WO2012042664A1 - 均熱処理装置 - Google Patents
均熱処理装置 Download PDFInfo
- Publication number
- WO2012042664A1 WO2012042664A1 PCT/JP2010/067243 JP2010067243W WO2012042664A1 WO 2012042664 A1 WO2012042664 A1 WO 2012042664A1 JP 2010067243 W JP2010067243 W JP 2010067243W WO 2012042664 A1 WO2012042664 A1 WO 2012042664A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plate
- heat
- heater
- heating means
- soaking
- Prior art date
Links
- 238000002791 soaking Methods 0.000 title claims abstract description 99
- 238000010438 heat treatment Methods 0.000 claims abstract description 88
- 239000012530 fluid Substances 0.000 claims abstract description 72
- 238000012546 transfer Methods 0.000 claims description 76
- 238000003825 pressing Methods 0.000 claims description 29
- 238000009835 boiling Methods 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 2
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000009834 vaporization Methods 0.000 abstract 2
- 230000008016 vaporization Effects 0.000 abstract 2
- 238000001704 evaporation Methods 0.000 description 24
- 230000008020 evaporation Effects 0.000 description 24
- 239000000463 material Substances 0.000 description 12
- 230000004048 modification Effects 0.000 description 12
- 238000012986 modification Methods 0.000 description 12
- 239000007788 liquid Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000004043 responsiveness Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Definitions
- This invention relates to a soaking apparatus for heating a heat treatment object to a soaking state.
- Patent Document 1 Japanese Patent Application Laid-Open No. 9-314561
- Patent Document 2 Japanese Patent Application Laid-Open No. 2007-294688
- FIG. 20 is a perspective view showing a configuration of an example of a conventional heat treatment plate.
- a sealed container 107 is formed by closing both ends of a plurality of through holes 102a formed in the plate 101 with lids 107a and 107b, and the inside of the sealed container 107 is evacuated. After that, a predetermined amount of hydraulic fluid is sealed, and the heater 106 is brought into thermal contact with the bottom surface of the plate 101 via the heat transfer block 104.
- FIG. 21 is a plan view showing the configuration of another example of a conventional heat treatment plate.
- FIG. 22 is a side view showing the configuration of another example of a conventional heat treatment plate.
- pipes 123 are arranged in a plurality of holes formed in the plate 121 to form a meandering circuit of a pipe container, and an inlet 141 serving as one end of the meandering circuit.
- Has an evaporator 143 which forms a single communication circuit with the meandering circuit by connecting an outlet 142 which is the other end of the circuit to the lower part.
- a predetermined amount of the working fluid 131 is sealed after evacuating the inside of this single communication circuit, and the working fluid 131 is heated by the heater 126 mounted inside the evaporator 143.
- the present invention has been made in view of the above problems, and a main purpose thereof is to provide a soaking apparatus that can uniformly heat a heat treatment target and can achieve downsizing of the apparatus. .
- the soaking apparatus includes a plate in which a heat pipe circuit enclosing a working fluid is formed, and heating means for heating the working fluid.
- the heat pipe circuit includes a header portion that heats and vaporizes the working fluid, and a plurality of branches that branch from the header portion that condense and vaporize the vaporized working fluid with the plate.
- the heating means is provided on the wall surface side of the header portion where the hydraulic fluid contacts when the heating means heats the hydraulic fluid.
- the plate is formed in a rectangular shape in a planar shape, the header portion extends along one side surface of the plate, and the branch portion faces the other side surface of the plate facing the one side surface. It is provided to extend.
- the plurality of branch portions are preferably arranged in parallel to each other.
- the heat pipe circuit further includes a connecting portion that connects the branch portions.
- the connecting portion may connect the tips of the branch portions extending from the header portion.
- a plurality of connecting portions may be provided and arranged in parallel to each other.
- the heating means includes a heater, a heat transfer block in which a recess is formed and the heater is accommodated in the recess, and a heater pressing plate that holds the heater in the recess.
- the heating means includes a fixing member that integrally fixes the heater pressing plate and the heat transfer block to the plate.
- the above-mentioned soaking apparatus may include a heat conductive interposition member interposed between the plate and the heat transfer block.
- the heating means may include a heat conductive interposition member interposed between the heat transfer block and the heater pressing plate.
- the heating means may include a heat insulating interposition member interposed between the heat transfer block and the heater pressing plate.
- the heater pressing plate is preferably provided with a recess for accommodating the heater at a position facing the recess.
- a high-performance boiling surface that promotes the boiling of the working fluid is formed on the wall surface of the portion where the working fluid is heated.
- the width of the heating means in thermal contact with the plate is equal to or less than the width of the wall surface in contact with the hydraulic fluid in the portion where the hydraulic fluid is heated.
- the object to be heat-treated can be heated uniformly, and downsizing of the apparatus can be achieved.
- FIG. 2 is a cross-sectional view of a soaking apparatus along the line II-II shown in FIG.
- FIG. 3 is a cross-sectional view of a soaking apparatus along line III-III shown in FIG. It is sectional drawing which shows the detail of a structure of a heating means. It is sectional drawing which shows the 1st modification of the soaking
- FIG. FIG. 6 is a cross-sectional view showing a second modification of the soaking apparatus of the first embodiment. It is sectional drawing which shows the 3rd modification of the soaking
- FIG. 1 is a cross-sectional view of a soaking apparatus along the line II-II shown in FIG.
- FIG. 3 is a cross-sectional view of a soaking apparatus along line III-III shown in FIG. It is sectional drawing which shows the detail of a structure of a heating means. It is sectional drawing which shows the 1st modification of the soaking
- FIG. FIG. 5 is a cross-sectional view of a soaking treatment apparatus according to a third embodiment.
- FIG. 10 is a cross-sectional view of a modification of the soaking apparatus of Embodiment 3. It is sectional drawing of the soaking
- FIG. It is sectional drawing of the soaking
- FIG. It is sectional drawing of the soaking
- FIG. It is sectional drawing which shows the other example of arrangement
- FIG. 10 is a plan view of a soaking treatment apparatus according to a seventh embodiment.
- FIG. 12 is a plan view of another example of the soaking apparatus of the seventh embodiment.
- FIG. 12 is a plan view of another example of the soaking apparatus of the seventh embodiment.
- FIG. 12 is a plan view of another example of the soaking apparatus of the seventh embodiment. It is a perspective view which shows the structure of an example of the conventional heat processing plate. It is a top view which shows the structure of the other example of the conventional heat processing plate. It is a side view which shows the structure of the other example of the conventional heat processing plate.
- FIG. 1 is a plan view of a soaking apparatus according to Embodiment 1 of the present invention.
- FIG. 2 is a sectional view of the soaking apparatus along the line II-II shown in FIG.
- the soaking apparatus of Embodiment 1 includes a rectangular plate 1.
- the plate 1 is made of a material having a high thermal conductivity, such as copper and aluminum.
- the material forming the plate 1 can be arbitrarily selected depending on the soaking performance required for the heat treatment object.
- the plate 1 has a planar shape that is rectangular.
- the surface 1a which is one side of the plate 1 is formed flat so that a heat treatment object such as an organic material for semiconductor manufacturing can be mounted and heated.
- the heating means 3 is attached to the back surface 1b which is the other one surface of the plate 1.
- a heat pipe circuit 2 is formed inside the plate 1.
- the heat pipe circuit 2 includes a header portion 2b and a plurality of branch portions 2a branched from the header portion 2b.
- the header portion 2b is disposed so as to extend along the side surface 1c that forms one side surface of the plate 1 when the plate 1 formed in a planar rectangular shape is viewed in plan.
- the branch portion 2a is provided so as to extend from the header portion 2b toward the side surface 1d forming the other side surface of the plate 1 facing the side surface 1c.
- the plurality of branch portions 2a are arranged in parallel to each other as shown in FIG. On the side surface 1c side of the plate 1, each of the plurality of branch portions 2a is connected to the header portion 2b.
- the circuit inside the plate 1 is formed, for example, by joining a flat plate and a grooved plate.
- the heat pipe circuit 2 is formed by evacuating an internal space 30 formed inside the plate 1 and then filling and enclosing a predetermined amount of working fluid in the internal space 30.
- the hydraulic fluid is heated by the heating means 3 as will be described later.
- FIG. 3 is a cross-sectional view of the soaking apparatus along line III-III shown in FIG.
- FIG. 2 shows a sectional view of the soaking apparatus in a section including the entire header portion 2b and branch portion 2a of the heat pipe circuit 2 extending from the side surface 1c to the side surface 1d of the plate 1.
- FIG. 3 sectional drawing of the soaking
- FIG. 3 illustrates a state in which the working fluid 31 is filled in the header portion 2b of the heat pipe circuit 2 and the working fluid 31 is in contact with the evaporation surface 12 forming the bottom surface of the header portion 2b having a rectangular cross section. Yes.
- the hydraulic fluid 31 is in contact with the evaporation surface 12 which is the wall surface of the header portion 2b on the back surface 1b side of the plate 1 inside the header portion 2b.
- the header portion 2b that forms part of the heat pipe circuit 2 and the heating means 3 are disposed with the plate 1 interposed therebetween.
- the header portion 2 b of the heat pipe circuit 2 has a width l 1 .
- the width in which the heating means 3 is in thermal contact with the plate 1 is the width 10 .
- Heating means 3 the width l 0 in thermal contact with the plate 1 is not more than the width l 1 of the evaporation surface 12.
- the width l 0 of the heating means 3 is in contact with the plate 1 is greater than the width l 1 of the evaporation surface 12 of the header portion 2b, the amount of heat transferred by heat conduction from the heating means 3 to the surface 1a through the back surface 1b of the plate 1 And the temperature may become non-uniform between the side surface 1c side and the side surface 1d side on the surface 1a of the plate 1.
- the heat generated by the heating means 3 is transmitted to the hydraulic fluid 31, and the entire branch portion 2a is uniformly heated by evaporation and condensation of the hydraulic fluid 31, as will be described later, thereby heating the entire plate 1 more uniformly. can do.
- Width l 0 of the heating means 3 is in contact with the plate 1, with respect to the width l 1 of the evaporation surface 12, for example, it may be several mm smaller.
- the optimum dimensions are the material of the plate 1, the thickness of the plate 1 (after processing the heat pipe circuit 2), the thickness of the plate 1 (that is, the distance between the front surface 1 a and the back surface 1 b), and the temperature range to be used. It depends on.
- FIG. 4 is a cross-sectional view showing details of the configuration of the heating means 3, and is an enlarged view of the vicinity of the side surface 1c in FIG.
- the heating unit 3 includes a heater 6, a heat transfer block 4, and a heater pressing plate 10.
- the heat transfer block 4 is formed with a groove-like recess 4 a for fixing the heater 6.
- the heat transfer block 4 has a function as an accommodating portion for accommodating the heater 6 in the recess 4a.
- the heater 6 may be, for example, an electric heater.
- a heater 6 is fitted into a recess 4 a formed in the heat transfer block 4, and the inside of the recess 4 a is enclosed by the heater 6 and the heat transfer material 5.
- the heater 6 is held in the recess 4 a of the heat transfer block 4 by the heater pressing plate 10.
- the heater pressing plate 10 has a function as a holding member that holds the heater 6 in the recess 4a.
- the heating means 3 includes a fixing bolt 9 as a fixing member that integrally fixes the heater pressing plate 10 and the heat transfer block 4 to the plate 1.
- the heat transfer block 4 is in thermal contact with a part of the back surface 1 b that is one side of the plate 1, and a part of the plate 1 is heated by the heater 6 held in the heat transfer block 4.
- the heat transport principle inside the soaking apparatus will be described with reference to FIG. 2 and FIG. 2 and 4, the heat flow 21 in the figure indicates the flow of heat from the heating means 3 toward the plate 1.
- the heat is transferred to the contact surface 14 between the plate 1 and the heat transfer block 4 via the heat transfer material 5 and the heat transfer block 4.
- the heat is further transferred to the evaporation surface 12 at the bottom of the header portion 2 b inside the plate 1 via the inside of the plate 1.
- the bottom part of the header part 2 b inside the plate 1 is heated by the heat flow 21, whereby the bottom part of the header part 2 b becomes the evaporation surface 12 of the hydraulic fluid 31.
- the working fluid 31 filled in the plate 1 is heated on the evaporation surface 12 in the header portion 2b. Since the inside of the plate 1 is in a vacuum-depressurized state, when the hydraulic fluid 31 is heated, the hydraulic fluid 31 is quickly vaporized to generate vapor bubbles 32. The vapor bubble 32 ascends in the hydraulic fluid 31 and becomes a vapor 33 from the liquid level of the hydraulic fluid 31 and moves in the heat pipe circuit 2 formed in the plate 1 from the side surface 1c side to the side surface 1d surface direction. Then, it branches from the header portion 2b and flows into each of the plurality of branch portions 2a.
- the vapor 33 moves in the internal space 30 formed in the plate 1 and moves to the surface 1a side opposite to the back surface 1b to which the heating means 3 is attached.
- the steam 33 is condensed and liquefied in each part in the branch part 2a of the heat pipe circuit 2 while moving in the internal space 30 from the side face 1c side to the side face 1d side, and is in thermal contact with the branch part 2a. Releases latent heat of condensation in part 1. In this way, the steam 33 is condensed by dissipating heat to the plate 1, and changes its state to the condensate 34. While the steam 33 flows toward the side surface 1d, heat is uniformly transmitted to the plate 1 in the entire branch portion 2a, and the plate 1 absorbs heat from the steam 33, whereby the plate 1 is heated at a uniform temperature.
- the water level of the working fluid 31 in the branch portion 2a is as shown in FIG.
- the side 1d side is larger than the 1c side.
- the hydraulic fluid 31 recirculates from the side surface 1d side to the side surface 1c side filled with the original hydraulic fluid 31 due to the level difference of the water level.
- the heat transport from the heater 6 to the plate 1 described above is repeated.
- the header part 2b functions as a heating part in which the hydraulic fluid 31 is heated and vaporized.
- the branch part 2a functions as a condensing part in which the steam 33 vaporized from the working liquid 31 is condensed by exchanging heat with the plate 1.
- the header part 2b has a function as a steam distribution header that distributes the steam 33 generated in the header part 2b to the plurality of branch parts 2a.
- the header part 2b also has a function as a liquid assembly header in which the condensate 34 obtained by condensing and condensing the vapor 33 in the plurality of branch parts 2a gathers.
- Each of the plurality of branch portions 2a is formed in a lateral branch tubular shape that extends in a direction intersecting (typically orthogonal) to the extending direction of the header portion 2b with respect to the header tubular header portion 2b.
- the heating means 3 is provided on the evaporation surface 12 side of the header portion 2b, which is the wall surface with which the working fluid 31 comes into contact when the heating means 3 heats the liquid working fluid 31. ing. Since the evaporation surface 12 is immediately above the contact surface 14 where the plate 1 and the heat transfer block 4 are in contact, the amount of heat directly transferred to the surface 1 a of the plate 1 out of the heat from the heater 6 is small. Most of the heat from the heater 6 is spent heating the hydraulic fluid 31 on the evaporation surface 12. Since the heat pipe circuit 2 and the heating means 3 have the dimensions specified in FIG. 3, the amount of heat transmitted to the hydraulic fluid 31 among the heat generated by the heater 6 is further increased.
- the working fluid 31 in the plate 1 is evaporated, and the vapor 33 vaporized by the working fluid 31 is diffused to each part in the plate 1. it can. Since the working fluid 31 is evaporated by the header portion 2b in the plate 1 to generate the steam 33, and the steam 33 is condensed by the branch portion 2a, the plate 1 can be heated, so that the surface 1a of the surface 1a of the plate 1 is soaked. Can be improved. Therefore, the heat treatment object mounted on the surface 1a of the plate 1 can be uniformly heated.
- the entire plate 1 can be heated by one heating means 3, and a plurality of heaters are not required as in the method shown in the prior art of FIG. Therefore, since the number of parts can be reduced, the manufacturing cost of the soaking apparatus can be reduced. Further, since the heat generated by the heater 6 is immediately transmitted to each part of the plate 1 due to the evaporation phenomenon of the hydraulic fluid 31, the temperature rise of the heater 6 can be suppressed and the amount of heat generated to the surroundings can be reduced, thereby reducing the required energy. The running cost of the soaking apparatus can be reduced. In addition, since the evaporation surface 12 is provided inside the plate 1, there is no need to separately provide an evaporation portion as in the prior art of FIGS. Therefore, it is possible to achieve downsizing and further cost reduction of the soaking apparatus, and it is possible to reduce the heat capacity of the plate 1, so that it is possible to obtain a soaking apparatus with high thermal response.
- FIG. 5 is a cross-sectional view showing a first modification of the soaking apparatus of the first embodiment.
- the soaking apparatus of the first modification shown in FIG. 5 is different from the configuration shown in FIG. 4 in that it includes a heat conductive interposition member 7 interposed between the plate 1 and the heat transfer block 4. As shown in FIG. 5, when the heat conductive interposition member 7 is sandwiched between the contact surface 14 between the back surface 1 b of the plate 1 and the heat transfer block 4, the contact between the back surface 1 b of the plate 1 and the heat transfer block 4. Thermal resistance is reduced.
- the thermal responsiveness of the soaking device is further improved.
- the amount of heat dissipated from the surface of the heat transfer block 4 and the heater pressing plate 10 to the surroundings is reduced, and a soaking apparatus with higher thermal efficiency can be provided.
- FIG. 6 is a cross-sectional view showing a second modification of the soaking apparatus of the first embodiment.
- the soaking apparatus of the second modification shown in FIG. 6 is shown in FIG. 5 in that the heating means 3 includes a thermally conductive interposing member 8 interposed between the heat transfer block 4 and the heater pressing plate 10. It is different from the configuration.
- the heat generated in the heater 6 is also transferred to the heater holding plate 10 via the heat transfer material 5.
- FIG. 6 when the heat conductive interposition member 8 is sandwiched between the heat transfer block 4 and the heater holding plate 10, the thermal resistance between the heater holding plate 10 and the heat transfer block 4 becomes small. It becomes easy to transfer heat from the heater pressing plate 10 to the heat transfer block 4 as in the heat flow 22 shown in FIG.
- the amount of heat lost to the surroundings out of the heat transmitted to the heater pressing plate 10 can be reduced, and the heat flow 22 from the heater pressing plate 10 to the heat transfer block 4 can be increased.
- the transmitted heat can be transferred to the heat transfer block 4 more efficiently.
- the heat transferred from the heat transfer block 4 to the working fluid 31 via the plate 1 to heat the working fluid 31 increases, so that the thermal responsiveness of the soaking apparatus can be further improved.
- FIG. 7 is a cross-sectional view showing a third modification of the soaking apparatus of the first embodiment.
- the soaking apparatus of the third modified example shown in FIG. 7 has the configuration shown in FIG. 5 in that the heating means 3 includes a heat insulating interposed member 8a interposed between the heat transfer block 4 and the heater pressing plate 10. Is different.
- FIG. 6 the example in which the heat conductive interposition member 8 is sandwiched between the heat transfer block 4 and the heater pressing plate 10 has been described, but conversely, as shown in FIG. If the interstitial member 8a having heat insulation is sandwiched between them, the amount of heat flow flowing from the heater 6 to the heater holding plate 10 can be reduced.
- the heater pressing plate 10 may be formed of a material having low thermal conductivity.
- FIG. 8 is a cross-sectional view of the soaking apparatus of the second embodiment.
- the soaking apparatus of the second embodiment is different from the first embodiment in that the heating means 3 does not include the heat transfer block 4.
- the heat transfer block 4 is not used, and a groove-like depression 10 a for fixing the heater 6 to the heater pressing plate 10 is formed.
- the heater 6 is incorporated in a recess 10 a as a groove processed in the heater pressing plate 10.
- the heater 6 is accommodated in a recess 10a formed in the heater pressing plate 10, and a heat transfer material 5 is disposed around the heater 6. The inside of the hollow portion 10 a is enclosed by the heater 6 and the heat transfer material 5.
- the heater holding plate 10 is fixed by a fixing bolt 9 in direct contact with the back surface 1b immediately below the header portion 2b in the plate 1.
- FIG. 9 is a sectional view of the soaking apparatus of the third embodiment.
- the soaking apparatus of the third embodiment is different from the first and second embodiments in that the place where the heater 6 is fixed is changed.
- both the heat transfer block 4 and the heater pressing plate 10 included in the heating unit 3 are fixed to the plate 1 using the fixing bolts 9.
- the structure was removable from the plate 1.
- the heater 6 is incorporated in the groove-like depression 10 a for fixing the heater 6 to the heater pressing plate 10.
- the heat transfer block 4 and the plate 1 are thermally integrated by a method such as brazing or welding.
- the component that fixes the heater 6 (the heat transfer block 4 in the first embodiment and the heater pressing plate 10 in the second embodiment) and the plate 1 are separate members.
- the contact surface 14 between the component fixing the plate and the plate 1 is not completely in close contact with each other, so that contact thermal resistance is generated. Even when the heat conductive interposition member 7 is arranged between the heat transfer block 4 and the plate 1, the contact heat resistance is reduced, but the heat resistance between the heat transfer block 4 and the plate 1 is completely eliminated. Was difficult.
- the heat resistance between the heat transfer block 4 and the back surface 1b of the plate 1 is obtained by thermally integrating the heat transfer block 4 and the plate 1 as shown in FIG. Can be made extremely small.
- FIG. 10 is a cross-sectional view of a modification of the soaking apparatus of the third embodiment. 9 and FIG. 10, in the modification shown in FIG. 10, a recess 10 a that accommodates the heater 6 is formed at a position of the heater pressing plate 10 that faces the recess 4 a.
- the heater 6 is disposed over both the recessed portion 4 a formed in the heat transfer block 4 and the recessed portion 10 a formed in the heater holding plate 10.
- the interior of the space formed by the recess 4 a and the recess 10 a is enclosed by the heater 6 and the heat transfer material 5.
- the effect of reducing the thermal resistance between the heat transfer block 4 and the back surface 1b of the plate 1 of the soaking apparatus of the third embodiment described with reference to FIG. 9 does not depend on the size of the heat transfer block 4. . That is, as shown in FIG. 10, the same effect can be obtained even if the size of the heat transfer block 4 is reduced and the size of the heater pressing plate 10 is increased. In addition, in the modified example shown in FIG. 10, the size of the heat transfer block 4 is reduced, so that the plate 1 can be cut from a slightly larger material integrally with the heat transfer block 4 and processed. Therefore, the manufacturing time of the soaking apparatus can be shortened, and the manufacturing cost can be reduced.
- FIG. 11 is a cross-sectional view of the soaking apparatus of the fourth embodiment.
- the soaking apparatus of the fourth embodiment has a structure in which the heater pressing plate 10 of the heating means 3 of the third embodiment is integrally joined to the heat transfer block 4 and integrated.
- the heat transferred to the heater holding plate 10 by the heater 6 is like a heat flow 22.
- thermal resistance is generated.
- the heater pressing plate 10 is thermally integrated with the heat transfer block 4, and the plate 1, the heat transfer block 4 and the entire heater pressing plate 10 are thermally integrated.
- the thermal resistance in the path through which the heat generated by the heater 6 is transmitted to the plate 1 is further smaller than that of the third embodiment described above.
- the amount of heat that is transmitted from the heat transfer block 4 to the working fluid 31 via the plate 1 and heats the working fluid 31 increases, so that the thermal responsiveness of the soaking apparatus can be further improved.
- FIG. 12 is a cross-sectional view of the soaking apparatus of the fifth embodiment.
- the high-performance boiling surface 39 that promotes the boiling of the working fluid 31 is provided on the evaporation surface 12 that is the wall surface of the header portion 2b of the heat pipe circuit 2 where the heating means 3 is provided.
- the high-performance boiling surface 39 is for accelerating heat transfer by boiling heat transfer from the heating means 3 to the plate 1.
- the boiling of the working fluid 31 is a phenomenon in which the vapor bubbles 32 that have grown on the evaporation surface 12 with the fine bubble nuclei as the starting point are detached from the evaporation surface 12.
- the evaporation surface 12 may have a structure in which a number of minute dents are formed on the surface and minute bubble nuclei are easily generated.
- the high-performance boiling surface 39 may be a metal particle welded to the evaporation surface 12 of the plate 1 or a groove processed on the evaporation surface 12.
- the hydraulic fluid 31 easily boiles to become a vapor bubble 32, and the generation of the vapor 33 is promoted.
- the amount of heat transferred to the working fluid 31 can be increased and the amount of heat transferred to the surface 1a by the heat conduction in the plate 1 can be reduced as compared with the first to fourth embodiments. Therefore, since the heat generated by the heater 6 can be used more efficiently for the generation of the steam 33, the thermal responsiveness of the soaking apparatus can be further improved.
- FIG. 13 is a cross-sectional view of the soaking apparatus of the sixth embodiment.
- the groove depth of the branch portion 2a of the heat pipe circuit 2 formed inside the plate 1 is described as being the same throughout the extending direction of the branch portion 2a. It is not limited to a simple configuration.
- the heat pipe circuit 2 may be formed so that the groove depth of the branch portion 2 a on the side surface 1 d side is smaller than that on the side surface 1 c side of the plate 1.
- the condensate 34 generated by condensing the vapor 33 in the branch portion 2a causes the bottom surface of the inclined branch portion 2a to be viewed from the side surface 1d side. It becomes easy to flow toward the side surface 1c.
- the hydraulic fluid 31 can be easily returned to the header part 2b which heats the hydraulic fluid 31, and the evaporation of the evaporation surface 12 can be prevented and the efficiency of the heat pipe circuit 2 can be improved.
- the thermal responsiveness of the soaking apparatus can be further improved.
- the plate 1 is arranged in the horizontal state, but the arrangement of the plate 1 is not limited to the horizontal state.
- 14 and 15 are cross-sectional views showing other examples of the arrangement of the plates 1. As shown in FIG. 14, the plate 1 may be arranged in a vertically standing state, and as shown in FIG. 15, the plate 1 may be arranged in an inclined state.
- the heating means on the wall surface side of the header portion 2b of the heat pipe circuit 2 that is in contact with the working liquid 31 when the heating means 3 heats the working liquid. 3 can be arranged, and in this way, the effect of efficiently transferring heat from the heating means 3 to the hydraulic fluid 31 can be obtained in the same manner as described above.
- the heating means 3 can be attached to the side surface 1 c side of the plate 1 without being limited to the configuration in which the heating means 3 is provided on the back surface 1 b side of the plate 1. is there.
- a duct or container surrounding the space can be formed by the soaking apparatus of the present invention. If the object to be heat-treated is accommodated in such a duct or container, the object to be heat-treated can be heated more uniformly.
- FIG. 16 is a plan view of the soaking apparatus of the seventh embodiment.
- the heat pipe circuit 2 formed inside the plate 1 includes a header portion 2b and branch portions 2a extending orthogonally to the header portion 2b and processed in parallel with each other.
- the present invention is not limited to such a configuration.
- the heat pipe circuit 2 may further include a connecting portion 2d that connects the branch portions 2a extending from the header portion 2b.
- the surface 1a of the plate 1 can be heated more uniformly. If the connecting portion 2d is formed so as to connect the tips of the branch portions 2a, when the heat pipe circuit 2 is formed by machining, the tool is moved relative to the plate 1 so as to follow a loop-shaped path. Can be processed. Therefore, the processing time for processing the plate 1 to form the heat pipe circuit 2 can be shortened, and the manufacturing cost of the soaking apparatus can be further reduced.
- FIGS. 17 to 19 are plan views of other examples of the soaking apparatus of the seventh embodiment.
- the heat pipe circuit 2 having the shape shown in FIGS. 17 and 18 is formed, similarly to the configuration of FIG. 16, the effect of increasing the path of the steam 33 and reducing the manufacturing cost of the soaking apparatus can be obtained.
- FIG. 19 if a grid-like heat pipe circuit 2 is formed in which a plurality of connecting portions 2d are provided and the plurality of connecting portions 2d are arranged in parallel to each other, the path of the steam 33 is further increased.
- the surface 1a of the plate 1 can be heated more uniformly.
- the heat pipe circuit 2 is formed along the entire periphery of the plate 1 as shown in FIGS. 17 to 19, heating by the steam 33 is performed on all the side surfaces of the plate 1, Temperature drop due to partial heat dissipation can be reduced. Therefore, as shown in FIG. 1 or FIG. 16, compared with the configuration in which the heat pipe circuit 2 is not partially provided on the end portion side of the plate 1 on the side away from the header portion 2b, the heat uniformity of the plate 1 is further increased. Can be improved.
- the present invention can be particularly advantageously applied to a soaking apparatus that heats an object to be heat-treated such as an organic material for manufacturing a semiconductor to a soaking state.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Resistance Heating (AREA)
Abstract
Description
図1は、本発明の実施の形態1の均熱処理装置の平面図である。図2は、図1中に示すII-II線に沿う均熱処理装置の断面図である。図1および図2に示すように、実施の形態1の均熱処理装置は、矩形板状のプレート1を備える。プレート1は、たとえば銅、アルミニウムなどに代表される、熱伝導率の大きい材料により形成されている。プレート1を形成する材料は、加熱処理対象物に要求される均熱性能によって、任意に選択することができる。
図8は、実施の形態2の均熱処理装置の断面図である。実施の形態2の均熱処理装置は、加熱手段3が伝熱ブロック4を備えていない点で、実施の形態1と異なっている。
図9は、実施の形態3の均熱処理装置の断面図である。実施の形態3の均熱処理装置は、ヒータ6を固定する場所を変更した点で、実施の形態1および実施の形態2と異なっている。具体的には、実施の形態1では、加熱手段3に含まれる伝熱ブロック4とヒータ押さえ板10との両方が固定ボルト9を使用してプレート1に固定されており、伝熱ブロック4はプレート1から取り外すことができる構造であった。また、実施の形態2では、ヒータ押さえ板10にヒータ6を固定するための溝状の窪み部10aにヒータ6が組み込まれている。これに対し、実施の形態3では、伝熱ブロック4とプレート1とは、ロウ付け、溶接などの方法で熱的に一体化されている。
図11は、実施の形態4の均熱処理装置の断面図である。実施の形態4の均熱処理装置は、実施の形態3の加熱手段3のヒータ押さえ板10を伝熱ブロック4に金属的に接合して一体化した構造を有する。
図12は、実施の形態5の均熱処理装置の断面図である。実施の形態5の均熱処理装置は、ヒートパイプ回路2のヘッダ部2bの、加熱手段3が設けられる側の壁面である蒸発面12に、作動液31の沸騰を促進する高性能沸騰面39が形成されている点で、実施の形態4と異なっている。高性能沸騰面39は、加熱手段3からプレート1への沸騰熱伝達による伝熱を促進するためのものである。
図13は、実施の形態6の均熱処理装置の断面図である。実施の形態1の説明においては、プレート1の内部に形成されたヒートパイプ回路2の枝部2aの溝深さは、枝部2aの延びる方向の全体に亘って同一として説明したが、このような構成に限られない。たとえば、図13に示すようにプレート1の側面1c側よりも側面1d側の枝部2aの溝深さをより小さくするように、ヒートパイプ回路2を形成してもよい。
図16は、実施の形態7の均熱処理装置の平面図である。実施の形態1の説明においては、プレート1の内部に形成されたヒートパイプ回路2が、ヘッダ部2bと、ヘッダ部2bに対し直交して延び互いに並行に加工された枝部2aとを含む例について説明したが、このような構成に限られない。たとえばヒートパイプ回路2は、図16に示すように、ヘッダ部2bから延びる枝部2a同士を連結する連結部2dをさらに含んでもよい。
Claims (14)
- 作動液(31)を封入したヒートパイプ回路(2)が内部に形成されたプレート(1)と、
前記作動液(31)を加熱する加熱手段(3)と、を備え、
前記ヒートパイプ回路(2)は、作動液(31)が加熱され気化するヘッダ部(2b)と、前記作動液(31)が気化した蒸気(33)が前記プレート(1)と熱交換して凝縮する、前記ヘッダ部(2b)から分枝する複数の枝部(2a)とを含み、
前記加熱手段(3)は、前記ヘッダ部(2b)の、前記加熱手段(3)が前記作動液(31)を加熱するときに前記作動液(31)が接触する壁面(12)側に設けられている、均熱処理装置。 - 前記プレート(1)は、平面形状矩形状に形成されており、
前記ヘッダ部(2b)は、前記プレート(1)の一側面(1c)に沿って延び、前記枝部(2a)は前記一側面(1c)と対向する前記プレート(1)の他の側面(1d)へ向かって延びるように設けられている、請求の範囲第1項に記載の均熱処理装置。 - 前記複数の枝部(2a)は、互いに平行に配置されている、請求の範囲第2項に記載の均熱処理装置。
- 前記ヒートパイプ回路(2)は、前記枝部(2a)同士を連結する連結部(2d)をさらに含む、請求の範囲第2項に記載の均熱処理装置。
- 前記連結部(2d)は、前記ヘッダ部(2b)から延びる前記枝部(2a)の先端同士を連結する、請求の範囲第4項に記載の均熱処理装置。
- 前記連結部(2d)は、複数設けられ、互いに平行に配置されている、請求の範囲第4項に記載の均熱処理装置。
- 前記加熱手段(3)は、ヒータ(6)と、凹部(4a)が形成され前記凹部(4a)内に前記ヒータ(6)を収容する伝熱ブロック(4)と、前記ヒータ(6)を前記凹部(4a)内に保持するヒータ押さえ板(10)と、を含む、請求の範囲第1項に記載の均熱処理装置。
- 前記加熱手段(3)は、前記ヒータ押さえ板(10)と前記伝熱ブロック(4)とを一体に前記プレート(1)に固定する固定部材(9)を含む、請求の範囲第7項に記載の均熱処理装置。
- 前記プレート(1)と前記伝熱ブロック(4)との間に介在する熱伝導性の介在部材(7)を備える、請求の範囲第7項に記載の均熱処理装置。
- 前記加熱手段(3)は、前記伝熱ブロック(4)と前記ヒータ押さえ板(10)との間に介在する熱伝導性の介在部材(8)を備える、請求の範囲第7項に記載の均熱処理装置。
- 前記加熱手段(3)は、前記伝熱ブロック(4)と前記ヒータ押さえ板(10)との間に介在する断熱性の介在部材(8a)を備える、請求の範囲第7項に記載の均熱処理装置。
- 前記ヒータ押さえ板(10)には、前記凹部(4a)と対向する位置に、前記ヒータ(6)を収容する窪み部(10a)が形成されている、請求の範囲第7項に記載の均熱処理装置。
- 前記壁面(12)には、前記作動液(31)の沸騰を促進する高性能沸騰面(39)が形成されている、請求の範囲第1項に記載の均熱処理装置。
- 前記加熱手段(3)が前記プレート(1)に熱的に接触する幅(l0)は、前記壁面(12)の幅(l1)以下である、請求の範囲第1項に記載の均熱処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/817,546 US20130146258A1 (en) | 2010-10-01 | 2010-10-01 | Isothermal heating apparatus |
JP2012536109A JP5536224B2 (ja) | 2010-10-01 | 2010-10-01 | 均熱処理装置 |
PCT/JP2010/067243 WO2012042664A1 (ja) | 2010-10-01 | 2010-10-01 | 均熱処理装置 |
KR1020137005803A KR101404319B1 (ko) | 2010-10-01 | 2010-10-01 | 균열 처리 장치 |
CN201080069337.8A CN103140919B (zh) | 2010-10-01 | 2010-10-01 | 均热处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2010/067243 WO2012042664A1 (ja) | 2010-10-01 | 2010-10-01 | 均熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012042664A1 true WO2012042664A1 (ja) | 2012-04-05 |
WO2012042664A9 WO2012042664A9 (ja) | 2013-04-04 |
Family
ID=45892168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/067243 WO2012042664A1 (ja) | 2010-10-01 | 2010-10-01 | 均熱処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20130146258A1 (ja) |
JP (1) | JP5536224B2 (ja) |
KR (1) | KR101404319B1 (ja) |
CN (1) | CN103140919B (ja) |
WO (1) | WO2012042664A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017223592B4 (de) * | 2017-12-21 | 2023-11-09 | Meyer Burger (Germany) Gmbh | System zur elektrisch entkoppelten, homogenen Temperierung einer Elektrode mittels Wärmeleitrohren sowie Bearbeitungsanlage mit einem solchen System |
JP2019128465A (ja) * | 2018-01-25 | 2019-08-01 | セイコーエプソン株式会社 | 光源装置およびプロジェクター |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56127191A (en) * | 1980-03-10 | 1981-10-05 | Matsushita Electric Works Ltd | Radiator |
JPH09293730A (ja) * | 1996-04-25 | 1997-11-11 | Mitsubishi Electric Corp | 加熱装置 |
JPH11283919A (ja) * | 1998-03-30 | 1999-10-15 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
JP2001021281A (ja) * | 1999-07-09 | 2001-01-26 | Mitsubishi Electric Corp | 均熱装置 |
JP2004174963A (ja) * | 2002-11-28 | 2004-06-24 | Mitsubishi Electric Corp | 均熱装置 |
JP2007294688A (ja) * | 2006-04-25 | 2007-11-08 | Toshiba Mitsubishi-Electric Industrial System Corp | 均熱処理装置 |
JP2009105156A (ja) * | 2007-10-22 | 2009-05-14 | Toshiba Mitsubishi-Electric Industrial System Corp | 均熱処理装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3069526A (en) * | 1959-07-20 | 1962-12-18 | Gen Motors Corp | Electric hot plate |
JP3034337B2 (ja) * | 1991-06-10 | 2000-04-17 | 昭和アルミニウム株式会社 | 平板状ヒートパイプ |
US5826645A (en) * | 1997-04-23 | 1998-10-27 | Thermal Corp. | Integrated circuit heat sink with rotatable heat pipe |
JP2001349682A (ja) * | 2000-06-05 | 2001-12-21 | Toshiba Corp | 沸騰冷却装置 |
JP2003139476A (ja) * | 2001-11-01 | 2003-05-14 | Toshiba Corp | 沸騰冷却装置 |
CN100434857C (zh) * | 2003-01-21 | 2008-11-19 | 三菱电机株式会社 | 气泡泵型热输送设备 |
JP2005195296A (ja) * | 2004-01-09 | 2005-07-21 | Matsushita Electric Ind Co Ltd | 熱電素子モジュール放熱促進装置、ならびにそれを用いた冷蔵庫 |
CN100557773C (zh) * | 2005-09-21 | 2009-11-04 | 东京毅力科创株式会社 | 热处理装置 |
JP5227672B2 (ja) * | 2008-06-17 | 2013-07-03 | 古河電気工業株式会社 | ヒートパイプの固定方法およびヒートシンク |
JP2011122813A (ja) * | 2009-11-16 | 2011-06-23 | Just Thokai:Kk | 薄型ヒートパイプ及びそれを用いた温度調整パネル |
-
2010
- 2010-10-01 JP JP2012536109A patent/JP5536224B2/ja active Active
- 2010-10-01 CN CN201080069337.8A patent/CN103140919B/zh active Active
- 2010-10-01 US US13/817,546 patent/US20130146258A1/en not_active Abandoned
- 2010-10-01 WO PCT/JP2010/067243 patent/WO2012042664A1/ja active Application Filing
- 2010-10-01 KR KR1020137005803A patent/KR101404319B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56127191A (en) * | 1980-03-10 | 1981-10-05 | Matsushita Electric Works Ltd | Radiator |
JPH09293730A (ja) * | 1996-04-25 | 1997-11-11 | Mitsubishi Electric Corp | 加熱装置 |
JPH11283919A (ja) * | 1998-03-30 | 1999-10-15 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
JP2001021281A (ja) * | 1999-07-09 | 2001-01-26 | Mitsubishi Electric Corp | 均熱装置 |
JP2004174963A (ja) * | 2002-11-28 | 2004-06-24 | Mitsubishi Electric Corp | 均熱装置 |
JP2007294688A (ja) * | 2006-04-25 | 2007-11-08 | Toshiba Mitsubishi-Electric Industrial System Corp | 均熱処理装置 |
JP2009105156A (ja) * | 2007-10-22 | 2009-05-14 | Toshiba Mitsubishi-Electric Industrial System Corp | 均熱処理装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2012042664A9 (ja) | 2013-04-04 |
CN103140919A (zh) | 2013-06-05 |
KR101404319B1 (ko) | 2014-06-05 |
US20130146258A1 (en) | 2013-06-13 |
JPWO2012042664A1 (ja) | 2014-02-03 |
CN103140919B (zh) | 2016-05-04 |
KR20130032915A (ko) | 2013-04-02 |
JP5536224B2 (ja) | 2014-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6015675B2 (ja) | 冷却装置及びそれを用いた電子機器 | |
WO2019151291A1 (ja) | ヒートシンク | |
EP3907455B1 (en) | Phase-change heat dissipation device | |
JP2022518864A (ja) | 相転移放熱装置 | |
JP2013004562A (ja) | 沸騰冷却システム | |
JP2009115396A (ja) | ループ型ヒートパイプ | |
JP2023009093A (ja) | ベーパーチャンバおよびベーパーチャンバ搭載基板 | |
JP7220434B2 (ja) | 沸騰冷却構造 | |
TW202040081A (zh) | 散熱器 | |
EP3255362B1 (en) | Semiconductor cooling refrigerator | |
JP5536224B2 (ja) | 均熱処理装置 | |
JP5334288B2 (ja) | ヒートパイプおよび電子機器 | |
JP6156368B2 (ja) | 冷却装置の接続構造、冷却装置、および冷却装置の接続方法 | |
JP6557112B2 (ja) | 携帯型情報機器の放熱装置 | |
JP5688477B1 (ja) | 放熱用熱伝達ユニット | |
KR102620058B1 (ko) | 방열 구조체 및 이를 포함하는 전자 장치 | |
JP5546280B2 (ja) | ヒートパイプ受熱部の接続部およびヒートパイプ受熱部の接続方法 | |
JP2012237491A (ja) | 平板型冷却装置、その製造方法及びその使用方法 | |
US20100006267A1 (en) | Covered plate-type heat pipe | |
CN112911028A (zh) | 均温板、终端设备及均温板的制造方法 | |
JP2021188890A (ja) | 伝熱部材および伝熱部材を有する冷却デバイス | |
JPH0942870A (ja) | ヒートパイプ式ヒートシンク | |
JP5625835B2 (ja) | ヒートパイプ | |
JP7444703B2 (ja) | 伝熱部材および伝熱部材を有する冷却デバイス | |
JP2000183259A (ja) | 沸騰冷却装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080069337.8 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10857877 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2012536109 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13817546 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 20137005803 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 10857877 Country of ref document: EP Kind code of ref document: A1 |