WO2012081243A1 - Adhésif durcissable par rayonnement et couche de protection de surface arrière pour batteries solaires - Google Patents
Adhésif durcissable par rayonnement et couche de protection de surface arrière pour batteries solaires Download PDFInfo
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- WO2012081243A1 WO2012081243A1 PCT/JP2011/006997 JP2011006997W WO2012081243A1 WO 2012081243 A1 WO2012081243 A1 WO 2012081243A1 JP 2011006997 W JP2011006997 W JP 2011006997W WO 2012081243 A1 WO2012081243 A1 WO 2012081243A1
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- Prior art keywords
- sheet
- active energy
- energy ray
- meth
- curable adhesive
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- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
- C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
- C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
- C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the urethane resin (D) preferably has a urethane bond equivalent of 200 to 3,000, more preferably 250 to 2,000 from the viewpoints of adhesive strength between sheet-like members and heat and humidity resistance. Further, 300 to 1,500, particularly 350 to 1250 is more preferable.
- the urethane bond equivalent referred to here is the number average molecular weight per urethane bond in one molecule of the urethane resin (D). In other words, the urethane bond equivalent is a value obtained by dividing the number average molecular weight of the urethane resin (D) by the average value of the number of urethane bonds contained in one molecule of the urethane resin (D).
- Examples of relatively low molecular weight (meth) acrylate monomers include monofunctional (meth) acrylate monomers such as 4-hydroxybutyl (meth) acrylate, isobornyl (meth) acrylate, lauryl (meth) acrylate, and acryloylmorpholine; 1,9-nonanediol di (meth) acrylate, bisphenol A di (meth) acrylate, pentaerythritol tri (meth) acrylate, tris ((meth) acryloxyethyl) isocyanurate, and dipentaerythritol hexa (meth)
- a polyfunctional (meth) acrylate monomer such as acrylate can be exemplified.
- the active energy ray-curable adhesive of the present invention is based on the solid content of the active energy ray-curable adhesive, 50 to 85% by weight of the urethane resin (D), 5 to 40% by weight of the epoxy resin (E), It is preferable to contain 0 to 30% by weight of a compound having a (meth) acryloyl group other than the urethane resin (D), 60 to 85% by weight of the urethane resin (D), and 10 to 34% by weight of the epoxy resin (E). It is more preferable to contain 0 to 15% by weight of a compound having a (meth) acryloyl group other than the urethane resin (D).
- FIG. 1 shows a schematic cross-sectional view which is an example of the outline of the solar cell module according to the present invention.
- the solar cell module 100 includes a solar cell 1, which is a solar cell element, a solar cell surface protective sheet 2, a light-receiving surface side sealing material layer 3, a non-light-receiving surface side sealing material layer 4, The back surface protection sheet 5 for solar cells is provided.
- a solar cell 1 which is a solar cell element
- a solar cell surface protective sheet 2 a light-receiving surface side sealing material layer 3
- the back surface protection sheet 5 for solar cells is provided.
- FIG. 1 shows a schematic cross-sectional view which is an example of the outline of the solar cell module according to the present invention.
- the solar cell module 100 includes a solar cell 1, which is a solar cell element, a solar cell surface protective sheet 2, a light-receiving surface side sealing material layer 3, a non-light-receiving surface side sealing material layer 4,
- Comparative Example 1 800.0 parts of methyl ethyl ketone (MEK) and polytetramethylene ether glycol PTMG-2000 (Mitsubishi Chemical) in a polymerization reactor of a polymerization reactor equipped with a polymerization vessel, a stirrer, a thermometer, a reflux condenser, a nitrogen introduction tube, and a dropping vessel 907.2 parts, 0.5 parts of dibutyltin dilaurate (DBTDL) as a catalyst, 0.3 parts of hydroquinone as a radical polymerization inhibitor, 0.1 parts of IRGANOX 1010 (manufactured by BASF) as an antioxidant. The temperature in the polymerization tank was raised to 80 ° C.
- DBTDL dibutyltin dilaurate
- hydroquinone as a radical polymerization inhibitor
- IRGANOX 1010 manufactured by BASF
- the cured adhesive sheet was prepared by applying an adhesive to a polyester film having a silicone release layer with a blade coater, drying the solvent, and then applying ultraviolet rays (120 W metal halide lamp, integrated light quantity of 500 mJ / UV-A region). cm 2 ), an active energy ray-curable adhesive layer was formed, and the polyester film was peeled off.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011800632148A CN103314070A (zh) | 2010-12-15 | 2011-12-14 | 活性能量线硬化性粘合剂、以及太阳能电池用背面保护片 |
JP2012548657A JP5849968B2 (ja) | 2010-12-15 | 2011-12-14 | 活性エネルギー線硬化性接着剤、並びに太陽電池用裏面保護シート |
KR1020137016388A KR20140014091A (ko) | 2010-12-15 | 2011-12-14 | 활성 에너지 선 경화성 접착제, 및 태양 전지용 뒷면 보호 시트 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010278715 | 2010-12-15 | ||
JP2010-278715 | 2010-12-15 | ||
JP2011-235723 | 2011-10-27 | ||
JP2011235723 | 2011-10-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012081243A1 true WO2012081243A1 (fr) | 2012-06-21 |
Family
ID=46244362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/006997 WO2012081243A1 (fr) | 2010-12-15 | 2011-12-14 | Adhésif durcissable par rayonnement et couche de protection de surface arrière pour batteries solaires |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5849968B2 (fr) |
KR (1) | KR20140014091A (fr) |
CN (1) | CN103314070A (fr) |
TW (1) | TW201229177A (fr) |
WO (1) | WO2012081243A1 (fr) |
Cited By (9)
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KR20140058355A (ko) * | 2012-11-06 | 2014-05-14 | 닛토덴코 가부시키가이샤 | 우레탄계 점착제 및 그 점착제를 사용한 표면 보호 필름 |
JP2014096514A (ja) * | 2012-11-12 | 2014-05-22 | Dainichiseika Color & Chem Mfg Co Ltd | 太陽電池モジュール用バックシート |
JP2014099531A (ja) * | 2012-11-15 | 2014-05-29 | Dainichiseika Color & Chem Mfg Co Ltd | 太陽電池モジュール用バックシート |
JP5578269B1 (ja) * | 2013-02-25 | 2014-08-27 | 東洋インキScホールディングス株式会社 | 電池用包装材用ポリウレタン接着剤、電池用包装材、電池用容器および電池 |
JP2015174961A (ja) * | 2014-03-17 | 2015-10-05 | スリーボンドファインケミカル株式会社 | 光電変換素子用シール剤 |
WO2016092972A1 (fr) * | 2014-12-09 | 2016-06-16 | Dic株式会社 | Composition d'agent adhésif durcissable par rayonnement ultraviolet, procédé de fabrication de feuille adhésive durcissable par rayonnement ultraviolet, et procédé de fabrication de stratifié |
WO2016092970A1 (fr) * | 2014-12-08 | 2016-06-16 | Dic株式会社 | Composition d'agent adhésif pouvant durcir aux ultraviolets et feuille adhésive |
US20190378943A1 (en) * | 2018-06-11 | 2019-12-12 | Alta Devices, Inc. | Planarization of photovoltaics |
JP7099593B1 (ja) | 2021-06-30 | 2022-07-12 | 東洋インキScホールディングス株式会社 | 蓄電デバイス包装材用ポリウレタン接着剤、蓄電デバイス用包装材、蓄電デバイス用容器及び蓄電デバイス |
Families Citing this family (5)
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KR20140135787A (ko) * | 2012-03-14 | 2014-11-26 | 도요보 가부시키가이샤 | 태양전지 이면 봉지 시트 및 태양전지 모듈 |
KR101666365B1 (ko) * | 2014-12-03 | 2016-10-17 | 코오롱글로텍주식회사 | 소수성 또는 발수성 기재용 접착제 및 이의 제조방법 |
JP6224188B1 (ja) * | 2016-08-08 | 2017-11-01 | 太陽インキ製造株式会社 | 半導体封止材 |
WO2019148331A1 (fr) * | 2018-01-30 | 2019-08-08 | 江苏科力斯通新材料有限公司 | Panneau arrière de module photovoltaïque |
WO2019178725A1 (fr) * | 2018-03-19 | 2019-09-26 | 海门市绣羽工业设计有限公司 | Fond de panier pour encapsulation de module de cellules solaires |
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WO2010147090A1 (fr) * | 2009-06-15 | 2010-12-23 | 東洋インキ製造株式会社 | Résine uréthanne, adhésif durcissable avec des rayons actiniques, et feuille de protection arrière pour cellule solaire |
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JP2008004691A (ja) * | 2006-06-21 | 2008-01-10 | Toppan Printing Co Ltd | 太陽電池裏面封止用シート |
-
2011
- 2011-12-14 JP JP2012548657A patent/JP5849968B2/ja active Active
- 2011-12-14 WO PCT/JP2011/006997 patent/WO2012081243A1/fr active Application Filing
- 2011-12-14 CN CN2011800632148A patent/CN103314070A/zh active Pending
- 2011-12-14 KR KR1020137016388A patent/KR20140014091A/ko not_active Application Discontinuation
- 2011-12-15 TW TW100146400A patent/TW201229177A/zh unknown
Patent Citations (5)
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JPS578218A (en) * | 1980-05-14 | 1982-01-16 | Poudres & Explosifs Ste Nale | Thermoplastic polyurethane resin having isocyanate end group and ethylenic side group |
JP2003040965A (ja) * | 2001-08-01 | 2003-02-13 | Kansai Paint Co Ltd | 不飽和基含有ウレタン樹脂及びそれを用いた活性エネルギー線硬化組成物 |
WO2009154224A1 (fr) * | 2008-06-20 | 2009-12-23 | ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー | Composition contenant un agent d’étanchéité durcissable par un rayonnement énergétique actif, et élément auquel est fixée une couche d’étanchéité |
JP2010275339A (ja) * | 2009-05-26 | 2010-12-09 | Mitsubishi Rayon Co Ltd | 硬化性組成物、及び物品 |
WO2010147090A1 (fr) * | 2009-06-15 | 2010-12-23 | 東洋インキ製造株式会社 | Résine uréthanne, adhésif durcissable avec des rayons actiniques, et feuille de protection arrière pour cellule solaire |
Cited By (15)
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KR20140058355A (ko) * | 2012-11-06 | 2014-05-14 | 닛토덴코 가부시키가이샤 | 우레탄계 점착제 및 그 점착제를 사용한 표면 보호 필름 |
KR102198465B1 (ko) * | 2012-11-06 | 2021-01-06 | 닛토덴코 가부시키가이샤 | 우레탄계 점착제 및 그 점착제를 사용한 표면 보호 필름 |
JP2014096514A (ja) * | 2012-11-12 | 2014-05-22 | Dainichiseika Color & Chem Mfg Co Ltd | 太陽電池モジュール用バックシート |
JP2014099531A (ja) * | 2012-11-15 | 2014-05-29 | Dainichiseika Color & Chem Mfg Co Ltd | 太陽電池モジュール用バックシート |
JP5578269B1 (ja) * | 2013-02-25 | 2014-08-27 | 東洋インキScホールディングス株式会社 | 電池用包装材用ポリウレタン接着剤、電池用包装材、電池用容器および電池 |
JP2014185317A (ja) * | 2013-02-25 | 2014-10-02 | Toyo Ink Sc Holdings Co Ltd | 電池用包装材用ポリウレタン接着剤、電池用包装材、電池用容器および電池 |
JP2015174961A (ja) * | 2014-03-17 | 2015-10-05 | スリーボンドファインケミカル株式会社 | 光電変換素子用シール剤 |
JP5967461B1 (ja) * | 2014-12-08 | 2016-08-10 | Dic株式会社 | 紫外線硬化型粘着剤組成物、及び、粘着シート |
WO2016092970A1 (fr) * | 2014-12-08 | 2016-06-16 | Dic株式会社 | Composition d'agent adhésif pouvant durcir aux ultraviolets et feuille adhésive |
JP5967341B1 (ja) * | 2014-12-09 | 2016-08-10 | Dic株式会社 | 紫外線硬化型粘着剤組成物、紫外線硬化型粘着シートの製造方法、及び、積層体の製造方法 |
WO2016092972A1 (fr) * | 2014-12-09 | 2016-06-16 | Dic株式会社 | Composition d'agent adhésif durcissable par rayonnement ultraviolet, procédé de fabrication de feuille adhésive durcissable par rayonnement ultraviolet, et procédé de fabrication de stratifié |
US20190378943A1 (en) * | 2018-06-11 | 2019-12-12 | Alta Devices, Inc. | Planarization of photovoltaics |
US11616154B2 (en) | 2018-06-11 | 2023-03-28 | Utica Leaseco, Llc | Planarization of photovoltaics |
JP7099593B1 (ja) | 2021-06-30 | 2022-07-12 | 東洋インキScホールディングス株式会社 | 蓄電デバイス包装材用ポリウレタン接着剤、蓄電デバイス用包装材、蓄電デバイス用容器及び蓄電デバイス |
JP2023006643A (ja) * | 2021-06-30 | 2023-01-18 | 東洋インキScホールディングス株式会社 | 蓄電デバイス包装材用ポリウレタン接着剤、蓄電デバイス用包装材、蓄電デバイス用容器及び蓄電デバイス |
Also Published As
Publication number | Publication date |
---|---|
KR20140014091A (ko) | 2014-02-05 |
JP5849968B2 (ja) | 2016-02-03 |
CN103314070A (zh) | 2013-09-18 |
TW201229177A (en) | 2012-07-16 |
JPWO2012081243A1 (ja) | 2014-05-22 |
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