WO2012070471A1 - Feuille de cuivre laminée pour carte à circuit imprimé flexible, carte laminée plaquée de cuivre, carte à circuit imprimé flexible et dispositif électronique - Google Patents

Feuille de cuivre laminée pour carte à circuit imprimé flexible, carte laminée plaquée de cuivre, carte à circuit imprimé flexible et dispositif électronique Download PDF

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Publication number
WO2012070471A1
WO2012070471A1 PCT/JP2011/076581 JP2011076581W WO2012070471A1 WO 2012070471 A1 WO2012070471 A1 WO 2012070471A1 JP 2011076581 W JP2011076581 W JP 2011076581W WO 2012070471 A1 WO2012070471 A1 WO 2012070471A1
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WO
WIPO (PCT)
Prior art keywords
flexible printed
printed wiring
wiring board
copper foil
board
Prior art date
Application number
PCT/JP2011/076581
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English (en)
Japanese (ja)
Inventor
岡野　朋樹
和樹 冠
Original Assignee
Jx日鉱日石金属株式会社
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Publication date
Application filed by Jx日鉱日石金属株式会社 filed Critical Jx日鉱日石金属株式会社
Publication of WO2012070471A1 publication Critical patent/WO2012070471A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Definitions

  • the present invention relates to a rolled copper foil for a flexible printed wiring board, a copper-clad laminate using the same, a flexible printed wiring board, and an electronic device.
  • An electronic device is usually composed of a plurality of electronic boards, and a printed wiring board that electrically connects these electronic boards is provided between the electronic boards.
  • a printed wiring board usually includes an insulating substrate and copper wiring formed on the surface of the substrate.
  • a printed wiring board is often required to have flexibility or the like, and a flexible printed wiring board is generally used.
  • the properties required for the flexible printed circuit board good bending properties typified by MIT flex resistance, and has high cycle flexibility typified by IPC flexibility, conventionally, with such properties Cu- Resin substrate laminates have been developed (Patent Documents 1 and 2).
  • a copper foil is formed on a resin substrate. At this time, the surface of the copper foil is often roughened in order to improve adhesion to the resin substrate.
  • a copper foil having a smooth surface and excellent adhesion to a resin substrate has been proposed, and a fine pattern of wiring can be formed without using a metalizing method. If a fine pattern can be formed in this way, a rolled copper foil can be used with COF (Chip On Film) or the like (Patent Documents 3 and 4).
  • a flexible printed wiring board is provided between two substrates as described above in an electronic device and electrically connects both.
  • these two substrates have the same linear thermal expansion coefficient, there is a problem.
  • the substrate has a difference in coefficient of linear thermal expansion, stress concentration occurs on the flexible printed wiring board due to turning on and off the power supply of the electronic device, temperature change at the place of use, and the like.
  • the flexible printed wiring board is designed in consideration of good bendability represented by MIT bendability and high cycle bendability represented by IPC bendability. Such stress concentrations are not planned and are not designed to withstand. For this reason, cracks due to the stress concentration occur in the wiring of the flexible printed wiring board due to long-term use of the electronic device, which causes the failure of the electronic device.
  • the present invention when used as a wiring of a flexible printed wiring board, a rolled copper foil that does not crack in wiring even after long-term use, and a copper-clad laminate, a flexible printed wiring board using the rolled copper foil, and It is an object to provide an electronic device.
  • the present invention completed based on the above knowledge is used as a wiring of a flexible printed wiring board that electrically connects a first board and a second board having a linear thermal expansion coefficient difference of 1.2 times or more.
  • a temperature change of ⁇ 10 ° C. to + 90 ° C. 1000 times cracks do not occur in the wiring.
  • the flexible It is a rolled copper foil for flexible printed wiring boards in which cracks do not occur in the wiring even when the temperature change of ⁇ 10 ° C. to + 90 ° C. is repeated 1000 times.
  • the distance between the first substrate and the second substrate is 10 mm or less, and at least the first substrate and the second substrate.
  • the length of the end portion of the substrate including the region where the flexible printed wiring board is provided is 200 mm or more.
  • the area of the contact surface between the base film of the flexible printed wiring board and the copper foil is that of the flexible printed wiring board. Less than 50% of the surface area.
  • the minimum value of the wiring width of the flexible printed wiring board is 25 ⁇ m or less.
  • the copper foil has a total of 50 to 1000 ⁇ g / Cr on the base film side surface of the flexible printed wiring board. dm 2 is adhered, and the surface roughness (Ra) on the surface is Ra ⁇ 0.2 ⁇ m.
  • the copper foil includes Cr and Ni as essential components on the base film side surface of the flexible printed wiring board, and Sn.
  • rolled copper foil for flexible printed wiring board Pd, Ag, Au, Cr, Ni, Sn are formed on the surface of the copper foil opposite to the surface to which Cr and Ni are adhered. And one or more selected from the group consisting of V and V are attached in a total of 50 to 1000 ⁇ g / dm 2 .
  • the adhering element essentially contains Pd.
  • the copper foil is formed of tough pitch copper or oxygen-free copper.
  • the copper foil Ag the tough pitch copper or oxygen-free copper, Sn, Cr, Zr, Fe, As, Sb, Bi, It is formed of a copper alloy to which at least one or two or more of Se, Te, and Pb are added in a total of 2000 ppm or less (excluding 0 ppm).
  • the present invention is a copper clad laminate provided with the copper foil according to the present invention.
  • the present invention is a flexible printed wiring board made of the copper clad laminate according to the present invention.
  • FIG. 1 Another aspect of the present invention is an electronic device including the flexible printed wiring board according to the present invention and a first substrate and a second substrate electrically connected by the flexible printed wiring board.
  • a rolled copper foil that does not crack in wiring even after long-term use and a copper-clad laminate
  • a flexible printed wiring board using the rolled copper foil and An electronic device can be provided.
  • the copper alloy foil based on tough pitch copper and oxygen-free copper is a total of at least one or more of Ag, Sn, Cr, Zr, Fe, As, Sb, Bi, Se, Te and Pb. And 2000 ppm or less (excluding 0 ppm), preferably 5 ppm to 1500 ppm, more preferably 20 ppm to 1000 ppm.
  • ppm means mass ppm.
  • the copper alloy foil is also included.
  • “tough pitch copper and oxygen-free copper” copper alloy based on tough pitch copper and oxygen-free copper is used. Includes foil.
  • the thickness of the copper foil that can be used in the present invention is preferably 5 to 18 ⁇ m.
  • the thickness of the copper foil is less than 5 ⁇ m, the handling of the copper foil is deteriorated, and when it is more than 18 ⁇ m, the fine etching property is deteriorated.
  • a flexible printed wiring board according to the present invention includes an insulating substrate and a wiring pattern formed on the surface of the insulating substrate.
  • the insulating substrate is not particularly limited as long as it has good bendability and bendability applicable to a flexible printed wiring board.
  • a polyimide film or a liquid crystal polymer film can be used.
  • the wiring pattern is formed using the above-mentioned rolled copper foil for flexible printed wiring boards.
  • the shape of the wiring pattern is not particularly limited, and any shape may be used.
  • the flexible printed wiring board which concerns on this invention Since the flexible printed wiring board which concerns on this invention is formed using the above rolled copper foil for flexible printed wiring boards, it has the following characteristics. That is, with respect to the first printed circuit board and the second printed circuit board to which the flexible printed wiring board is electrically connected, when both boards have a difference in linear thermal expansion coefficient of 1.2 times or more, the flexible printed wiring board Even if the temperature change from ⁇ 10 ° C. to + 90 ° C. is repeated 1000 times, the wiring does not crack. Furthermore, even when the two substrates have a difference in linear thermal expansion coefficient of 1.5 times or more, the wiring is cracked even if the temperature change of -10 ° C to + 90 ° C is repeated 1000 times with respect to the flexible printed wiring board Does not occur.
  • the difference in linear thermal expansion coefficient between the first substrate and the second substrate is 1.5 times or more, it cannot withstand the stress concentration caused by the difference in expansion between the two substrates due to temperature change, and the flexible printed wiring board There is a high possibility of cracks in the wiring.
  • the difference between the linear expansion coefficients of the first substrate and the second substrate is 1.2 times or more, there is a possibility that cracks may occur in the wiring of the flexible printed wiring board.
  • the present invention the occurrence of cracks in the wiring is well suppressed even in such a state.
  • the temperature change from ⁇ 10 ° C. to + 90 ° C. is repeated 1000 times with respect to the flexible printed wiring board means that, as shown in FIG. Holding at 90 ° C. and ⁇ 10 ° C. for 30 minutes means repeating this 1000 times as one cycle.
  • the transfer between a high temperature tank and a low temperature tank is performed within 1 minute.
  • Other conditions are performed according to JIS C0025.
  • FIG. 2 shows a region (connection portion) where the flexible printed wiring board is provided in the first substrate or the second substrate, and a substrate end including the region.
  • the linear thermal expansion coefficient is an expansion coefficient in a direction parallel to the extending direction of the substrate end, and a value at room temperature is used.
  • the flexible printed wiring board according to the present invention is a flexible printed wiring board that electrically connects a first board and a second board having a linear thermal expansion coefficient difference of 1.2 times or more.
  • the crack does not occur in the wiring even if the temperature change of ⁇ 65 ° C. to + 100 ° C. is repeated 100 times with respect to the flexible printed wiring board.
  • the two substrates have a difference in linear thermal expansion coefficient of 1.5 times or more, the wiring is cracked even if the temperature change from -65 ° C to + 100 ° C is repeated 100 times with respect to the flexible printed wiring board Does not occur.
  • the flexible printed wiring board according to the present invention is a flexible printed wiring board that electrically connects a first board and a second board having a linear thermal expansion coefficient difference of 1.2 times or more.
  • a wiring When used as a wiring, no cracks occur in the wiring even if the temperature change of ⁇ 65 ° C. to + 125 ° C. is repeated 100 times with respect to the flexible printed wiring board.
  • both boards have a difference in linear thermal expansion coefficient of 1.5 times or more, the wiring is cracked even if the temperature change of -65 ° C to + 125 ° C is repeated 100 times with respect to the flexible printed wiring board. Does not occur.
  • the distance between the substrates of the first substrate and the second substrate is 10 mm or less, and at least one of the first substrate and the second substrate includes a region where the flexible printed wiring board according to the present invention is provided.
  • the length may be 200 mm or more.
  • FIG. 2 shows a region (connection portion) where the flexible printed wiring board is provided in the first substrate or the second substrate, and a substrate end including the region. The longer the lengths of the substrate end portions of the first substrate and the second substrate including the region where the flexible printed wiring board is provided, the greater the concentration of stress applied to the flexible printed wiring board.
  • the length of the substrate end portion of the first substrate or the second substrate including the region where the flexible printed wiring board is provided is 200 mm or more.
  • the present invention the occurrence of cracks in the wiring is well suppressed even in such a state.
  • the area of the contact surface between the base film of the flexible printed wiring board and the copper foil may be less than 50% of the surface area of the flexible printed wiring board.
  • the wiring pattern of the rolled copper foil has the function of fixing the flexible printed wiring board and improving the stress resistance characteristics. Therefore, conversely, if the surface area of the rolled copper foil for flexible printed wiring board in the flexible printed wiring board is reduced, the stress resistance characteristic of the flexible printed wiring board is lowered accordingly.
  • the surface area of the rolled copper foil for a flexible printed wiring board is less than 50% of the surface area of the flexible printed wiring board, the flexible printed wiring board cannot withstand the stress concentration caused by the difference in expansion between the two substrates due to temperature changes. There is a high possibility that cracks will occur in the wiring. On the other hand, in the present invention, the occurrence of cracks in the wiring is well suppressed even in such a state.
  • each wiring width constituting the wiring pattern of the flexible printed wiring board may be 25 ⁇ m or less.
  • the minimum value of the wiring width is 25 ⁇ m or less, the stress concentration generated by the difference in expansion between the two substrates due to temperature change cannot be withstood, and there is a high possibility that a crack will occur.
  • the present invention the occurrence of cracks in the wiring is well suppressed even in such a state.
  • a total of 50 to 1000 ⁇ g / dm 2 of Cr and Ni may be adhered to the base film side surface of the flexible printed wiring board. According to such a structure, it has the effect that the adhesiveness and heat resistance of copper foil improve.
  • the adhesion amount of Cr and Ni is less than 50 ⁇ g / dm 2 in total, the adhesion and heat resistance of the copper foil are poor.
  • the etching property becomes poor.
  • the surface roughness (Ra) on the surface may be Ra ⁇ 0.2 ⁇ m. According to such a structure, it has the effect that the fine etching property of copper foil improves.
  • the rolled copper foil according to the present invention is selected from the group consisting of Cr and Ni as essential components, Sn, Co, V, Ti, Zn, Mn and Fe on the base film side surface of the flexible printed wiring board.
  • One or two or more of them may be attached in a total of 50 to 1000 ⁇ g / dm 2 . According to such a configuration, there is an effect that adhesion, heat resistance or etching is improved. When the amount of adhesion is less than 50 ⁇ g / dm 2 in total, the adhesion, heat resistance or etching becomes poor. Further, if the total amount of adhesion is more than 1000 ⁇ g / dm 2 , the etching property becomes poor.
  • One type or two or more types selected from the group consisting of Pd, Ag, Au, Cr, Ni, Sn and V are added to the surface opposite to the surface to which Cr and Ni of the rolled copper foil according to the present invention are attached. 50 to 1000 ⁇ g / dm 2 may be adhered. According to such a configuration, the etching property is improved, and there is an effect that a fine pitch circuit can be formed. Furthermore, heat resistance becomes favorable. When the adhesion amount is less than 50 ⁇ g / dm 2 in total, the etching property and heat resistance are poor. Further, if the total amount of adhesion is more than 1000 ⁇ g / dm 2 , the etching property becomes poor. For the above effect, it is more preferable that Pd is contained as an essential element in the adhering element.
  • a flexible printed wiring board can be manufactured according to a conventional method using the rolled copper foil. Below, the manufacture example of a flexible printed wiring board is shown. First, a copper clad laminate is manufactured by laminating a rolled copper foil and an insulating substrate such as a polyimide film or a liquid crystal polymer film having good flexibility and foldability.
  • thermoplastic polyimide adhesive is applied to the thermosetting polyimide film and dried, and then laminated with a copper foil and thermocompression bonded.
  • pressure bonding method there are a method of vacuum hot pressing and a method of laminating with a heat roll.
  • a copper-clad laminate is produced by coating, drying and curing a polyimide precursor on a copper foil.
  • a method well known to those skilled in the art may be used. For example, an etching resist is applied only to a necessary portion as a wiring pattern on a copper foil surface of a copper clad laminate, and unnecessary copper foil is removed by spraying an etching solution onto the copper foil surface to form a circuit pattern. Next, a flexible printed wiring board is produced by peeling and removing the etching resist to expose the wiring pattern.
  • the electronic devices can be manufactured by providing this flexible printed wiring board between two electronic boards and electrically connecting them.
  • the electronic devices is not particularly limited, for example, include a liquid crystal display, a car navigation, mobile phone, game machine, CD player, digital camera, TV, DVD player, electronic organizers, electronic dictionaries, calculators, video cameras, printers, etc. It is done.
  • Examples 1 to 56, 57, 58, 61, 65, 66 are based on tough pitch copper ingots and oxygen-free copper, and are based on at least Ag, Sn, Cr, Zr, Fe, As, Sb, Bi, Se, Te, and Pb.
  • An ingot produced by adding one or more kinds is processed into a plate having a thickness of 10 mm by hot rolling, the oxide is removed by surface cutting, and then cold rolling, annealing and pickling are repeated.
  • a copper foil was produced by processing to the thickness described in (3) to (3), and surface treatment was applied to the surface of the copper foil by sputtering.
  • Examples 1 to 32, 63, 64, 66, and 68 were obtained by applying a 18.5 ⁇ m thick thermoplastic PI adhesive to Kapton EN (registered trademark) and drying a 38.5 ⁇ m thick resin layer on a copper foil.
  • a copper clad laminate was produced by vacuum hot pressing.
  • Examples 33 to 62, 65, and 67 were prepared by applying polyimide varnish (U varnish S manufactured by Ube Industries Co., Ltd.) to copper foil, drying, and curing to form a 37.5 ⁇ m resin layer to produce a copper clad laminate. did.
  • a copper foil wiring pattern was formed by etching so that the wiring width and area ratio shown in Tables 1 to 3 were obtained.
  • each wiring was formed so that the width
  • the flexible printed wiring board was produced by the above procedure. At this time, it was confirmed that the adhesion strength between the copper foil and the resin layer was 0.7 kN / m or more, and the copper foil was controlled not to peel during the test. Subsequently, as shown in Tables 1 to 3 and FIGS. 3 to 4, a first substrate and a second substrate formed using a rigid substrate such as FR4 and / or a glass substrate are prepared, and a predetermined inter-substrate distance is prepared. The flexible printed wiring board was pressure-bonded with an anisotropic conductive adhesive film (ACF).
  • ACF anisotropic conductive adhesive film
  • the 3 to 4 show various patterns (patterns 1 to 7) of the connection form between the first substrate and the second substrate and the flexible printed wiring board formed therebetween, respectively.
  • the patterns 1 to 3, 6, and 7 are formed in a circuit that is parallel and has a constant L (line) / S (space). Moreover, the circuit is not formed in both side etch 0.5mm.
  • the length of the wiring boards of patterns 2 and 3 is 35 mm.
  • the circuits are formed in a radial pattern. Since the circuit widths of the patterns 4 and 5 are not changed, the L / S differs depending on the location so that the space becomes wider in the direction in which the circuit expands.
  • L / S is a circuit with an equal interval.
  • neither side edge of 0.5 mm forms a circuit.
  • the first substrate and the second substrate expand in the direction of the linear thermal expansion coefficient (the direction of the arrow) shown in each drawing.
  • ⁇ 10 ° C. to + 90 ° C., or ⁇ 65 to A temperature change of + 100 ° C. or ⁇ 65 to + 125 ° C. was repeatedly applied, and the number of repetitions when a crack occurred in the wiring of the flexible printed wiring board was measured.
  • Comparative example As Comparative Examples 1 to 16 and 18, Kapton EN (registered trademark) manufactured by Toray DuPont Co., Ltd. is used as a resin layer, and metal layers Cr, Ni, and Cu are sputtered to improve adhesion and electrodeposit Cu in a later step. After that, a copper layer was formed by electrodeposition to produce a copper clad laminate. The thickness of the resin layer was 37.5 ⁇ m. Further, as Comparative Example 17, a 38.5 ⁇ m thick resin layer formed by applying 1 ⁇ m of thermoplastic PI adhesive to Kapton EN and drying on electrolytic copper foil NA-VLP manufactured by Mitsui Mining & Mining Co., Ltd. was laminated on the copper foil.
  • a copper clad laminate was produced by vacuum hot pressing.
  • a copper foil wiring pattern was formed by etching so that the wiring width and area ratio shown in Table 7 were obtained.
  • each wiring was formed so that the width
  • the flexible printed wiring board was produced by the above procedure. At this time, it was confirmed that the adhesion strength between the copper foil and the resin layer was 0.7 kN / m or more, and the copper foil was controlled not to peel during the test.
  • a first substrate and a second substrate formed using a rigid substrate such as FR4 and / or a glass substrate are prepared, and the distance between the substrates is set to 6 mm.
  • the wiring board was pressure-bonded with an anisotropic conductive adhesive film (ACF). Subsequently, for the sample made of the first substrate, the second substrate, and the flexible printed wiring board that electrically connects them, manufactured as described above, ⁇ 10 ° C. to + 90 ° C., or ⁇ 65 to A temperature change of + 100 ° C. or ⁇ 65 to + 125 ° C. was repeatedly given, and the number of repetitions when a crack occurred in the wiring of the flexible printed wiring board was measured.
  • the occurrence of cracks was determined as follows.
  • a constant current (0.01 to 0.1 mA) is passed through the wiring of the flexible printed wiring board, a voltage value necessary to pass the current is measured, and the wiring resistance of the flexible printed wiring board is calculated from the measured voltage value. The value was calculated. When the calculated resistance value was 500% or more of the initial value, it was determined that a crack occurred. Further, the arithmetic average roughness Ra ( ⁇ m) based on JIS-B0601 of the surface (1) of the copper foil on the base film side was measured. A contact roughness meter (manufactured by Kosaka Laboratory, trade name “SE-3400”) was used to measure the arithmetic average roughness Ra ( ⁇ m). Tables 1 to 7 show the test conditions and measurement results.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention porte sur une feuille de cuivre laminée avec laquelle des craquelures ne surviennent pas dans le câblage même lorsqu'elle est utilisée pendant une longue période de temps dans le câblage d'une carte à circuit imprimé flexible. L'invention porte également sur une carte laminée plaquée de cuivre utilisant ladite feuille, sur une carte à circuit imprimé flexible et sur un dispositif électronique. Lorsqu'elle est utilisée pour le câblage dans une carte à circuit imprimé flexible qui connecte électriquement un premier substrat et un second substrat pour lesquels la différence des coefficients de dilatation thermique linéaire est 1,2 fois ou plus, la feuille de cuivre laminée pour une carte à circuit imprimé flexible ne donne pas lieu à des craquelures dans le câblage même lorsque la température de la carte à circuit imprimé flexible est amenée à varier 1 000 fois entre -10°C et -90°C.
PCT/JP2011/076581 2010-11-25 2011-11-17 Feuille de cuivre laminée pour carte à circuit imprimé flexible, carte laminée plaquée de cuivre, carte à circuit imprimé flexible et dispositif électronique WO2012070471A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-262692 2010-11-25
JP2010262692 2010-11-25

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Publication Number Publication Date
WO2012070471A1 true WO2012070471A1 (fr) 2012-05-31

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PCT/JP2011/076581 WO2012070471A1 (fr) 2010-11-25 2011-11-17 Feuille de cuivre laminée pour carte à circuit imprimé flexible, carte laminée plaquée de cuivre, carte à circuit imprimé flexible et dispositif électronique

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WO (1) WO2012070471A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001125127A (ja) * 1999-10-26 2001-05-11 Citizen Watch Co Ltd 液晶装置及びその接続方法
JP2002167632A (ja) * 2000-11-29 2002-06-11 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2003096526A (ja) * 2001-07-17 2003-04-03 Nippon Mining & Metals Co Ltd 銅張積層板用圧延銅箔およびその製造方法
JP2005317880A (ja) * 2004-04-30 2005-11-10 Nikko Metal Manufacturing Co Ltd プリント配線基板用金属材料
JP2008041972A (ja) * 2006-08-08 2008-02-21 Nikko Kinzoku Kk プリント配線基板用金属材料
JP2010239081A (ja) * 2009-03-31 2010-10-21 Nippon Mining & Metals Co Ltd プリント配線板用銅箔
JP2010239095A (ja) * 2009-03-31 2010-10-21 Nippon Mining & Metals Co Ltd プリント配線板用銅箔

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001125127A (ja) * 1999-10-26 2001-05-11 Citizen Watch Co Ltd 液晶装置及びその接続方法
JP2002167632A (ja) * 2000-11-29 2002-06-11 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2003096526A (ja) * 2001-07-17 2003-04-03 Nippon Mining & Metals Co Ltd 銅張積層板用圧延銅箔およびその製造方法
JP2005317880A (ja) * 2004-04-30 2005-11-10 Nikko Metal Manufacturing Co Ltd プリント配線基板用金属材料
JP2008041972A (ja) * 2006-08-08 2008-02-21 Nikko Kinzoku Kk プリント配線基板用金属材料
JP2010239081A (ja) * 2009-03-31 2010-10-21 Nippon Mining & Metals Co Ltd プリント配線板用銅箔
JP2010239095A (ja) * 2009-03-31 2010-10-21 Nippon Mining & Metals Co Ltd プリント配線板用銅箔

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