WO2012102112A1 - 電気又は電子機器用の発泡積層体 - Google Patents

電気又は電子機器用の発泡積層体 Download PDF

Info

Publication number
WO2012102112A1
WO2012102112A1 PCT/JP2012/050728 JP2012050728W WO2012102112A1 WO 2012102112 A1 WO2012102112 A1 WO 2012102112A1 JP 2012050728 W JP2012050728 W JP 2012050728W WO 2012102112 A1 WO2012102112 A1 WO 2012102112A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyolefin
foam
adhesive layer
sensitive adhesive
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/050728
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
逸大 畑中
奈緒美 渡邊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to KR1020137019524A priority Critical patent/KR101852221B1/ko
Priority to CN201280006280.6A priority patent/CN103328594B/zh
Priority to US13/981,380 priority patent/US20130302590A1/en
Publication of WO2012102112A1 publication Critical patent/WO2012102112A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/025—Copolymer of an unspecified olefine with a monomer other than an olefine
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/10—Homopolymers or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/14—Applications used for foams
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249982—With component specified as adhesive or bonding agent
    • Y10T428/249985—Composition of adhesive or bonding component specified

Definitions

  • the present invention relates to foam laminates for electrical or electronic devices. More specifically, an adhesive layer is provided on at least one side of the foam layer, and is used for electric and electronic devices (mobile phones, portable terminals, digital cameras, video movies, personal computers, liquid crystal televisions, other home appliances, etc.)
  • the present invention relates to a foam laminate suitably used as a gasket.
  • a resin layer on the surface of the foam in order to improve adhesion and sealability.
  • a foam laminate having a flexible layer and an adhesive layer formed on a foam has been proposed for the purpose of improving sealability (see Patent Documents 1 and 2).
  • a foam (see Patent Document 3) in which an easily water-soluble layer (such as a polyvinyl alcohol layer) is provided on the foam surface for the purpose of waterproofing improvement, or a polychloroprene-based adhesive A foam treated with a composition (see Patent Document 4) and the like have also been proposed.
  • an object of the present invention is to provide a foam laminate for electric or electronic equipment which is excellent in removability. Furthermore, another object of the present invention is to provide a foam laminate for electric or electronic equipment which is excellent in removability and dust resistance (especially dynamic dust resistance). Furthermore, another object of the present invention is to provide a foam laminate for electric or electronic equipment which is excellent in removability and heat resistance.
  • a foamed laminate having a polyolefin-based pressure-sensitive adhesive layer on at least one surface side of the foam layer is an acrylic sheet of the polyolefin-based pressure-sensitive adhesive layer. It has been found that excellent removability can be obtained if the peel force is within a specific range. Furthermore, it has been found that dust resistance (especially dynamic dust resistance) and heat resistance can be obtained together with excellent removability when the above-mentioned polyolefin-based pressure-sensitive adhesive layer is a polyolefin-based pressure-sensitive adhesive layer containing a specific polyolefin. The present invention has been completed based on these findings.
  • the foam laminate for electric or electronic device of the present invention has a polyolefin-based pressure-sensitive adhesive layer containing polyolefin on at least one surface side of the foam layer, and the 180 ° of the polyolefin-based pressure-sensitive adhesive layer with respect to the acrylic plate.
  • Peeling force tensile speed: 0.3 m / min
  • peeling force is characterized by being 0.1 N / 20 mm or more and 2.5 N / 20 mm or less.
  • the polyolefin-based pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer including polylefin A having a crystal melting energy of less than 50 J / g, or the polyolefin A and a crystal melting energy of 50 J /. It is preferable that the pressure-sensitive adhesive layer contains polyolefin B which is g or more, and the proportion of the polyolefin B is 3 to 30% by weight with respect to the total amount (100% by weight) of the polyolefin.
  • the polyolefin-based pressure-sensitive adhesive layer is preferably a hot melt pressure-sensitive adhesive layer having a melt viscosity at 200 ° C. of 1 to 30 Pa ⁇ s.
  • the apparent density of the foam layer is preferably 0.02 to 0.30 g / cm 3 .
  • the foam laminate of the present invention is excellent in removability because it has a polyolefin-based pressure-sensitive adhesive layer in which the 180 ° peel force with respect to an acrylic sheet is within a specific range. Furthermore, when the foamed laminate of the present invention has a polyolefin-based pressure-sensitive adhesive layer containing a specific polyolefin, it is excellent in removability, and is excellent in dust resistance (particularly dynamic dust resistance) and heat resistance.
  • FIG. 1 is a chart (DSC curve) obtained by differential scanning calorimetry (DSC measurement) of Example 3.
  • FIG. 2 is a schematic view showing an evaluation sample used in the dynamic dust resistance evaluation.
  • FIG. 3 is a schematic cross-sectional view of an evaluation container for evaluation of dynamic dustproofness in which a sample for evaluation is assembled.
  • FIG. 4 is a schematic view showing a test method of the dynamic dust resistance test.
  • Fig.5 (a) is a top view of the evaluation container (evaluation container for dynamic dust resistance evaluation) which assembled
  • FIG.5 (b) is the AA 'line cutting part of the evaluation container. It is an end elevation.
  • the foam laminate for electric or electronic device of the present invention is a foam laminate having a polyolefin-based pressure-sensitive adhesive layer on at least one surface side of the foam layer.
  • the polyolefin-based pressure-sensitive adhesive layer contains a polyolefin as an essential component.
  • the polyolefin-based pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer having a 180 ° peeling force (tension speed: 0.3 m / min) against an acrylic plate of 0.1 N / 20 mm or more and 2.5 N / 20 mm or less.
  • “180 ° peeling force (tensile speed: 0.3 m / min) with respect to acrylic plate” may be simply referred to as “peeling force with respect to acrylic plate (adhesive force with respect to acrylic plate)”.
  • a polyolefin-based pressure-sensitive adhesive layer having a peeling force with respect to an acrylic plate of 0.1 N / 20 mm to 2.5 N / 20 mm” may be referred to as a "specific polyolefin-based pressure-sensitive adhesive layer”.
  • the foam laminate for electric or electronic device of the present invention may be simply referred to as "the foam laminate of the present invention”.
  • the foam laminate of the present invention is not particularly limited, but preferably has a sheet-like or tape-like shape. Furthermore, the foamed laminate of the present invention may be processed to have a desired shape according to the used electric / electronic device, apparatus, case, part, etc. in use. In addition, the adhesive layer of the foam laminated body of this invention may be protected by the peeling film (separator) until use.
  • the foam laminate of the present invention is a laminate having a structure in which a specific polyolefin-based pressure-sensitive adhesive layer is laminated directly or via another layer on at least one surface side of a foam layer.
  • the foam laminate of the present invention has a structure in which a specific polyolefin-based pressure-sensitive adhesive layer is directly laminated on one side or both sides of a foam layer.
  • the foam laminate of the present invention may be a double-sided adhesive type having a specific polyolefin-based pressure-sensitive adhesive layer on both sides of the foam layer, or may be specific on only one side of the foam layer. It may be a single-sided adhesive type having a polyolefin-based pressure-sensitive adhesive layer.
  • both pressure-sensitive adhesive layers may be a specific polyolefin-based pressure-sensitive adhesive layer, or the pressure-sensitive adhesive layer on one side may be specific.
  • the type may be a polyolefin-based pressure-sensitive adhesive layer, and the other surface side may be another pressure-sensitive adhesive layer (for example, a known pressure-sensitive adhesive layer, a polyolefin-based pressure-sensitive adhesive layer other than a specific polyolefin-based pressure-sensitive adhesive layer).
  • another pressure-sensitive adhesive layer for example, a known pressure-sensitive adhesive layer, a polyolefin-based pressure-sensitive adhesive layer other than a specific polyolefin-based pressure-sensitive adhesive layer.
  • the specific polyolefin-based pressure-sensitive adhesive layer has a peeling force (peeling angle: 180 °, tensile speed: 0.3 m / min) against an acrylic plate of 0.1 N / 20 mm to 2.5 N / 20 mm, preferably It is 0.2 N / 20 mm or more and 2.3 N / 20 mm or less, more preferably 0.5 N / 20 mm or more and 2.0 N / 20 mm or less.
  • the crystal melting energy of the specific polyolefin-based pressure-sensitive adhesive layer is not particularly limited, but is preferably 50 J / g or less, more preferably 45 J / g or less, and even more preferably 40 J / g or less is there. If the above-mentioned crystal melting energy exceeds 50 J / g, the flexibility and slight adhesion of the pressure-sensitive adhesive layer will be impaired, and there is concern that dust resistance, in particular dynamic dust resistance (dust resistance under dynamic environment) may deteriorate. Ru.
  • the sample is melted by heating at a temperature rising rate of 10 ° C./min (first heating), and then it is cooled at ⁇ 50 ° C. by a temperature lowering rate of 10 ° C./min.
  • the sample is cooled down (first cooling), and differential scanning calorimetry is performed under the condition that the sample is heated from -50 ° C. by heating at a temperature rising rate of 10 ° C./min (second heating), The heat of fusion (J / g) determined at the time of the second heating.
  • requiring crystal melting energy is based on JISK7122 (the transfer heat measuring method of a plastics).
  • the specific polyolefin-based pressure-sensitive adhesive layer contains a polyolefin as an essential component.
  • the proportion of the polyolefin in the specific polyolefin-based pressure-sensitive adhesive layer is not particularly limited, but is 60% by weight or more (for example, 60 to 100% by weight) based on the total amount (100% by weight) of the polyolefin-based pressure-sensitive adhesive layer. Is more preferably 80% by weight or more (eg, 80 to 100% by weight).
  • polyolefin adhesive layer only 1 type of polyolefin may be contained in the said specific polyolefin adhesive layer, and 2 or more types of polyolefin may be combined and contained.
  • resins other than polyolefins, additives, and the like may be contained in the specific polyolefin-based pressure-sensitive adhesive layer as long as the effects of the present invention are not impaired.
  • the specific polyolefin-based pressure-sensitive adhesive layer preferably contains a polyolefin having a crystal melting energy of less than 50 J / g.
  • polyolefin A is a so-called amorphous polyolefin and has almost no crystal structure.
  • the specific polyolefin-based pressure-sensitive adhesive layer is preferably a polyolefin-based pressure-sensitive adhesive layer containing polyolefin A and having a peeling force of 0.1 N / 20 mm to 2.5 N / 20 mm with respect to the acrylic plate.
  • Polyolefin A is a polyolefin having a crystal melting energy of less than 50 J / g (eg, 5 J / g to 50 J / g), preferably, a crystal melting energy of less than 45 J / g (eg, 7 J / g to less than 45 J / g) It is the polyolefin which is, More preferably, it is polyolefin whose crystal melting energy is less than 40 J / g (for example, 10 J / g or more and less than 40 J / g).
  • the polyolefin A is not particularly limited.
  • low density polyethylene medium density polyethylene, high density polyethylene, linear low density polyethylene, polypropylene, copolymer of ethylene and propylene, ethylene and other ⁇ -olefins Copolymer, copolymer of propylene and other ⁇ -olefin, copolymer of ethylene and propylene and other ⁇ -olefin, copolymer of ethylene and other ethylenically unsaturated monomer, etc. It can be mentioned.
  • the polyolefin A may be a mixture of a homopolymer and a copolymer, or a mixture of a plurality of copolymers. When the polyolefin A is a copolymer, it may be a random copolymer or a block copolymer.
  • Examples of the ⁇ -olefin include 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 4-methyl-1-pentene, 4-methyl-1-hexene and the like.
  • 1-butene, 1-hexene, 1-octene and 4-methyl-1-pentene are preferable as the above-mentioned ⁇ -olefin.
  • said other ethylenically unsaturated monomer vinyl acetate, acrylic acid, acrylic acid ester, methacrylic acid, methacrylic acid ester, vinyl alcohol etc. are mentioned, for example.
  • the ⁇ -olefin and the other ethylenically unsaturated monomer may be used alone or in combination of two or more.
  • polyolefin A is a polypropylene-based resin such as polypropylene (propylene homopolymer), copolymer of ethylene and propylene, copolymer of propylene and other ⁇ -olefins from the viewpoint of heat resistance and flexibility. Is particularly preferred.
  • the density of the polyolefin A is not particularly limited, but is preferably 0.84 to 0.89 g / cm 3 , more preferably 0.85 to 0.89 g / cm 3 .
  • the density exceeds 0.89 g / cm 3 , there is a possibility that the flexibility and the slight adhesiveness of the resin may be impaired.
  • the density is less than 0.84 g / cm 3 , there is a possibility that the formability and the heat resistance may be reduced.
  • polyolefin A As a commercial item of polyolefin A, for example, trade name "Tough Selenium H5002" (Sumitomo Chemical Co., Ltd., polypropylene-based elastomer, crystal melting energy: 11.3 J / g, density: 0.86 g / cm 3 ), trade name "Notio PN20300 "(Mitsui Chemical Co., Ltd., polypropylene-based elastomer, crystal melting energy: 23.4 J / g, density: 0.868 g / cm 3 ), trade name” Lycosen PP1502 "(manufactured by Clariant, polypropylene-based wax, crystal melting energy : 26.0 J / g, density: 0.87 g / cm 3 ), trade name “Lycosene PP 1602” (manufactured by Clariant, polypropylene wax, crystal melting energy: 26.9 J / g, density: 0.87 g / cm 3
  • the proportion of the polyolefin A is not particularly limited, but 70% by weight or more based on the total amount (100% by weight) of the polyolefin contained in the specific polyolefin-based pressure-sensitive adhesive layer (Eg, 70 to 100% by weight) is preferable, more preferably 75% by weight (eg, 75 to 100% by weight). If the proportion of the polyolefin A is less than 70% by weight, it may be difficult to obtain good flexibility and slight tackiness while obtaining sufficient removability in the polyolefin-based pressure-sensitive adhesive layer.
  • the polyolefin (polyolefin B) whose crystal melting energy is 50 J / g or more is also contained in the said specific polyolefin adhesive layer with the polyolefin A.
  • the polyolefin-based pressure-sensitive adhesive layer when polyolefin B is contained relative to the polyolefin A, heat resistance is easily exhibited in addition to the above-mentioned properties such as removability.
  • the above-mentioned "polyolefin having a crystal melting energy of 50 J / g or more" may be referred to as "polyolefin B".
  • Polyolefin B is a so-called crystalline polyolefin and contains many crystal structures.
  • the specific polyolefin-based pressure-sensitive adhesive layer may contain only one type of polyolefin B, or may contain two or more types of polyolefin B.
  • the specific polyolefin-based pressure-sensitive adhesive layer is preferably a polyolefin-based pressure-sensitive adhesive layer containing polyolefin A and polyolefin B.
  • the polyolefin B is not particularly limited.
  • low density polyethylene medium density polyethylene, high density polyethylene, linear low density polyethylene, polypropylene, copolymer of ethylene and propylene, ethylene and other ⁇ -olefins Copolymer, copolymer of propylene and other ⁇ -olefin, copolymer of ethylene and propylene and other ⁇ -olefin, copolymer of ethylene and other ethylenically unsaturated monomer, etc. It can be mentioned.
  • the polyolefin B may be a mixture of a homopolymer and a copolymer, or a mixture of a plurality of copolymers. When the polyolefin B is a copolymer, it may be a random copolymer or a block copolymer.
  • Examples of the ⁇ -olefin include 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 4-methyl-1-pentene, 4-methyl-1-hexene and the like.
  • 1-butene, 1-hexene, 1-octene and 4-methyl-1-pentene are preferable as the above-mentioned ⁇ -olefin.
  • said other ethylenically unsaturated monomer vinyl acetate, acrylic acid, acrylic acid ester, methacrylic acid, methacrylic acid ester, vinyl alcohol etc. are mentioned, for example.
  • the ⁇ -olefin and the other ethylenically unsaturated monomer may be used alone or in combination of two or more.
  • Polyolefin B is particularly preferably a polypropylene resin such as polypropylene (propylene homopolymer), a copolymer of ethylene and propylene, and a copolymer of propylene and the other ⁇ -olefin from the viewpoint of heat resistance.
  • polypropylene resin such as polypropylene (propylene homopolymer), a copolymer of ethylene and propylene, and a copolymer of propylene and the other ⁇ -olefin from the viewpoint of heat resistance.
  • the density of the polyolefin B is not particularly limited, but is preferably 0.90 to 0.91 g / cm 3 . If the density is less than 0.90 g / cm 3 , the heat resistance may be reduced. In addition, polyolefin B whose density exceeds 0.91 g / cm 3 is difficult to obtain.
  • polyolefin B As a commercial item of polyolefin B, for example, trade name "High wax NP055" (made by Mitsui Chemicals, Inc., polypropylene wax, crystal melting energy: 89.1 J / g, density: 0.90 g / cm 3 ), etc. may be mentioned .
  • the proportion of the polyolefin B is not particularly limited, but the total amount (100% by weight) of the polyolefin contained in the specific polyolefin-based pressure-sensitive adhesive layer On the other hand, 3 to 30% by weight is preferable, more preferably 4 to 28% by weight, and still more preferably 5 to 25% by weight.
  • the proportion of the polyolefin B exceeds 30% by weight, the polyolefin-based pressure-sensitive adhesive layer becomes too hard, and the flexibility and slight adhesion of the foam laminate are impaired, and the dust resistance of the foam laminate (especially dynamic dust resistance) And the polyolefin-based pressure-sensitive adhesive layer may become brittle.
  • the proportion of the polyolefin B is less than 3% by weight, sufficient heat resistance may not be obtained in the polyolefin-based pressure-sensitive adhesive layer.
  • the specific polyolefin-based pressure-sensitive adhesive layer has a peeling force of 0.1 N / 20 mm or more and 2.5 N / 20 mm or less with respect to the acrylic plate, contains polyolefin A and polyolefin B, and the ratio of polyolefin B is specific
  • the polyolefin-based pressure-sensitive adhesive layer is preferably 3 to 30% by weight based on the total amount (100% by weight) of the polyolefin-based pressure-sensitive adhesive layer.
  • the above-mentioned specific polyolefin-based pressure-sensitive adhesive layer does not impair the effects of the present invention, and the tackifier (tackifying resin), the antioxidant, the antiaging agent, the plasticizer, the colorant, the filler, and the like Additives such as resins (resins other than polyolefin A and polyolefin B) may be included. In addition, an additive may be used individually or in combination of 2 or more types.
  • the specific polyolefin-based pressure-sensitive adhesive layer preferably contains a tackifier (a tackifying resin).
  • a tackifier a tackifying resin
  • the adhesion of the pressure-sensitive adhesive layer can be improved, and for example, the anti-slip property and the dust resistance of the foam laminate of the present invention can be improved.
  • the tackifier may be used alone or in combination of two or more.
  • the tackifier is a resin having a softening point (according to JIS K 2207) of 70 to 180 ° C., more preferably a resin having a softening point of 80 to 160 ° C., still more preferably, a softening point Is a resin having a temperature of 90 to 150.degree.
  • a softening point is too high, the removability may be reduced, and the resin flexibility and the slight adhesiveness may be reduced. On the other hand, if the softening point is too low, the heat resistance may be lowered.
  • the tackifier is not particularly limited as long as it has the above-mentioned softening point, but, for example, aliphatic petroleum resin, fully hydrogenated aliphatic petroleum resin, partially hydrogenated aliphatic petroleum resin, aromatic petroleum The resin, a fully hydrogenated aromatic petroleum resin, a partially hydrogenated aromatic petroleum resin, etc. may be mentioned.
  • the content of the tackifier in the specific polyolefin-based pressure-sensitive adhesive layer is not particularly limited, but if the content of the tackifier is too large, removability may be lost, while the content of the tackifier If the amount is too small, the expected effect (for example, further improvement of the dust resistance) may not be obtained due to the tackifier being contained.
  • the content of the tackifier in the polyolefin-based pressure-sensitive adhesive layer is 100 parts by weight of the polyolefin (100 parts by weight of the total amount of the polyolefin A and the polyolefin B when the polyolefin A and the polyolefin B are contained)
  • the amount is preferably 25 parts by weight or less (eg, 1 to 25 parts by weight), and more preferably 20 parts by weight or less (eg, 3 to 20 parts by weight).
  • the foam laminate of the present invention has the above-mentioned specific pressure-sensitive adhesive layer (in particular, the above-mentioned polyolefin-based pressure-sensitive adhesive layer) on at least one surface side of the foam layer, but the thickness of the above-mentioned specific pressure-sensitive adhesive layer
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably 1 to 50 ⁇ m, and more preferably 2 to 40 ⁇ m. If the thickness is less than 1 ⁇ m, sufficient adhesion may not be obtained. If the thickness exceeds 50 ⁇ m, the flexibility of the foam laminate may be reduced.
  • the specific pressure-sensitive adhesive layer may have a single-layer structure or a laminated structure.
  • the foam laminate of the present invention has a foam layer. For this reason, the foam laminate of the present invention is excellent in flexibility and shock absorption.
  • the foam layer is formed by foaming and molding the resin composition.
  • the resin composition is a composition obtained by mixing a resin as a raw material and an additive or the like added as needed.
  • the foam layer has a cell structure.
  • the cell structure is not particularly limited, but is a closed cell structure, a semicontinuous semi-closed cell structure (a cell structure in which a closed cell structure and an open cell structure are mixed, and the ratio of the closed cell structure and the open cell structure is There is no particular limitation) and any open cell structure may be used.
  • the foam layer preferably has a cell structure of an open cell structure or a semi-continuous semi-closed cell structure from the viewpoint of obtaining better flexibility.
  • a semi-continuous semi-closed cell structure the cell structure where the closed cell structure part in a cell structure is 40% (volume%) or less (preferably 30% (volume%) or less) is mentioned, for example.
  • the density (apparent density) of the foam layer can be appropriately set according to the purpose of use, etc., but is preferably 0.02 to 0.20 g / cm 3 , more preferably 0.03 to 0 a .17g / cm 3, even more preferably 0.04 ⁇ 0.15g / cm 3. If the density of the foam layer exceeds 0.20 g / cm 3 , foaming may be insufficient and the flexibility may be impaired. On the other hand, if it is less than 0.02 g / cm 3 , the strength of the foam layer may be significantly reduced, which is not preferable.
  • the density of the foam layer is determined as follows.
  • the foam layer is punched with a 40 mm ⁇ 40 mm punching blade, and the dimensions (height and width) of the punched sample are measured. Further, the thickness of the sample is measured with a 1/100 dial gauge having a diameter ( ⁇ ) of 20 mm of the measurement terminal.
  • the volume of the sample is calculated from the dimensions of the sample and the thickness of the sample.
  • the weight of the above sample is measured by a balance with a minimum scale of 0.01 g or more.
  • the density (g / cm 3 ) of the foam layer is calculated from the volume of the sample and the value of the weight of the sample.
  • the thickness of the foam layer is not particularly limited, but, for example, from the viewpoint of dustproof performance and impact absorption, and also from the viewpoint of applicability to electronic or electrical devices having a shape such as thin, small and narrow. 1 mm to 5 mm is preferable, more preferably 0.2 mm to 3 mm.
  • the foam layer is made of a resin.
  • the resin constituting the foam layer is thermoplastic and is not particularly limited as long as it is a resin that can be impregnated with a gas (gas that forms bubbles), but a thermoplastic resin is preferable.
  • the said foam layer may be comprised only by 1 type of resin, and may be comprised with 2 or more types of resin.
  • thermoplastic resin examples include low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, polypropylene, copolymers of ethylene and propylene, ethylene or propylene and other ⁇ -olefins (for example, Copolymers with butene-1, pentene-1, hexene-1, 4-methylpentene-1, etc.), ethylene and other ethylenically unsaturated monomers (eg vinyl acetate, acrylic acid, acrylic esters, Polyolefin resins such as copolymers with methacrylic acid, methacrylic esters, vinyl alcohol etc.); Styrene resins such as polystyrene, acrylonitrile-butadiene-styrene copolymer (ABS resin); 6-nylon, 66-nylon, 12-Polyamide resin such as nylon; Polyamide Polyurethane; polyimide; polyether imide; acrylic resin such as polymethyl methacrylate; polyvinyl chloride; polyviny
  • thermoplastic resin when a thermoplastic resin is a copolymer, the copolymer of any form of a random copolymer and a block copolymer may be sufficient.
  • a thermoplastic resin is used individually or in combination of 2 or more types.
  • the polyolefin resin is preferably a resin having a broad molecular weight distribution and having a shoulder on the high molecular weight side, a slightly crosslinked resin (a slightly crosslinked resin), a long chain branched resin, or the like.
  • thermoplastic resin also includes a thermoplastic elastomer (for example, the following thermoplastic elastomer).
  • a thermoplastic elastomer When a thermoplastic elastomer is contained as a resin constituting the foam layer, the thermoplastic elastomer has a glass transition temperature of room temperature or less (eg, 20 ° C. or less), so the flexibility and shape conformity of the foam layer are It becomes remarkably excellent.
  • thermoplastic elastomer examples include, but are not limited to, natural or synthetic rubbers such as natural rubber, polyisobutylene, polyisoprene, chloroprene rubber, butyl rubber and nitrile butyl rubber; ethylene-propylene copolymer, ethylene-propylene-diene copolymer Olefin-based elastomers such as polymers, ethylene-vinyl acetate copolymer, polybutene and chlorinated polyethylene; styrene-butadiene-styrene copolymers such as styrene-butadiene-styrene copolymer, styrene-isoprene-styrene copolymer, and hydrogenated products thereof Elastomers; polyester elastomers; polyamide elastomers; various thermoplastic elastomers such as polyurethane elastomers and the like. In addition, a thermoplastic elasto
  • the thermoplastic elastomer is preferably the olefin-based elastomer.
  • the olefin-based elastomer has a structure in which an olefin-based resin component such as polyethylene or polypropylene and an olefin-based rubber component such as ethylene-propylene rubber or ethylene-propylene-diene rubber are microphase-separated.
  • the olefin elastomer may be of a type in which each component is physically dispersed or a type thermally treated in the presence of a crosslinking agent.
  • the olefin elastomer has good compatibility with the polyolefin resin exemplified as the thermoplastic resin.
  • the foam layer is preferably composed of the thermoplastic resin (the thermoplastic resin excluding the thermoplastic elastomer) and the thermoplastic elastomer.
  • the ratio of the thermoplastic resin (the thermoplastic resin excluding the thermoplastic elastomer) and the thermoplastic elastomer is not particularly limited, but if the ratio of the thermoplastic elastomer is too small, the cushioning property of the foam layer is On the other hand, if the proportion of the thermoplastic elastomer is too large, outgassing tends to occur at the time of formation of the cell structure, and a highly foamed cell structure may not be obtained in the foam layer.
  • the foam layer is composed of the polyolefin resin (the polyolefin resin excluding the olefin elastomer) such as polypropylene and the olefin elastomer
  • the polyolefin resin and the olefin resin The ratio (by weight) to the elastomer is preferably 1/99 to 99/1, more preferably 10/90 to 90/10, and still more preferably 20/80 to 80/20 in the former / the latter.
  • the melt flow rate (MFR) of the resin composition constituting the foam layer is preferably 0.1 to 30 g / 10 min, and more preferably 0.2 to 15 g / 10 min. Particularly preferred is 0.3 to 10 g / 10 min.
  • MFR indicates a measured value at “230 ° C., 98 N” unless otherwise noted.
  • the foam layer may contain various additives as needed.
  • the additive is not particularly limited, but, for example, a cell nucleating agent (particles described later, etc.), a crystal nucleating agent, a plasticizer, a lubricant, a coloring agent (pigment, dye etc.), an ultraviolet absorber, an antioxidant, an antiaging agent Agents, fillers, reinforcing agents, antistatic agents, surfactants, tension modifiers, shrinkage inhibitors, flowability modifiers, clays, vulcanizing agents, surface treatment agents, flame retardants Flame retardants, flame retardants of various forms other than powdery, etc. may be mentioned.
  • the amount of the additive is suitably selected in the range which does not impair formation of a bubble etc.
  • the foam layer preferably contains particles. Since the particles can exhibit the function as a cell nucleating agent (foaming nucleating agent) at the time of foam molding of the resin composition, when the resin composition contains the particles, the cells in the foam layer in a good foam state.
  • the structure is obtained.
  • particles include talc, silica, alumina, zeolite, calcium carbonate, magnesium carbonate, barium sulfate, zinc oxide, titanium oxide, aluminum hydroxide, magnesium hydroxide, mica, clay such as montmorillonite, carbon particles, glass fiber And carbon tubes.
  • grains are used individually or in combination of 2 or more types.
  • particles having an average particle diameter (particle diameter) of 0.1 to 20 ⁇ m are particularly preferable.
  • the average particle size of the particles is less than 0.1 ⁇ m, the particles may not function sufficiently as a nucleating agent.
  • the particle size is more than 20 ⁇ m, outgassing may occur during foam molding.
  • the content of particles in the foam layer is not particularly limited, but for example, in the resin composition, 0.1 to 150 parts by weight is preferable, and more preferably 1 to 130 parts by weight with respect to 100 parts by weight of the total resin. And more preferably 2 to 50 parts by weight. If the amount is less than 0.1 parts by weight, the function as a cell nucleating agent can not be sufficiently exhibited at the time of foam molding of the resin composition, and a uniform cell structure may not be obtained in the foam layer. If the amount is more than 10 parts by weight, the viscosity of the resin composition may be significantly increased, and outgassing may occur at the time of foam formation to impair the foam characteristics, and a highly foamed cell structure may not be obtained.
  • the foam layer preferably contains a flame retardant (powdery flame retardant, flame retardant of various forms other than powdery, etc.).
  • a flame retardant pellets, flame retardant of various forms other than powdery, etc.
  • the foam laminate of the present invention is often used for applications in which imparting of flame retardance such as electrical or electronic device applications is essential, but the foam layer is made of a thermoplastic resin, so it is easy to burn It is because it has the characteristic of.
  • the powdery flame retardant is preferably an inorganic flame retardant.
  • the inorganic flame retardant include bromine-based flame retardants, chlorine-based flame retardants, phosphorus-based flame retardants, antimony-based flame retardants, and non-halogen-non-antimony-based inorganic flame retardants.
  • chlorine-based flame retardants and bromine-based flame retardants generate gas components that are harmful to the human body during combustion and corrosive to equipment, and phosphorus-based flame retardants and antimony-based flame retardants There are problems such as harmfulness and explosiveness. Therefore, the above-mentioned inorganic flame retardant is preferably a non-halogen-non-antimony inorganic flame retardant.
  • non-halogen-non-antimony inorganic flame retardants include hydrated metal compounds such as aluminum hydroxide, magnesium hydroxide, hydrates of magnesium oxide and nickel oxide, and hydrates of magnesium oxide and zinc oxide. .
  • the hydrated metal oxide may be surface treated.
  • a powdery flame retardant is used individually or in combination of 2 or more types.
  • the content of the flame retardant in the foam layer is not particularly limited, but if the amount is too small, the flame retarding effect may not be obtained, and if too large, it is difficult to obtain a highly foamed cell structure. May be
  • the content of the powdery flame retardant in the resin composition is preferably 5 to 130 parts by weight, more preferably 10 to 120 parts by weight with respect to 100 parts by weight of the total amount of resin.
  • the powdered flame retardant may function as a cell nucleating agent.
  • the foam layer is also used as a foam nucleating agent, since it contains both a foam nucleating agent and a flame retardant, from the viewpoint of achieving both sufficient flame retardancy and high foam cell structure.
  • the foam layer is formed by foam-molding a resin composition which is a composition obtained by mixing a resin as a raw material and an additive etc. added as necessary.
  • the foaming method to be used when the resin composition is subjected to foam molding is not particularly limited.
  • a physical method low boiling point liquid (foaming agent) is dispersed in the resin composition, and then heating to volatilize the foaming agent
  • a method of forming air bubbles thereby, a chemical method (a method of forming air bubbles by a gas generated by thermal decomposition of a compound (foaming agent) added to a resin composition) may be mentioned.
  • a physical foaming method is preferable as the foaming method used when the resin composition is foam-molded, and in particular, from the viewpoint that a cell structure having a small cell diameter and a high cell density can be easily obtained, a high pressure foaming agent is used. Physical foaming methods using gases are more preferred.
  • the gas as the blowing agent is more preferably an inert gas which is an inert gas to the resin in the resin composition. That is, the foam layer is preferably formed by foaming and molding the resin composition by a physical foaming method using a high pressure inert gas as a foaming agent.
  • the inert gas is not particularly limited as long as it is inert to and can be impregnated into the resin constituting the foam layer, and examples thereof include carbon dioxide, nitrogen gas, air and the like.
  • the inert gas is preferably carbon dioxide from the viewpoint of a large amount of impregnation into the resin and a high impregnation rate.
  • the inert gas may be a mixed gas.
  • the high-pressure gas (in particular, an inert gas, further carbon dioxide) is preferably a gas in a supercritical state.
  • the solubility of gas in the resin is increased, and high concentration mixing is possible.
  • the generation of cell nuclei increases, and the density of the cells formed by the growth of cell nuclei is the porosity. Even if it is the same, since it becomes large, fine bubbles can be obtained.
  • the critical temperature of carbon dioxide is 31 ° C.
  • the critical pressure is 7.4 MPa.
  • the physical foaming method using a high pressure gas as the foaming agent is preferably a method in which the resin composition is impregnated with a high pressure gas and then subjected to a pressure reduction step to foam, specifically, it is not composed of the resin composition.
  • a method in which a foamed molded product is impregnated with a high pressure gas and then decompressed through a step of foaming, or a method in which a molten resin composition is impregnated with a gas under pressure and then subjected to molding under reduced pressure and foaming And the like are more preferable.
  • the foam layer is formed by molding the resin composition into an appropriate shape such as a sheet to obtain a non-foamed resin molded product (non-foamed molded product), and then high pressure is applied to the non-foamed resin molded product. It may be obtained by a batch method in which gas is impregnated and foaming is released by releasing the pressure, and the resin composition is kneaded with a high pressure gas under pressure, molded at the same time with release of pressure, and molded and foamed simultaneously It may be obtained in a continuous manner.
  • the method of forming the non-foamed resin molded product is not particularly limited.
  • a method of molding the resin composition using an extruder such as a single screw extruder or a twin screw extruder; resin composition To knead the material uniformly using a kneader equipped with blades such as rollers, cams, kneaders and banbury types, and press-mold it to a predetermined thickness using a hot plate press; resin composition
  • the shape of the non-foamed resin molded body is not particularly limited, and examples thereof include a sheet, a roll, and a plate.
  • a resin composition is shape
  • a non-foamed resin molded product is placed in a pressure container, and a high pressure gas is injected (introduced) to impregnate the non-foamed resin molded product with a high pressure gas.
  • a high pressure gas is injected (introduced) to impregnate the non-foamed resin molded product with a high pressure gas.
  • pressure is released (usually up to atmospheric pressure) at the time of impregnation, bubbles are formed through a depressurization process to generate cell nuclei in the resin.
  • a high pressure gas is injected (introduced) while kneading the resin composition using an extruder (for example, a single screw extruder, a twin screw extruder, etc.) or an injection molding machine.
  • the resin composition is impregnated with a high pressure gas into the resin composition, and the pressure is released by extruding the resin composition through a die or the like provided at the tip of the extruder (usually up to atmospheric pressure) to simultaneously form and foam.
  • the resin composition is foam-molded by the molding pressure reduction step to be performed.
  • a heating step may be provided to grow bubble nuclei by heating.
  • you may make a bubble nucleus grow at room temperature, without providing a heating process.
  • the introduction of the high pressure gas may be continuous or discontinuous.
  • the method of heating at the time of growing the cell nuclei is not particularly limited, and known or commonly used methods such as water bath, oil bath, heat roll, hot air oven, far infrared, near infrared, microwave and the like can be mentioned.
  • the mixing amount of the gas is not particularly limited, but is, for example, 2 to 10% by weight with respect to the total amount of resin in the resin composition.
  • the pressure for impregnating the gas in the batch type gas impregnation step and the continuous type kneading and impregnation step is appropriately selected in consideration of the type of gas, operability, etc.
  • inert gas as gas In particular, when carbon dioxide is used, 6 MPa or more (for example, 6 to 100 MPa) is preferable, and more preferably 8 MPa or more (for example, 8 to 100 MPa).
  • the pressure of the gas is lower than 6 MPa, the bubble growth at the time of foaming is remarkable and the bubble diameter becomes too large, for example, the disadvantage such as the reduction of the dustproof effect tends to occur, which is not preferable.
  • the temperature (impregnation temperature) at which the gas is impregnated in the gas impregnation step in the batch method and the kneading and impregnation step in the continuous method varies depending on the type of gas and resin used, and can be selected within a wide range. In consideration of the like, 10 to 350 ° C. is preferable. More specifically, the impregnation temperature in batch mode is preferably 10 to 250 ° C., more preferably 40 to 240 ° C., and still more preferably 60 to 230 ° C. In the continuous system, the impregnation temperature is preferably 60 to 350 ° C., more preferably 100 to 320 ° C., and still more preferably 150 to 300 ° C. When carbon dioxide is used as the high pressure gas, the temperature at the time of impregnation (impregnation temperature) is preferably 32 ° C. or more (particularly 40 ° C. or more) in order to maintain the supercritical state.
  • the pressure reduction rate in the pressure reduction step is not particularly limited, but is preferably 5 to 300 MPa / second in order to obtain uniform fine bubbles.
  • the heating temperature in the heating step is, for example, preferably 40 to 250 ° C., more preferably 60 to 250 ° C.
  • a high foaming cell structure can be obtained, and the thickness of the foam layer can be further increased.
  • a foam layer having a thickness of 0.50 to 5.00 mm can be obtained.
  • the thickness of the foam layer is not particularly limited, but is preferably 0.1 mm to 5 mm, and more preferably 0.2 mm to 3 mm. If the thickness is less than 0.1 mm, it may lead to a reduction in the dustproof performance and the cushioning performance of the foam laminate. On the other hand, if the thickness exceeds 5 mm, the shape such as thin, small and narrow It becomes difficult to apply the foam laminate to electronic or electrical devices that it has.
  • the thickness of the foam layer may be adjusted by slicing it to a desired thickness after obtaining a foam layer having a thickness in advance.
  • relative density density after foaming / density in unfoamed state (for example, resin composition)
  • density of the unfoamed molded product is preferably 0.02 to 0.30, and more preferably 0.03 to 0.25. If the relative density exceeds 0.30, foaming may be insufficient, which may result in a decrease in the flexibility of the foam layer. If the relative density is less than 0.02, the strength of the foam layer may be significantly reduced, which is not preferable.
  • the foam structure, density, and relative density of the foam layer depend on the method and conditions for foaming the resin composition according to the type of the resin forming the foam layer (for example, the type of the foaming agent or the like). Adjustment is made by selecting the amount, temperature, pressure, time, etc. at the time of foaming. For example, a polyolefin-based resin foam layer having a density of 0.02 ⁇ 0.20g / cm 3 (the apparent density) in the physical foaming process using a high-pressure gas as the foaming agent, 0.99 ° C.
  • a resin composition with a gas (preferably an inert gas, more preferably carbon dioxide) as a foaming agent under a pressure of 10 MPa to 30 MPa in a temperature atmosphere of 190 ° C.
  • a gas preferably an inert gas, more preferably carbon dioxide
  • the foam laminate of the present invention may have other layers in addition to the above-mentioned specific polyolefin pressure-sensitive adhesive layer and foam layer.
  • layers for example, an intermediate layer provided between a foam layer and a specific polyolefin-based pressure-sensitive adhesive layer (for example, an undercoat layer for improving adhesion, a base material layer acting as a core material (for example, a film) Layers, non-woven layers, etc.) and pressure-sensitive adhesive layers (other pressure-sensitive adhesive layers) other than the above-mentioned specific polyolefin-based pressure-sensitive adhesive layer.
  • the method for producing the foam laminate of the present invention is not particularly limited.
  • the foam laminate is produced by providing a specific polyolefin-based pressure-sensitive adhesive layer on one side or both sides of the foam layer.
  • a foam laminate having a specific polyolefin-based pressure-sensitive adhesive layer on at least one side of the foam layer is obtained by applying and curing a polyolefin-based pressure-sensitive adhesive composition on at least one side of the foam layer. It is produced by forming a layer.
  • the polyolefin-based pressure-sensitive adhesive composition is a composition for forming a specific polyolefin-based pressure-sensitive adhesive layer, and also includes a composition for forming a pressure-sensitive adhesive.
  • the specific polyolefin-based pressure-sensitive adhesive composition can be obtained by mixing raw materials such as polyolefins such as polyolefin A and polyolefin B, and additives added as needed. In addition, when mixing a raw material, heat may be added.
  • the melt viscosity of the above-mentioned polyolefin-based pressure-sensitive adhesive composition is not particularly limited, but from the viewpoint of achieving high-precision application properties such as accurate application on a foam layer to form an adhesive layer, for example, at 200 ° C.
  • the melt viscosity is preferably 1 to 30 Pa ⁇ s, more preferably 2 to 20 Pa ⁇ s. If it exceeds 30 Pa ⁇ s, the viscosity may be high and it may be difficult to apply uniformly.
  • the melt viscosity of the polyolefin-based pressure-sensitive adhesive composition is also the melt viscosity of the polyolefin-based pressure-sensitive adhesive layer.
  • the above-mentioned specific polyolefin-based pressure-sensitive adhesive layer is a hot-melt pressure-sensitive adhesive layer (a hot-melt type, a pressure-sensitive adhesive layer formed by heating and melting a solid pressure-sensitive adhesive composition at normal temperature and applying it; It is preferable that it is a hot melt pressure-sensitive adhesive layer having a melt viscosity at 200 ° C. of 1 to 30 Pa ⁇ s.
  • the thickness of the foam laminate of the present invention is not particularly limited, but is preferably 0.1 mm to 5 mm, more preferably 0 in terms of application to an electronic or electrical device having a shape such as thin, small or narrow. 2 mm to 3 mm.
  • the foam laminate of the present invention preferably has good heat resistance evaluated by the following heat resistance evaluation method.
  • the adhesive layer in the foam laminate incorporated inside melts and protrudes outside the foam laminate during use of the electric / electronic device, for example, the electrical / electronic device And may adversely affect the visibility of the display portion of the electric / electronic device.
  • Evaluation method of heat resistance A sample compressed in the thickness direction so as to have a thickness of 50% before compression is stored for 72 hours in a temperature atmosphere of 60 ° C., and the pressure-sensitive adhesive layer protrudes to the outside of the foam laminate. Check visually to see if it is. And the case where the protrusion of the adhesive layer is not generated is evaluated as good, and the case where the protrusion of the adhesive layer is generated is evaluated as the defect.
  • the foam laminate of the present invention has a specific polyolefin-based pressure-sensitive adhesive layer, and thus has good removability.
  • the term "removability" refers to a foam laminate such as breakage of a foam layer when the foam laminate attached to the adherend in a form in which a specific polyolefin-based pressure-sensitive adhesive layer is in contact is peeled off from the adherend It is a property that can be easily peeled off without any damage to the surface and contamination of the adherend.
  • the foam laminate of the present invention is excellent in removability, it is possible to promote recycling and resource saving of members.
  • the foam laminate of the present invention has a specific polyolefin-based pressure-sensitive adhesive layer containing polyolefin A as a pressure-sensitive adhesive layer, in addition to the removability, it is excellent in flexibility and fine adhesion. For this reason, when the foam laminate of the present invention has a specific polyolefin-based pressure-sensitive adhesive layer containing polyolefin A, it is excellent in dust resistance, particularly in dynamic dust resistance (dust resistance in a dynamic environment).
  • the foam laminate of the present invention exerts heat resistance in addition to the above when it has a specific polyolefin-based pressure-sensitive adhesive layer containing polyolefin A and polyolefin B as a pressure-sensitive adhesive layer.
  • the foam laminate of the present invention is excellent in dimensional stability (characteristic that the dimensional change is small even if the temperature or time changes) if the heat resistance is good.
  • the foam laminate of the present invention is often incorporated into the interior of electric and electronic devices, and a temperature atmosphere of 60 to 100 ° C. is assumed inside electric and electronic devices by using electric and electronic devices. If the heat resistance is good, the performance does not deteriorate or deteriorate under the temperature atmosphere.
  • the foam laminate of the present invention exerts low staining properties in addition to the above as long as it has a specific polyolefin-based pressure-sensitive adhesive layer containing a polyolefin obtained by polymerization catalyzed by a metallocene as the pressure-sensitive adhesive layer. Do.
  • the foam laminate of the present invention is low in stain resistance, for example, during rework in disassembling an electrical or electronic device incorporating the foam laminate or when incorporating the foam laminate into an electrical or electronic device, When the body is peeled off from the resin surface or metal surface of the device housing, the glass surface of the image display unit, etc., contamination of the resin surface or metal surface of the device housing, the glass surface of the image display unit, etc. does not occur easily.
  • the foam laminate of the present invention has low contamination, when the foam laminate is incorporated into an electric or electronic device, and parts, members, and cases constituting the electric or electronic device. It is advantageous to the recycling of
  • the foam laminate of the present invention is preferably used, for example, in mobile phones, mobile terminals, digital cameras, video movies, personal computers, liquid crystal televisions, and other home appliances. More specifically, the foam laminate of the present invention is preferably used as a gasket when used in attaching (mounting) various members or parts constituting an electric or electronic device in an electric or electronic device. Used.
  • the various members or parts constituting the electric or electronic device that can be attached (mounted) using the foam laminate of the present invention are not particularly limited, but, for example, a liquid crystal display, an electroluminescence display, a plasma display, etc.
  • the image display member (especially, a small image display member) attached to the image display device of the present invention, the camera or lens attached to a device of mobile communication such as a so-called "mobile phone” or “portable information terminal” Examples include optical members such as small-sized cameras and lenses, or optical components.
  • the foam laminate of the present invention can provide electric or electronic devices including foam laminates for electric or electronic devices.
  • the electric or electronic device has a configuration in which a member or part for electric or electronic device is attached (mounted) to a predetermined site via the foam laminate for the electric or electronic device. .
  • Examples of the electric or electronic devices include image display devices such as liquid crystal displays as electrooptical members or components, electroluminescence displays, plasma displays (in particular, image display devices in which small image display members are attached as optical members) Or a camera or lens (in particular, a small camera or lens) attached via the foam laminate for the above electric or electronic device (for example, so-called “portable” Mobile communication devices such as “telephone” and “portable information terminal”.
  • image display devices such as liquid crystal displays as electrooptical members or components, electroluminescence displays, plasma displays (in particular, image display devices in which small image display members are attached as optical members)
  • a camera or lens in particular, a small camera or lens attached via the foam laminate for the above electric or electronic device
  • Such electric or electronic devices may be thinner products than conventional products, and the thickness, shape, etc. thereof are not particularly limited.
  • the mixture was extruded in the form of a strand, cooled with water, and formed into a pellet.
  • the pellet had a softening point of 155 ° C.
  • the pellets were charged into a single-screw extruder manufactured by Japan Steel Works (JSW), and carbon dioxide gas was injected at a pressure of 22 (19 after injection) MPa while kneading under an atmosphere of 220 ° C. After sufficiently saturating the carbon dioxide gas, it was cooled to a temperature suitable for foaming, and then extruded from a die to obtain a foam having a semicontinuous semi-independent structure.
  • JSW Japan Steel Works
  • the foam had a sheet-like shape, a density of 0.05 g / cm 3 and a thickness of 2.0 mm. And this foam was sliced and the 0.5-mm-thick foam layer (foam layer A) (sheet-like foam) was obtained.
  • Examples 1 to 9 The materials of the respective examples shown in Table 1 below are put into a Labo Plastomill (kneading extruder) manufactured by Toyo Seiki Seisakusho Co., Ltd., and the mixture is kneaded for 5 minutes under the conditions of rotational speed: 30 rpm and temperature: 140 ° C. The mixture was heated to 200 ° C. and kneaded for 10 minutes to obtain the pressure-sensitive adhesive composition of each example. Next, using the coating machine (apparatus name “GPD-300, Yuri Roll Machinery Co., Ltd.), melt the pressure-sensitive adhesive composition at a temperature of 200 ° C. and 30 ⁇ m on the foam layer A. It coated by thickness and produced the foaming laminated body of each Example.
  • the foam laminate has a sheet-like shape and has a layer structure of foam layer / pressure-sensitive adhesive layer.
  • “Tough Selenium H5002” is a propylene-based elastomer (trade name “Tough Selenium H5002”, manufactured by Sumitomo Chemical Co., Ltd., crystal melting energy: 11.3 J / g)
  • “Lycosene PP1602” is a polypropylene-based wax (trade name “Lycosen PP 1602”, manufactured by Clariant, crystal melting energy: 26.9 J / g)
  • “Lycosen PP 2602” is a polypropylene-based wax (trade name “Lycosene PP 2602”, manufactured by Clariant, crystal melting energy: 39.8 J / g)
  • “High wax NP055” is a polypropylene-based wax (trade name “high wax NP055”, manufactured by Mitsui Chemicals, Inc., crystal melting energy: 87.2 J / g)
  • “Alcon P125” is hydrogenated petroleum Resin (brand name "Alcon
  • Crystal melting energy of adhesive layer The adhesive layer of the foam laminate was sampled at 3.0 mg and used as a sample. The sample was subjected to differential scanning calorimetry (DSC measurement) under the following conditions to obtain a DSC curve (for example, FIG. 1). In addition, it measured based on JISK7122. And the sum total of the melting energy at the time of 2nd Run heating was computed, and it was set as crystal melting energy.
  • FIG. 1 shows a chart (DSC curve) obtained by differential scanning calorimetry (DSC measurement) of Example 3.
  • the sample was melted by heating from ⁇ 50 ° C. to 200 ° C. by heating at a temperature rising rate of 10 ° C./min.
  • the melted sample was solidified by cooling from 200 ° C. to ⁇ 50 ° C. by cooling at a temperature lowering rate of 10 ° C./min.
  • the solidified sample was melted again by raising the temperature from -50 ° C. to 200 ° C. by heating at a temperature rising rate of 10 ° C./min.
  • DSC measurement DSC measurement
  • the crystal melting energy was determined from the area of the portion enclosed by the straight line obtained by connecting with B) and the melting peak (area of the shaded peak in FIG. 1).
  • the baseline of the melting peak is the low-temperature side baseline (baseline E in FIG. 1) and the high-temperature side base when determining the glass transition temperature from the stepwise change (step D in FIG. 1) of the DSC curve.
  • the lines (baseline F in FIG. 1) it is the high temperature side base line (baseline F).
  • the foamed laminate was cut into a width of 20 mm and a length of 100 mm, and used as a test piece.
  • the test piece is bonded by pressure bonding to an acrylic plate (trade name "Akrilite", manufactured by Mitsubishi Rayon Co., Ltd.) under the conditions of 1 kg roller, one reciprocation, and left for 30 minutes at room temperature (23 ⁇ 2 ° C) did.
  • FIGS. 5 (a) and 5 (b) show a top view and an end view of a cutting portion of an evaluation container (an evaluation container for evaluating dynamic dust resistance) in which a sample for evaluation is assembled.
  • FIG. 5 (a) shows a top view of an evaluation container for evaluation of dynamic dustproofness assembled with a sample for evaluation.
  • FIG. 5 (b) is an end view of the A-A 'line cutting section of the evaluation container assembled with the evaluation sample.
  • the evaluation container can evaluate the dynamic dust resistance (dust resistance at impact) of the evaluation sample by assembling the evaluation sample and then dropping it.
  • FIGS. 5 (a) and 5 (b) show a top view and an end view of a cutting portion of an evaluation container (an evaluation container for evaluating dynamic dust resistance) in which a sample for evaluation is assembled.
  • FIG. 5 (a) shows a top view of an evaluation container for evaluation of dynamic dustproofness assembled with a sample for evaluation.
  • FIG. 5 (b) is an end view of the A-A 'line cutting
  • reference numeral 2 denotes an evaluation container in which a sample for evaluation is assembled
  • reference numeral 211 denotes a black acrylic plate (black acrylic plate on the cover plate side)
  • reference numeral 212 denotes a black acrylic plate It is a black acrylic plate on the aluminum plate side
  • 22 is a sample for evaluation (frame-like resin foam)
  • 23 is an aluminum plate
  • 24 is a base plate
  • 25 is a powder supply part
  • Reference numeral 26 is a screw
  • reference numeral 27 is a foam compression plate
  • reference numeral 28 is a pin
  • reference numeral 29 is an inside of the evaluation container
  • reference numeral 30 is an aluminum spacer.
  • the compression rate of the evaluation sample 22 can be controlled by adjusting the thickness of the aluminum spacer 30.
  • a cover plate fixing bracket is provided between facing screws, The black acrylic plate 211 is firmly fixed to the foam compression plate 27.
  • FIG. 3 is a schematic cross-sectional view of an evaluation container for evaluation of dynamic dustproofness in which a sample for evaluation is assembled.
  • reference numeral 2 denotes an evaluation container (package in which the evaluation sample is assembled) in which an evaluation sample is assembled
  • reference numeral 22 denotes an evaluation sample (resin foam punched out in a frame shape)
  • reference numeral 24 denotes a base.
  • It is a board
  • symbol 25 is a powder supply part
  • symbol 27 is a foam compression board
  • symbol 29 is an evaluation container inside (package inside).
  • the powder supply unit 25 and the inside of the evaluation container 29 are separated by the evaluation sample 22, and the powder supply unit 25 and the inside of the evaluation container 29 are closed. .
  • FIG. 4 is a schematic view showing a test method of the dynamic dust resistance test.
  • reference numeral 1 is a tumbler
  • reference numeral 2 is an evaluation container in which a sample for evaluation is assembled.
  • the direction a is the rotation direction of the tumbler.
  • the evaluation container 2 is housed in the tumbler 1. When the tumbler 1 rotates, the evaluation container 2 is repeatedly loaded with an impact.
  • the method of evaluating dynamic dust resistance will be described in more detail.
  • the resin foam was punched into a frame shape (window frame shape) (width: 2 mm) shown in FIG.
  • the evaluation sample 22 was mounted on an evaluation container 2 (an evaluation container for evaluating dynamic dust resistance, see FIGS. 3 and 5).
  • the compression ratio of the evaluation sample 22 at the time of mounting was 40% (compressed so as to be 40% of the initial thickness).
  • the evaluation sample 22 is provided between the foam compression plate 27 and the black acrylic plates 211 and 212 on the aluminum plate 23 fixed to the base plate 24.
  • the evaluation sample 22 forms a system in which a fixed region inside is closed. As shown in FIG.
  • a still image is created for the black acrylic plate 212 on the aluminum plate 23 side and the black acrylic plate 211 on the cover plate side, and binarization processing is performed using image analysis software (software name “Win ROOF”, manufactured by Mitani Corporation)
  • the total area of the particles was measured as the number of particles. The observation was performed in a clean bench to reduce the influence of airborne dust.
  • the total particle area of the particles adhering to the black acrylic plate 212 on the aluminum plate 23 side and the particles adhering to the black acrylic plate 211 on the cover plate side is preferably less than 1500 [Pixel x Pixel] It was determined to be “o”, and a case exceeding 1500 [Pixel ⁇ Pixel] was determined to be a defect “x”.
  • melt viscosity of adhesive layer 20 g of the adhesive layer of the foam laminate was sampled to obtain a test piece. Next, the test piece was dissolved at 200 ° C. in a sample chamber and stirred for 30 minutes with a rotor to obtain a melt. Then, the viscosity of the melt was measured to determine the melt viscosity. In addition, since the comparative example 1 does not have an adhesive layer, it did not measure the melt viscosity of an adhesive layer.
  • Melt viscosity device "DV-II + VISCOMETER" (made by BROOK FILD) Sample chamber: HT-2DB Rotor: SC4-27
  • the foamed laminate was cut into a width of 20 mm and a length of 100 mm, and used as a test piece.
  • the test piece is bonded by pressure bonding to an acrylic plate (trade name "Akrilite”, manufactured by Mitsubishi Rayon Co., Ltd.) under the condition of 1 kg roller, 1 reciprocation, and left for 24 hours at room temperature (23 ⁇ 2 ° C) did.
  • an acrylic plate trade name “Akrilite”, manufactured by Mitsubishi Rayon Co., Ltd.
  • a tensile tester Appatus name “TG-1 kN”, manufactured by Minebea Co., Ltd.
  • temperature 23 ⁇ 2 ° C.
  • humidity 50 ⁇ 5 RH
  • tensile speed 0.3 m / min
  • peeling Angle The test piece was peeled off under the condition of 180 °.
  • the foamed laminate was cut into a width of 30 mm and a length of 30 mm, and used as a measurement sample.
  • the measurement sample was uniformly compressed in the thickness direction using a jig so that the thickness was 50% before compression.
  • the measurement sample was stored for 72 hours under a temperature atmosphere of 80 ° C. while maintaining 50% compression in the thickness direction.
  • the measurement sample after storage was visually observed, and it was confirmed whether the pressure-sensitive adhesive layer in the foam laminate flowed and the pressure-sensitive adhesive layer was sticking out of the foam laminate outside.
  • the case where the protrusion of the pressure-sensitive adhesive layer did not occur was evaluated as good heat resistance " ⁇ ", while the case where the protrusion of the pressure-sensitive adhesive layer occurred was evaluated as poor heat resistance "X”. In any case, the pressure-sensitive adhesive layer did not stick out of the foam laminate at a stage where it was compressed 50% in the thickness direction before storage.
  • the foamed laminates of Examples 1 to 9 are peeled off from the acrylic plate at the time of measurement of the adhesion to the acrylic plate and at the time of evaluation of the rework property evaluation test. Also in the case of the foam laminate of the above, there was no failure of the foam laminate such as the failure of the foam layer.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/JP2012/050728 2011-01-24 2012-01-16 電気又は電子機器用の発泡積層体 Ceased WO2012102112A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020137019524A KR101852221B1 (ko) 2011-01-24 2012-01-16 전기 또는 전자 기기용 발포 적층체
CN201280006280.6A CN103328594B (zh) 2011-01-24 2012-01-16 电气或电子器件用发泡层压体
US13/981,380 US20130302590A1 (en) 2011-01-24 2012-01-16 Foam laminate for electric or electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011012249A JP5666926B2 (ja) 2011-01-24 2011-01-24 電気又は電子機器用の発泡積層体
JP2011-012249 2011-01-24

Publications (1)

Publication Number Publication Date
WO2012102112A1 true WO2012102112A1 (ja) 2012-08-02

Family

ID=46580684

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/050728 Ceased WO2012102112A1 (ja) 2011-01-24 2012-01-16 電気又は電子機器用の発泡積層体

Country Status (6)

Country Link
US (1) US20130302590A1 (enExample)
JP (1) JP5666926B2 (enExample)
KR (1) KR101852221B1 (enExample)
CN (1) CN103328594B (enExample)
TW (1) TW201235220A (enExample)
WO (1) WO2012102112A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10316156B2 (en) * 2014-09-24 2019-06-11 Nitto Denko Corporation Foamed sheet
WO2022092199A1 (ja) * 2020-10-28 2022-05-05 積水化学工業株式会社 粘着テープ

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5731835B2 (ja) * 2011-01-24 2015-06-10 日東電工株式会社 電気又は電子機器用の発泡積層体
JP2014040094A (ja) * 2012-07-24 2014-03-06 Nitto Denko Corp 電子機器用再剥離可能発泡積層体及び電気又は電子機器類
JP2014180817A (ja) * 2013-03-19 2014-09-29 Nitto Denko Corp 発泡積層体
JP2014180816A (ja) * 2013-03-19 2014-09-29 Nitto Denko Corp 発泡積層体
JP2014180818A (ja) * 2013-03-19 2014-09-29 Nitto Denko Corp 発泡積層体
US20160256592A1 (en) * 2015-03-02 2016-09-08 The Procter & Gamble Company Stretch laminates
KR101527953B1 (ko) * 2015-03-05 2015-06-10 강제훈 3차원 프린터를 이용한 치아 이동 시스템 및 방법
EP3365168B1 (en) * 2015-10-21 2021-06-30 Schneller, LLC Lightweight flame retardant thermoplastic structures
JPWO2018116844A1 (ja) * 2016-12-22 2019-10-24 Ｄｉｃ株式会社 粘着テープ
PL3746518T3 (pl) 2018-01-31 2024-04-22 Bostik, Inc. Kompozycje klejów topliwych zawierające kopolimery propylenowe i sposoby ich zastosowania
JP2018161895A (ja) * 2018-06-25 2018-10-18 東洋インキＳｃホールディングス株式会社 接着剤組成物、電池用包装材、及び電池用容器
JP6809509B2 (ja) * 2018-06-25 2021-01-06 東洋インキＳｃホールディングス株式会社 接着剤組成物、電池用包装材、及び電池用容器
US12018182B2 (en) 2018-09-04 2024-06-25 Idemitsu Kosan Co., Ltd. Thermoplastic resin composition and hot-melt adhesive
KR102702925B1 (ko) * 2020-05-19 2024-09-03 한화솔루션 주식회사 점착성 및 전기 전도성이 우수한 다층 성형품 및 이에 의해 운송되는 전자제품

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08500134A (ja) * 1992-08-06 1996-01-09 ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチェン 熱可塑性熱溶融接着剤
WO2001096490A1 (en) * 2000-06-14 2001-12-20 Idemitsu Petrochemical Co., Ltd. Polyolefin resin for hot-melt adhesive
JP2004284575A (ja) * 2003-03-06 2004-10-14 Hitachi Kasei Polymer Co Ltd 自動車内装材用プレコート表皮材および自動車内装材の製造方法
JP2006193719A (ja) * 2004-10-28 2006-07-27 Exxonmobile Chemical Patents Inc シンジオタクチックを豊富に含むポリオレフィン
JP2006312308A (ja) * 2005-04-08 2006-11-16 Nitto Denko Corp 発泡部材、発泡部材積層体及び発泡部材が用いられた電気・電子機器類
JP2008024859A (ja) * 2006-07-24 2008-02-07 Sumitomo Chemical Co Ltd ホットメルト接着剤
JP2009057397A (ja) * 2007-08-29 2009-03-19 Sanyo Chem Ind Ltd 難接着基材用ホットメルト接着剤
JP2009275218A (ja) * 2008-04-15 2009-11-26 Nitto Denko Corp 粘着剤、粘着シート及び粘着シートの製造方法
JP2009275209A (ja) * 2008-04-14 2009-11-26 Nitto Denko Corp 粘着剤、粘着シート及びその製造方法
JP2010144063A (ja) * 2008-12-19 2010-07-01 Dainippon Printing Co Ltd 粘着積層体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4868045A (en) * 1987-01-08 1989-09-19 Nagoya Oilchemical Co., Ltd. Masking member
US6586483B2 (en) * 2001-01-08 2003-07-01 3M Innovative Properties Company Foam including surface-modified nanoparticles
WO2008099865A1 (ja) * 2007-02-15 2008-08-21 Mitsui Chemicals, Inc. プロピレン系重合体、プロピレン系重合体組成物、ペレットおよび粘着剤
JP2008208173A (ja) * 2007-02-23 2008-09-11 Nitto Denko Corp 表面保護シート
JP5371206B2 (ja) * 2007-05-30 2013-12-18 アキレス株式会社 保護フィルム
JP2010150452A (ja) * 2008-12-26 2010-07-08 Dainippon Printing Co Ltd 粘着フィルム
EP2627702B1 (en) * 2010-10-15 2019-03-27 ExxonMobil Chemical Patents Inc. Polypropylene-based adhesive compositions
JP5731835B2 (ja) * 2011-01-24 2015-06-10 日東電工株式会社 電気又は電子機器用の発泡積層体

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08500134A (ja) * 1992-08-06 1996-01-09 ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチェン 熱可塑性熱溶融接着剤
WO2001096490A1 (en) * 2000-06-14 2001-12-20 Idemitsu Petrochemical Co., Ltd. Polyolefin resin for hot-melt adhesive
JP2004284575A (ja) * 2003-03-06 2004-10-14 Hitachi Kasei Polymer Co Ltd 自動車内装材用プレコート表皮材および自動車内装材の製造方法
JP2006193719A (ja) * 2004-10-28 2006-07-27 Exxonmobile Chemical Patents Inc シンジオタクチックを豊富に含むポリオレフィン
JP2006312308A (ja) * 2005-04-08 2006-11-16 Nitto Denko Corp 発泡部材、発泡部材積層体及び発泡部材が用いられた電気・電子機器類
JP2008024859A (ja) * 2006-07-24 2008-02-07 Sumitomo Chemical Co Ltd ホットメルト接着剤
JP2009057397A (ja) * 2007-08-29 2009-03-19 Sanyo Chem Ind Ltd 難接着基材用ホットメルト接着剤
JP2009275209A (ja) * 2008-04-14 2009-11-26 Nitto Denko Corp 粘着剤、粘着シート及びその製造方法
JP2009275218A (ja) * 2008-04-15 2009-11-26 Nitto Denko Corp 粘着剤、粘着シート及び粘着シートの製造方法
JP2010144063A (ja) * 2008-12-19 2010-07-01 Dainippon Printing Co Ltd 粘着積層体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10316156B2 (en) * 2014-09-24 2019-06-11 Nitto Denko Corporation Foamed sheet
WO2022092199A1 (ja) * 2020-10-28 2022-05-05 積水化学工業株式会社 粘着テープ
JPWO2022092199A1 (enExample) * 2020-10-28 2022-05-05

Also Published As

Publication number Publication date
TW201235220A (en) 2012-09-01
KR101852221B1 (ko) 2018-04-25
KR20140018222A (ko) 2014-02-12
JP2012153765A (ja) 2012-08-16
CN103328594A (zh) 2013-09-25
CN103328594B (zh) 2015-03-11
JP5666926B2 (ja) 2015-02-12
US20130302590A1 (en) 2013-11-14

Similar Documents

Publication Publication Date Title
WO2012102112A1 (ja) 電気又は電子機器用の発泡積層体
TWI598275B (zh) 樹脂發泡體及發泡密封材
JP5508115B2 (ja) 樹脂発泡体及び発泡部材
JP5289871B2 (ja) 微細セル構造を有する発泡防塵材
JP6358825B2 (ja) 樹脂発泡複合体
TWI507456B (zh) Resin foam and foam sealing material
JP5914141B2 (ja) ポリオレフィン系樹脂発泡体用樹脂組成物、ポリオレフィン系樹脂発泡体、発泡体製造方法、及び発泡シール材
JP2011012235A (ja) 樹脂発泡体
WO2014017423A1 (ja) 電子機器用再剥離可能発泡積層体及び電気又は電子機器類
TWI569968B (zh) A foamed laminate for electrical or electronic equipment
US20100119812A1 (en) Light-reflecting member containing polyolefin resin foam, and method for producing the same
JP5427972B2 (ja) 樹脂発泡体
JP6055141B2 (ja) ポリオレフィン系樹脂発泡体用樹脂組成物、ポリオレフィン系樹脂発泡体、発泡体製造方法、及び発泡シール材
JP2011162717A (ja) 発泡シール材
JP5872524B2 (ja) 発泡部材
JP5620022B2 (ja) 樹脂発泡体及び発泡部材
JP5620021B2 (ja) 樹脂発泡体及び発泡部材

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12738726

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20137019524

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 13981380

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 12738726

Country of ref document: EP

Kind code of ref document: A1