US20130146258A1 - Isothermal heating apparatus - Google Patents
Isothermal heating apparatus Download PDFInfo
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- US20130146258A1 US20130146258A1 US13/817,546 US201013817546A US2013146258A1 US 20130146258 A1 US20130146258 A1 US 20130146258A1 US 201013817546 A US201013817546 A US 201013817546A US 2013146258 A1 US2013146258 A1 US 2013146258A1
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- plate
- heating apparatus
- working fluid
- heater
- heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Definitions
- the present invention relates to an isothermal heating apparatus that heats a heat-treatment subject into an isothermally heated state.
- a conventional technique regarding an isothermal heating plate that heat-treats a heat-treatment subject into an isothermally heated state is disclosed in, for example, Japanese Laid-Open Patent Publication No. 9-314561 (PTL 1) or Japanese Laid-Open Patent Publication No. 2007-294688 (PTL 2).
- FIG. 20 is a perspective view showing a structure of an example of a conventional isothermal heating plate.
- An isothermal heating plate shown in FIG. 20 has a structure in which the both ends of each of a plurality of through holes 102 a formed in a plate 101 are closed with lids 107 a and 107 b to form a sealed container 107 , the inside of this sealed container 107 is evacuated and then a predetermined amount of working fluid is charged, and a heater 106 is brought into thermal contact with the bottom of plate 101 with a heat transfer block 104 interposed therebetween.
- FIG. 21 is a plan view showing a structure of another example of a conventional isothermal heating plate.
- FIG. 22 is a side view showing the structure of the other example of the conventional isothermal heating plate.
- the isothermal heating plate shown in FIGS. 21 and 22 has a pipe 123 arranged in a plurality of holes formed in a plate 121 to form a meandering circuit of a pipe container, and has an evaporator 143 with an entrance 141 serving as one end of the meandering circuit being connected to the upper part and an exit 142 serving as the other end of the circuit being connected to the lower part to form a single communication circuit with the meandering circuit.
- the inside of this single communication circuit is evacuated and then a predetermined amount of working fluid 131 is charged, and working fluid 131 is heated by a heater 126 fitted in evaporator 143 .
- the present invention was made in view of the above-described problems, and has a main object to provide an isothermal heating apparatus capable of isothermally heating a heat-treatment subject and achieving size reduction of the apparatus.
- An isothermal heating apparatus includes a plate having formed therein a heat pipe circuit in which a working fluid is charged, and heating means heating the working fluid.
- the heat pipe circuit includes a header portion at which the working fluid is heated and evaporated and a plurality of branch portions in which vapor produced by vaporization of the working fluid exchanges heat with the plate and condensates, the branch portions branching off from the header portion.
- the heating means is provided on a wall surface side of the header portion with which the working fluid is in contact when the heating means heats the working fluid.
- the plate is formed to have a rectangular shape in plan view, the header portion extends along one side surface of the plate, and the branch portions are provided to extend toward an other side surface of the plate opposed to the one side surface.
- the plurality of branch portions are arranged in parallel to one another.
- the heat pipe circuit further includes a coupling portion coupling the branch portions.
- the coupling portion may couple tips of the branch portions extending from the header portion.
- a plurality of the coupling portions may be provided and may be arranged in parallel to one another.
- the heating means includes a heater, a heat transfer block formed with a recess and storing the heater in the recess, and a heater holding plate holding the heater in the recess.
- the heating means includes a fixing member fixing the heater holding plate and the heat transfer block integrally to the plate.
- the above-described isothermal heating apparatus may include a thermally conductive interposed member interposed between the plate and the heat transfer block.
- the heating means may include a thermally conductive interposed member interposed between the heat transfer block and the heater holding plate.
- the heating means may include a thermally insulative interposed member interposed between the heat transfer block and the heater holding plate.
- a hollowed portion storing the heater is formed in the heater holding plate at a position opposed to the recess.
- a high performance boiling surface promoting boiling of the working fluid is formed in the wall surface with which the working fluid is in contact where the working fluid is heated.
- a width by which the heating means is in thermal contact with the plate is less than or equal to a width of the wall surface with which the working fluid is in contact where the working fluid is heated.
- a heat-treatment subject can be heated isothermally, and size reduction of the apparatus can be achieved.
- FIG. 1 is a plan view of an isothermal heating apparatus of a first embodiment of the present invention.
- FIG. 2 is a sectional view of the isothermal heating apparatus taken along the line II-II shown in FIG. 1 .
- FIG. 3 is a sectional view of the isothermal heating apparatus taken along the line shown in FIG. 1 .
- FIG. 4 is a sectional view showing details of the structure of heating means.
- FIG. 5 is a sectional view showing a first variation of the isothermal heating apparatus of the first embodiment.
- FIG. 6 is a sectional view showing a second variation of the isothermal heating apparatus of the first embodiment.
- FIG. 7 is a sectional view showing a third variation of the isothermal heating apparatus of the first embodiment.
- FIG. 8 is a sectional view of an isothermal heating apparatus of a second embodiment.
- FIG. 9 is a sectional view of an isothermal heating apparatus of a third embodiment.
- FIG. 10 is a sectional view of a variation of the isothermal heating apparatus of the third embodiment.
- FIG. 11 is a sectional view of an isothermal heating apparatus of a fourth embodiment.
- FIG. 12 is a sectional view of an isothermal heating apparatus of a fifth embodiment.
- FIG. 13 is a sectional view of an isothermal heating apparatus of a sixth embodiment.
- FIG. 14 is a sectional view showing another example of arrangement of a plate.
- FIG. 15 is a sectional view showing another example of arrangement of a plate.
- FIG. 16 is a plan view of an isothermal heating apparatus of a seventh embodiment.
- FIG. 17 is a plan view of another example of the isothermal heating apparatus of the seventh embodiment.
- FIG. 18 is a plan view of another example of the isothermal heating apparatus of the seventh embodiment.
- FIG. 19 is a plan view of another example of the isothermal heating apparatus of the seventh embodiment.
- FIG. 20 is a perspective view showing the structure of an example of a conventional isothermal heating plate.
- FIG. 21 is a plan view showing the structure of another example of the conventional isothermal heating plate.
- FIG. 22 is a side view showing the structure of the other example of the conventional isothermal heating plate.
- FIG. 1 is a plan view of an isothermal heating apparatus of a first embodiment of the present invention.
- FIG. 2 is a sectional view of the isothermal heating apparatus taken along the line II-II shown in FIG. 1 .
- the isothermal heating apparatus of the first embodiment includes a plate 1 having a rectangular plate shape.
- Plate 1 is made of a material having high thermal conductivity represented by, for example, copper, aluminum or the like. The material making up of plate 1 can be arbitrarily selected depending on isothermal property required of a heat-treatment subject.
- Plate 1 is formed to have a rectangular shape in plan view.
- a front surface 1 a which is one surface of plate 1 is formed flat such that a heat-treatment subject, such as an organic material for semiconductor manufacture, for example, can be mounted and heated thereon.
- Heating means 3 is attached to a rear surface 1 b which is the other surface of plate 1 .
- Heat pipe circuit 2 is formed in plate 1 .
- Heat pipe circuit 2 includes a header portion 2 b and a plurality of branch portions 2 a branching off from header portion 2 b.
- Header portion 2 b is arranged to extend along a side surface 1 c constituting one side surface of plate 1 when plate 1 formed to have a rectangular shape in plan view is planarly viewed.
- Branch portions 2 a are provided to extend from header portion 2 b toward a side surface 1 d constituting the other side surface of plate 1 opposed to side surface 1 c.
- Plurality of branch portions 2 a are arranged in parallel to one another, as shown in FIG. 1 .
- Each of plurality of branch portions 2 a is coupled to header portion 2 b on the side surface 1 c side of plate 1 .
- the circuit in plate 1 is formed by joining a flat plate and a groove-processed plate, for example.
- Heat pipe circuit 2 is formed by evacuating internal space 30 formed in plate 1 , and then a predetermined amount of working fluid is charged in internal space 30 .
- the working fluid is heated by heating means 3 as will be described later.
- FIG. 3 is a sectional view of the isothermal heating apparatus taken along the line shown in FIG. 1 .
- FIG. 2 the sectional view of the isothermal heating apparatus in a cross section including the whole of header portion 2 b and branch portions 2 a of heat pipe circuit 2 from side surface 1 c to side surface 1 d of plate 1 is shown.
- FIG. 3 the sectional view of the isothermal heating apparatus in a cross section including only header portion 2 b of heat pipe circuit 2 is shown.
- FIG. 3 illustrates the state where working fluid 31 is charged into header portion 2 b of heat pipe circuit 2 , and working fluid 31 is in contact with an evaporating surface 12 constituting the bottom of header portion 2 b having a rectangular shape in cross section.
- working fluid 31 is in contact with evaporating surface 12 which is a wall surface of header portion 2 b on the rear surface 1 b side of plate 1 .
- Header portion 2 b constituting a part of heat pipe circuit 2 and heating means 3 are arranged with plate 1 interposed therebetween. As shown in FIG. 3 , header portion 2 b of heat pipe circuit 2 has a width 1 1 . The width by which heating means 3 is in thermal contact with plate 1 is a width 1 0 . Width 1 0 by which heating means 3 is in thermal contact with plate 1 shall be less than or equal to width 1 1 of evaporating surface 12 . By thus defining the dimensions of heat pipe circuit 2 and heating means 3 , heat generated by heating means 3 is more easily transferred to working fluid 31 in header portion 2 b.
- width 1 0 by which heating means 3 is in contact with plate 1 is larger than width 1 1 of evaporating surface 12 of header portion 2 b, the amount of heat transferred by heat conduction from heating means 3 to front surface 1 a through rear surface 1 b of plate 1 may increase, causing the temperature to be nonuniform on the side surface 1 c side and side surface 1 d side, on front surface 1 a of plate 1 .
- plate 1 can be heated as a whole more isothermally.
- Width 1 0 by which heating means 3 is in contact with plate 1 may be made smaller than width 1 1 of evaporating surface 12 by about several millimeters, for example.
- the optimal dimensions vary depending on the material of plate 1 , the wall thickness of plate 1 (after processing of heat pipe circuit 2 ), the thickness of plate 1 (i.e., the spacing between front surface 1 a and rear surface 1 b ), the temperature area used, and the like.
- FIG. 4 is a sectional view showing details of the structure of heating means 3 , enlargedly showing side surface 1 c and its surroundings in FIG. 2 .
- heating means 3 includes a heater 6 , a heat transfer block 4 , and a heater holding plate 10 .
- Heat transfer block 4 is formed with a grooved recess 4 a for fixing heater 6 .
- Heater 6 as an example of heating member that supplies heat to working fluid 31 in heat pipe circuit 2 by generating heat is incorporated in recess 4 a as a grooved portion formed in heat transfer block 4 .
- Heat transfer block 4 has the function as a storing portion storing heater 6 in recess 4 a.
- Heater 6 may be an electric heater, for example.
- Heater 6 is fitted within recess 4 a formed in heat transfer block 4 , and the inside of recess 4 a is filled with heater 6 and a heat transfer material 5 . Heater 6 is held in recess 4 a of heat transfer block 4 by heater holding plate 10 . Heater holding plate 10 has the function as a holding member holding heater 6 in recess 4 a.
- Heat transfer block 4 is brought into close contact with and fixed to rear surface 1 b immediately below header portion 2 b in plate 1 with heater 6 sandwiched between heat transfer block 4 and heater holding plate 10 and with heater 6 and heater holding plate 10 crimped by a fixing bolt 9 .
- Heating means 3 includes fixing bolt 9 as a fixing member fixing heater holding plate 10 and heat transfer block 4 integrally to plate 1 .
- Heat transfer block 4 is in thermal contact with a part of rear surface 1 b which is one surface of plate 1 , and the part of plate 1 is heated by heater 6 held in heat transfer block 4 .
- a heat flow 21 in the drawings indicates a heat flow from heating means 3 to plate 1 .
- heater 6 When heater 6 is turned on to generate heat, the heat is transferred to a contact surface 14 between plate 1 and heat transfer block 4 through heat transfer material 5 and heat transfer block 4 .
- the heat is further transferred through the inside of plate 1 to evaporating surface 12 at the bottom of header portion 2 b in plate 1 .
- the bottom of header portion 2 b in plate 1 is heated by heat flow 21 , the bottom of header portion 2 b will be evaporating surface 12 where working fluid 31 evaporates.
- Vapor 33 moves through internal space 30 formed in plate 1 to move to the front surface 1 a side opposite to rear surface 1 b to which heating means 3 is attached. Vapor 33 is condensed in each part in branch portions 2 a of heat pipe circuit 2 while moving through internal space 30 from the side surface 1 c side to the side surface 1 d side, and discharges latent heat of condensation to the part of plate 1 that is in thermal contact with branch portions 2 a. In this manner, vapor 33 is condensed by radiating heat to plate 1 , and is transformed into a condensate fluid 34 . Heat is transferred isothermally to plate 1 in the whole branch portions 2 a while vapor 33 flows toward side surface 1 d, and plate 1 absorbs heat from vapor 33 , so that plate 1 is heated at an equal temperature.
- the water level of working fluid 31 in branch portions 2 a is higher on the side surface 1 d d side than on the side surface 1 c side, as shown in FIG. 2 .
- the level difference of water level causes working fluid 31 to flow back from the side surface 1 d side to the side surface 1 c side where working fluid 31 originally exists.
- the above-described heat transport from heater 6 to plate 1 is carried out repeatedly.
- Header portion 2 b functions as a heating portion where working fluid 31 is heated and evaporated.
- Branch portions 2 a function as condensation portions where vapor 33 produced by evaporation of working fluid 31 exchanges heat with plate 1 and condenses.
- Header portion 2 b has the function as a vapor distributing header that distributes vapor 33 produced in header portion 2 b to plurality of branch portions 2 a.
- Header portion 2 b has the function as a liquid collection header where condensate fluid 34 produced by condensation of vapor 33 in plurality of branch portions 2 a is collected.
- Each of plurality of branch portions 2 a is, relative to header tubular header portion 2 b, formed as a lateral branch tubular shape extending in the direction crossing (typically, orthogonal to) the direction in which header portion 2 b extends.
- heating means 3 is provided on the evaporating surface 12 side which is the wall surface of header portion 2 b with which working fluid 31 is in contact when heating means 3 heats working fluid 31 in the liquid state. Since evaporating surface 12 is positioned immediately above contact surface 14 where plate 1 and heat transfer block 4 are in contact, the amount of heat, of heat from heater 6 , that is directly transferred to front surface 1 a of plate 1 is small. Most of the heat from heater 6 is spent in heating working fluid 31 on evaporating surface 12 . When heat pipe circuit 2 and heating means 3 have dimensions defined in FIG. 3 , the amount of heat, of the heat generated by heater 6 , that is transferred to working fluid 31 is much larger.
- working fluid 31 in plate 1 can be evaporated, while preventing the heat of heater 6 from being directly transferred to plate 1 , and vapor 33 produced by evaporation of working fluid 31 can be diffused into every part in plate 1 . Since working fluid 31 can be evaporated at header portion 2 b in plate 1 to produce vapor 33 and vapor 33 can be condensed at branch portions 2 a to heat plate 1 , thermal uniformity of front surface 1 a of plate 1 can be improved. Therefore, the heat-treatment subject mounted on front surface 1 a of plate 1 can be heated isothermally.
- plate 1 can be heated as a whole by one heating means 3 , and a plurality of heaters as in the system shown in the conventional technique of FIG. 20 are not required. Therefore, the number of components can be reduced, and the manufacturing costs of the isothermal heating apparatus can thus be reduced. Moreover, since heat generated by heater 6 is promptly transferred to every part of plate 1 by the evaporation phenomenon of working fluid 31 , the temperature rise of heater 6 can be suppressed and the amount of heat transferred to the surroundings can also be reduced. Thus, the required energy can be reduced, and the running costs of the isothermal heating apparatus can be reduced.
- evaporating surface 12 is provided in plate 1 , it is not necessary to provide an evaporator separately as in the conventional technique of FIGS. 21 and 22 . Therefore, size reduction and further cost reduction of the isothermal heating apparatus can be achieved, and the heat capacity of plate 1 can be reduced, so that an isothermal heating apparatus having high thermal responsiveness can be obtained.
- FIG. 5 is a sectional view showing a first variation of the isothermal heating apparatus of the first embodiment.
- the isothermal heating apparatus of the first variation shown in FIG. 5 differs from the structure shown in FIG. 4 in that a thermally conductive interposed member 7 interposed between plate 1 and heat transfer block 4 is provided.
- thermally conductive interposed member 7 when thermally conductive interposed member 7 is placed on contact surface 14 between rear surface 1 b of plate 1 and heat transfer block 4 , thermal contact resistance between rear surface 1 b of plate 1 and heat transfer block 4 will be reduced.
- heat generated by heater 6 can be transferred to working fluid 31 through plate 1 more efficiently, so that thermal responsiveness of the isothermal heating apparatus is further improved.
- the amount of heat radiation radiated from the surfaces of heat transfer block 4 and heater holding plate 10 to the surroundings is reduced, so that an isothermal heating apparatus having higher thermal efficiency can be provided.
- FIG. 6 is a sectional view showing a second variation of the isothermal heating apparatus of the first embodiment.
- the isothermal heating apparatus of the second variation shown in FIG. 6 differs from the structure shown in FIG. 5 in that heating means 3 includes a thermally conductive interposed member 8 interposed between heat transfer block 4 and heater holding plate 10 . Heat generated by heater 6 is also transferred to heater holding plate 10 through heat transfer material 5 .
- thermal resistance between heater holding plate 10 and heat transfer block 4 will be reduced, so that heat is more likely to be transferred from heater holding plate 10 to heat transfer block 4 as a heat flow 22 indicated by an arrow of broken line.
- the amount of heat lost by radiation to the surroundings, of heat transferred to heater holding plate 10 can be reduced and heat flow 22 from heater holding plate 10 to heat transfer block 4 can be increased, so that the heat generated by heater 6 can be transferred to heat transfer block 4 still more efficiently.
- thermal responsiveness of the isothermal heating apparatus can further be improved.
- FIG. 7 is a sectional view showing a third variation of the isothermal heating apparatus of the first embodiment.
- the isothermal heating apparatus of the third variation shown in FIG. 7 differs from the structure shown in FIG. 5 in that heating means 3 includes a thermally insulative interposed member 8 a interposed between heat transfer block 4 and heater holding plate 10 .
- FIG. 6 illustrates the example where thermally conductive interposed member 8 is interposed between heat transfer block 4 and heater holding plate 10 .
- the amount of heat flow flowing from heater 6 to heater holding plate 10 can be reduced by interposing thermally insulative interposed member 8 a between heat transfer block 4 and heater holding plate 10 as shown in FIG. 7 .
- heater holding plate 10 may be made of a material having low thermal conductivity.
- FIG. 8 is a sectional view of an isothermal heating apparatus of a second embodiment.
- the isothermal heating apparatus of the second embodiment differs from the first embodiment in that heating means 3 does not include heat transfer block 4 .
- heat transfer block 4 is not used, but a groove-like hollowed portion 10 a for fixing heater 6 is formed in heater holding plate 10 .
- Heater 6 is incorporated in hollowed portion 10 a as a groove portion formed in heater holding plate 10 .
- Heater 6 is stored in hollowed portion 10 a formed in heater holding plate 10 , and in its surroundings, heat transfer material 5 is arranged.
- the inside of hollowed portion 10 a is filled with heater 6 and heat transfer material 5 .
- Heater holding plate 10 is fixed by fixing bolt 9 in direct close contact with rear surface 1 b immediately below header portion 2 b in plate 1 .
- heating means 3 is constructed in this manner, the number of components of the isothermal heating apparatus is reduced by not using heat transfer block 4 , so that cost reduction of the isothermal heating apparatus can be achieved.
- FIG. 9 is a sectional view of an isothermal heating apparatus of a third embodiment.
- the isothermal heating apparatus of the third embodiment differs from the first and second embodiments in that the location where heater 6 is fixed is changed. More specifically, the first embodiment presents a structure in which heat transfer block 4 and heater holding plate 10 included in heating means 3 are both fixed to plate 1 using fixing bolt 9 , and heat transfer block 4 is removable from plate 1 .
- heater 6 is incorporated in groove-like hollowed portion 10 a for fixing heater 6 to heater holding plate 10 .
- heat transfer block 4 and plate 1 are thermally integrated by a method such as brazing or welding.
- the part fixing heater 6 (heat transfer block 4 in the first embodiment and heater holding plate 10 in the second embodiment) is a member different from plate 1 , and thermal contact resistance occurs because contact surface 14 between the part fixing heater 6 and plate 1 is not in full close contact. Even when thermally conductive interposed member 7 is arranged between heat transfer block 4 and plate 1 , it is difficult to fully eliminate thermal resistance between heat transfer block 4 and plate 1 though thermal contact resistance is reduced. In contrast, in the third embodiment, thermal resistance between heat transfer block 4 and rear surface 1 b of plate 1 can be minimized by thermally integrating heat transfer block 4 and plate 1 as shown in FIG. 9 .
- FIG. 10 is a sectional view of a variation of the isothermal heating apparatus of the third embodiment. Comparing FIGS. 9 and 10 , hollowed portion 10 a storing heater 6 is formed at a position of heater holding plate 10 opposed to recess 4 a in the variation shown in FIG. 10 . Heater 6 is disposed in the inside of recess 4 a formed in heat transfer block 4 and in the inside of hollowed portion 10 a formed in heater holding plate 10 . The inside of space formed by recess 4 a and hollowed portion 10 a is filled with heater 6 and heat transfer material 5 .
- the effect of the isothermal heating apparatus of the third embodiment described with reference to FIG. 9 that can reduce thermal resistance between heat transfer block 4 and rear surface 1 b of plate 1 does not depend on the size of heat transfer block 4 . That is, as shown in FIG. 10 , a similar effect can also be obtained by reducing the size of heat transfer block 4 and increasing the size of heater holding plate 10 . In addition, in the variation shown in FIG. 10 , because heat transfer block 4 is reduced in size, plate 1 can be cut out and processed from a somewhat larger material integrally with heat transfer block 4 . Therefore, the production time of the isothermal heating apparatus can be shortened, and the manufacturing costs can be reduced.
- FIG. 11 is a sectional view of an isothermal heating apparatus of a fourth embodiment.
- the isothermal heating apparatus of the fourth embodiment has a structure in which heater holding plate 10 of heating means 3 of the third embodiment is metallically joined and integrated to heat transfer block 4 .
- heat transfer block 4 and heater holding plate 10 are separate members not thermally integrated as in the first to third embodiments, thermal resistance occurs when heat transferred from heater 6 to heater holding plate 10 is transferred to the heat transfer block 4 side as heat flow 22 .
- heater holding plate 10 is thermally integrated with heat transfer block 4 , and plate 1 , heat transfer block 4 and heater holding plate 10 are thermally integrated as a whole.
- thermal resistance in the path along which the heat generated by heater 6 is transferred to plate 1 becomes even smaller than in the third embodiment described above.
- the amount of heat transferred from heat transfer block 4 to working fluid 31 through plate 1 to heat working fluid 31 increases, so that thermal responsiveness of the isothermal heating apparatus can further be improved.
- FIG. 12 is a sectional view of an isothermal heating apparatus of a fifth embodiment.
- the isothermal heating apparatus of the fifth embodiment differs from the fourth embodiment in that a high performance boiling surface 39 which promotes boiling of working fluid 31 is formed on evaporating surface 12 which is the wall surface of header portion 2 b of heat pipe circuit 2 on the side where heating means 3 is provided.
- High performance boiling surface 39 is to promote heat transfer by boiling heat transfer from heating means 3 to plate 1 .
- Boiling of working fluid 31 is a phenomenon in which a vapor bubble 32 grown from a minute bubble nuclei as an origin in evaporating surface 12 moves away from evaporating surface 12 .
- evaporating surface 12 may have a structure whose surface is formed with a large number of minute cavities and minute bubble nuclei are likely to occur.
- high performance boiling surface 39 can be obtained by welding metallic particles onto evaporating surface 12 of plate 1 or groove-processing evaporating surface 12 .
- working fluid 31 easily boils to become vapor bubbles 32 , so that generation of vapor 33 is promoted.
- the amount of heat transferred to working fluid 31 can be increased, and the amount of heat transferred to front surface 1 a by heat conduction in plate 1 can be reduced. Therefore, heat generated by heater 6 can be utilized for production of vapor 33 still more efficiently, so that thermal responsiveness of the isothermal heating apparatus can further be improved.
- FIG. 13 is a sectional view of an isothermal heating apparatus of a sixth embodiment.
- branch portions 2 a of heat pipe circuit 2 formed in plate 1 have an equal groove depth entirely in the direction that branch portions 2 a extend, it is not limited to such a structure.
- heat pipe circuit 2 may be formed such that the groove depth of branch portions 2 a is smaller on the side surface 1 d side than on side surface 1 c side of plate 1 as shown in FIG. 13 .
- FIGS. 14 and 15 are sectional views each showing another example of arrangement of plate 1 .
- plate 1 may be arranged in the vertically standing state, or plate 1 may be arranged in an inclined state as shown in FIG. 15 .
- heating means 3 Even when plate 1 is arranged in the vertically standing state or inclined state, it is only necessary to locate heating means 3 on the wall surface side of header portion 2 b of heat pipe circuit 2 with which working fluid 31 is in contact when heating means 3 heats the working fluid. Then, the effect of efficiently transferring heat from heating means 3 to working fluid 31 can also be obtained similarly to the above.
- the structure in which heating means 3 is provided on the rear surface 1 b side of plate 1 is not a limitation, but in the isothermal heating apparatus arranged as shown in FIGS. 14 and 15 , it is also possible to attach heating means 3 to the side surface 1 c side of plate 1 .
- the isothermal heating apparatus of the present invention can form a duct, a container or the like surrounding space.
- the heat-treatment subject can be heated more isothermally.
- FIG. 16 is a plan view of an isothermal heating apparatus of a seventh embodiment.
- heat pipe circuit 2 formed in the inside of plate 1 includes header portion 2 b and branch portions 2 a processed to extend perpendicularly to header portion 2 b and in parallel to one another has been illustrated, such a structure is not a limitation.
- heat pipe circuit 2 may further include a coupling portion 2 d coupling branch portions 2 a extending from header portion 2 b, as shown in FIG. 16 .
- FIGS. 17 to 19 are plan views of other examples of the isothermal heating apparatus of the seventh embodiment. If heat pipe circuit 2 in the shapes shown in FIGS. 17 and 18 is formed, the effect that can increase the paths of vapor 33 to reduce the manufacturing costs of the isothermal heating apparatus can also be obtained similarly to the structure of FIG. 16 . As shown in FIG. 19 , if grid-like heat pipe circuit 2 is formed in which a plurality of coupling portions 2 d are provided and arranged in parallel to one another, the paths of vapor 33 can further be increased, and front surface 1 a of plate 1 can be heated even more isothermally.
- heat pipe circuit 2 is formed along the entire circumference of plate 1 as shown in FIGS. 17 to 19 , heating by vapor 33 is conducted on all the side surfaces of plate 1 , which can reduce temperature drop that would be caused by heat dissipation from edge. Therefore, thermal uniformity of plate 1 can be improved further as compared to the structure in which heat pipe circuit 2 is not provided partly on the side of an end of plate 1 that is located away from header portion 2 b as shown in FIG. 1 or 16 .
- the present invention is particularly advantageously applicable to an isothermal heating apparatus that heats a heat-treatment subject, such as an organic material for semiconductor manufacture, into an isothermally heated state.
Abstract
An isothermal heating apparatus includes a plate including formed therein a heat pipe circuit in which working fluid is charged, and a heating mechanism heating the working fluid. The heat pipe circuit includes a header portion at which the working fluid is heated and evaporated and a plurality of branch portions in which vapor produced by vaporization of the working fluid exchanges heat with the plate and condensates, the branch portions branching off from the header portion. The heating mechanism is provided on an evaporating surface side of the header portion with which the working fluid is in contact when the heating mechanism heats the working fluid. The isothermal heating apparatus can achieve isothermal heating of a heat-treatment subject and size reduction of the apparatus.
Description
- The present invention relates to an isothermal heating apparatus that heats a heat-treatment subject into an isothermally heated state.
- A conventional technique regarding an isothermal heating plate that heat-treats a heat-treatment subject into an isothermally heated state is disclosed in, for example, Japanese Laid-Open Patent Publication No. 9-314561 (PTL 1) or Japanese Laid-Open Patent Publication No. 2007-294688 (PTL 2).
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FIG. 20 is a perspective view showing a structure of an example of a conventional isothermal heating plate. An isothermal heating plate shown inFIG. 20 has a structure in which the both ends of each of a plurality of throughholes 102 a formed in aplate 101 are closed withlids container 107, the inside of this sealedcontainer 107 is evacuated and then a predetermined amount of working fluid is charged, and aheater 106 is brought into thermal contact with the bottom ofplate 101 with aheat transfer block 104 interposed therebetween. -
FIG. 21 is a plan view showing a structure of another example of a conventional isothermal heating plate.FIG. 22 is a side view showing the structure of the other example of the conventional isothermal heating plate. The isothermal heating plate shown inFIGS. 21 and 22 has apipe 123 arranged in a plurality of holes formed in aplate 121 to form a meandering circuit of a pipe container, and has anevaporator 143 with anentrance 141 serving as one end of the meandering circuit being connected to the upper part and anexit 142 serving as the other end of the circuit being connected to the lower part to form a single communication circuit with the meandering circuit. The inside of this single communication circuit is evacuated and then a predetermined amount of workingfluid 131 is charged, and workingfluid 131 is heated by aheater 126 fitted inevaporator 143. -
- PTL 1: Japanese Laid-Open Patent Publication No. 9-314561
- PTL 2: Japanese Laid-Open Patent Publication No. 2007-294688
- As described above, various techniques for the isothermal heating apparatus that isothermally heats a heat-treatment subject have been proposed so far. However, the isothermal heating apparatus is requested to have the capability of heating a subject much more isothermally, and in addition, size reduction of the apparatus is also required. The conventional apparatus disclosed in each piece of literature mentioned above do not necessarily satisfy these points, but there is still room for improvement.
- The present invention was made in view of the above-described problems, and has a main object to provide an isothermal heating apparatus capable of isothermally heating a heat-treatment subject and achieving size reduction of the apparatus.
- An isothermal heating apparatus according to the present invention includes a plate having formed therein a heat pipe circuit in which a working fluid is charged, and heating means heating the working fluid. The heat pipe circuit includes a header portion at which the working fluid is heated and evaporated and a plurality of branch portions in which vapor produced by vaporization of the working fluid exchanges heat with the plate and condensates, the branch portions branching off from the header portion. The heating means is provided on a wall surface side of the header portion with which the working fluid is in contact when the heating means heats the working fluid.
- In the above-described isothermal heating apparatus, preferably, the plate is formed to have a rectangular shape in plan view, the header portion extends along one side surface of the plate, and the branch portions are provided to extend toward an other side surface of the plate opposed to the one side surface.
- In the above-described isothermal heating apparatus, preferably, the plurality of branch portions are arranged in parallel to one another. Still preferably, the heat pipe circuit further includes a coupling portion coupling the branch portions. The coupling portion may couple tips of the branch portions extending from the header portion. A plurality of the coupling portions may be provided and may be arranged in parallel to one another.
- In the above-described isothermal heating apparatus, preferably, the heating means includes a heater, a heat transfer block formed with a recess and storing the heater in the recess, and a heater holding plate holding the heater in the recess.
- In the above-described isothermal heating apparatus, preferably, the heating means includes a fixing member fixing the heater holding plate and the heat transfer block integrally to the plate.
- The above-described isothermal heating apparatus may include a thermally conductive interposed member interposed between the plate and the heat transfer block. The heating means may include a thermally conductive interposed member interposed between the heat transfer block and the heater holding plate. The heating means may include a thermally insulative interposed member interposed between the heat transfer block and the heater holding plate.
- In the above-described isothermal heating apparatus, preferably, a hollowed portion storing the heater is formed in the heater holding plate at a position opposed to the recess.
- In the above-described isothermal heating apparatus, preferably, a high performance boiling surface promoting boiling of the working fluid is formed in the wall surface with which the working fluid is in contact where the working fluid is heated.
- In the above-described isothermal heating apparatus, preferably, a width by which the heating means is in thermal contact with the plate is less than or equal to a width of the wall surface with which the working fluid is in contact where the working fluid is heated.
- According to the isothermal heating apparatus of the present invention, a heat-treatment subject can be heated isothermally, and size reduction of the apparatus can be achieved.
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FIG. 1 is a plan view of an isothermal heating apparatus of a first embodiment of the present invention. -
FIG. 2 is a sectional view of the isothermal heating apparatus taken along the line II-II shown inFIG. 1 . -
FIG. 3 is a sectional view of the isothermal heating apparatus taken along the line shown inFIG. 1 . -
FIG. 4 is a sectional view showing details of the structure of heating means. -
FIG. 5 is a sectional view showing a first variation of the isothermal heating apparatus of the first embodiment. -
FIG. 6 is a sectional view showing a second variation of the isothermal heating apparatus of the first embodiment. -
FIG. 7 is a sectional view showing a third variation of the isothermal heating apparatus of the first embodiment. -
FIG. 8 is a sectional view of an isothermal heating apparatus of a second embodiment. -
FIG. 9 is a sectional view of an isothermal heating apparatus of a third embodiment. -
FIG. 10 is a sectional view of a variation of the isothermal heating apparatus of the third embodiment. -
FIG. 11 is a sectional view of an isothermal heating apparatus of a fourth embodiment. -
FIG. 12 is a sectional view of an isothermal heating apparatus of a fifth embodiment. -
FIG. 13 is a sectional view of an isothermal heating apparatus of a sixth embodiment. -
FIG. 14 is a sectional view showing another example of arrangement of a plate. -
FIG. 15 is a sectional view showing another example of arrangement of a plate. -
FIG. 16 is a plan view of an isothermal heating apparatus of a seventh embodiment. -
FIG. 17 is a plan view of another example of the isothermal heating apparatus of the seventh embodiment. -
FIG. 18 is a plan view of another example of the isothermal heating apparatus of the seventh embodiment. -
FIG. 19 is a plan view of another example of the isothermal heating apparatus of the seventh embodiment. -
FIG. 20 is a perspective view showing the structure of an example of a conventional isothermal heating plate. -
FIG. 21 is a plan view showing the structure of another example of the conventional isothermal heating plate. -
FIG. 22 is a side view showing the structure of the other example of the conventional isothermal heating plate. - Hereinbelow, embodiments of the present invention will be described based on the drawings. It is noted that, in the drawings, the same or corresponding portion has the same reference number allotted, and description thereof will not be repeated.
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FIG. 1 is a plan view of an isothermal heating apparatus of a first embodiment of the present invention.FIG. 2 is a sectional view of the isothermal heating apparatus taken along the line II-II shown inFIG. 1 . As shown inFIGS. 1 and 2 , the isothermal heating apparatus of the first embodiment includes aplate 1 having a rectangular plate shape.Plate 1 is made of a material having high thermal conductivity represented by, for example, copper, aluminum or the like. The material making up ofplate 1 can be arbitrarily selected depending on isothermal property required of a heat-treatment subject. -
Plate 1 is formed to have a rectangular shape in plan view. Afront surface 1 a which is one surface ofplate 1 is formed flat such that a heat-treatment subject, such as an organic material for semiconductor manufacture, for example, can be mounted and heated thereon. Heating means 3 is attached to arear surface 1 b which is the other surface ofplate 1. - As shown in
FIG. 1 , aheat pipe circuit 2 is formed inplate 1.Heat pipe circuit 2 includes aheader portion 2 b and a plurality ofbranch portions 2 a branching off fromheader portion 2 b.Header portion 2 b is arranged to extend along aside surface 1 c constituting one side surface ofplate 1 whenplate 1 formed to have a rectangular shape in plan view is planarly viewed.Branch portions 2 a are provided to extend fromheader portion 2 b toward aside surface 1 d constituting the other side surface ofplate 1 opposed toside surface 1 c. Plurality ofbranch portions 2 a are arranged in parallel to one another, as shown inFIG. 1 . Each of plurality ofbranch portions 2 a is coupled toheader portion 2 b on theside surface 1 c side ofplate 1. It is noted that the circuit inplate 1 is formed by joining a flat plate and a groove-processed plate, for example. -
Heat pipe circuit 2 is formed by evacuatinginternal space 30 formed inplate 1, and then a predetermined amount of working fluid is charged ininternal space 30. The working fluid is heated by heating means 3 as will be described later. -
FIG. 3 is a sectional view of the isothermal heating apparatus taken along the line shown inFIG. 1 . InFIG. 2 , the sectional view of the isothermal heating apparatus in a cross section including the whole ofheader portion 2 b andbranch portions 2 a ofheat pipe circuit 2 fromside surface 1 c toside surface 1 d ofplate 1 is shown. In contrast, inFIG. 3 , the sectional view of the isothermal heating apparatus in a cross section includingonly header portion 2 b ofheat pipe circuit 2 is shown.FIG. 3 illustrates the state where workingfluid 31 is charged intoheader portion 2 b ofheat pipe circuit 2, and workingfluid 31 is in contact with an evaporatingsurface 12 constituting the bottom ofheader portion 2 b having a rectangular shape in cross section. Inheader portion 2 b, workingfluid 31 is in contact with evaporatingsurface 12 which is a wall surface ofheader portion 2 b on therear surface 1 b side ofplate 1. -
Header portion 2 b constituting a part ofheat pipe circuit 2 and heating means 3 are arranged withplate 1 interposed therebetween. As shown inFIG. 3 ,header portion 2 b ofheat pipe circuit 2 has awidth 1 1. The width by which heating means 3 is in thermal contact withplate 1 is awidth 1 0.Width 1 0 by which heating means 3 is in thermal contact withplate 1 shall be less than or equal towidth 1 1 of evaporatingsurface 12. By thus defining the dimensions ofheat pipe circuit 2 and heating means 3, heat generated by heating means 3 is more easily transferred to workingfluid 31 inheader portion 2 b. - If
width 1 0 by which heating means 3 is in contact withplate 1 is larger thanwidth 1 1 of evaporatingsurface 12 ofheader portion 2 b, the amount of heat transferred by heat conduction from heating means 3 tofront surface 1 a throughrear surface 1 b ofplate 1 may increase, causing the temperature to be nonuniform on theside surface 1 c side andside surface 1 d side, onfront surface 1 a ofplate 1. By transferring heat generated by heating means 3 to workingfluid 31 and isothermally heating thewhole branch portions 2 a by evaporation and condensation of workingfluid 31 as will be described later,plate 1 can be heated as a whole more isothermally. -
Width 1 0 by which heating means 3 is in contact withplate 1 may be made smaller thanwidth 1 1 of evaporatingsurface 12 by about several millimeters, for example. The optimal dimensions vary depending on the material ofplate 1, the wall thickness of plate 1 (after processing of heat pipe circuit 2), the thickness of plate 1 (i.e., the spacing betweenfront surface 1 a andrear surface 1 b), the temperature area used, and the like. -
FIG. 4 is a sectional view showing details of the structure of heating means 3, enlargedly showingside surface 1 c and its surroundings inFIG. 2 . As shown inFIG. 4 , heating means 3 includes aheater 6, aheat transfer block 4, and aheater holding plate 10.Heat transfer block 4 is formed with agrooved recess 4 a for fixingheater 6.Heater 6 as an example of heating member that supplies heat to workingfluid 31 inheat pipe circuit 2 by generating heat is incorporated inrecess 4 a as a grooved portion formed inheat transfer block 4.Heat transfer block 4 has the function as a storingportion storing heater 6 inrecess 4 a.Heater 6 may be an electric heater, for example. -
Heater 6 is fitted withinrecess 4 a formed inheat transfer block 4, and the inside ofrecess 4 a is filled withheater 6 and aheat transfer material 5.Heater 6 is held inrecess 4 a ofheat transfer block 4 byheater holding plate 10.Heater holding plate 10 has the function as a holdingmember holding heater 6 inrecess 4 a. -
Heat transfer block 4 is brought into close contact with and fixed torear surface 1 b immediately belowheader portion 2 b inplate 1 withheater 6 sandwiched betweenheat transfer block 4 andheater holding plate 10 and withheater 6 andheater holding plate 10 crimped by a fixingbolt 9. Heating means 3 includes fixingbolt 9 as a fixing member fixingheater holding plate 10 andheat transfer block 4 integrally toplate 1. -
Heat transfer block 4 is in thermal contact with a part ofrear surface 1 b which is one surface ofplate 1, and the part ofplate 1 is heated byheater 6 held inheat transfer block 4. - As to the operation of the isothermal heating apparatus having the above-described structure, the heat transport principle in the isothermal heating apparatus will be described with reference to
FIGS. 2 and 4 . In the heat transport principle diagrams ofFIGS. 2 and 4 , aheat flow 21 in the drawings indicates a heat flow from heating means 3 toplate 1. Whenheater 6 is turned on to generate heat, the heat is transferred to acontact surface 14 betweenplate 1 andheat transfer block 4 throughheat transfer material 5 andheat transfer block 4. The heat is further transferred through the inside ofplate 1 to evaporatingsurface 12 at the bottom ofheader portion 2 b inplate 1. When the bottom ofheader portion 2 b inplate 1 is heated byheat flow 21, the bottom ofheader portion 2 b will be evaporatingsurface 12 where workingfluid 31 evaporates. - On evaporating
surface 12 inheader portion 2 b, workingfluid 31 charged into the inside ofplate 1 is heated. Since the inside ofplate 1 is in a vacuum decompression state, workingfluid 31, when heated, is vaporized promptly to produce avapor bubble 32.Vapor bubble 32 moves up through workingfluid 31 to becomevapor 33 at the liquid surface of workingfluid 31, andvapor 33 moves inheat pipe circuit 2 formed inplate 1 in the direction from theside surface 1 c side to theside surface 1 d side to branch off fromheader portion 2 b, and flows into each of plurality ofbranch portions 2 a. -
Vapor 33 moves throughinternal space 30 formed inplate 1 to move to thefront surface 1 a side opposite torear surface 1 b to which heating means 3 is attached.Vapor 33 is condensed in each part inbranch portions 2 a ofheat pipe circuit 2 while moving throughinternal space 30 from theside surface 1 c side to theside surface 1 d side, and discharges latent heat of condensation to the part ofplate 1 that is in thermal contact withbranch portions 2 a. In this manner,vapor 33 is condensed by radiating heat toplate 1, and is transformed into acondensate fluid 34. Heat is transferred isothermally toplate 1 in thewhole branch portions 2 awhile vapor 33 flows towardside surface 1 d, andplate 1 absorbs heat fromvapor 33, so thatplate 1 is heated at an equal temperature. - Since the pressure of
vapor 33 flowing throughbranch portions 2 a is higher on theside surface 1 c side ofplate 1 and decreases toward theside surface 1 d side, the water level of workingfluid 31 inbranch portions 2 a is higher on theside surface 1 d d side than on theside surface 1 c side, as shown inFIG. 2 . The level difference of water levelcauses working fluid 31 to flow back from theside surface 1 d side to theside surface 1 c side where workingfluid 31 originally exists. In the isothermal heating apparatus of the present embodiment, the above-described heat transport fromheater 6 toplate 1 is carried out repeatedly. -
Header portion 2 b functions as a heating portion where workingfluid 31 is heated and evaporated.Branch portions 2 a function as condensation portions wherevapor 33 produced by evaporation of workingfluid 31 exchanges heat withplate 1 and condenses.Header portion 2 b has the function as a vapor distributing header that distributesvapor 33 produced inheader portion 2 b to plurality ofbranch portions 2 a.Header portion 2 b has the function as a liquid collection header wherecondensate fluid 34 produced by condensation ofvapor 33 in plurality ofbranch portions 2 a is collected. Each of plurality ofbranch portions 2 a is, relative to headertubular header portion 2 b, formed as a lateral branch tubular shape extending in the direction crossing (typically, orthogonal to) the direction in whichheader portion 2 b extends. - According to the above-described isothermal heating apparatus, heating means 3 is provided on the evaporating
surface 12 side which is the wall surface ofheader portion 2 b with which workingfluid 31 is in contact when heating means 3heats working fluid 31 in the liquid state. Since evaporatingsurface 12 is positioned immediately abovecontact surface 14 whereplate 1 andheat transfer block 4 are in contact, the amount of heat, of heat fromheater 6, that is directly transferred tofront surface 1 a ofplate 1 is small. Most of the heat fromheater 6 is spent inheating working fluid 31 on evaporatingsurface 12. Whenheat pipe circuit 2 and heating means 3 have dimensions defined inFIG. 3 , the amount of heat, of the heat generated byheater 6, that is transferred to workingfluid 31 is much larger. - Therefore, working
fluid 31 inplate 1 can be evaporated, while preventing the heat ofheater 6 from being directly transferred toplate 1, andvapor 33 produced by evaporation of workingfluid 31 can be diffused into every part inplate 1. Since workingfluid 31 can be evaporated atheader portion 2 b inplate 1 to producevapor 33 andvapor 33 can be condensed atbranch portions 2 a to heatplate 1, thermal uniformity offront surface 1 a ofplate 1 can be improved. Therefore, the heat-treatment subject mounted onfront surface 1 a ofplate 1 can be heated isothermally. - In addition, in the above-described isothermal heating apparatus,
plate 1 can be heated as a whole by one heating means 3, and a plurality of heaters as in the system shown in the conventional technique ofFIG. 20 are not required. Therefore, the number of components can be reduced, and the manufacturing costs of the isothermal heating apparatus can thus be reduced. Moreover, since heat generated byheater 6 is promptly transferred to every part ofplate 1 by the evaporation phenomenon of workingfluid 31, the temperature rise ofheater 6 can be suppressed and the amount of heat transferred to the surroundings can also be reduced. Thus, the required energy can be reduced, and the running costs of the isothermal heating apparatus can be reduced. In addition, since evaporatingsurface 12 is provided inplate 1, it is not necessary to provide an evaporator separately as in the conventional technique ofFIGS. 21 and 22 . Therefore, size reduction and further cost reduction of the isothermal heating apparatus can be achieved, and the heat capacity ofplate 1 can be reduced, so that an isothermal heating apparatus having high thermal responsiveness can be obtained. -
FIG. 5 is a sectional view showing a first variation of the isothermal heating apparatus of the first embodiment. The isothermal heating apparatus of the first variation shown inFIG. 5 differs from the structure shown inFIG. 4 in that a thermally conductive interposedmember 7 interposed betweenplate 1 andheat transfer block 4 is provided. As shown inFIG. 5 , when thermally conductive interposedmember 7 is placed oncontact surface 14 betweenrear surface 1 b ofplate 1 andheat transfer block 4, thermal contact resistance betweenrear surface 1 b ofplate 1 andheat transfer block 4 will be reduced. - Therefore, heat generated by
heater 6 can be transferred to workingfluid 31 throughplate 1 more efficiently, so that thermal responsiveness of the isothermal heating apparatus is further improved. In addition, the amount of heat radiation radiated from the surfaces ofheat transfer block 4 andheater holding plate 10 to the surroundings is reduced, so that an isothermal heating apparatus having higher thermal efficiency can be provided. -
FIG. 6 is a sectional view showing a second variation of the isothermal heating apparatus of the first embodiment. The isothermal heating apparatus of the second variation shown inFIG. 6 differs from the structure shown inFIG. 5 in that heating means 3 includes a thermally conductive interposedmember 8 interposed betweenheat transfer block 4 andheater holding plate 10. Heat generated byheater 6 is also transferred toheater holding plate 10 throughheat transfer material 5. When interposing thermally conductive interposedmember 8 betweenheat transfer block 4 andheater holding plate 10 as shown inFIG. 6 , thermal resistance betweenheater holding plate 10 andheat transfer block 4 will be reduced, so that heat is more likely to be transferred fromheater holding plate 10 to heattransfer block 4 as aheat flow 22 indicated by an arrow of broken line. - Therefore, the amount of heat lost by radiation to the surroundings, of heat transferred to
heater holding plate 10, can be reduced andheat flow 22 fromheater holding plate 10 to heattransfer block 4 can be increased, so that the heat generated byheater 6 can be transferred toheat transfer block 4 still more efficiently. As a result, since heat transferred fromheat transfer block 4 to workingfluid 31 throughplate 1 to heat workingfluid 31 increases, thermal responsiveness of the isothermal heating apparatus can further be improved. -
FIG. 7 is a sectional view showing a third variation of the isothermal heating apparatus of the first embodiment. The isothermal heating apparatus of the third variation shown inFIG. 7 differs from the structure shown inFIG. 5 in that heating means 3 includes a thermally insulative interposedmember 8 a interposed betweenheat transfer block 4 andheater holding plate 10.FIG. 6 illustrates the example where thermally conductive interposedmember 8 is interposed betweenheat transfer block 4 andheater holding plate 10. In contrast, the amount of heat flow flowing fromheater 6 toheater holding plate 10 can be reduced by interposing thermally insulative interposedmember 8 a betweenheat transfer block 4 andheater holding plate 10 as shown inFIG. 7 . - Therefore, the amount of heat radiated from
heater holding plate 10 to the surroundings can be reduced, so that the heat generated byheater 6 can be transferred toheat transfer block 4 still more efficiently. As a result, since heat transferred fromheat transfer block 4 to workingfluid 31 throughplate 1 to heat workingfluid 31 increases, thermal responsiveness of the isothermal heating apparatus can further be improved. In this case,heater holding plate 10 may be made of a material having low thermal conductivity. -
FIG. 8 is a sectional view of an isothermal heating apparatus of a second embodiment. The isothermal heating apparatus of the second embodiment differs from the first embodiment in that heating means 3 does not includeheat transfer block 4. - That is, in heating means 3 of the second embodiment,
heat transfer block 4 is not used, but a groove-likehollowed portion 10 a for fixingheater 6 is formed inheater holding plate 10.Heater 6 is incorporated in hollowedportion 10 a as a groove portion formed inheater holding plate 10.Heater 6 is stored in hollowedportion 10 a formed inheater holding plate 10, and in its surroundings,heat transfer material 5 is arranged. The inside of hollowedportion 10 a is filled withheater 6 andheat transfer material 5. -
Heater holding plate 10 is fixed by fixingbolt 9 in direct close contact withrear surface 1 b immediately belowheader portion 2 b inplate 1. When heating means 3 is constructed in this manner, the number of components of the isothermal heating apparatus is reduced by not usingheat transfer block 4, so that cost reduction of the isothermal heating apparatus can be achieved. -
FIG. 9 is a sectional view of an isothermal heating apparatus of a third embodiment. The isothermal heating apparatus of the third embodiment differs from the first and second embodiments in that the location whereheater 6 is fixed is changed. More specifically, the first embodiment presents a structure in whichheat transfer block 4 andheater holding plate 10 included in heating means 3 are both fixed toplate 1 using fixingbolt 9, andheat transfer block 4 is removable fromplate 1. In the second embodiment,heater 6 is incorporated in groove-likehollowed portion 10 a for fixingheater 6 toheater holding plate 10. On the other hand, in the third embodiment,heat transfer block 4 andplate 1 are thermally integrated by a method such as brazing or welding. - In the first and second embodiments, the part fixing heater 6 (
heat transfer block 4 in the first embodiment andheater holding plate 10 in the second embodiment) is a member different fromplate 1, and thermal contact resistance occurs becausecontact surface 14 between thepart fixing heater 6 andplate 1 is not in full close contact. Even when thermally conductive interposedmember 7 is arranged betweenheat transfer block 4 andplate 1, it is difficult to fully eliminate thermal resistance betweenheat transfer block 4 andplate 1 though thermal contact resistance is reduced. In contrast, in the third embodiment, thermal resistance betweenheat transfer block 4 andrear surface 1 b ofplate 1 can be minimized by thermally integratingheat transfer block 4 andplate 1 as shown inFIG. 9 . - Therefore, when heat generated by
heater 6 and transferred to heattransfer block 4 is further transferred to theplate 1 side throughcontact surface 14 betweenheat transfer block 4 andplate 1, part of heat energy can be prevented from being lost. As a result, the amount of heat transferred fromheat transfer block 4 to workingfluid 31 throughplate 1 to heat workingfluid 31 increases, so that thermal responsiveness of the isothermal heating apparatus can further be improved. -
FIG. 10 is a sectional view of a variation of the isothermal heating apparatus of the third embodiment. ComparingFIGS. 9 and 10 , hollowedportion 10 a storingheater 6 is formed at a position ofheater holding plate 10 opposed to recess 4 a in the variation shown inFIG. 10 .Heater 6 is disposed in the inside ofrecess 4 a formed inheat transfer block 4 and in the inside of hollowedportion 10 a formed inheater holding plate 10. The inside of space formed byrecess 4 a and hollowedportion 10 a is filled withheater 6 andheat transfer material 5. - The effect of the isothermal heating apparatus of the third embodiment described with reference to
FIG. 9 that can reduce thermal resistance betweenheat transfer block 4 andrear surface 1 b ofplate 1 does not depend on the size ofheat transfer block 4. That is, as shown inFIG. 10 , a similar effect can also be obtained by reducing the size ofheat transfer block 4 and increasing the size ofheater holding plate 10. In addition, in the variation shown inFIG. 10 , becauseheat transfer block 4 is reduced in size,plate 1 can be cut out and processed from a somewhat larger material integrally withheat transfer block 4. Therefore, the production time of the isothermal heating apparatus can be shortened, and the manufacturing costs can be reduced. -
FIG. 11 is a sectional view of an isothermal heating apparatus of a fourth embodiment. The isothermal heating apparatus of the fourth embodiment has a structure in whichheater holding plate 10 of heating means 3 of the third embodiment is metallically joined and integrated toheat transfer block 4. - If
heat transfer block 4 andheater holding plate 10 are separate members not thermally integrated as in the first to third embodiments, thermal resistance occurs when heat transferred fromheater 6 toheater holding plate 10 is transferred to theheat transfer block 4 side asheat flow 22. In the fourth embodiment,heater holding plate 10 is thermally integrated withheat transfer block 4, andplate 1,heat transfer block 4 andheater holding plate 10 are thermally integrated as a whole. - Therefore, thermal resistance in the path along which the heat generated by
heater 6 is transferred toplate 1 becomes even smaller than in the third embodiment described above. As a result, the amount of heat transferred fromheat transfer block 4 to workingfluid 31 throughplate 1 to heat workingfluid 31 increases, so that thermal responsiveness of the isothermal heating apparatus can further be improved. -
FIG. 12 is a sectional view of an isothermal heating apparatus of a fifth embodiment. The isothermal heating apparatus of the fifth embodiment differs from the fourth embodiment in that a high performance boiling surface 39 which promotes boiling of workingfluid 31 is formed on evaporatingsurface 12 which is the wall surface ofheader portion 2 b ofheat pipe circuit 2 on the side where heating means 3 is provided. High performance boiling surface 39 is to promote heat transfer by boiling heat transfer from heating means 3 toplate 1. - Boiling of working
fluid 31 is a phenomenon in which avapor bubble 32 grown from a minute bubble nuclei as an origin in evaporatingsurface 12 moves away from evaporatingsurface 12. To promote boiling of workingfluid 31, evaporatingsurface 12 may have a structure whose surface is formed with a large number of minute cavities and minute bubble nuclei are likely to occur. Specifically, high performance boiling surface 39 can be obtained by welding metallic particles onto evaporatingsurface 12 ofplate 1 or groove-processing evaporating surface 12. - By providing such high performance boiling surface 39, working
fluid 31 easily boils to become vapor bubbles 32, so that generation ofvapor 33 is promoted. In the isothermal heating apparatus of the fifth embodiment, as compared to the first to fourth embodiments, the amount of heat transferred to workingfluid 31 can be increased, and the amount of heat transferred tofront surface 1 a by heat conduction inplate 1 can be reduced. Therefore, heat generated byheater 6 can be utilized for production ofvapor 33 still more efficiently, so that thermal responsiveness of the isothermal heating apparatus can further be improved. -
FIG. 13 is a sectional view of an isothermal heating apparatus of a sixth embodiment. Although the first embodiment has been described thatbranch portions 2 a ofheat pipe circuit 2 formed inplate 1 have an equal groove depth entirely in the direction thatbranch portions 2 a extend, it is not limited to such a structure. For example,heat pipe circuit 2 may be formed such that the groove depth ofbranch portions 2 a is smaller on theside surface 1 d side than onside surface 1 c side ofplate 1 as shown inFIG. 13 . - Then, when horizontally arranging
planar plate 1,condensate fluid 34 produced by condensation ofvapor 33 inbranch portions 2 a is more likely to flow along the inclined bottom ofbranch portions 2 a from theside surface 1 d side toward theside surface 1 c side. Workingfluid 31 can thus be easily returned toheader portion 2 b where workingfluid 31 is heated, so that fluid shortage on evaporatingsurface 12 can be prevented and efficiency ofheat pipe circuit 2 can be improved. In addition, since the required amount of workingfluid 31 can be reduced, thermal responsiveness of the isothermal heating apparatus can further be improved. - Although, in the descriptions of the first to sixth embodiments, the case where
plate 1 is arranged in a horizontal state has been illustrated, the arrangement ofplate 1 is not limited to the horizontal state.FIGS. 14 and 15 are sectional views each showing another example of arrangement ofplate 1. As shown inFIG. 14 ,plate 1 may be arranged in the vertically standing state, orplate 1 may be arranged in an inclined state as shown inFIG. 15 . - Even when
plate 1 is arranged in the vertically standing state or inclined state, it is only necessary to locate heating means 3 on the wall surface side ofheader portion 2 b ofheat pipe circuit 2 with which workingfluid 31 is in contact when heating means 3 heats the working fluid. Then, the effect of efficiently transferring heat from heating means 3 to workingfluid 31 can also be obtained similarly to the above. The structure in which heating means 3 is provided on therear surface 1 b side ofplate 1 is not a limitation, but in the isothermal heating apparatus arranged as shown inFIGS. 14 and 15 , it is also possible to attach heating means 3 to theside surface 1 c side ofplate 1. - By arbitrarily combining
plates 1 in the horizontal, vertical and inclined states, the isothermal heating apparatus of the present invention can form a duct, a container or the like surrounding space. When a heat-treatment subject is stored in such a duct or a container, the heat-treatment subject can be heated more isothermally. -
FIG. 16 is a plan view of an isothermal heating apparatus of a seventh embodiment. Although, in the description of the first embodiment, the example whereheat pipe circuit 2 formed in the inside ofplate 1 includesheader portion 2 b andbranch portions 2 a processed to extend perpendicularly toheader portion 2 b and in parallel to one another has been illustrated, such a structure is not a limitation. For example,heat pipe circuit 2 may further include acoupling portion 2 dcoupling branch portions 2 a extending fromheader portion 2 b, as shown inFIG. 16 . - Then, the paths of
vapor 33 produced by heating of workingfluid 31 inheader portion 2 b increase, so thatfront surface 1 a ofplate 1 can be heated more isothermally. Ifcoupling portion 2 d is formed so as to couple the tips ofbranch portions 2 a, then, when formingheat pipe circuit 2 by machining, a tool can be moved relative toplate 1 along the loop-like path and perform machining. Therefore, the machining time ofprocessing plate 1 for formingheat pipe circuit 2 can be shortened, and the manufacturing costs of the isothermal heating apparatus can further be reduced. -
FIGS. 17 to 19 are plan views of other examples of the isothermal heating apparatus of the seventh embodiment. Ifheat pipe circuit 2 in the shapes shown inFIGS. 17 and 18 is formed, the effect that can increase the paths ofvapor 33 to reduce the manufacturing costs of the isothermal heating apparatus can also be obtained similarly to the structure ofFIG. 16 . As shown inFIG. 19 , if grid-likeheat pipe circuit 2 is formed in which a plurality ofcoupling portions 2 d are provided and arranged in parallel to one another, the paths ofvapor 33 can further be increased, andfront surface 1 a ofplate 1 can be heated even more isothermally. - In addition, with a structure in which
heat pipe circuit 2 is formed along the entire circumference ofplate 1 as shown inFIGS. 17 to 19 , heating byvapor 33 is conducted on all the side surfaces ofplate 1, which can reduce temperature drop that would be caused by heat dissipation from edge. Therefore, thermal uniformity ofplate 1 can be improved further as compared to the structure in whichheat pipe circuit 2 is not provided partly on the side of an end ofplate 1 that is located away fromheader portion 2 b as shown inFIG. 1 or 16. - While the embodiments of the present invention have been described above, the structures of the respective embodiments may be combined as appropriate. It should be understood that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the claims not by the description above, and is intended to include any modification within the meaning and scope equivalent to the terms of the claims.
- The present invention is particularly advantageously applicable to an isothermal heating apparatus that heats a heat-treatment subject, such as an organic material for semiconductor manufacture, into an isothermally heated state.
- 1 plate; 1 a front surface; 1 b rear surface; 1 c, 1 d side surface; 2 heat pipe circuit; 2 a branch portion; 2 b header portion; 2 d coupling portion; 3 heating means; 4 heat transfer block; 4 a recess; 5 heat transfer material; 6 heater; 7, 8, 8 a interposed member; 9 fixing bolt; 10 heater holding plate; 10 a hollowed portion; 12 evaporating surface; 14 contact surface; 21, 22 heat flow; 30 internal space; 31 working fluid; 32 vapor bubble; 33 vapor; 34 condensate fluid; 39 high performance boiling surface; 41 first member; 42 second member; 42 a opposed surface.
Claims (14)
1. An isothermal heating apparatus comprising:
a plate having formed therein a heat pipe circuit in which a working fluid is charged; and
heating means heating said working fluid, wherein
said heat pipe circuit includes a header portion at which the working fluid is heated and evaporated and a plurality of branch portions in which vapor produced by vaporization of said working fluid exchanges heat with said plate and condensates, said branch portions branching off from said header portion, and
said heating means is provided on a wall surface side of said header portion with which said working fluid is in contact when said heating means heats said working fluid.
2. The isothermal heating apparatus according to claim 1 , wherein
said plate is formed to have a rectangular shape in plan view,
said header portion extends along one side surface of said plate, and
said branch portions are provided to extend toward an other side surface of said plate opposed to said one side surface.
3. The isothermal heating apparatus according to claim 2 , wherein said plurality of branch portions are arranged in parallel to one another.
4. The isothermal heating apparatus according to claim 2 , wherein said heat pipe circuit further includes a coupling portion coupling said branch portions.
5. The isothermal heating apparatus according to claim 4 , wherein said coupling portion couples tips of said branch portions extending from said header portion.
6. The isothermal heating apparatus according to claim 4 , wherein a plurality of said coupling portions are provided and are arranged in parallel to one another.
7. The isothermal heating apparatus according to claim 1 , wherein said heating means includes a heater, a heat transfer block formed with a recess and storing said heater in said recess, and a heater holding plate holding said heater in said recess.
8. The isothermal heating apparatus according to claim 7 , wherein said heating means includes a fixing member fixing said heater holding plate and said heat transfer block integrally to said plate.
9. The isothermal heating apparatus according to claim 7 , comprising a thermally conductive interposed member interposed between said plate and said heat transfer block.
10. The isothermal heating apparatus according to claim 7 , wherein said heating means includes a thermally conductive interposed member interposed between said heat transfer block and said heater holding plate.
11. The isothermal heating apparatus according to claim 7 , wherein said heating means includes a thermally insulative interposed member interposed between said heat transfer block and said heater holding plate.
12. The isothermal heating apparatus according to claim 7 , wherein a hollowed portion storing said heater is formed in said heater holding plate at a position opposed to said recess.
13. The isothermal heating apparatus according to claim 1 , wherein a high performance boiling surface promoting boiling of said working fluid is formed in said wall surface.
14. The isothermal heating apparatus according to claim 1 , wherein a width by which said heating means is in thermal contact with said plate is less than or equal to a width of said wall surface.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2010/067243 WO2012042664A1 (en) | 2010-10-01 | 2010-10-01 | Soaking apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130146258A1 true US20130146258A1 (en) | 2013-06-13 |
Family
ID=45892168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/817,546 Abandoned US20130146258A1 (en) | 2010-10-01 | 2010-10-01 | Isothermal heating apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US20130146258A1 (en) |
JP (1) | JP5536224B2 (en) |
KR (1) | KR101404319B1 (en) |
CN (1) | CN103140919B (en) |
WO (1) | WO2012042664A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210090863A1 (en) * | 2017-12-21 | 2021-03-25 | Meyer Burger (Germany) Gmbh | System for electrically decoupled, homogeneous temperature control of an electrode by means of heat conduction tubes, and processing facility comprising such a system |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019128465A (en) * | 2018-01-25 | 2019-08-01 | セイコーエプソン株式会社 | Light source device and projector |
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JP2009105156A (en) * | 2007-10-22 | 2009-05-14 | Toshiba Mitsubishi-Electric Industrial System Corp | Soaking processing apparatus |
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JPS56127191A (en) * | 1980-03-10 | 1981-10-05 | Matsushita Electric Works Ltd | Radiator |
JP3034337B2 (en) * | 1991-06-10 | 2000-04-17 | 昭和アルミニウム株式会社 | Flat heat pipe |
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JP3623653B2 (en) * | 1998-03-30 | 2005-02-23 | 大日本スクリーン製造株式会社 | Heat treatment equipment |
JP2001021281A (en) | 1999-07-09 | 2001-01-26 | Mitsubishi Electric Corp | Soaking device |
JP2001349682A (en) * | 2000-06-05 | 2001-12-21 | Toshiba Corp | Boiling cooler |
JP2003139476A (en) * | 2001-11-01 | 2003-05-14 | Toshiba Corp | Boiling cooling device |
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CN100557773C (en) * | 2005-09-21 | 2009-11-04 | 东京毅力科创株式会社 | Annealing device |
JP4942385B2 (en) * | 2006-04-25 | 2012-05-30 | 東芝三菱電機産業システム株式会社 | Soaking equipment |
JP5227672B2 (en) * | 2008-06-17 | 2013-07-03 | 古河電気工業株式会社 | Heat pipe fixing method and heat sink |
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2010
- 2010-10-01 CN CN201080069337.8A patent/CN103140919B/en active Active
- 2010-10-01 KR KR1020137005803A patent/KR101404319B1/en active IP Right Grant
- 2010-10-01 US US13/817,546 patent/US20130146258A1/en not_active Abandoned
- 2010-10-01 WO PCT/JP2010/067243 patent/WO2012042664A1/en active Application Filing
- 2010-10-01 JP JP2012536109A patent/JP5536224B2/en active Active
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US3069526A (en) * | 1959-07-20 | 1962-12-18 | Gen Motors Corp | Electric hot plate |
US5826645A (en) * | 1997-04-23 | 1998-10-27 | Thermal Corp. | Integrated circuit heat sink with rotatable heat pipe |
JP2008164285A (en) * | 2003-01-21 | 2008-07-17 | Mitsubishi Electric Corp | Airlift pump type heat transport equipment |
JP2009105156A (en) * | 2007-10-22 | 2009-05-14 | Toshiba Mitsubishi-Electric Industrial System Corp | Soaking processing apparatus |
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US20210090863A1 (en) * | 2017-12-21 | 2021-03-25 | Meyer Burger (Germany) Gmbh | System for electrically decoupled, homogeneous temperature control of an electrode by means of heat conduction tubes, and processing facility comprising such a system |
Also Published As
Publication number | Publication date |
---|---|
WO2012042664A1 (en) | 2012-04-05 |
CN103140919A (en) | 2013-06-05 |
CN103140919B (en) | 2016-05-04 |
JPWO2012042664A1 (en) | 2014-02-03 |
WO2012042664A9 (en) | 2013-04-04 |
JP5536224B2 (en) | 2014-07-02 |
KR101404319B1 (en) | 2014-06-05 |
KR20130032915A (en) | 2013-04-02 |
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Owner name: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS COR Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:UNO, JUNICHI;YAMAKAGE, HISAAKI;FUNABIKI, TAKESHI;AND OTHERS;REEL/FRAME:029848/0920 Effective date: 20121221 |
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STCB | Information on status: application discontinuation |
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