlbehandlungsvorrichtung |
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